Die bonding apparatus

Abstract

The application discloses a kind of solid crystal equipment, it is related to semiconductor processing technical field;Solid crystal equipment includes frame, first rotating hub and glue dispensing mechanism, first rotating hub is rotatably connected with frame, and first rotating hub is used to transport material belt;Material belt is provided with multiple rows of multiple columns of initial labels, each column of initial labels is arranged along the rotation direction of first rotating hub, and each row of initial labels is arranged along first direction, and first direction is parallel to the rotation axis of first rotating hub;Glue dispensing mechanism includes first movement module and glue dispensing function module, first movement module is movably arranged on frame, and glue dispensing function module is installed on first movement module, and first movement module is used to reciprocate along first direction;Glue dispensing function module is used to carry out glue dispensing operation after detecting that it is moved to the corresponding position of initial label, and quality detection is carried out to glue dispensing label.The application is reciprocated by first movement module to drive glue dispensing function module to carry out glue dispensing, and the effect of considering cost and control accuracy is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a die bonding device. Background Technology

[0002] The technological development of chip die bonding equipment has progressed from single-row to multi-row parallel processing to improve packaging efficiency. Among the core processes, dispensing and chip mounting are key steps, and their equipment layout directly determines the system's overall performance in terms of cost, accuracy, and efficiency.

[0003] Currently, in multi-column die bonding equipment, two main solutions are used to achieve dispensing of adhesive to multiple preset positions on the substrate (i.e., the strip): one is a parallel multi-mechanism system, where each column is independently configured with a complete dispensing mechanism, and the parallel processing of dispensing across multiple columns is achieved through hardware stacking; the other is a single-mechanism platform moving system, which uses only a single dispensing mechanism. The system drives the adsorption hub platform to move back and forth significantly along a direction perpendicular to the strip's running direction, allowing the strip and the labels on it to sequentially enter the fixed processing head of the dispensing mechanism for processing.

[0004] However, both of the above-mentioned dispensing methods in current multi-row chip bonding equipment have shortcomings. Although the multi-parallel solution is fast, the cost of the equipment increases sharply due to the multiple sets of high-precision vision and dispensing systems. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long stroke reciprocating motion of the large inertia platform makes it difficult to guarantee control accuracy.

[0005] Therefore, there is an urgent need for a new die bonding device to solve the problem of balancing cost and control accuracy in the die bonding process. Summary of the Invention

[0006] The main objective of this invention is to propose a die bonding device that aims to solve the problem of balancing cost and control accuracy during the dispensing process.

[0007] To achieve the above objectives, the die bonding equipment proposed in this invention includes a frame, a first rotating hub, and a dispensing mechanism. The first rotating hub is rotatably connected to the frame and is used to carry and transport the material strip. Multiple rows and columns of initial labels are arrayed on the material strip. Each column of initial labels is arranged along the rotation direction of the first rotating hub, and each row of initial labels is arranged along a first direction parallel to the rotation axis of the first rotating hub. The dispensing mechanism includes a first motion module and a dispensing function module. The first motion module is movably mounted on the frame, and the dispensing function module is mounted on the first motion module. The first motion module is used to reciprocate along the first direction and drive the dispensing function module to move. The dispensing function module is used to perform dispensing operations on the initial labels after detecting the corresponding position of the initially labels on the material strip, and to perform quality inspection on the dispensed labels.

[0008] In one embodiment, the dispensing function module includes a dispensing execution unit, a first vision sensor, and a second vision sensor. The dispensing execution unit is mounted on a first motion module and is used to perform dispensing operations. The first vision sensor is used to locate and identify the initial label on the material strip. The second vision sensor is used to perform quality inspection on the glue dots on the dispensing label.

[0009] In one embodiment, the dispensing function module further includes a mounting adjustment component, on which the first vision sensor and the second vision sensor are mounted to the first motion module. The mounting adjustment component is used to adjust the spatial pose of the first vision sensor and the second vision sensor relative to the dispensing execution unit, so that the dispensing end of the dispensing execution unit, the first vision sensor, and the second vision sensor are arranged in the same row or staggered.

[0010] In one embodiment, a first vision sensor is locked in a first position on the mounting adjustment member in a first posture, such that the field of view of the first vision sensor covers the initial label on the tape facing the dispensing end; in a same-row layout, a second vision sensor is locked in a second position on the mounting adjustment member in a second posture, such that the center of the field of view of the second vision sensor, the center of the field of view of the first vision sensor, and the direction facing the dispensing end converge at the same point; in a staggered layout, a second vision sensor is locked in a third position on the mounting adjustment member in a third posture, such that the center of the field of view of the second vision sensor has a preset distance from the center of the field of view of the first vision sensor in the rotation direction along the first rotating hub, so that when both the dispensing end and the first vision sensor correspond to the initial label in the m-th column and n+k-th row, the center of the field of view of the second vision sensor corresponds to the dispensing label in the m-th column and n-th row; wherein m, n, and k are all positive integers, and the row numbers of the initial label and the dispensing label gradually decrease in the running direction of the tape.

[0011] In one embodiment, the mounting adjustment member has an arc-shaped adjustment hole, the plane of which the arc of the adjustment hole extends is perpendicular to the first direction, and the mounting adjustment member has an angle scale around the adjustment hole; a first visual sensor and a second visual sensor are each mounted on the mounting adjustment member through the adjustment hole; the first visual sensor is configured to be movable along the extension direction of the adjustment hole and rotatable about the mounting axis of the first visual sensor, and its position and angle can be locked; the second visual sensor is configured to be movable along the extension direction of the adjustment hole and rotatable about the mounting axis of the second visual sensor, and its position and angle can be locked.

[0012] In one embodiment, the die bonding equipment further includes a control module and a motion correction platform. The two ends of the first rotating hub are mounted on the motion correction platform, which drives the first rotating hub to rotate. The control module is electrically connected to the first motion module, the dispensing function module, and the motion correction platform. The control module controls the first motion module to move along a first direction to the corresponding position of the target column and receives a positioning image from a first vision sensor to control the first motion module to perform compensatory movement, so that the dispensing execution unit aligns with the initial label on the target column and performs dispensing operations. The control module also controls the first motion module and the dispensing execution unit to sequentially dispense initial labels on different columns of the same row along the first direction. After all initial labels on the same row have been dispensed, the control module resets and synchronously controls the motion correction platform to drive the first rotating hub to rotate, so that the first motion module and the dispensing execution unit sequentially dispense initial labels on different columns of the next row.

[0013] In one embodiment, the control module is further configured to, in the same row layout mode, after the dispensing execution unit has dispensed glue to each initial label, receive a detection image of the dispensing label from the second vision sensor and determine the dispensing quality; the control module is further configured to, in the staggered layout mode, during the process of the dispensing execution unit dispensing glue to the initial label in the m-th column and n-th row, simultaneously receive a detection image of the dispensing label in the m-th column and n-th row from the second vision sensor and determine the dispensing quality; wherein m, n, and k are all positive integers, and the row numbers of the initial label and the dispensing label gradually decrease in the running direction of the conveyor belt.

[0014] In one embodiment, the die bonding equipment further includes a wiping structure, which is mounted on the frame and located beside the initial position of the dispensing execution unit. The control module is used to control the first motion module to move after the dispensing execution unit completes a preset number of dispensing operations, so that the dispensing end of the dispensing execution unit rubs against the wiping structure. And / or, the control module is used to control the motion correction platform to drive the first rotating hub and the material belt to move compensatingly along the first direction or the opposite direction of the first direction based on the positioning image of the first vision sensor, so that the dispensing execution unit aligns with the initial label on the target column and performs the dispensing operation. And / or, the outer periphery of the first rotating hub is provided with at least two air inlets, and the two ends of the first rotating hub are also used to dock with a vacuum adsorption device.

[0015] In one embodiment, the die bonding equipment further includes a second rotating hub and a bonding mechanism; the second rotating hub is rotatably connected to the frame and is used to carry and transport the tape from the first rotating hub; the bonding mechanism is located on the frame and is downstream of the dispensing mechanism along the running direction of the tape; the bonding mechanism is used to perform chip mounting operations on the dispensing labels.

[0016] In one embodiment, the bonding mechanism includes a second motion module, a third motion module, a multi-arm bonding module, a third vision sensor, and a fourth vision sensor. The second and third motion modules are movably mounted on a frame. The third and fourth vision sensors are mounted on the second motion module, and the multi-arm bonding module is mounted on the third motion module. The second and third motion modules are used for reciprocating along a second direction, which is parallel to the first direction. The multi-arm bonding module has a substrate and multiple bonding arms that can rotate around the substrate. Each bonding arm has a nozzle at its end for adsorbing and placing chips. The nozzle is used to adsorb chips. The third vision sensor is used to locate and identify the adhesive labels on the tape. The multi-arm bonding module is used to attach the chips on the bonding arms to the adhesive labels. The fourth vision sensor is used to perform quality inspection on the attached labels after chip mounting.

