Computing nodes and cabinets
By combining liquid cooling and air cooling components in the computing nodes and adopting three-bus blind-plug connection technology, the challenges of traditional server systems in terms of deployment density, heat dissipation efficiency and interconnection cost are solved, realizing high-density computing deployment and simplified assembly and maintenance process.
CN122195224APending Publication Date: 2026-06-12BEIJING ZITIAO NETWORK TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING ZITIAO NETWORK TECH CO LTD
- Filing Date
- 2026-03-15
- Publication Date
- 2026-06-12
Smart Images
Figure CN122195224A_ABST
Abstract
The present disclosure provides a computing node and a cabinet. The computing node includes a motherboard assembly, a plurality of graphics processor assemblies, a distribution header, and an air cooling assembly. The plurality of graphics processor assemblies are disposed at the periphery of the motherboard assembly. The distribution header is connected to the motherboard assembly and the plurality of graphics processor assemblies to liquid cool the motherboard assembly and the plurality of graphics processor assemblies. The air cooling assembly is configured to air cool the motherboard assembly.
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