Bga ball picking method and device

Abstract

The application is suitable for the field of semiconductor packaging technology. The application discloses a BGA ball mounting and picking method and device. The BGA ball mounting and picking device comprises a ball picking component and a tin ball cleaning mechanism. The ball picking component comprises a ball picking plate with a plurality of arrayed ball picking holes. One end of each ball picking hole is connected with a negative pressure component, and the other end penetrates through a ball picking surface. Each ball picking hole is used to adsorb and fix the tin ball bouncing due to vibration through the negative pressure component during ball picking. The tin ball cleaning mechanism comprises a gas nozzle component connected with pressure gas. The gas nozzle component moves relative to the ball picking component. The gas nozzle component outputs variable airflow to blow and clean the ball picking surface. The airflow blows and cleans the excess tin ball attached during ball picking. The variable airflow is used to blow and clean the excess tin ball attached during ball picking, so that the rigid contact cleaning of the ball picking surface by a scraper is avoided, and the tin ball is not damaged or the curved surface of the ball picking surface cannot be cleaned completely. The device can be widely used for the flat or warped surface of the ball picking surface.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging manufacturing technology, and in particular to a method and apparatus for BGA ball placement and removal. Background Technology

[0002] In semiconductor manufacturing, ball placement is a crucial step in the packaging process. As semiconductor integration increases and chip areas grow larger, the substrates used for packaging also increase. With larger substrate surface areas, warping inevitably occurs. As chip integration increases, the pads on the substrate become denser and smaller, requiring smaller solder ball diameters and higher precision in ball placement. Even minute amounts of warping in the substrate will affect the precision and quality of ball placement using BGA processes.

[0003] In BGA ball placement, due to adsorption and electrostatic effects, excess solder balls may adhere to the area around each pick hole on the pick board during ball removal. Using existing solder ball cleaning devices, such as scrapers or fishing lines, to remove excess solder balls from the pick surface can lead to problems. Since the chip substrate may be warped, and to ensure placement accuracy, the pick board is usually made to be the same shape as the chip substrate, using a scraper or fishing line to remove excess solder balls from non-planar pick surfaces can result in inconsistent solder amounts at each solder joint and defects such as solder bridging. Conversely, if the distance between the scraper or fishing line and the pick surface is too small, the necessary solder balls may be removed from the pick holes, resulting in missed solder balls or damage to the solder balls, leading to poor solder ball removal. Even when the pick surface of the pick board is planar, cleaning with a scraper or fishing line can damage solder balls or fail to effectively remove irregularly shaped solder balls. Summary of the Invention

[0004] The main technical problem solved by this invention is to provide a BGA ball-removing device and method, wherein the BGA ball-removing device can avoid damage to the solder balls when cleaning excess solder balls, thereby improving the solder ball cleaning efficiency and the subsequent ball-removing quality.

[0005] To address the aforementioned technical problems, the present invention provides a BGA ball-mounting and ball-retrieving device, which includes... The ball-collecting component includes a ball-collecting plate with several ball-collecting holes arranged in an array. One end of each ball-collecting hole is connected to a negative pressure component, and the other end passes through the ball-collecting surface. When collecting the ball, each ball-collecting hole uses the negative pressure component to adsorb and fix the bouncing solder ball caused by vibration. The solder ball cleaning mechanism includes a nozzle component connected to pressurized gas, which moves relative to a ball-receiving component. When the nozzle component outputs a varying airflow to blow away the ball-receiving surface, the airflow removes excess solder balls adhering to the surface during ball removal.

[0006] In one specific embodiment, the changing airflow includes airflow with changing direction, intermittent pulsed airflow, and airflow with different velocities.

[0007] In one specific embodiment, the solder ball cleaning mechanism further includes a nozzle swing assembly that swings the nozzle component to change the airflow direction when cleaning solder balls.

[0008] In one specific embodiment, the air nozzle swing assembly includes a rack that cooperates with the air nozzle component. The air nozzle component is rotatably connected to the air nozzle slider via a rotating shaft. When the air nozzle slider drives the air nozzle component to move parallel, the air nozzle component cooperates with the swing teeth on the rack, causing the air nozzle component to swing left and right via the rotating shaft. During the process of removing solder balls, the air nozzle component outputs an airflow that swings in a specific direction.

[0009] In one specific embodiment, the solder ball cleaning mechanism further includes a driving assembly for driving the air nozzle component and the ball-retrieving component to move relatively parallel to each other. The driving assembly includes a driving component and a transmission component connected to the driving component, as well as a guide component that causes the air nozzle component to move parallel to each other through the transmission component. Alternatively, the driving assembly includes a driving component and a transmission component connected to the driving component, as well as a guide component that causes the ball-retrieving component to move parallel to each other above the air nozzle component through the transmission component.

[0010] In one specific embodiment, the spherical surface includes a plane or a curved surface.

[0011] In one specific embodiment, the nozzle component includes a nozzle body with an air inlet and an air passage located at one end of the nozzle body and communicating with the air inlet, and the other end of the air passage communicating with a nozzle disposed on the surface of the nozzle body.

[0012] In one specific embodiment, the air nozzle is a strip-shaped air nozzle.

