Interactive system and interactive method for radio frequency impedance matching

By setting target areas on the Smith chart and using an interactive system for automatic filtering, the cumbersome operation and comprehensive trade-offs in the RF impedance matching design process are solved, achieving efficient and intuitive impedance matching design.

CN122197773APending Publication Date: 2026-06-12UNIVERSAL GLOBAL TECH KUNSHAN

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
UNIVERSAL GLOBAL TECH KUNSHAN
Filing Date
2026-03-12
Publication Date
2026-06-12

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Abstract

An interactive system and method for radio frequency impedance matching are disclosed. The interactive system comprises: a first input module configured to receive target element information, a target frequency range and a target scattering parameter input by a user; an image processing module configured to superimpose a Smith chart with a gain circle and / or a noise circle corresponding to the target element to generate a first target image; a second input module configured to receive target circle information determined by the user on the first target image; a processing module configured to perform impedance matching simulation to generate a plurality of simulation results, and match the simulation results with the target circle information to determine a target result having the highest matching degree with the target circle information among the simulation results; and an output module configured to receive the target result, map the target result on the Smith chart to generate a second target image, and output the second target image. The interactive system can improve the work efficiency of engineers when performing radio frequency impedance matching.
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Description

Technical Field

[0001] This application relates to the field of radio frequency impedance matching technology, and more particularly to an interactive system and method for radio frequency impedance matching. Background Technology

[0002] RF impedance matching is a critical aspect of RF circuit design. Its purpose is to match the impedances of the signal source, transmission lines, and load within the RF circuit, thereby reducing reflection loss, improving power transmission efficiency, and enhancing circuit stability and overall performance. Therefore, engineers typically need to repeatedly perform impedance matching design and verification during the design of RF amplifiers, wireless communication modules, and other applications.

[0003] In existing technologies, engineers typically rely on commercial RF simulation software (such as ADS) to complete impedance matching designs. This type of software primarily obtains results by repeatedly modifying component parameters at the circuit level and rerunning the simulation. This process is cumbersome and time-consuming, lacking an intuitive interactive approach. Furthermore, engineers cannot easily set matching targets and observe corresponding results in a single visual interface, and noise and gain performance often require separate analysis using different charts, failing to provide a unified presentation with the Smith chart. These shortcomings result in low efficiency for engineers performing RF impedance matching.

[0004] Therefore, there is an urgent need for an interactive system for RF impedance matching to improve the efficiency of engineers. Summary of the Invention

[0005] In view of this, this application discloses an interactive system and method for radio frequency impedance matching to improve the efficiency of engineers.

[0006] In a first aspect, this application discloses an interactive system for radio frequency impedance matching, comprising: a first input module configured to receive target component information, target frequency range, and target scattering parameters input by a user, wherein the target component information includes component type and component parameters; an image processing module configured to superimpose a first Smith chart with a gain chart and / or noise chart corresponding to the target component to generate a first target image; a second input module configured to receive target circle information determined by the user on the first target image, wherein the target circle information includes the coordinate information of the target circle center in the first target image and the radius of the target circle; a processing module configured to perform impedance matching simulation based on the target component information, target frequency range, and target scattering parameters to generate multiple simulation results, and match the multiple simulation results with the target circle information to determine the target result among the multiple simulation results that has the highest degree of matching with the target circle information; and an output module configured to receive the target result, map the target result onto a second Smith chart to generate a second target image, and output the second target image.

[0007] Optionally, the gain chart and / or noise chart corresponding to the target element are input by the user to the image processing module; the image processing module is further configured to adjust the first Smith chart based on the user's operation instructions, so that the circumference of the first Smith chart is at least partially aligned with the circumference of the gain chart and / or noise chart corresponding to the target element; wherein the operation instructions include translation instructions and scaling instructions.

[0008] Optionally, the interactive system further includes a storage module configured to store component information of each component and its corresponding gain circle plot and / or noise circle plot; the image processing module is further configured to obtain target component information from the first input module, determine the gain circle plot and / or noise circle plot corresponding to the target component in the storage module based on the target component information, and automatically adjust the first Smith chart based on the adjustment coefficient of the target component so that the circumference of the first Smith chart at least partially matches the circumference of the gain circle plot and / or noise circle plot corresponding to the target component; wherein, the adjustment coefficient includes translation coefficient and scaling coefficient, and the storage module is further configured to store the adjustment coefficients corresponding to the gain circle plot and / or noise circle plot of each component.

[0009] Optionally, the image processing module is further configured to, in response to a user's fusion instruction, use the superimposed image as the first target image after the circumference of the first Smith chart at least partially overlaps with the circumference of the gain chart and / or noise chart corresponding to the target element.

[0010] Optionally, the second input module is further configured to receive a user's selection instruction and determine the coordinate information of the target circle's center in the first target image based on the selection instruction; the second input module is also configured to receive a user's drag instruction and determine the radius of the target circle based on the drag instruction.

[0011] Optionally, the degree of matching is determined based on the distribution of simulation results within the target circle.

[0012] Optionally, the output module is also configured to generate a target circle on the second target image to show the relative positional relationship between the target result and the target circle.

[0013] Optionally, the first and second Smith charts are blank Smith charts.