[0017] The technical solution of this invention provides stable support and step-by-step conveying capability for the material belt by setting a first rotating hub to carry and transport it. This ensures that multiple rows and columns of labels can enter the processing area sequentially and orderly, laying the foundation for continuous production. Simultaneously, by installing the dispensing function module in the dispensing mechanism onto a first motion module, and utilizing the reciprocating movement of the first motion module along a first direction, the dispensing function module is moved. Thus, only a single dispensing function module is needed to sequentially process multiple columns of labels distributed along the first direction on the material belt through the movement of the first motion module. Compared to a parallel solution with multiple mechanisms, each requiring a separate complete dispensing mechanism for each column of labels, this solution significantly reduces the number of high-precision vision and dispensing systems, thereby significantly reducing equipment hardware costs. Furthermore, compared to the single-mechanism platform movement scheme that moves the entire first rotating hub along the first direction to allow each column of labels to sequentially enter the fixed processing head, the object moved in this scheme is only the lightweight first motion module and the dispensing function module it carries. The first motion module has the characteristics of light load and small inertia. Its long-stroke reciprocating motion control accuracy, dynamic response characteristics and stopping stability have been significantly improved compared to the large inertia platform. It can achieve high-speed, high-acceleration smooth reciprocating positioning and shorten the inter-column movement time. It can also avoid the problem of vibration and inertial impact caused by the movement of a large mass platform being transmitted to the material strip and affecting the positioning reference. It also eliminates the uncontrollable errors introduced by the micro-slippage or stretching of the material strip on the platform, and achieves high-precision and high-efficiency dispensing processing of multiple columns of labels at a reasonable cost. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the dispensing mechanism of an embodiment of the die bonding equipment provided by the present invention; Figure 2 Another schematic diagram of the dispensing mechanism of an embodiment of the die bonding equipment provided by the present invention; Figure 3 This is a schematic diagram of a structure of an embodiment of the die bonding device provided by the present invention; Figure 4 This is a schematic diagram of the bonding mechanism of an embodiment of the die bonding device provided by the present invention.

[0020] Explanation of icon numbers: 1. Rack; 2. First rotating hub; 3. Dispensing mechanism; 31. First motion module; 32. Dispensing function module; 321. Dispensing execution unit; 322. First vision sensor; 323. Second vision sensor; 324. Mounting adjustment component; 3241. Adjustment hole; 5. Control module; 6. Motion correction platform; 7. Second rotating hub; 8. Binding mechanism; 81. Second motion module; 82. Third motion module; 83. Multi-arm binding module; 831. Base; 832. Binding arm; 8321. Nozzle; 84. Third vision sensor; 85. Fourth vision sensor.

[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] The technological development of chip die bonding equipment has progressed from single-row to multi-row parallel processing to improve packaging efficiency. Among the core processes, dispensing and chip mounting are key steps, and their equipment layout directly determines the system's overall performance in terms of cost, accuracy, and efficiency.

[0026] Currently, in multi-column die bonding equipment, two main solutions are used to achieve dispensing of adhesive to multiple preset positions on the substrate (i.e., the strip): one is a parallel multi-mechanism system, where each column is independently configured with a complete dispensing mechanism, and the parallel processing of dispensing across multiple columns is achieved through hardware stacking; the other is a single-mechanism platform moving system, which uses only a single dispensing mechanism. The system drives the adsorption hub platform to move back and forth significantly along a direction perpendicular to the strip's running direction, allowing the strip and the labels on it to sequentially enter the fixed processing head of the dispensing mechanism for processing.

[0027] However, both of the above-mentioned dispensing methods in current multi-row chip bonding equipment have shortcomings. Although the multi-parallel solution is fast, the cost of the equipment increases sharply due to the multiple sets of high-precision vision and dispensing systems. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long stroke reciprocating motion of the large inertia platform makes it difficult to guarantee control accuracy.

[0028] Therefore, there is an urgent need for a new die bonding device to solve the problem of balancing cost and control accuracy in the die bonding process.

[0029] To address the above problems, this invention proposes a die bonding device.

[0030] Please see Figures 1 to 3 In one embodiment of the present invention, the die bonding equipment includes a frame 1, a first rotating hub 2, and a dispensing mechanism 3. The first rotating hub 2 is rotatably connected to the frame 1 and is used to carry and convey the material strip. Multiple rows and columns of initial labels are arrayed on the material strip. Each column of initial labels is arranged along the rotation direction of the first rotating hub 2, and each row of initial labels is arranged along a first direction, which is parallel to the rotation axis of the first rotating hub 2. The dispensing mechanism 3 includes a first motion module 31 and a dispensing function module 32. The first motion module 31 is movably mounted on the frame 1, and the dispensing function module 32 is mounted on the first motion module 31. The first motion module 31 is used to reciprocate along the first direction and drive the dispensing function module 32 to move. The dispensing function module 32 is used to perform dispensing operations on the initial labels after detecting the corresponding position of the initial labels on the material strip, and to perform quality inspection on the dispensed labels.

[0031] The technical solution of this invention provides stable support and step-by-step conveying capability for the material belt by setting a first rotating hub 2 to carry and transport it, ensuring that multiple rows and columns of labels can enter the processing area sequentially and orderly, laying the foundation for continuous production. Simultaneously, by installing the dispensing function module 32 in the dispensing mechanism 3 onto the first motion module 31, and utilizing the reciprocating movement of the first motion module 31 along a first direction (i.e., parallel to the rotation axis of the first rotating hub 2), the dispensing function module 32 is moved. Thus, only a single dispensing function module 32 is needed to sequentially process multiple columns of labels distributed along the first direction on the material belt through the movement of the first motion module 31. Compared to a parallel solution with multiple mechanisms, each column of labels requires a separate complete dispensing mechanism 3, this solution significantly reduces the number of high-precision vision and dispensing systems, thereby significantly reducing equipment hardware costs. Furthermore, compared to the single-mechanism platform moving scheme that moves the entire first rotating hub 2 along the first direction to allow each column of labels to sequentially enter the fixed processing head, the moving object in this scheme is only the lightweight first motion module 31 and the dispensing function module 32 it carries. The first motion module 31 has the characteristics of light load and small inertia. Its long-stroke reciprocating motion control accuracy, dynamic response characteristics and stopping stability have been significantly improved compared to the large inertia platform. It can achieve high-speed, high-acceleration smooth reciprocating positioning and shorten the inter-column movement time. It can also avoid the problem of vibration and inertial impact caused by the movement of a large mass platform being transmitted to the material strip and affecting the positioning reference. It also eliminates the uncontrollable error introduced by the micro-slippage or stretching of the material strip on the platform, and realizes high-precision and high-efficiency dispensing processing of multiple columns of labels at a reasonable cost.

[0032] Furthermore, the dispensing module 32, while performing dispensing operations on the initial labels, also performs quality inspection on the dispensed labels. This allows the equipment to inspect the quality of the glue dots immediately after the dispensing process, achieving an instant closed loop between processing and inspection. The inspection data can not only be used for quality judgment in this process, but also provide a basis for precise position compensation based on the actual glue condition for subsequent chip mounting processes, thereby achieving precise control across processes and improving the yield and reliability of the final product.

[0033] Overall, the die bonding equipment of the present invention, by adopting a scheme in which a lightweight first motion module 31 drives a dispensing function module 32 that integrates dispensing and detection functions to move back and forth along a first direction, successfully breaks the balance between cost, accuracy and efficiency in the traditional multi-row dispensing scheme. It achieves high control accuracy close to that of a multi-group parallel scheme with a low cost close to that of a single-mechanism platform moving scheme, and significantly improves efficiency compared to a single-mechanism platform moving scheme.

[0034] It should be noted that the first direction refers to the direction parallel to the rotation axis of the first rotating hub 2, and also perpendicular to the direction of the material strip's movement (usually called the CD (Cross Direction) in die bonding equipment). The rotation direction of the first rotating hub 2 is the same as the direction of the material strip's movement, usually called the MD (Machine Direction) in die bonding equipment. The labels on the material strip are distributed in an array of rows and columns, with the columns arranged along the rotation direction of the first rotating hub 2 and the rows arranged along the first direction. The dispensing label refers to the initial label after the dispensing operation has been completed. In addition, quality inspection can include checking for defects such as the shape, size, center position, and presence of stringing or satellite dots in the adhesive dots.