[0013] In one specific embodiment, when the number of the strip-shaped air nozzles is one, the angle between the airflow direction of the strip-shaped air nozzle and the horizontal plane is 20-75 degrees.

[0014] In one specific embodiment, the airflow direction of the strip nozzle forms an angle of 30-45 degrees with the horizontal plane.

[0015] In one specific embodiment, there are two strip-shaped air nozzles, the airflow directions of the two strip-shaped air nozzles are far apart, and they form a first angle and a second angle with the horizontal plane, respectively. The first angle and the second angle may be the same or different.

[0016] In one specific embodiment, there are two strip-shaped air nozzles, the airflow directions of the two strip-shaped air nozzles are opposite, and the distance between the two airflows acting on the spherical surface is not less than the diameter of the solder ball.

[0017] In one specific embodiment, the air nozzle slider is connected to both a guide component and a transmission component, and the drive component causes the air nozzle slider to move parallel to the guide component via the transmission component.

[0018] In one specific embodiment, the ball-retrieving device further includes a ball tray for storing solder balls and a solder ball vibration assembly for causing the solder balls in the ball tray to vibrate and bounce. The solder ball vibration assembly includes a vibration component that causes the solder balls to bounce through the ball tray and a vibration seat that fixes the vibration component. An elastic component that converts rigid vibration into flexible vibration is provided between the vibration seat and the ball tray.

[0019] In one specific embodiment, the pulse frequency of the pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the air nozzle and the ball-collecting plate when cleaning solder balls, and R represents the diameter of the solder ball.

[0020] To improve the efficiency of cleaning solder balls on non-planar surfaces and reducing damage to solder balls during the solder ball removal process, this invention also provides a BGA solder ball removal method, which includes: The ball retrieval step includes a ball retrieval plate with several ball retrieval holes arranged in an array. One end of each ball retrieval hole is connected to a negative pressure component, and the other end passes through the ball retrieval surface. During ball retrieval, each ball retrieval hole uses the negative pressure component to adsorb and fix the bouncing solder ball caused by vibration. The ball picking detection step involves acquiring an image of the ball picking surface after the ball picking component picks up the ball, and comparing this image with a preset ball picking image. When the number of solder balls in the array of ball picking holes reaches a preset value, the solder ball picking is completed. The solder ball cleaning process involves using a nozzle component to output varying airflow to clean the solder ball picking surface of the ball picking component, removing excess solder balls.

[0021] In one specific embodiment, the changing airflow includes airflow with changing direction, intermittent pulsed airflow, and airflow with different velocities.

[0022] In one specific embodiment, the solder ball cleaning step further includes blowing air in a specific direction during the solder ball cleaning process.

[0023] In one specific embodiment, the solder ball cleaning step further includes using two airflows in opposite directions to blow away the surface of the ball, wherein one airflow forms a first angle with the horizontal plane and the other airflow forms a second angle with the horizontal plane, and the first angle and the second angle may be the same or different.

[0024] In one specific embodiment, the solder ball cleaning step further includes sequentially using two opposing airflows to sweep the surface of the solder ball, with the distance between the two airflows acting on the surface of the solder ball being greater than the diameter of the solder ball.

[0025] In one specific embodiment, a solder ball cleaning detection step is further included after the solder ball cleaning step. The solder ball cleaning detection step includes acquiring an image of the ball-collecting surface after cleaning the solder balls with an airflow of a first speed and comparing it with a preset standard to determine whether the solder balls need to be cleaned again. If the comparison is inconsistent, the ball-collecting surface is swept with an airflow of a second speed to remove excess solder balls. The second speed is greater than the first speed.

[0026] In one specific embodiment, the pulse frequency of the pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the air nozzle and the ball-collecting plate when cleaning solder balls, and R represents the diameter of the solder ball.

[0027] This invention discloses a method and apparatus for removing solder balls during BGA ball placement. The BGA ball removal apparatus includes a ball-removing component for arraying solder balls and a solder ball cleaning mechanism for removing excess solder balls from the ball-removing component. The ball-removing component includes a ball-removing plate with an array of ball-removing holes. One end of each ball-removing hole is connected to a negative pressure component, and the other end penetrates the ball-removing surface. During ball removal, each ball-removing hole uses the negative pressure component to adsorb and fix the solder balls that bounce due to vibration. The solder ball cleaning mechanism includes a nozzle component connected to pressurized gas. This nozzle component moves relative to the ball-removing component, and the nozzle component outputs a variable airflow to sweep the ball-removing surface. This airflow removes excess solder balls adhering during ball removal. Because a variable airflow is used to remove excess solder balls adhering during ball removal, the method avoids the damage to solder balls or incomplete cleaning when using rigid contact cleaning methods such as scrapers on the ball-removing surface, which can lead to incomplete cleaning, thus improving solder ball cleaning efficiency. It is widely applicable to ball-removing surfaces that are flat or warped. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the description only show some embodiments of the present invention, and therefore should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the first embodiment of the BGA ball-planting and ball-retrieving device.

[0030] Figure 2 This is a schematic diagram of the solder ball removal structure in the second embodiment of the BGA ball placement and removal device.