[0014] Secondly, this application discloses an interactive method for radio frequency impedance matching, applied to a processor. The interactive method includes: receiving target component information, target frequency range, and target scattering parameters input by a user, wherein the target component information includes component type and component parameters; superimposing a first Smith chart with a gain chart and / or noise chart corresponding to the target component to generate a first target image; receiving target circle information determined by the user on the first target image, wherein the target circle information includes the coordinate information of the target circle center in the first target image and the radius of the target circle; performing impedance matching simulation based on the target component information, target frequency range, and target scattering parameters to generate multiple simulation results, and matching the multiple simulation results with the target circle information to determine the target result with the highest matching degree among the multiple simulation results; mapping the target result onto a second Smith chart to generate a second target image, and outputting the second target image.

[0015] Thirdly, this application discloses an interactive system for radio frequency impedance matching, comprising: an interactive module and a processor, wherein the interactive module is adapted to receive instructions from a user and transmit the instructions to the processor, and to display at least a portion of the processing results of the processor to the user; the processor is configured to execute the interactive method disclosed in the second aspect above.

[0016] In summary, the interactive system and method for radio frequency impedance matching disclosed in this application have at least the following beneficial effects: (1) By receiving the target component information, target frequency range and target scattering parameters before impedance matching simulation, and setting the target circle in a graphical way, the engineer's design intention is clearly expressed in the early stage of simulation, reducing the operation process of repeatedly modifying parameters and resimulating, thereby effectively improving the efficiency of impedance matching design. (2) By overlaying the Smith chart with the gain chart and / or noise chart corresponding to the target component, and receiving the target setting and output matching results in the same interface, a unified visualization of impedance, gain and noise performance is achieved, enabling engineers to complete target setting, performance trade-offs and result review in a single interface, enhancing the real-time interactivity and intuitiveness of the design process. (3) By matching and screening multiple impedance matching simulation results based on target circle information, and determining the target result with the highest degree of matching, the original process of repeated trial calculations relying on human experience is transformed into an automated screening process, thereby reducing the error caused by manual calculation and judgment and improving the reliability of matching results. (4) By mapping the target results to the Smith chart and displaying them synchronously with the target circle, engineers can intuitively compare the relationship between the simulation results and the expected target, thereby reducing the design error rate while retaining the flexibility of human judgment. Attached Figure Description

[0017] The accompanying drawings used in the description of the embodiments of this application are briefly introduced below.

[0018] Figure 1 A schematic diagram of an interactive system for radio frequency impedance matching provided in an embodiment of this application is shown.

[0019] Figure 2 This illustration shows the relationship between an unadjusted first Smith chart and the gain chart and / or noise chart corresponding to the target element, as provided in an embodiment of this application.

[0020] Figure 3 This illustration shows the relationship between an adjusted first Smith chart and the gain and / or noise chart corresponding to the target element, as provided in an embodiment of this application.

[0021] Figure 4 This illustration shows a schematic diagram of a first target image after the target circle has been determined, according to an embodiment of this application.

[0022] Figure 5 This illustration shows a schematic diagram of a second target image provided in an embodiment of this application.

[0023] Figure 6 A schematic diagram of another interactive system for radio frequency impedance matching provided in an embodiment of this application is shown.

[0024] Figure 7 A flowchart of an interactive method for radio frequency impedance matching provided in an embodiment of this application is shown. Detailed Implementation

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the specific implementation methods of this application will be described below with reference to the accompanying drawings. The accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort. Adjustments and improvements made without departing from the concept of this application are all within the protection scope of this application.

[0026] To keep the drawings simple, only the parts related to the corresponding embodiments are shown schematically in each figure, and they do not represent the actual structure of the product. In addition, to make the drawings simple and easy to understand, some parts with the same structure or function are only shown schematically in some figures, and there may actually be more or fewer parts with the same structure or function.

[0027] In this application, unless otherwise expressly specified and limited, ordinal numbers, such as "first," "second," etc., are used only to distinguish and describe related objects, and should not be construed as indicating or implying the relative importance or order between related objects; furthermore, they do not represent the quantity of related objects. "Multiple" includes two or more, and other quantifiers are similar. " / " is used to describe the relationship between related objects, indicating an "or" relationship between them. "And / or" is used to describe the relationship between related objects, including any combination relationship between them, such as "a and / or b" including: "a alone," "b alone," or "a and b." "One or more" or "at least one" of multiple objects refers to any object or any combination of multiple objects, such as "one or more of a1, a2, a3" or "at least one of a1, a2, a3" including: "a1 alone," "a2 alone," "a3 alone," "a1 and a2," "a1 and a3," "a2 and a3," or "a1, a2 and a3."

[0028] RF impedance matching is a fundamental and critical technology in RF and microwave circuit design. Its core purpose is to match the impedances between the signal source, transmission channel, and load, thereby minimizing signal reflection, improving power transmission efficiency, and enhancing the stability and performance of the circuit within the target frequency band. In RF systems, impedance mismatch can lead to signal reflection during transmission, resulting in a decrease in effective output power. It can also introduce problems such as standing waves, noise amplification, and nonlinear distortion, ultimately affecting the overall system performance. Therefore, impedance matching is integral to the design process of almost all RF circuits.