[0035] In one example, during the operation of the die bonding equipment, when a parallel layout mode is adopted, after the die bonding equipment is started, the first rotating hub 2 begins to rotate, carrying and driving the material strip to step forward, so that the first row of labels in a certain area to be processed on the material strip enters the dispensing station. The control system, according to the preset column coordinates, drives the first motion module 31 to move the dispensing function module 32 at high speed along the first direction to the theoretical position above the first column of labels. The positioning camera in the dispensing function module 32 captures an image of the target die bonding point of the first column of labels, and identifies its actual center coordinates through image processing, calculating the positional deviation from the theoretical coordinates. The motion controller drives the first motion module 31 to perform micro-motion compensation based on this deviation, so that the dispensing nozzle is precisely aligned with the die bonding point, triggering dispensing. After dispensing is completed, the detection camera in the dispensing function module 32 immediately captures an image of the newly formed glue dot, detects its quality, and records the actual center position of the glue dot. After completing the positioning-dispensing-detection cycle of the first column, the first motion module 31 drives the dispensing function module 32 to move rapidly along the first direction to the second column, repeating the above steps. This process is repeated until all columns of the current row are dispensing adhesive. Then, the first rotating hub 2 advances one row spacing, allowing the next row of labels to enter the processing area, while the first motion module 31 moves in the opposite direction to begin dispensing adhesive across multiple columns of a new row. This cycle is repeated to achieve continuous production.

[0036] The same-row layout mode will be described in detail in subsequent embodiments, and will not be repeated here.

[0037] As an optional implementation, the frame 1 can be constructed using a high-strength cast iron or marble platform structure, providing a stable mounting base for all moving parts. The first rotating hub 2 is a cylindrical or cylindrical structure, and its surface can be provided with vacuum adsorption holes or friction layers for adsorbing or rubbing the material strip during rotation, ensuring the tension and position stability of the material strip during conveying and processing. The rotation of the first rotating hub 2 is driven by an independent high-precision servo motor and reducer, achieving precise stepping of the material strip.

[0038] In addition, as an optional implementation, the first motion module 31 can be a linear motor module, which includes a stator (such as a guide rail) and a mover (such as a moving platform that slides with the guide rail), with the dispensing function module 32 mounted on the mover. The linear motor module features high speed, high acceleration, and high positioning accuracy, enabling rapid, smooth, and precise reciprocating movement of the dispensing function module 32. Alternatively, the first motion module 31 can also be a ball screw-type linear module, where a servo motor drives the ball screw to rotate via a coupling, moving the nut seat mounted on the dispensing function module 32. This solution also provides high positioning accuracy and transmission rigidity.

[0039] Please see Figure 1 and Figure 2In an embodiment of the present invention, the dispensing function module 32 includes a dispensing execution unit 321, a first vision sensor 322, and a second vision sensor 323. The dispensing execution unit 321 is mounted on the first motion module 31 and is used to perform dispensing operations. The first vision sensor 322 is used to locate and identify the initial label on the material strip. The second vision sensor 323 is used to perform quality detection on the glue dots on the dispensing label.

[0040] In this embodiment, by integrating the dispensing execution unit 321, the first vision sensor 322, and the second vision sensor 323 into the same dispensing functional module 32 and mounting it on the first motion module 31, a high degree of integration of positioning, processing, and detection functions is achieved. The dispensing execution unit 321 performs the dispensing operation, ensuring basic processing capabilities. The first vision sensor 322 is used to locate and identify the initial label on the material strip, accurately acquiring the position information of the target initial label before dispensing. This provides a basis for position compensation of the dispensing execution unit 321, eliminating positioning errors caused by material strip transportation, label arrangement, and other processes, significantly improving dispensing position accuracy. The second vision sensor 323 is used to perform quality inspection on the glue dots on the dispensed labels, enabling the equipment to immediately inspect the glue dot quality after the dispensing process is completed, without needing to transfer the material strip to a separate inspection station. This shortens the inspection feedback cycle and achieves an instant closed loop between processing and inspection. Furthermore, since the first vision sensor 322 and the second vision sensor 323 are rigidly connected to the dispensing execution unit 321 and move synchronously, the measurement reference and execution reference are highly consistent, avoiding Abbe error and dynamic positioning error introduced by relative motion or platform movement, thus further improving the reliability of positioning and detection. Simultaneously, the glue dot detection data acquired by the second vision sensor 323 can not only be used for quality judgment in this process but also provide accurate position compensation based on actual glue conditions for downstream chip mounting processes, thereby achieving closed-loop control across processes and improving the final product mounting yield.

[0041] It should be noted that the dispensing execution unit 321 is a component used to perform glue spraying or dotting operations, typically including a glue spray valve, a glue nozzle, and a glue path controller. For specific structure, refer to commercially available conventional dispensing mechanisms 3. The first vision sensor 322 is a camera or image sensor used to identify the position of the target label before the dispensing operation; it is also called a positioning camera. The second vision sensor 323 is a camera or image sensor used to image and detect the formed glue dots after the dispensing operation; it is also called a detection camera. An initial label refers to a label on the tape that has not yet undergone dispensing. A dispensing label refers to a label that has completed the dispensing operation and has glue dots adhering to its surface.

[0042] In one example, the dispensing function module 32 operates as follows: In a parallel layout mode, when the first motion module 31 moves the dispensing function module 32 above a column of labels, the first vision sensor 322 first captures an image of the initial label in that column, obtaining its actual position coordinates, and sends the image data to the control module 5. The control module 5 calculates the deviation between the label center and the theoretical position using an image processing algorithm, and drives the first motion module 31 to perform micro-displacement compensation, ensuring that the dispensing end of the dispensing execution unit 321 is precisely aligned with the target die-bonding point on the label. Subsequently, the control module 5 triggers the dispensing execution unit 321 to complete the dispensing operation. After dispensing is completed, the second vision sensor 323 immediately captures an image of the newly formed glue dot, detecting quality parameters such as the shape, size, and center position of the glue dot, and feeds the detection results back to the control module 5 for recording or alarm. After completing the operation of the current column, the first motion module 31 moves the entire dispensing function module 32 to the next column, repeating the above steps.

[0043] As an optional implementation, both the first vision sensor 322 and the second vision sensor 323 can be high-resolution industrial cameras, coupled with coaxial or ring light sources, to ensure clear images are obtained under various material and lighting conditions. The dispensing execution unit 321 can be a piezoelectric jet valve or a pneumatic dispensing valve, selected according to the adhesive characteristics and process requirements.

[0044] Please see Figure 1 and Figure 2 In an embodiment of the present invention, the dispensing function module 32 further includes a mounting adjustment component 324, wherein the first vision sensor 322 and the second vision sensor 323 are mounted on the first motion module 31 via the mounting adjustment component 324; the mounting adjustment component 324 is used to adjust the spatial pose of the first vision sensor 322 and the second vision sensor 323 relative to the dispensing execution unit 321, so that the dispensing end of the dispensing execution unit 321, the first vision sensor 322 and the second vision sensor 323 form a co-row layout or a staggered layout.

[0045] In this embodiment, by adding an adjustment component 324, and mounting the first vision sensor 322 and the second vision sensor 323 onto the first motion module 31 via the adjustment component 324, the spatial pose of the two vision sensors relative to the dispensing execution unit 321 can be flexibly adjusted. Through the adjustment component 324, operators can conveniently configure the dispensing execution unit 321, the first vision sensor 322, and the second vision sensor 323 into a co-row or staggered layout according to different process requirements, without replacing hardware or disassembling and reassembling. In the co-row layout, the first vision sensor 322, the dispensing execution unit 321, and the second vision sensor 323 are used to sequentially perform positioning identification, dispensing, and quality inspection on target labels in the same column and row, suitable for scenarios where the requirement for glue settling time is not high and timely glue dot quality feedback is needed. In a staggered layout, by adjusting the position of the second vision sensor 323, the center of its field of view is offset from the center of the field of view of the first vision sensor 322 along the rotation direction of the first rotating hub 2. This allows the second vision sensor 323 to simultaneously detect adhesive dots on labels that have already been dispensed (i.e., n rows) while the dispensing unit 321 is dispensing the current row (n+k rows). This achieves synchronization between dispensing and quality inspection. Therefore, unlike the same-row layout, the staggered layout does not require waiting for the dispensing of a single label to be completed before quality inspection. Furthermore, since image processing for quality inspection also takes time (typically tens of milliseconds), the staggered layout offers a significant production capacity advantage over the same-row layout when continuously processing large quantities of labels across multiple columns and rows. Furthermore, in the staggered layout, the adhesive dots of the dispensing labels detected by the second vision sensor 323 have undergone sufficient settling time, resulting in stable morphology and more accurate detection results. The subsequent mounting compensation data provided based on this is also more precise.