[0031] Figure 3This is a schematic diagram of the solder ball removal structure in the third embodiment of the BGA ball placement and removal device.

[0032] Figure 4 This is a schematic diagram of the solder ball removal structure in the fourth embodiment of the BGA ball-mounting and ball-removing device.

[0033] Figure 5 This is a schematic diagram of the solder ball removal structure in the fifth embodiment of the BGA ball placement and removal device.

[0034] Figure 6 This is a schematic diagram of an embodiment of the solder ball vibration assembly.

[0035] Figure 7 A schematic diagram of the first embodiment of the BGA ball implantation and removal method.

[0036] Figure 8 This is a schematic diagram of the second embodiment of the BGA ball implantation and removal method.

[0037] Figure 9 A detailed flowchart illustrating an embodiment of the BGA ball implantation and removal method.

[0038] Explanation of reference numerals in the attached drawings: 1. Ball-collecting component; 10. Ball-collecting plate; 11. Ball-collecting hole; 110. Connecting section; 111. Adsorption chamber; 12. Ball-collecting surface; 2. Solder ball; 3. Solder ball cleaning mechanism; 31. Air nozzle component; 311. Air nozzle body; 312. Air passage; 313. Air nozzle; 314. Air inlet; 315. Air nozzle slider; 316. Rotating shaft; 32. Drive assembly; 320. Drive component; 321. Transmission component; 322. Guide component; 4. Rack; 41. Swinging tooth; 5. Solder ball vibration assembly; 51. Vibration seat; 52. Vibration component; 53. Elastic component; 6. Ball plate.

[0039] The realization of the objectives, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0040] The claims of the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are also within the scope of protection of the present invention.

[0041] It should be understood that, in the description of the embodiments of the present invention, all directional indicating terms, such as "up," "down," "left," "right," "front," and "back," indicate the orientation or positional relationship based on the orientation and positional relationship shown in the accompanying drawings or the orientation or positional relationship commonly used when the product is in use. These terms are merely for the purpose of simplifying the description of the present invention and do not explicitly or implicitly suggest that the device, element, or component referred to must have a specific orientation or specific orientational structure, and should not be construed as a limitation of the present invention. They are only used to explain the relative positional relationships and movements between the components shown in the accompanying drawings. When this specific orientation changes, the directional indication may also change accordingly.

[0042] Furthermore, ordinal numbers such as "first" and "second" in this invention are used for distinguishing purposes only and should not be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, the features referred to as "first" and "second" may explicitly or implicitly include at least one of those technical features. In the description of this invention, "a plurality of" means at least two, i.e., two or more, unless otherwise expressly defined; "at least one" means one or more.

[0043] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," and "screw-in" should be interpreted broadly. For example, they can refer to a relatively fixed positional relationship between components, or a physically fixed connection between components; they can be detachable connections or integral structures; they can be mechanical connections or electrical signal connections; they can be direct connections or indirect connections through intermediate media or components; they can refer to the internal communication of two elements or the interaction between two elements. Unless otherwise explicitly limited in the specification, other interpretations will not achieve the corresponding functions or effects. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0044] If the controllers or control circuits involved in this invention are conventional control technologies or units for those skilled in the art, such as the control circuits of the controllers, they can be implemented by those skilled in the art using existing methods, such as simple programming. Regarding software or programs that work with hardware to achieve control results, unless the description provides a detailed explanation of the control process of the software or programs involved, this pertains to the use of existing technology or conventional techniques for those skilled in the art. The power supply also employs existing technology in the art. Furthermore, since the main inventive aspect of this invention lies in the improvement of the mechanical device, this invention will not provide a detailed explanation of the specific circuit control relationships and circuit connections.

[0045] This invention discloses many different embodiments or examples for implementing different structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described herein. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0046] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0047] like Figures 1-6 As shown, this invention provides an embodiment of a BGA ball-planting and ball-retrieving device.

[0048] The BGA ball removal device includes a ball removal component 1 for arraying solder balls and a solder ball cleaning mechanism 3 for cleaning excess solder balls from the ball removal component. The ball removal component 1 includes a ball removal plate 10 with a plurality of ball removal holes 11 arranged in an array. One end of each ball removal hole 11 is connected to a negative pressure component (not shown in the figure), and the other end passes through the ball removal surface 12 of the ball removal plate 10. During ball removal, the ball removal hole 11 uses the negative pressure component to adsorb and fix the solder balls 2 that bounce due to vibration. During ball removal, the negative pressure component forms an adsorption force at one end of the ball removal hole 11 that can fix the solder balls 2. The solder ball cleaning mechanism 3 includes a nozzle component 31 connected to pressurized gas. A variable airflow is output from the nozzle component 31 to sweep across the ball removal surface 12 where the solder balls 2 are adsorbed, thereby removing the excess solder balls 2 that the ball removal component 1 attaches to the ball removal surface 12 during ball removal. After the ball-collecting component 1 collects the solder ball, it moves relative to the solder ball cleaning mechanism 3, causing the air nozzle component 31 to output a suitably varied airflow that sweeps across the ball-collecting surface 12, removing excess solder balls 2 that were attached to the surface 12 when the ball-collecting component 1 collected the ball. During ball collection, some solder balls are vibrated to bounce, and each solder ball bounces to a different height, limiting the number of solder balls that can be captured by the ball-collecting hole 11, thus reducing the occurrence of excess solder balls when the ball-collecting hole 11 is adsorbed. Since the varied airflow can change the direction acting on the excess solder balls during purging, it helps to disrupt the stability of the excess solder balls fixed on the ball-collecting surface, thereby making solder ball cleaning easier and improving cleaning efficiency. The varied airflow includes airflow with changing direction, intermittent pulsed airflow, and airflow with different speeds.