[0029] Radio frequency (RF) impedance matching is widely used in wireless communication terminals, base station RF front-ends, RF power amplifiers, low-noise amplifiers, RF transceiver modules, radar systems, and various microwave measurement and testing equipment. Especially in high-frequency, high-speed, and high-performance applications, impedance matching not only affects signal transmission efficiency but also directly impacts key system parameters such as noise figure, gain characteristics, and bandwidth. For example, in low-noise amplifier design, engineers often need to balance impedance matching, maximizing gain, and minimizing noise; in power amplifier design, a balance must be struck between output power, efficiency, and stability. Therefore, RF impedance matching is not a single-parameter optimization problem but a design process involving comprehensive trade-offs among multiple performance indicators.

[0030] Currently, engineers use commercial RF simulation software for impedance matching design. A typical workflow involves: first, establishing or modifying the matching network structure at the circuit level, setting component parameters and operating frequency range, running the simulation to obtain the corresponding scattering parameter results, and then analyzing the simulation results using tools such as the Smith chart. If the results do not meet expectations, the circuit parameters need to be readjusted and the simulation repeated, iterating repeatedly. While this workflow is mature and reliable, it relies heavily on engineers performing numerous trial calculations and relying on experience in the parameter space. This is not only cumbersome and time-consuming, but also because impedance, gain, and noise characteristics are usually displayed in different charts, requiring engineers to switch between multiple interfaces, making it difficult to make comprehensive trade-offs and quick decisions from a single perspective.

[0031] Based on this, the core technical concept of this application is to change the traditional working method mentioned above. The engineer first directly gives the desired target area in a graphical way on the Smith chart, and then the system automatically selects the matching result that is closest to the target area from the result space through multiple impedance matching simulations, thereby realizing an interactive RF impedance matching design process that is target-oriented and deduces parameters from the results.

[0032] It should be noted that, in this application, the “user” in the interactive system and interactive method can be understood as an engineering technician (hereinafter also referred to as an engineer) who needs to complete the RF impedance matching work. “The gain circle diagram and / or noise circle diagram corresponding to the component” includes three cases: (1) the gain circle diagram corresponding to the component; (2) the noise circle diagram corresponding to the component; (3) the gain circle diagram and noise circle diagram corresponding to the component; wherein, in the third case, the gain circle diagram and noise circle diagram of the component are superimposed on the same circle diagram, that is, the gain circle and noise circle of the component exist simultaneously on one circle diagram.

[0033] The following description is in conjunction with the accompanying drawings.

[0034] Please refer to Figure 1 This illustration shows a schematic diagram of an interactive system for radio frequency impedance matching provided in an embodiment of this application. Figure 1As shown, the interactive system 100 includes: a first input module 110 configured to receive target element information, target frequency range, and target scattering parameters input by a user, wherein the target element information includes element type and element parameters; an image processing module 120 configured to overlay a first Smith chart with a gain chart and / or noise chart corresponding to the target element to generate a first target image; a second input module 130 configured to receive target circle information determined by the user on the first target image, wherein the target circle information includes the coordinates of the target circle center in the first target image and the radius of the target circle; a processing module 140 configured to perform impedance matching simulation based on the target element information, target frequency range, and target scattering parameters to generate multiple simulation results, and match the multiple simulation results with the target circle information to determine the target result with the highest matching degree among the multiple simulation results; and an output module 150 configured to receive the target result, map the target result onto a second Smith chart to generate a second target image, and output the second target image.

[0035] When a user uses the interactive system 100 of this application, they first select the component requiring impedance matching from the circuit as the target component. Then, the relevant component information of the target component is transmitted to the first input module 110. The target component information includes the component type and component parameters. For example, the component type of the target component may include resistors, inductors, capacitors, etc., and the component parameters correspond to resistance values, inductance values, or capacitance values. In some embodiments, the target component information may also include an ID value for uniquely identifying the component. The interactive system 100 can automatically obtain relevant information about the target component in the circuit based on this ID value. For example, the gain circle and noise circle corresponding to the target component.

[0036] In addition to the target component information, the first input module 110 is also used to receive the target frequency range and target scattering parameters (S-parameters) input by the user. The target frequency range refers to the desired operating frequency range of the target component, such as 2600MHz-2700MHz; the target scattering parameters include input reflection parameters (S11), output reflection parameters (S22), reverse isolation parameters (S12), and forward gain parameters (S21). In some embodiments, the target scattering parameters are the input reflection parameters and the output reflection parameters, because these parameters have better graphical representation characteristics on a Smith chart, making it more suitable for visually presenting the impedance matching effect to the user.