[0046] This embodiment achieves two different layout modes using the same set of mounting adjustment components 324, thus forming two different working modes. This significantly improves the equipment's process adaptability and flexibility, allowing users to flexibly select the optimal mode based on adhesive characteristics, production cycle time, and precision requirements, without the need to purchase multiple dedicated devices. Overall, this embodiment's technical solution of adjusting the spatial layout of the vision sensor and execution unit through mounting adjustment components 324 endows the dispensing function module 32 with powerful process mode switching capabilities. It achieves the conversion from a same-row reciprocating mode to a staggered parallel mode with simple mechanical structural adjustments, greatly expanding the equipment's applicable process scenarios with almost no increase in hardware costs.

[0047] It should be noted that the mounting adjustment component 324 refers to the mechanical component used to fix and allow adjustment of the mounting position and angle of the first vision sensor 322 and the second vision sensor 323. Spatial pose refers to the three-dimensional coordinate position and orientation (i.e., three-dimensional angle) in three-dimensional space.

[0048] In one example, when switching operating modes, the operator first determines whether a same-row or staggered layout is required based on process requirements. If a same-row layout is used, the field of view centers of the first vision sensor 322 and the second vision sensor 323 are adjusted using the adjustment component 324 to converge at the same point in the direction facing the dispensing end of the dispensing execution unit 321. If a staggered layout is used, for example, if the adhesive needs to settle for three rows, the second vision sensor 323 is adjusted along the rotation direction of the first rotating hub 2 using the adjustment component 324, so that its field of view center lags behind the dispensing execution unit 321 by three rows, and then locked. During operation, the control system automatically matches the corresponding control logic according to the preset layout parameters.

[0049] As an optional implementation, the mounting adjustment component 324 can be a circular fixing ring support with angle scales. The first vision sensor 322 and the second vision sensor 323 are respectively mounted on the basic structure of the dispensing function module 32 through the fixing ring support. By rotating the fixing ring support and referring to the scale, the angles of the two vision sensors can be precisely adjusted, which can then be converted into the row offset along the material conveyor belt running direction. For minor deviations in adjustment, the control module 5 of the die bonding equipment can also perform displacement compensation within a certain range on the detection image through the system program, so that the dispensing label in the detection image is centered in the image. Alternatively, the mounting adjustment component 324 can also be a mounting plate with an elongated hole or an arc-shaped groove. The vision sensor is fixed to the mounting plate by bolts passing through the elongated hole. Loosening the bolts allows the sensor to move and adjust its position along the groove, while tightening the bolts secures it.

[0050] Please see Figures 1 to 3In an embodiment of the present invention, the first vision sensor 322 is locked in a first position on the mounting adjustment member 324 in a first posture, such that the field of view of the first vision sensor 322 covers the initial label on the tape facing the dispensing end; in a same-row layout, the second vision sensor 323 is locked in a second position on the mounting adjustment member 324 in a second posture, such that the center of the field of view of the second vision sensor 323, the center of the field of view of the first vision sensor 322, and the direction facing the dispensing end converge at the same point; in a staggered layout, the second vision sensor 323 is locked in a second position on the mounting adjustment member 324 in a second posture, such that the center of the field of view of the second vision sensor 323, the center of the field of view of the first vision sensor 322, and the direction facing the dispensing end converge at the same point; The three-position lock is set to the third position on the mounting adjustment component 324, such that the field center of the second vision sensor 323 has a preset distance from the field center of the first vision sensor 322 in the rotation direction along the first rotating hub 2, so that when the dispensing end and the first vision sensor 322 both correspond to the initial label in the m-th column and n+k-th row, the field center of the second vision sensor 323 corresponds to the dispensing label in the m-th column and n-th row; where m, n, and k are all positive integers, and the row numbers of the initial label and the dispensing label gradually decrease in the running direction of the conveyor belt.

[0051] In this embodiment, by locking the first vision sensor 322 in a first posture at a first position, its field of view can reliably cover the initial label facing the dispensing end, ensuring accurate positional information is obtained before each dispensing. In a same-row layout, the second vision sensor 323 is locked in a second posture at a second position, so that its field of view center converges with the field of view center of the first vision sensor 322 and the direction facing the dispensing end at the same point. This means that after dispensing, the tape does not need to move, and the second vision sensor 323 can perform high-precision imaging detection on the newly formed adhesive dots, realizing a three-in-one real-time closed loop of positioning, dispensing, and detection in the same row, which facilitates timely detection and feedback of dispensing defects. In a staggered layout, the second vision sensor 323 is locked in a third posture at a third position, so that its field of view center forms a preset row number difference k with the field of view center of the first vision sensor 322 in the tape running direction. When the dispensing end and the first vision sensor 322 correspond to the initial label in the m-th column and n+k-th row, the second vision sensor 323 corresponds exactly to the dispensing label in the m-th column and n-th row that has been stationary and stabilized. This design allows the second vision sensor 323 to simultaneously detect adhesive dots on labels that have already moved k rows forward, while the dispensing unit 321 is dispensing adhesive to the current label. This achieves complete parallel processing and detection, effectively improving production efficiency. Furthermore, the detected adhesive dots have undergone a conveying time of k row spacings, allowing the adhesive to fully level, solvent to evaporate, and the shape to stabilize, resulting in significantly higher accuracy and reliability of the detection results compared to immediate detection. Simultaneously, the preset distance k can be flexibly set according to actual process requirements by changing the locking posture of the second sensor, for example, setting k=1, 2, or 3, to adapt to the settling time required for different adhesives. Overall, this embodiment precisely defines the spatial geometric relationship of the three functional units and the different locking positions of the second vision sensor 323 in both same-row and staggered-row modes, clearly describing the alignment logic in the two working modes with a clear mathematical relationship. This allows the equipment to reliably switch between the two modes according to process requirements, achieving the dual advantages of parallel processing and detection and sufficient adhesive settling stability in staggered-row mode, significantly improving the process quality and production efficiency of multi-row dispensing.

[0052] It should be noted that attitude refers to the angular orientation of the vision sensor on the mounting adjustment component 324. The field of view center refers to the geometric center point of the image field of view of the vision sensor. In the m-th column and n-th row, m represents the column number and n represents the row number. The row number gradually decreases in the direction of the conveyor belt movement. This is because, during the dispensing process of the initial labels on the conveyor belt, the initial labels at the front end are processed first, and the initial labels at the back end are processed later. Therefore, the initial row number is the row number processed first, and the row number gradually increases in the opposite direction of the conveyor belt movement. k is a positive integer representing the difference in the number of misplaced rows.

[0053] In one example, under a staggered layout, assuming the process requires the adhesive to stabilize within 3 row spacings, the operator adjusts the second vision sensor 323 to a third position using the adjustment component 324, ensuring its field of view center is 3 row spacings away from the dispensing end in the conveyor belt running direction (k=3). During equipment operation, when the first motion module 31 moves the dispensing function module 32 above the initial label in the 5th row of the 2nd column, the first vision sensor 322 positions the label, and the dispensing execution unit 321 performs dispensing. Simultaneously, the field of view center of the second vision sensor 323 covers the dispensing label in the 2nd row of the 2nd column (this label has already been dispensed 3 row spacings ago, and the adhesive has fully stabilized). The control module 5 synchronously triggers the second vision sensor 323 to detect the stabilized adhesive dot and associates the detection data with the label in the 5th row of the 2nd column. This parallel process repeats as the first motion module 31 moves to the next column.

[0054] As an optional implementation, the specific parameters of the first, second, and third postures can be obtained through calibration. Before the equipment leaves the factory, the relative positions of the dispensing end, the first vision sensor 322, and the second vision sensor 323 are calibrated using a standard calibration board, and the locking position parameters for different modes are stored in the control system. After the user selects the same-row mode or staggered-row mode through the human-machine interface and inputs the required number of staggered rows k, the control system can automatically prompt the operator to adjust to the appropriate angle scale position, or complete the posture adjustment through an automatic adjustment device driven by a servo motor.