[0049] Specifically, the BGA ball-retrieving device includes a ball tray 6 for storing solder balls, a solder ball vibration assembly 5, a ball-retrieving component 1, and a solder ball cleaning mechanism 3. The ball tray 6 is located directly below the ball-retrieving component 1. The ball-retrieving component 1 has an array of ball-retrieving holes 11, each of which can attract and fix the solder balls 2 that bounce due to the vibration of the solder ball vibration assembly 5. The solder ball cleaning mechanism 3 moves relative to the ball-retrieving component 1 via an air nozzle component 31. Pressurized gas is blown through the airflow output by the air nozzle component 31 to clean the ball-retrieving surface 12, removing excess solder balls 2 that appear during ball retrieval by the ball-retrieving component 1. After the excess solder balls 2 on the ball-retrieving surface 12 are cleaned to the set requirements, the ball-retrieving component 1 is moved directly above the substrate waiting to be ball-retrieving, aligning each solder ball 2 with the pad on the substrate. Then, by removing the negative pressure, each solder ball 2 on the ball-retrieving board 10 is placed at the corresponding pad position on the substrate to complete the ball-retrieving process. The airflow speed will not exceed the speed required to blow away each normally adsorbed solder ball from the ball-removing plate; only excess solder balls will be removed.

[0050] The negative pressure component can form a negative pressure adsorption component at the ball-receiving end of the ball-receiving hole 11. This negative pressure component includes a vacuum pump, etc. In this embodiment, the ball-receiving component 1 can also employ other existing methods to adsorb and fix the solder ball 2. The ball-receiving hole 11 includes a connecting section 110 and an adsorption cavity 111 connected to the connecting section 110. The adsorption cavity 111 is located at the ball-receiving end of the ball-receiving hole 11. The adsorption cavity 111 can be cylindrical, with a diameter larger than the ball-receiving hole 11 and slightly larger than the diameter of the solder ball 2, just large enough to accommodate the solder ball 2. This ensures stable fixation of the solder ball 2 during ball receiving while also providing high positional accuracy for each solder ball 2. The depth of the adsorption cavity 111 is not greater than the diameter of the solder ball 2, and preferably not less than the radius of the solder ball 2. In this way, when adsorbing and fixing the solder ball 2, even under negative pressure, when excess solder balls 2 are adsorbed and accumulated at the opening of the adsorption cavity 111, the adsorption effect is limited, and it is easier to remove them by purging. At the same time, it can also improve the reliability of adsorption and fixing of the solder ball 2 in the adsorption cavity 111, and avoid accidentally removing the solder ball 2 in the adsorption cavity 111 when purging and removing excess solder balls 2.

[0051] The solder ball cleaning mechanism 3 includes an air nozzle component 31 and a drive assembly 32 that allows the air nozzle component 31 and the solder ball picking component 1 to move relatively parallel to each other. The air nozzle component 31 includes an air nozzle body 311 with an air inlet 314 and an air passage 312 located at one end of the air nozzle body 311 and communicating with the air inlet 314. The other end of the air passage 312 communicates with an air nozzle 313 disposed on the surface of the air nozzle body 311. The shape of the air nozzle 313 is not limited, but to improve the efficiency of solder ball removal, the air nozzle 313 is preferably designed as a strip structure, such as a strip-shaped slit structure. The width of the strip-shaped slit can be set as needed to generate a flat, ribbon-like airflow under appropriate air pressure, forming an air knife with a certain wind speed. The solder ball cleaning mechanism 3 includes an air nozzle component 31 connected to a pressurized gas, including a clean gas such as an inert gas, which generates a certain pressure when passing through the air nozzle 313. When cleaning solder balls, the airflow generated during the blowing process can sweep away the solder balls 2 adsorbed on the ball-collecting surface 12. The airflow speed when cleaning excess solder balls 2 can be set based on experience or obtained through limited experiments, and can be adjusted as needed, such as determining the airflow speed based on the diameter of the solder balls and the experiment.