[0037] Image processing module 120 overlays the first Smith chart with the gain chart and / or noise chart corresponding to the target element to generate a first target image. Second input module 130 receives target circle information determined by the user on the first target image. As mentioned above, engineers often need to balance impedance matching, gain maximization, and noise minimization. This is because during impedance matching, a node may simultaneously meet impedance requirements and have good gain performance, but its noise performance may not meet requirements; in this case, the engineer will have to discard the node. In existing impedance matching processes, engineers need to continuously manually modify the target element information and additionally compare the gain and noise charts after simulation to determine whether a node meets production requirements. In this application, the image processing module 120 overlays at least one of the gain and noise charts corresponding to the target element with the Smith chart before simulation to obtain the first target image, and subsequent operations use the first target image as the object of processing. This allows engineers to directly select the desired result region (i.e., the target circle) on the superimposed first target image using the second input module 130 before simulation, eliminating the need for secondary comparisons using the gain and noise charts corresponding to the target element after each simulation. This enables the interactive system 100 to guide the user in determining the desired result region before impedance matching simulation, reducing subsequent repeated adjustments and comparisons and improving the overall efficiency of RF impedance matching. The target circle information includes the coordinates of the target circle's center in the first target image and the radius of the target circle. In other words, the user defines the desired result by constructing a circular region on the first target image. Once the center and radius of the target circle are determined in the first target image, the system can determine the target circle's position on the first target image. Through a preset mapping relationship, the subsequent processing module 140 can determine the range of target scattering parameters corresponding to the target circle.

[0038] The processing module 140 performs impedance matching simulations based on target component information, target frequency range, and target scattering parameters to generate multiple simulation results. These results are then matched with target circle information to determine the target result with the highest degree of matching among the simulation results. Upon receiving the target component information, target frequency range, and target scattering parameters from the first input module 110, the processing module 140 performs impedance matching simulations on the target component within the target frequency range based on a preset impedance matching model and simulation rules. Since the structure of the matching network, the combination of component values, and frequency variations can all affect the matching results during RF impedance matching, the processing module 140 can generate multiple different simulation results in a single impedance matching simulation. Each simulation result can correspond to a trajectory or curve on a Smith chart, representing the matching state of the target component's impedance as a function of frequency within the target frequency range. It should be noted that in the above impedance matching simulation process, the target circle information is not used as a constraint condition in the impedance matching calculation but rather as a criterion for subsequent result selection. That is, the processing module 140 first performs impedance matching simulation based on the target element information, target frequency range, and target scattering parameters to obtain multiple candidate simulation results. Then, it performs matching analysis between these multiple simulation results and the target circle information received by the second input module 130. In some embodiments, the processing module 140 can determine the corresponding matching degree based on the distribution of each simulation result within the target circle. For example, it can compare and analyze multiple simulation results based on indicators such as the number of points where the curve corresponding to the simulation result falls within the target circle, the proportion of the curve within the target circle, or the degree of overlap between the curve and the target circle. In this way, the processing module 140 can determine the simulation result with the highest matching degree with the target circle information and identify this simulation result as the target result. After determining the target result, the processing module 140 transmits the target result to the output module 150.

[0039] The output module 150 receives the target result, maps it onto the second Smith chart to generate a second target image, and outputs the second target image. The second Smith chart can be identical to the first Smith chart in terms of coordinate system and physical meaning; it is only used to distinguish the image content presented by the interactive system at different stages. In this way, the user can intuitively understand the impedance matching result based on the second target image.

[0040] In summary, the interactive system for RF impedance matching provided in this application does not involve gradually adjusting component parameters and repeatedly verifying results during impedance matching simulation in a traditional manner. Instead, it first uses an image processing module to overlay the Smith chart with the gain and / or noise charts corresponding to the target component, forming a first target image containing multiple performance constraint information. The user then directly determines the desired result region based on this first target image, thus clearly defining the screening criteria for the matching results in the form of target circle information. Based on this, the processing module independently completes the impedance matching simulation to generate multiple candidate simulation results. These simulation results are then matched with the target circle information to determine the target result that best matches the user's design intent. By presenting the user's design intent as graphical screening conditions upfront, rather than manually comparing simulation results afterward, this interactive system can significantly improve the intuitiveness and efficiency of the RF impedance matching design process without changing the inherent calculation mechanism of the impedance matching simulation.

[0041] In some embodiments of this application, the gain circle map and / or noise circle map corresponding to the target element are input by the user to the image processing module 120; the image processing module 120 is also configured to adjust the first Smith circle map based on the user's operation instructions, so that the circumference of the first Smith circle map is at least partially aligned with the circumference of the gain circle map and / or noise circle map corresponding to the target element; wherein, the operation instructions include translation instructions and scaling instructions.

[0042] During the overlay processing in the image processing module 120 to generate the first target image, the user can manually input the gain pie chart and / or noise pie chart corresponding to the target element into the image processing module 120. The gain pie chart and / or noise pie chart corresponding to each element have been pre-stored in the user's electronic device. For example, these pie charts are sourced from the suppliers of the respective elements.

[0043] The image processing module 120 stores a blank Smith chart by default (referred to as the first Smith chart for easy distinction). When the user manually imports the gain chart and / or noise chart corresponding to the target element into the image processing module 120, the first Smith chart is superimposed on the gain chart and / or noise chart corresponding to the target element. Considering that misalignment may occur between the first Smith chart and the gain chart and / or noise chart corresponding to the target element during the superposition process, which may lead to errors in the user's determination of the target circle, the image processing module 120 is further configured to adjust the first Smith chart based on the user's operation commands, so that the circumference of the first Smith chart at least partially aligns with the circumference of the gain chart and / or noise chart corresponding to the target element. The user's operation commands include translation and zoom commands.