[0055] Please see Figures 1 to 3 In an embodiment of the present invention, the mounting adjustment member 324 is provided with an arc-shaped adjustment hole 3241, the plane of the arc extension direction of the adjustment hole 3241 is perpendicular to the first direction, and the mounting adjustment member 324 is provided with an angle scale around the adjustment hole 3241; the first visual sensor 322 and the second visual sensor 323 are each mounted on the mounting adjustment member 324 through the adjustment hole 3241; the first visual sensor 322 is configured to be movable along the extension direction of the adjustment hole 3241 and to be rotatable about the mounting axis of the first visual sensor 322, and its position and angle can be locked; the second visual sensor 323 is configured to be movable along the extension direction of the adjustment hole 3241 and to be rotatable about the mounting axis of the second visual sensor 323, and its position and angle can be locked.

[0056] In this embodiment, by providing an arc-shaped adjustment hole 3241 on the mounting adjustment component 324, and with the plane of the arc extension direction of the adjustment hole 3241 perpendicular to the first direction, and by setting an angle scale around the adjustment hole 3241, precise guidance and quantitative reference are provided for the position and angle adjustment of the first vision sensor 322 and the second vision sensor 323. The arc-shaped adjustment hole 3241 allows the vision sensor to move along an arc trajectory during adjustment, thereby changing its angle in the plane perpendicular to the first direction, and thus changing the projection position of its field of view center in the material belt running direction. The setting of the angle scale allows the operator to intuitively read the current adjusted angle value and quickly adjust the vision sensor to the target position according to the pre-calibrated correspondence between the angle and the number of misaligned rows, without repeated trial and error. The first vision sensor 322 and the second vision sensor 323 are each configured to move along the extension direction of the adjustment hole 3241 and rotate around the mounting axis, and their positions and angles can be locked. This means that each vision sensor has two independent degrees of freedom for adjustment; it can change its spatial angle by moving along the adjustment hole 3241, and it can adjust its imaging direction by rotating around its own mounting axis, thus flexibly adapting to different installation postures and process requirements. The locking function ensures the stability of the sensor position after adjustment, preventing displacement due to vibration during high-speed movement of the equipment, and ensuring repeatability and positioning accuracy during long-term operation.

[0057] Overall, this embodiment provides a visual sensor installation and adjustment structure that is simple in structure, convenient in operation, and highly accurate in adjustment, through the use of the arc adjustment hole 3241 in conjunction with the angle scale and the independent locking mechanism. This allows operators to quickly switch between same-row and staggered layouts without the need for professional tools, and to accurately set the difference in the number of staggered rows. This reduces the difficulty and time cost of equipment debugging, and improves the efficiency and reliability of process switching.

[0058] It should be noted that the arc-shaped adjustment hole 3241 refers to an elongated arc-shaped hole opened on the mounting adjustment component 324, with the center of its arc located on the rotation axis of the first rotating hub 2. The angle scale is an angle value mark engraved or printed along the edge of the arc, used to indicate the current angular position of the sensor. Locking can be achieved using conventional mechanical locking mechanisms such as lock nuts, lock knobs, set screws, or eccentric handles.

[0059] In one example, when an operator needs to switch the equipment from a parallel mode to a staggered mode and set the number of rows offset between the dispensing end and the second vision sensor 323 to two, they can first consult the correspondence table between angles and the number of staggered rows stored in the equipment manual or the die bonding equipment system. For example, every 5-degree increase in angle corresponds to a lag of one row. Then, loosen the locking mechanism of the first vision sensor 322 and the second vision sensor 323. Since the two sensors are already in the reference position in the parallel mode, the operator only needs to rotate the second vision sensor 323 10 degrees backward along the arc adjustment hole 3241, observe the angle scale to confirm it is in place, and then relock it to complete the adjustment. The first vision sensor 322 remains in its original position. The entire adjustment process takes no more than one minute and requires no disassembly or assembly of any parts.

[0060] As an optional implementation, the mounting adjustment component 324 can be an integral open-ring fixed ring support with an arc-shaped adjustment hole 3241 on its circumference. The adjustment hole 3241 is used to mount the first vision sensor 322 and the second vision sensor 323.

[0061] Please see Figure 1 and Figure 3 In an embodiment of the present invention, the die bonding device further includes a control module 5 and a motion correction platform 6. The two ends of the first rotating hub 2 are mounted on the motion correction platform 6, which drives the first rotating hub 2 to rotate. The control module 5 is electrically connected to the first motion module 31, the dispensing function module 32, and the motion correction platform 6. The control module 5 controls the first motion module 31 to move along the first direction to the corresponding position of the target column and receives the positioning image from the first vision sensor 322 to control the first motion module 31 to perform compensating movement so that the dispensing execution unit 321 aligns with the initial label on the target column and performs dispensing operation. The control module 5 is also used to control the first motion module 31 and the dispensing execution unit 321 to perform dispensing operation on the initial labels on different columns of the same row in sequence along the first direction. After all the initial labels on the same row are dispensed, the control module 31 is reset and the motion correction platform 6 is synchronously controlled to drive the first rotating hub 2 to rotate so that the first motion module 31 and the dispensing execution unit 321 can perform dispensing operation on the initial labels on different columns of the next row in sequence.

[0062] In this embodiment, by setting up a control module 5 and a motion correction platform 6, and mounting both ends of the first rotating hub 2 onto the motion correction platform 6, centralized control and coordinated scheduling of the material conveying and dispensing processing are achieved. The control module 5 is used to control the first motion module 31 to move along the first direction to the corresponding position of the target column, and to receive the positioning image from the first vision sensor 322 to control the first motion module 31 to perform compensatory movement, so that the dispensing execution unit 321 can accurately align with the initial label on the target column. This feedback control mechanism effectively compensates for the positioning error of the first motion module 31 itself and the position deviation of the material label, ensuring the accuracy of the dispensing position. The control module 5 is also used to control the first motion module 31 and the dispensing execution unit 321 to perform dispensing operations on the initial labels on different columns of the same row sequentially along the first direction, that is, to process all columns in the same row one by one in a serial traversal manner, without the need to configure an independent dispensing mechanism 3 for each column, which greatly reduces the hardware cost. After all initial labels on the same row have been glued, the control module 5 controls the first motion module 31 to reset and simultaneously controls the motion correction platform 6 to drive the first rotating hub 2 to rotate. This controls the first motion module 31 and the glue dispensing execution unit 321 to sequentially dispense labels on different columns of the next row. Here, the reset of the first motion module 31 and the stepping rotation of the first rotating hub 2 are synchronized. That is, as the first motion module 31, carrying the glue dispensing function module 32, returns at high speed from the last column to the starting column, the first rotating hub 2 simultaneously drives the conveyor belt forward one row distance, allowing the next row of labels to enter the processing area. The two actions are executed synchronously in time, effectively utilizing the originally idle return stroke time, reducing equipment waiting time, and improving overall production efficiency. Overall, this embodiment achieves a production line operation mode of serial traversal processing of each column of the dispensing function module 32 and step-by-step conveying of the material strip by the coordinated control of the first motion module 31 and the motion correction platform 6 by the control module 5. Without increasing hardware costs, it achieves efficient continuous processing of multi-row and multi-column labels by optimizing motion timing, and ensures the dispensing accuracy of each column by compensating for movement through visual feedback.

[0063] It should be noted that the control module 5 can be a programmable logic controller, an industrial computer, or a motion controller, used to execute preset control algorithms and logical judgments. The motion correction platform 6 is a power device used to drive the first rotating hub 2 to rotate, typically including a servo motor and a reducer, and may also have micro-adjustment functions along the first direction or other directions. Reset refers to the first motion module 31 moving from its current position back to the initial reference position.

[0064] In one example, the control module 5 internally stores the number of rows and columns of the conveyor belt, as well as the theoretical coordinates of each column. After the equipment starts, the control module 5 first drives the first motion module 31 to move above the first column of the first row. The first vision sensor 322 captures an image of the label in the first column. After calculating the deviation, the control module 5 drives the first motion module 31 to compensate, and then triggers the dispensing execution unit 321 to complete the dispensing. Subsequently, the control module 5 drives the first motion module 31 to move to the second column of the first row, the third column, and so on, until the last column of the first row, repeating the above process in sequence. When the dispensing of all columns in the first row is completed, the control module 5 immediately issues two commands: one is to control the first motion module 31 to return to the position of the first column at high speed, and the other is to synchronously control the motion correction platform 6 to drive the first rotating hub 2 to rotate one row distance, so that the second row of labels enters the processing area. Since the return stroke of the first motion module 31 takes a certain amount of time, the rotation of the first rotating hub 2 can be completed simultaneously during this period. When the first motion module 31 returns to the starting point, the second row of labels is already in place, and the next round of dispensing can begin immediately.

[0065] As an optional implementation, the control module 5 can also record the dispensing detection data for each column and dynamically adjust the compensation amount and glue quantity parameters for subsequent dispensing accordingly to achieve adaptive control.