[0052] During operation, the solder ball vibration assembly 5 causes the solder balls 2 in the ball tray 6 to vibrate, allowing them to bounce within the tray. A negative pressure component connected to the ball-collecting hole 11 creates a negative pressure adsorption effect in the adsorption chamber 111. When the bouncing solder ball 2 approaches the adsorption chamber 111 on the ball-collecting surface 12, it is captured and fixed within the adsorption chamber 111 by the negative pressure. When the number of solder balls adsorbed by the array of adsorption chambers 111 on the ball-collecting plate 10 reaches or approaches the set number of balls to be collected (i.e., the number of adsorption chambers 111 containing solder balls 2 reaches the set value), the ball-collecting component 1 completes the process of collecting the balls from the ball tray 6. Then, relative movement occurs between the ball-collecting component 1 and the solder ball cleaning mechanism 3, such as by moving the air nozzle component 31 in the solder ball cleaning mechanism 3 in parallel or by moving the ball-collecting component 1, achieving relative translation between the ball-collecting component 1 and the solder ball cleaning mechanism 3. When the solder ball picking component 1 is positioned above the solder ball cleaning mechanism 3, the solder ball cleaning mechanism 3 outputs an airflow at a certain speed through a pressurized gas connected to the air inlet 314 on the air nozzle body 311 and the air nozzle 313 connected to the air inlet 314 via the air passage 312. When relative movement occurs between the solder ball picking component 1 and the solder ball cleaning mechanism 3, the airflow sweeps across the picking surface 12 of the solder ball picking component 1, blowing away any excess solder balls 2 that may be present on the picking surface 12, thus cleaning the excess solder balls 2 on the solder ball picking component 1. Because the solder ball cleaning mechanism 3 and the solder ball picking component 1 move relative to each other during solder ball removal, the airflow sprayed from the air nozzle 313 on the air nozzle component 31 sweeps across the picking surface 12, and any excess solder balls 2 that may be attached to the picking surface 12 are blown away by the airflow. This non-rigid contact method removes excess solder balls 2 from the picking surface 12, improving the cleaning efficiency of non-planar picking surfaces 12, such as warped surfaces, and avoiding incomplete cleaning. When the airflow output from nozzle 313 is properly set during the cleaning of solder balls, it will not damage the cleaned solder balls or affect the quality of subsequent ball placement.

[0053] When removing excess solder balls 2 from the surface of the ball-removing surface 12, relative movement occurs between the ball-removing component 1 and the solder ball cleaning mechanism 3. This can be achieved by employing methods such as... Figure 1The structure shown is described above. The drive assembly 32 can have the following structure: it includes a drive component 320, a transmission component 321 connected to the drive component 320, and a guide component 322 that moves the nozzle component 31 in parallel. The drive component 320 includes components such as a cylinder, stepper motor, or servo motor that can drive the nozzle component 31 to move. The transmission component 321 includes components such as a transmission rod, lead screw, or pulley drive that can convert the rotation of the drive component 320 into linear movement of the nozzle component 31. The guide component 322 includes a guide rod, etc., and can cooperate with the transmission component 321 to achieve linear reciprocating movement of the nozzle component 31. During operation, the drive component 320 can cause the nozzle component 31 to move linearly at a uniform speed in cooperation with the guide component 322 and the transmission component 321. Alternatively, it can be configured for non-uniform linear motion as needed.

[0054] In the above embodiment, the drive assembly 32 cooperates to directly drive the nozzle component 31 to move linearly and parallel, and the nozzle component 31 moves horizontally along the F direction, such as... Figure 1 As shown, the air nozzle component 31 moves horizontally to the right, causing relative movement between the air nozzle component 31 and the ball-collecting component 1. This allows the airflow output from the air nozzle component 31 to sweep across the ball-collecting surface 12, effectively removing excess solder balls 2 from the surface. If needed, the ball-collecting component 1 can be directly driven by the drive assembly 32, causing relative movement between the ball-collecting component 1 and the air nozzle component 31, such as... Figure 2 As shown, the air nozzle component 31 remains stationary, and the ball-collecting component 1 moves horizontally to the left along the F direction under the action of the drive assembly 32. The drive assembly 32 includes a drive component 320 and a transmission component 321 connected to the drive component 320, as well as a guide component 322 that moves the ball-collecting component 1 parallel to the air nozzle component 31. Its working process and the principle of removing solder balls are the same as those in the above embodiment, and will not be described again.

[0055] The shape of the spherical surface 12 can be similar to the surface of the chip substrate to which the ball is implanted. The spherical surface 12 can be either a plane or a curved surface, which can improve the accuracy of ball implantation. When the chip substrate is large and warping occurs, the spherical surface 12 adopts a warped surface similar to that of the chip substrate.

[0056] In the above embodiment, the air nozzle 313 can be configured as a strip-shaped air nozzle, the width of which is adapted to the width of the ball-receiving plate, such as not being less than the width of the ball-receiving plate. This ensures that the ball-receiving plate is swept in one go during cleaning, avoiding the edges from being unable to be swept clean, increasing the sweeping area in one go, and improving sweeping efficiency. The air nozzle 313 can also be configured as multiple independent air nozzles distributed in a straight line. In this embodiment, a single strip-shaped air nozzle is used as an example for explanation. Figure 1 and Figure 2As shown, the angle α formed by the airflow direction F1 of the strip nozzle and the horizontal plane AA can be set to 20-75 degrees. This angle α can be 30-45 degrees, which can effectively remove excess solder balls 2 and prevent them from scattering during removal, thus facilitating the recycling of solder balls.