[0044] The above explains three scenarios for the "gain and / or noise circle plots corresponding to the component." Regardless of the scenario, this technical feature corresponds to a single circle plot. Therefore, given that the first Smith chart is also a circle plot in form, the user can manually adjust the position and size of the first Smith chart to at least partially align its circumference with the circumference of the target component's corresponding gain and / or noise circle plots. During the adjustment process, the user can pan and / or scale the first Smith chart until the final alignment meets expectations. Considering potential errors during operation, in some cases, the required adjustment can be considered complete when the circumferences of the two types of circles are at least partially aligned (or essentially aligned). In some cases, such as scenarios requiring high precision, the required adjustment can also be considered complete when the circumferences of the two types of circles are completely aligned.

[0045] In some embodiments, the user can also adjust the gain and / or noise pie chart corresponding to the target element so that the circumference of the pie chart at least partially matches the circumference of the first Smith chart. In some embodiments, the user can also adjust the gain and / or noise pie chart corresponding to the target element and the first Smith chart simultaneously. Regardless of the adjustment method, an accurate correspondence can ultimately be established between the gain and / or noise pie chart corresponding to the target element and the first Smith chart, forming a first target image, thereby facilitating the user to determine the desired target circle on the first target image.

[0046] Please refer to some embodiments of this application. Figure 1 The interactive system 100 also includes a storage module 160, which is configured to store the component information of each component and its corresponding gain circle plot and / or noise circle plot; the image processing module 120 is further configured to obtain target component information from the first input module 110, determine the gain circle plot and / or noise circle plot corresponding to the target component in the storage module 160 based on the target component information, and automatically adjust the first Smith chart based on the adjustment coefficient of the target component so that the circumference of the first Smith chart is at least partially aligned with the circumference of the gain circle plot and / or noise circle plot corresponding to the target component; wherein, the adjustment coefficient includes translation coefficient and scaling coefficient, and the storage module 160 is further configured to store the adjustment coefficients corresponding to the gain circle plot and / or noise circle plot of each component.

[0047] The image processing module 120 no longer relies on the user manually importing the gain and / or noise pie charts corresponding to the target component. Instead, it is configured to obtain the target component information input by the user from the first input module 110 and automatically determine the corresponding gain and / or noise pie charts in the storage module 160 based on the target component information. This reduces the frequency of user switching between different files or interfaces, thereby further improving operational efficiency. For example, as mentioned above, the target component information may include an ID value to uniquely identify the component. The image processing module 120 in the interactive system 100 can automatically obtain relevant information about the target component in the circuit based on this ID value, such as the gain and noise pie charts corresponding to the target component.

[0048] Furthermore, considering that the gain and / or noise pie charts corresponding to different components may differ in size and coordinate position, in this embodiment, the storage module 160 also pre-stores the adjustment coefficients corresponding to the gain and / or noise pie charts of each component. These adjustment coefficients describe the geometric correspondence between the first Smith chart and the gain and / or noise pie chart corresponding to the target component, and include translation and scaling coefficients. For example, the image processing module 120 can obtain the ID value of the target component from the first input module 110, and then directly query the storage module 160 based on this ID value to obtain the gain and / or noise pie chart corresponding to the target component, as well as the corresponding adjustment coefficients.

[0049] The image processing module 120 is further configured to, after determining the gain circle chart and / or noise circle chart corresponding to the target element, automatically adjust the first Smith chart based on the adjustment coefficient corresponding to the target element, so that the circumference of the first Smith chart at least partially matches the circumference of the gain circle chart and / or noise circle chart corresponding to the target element. The automatic adjustment process may include translation and / or scaling of the first Smith chart, thereby achieving alignment between the first Smith chart and the corresponding circle chart of the target element without manual intervention from the user. Compared to manual alignment by the user, the image processing module 120 in this embodiment can perform automated alignment operations, achieving relatively better alignment accuracy.

[0050] In the above manner, after the user inputs the target component information, the interactive system 100 can automatically complete the matching and alignment between the Smith chart and the corresponding gain chart and / or noise chart of the target component, and form a first target image for subsequent operations, thereby providing a reliable reference basis for the user to determine the target circle on the first target image.

[0051] In some embodiments of this application, the image processing module 120 is further configured to, in response to a user's fusion instruction, use the superimposed image as the first target image after the circumference of the first Smith chart is at least partially aligned with the circumference of the gain chart and / or noise chart corresponding to the target element.

[0052] After completing the above adjustment operations and confirming that the circumferences of the two circular images are at least partially aligned, the user sends a fusion command to the image processing module 120. Upon receiving the fusion command, the image processing module 120 uses the superimposed image as the first target image and outputs the first target image to the second input module 130, allowing the user to determine the desired target circle on the first target image through the second input module 130.

[0053] Please refer to Figure 2 and Figure 3 , Figure 2 This illustration shows a schematic diagram of the relationship between an unadjusted first Smith chart and the gain and / or noise chart corresponding to the target element, as provided in an embodiment of this application. Figure 3 This illustration shows the relationship between an adjusted first Smith chart and the gain and / or noise chart corresponding to the target element, as provided in an embodiment of this application. Figure 2 and Figure 3 As shown in the figure, the black lines represent the first Smith chart, the blue lines represent the gain chart of the target component, and the red lines represent the noise chart of the target component. Figure 2 and Figure 3 In this method, the gain and noise pie charts of the target component are combined into a single pie chart and overlaid with the Smith chart. This allows users to clearly see the corresponding information on the impedance, gain, and noise of the target component in a single image. Figure 2 In the middle, since alignment adjustments have not yet been made, a certain misalignment is clearly visible between the first Smith chart and the gain and noise charts of the target component; while... Figure 3 Since the adjustment has been completed, it can be seen that the circumferences of the two are completely aligned (that is, the requirement of at least partial alignment is met). At this time, the image can be used as the first target image and output by the image processing module 120 to the subsequent modules for processing.