[0066] Please see Figures 1 to 3 In an embodiment of the present invention, the control module 5 is further configured to, in the same row layout mode, after the dispensing execution unit 321 has dispensed glue to each initial label, receive the detection image of the dispensing label from the second vision sensor 323 and determine the dispensing quality; the control module 5 is further configured to, in the staggered layout mode, during the process of the dispensing execution unit 321 dispensing glue to the initial label in the m-th column and n-th row, simultaneously receive the detection image of the dispensing label in the m-th column and n-th row from the second vision sensor 323 and determine the dispensing quality; wherein m, n, and k are all positive integers, and in the running direction of the conveyor belt, the row number of the initial label and the dispensing label gradually decreases.

[0067] In this embodiment, the control module 5 employs different signal processing logics for the same-row layout mode and the staggered layout mode, achieving precise triggering and real-time quality judgment of the images detected by the second vision sensor 323 in both modes. In the same-row layout mode, after the dispensing execution unit 321 completes dispensing for each initial label, the control module 5 immediately receives the detection image of the dispensed label from the second vision sensor 323 and judges the dispensing quality. This timing arrangement ensures that the detection action closely follows the dispensing action, enabling a compact cycle of positioning, dispensing, and detection within the same column and row. This facilitates rapid detection of dispensing defects and timely processing of the current batch, preventing defective products from flowing into downstream processes. In the staggered layout mode, during the dispensing process of the dispensing execution unit 321 on the initial label in the m-th column and n+k-th row, the control module 5 simultaneously receives the detection image of the dispensed label in the m-th column and n-th row from the second vision sensor 323. Because the field of view of the second vision sensor 323 lags behind row k in the direction of the conveyor belt, when the dispensing execution unit 321 is dispensing the current row, the second vision sensor 323 can detect the glue dots that have moved forward k rows. The control module 5 realizes this parallel processing of current dispensing and forward row detection, eliminating the need to allocate time separately for detection, thereby significantly improving the processing throughput per unit time. At the same time, the detected glue dots have already experienced the conveying time of row k, the glue form is stable, the accuracy of the detection results is higher, and the quality judgment made by the control module 5 based on this is more reliable. Overall, this embodiment fully utilizes the potential of the dual layout mode achieved by the installation adjustment component 324 by automatically switching the detection trigger timing and data processing flow according to two different layout modes through the control module 5. In the same row mode, it ensures the timeliness of single-row processing closed loop, and in the staggered layout mode, it achieves the dual technical effects of parallel processing and detection and sufficient glue settling and stabilization, further improving the equipment's adaptability to diverse process requirements and overall operating efficiency.

[0068] It should be noted that in the staggered layout mode, k is usually a positive integer such as 1, 2, or 3. Judging the dispensing quality refers to analyzing the diameter, roundness, area, center offset, and other characteristics of the dispensing dots using image processing algorithms, comparing them with preset thresholds or templates, and outputting a pass / fail result.

[0069] In one example, when the device operates in a same-row layout mode, the control module 5 executes the following loop: receiving an image from the first vision sensor 322 - calculating compensation - sending a dispensing command - waiting for dispensing to complete - triggering the second vision sensor 323 - receiving a detection image - quality judgment - recording the result - moving to the next column. When the device operates in a staggered layout mode, the control module 5 executes the following parallel task: simultaneously issuing a dispensing command for the m-th column and the (n+k)-th row, triggering the second vision sensor 323 to capture an image of the m-th column and the n-th row and receive the image for quality judgment. The control module 5 internally employs a multi-threaded or task scheduling mechanism to ensure that the dispensing and detection actions do not interfere with each other and are completely overlapping in time.

[0070] As an optional implementation, the control module 5 can also dynamically adjust the position compensation amount during subsequent dispensing based on the glue dot offset data detected by the second vision sensor 323, forming an adaptive closed-loop control. For example, if multiple glue dots are continuously detected to be offset in the same direction, the control module 5 can determine that it is a systematic positioning error and add a correction bias in the subsequent compensation calculation until the detection result returns to the normal range.

[0071] Please see Figures 1 to 3 In an embodiment of the present invention, the die bonding equipment further includes a wiping structure (not shown in the figure), which is disposed on the frame 1 and located beside the initial position of the dispensing execution unit 321; the control module 5 is used to control the first motion module 31 to move after the dispensing execution unit 321 completes a preset number of dispensing operations, so that the dispensing end of the dispensing execution unit 321 rubs against the wiping structure; and / or, the control module 5 is used to control the motion correction platform 6 to drive the first rotating hub 2 and the material belt to move in a first direction or the opposite direction of the first direction for compensation based on the positioning image of the first vision sensor 322, so that the dispensing execution unit 321 aligns with the initial label on the target column and performs the dispensing operation; and / or, the outer periphery of the first rotating hub 2 is provided with at least two air inlets (not shown in the figure), and the two ends of the first rotating hub 2 are also used to dock with a vacuum adsorption device.

[0072] In this embodiment, by adding a wiping structure, optimizing the compensation movement method, and setting an air intake and vacuum adsorption interface on the rotating hub, the overall performance of the die bonding equipment is further improved from three dimensions: ensuring dispensing quality, improving positioning accuracy, and stabilizing tape delivery. The wiping structure is mounted on the frame 1 and located beside the initial position of the dispensing execution unit 321. The control module 5 controls the first motion module 31 to move after the dispensing execution unit 321 completes a preset number of dispensing operations, so that the dispensing end of the dispensing execution unit 321 rubs against the wiping structure. This design can periodically remove residual glue or contaminants adhering to the end of the dispensing nozzle, preventing defects such as unstable dispensing volume, stringing, or dripping caused by glue drying or foreign object blockage. This extends the continuous working time of the dispensing execution unit 321, reduces the frequency of manual downtime for cleaning, and improves the automation level and dispensing consistency of the equipment.

[0073] Furthermore, based on the positioning image from the first vision sensor 322, the control module 5 can control the motion correction platform 6 to drive the first rotating hub 2 and the material strip to make slight compensation movements along the first direction or the opposite direction, so that the dispensing execution unit 321 is aligned with the initial label on the target column. Normally, the control module 5 can control the first motion module 31 to perform micro-motion compensation based on the positioning image from the first vision sensor 322 for precise alignment; however, when the control module 5 detects an overall offset of the material strip in the first direction or the opposite direction (such as the offset in the same direction as the dispensing situation in the quality inspection results of multiple dispensing labels), the motion correction platform 6 can drive the first rotating hub 2 and the material strip to make overall micro-movement compensation along the first direction, as an auxiliary or supplement to the compensation movement of the first motion module 31, thereby providing redundant compensation paths for the die bonding equipment and enhancing the robustness of the system. Furthermore, the motion correction platform 6 is used only in a few cases to drive the first rotating hub 2 and the material belt for overall micro-movement compensation. By controlling the motion correction platform 6 to move slowly to supplement, sudden starts and stops are avoided, which can also effectively reduce the vibration and inertial impact generated by the movement of the motion correction platform 6 and prevent the material belt from deviating.

[0074] In addition, the outer periphery of the first rotating hub 2 is provided with at least two air inlets, and both ends are used to connect to the vacuum adsorption device. This allows the first rotating hub 2 to tightly adsorb the material belt onto its outer periphery through the negative pressure generated by the air inlets when rotating the conveyor belt. This effectively prevents the material belt from sliding, arching or shifting during high-speed movement or positioning, ensuring the flatness and positional stability of the material belt in the dispensing area, thus providing a reliable bearing foundation for high-precision dispensing.

[0075] Overall, this embodiment has made targeted optimizations in dispensing nozzle cleaning, material belt alignment compensation, and material belt conveying and adsorption through the combination of the above-mentioned multiple optional functions, further improving the processing stability and reliability of the equipment under long-term continuous operation conditions.

[0076] It should be noted that the wiping structure refers to the device used to contact the dispensing nozzle and remove residual adhesive from its surface, and may include a flexible wiping cloth, sponge, brush, or rubber scraper. The preset number of times can be set through the human-machine interface of the control module 5 according to factors such as adhesive characteristics and dispensing frequency, for example, cleaning can be performed once every 50 or 100 dispensing times. The suction port refers to a through hole or slit opened on the outer peripheral surface of the first rotating hub 2, which communicates with the negative pressure chamber.

