柔性电路板导通孔制作方法及医疗超声设备用柔性电路板
By drilling non-through holes and selectively electroplating on flexible circuit boards, the problems of increased thickness and decreased flexibility caused by whole-board electroplating are solved, achieving high flexibility and low-cost manufacturing of flexible circuit boards for medical ultrasound equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHUHAI HAIXUN SOFT MULTILAYER PROTOTYPES
- Filing Date
- 2026-05-08
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology, the flexible circuit boards used in medical ultrasound equipment have increased thickness and decreased flexibility due to the whole board electroplating, which cannot meet the requirements of use in narrow spaces and high bending, and also increases material costs and process complexity.
The method involves drilling non-through holes in the upper circuit and the insulating layer, shielding them, opening electrical connection channels in the insulating layer and filling them with conductive medium, and selectively electroplating only the exposed areas of the lower circuit to form a conductive structure, thus avoiding the thickening of the surfaces of the upper and lower circuits.
It maintains the overall thickness and flexibility of flexible circuit boards, reduces material costs and process complexity, improves manufacturing yield and product consistency, and is suitable for the use requirements of medical ultrasound equipment.
Smart Images
Figure CN122205770B_ABST
Abstract
Citation Information
Patent Citations
CN104135822A
CN118475029A