[0054] In some embodiments of this application, the interactive system for radio frequency impedance matching can be implemented as a webpage, software installed locally on an electronic device, or other similar implementations; however, regardless of the implementation method, it can interact with the user, receive various commands issued by the user, provide corresponding feedback, and display some results to the user. For example, in... Figure 2 and Figure 3In this process, after clicking the "LoadPicture" button, the user can manually select the gain and noise pie charts of the target component from the local database. The image processing module 120 loads the selected image onto the first Smith chart. Subsequently, the user can move the position of the first Smith chart and perform zoom-in / zoom-out operations (i.e., give operation commands). The image processing module 120 adjusts the first Smith chart according to the user's operation commands so that the circumference of the first Smith chart at least partially aligns with the circumference of the corresponding gain and / or noise pie chart of the target component. After adjustment, the user can send a fusion command to the image processing module 120 by clicking the "Fixed" button and then the "Save" button. Upon receiving the fusion command, the image processing module 120 uses the image determined by the user as the first target image. In the case of automatic adjustment by the image processing module 120, the image processing module 120 will also display the automatically adjusted image to the user for confirmation. If the user is satisfied with the image, they can send a fusion command to the image processing module 120 following the above steps; if the user is not satisfied with the image, they can switch to manual adjustment.

[0055] In some embodiments of this application, the second input module 130 is further configured to receive a user's selection instruction and determine the coordinate information of the target circle center in the first target image based on the selection instruction; the second input module 130 is also configured to receive a user's drag instruction and determine the radius of the target circle based on the drag instruction.

[0056] Since the target circle is a circular area, when determining the target circle on the first target image, the center can be determined first, and then the radius can be determined. That is, the user can first send a point selection command to the second input module 130 to select a position on the first target image as the center position of the target circle; after the point selection command is received and parsed, the second input module 130 can determine the coordinate information of the target circle center in the first target image based on the point selection command.

[0057] After determining the center position, the user can continue to send drag commands to the second input module 130. Starting from the determined target center, the user gradually expands or shrinks the coverage area of ​​the target circle by dragging it in any direction on the first target image. The second input module 130 can determine the radius of the target circle based on the drag distance corresponding to the drag command, thereby completing the construction of the target circle.

[0058] Through this method, users can flexibly set the position and size of the target circle on the first target image using intuitive and continuous interactive operations. This ensures that the area defined by the target circle accurately reflects the user's expected range for impedance matching, gain, and noise results. This interactive method aligns with the conventional operating habits of engineers and helps reduce the understanding cost and operational complexity during the target circle setting process.

[0059] Please refer to Figure 4 This illustration shows a schematic diagram of a first target image after the target circle has been determined, according to an embodiment of this application. Figure 4 As shown, in Figure 3 Based on the determined first target image, Figure 4 The first target image also displays the target circle determined by the user (represented by a thick red line in the image, with a red center). If the user is not satisfied with the determined target circle, they can adjust its position and size by clicking the "Adjust" button. After the user determines the target circle, the second input module 130 will transmit the center coordinates and radius of the target circle to the subsequent processing module 140.

[0060] In some embodiments of this application, the degree of matching is determined based on the distribution of simulation results within the target circle.

[0061] When performing impedance matching simulation, the processing module 140 can call backend RF circuit simulation tools (such as ADS or an equivalent simulation engine) to perform multiple impedance matching simulations on the target component under different parameter combinations or matching conditions, based on the target component information, target frequency range, and target scattering parameters, thereby generating multiple simulation results. Each simulation result can be represented on a Smith chart as one or more scattering parameter trajectories corresponding to the target frequency range.

[0062] After obtaining multiple simulation results, the processing module 140 performs matching analysis between the simulation results and the target circle information determined by the user, and determines the degree of matching based on the distribution of each simulation result within the target circle. For example, the degree of matching can be determined based on one or more of the following methods: for example, the number or proportion of points in the simulation result trajectory that fall within the target circle; the continuous coverage length of the simulation result trajectory within the target circle; the average distance of the simulation result trajectory relative to the center of the target circle; or the size of the area where the simulation result trajectory overlaps with the target circle, etc. The above matching methods are merely examples, and this application does not limit the specific calculation algorithm.

[0063] Among multiple simulation results, the processing module 140 can determine the simulation result with the highest degree of matching as the target result. Understandably, the simulation result with the highest degree of matching is represented on the Smith chart as the trajectory that most closely overlaps with the target circle. By matching and filtering multiple impedance matching simulation results based on the target circle information and automatically determining the target result with the highest degree of matching, the process of repeated trial and error and manual comparison, which originally relied on engineers' experience, can be transformed into an automated filtering process. This reduces errors caused by manual calculation and judgment, and improves the reliability and consistency of impedance matching results.