[0077] In one example, the operator sets the system to automatically clean after every 200 dispensing cycles on the control interface. When the counter in control module 5 reaches 200, control module 5 pauses the dispensing operation and drives the first motion module 31 to move the dispensing function module 32 to the wiping structure next to its initial position. The dispensing end descends and contacts the wiping structure, while the wiping structure is simultaneously controlled to move or rotate, for example, to achieve relative friction cleaning. After cleaning is complete, the counter resets to zero, and the dispensing function module 32 returns to its original position to continue operating.

[0078] In one example, when the first vision sensor 322 captures a target label with a positional deviation that exceeds the compensation range of the first motion module 31, the control module 5 can switch to controlling the motion correction platform 6 to move the first rotating hub 2 and the conveyor belt as a whole to eliminate the deviation before dispensing.

[0079] In one example, the vacuum adsorption devices connected to both ends of the first rotating hub 2 operate continuously, ensuring that the air intake on the outer periphery of the rotating hub always generates negative pressure. When the material strip adheres to the rotating hub, the negative pressure firmly adsorbs the material strip, preventing relative slippage even when the dispensing nozzle contacts the material strip or when rotating at high speed.

[0080] As an optional implementation, the wiping structure can integrate an automatic liquid spraying function, spraying a small amount of cleaning agent onto the dispensing nozzle before cleaning to improve the cleaning effect. The suction port can be a small circular hole or an oblong groove, evenly distributed in multiple rings along the outer circumference of the rotating hub to ensure uniform adsorption force. The vacuum adsorption device can include a vacuum pump, a vacuum tank, and a pressure regulating valve, allowing the operator to adjust the adsorption negative pressure value according to the material and thickness of the conveyor belt.

[0081] Please see Figure 3 and Figure 4In an embodiment of the present invention, the die bonding equipment further includes a second rotating hub 7 and a bonding mechanism 8; the second rotating hub 7 is rotatably connected to the frame 1 and is used to carry and transport the material strip from the first rotating hub 2; the bonding mechanism 8 is located on the frame 1 and is located downstream of the dispensing mechanism 3 along the running direction of the material strip; the bonding mechanism 8 is used to perform chip mounting operations on the dispensing label.

[0082] In this embodiment, by setting a second rotating hub 7 and a bonding mechanism 8 downstream of the dispensing mechanism 3, the dispensing process and the chip mounting process are connected in series within the same equipment, realizing continuous automated production from dispensing to bonding. The second rotating hub 7 is rotatably connected to the frame 1 and is used to carry and transport the tape from the first rotating hub 2, ensuring that the tape after the dispensing process can smoothly transition to the bonding process, avoiding offset, wrinkles, or contamination during the transfer of the tape between processes. The bonding mechanism 8 is located downstream of the dispensing mechanism 3 along the tape running direction and is used to perform chip mounting operations on the dispensing labels that have been dispensed. This allows the adhesive dots to be covered with the chip in a timely manner within the optimal process window, avoiding the problem of reduced adhesion due to adhesive surface curing or contamination. Simultaneously, since the second vision sensor 323 in the dispensing mechanism 3 has acquired the actual position information of the adhesive dots for each dispensing label, this information can be transmitted to the bonding mechanism 8 through the control module 5 as a position compensation reference for the bonding mechanism 8 during chip mounting, achieving precise mounting based on the actual adhesive condition, significantly improving mounting accuracy and yield.

[0083] Overall, this embodiment integrates the dispensing mechanism 3 and the bonding mechanism 8 into the same equipment, and uses the second rotating hub 7 to realize cross-process conveying of the material strip, thus constructing a compact, efficient, and high-precision multi-row chip bonding production line. It completes the continuous operation of the two core processes of dispensing and bonding within a limited equipment space, reduces work-in-process handling and secondary positioning errors, and improves overall production efficiency and product quality.

[0084] It should be noted that the structure of the second rotating hub 7 can be the same as or similar to that of the first rotating hub 2, both used for carrying and conveying the tape. The bonding mechanism 8 is a mechanical assembly that performs chip mounting operations, typically including a nozzle 8321 for picking up chips, a motion module for movement and positioning, and a camera for visual positioning, etc.

[0085] In one example, the tape first passes through the first rotating hub 2 and the dispensing mechanism 3 to complete multi-column dispensing and quality inspection. The inspection data is recorded and stored in association with the coordinates of each label. Subsequently, the tape is fed out by the first rotating hub 2 and enters the second rotating hub 7. The second rotating hub 7 conveys the tape to the working area of ​​the bonding mechanism 8 in a stepping manner. The bonding mechanism 8 obtains the actual position information of the adhesive dots of the current label from the control module 5, and drives its motion module to accurately attach the chip to the adhesive dots, completing the bonding.

[0086] As an optional implementation, a buffer section or tension control mechanism can be provided between the first rotating hub 2 and the second rotating hub 7 to ensure uniform tension of the material strip between the two rotating hubs and avoid slack or stretching of the material strip due to speed mismatch. The first rotating hub 2 and the second rotating hub 7 can be driven by the same drive source through a transmission mechanism, or they can be driven by independent servo motors and synchronized through the control module 5.

[0087] Please see Figure 3 and Figure 4 In an embodiment of the present invention, the binding mechanism 8 includes a second motion module 81, a third motion module 82, a multi-arm binding module 83, a third vision sensor 84, and a fourth vision sensor 85; the second motion module 81 and the third motion module 82 are movably mounted on the frame 1; the third vision sensor 84 and the fourth vision sensor 85 are mounted on the second motion module 81, and the multi-arm binding module 83 is mounted on the third motion module 82; the second motion module 81 and the third motion module 82 are used for reciprocating movement along a second direction; The second direction is parallel to the first direction; the multi-arm bonding module 83 has a base 831 and multiple bonding arms 832 that can rotate around the base 831. Each bonding arm 832 has a suction nozzle 8321 at its end for adsorbing and placing chips. The suction nozzle 8321 is used to adsorb chips; the third vision sensor 84 is used to locate and identify the dispensing label on the material strip; the multi-arm bonding module 83 is used to attach the chip on the bonding arm 832 to the dispensing label; the fourth vision sensor 85 is used to perform quality inspection on the attached label after chip mounting.

[0088] In this embodiment, by designing the bonding mechanism 8 as a dual-layer independent moving structure comprising a second motion module 81, a third motion module 82, a multi-arm bonding module 83, a third vision sensor 84, and a fourth vision sensor 85, decoupling and coordination between visual positioning and placement execution are achieved. Both the second motion module 81 and the third motion module 82 are movably mounted on the frame 1 and used for reciprocating movement along a second direction parallel to the first direction. The third vision sensor 84 and the fourth vision sensor 85 are mounted on the second motion module 81, while the multi-arm bonding module 83 is mounted on the third motion module 82. This means that the vision component and the placement execution component are driven by two independent motion modules, allowing them to move independently or coordinate in action. This layered layout mechanically isolates the high-load multi-arm bonding module 83 from the vibration-sensitive vision sensor, ensuring that the motion inertia of the placement platform does not directly affect the stability of the vision platform, thus guaranteeing the accuracy of visual positioning.

[0089] Furthermore, the multi-arm bonding module 83 has a substrate 831 and multiple bonding arms 832 that can rotate around the substrate 831. Each bonding arm 832 has a suction nozzle 8321 at its end for adsorbing and placing chips. By adopting a multi-arm rotating structure, the bonding module can load multiple chips at the die bonding station at one time, and then sequentially attach each chip to different columns of dispensing labels through rotational indexing. With the lateral movement of the second motion module 81 and the third motion module 82, batch processing and sequential placement operation modes are realized, which greatly improves the efficiency of multi-column bonding. In addition, the third vision sensor 84 is used to locate and identify the dispensing labels on the tape. The position information it acquires can be used as the basis for position compensation when the multi-arm bonding module 83 is placing chips, ensuring that the chips are accurately placed in the center of the adhesive dots. The fourth vision sensor 85 is used to perform quality inspection on the placement labels after chip placement, realizing timely inspection after the bonding process and enabling timely detection of defects such as chip misalignment, warping, or missing chips.

[0090] Overall, this embodiment constructs a high-precision and high-efficiency multi-row chip mounting system through a dual-layer independent motion module combined with a multi-arm rotation bonding module and a dual vision sensor architecture. It has achieved significant improvements in visual positioning stability, batch mounting efficiency, and post-mounting quality inspection integrity. Together with the aforementioned dispensing mechanism 3, it forms a complete multi-row chip die bonding solution.

[0091] It should be noted that the second motion module 81 and the third motion module 82 are two independent linear motion mechanisms, which can employ linear motors or servo screw modules. The second direction is parallel to the first direction, i.e., it is also the CD direction. The multi-arm bonding module 83 typically uses a disc-shaped substrate 831, with multiple bonding arms 832 evenly distributed circumferentially. Each bonding arm 832 can independently perform Z-axis lifting and θ-axis rotation. The mounting label refers to the label on which the chip mounting operation has been completed.