[0057] As needed, in a preferred embodiment, the air nozzle component 31 may be provided with two strip-shaped air nozzles, such as... Figure 3 As shown, there are two strip-shaped air nozzles. The two airflows from the two nozzles blow in opposite directions. The airflows from the two nozzles form a first angle 'a' and a second angle 'b' with the horizontal plane AA, respectively. The first angle 'a' and the second angle 'b' are not the same; for example, the first angle 'a' can be set to be greater than the second angle 'b', or the first angle 'a' can be set to be less than the second angle 'b'. When cleaning excess solder balls, the two airflows from the two nozzles blow in opposite directions, i.e., the airflow from one nozzle is in direction F1, and the airflow from the other nozzle is in direction F2. Since the first angle 'a' and the second angle 'b' are different, the excess solder balls 2 adsorbed on the spherical surface 12 usually have only one stable point. When the airflow forming the first angle 'a' cannot remove them, the airflow forming the second angle 'b' can easily disrupt the stable point of the solder balls 2, thus easily removing the excess solder balls 2 and improving the efficiency of solder ball removal. The first included angle a and the second included angle b can also be set to be the same. Since the solder ball 2 usually has only one stable point, the airflow in different directions produces different rotational torques on the solder ball 2. When it is stable in one direction, the rotational torque changes in the other direction, making it easier to remove.

[0058] As needed, in a preferred embodiment, the two shaped nozzles are configured to output two opposing airflows to purge the spherical surface. For example... Figure 4 As shown, the two strip nozzles are configured to output two airflows in opposite directions. One strip nozzle outputs airflow direction F1, which is to the left, and the other strip nozzle outputs airflow direction F2, which is to the right. Airflow direction F2 is opposite to airflow direction F1. During operation, when removing excess solder balls 2 from the spherical surface 12, if the strip nozzle outputting airflow direction F1 fails to remove the excess solder balls 2, then using the strip nozzle outputting airflow direction F2 can easily disrupt the equilibrium of the excess solder balls 2 on the spherical surface 12, making them easier to remove. In other words, the airflows in two directions blow the spherical surface sequentially. The angles formed by these two opposing airflows and the horizontal plane AA can be the same or different, with the same effect as in the aforementioned embodiment.

[0059] To avoid the airflow from the two nozzles interacting when cleaning solder balls 2, which would affect the cleaning efficiency, the distance C between the airflow from the two nozzles and the point of action of the spherical surface 12 can be greater than the diameter of the solder ball 2. This prevents the two airflows from acting on the same solder ball 2 during the purging process, which could result in the solder ball not being removed.

[0060] To improve solder ball removal efficiency and reduce removal difficulty, in a preferred embodiment, the air nozzle component 31 can be oscillated during the removal of excess solder balls 2. The oscillating air nozzle component 31 outputs an airflow that oscillates in direction. This oscillating airflow is also a direction-changing airflow, altering the angle between the airflow output from the nozzle and the ball-collecting surface of the ball-collecting component. This allows for better removal of solder balls that cannot be cleaned by a fixed-angle airflow under special circumstances, such as… Figure 4 As shown.

[0061] like Figure 5As shown, the solder ball cleaning mechanism 3 also includes a nozzle swing assembly that causes the nozzle component to swing during the cleaning of solder balls 2. This nozzle swing assembly can change the airflow output from the strip nozzle on the nozzle component. The nozzle swing assembly includes a rack 4 that cooperates with the nozzle component 31. The nozzle component 31 also includes a nozzle slider 315 that is rotatably connected to the nozzle body 311 via a rotating shaft 316. When the nozzle slider 315 drives the nozzle component 31 to move parallel, the nozzle body 311 cooperates with the swing teeth 41 on the rack 4, causing the nozzle body 311 to swing up and down or left and right via the rotating shaft 316, thus clearing the solder balls by oscillating the airflow output by the nozzle body 311. In other words, the rotating shaft 316 is rotatably connected to the air nozzle component 31. When the air nozzle slider 315 drives the air nozzle component 31 to move parallel, the air nozzle component 31 engages with the swing teeth 41 on the rack 4, causing the air nozzle component 31 to swing up and down or left and right through the rotating shaft 316. During the process of clearing solder balls, the airflow output direction of the air nozzle component swings between the airflow direction F2 and the airflow direction F3 output by the air nozzle 313 on the air nozzle component 31. Specifically, the air nozzle slider 315 is connected to the guide component 322 and the transmission component 321 respectively. The drive component 320 causes the air nozzle slider 315 to move parallel along the guide component 322 through the transmission component 321. The driving component 320 is connected to the nozzle slider 315 of the fixed nozzle body 311 via the transmission component 321. The nozzle slider 315 is slidably engaged with the guide component 322. The nozzle component 31 also includes the nozzle slider 315 rotatably connected to the nozzle body 311 via the rotating shaft 316. The nozzle body 311 engages with the swing teeth 41 on the rack 4. When the driving component 320 drives the nozzle slider 315 to move via the transmission component 321, the nozzle body 311 swings under the action of the rack 4, causing the strip-shaped nozzle on the nozzle body 311 to swing left and right during the blowing and cleaning of the spherical surface 12. The unstable airflow acts on the solder ball 2, making it easier to clean. This changes the direction of the airflow output by the strip-shaped nozzle, and the unstable airflow acts on the solder ball, making it easier to remove the solder ball.