[0064] In some implementations, the target results can be further exported as corresponding scattering parameter data files, such as S-parameter files (.s2p files), for use in subsequent circuit verification, system-level simulation, or production testing.

[0065] In some embodiments of this application, the first and second Smith charts are blank Smith charts. The output module 150 stores a blank Smith chart by default (referred to as the second Smith chart for easy distinction). The second Smith chart does not pre-load any simulation results or parameter curves; it serves only as a unified coordinate and visualization carrier to display the impedance matching results, thereby avoiding interference to the user's judgment due to differences in scale, coordinates, or display methods between different images.

[0066] In some embodiments of this application, the output module 150 is further configured to generate a target circle on the second target image to show the relative positional relationship between the target result and the target circle.

[0067] During the process of generating the second target image by the output module 150, a target circle is simultaneously generated on the second Smith chart to show the relative positional relationship between the target result and the target circle. That is, after mapping the target result to the second Smith chart, the output module 150 retains the target circle previously determined by the user in the same image, so that the scattering parameter trajectory corresponding to the target result and the target circle are displayed in the same visual space.

[0068] Using the above method, engineers can not only intuitively view the distribution of the target results obtained from impedance matching simulation on the Smith chart, but also directly compare the spatial relationship between the results and their pre-defined target areas, thereby quickly determining whether the target results meet design expectations. This synchronous display method retains the flexibility of engineers' manual judgment and experience-based decision-making, while further reducing the risk of design errors caused by misunderstandings or visual switching through graphical comparison, thus improving the reliability and user-friendliness of the RF impedance matching design process.

[0069] Please refer to Figure 5This illustrates a schematic diagram of a second target image provided in an embodiment of this application. For example... Figure 5 As shown, the second target image corresponds to the output reflection parameters. The black trajectory with arrows in the figure represents the scattering parameter trajectory corresponding to the target result, and the green dashed line represents the target circle. It can be seen from the figure that the scattering parameter trajectory corresponding to the target result matches the target circle to a high degree, and can be used as an ideal output result.

[0070] From an engineering perspective, Figure 5 The scattering parameter trajectory shown reflects the impedance variation of the target component under the corresponding parameter combination within the target frequency range (2620MHz to 2690MHz). When the scattering parameter trajectory falls into or approaches the target circle, it means that the parameter combination achieves the expected impedance matching effect at the corresponding frequency point. Furthermore, since the user has simultaneously referenced and comprehensively considered the gain and noise circle diagrams corresponding to the target component when determining the target circle, the scattering parameter trajectory falling within the target circle not only meets the impedance matching requirements but also takes into account both gain and noise performance. Based on this, Figure 5 The parameter combination corresponding to the target result shown can achieve a reasonable trade-off between gain and noise performance while satisfying impedance matching. This result can be directly used as the basis for parameter selection in RF circuit design and can be used for subsequent circuit implementation or product development, thereby reducing the process of repeated debugging and manual screening.

[0071] In some embodiments of this application, the interactive system 100 is also configured to re-execute the entire interactive process based on user instructions.

[0072] When the target result generated by the processing module 140 based on the target element information, target frequency range, and target scattering parameters deviates significantly from the target circle set by the user in the first target image, the user can send a re-execution command to the interactive system 100 through the interactive module. For example, in the second target image, if the trajectory corresponding to the target result deviates from the target circle or only has a small overlap with the target circle, the user can quickly determine that the simulation result does not meet expectations, and then reset the initial parameters (such as target element information, target frequency range, and target scattering parameters) before performing the simulation again.

[0073] Upon receiving the re-execution instruction, the interactive system 100 can clear the target circle information, simulation results, and corresponding second target image generated in the current interactive process, and re-enter the initial interactive state, so that the user can again input the target element information, target frequency range, and target scattering parameters through the first input module 110, and re-perform the subsequent image superposition, target circle setting, and impedance matching simulation process.

[0074] By providing the above-mentioned re-execution mechanism, when the simulation results deviate from the user's design expectations and it is difficult to obtain satisfactory results by fine-tuning the target circle, engineers do not need to repeatedly correct the existing results. Instead, they can quickly return to the starting point of the interaction and reset the design conditions, thereby enhancing the system's flexibility and operability in complex RF design scenarios and further improving the overall interactive experience and design efficiency.

[0075] Based on a similar technical concept, this application discloses an interactive system for radio frequency impedance matching. Please refer to... Figure 6 This illustrates a schematic diagram of another interactive system for radio frequency impedance matching provided in an embodiment of this application. Figure 6 As shown, the interactive system 200 includes an interactive module 210 and a processor 220. The interactive module 210 is adapted to receive instructions from the user and transmit the instructions to the processor 220, and to display at least a portion of the processing results of the processor 220 to the user; the processor 220 is configured to execute an interactive method for radio frequency impedance matching.

[0076] Please refer to Figure 7 The diagram illustrates a flowchart of an interactive method for radio frequency impedance matching provided in an embodiment of this application. This interactive method is applied to a processor. Figure 7 As shown, the interaction methods include: S100 receives target component information, target frequency range, and target scattering parameters input by the user. The target component information includes component type and component parameters. S200, the first Smith chart is superimposed with the gain chart and / or noise chart corresponding to the target element to generate the first target image; S300, receive target circle information determined by the user on the first target image, the target circle information including the coordinate information of the center of the target circle in the first target image and the radius of the target circle; S400 performs impedance matching simulation based on target element information, target frequency range, and target scattering parameters to generate multiple simulation results. These simulation results are then matched with target circle information to determine the target result that has the highest degree of matching with the target circle information among the multiple simulation results. S500 maps the target result onto the second Smith chart to generate a second target image and outputs the second target image.