[0092] In one example, the bonding mechanism 8 operates as follows: The multi-arm bonding module 83 rotates, causing its multiple bonding arms 832 to sequentially pass through the die-attaching station, with each bonding arm 832 adsorbing one chip, completing batch loading. The second motion module 81 and the third motion module 82 move as a whole in a locking linkage manner, moving along the second direction to above the target column. The third vision sensor 84 photographs the dispensing label of the current column to obtain the actual position of the adhesive dots, and the control module 5 calculates the mounting deviation. Subsequently, the third motion module 82 drives the multi-arm bonding module 83 to perform micro-motion compensation in the X and Y directions, while the nozzle 8321 of the bonding arm 832 to be bonded performs θ-axis rotation to compensate for the angle deviation, and then descends along the Z-axis to press the chip onto the adhesive dot, completing the bonding. The fourth vision sensor 85 then photographs and inspects the bonded chip. After completing the current column, the dual-layer platform moves to the next column, while the multi-arm bonding module 83 rotates by one division angle, causing the next bonding arm 832 to enter the working position, and the above steps are repeated. Once all the chips on the multiple bonding arms 832 have been mounted, the dual-layer platform quickly returns to the die bonding area to load the next batch of chips.

[0093] As an optional implementation, the number of arms in the multi-arm bonding module 83 can be configured according to production capacity requirements and the number of columns of dispensing chips on the material strip. For example, when the number of columns of dispensing chips on the material strip is 6, 6 bonding arms 832 can be used. In this way, the multi-arm bonding module 83 can complete the bonding of all 6 columns of chips in the same row by adsorbing 6 chips in a single batch. The third vision sensor 84 and the fourth vision sensor 85 can also be arranged in the same row or staggered row by using the mounting adjustment component 324 similar to that in the dispensing mechanism 3, to adapt to different detection timing requirements.

[0094] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A die bonding device, characterized in that, include: frame; A first rotating hub is rotatably connected to the frame and is used to carry and convey the material belt. The material strip is arrayed with multiple rows and columns of initial labels. Each column of the initial labels is arranged along the rotation direction of the first rotating hub, and each row of the initial labels is arranged along a first direction, which is parallel to the rotation axis of the first rotating hub. The dispensing mechanism includes a first motion module and a dispensing function module. The first motion module is movably mounted on the frame, and the dispensing function module is mounted on the first motion module. The first motion module is used to reciprocate along a first direction and drive the dispensing function module to move. The dispensing function module is used to perform dispensing operations on the initial label after detecting that it has moved to the corresponding position of the initial label on the material strip, and to perform quality inspection on the dispensed label. The dispensing function module includes a dispensing execution unit, a first vision sensor, and a second vision sensor. The dispensing execution unit is installed on the first motion module and is used to perform dispensing operations. The first vision sensor is used to locate and identify the initial label on the material strip; the second vision sensor is used to perform quality inspection on the adhesive dots on the dispensing label. The die bonding device also includes a second rotating hub and a bonding mechanism; The second rotating hub is rotatably connected to the frame, and the second rotating hub is used to carry and convey the material strip from the first rotating hub; The bonding mechanism is located on the frame and downstream of the dispensing mechanism along the running direction of the material strip; the bonding mechanism is used to perform chip mounting operations on the dispensing label; The binding mechanism includes a second motion module, a third motion module, a multi-arm binding module, a third vision sensor, and a fourth vision sensor; The second motion module and the third motion module are movably mounted on the frame; the third vision sensor and the fourth vision sensor are mounted on the second motion module, and the multi-arm binding module is mounted on the third motion module. The second motion module and the third motion module are used for reciprocating movement along a second direction; the second direction is parallel to the first direction. The multi-arm bonding module has a substrate and multiple bonding arms that can rotate around the substrate. Each bonding arm has a nozzle at its end for adsorbing and placing chips. The nozzle is used to adsorb chips. The third vision sensor is used to locate and identify the adhesive label on the tape. The multi-arm bonding module is used to attach the chip on the bonding arm to the adhesive label. The fourth vision sensor is used to perform quality inspection on the attached label after chip mounting.

2. The die bonding equipment according to claim 1, characterized in that, The dispensing function module further includes a mounting adjustment component, through which the first vision sensor and the second vision sensor are mounted on the first motion module; the mounting adjustment component is used to adjust the spatial pose of the first vision sensor and the second vision sensor relative to the dispensing execution unit, so that the dispensing end of the dispensing execution unit, the first vision sensor and the second vision sensor form a same-row layout or a staggered layout.

3. The die bonding equipment according to claim 2, characterized in that, The first vision sensor is locked in a first position on the mounting adjustment member in a first posture, such that the field of view of the first vision sensor covers the initial label on the tape that the dispensing end is facing; In the same row layout, the second vision sensor is locked in a second position on the mounting adjustment member in a second posture, so that the field center of the second vision sensor, the field center of the first vision sensor, and the direction in which the dispensing end is facing converge at the same point. In the staggered layout, the second vision sensor is locked in a third position on the mounting adjustment member in a third posture, such that the field center of the second vision sensor has a preset distance from the field center of the first vision sensor in the rotation direction along the first rotating hub, so that when both the dispensing end and the first vision sensor correspond to the initial label in the m-th column and n+k-th row, the field center of the second vision sensor corresponds to the dispensing label in the m-th column and n-th row; where m, n, and k are all positive integers, and the row numbers of the initial label and the dispensing label gradually decrease in the running direction of the conveyor belt.

4. The die bonding apparatus according to claim 2 or 3, characterized in that, The mounting adjustment component is provided with an arc-shaped adjustment hole, the plane in which the arc of the adjustment hole extends is perpendicular to the first direction, and the mounting adjustment component is provided with an angle scale around the adjustment hole; The first vision sensor and the second vision sensor are each mounted on the mounting adjustment member through the adjustment hole; the first vision sensor is configured to move along the extension direction of the adjustment hole and rotate about the mounting axis of the first vision sensor, and its position and angle can be locked; the second vision sensor is configured to move along the extension direction of the adjustment hole and rotate about the mounting axis of the second vision sensor, and its position and angle can be locked.

5. The die bonding apparatus according to claim 1, characterized in that, The die bonding equipment further includes a control module and a motion correction platform. The two ends of the first rotating hub are mounted on the motion correction platform, which is used to drive the first rotating hub to rotate. The control module is electrically connected to the first motion module, the dispensing function module, and the motion correction platform. The control module is used to control the first motion module to move along the first direction to the corresponding position of the target column and to receive the positioning image from the first vision sensor to control the first motion module to perform compensatory movement so that the dispensing execution unit aligns with the initial label on the target column and performs dispensing operation. The control module is also used to control the first motion module and the dispensing execution unit to perform dispensing operations on the initial labels in different columns of the same row in sequence along the first direction, and after all the initial labels in the same row have been dispensed, control the first motion module to reset, and synchronously control the motion correction platform to drive the first rotating hub to rotate, so as to control the first motion module and the dispensing execution unit to perform dispensing operations on the initial labels in different columns of the next row in sequence.

6. The die bonding apparatus according to claim 5, characterized in that, The control module is also used to receive a detection image of the dispensing label from the second vision sensor and determine the dispensing quality after the dispensing execution unit has dispensed glue to each of the initial labels in the same row layout mode. The control module is also used to simultaneously receive the detection image of the dispensing label in the m-th column and n-th row from the second vision sensor and determine the dispensing quality during the dispensing execution unit dispensing the initial label in the m-th column and n+k-th row in the staggered layout mode; wherein m, n, and k are all positive integers, and the row number of the initial label and the dispensing label gradually decreases in the running direction of the material strip.

7. The die bonding apparatus according to claim 5, characterized in that, The die bonding equipment further includes a wiping structure, which is disposed on the frame and located beside the initial position of the dispensing execution unit; the control module is used to control the first motion module to move after the dispensing execution unit completes a preset number of dispensing operations, so that the dispensing end of the dispensing execution unit rubs against the wiping structure. And / or, the control module is used to control the motion correction platform to drive the first rotating hub and the material belt to move compensatingly along the first direction or the opposite direction based on the positioning image of the first vision sensor, so that the dispensing execution unit aligns with the initial label on the target column and performs dispensing operation; And / or, at least two air inlets are provided on the outer periphery of the first rotating hub, and the two ends of the first rotating hub are also used to dock with a vacuum adsorption device.

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