[0062] To improve the efficiency of removing excess solder balls, the air nozzle 313 can output a pulsed airflow, which can easily clean solder balls that are difficult to clean with a stable air velocity. This pulsed airflow can be appropriately set to ensure it does not affect the solder balls adsorbed in the suction cavity while effectively cleaning excess solder balls. The pulse frequency of this pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the air nozzle and the ball-collecting plate during solder ball cleaning, and R represents the diameter of the solder ball. This ensures that each solder ball is swept by the airflow within one cycle, avoiding missed areas and incomplete cleaning.

[0063] To improve ball placement efficiency and reduce the difficulty of ball replenishment, in a preferred embodiment, the ball-retrieving device further includes a ball-retrieving detection component to prevent the number of solder balls 2 adsorbed by the arrayed adsorption cavities 111 from not being all present or reaching the minimum ball placement requirement during ball retrieval. The ball-retrieving detection component includes a camera, which compares the image of the ball-retrieving component after ball retrieval with a preset image of the ball-retrieving component. Since there is a clear difference between the images of the ball-retrieving holes when balls are being retrieved, this difference is used to determine whether ball retrieval is required. When the set number of retrieved balls reaches the preset requirement, a "detection qualified" message is output, indicating that ball retrieval is complete. This ball-retrieving detection component can also employ other structures, such as sensors including vacuum and pressure sensors. These sensors detect the air pressure value in the ball-retrieving plate pipe or each air inlet to determine the number of solder balls adsorbed at the air inlet. Since the air pressure value is higher when solder balls are adsorbed at the air inlet and lower when no solder balls are adsorbed, the number of solder balls adsorbed at the air inlet can be determined, thereby determining whether ball placement is complete and subsequent processes.

[0064] To avoid incomplete removal of excess solder balls, which could lead to inconsistent solder ball numbers at each solder joint and potential encapsulation abnormalities due to varying solder amounts at solder joint locations, a preferred embodiment includes a solder ball cleaning and detection component. This component includes a camera that captures images of the solder ball removal board 10 or the solder ball removal surface 12 after solder ball cleaning. The image of the solder ball removal surface after cleaning is compared with a preset image showing a cleaned solder ball surface to determine if the surface is properly cleaned. This preset image can be data from when each solder ball hole on the board has one solder ball. Inconsistencies during comparison can be used as evidence of excess solder balls. When the solder ball removal board is detected to be unclean, the air nozzle component 31 moves parallel to the solder ball removal component 1 again. At this time, the air nozzle component 31 uses a second airflow with a higher speed than the first airflow to purge. This purging process is the same as in the previous embodiment and will not be described again. The increased airflow speed effectively cleans and stably removes excess solder balls. Alternatively, an airflow at a smaller angle than the previous airflow angle can be used for purging, which can also improve the efficiency of cleaning solder balls.

[0065] like Figure 6As shown, the ball-retrieving device includes a ball tray 6 for storing solder balls and a solder ball vibration assembly 5 for causing the solder balls in the ball tray 6 to vibrate and bounce. The solder ball vibration assembly 5 includes a vibration component 52 that causes the solder balls 2 to bounce via the ball tray 6 and a vibration seat 51 for fixing the vibration component 52. An elastic component 53 is provided between the vibration seat 51 and the ball tray 6 to convert rigid vibration into flexible vibration. The vibration component 52 includes a pneumatic or electric vibration component, such as an ultrasonic vibrator. The elastic component 53 includes four springs or rubbers, located at the four corners of the ball tray, or the ball tray 6 can be suspended on the vibration seat 51. Through the elastic component 53 between the vibration seat 51 and the ball tray 6, the rigid vibration generated by the vibration component can be converted into flexible or elastic vibration of the ball tray, preventing vibration from being transmitted to other components during operation and affecting the ball-planting accuracy. The elastic component 53 causes the solder balls 2 in the ball tray 6 to bounce to a certain extent. When some of the solder balls 2 that bounce due to the vibration approach the ball-collecting surface 12 of the ball-collecting component 1, there is a certain adsorption effect near the opening of the adsorption cavities 111 distributed on the ball-collecting surface 12, which adsorbs and fixes the solder balls 2 when capturing them. The vibration intensity and frequency of the vibration component 52 can be set according to the diameter or weight of the solder balls 2, and can be determined by obtaining corresponding vibration data through limited testing.

[0066] In this embodiment, besides being adsorbed and fixed by the adsorption cavity 111 under the action of the solder ball vibration component, the solder ball 2 can also be adsorbed and fixed by the adsorption cavity 111 of the ball-retrieving hole 11 on the ball-retrieving plate 10 using other existing methods. Ideally, during ball retrieval, each ball-retrieving hole 11 in the array distributed on the ball-retrieving plate 10 can adsorb and fix the solder ball 2, but in actual ball retrieval, it is difficult to achieve such a goal from the perspective of ball retrieval efficiency. Therefore, ball retrieval is usually considered complete when the number of solder balls 2 adsorbed by the array distributed adsorption cavities 111 is above a certain proportion, such as above 90%. Therefore, a ball retrieval detection component, such as visual detection, can be set to determine that the number of adsorption cavities with solder balls in the array distributed adsorption cavities reaches a preset number before solder ball cleaning is performed.