[0077] It should be noted that, Figure 6In the interactive system 200 shown, the interactive method for radio frequency impedance matching executed by the processor 220 can be specifically implemented by referring to the description of each functional module in the aforementioned implementation of the interactive system 100. In this embodiment, the same or similar technical content will not be repeated. In other words, the processing logic completed by the processor 220 during the execution of the interactive method is technically consistent with the functions collaboratively implemented by the modules in the aforementioned embodiments; only the system architecture expression has been abstracted and integrated.

[0078] Furthermore, the interaction module 210 is used to display at least part of the processing results of the processor 220 to the user, and its specific implementation is not limited. For example, the interaction module 210 may include a computer display screen, a touch screen of a portable electronic device, or other display devices with graphical display and interactive capabilities. In this way, users can complete parameter input, target area setting, and simulation result viewing on an intuitive graphical interface, thereby improving the human-computer interaction of the system and facilitating engineers to efficiently complete RF impedance matching related operations. The at least part of the processing results includes at least the aforementioned first target image and second target image.

[0079] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail or in a particular embodiment can be referred to in the relevant descriptions of other embodiments. Furthermore, the above embodiments can be freely combined as needed.

Claims

1. An interactive system for radio frequency impedance matching, characterized in that, include: The first input module is configured to receive target element information, target frequency range, and target scattering parameters input by the user, wherein the target element information includes element type and element parameters. The image processing module is configured to overlay a first Smith chart with a gain chart and / or a noise chart corresponding to the target element to generate a first target image; The second input module is configured to receive target circle information determined by the user on the first target image, the target circle information including the coordinates of the center of the target circle in the first target image and the radius of the target circle; The processing module is configured to perform impedance matching simulation based on the target element information, the target frequency range, and the target scattering parameters to generate multiple simulation results, and to match the multiple simulation results with the target circle information to determine the target result among the multiple simulation results that has the highest degree of matching with the target circle information; The output module is configured to receive the target result, map the target result onto a second Smith chart to generate a second target image, and output the second target image.

2. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, The gain pie chart and / or noise pie chart corresponding to the target element are input by the user into the image processing module; The image processing module is further configured to adjust the first Smith chart based on the user's operation command, so that the circumference of the first Smith chart at least partially matches the circumference of the gain chart and / or noise chart corresponding to the target element. The operation commands include translation commands and zoom commands.

3. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, It also includes a storage module configured to store component information of each element and its corresponding gain pie chart and / or noise pie chart; The image processing module is further configured to obtain the target element information from the first input module, determine the gain pie chart and / or noise pie chart corresponding to the target element in the storage module based on the target element information, and automatically adjust the first Smith chart based on the adjustment coefficient of the target element so that the circumference of the first Smith chart at least partially matches the circumference of the gain pie chart and / or noise pie chart corresponding to the target element. The adjustment coefficients include translation coefficients and scaling coefficients, and the storage module is further configured to store the adjustment coefficients corresponding to the gain pie chart and / or noise pie chart of each element.

4. The interactive system for radio frequency impedance matching according to claim 2 or 3, characterized in that, The image processing module is further configured to, in response to the user's fusion command, use the superimposed image as the first target image after the circumference of the first Smith chart at least partially overlaps with the circumference of the gain chart and / or noise chart corresponding to the target element.

5. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, The second input module is also configured to receive the user's selection instruction and determine the coordinate information of the target circle center in the first target image based on the selection instruction; The second input module is also configured to receive the user's drag command and determine the radius of the target circle based on the drag command.

6. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, The degree of matching is determined based on the distribution of the simulation results within the target circle.

7. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, The output module is also configured to generate the target circle on the second target image to show the relative positional relationship between the target result and the target circle.

8. The interactive system for radio frequency impedance matching according to claim 1, characterized in that, The first Smith chart and the second Smith chart are blank Smith charts.

9. An interactive method for radio frequency impedance matching, characterized in that, Applied to a processor, the interaction method includes: The system receives target component information, target frequency range, and target scattering parameters input by the user. The target component information includes component type and component parameters. The first Smith chart is superimposed with the gain chart and / or noise chart corresponding to the target element to generate the first target image; The system receives target circle information determined by the user on the first target image, the target circle information including the coordinates of the center of the target circle in the first target image and the radius of the target circle; Impedance matching simulation is performed based on the target element information, the target frequency range, and the target scattering parameters to generate multiple simulation results. The multiple simulation results are then matched with the target circle information to determine the target result among the multiple simulation results that has the highest degree of matching with the target circle information. The target result is mapped onto a second Smith chart to generate a second target image, and the second target image is output.

10. An interactive system for radio frequency impedance matching, characterized in that, include: An interaction module and a processor, the interaction module being adapted to receive instructions from a user and transmit the instructions to the processor, and to display at least a portion of the processing results of the processor to the user; The processor is configured to execute the interaction method of claim 9.