[0067] like Figures 7-9 As shown, the present invention also provides an embodiment of a BGA ball-planting and ball-removal method.

[0068] The BGA ball-planting and ball-removal method includes, In the ball-retrieving step S11, the ball-retrieving component forms an adsorption force in each ball-retrieving hole distributed in the array. The ball-retrieving hole captures the bouncing solder ball caused by vibration and fixes it in place. During ball retrieval, by causing some of the solder balls to vibrate and bounce, the height of each solder ball bounces is different. The number of solder balls that can be captured by the ball-retrieving hole is limited, which can reduce the phenomenon of excess solder balls appearing when the ball-retrieving hole adsorbs.

[0069] In the ball-retrieving detection step S12, the number of solder balls retrieved is checked to see if it meets the requirements. An image of the retrieved surface is captured by the ball-retrieving component and compared with a preset ball-retrieving image. If the number of solder balls in the array of retrieved holes reaches the preset value, this ball-retrieving detection step is completed, and the solder ball retrieval is finished, proceeding to the next step. If the number of solder balls in the array of retrieved holes does not meet the minimum requirements for ball placement, the process returns to the ball-retrieving step S11 until the number of solder balls in the array of retrieved holes meets the detection requirements, then proceeding to the next step. This ball-retrieving step S1... 1. This can prevent too many solder balls from being missed in the ball picker, which would affect subsequent ball placement. Since there are differences in image characteristics between solder balls in the picker hole and solder balls, the number of these differences can be used to determine whether the ball picker meets the set requirements. For example, if the picker hole is a 50x50 array, when 2400 picker holes have solder balls, this number is greater than the preset threshold of 2375, and the ball picker is considered to meet the requirements. When 2400 picker holes have solder balls, this number is greater than the preset threshold of 2245, and the ball picker is considered to not meet the requirements. It is necessary to pick balls again or continue picking balls until the requirements are met.

[0070] In solder ball cleaning step S13, after the number of solder balls in the array of solder ball picking holes reaches the required level, a varying airflow is output through the air nozzle component 31 to purge the solder ball picking surface that meets the requirements in step S12. For example, an airflow at a first speed can be output from the air nozzle component to purge the solder ball picking surface from the solder ball picking component, removing excess solder balls. This step can avoid the impact of excess solder balls on the solder ball placement accuracy and quality. If the solder ball cleaning does not meet the preset requirements after purging with the first speed airflow, a second speed airflow is used, where the first speed is lower than the second speed. The varying airflow includes airflow with changing direction, intermittent pulsed airflow, and airflow with different speeds.

[0071] Specifically, the devices, components, and assemblies involved in the BGA ball placement and removal method can all adopt the structure of the BGA ball placement and removal device described above. By causing the solder balls in the ball tray 6 to bounce, the ball removal component, which is connected to the negative pressure component, forms a negative pressure in the array of ball removal holes. The adsorption cavity 111 located at the ball removal end of the ball removal hole generates an adsorption effect. When the bouncing solder ball approaches the opening of the adsorption cavity 111, it is captured and fixed by the adsorption force of the adsorption cavity 111. After ball retrieval is completed, the array of adsorption cavities 111 on the ball retrieval surface 12 is detected through a ball retrieval detection step. If the number of solder balls 2 in the array of ball retrieval holes reaches a preset number, that is, if the number of adsorption cavities 111 containing solder balls is lower than a preset number, such as a preset threshold, the process returns to the ball retrieval step S11 and repeats the ball retrieval step. When the number of adsorption cavities 111 containing solder balls reaches a preset number, the next step, solder ball cleaning step S13, can be performed. A variable airflow is used to blow the ball retrieval surface. Because the variable airflow can change the direction acting on the excess solder balls during blowing, it is more conducive to breaking the stability of the excess solder balls fixed on the ball retrieval surface, making it easier to clean the solder balls and improving cleaning efficiency. This prevents the ball retrieval surface 12 from having incomplete solder ball cleaning during ball retrieval, thus avoiding any impact on the subsequent ball placement accuracy or effect.

[0072] The solder ball cleaning step S13 includes using an airflow to form an air knife to blow away the solder ball surface 12. For example, the angle between the airflow output through the strip nozzle and the horizontal plane AA is 'a'. This angle 'a' can be set to 20-75 degrees, preferably 30-45 degrees. This effectively removes excess solder balls 2 and prevents them from scattering during removal, facilitating solder ball recycling. Because airflow is used to remove any excess solder balls that may be attached, this method avoids the damage to the solder balls or incomplete cleaning when the solder ball surface is curved, which can occur with rigid contact cleaning methods like scrapers.

[0073] In the above embodiment, before the ball-retrieving step S11, a vibration step S10 is performed on the solder ball to make the solder ball bounce in the ball tray. This makes it easier for the ball-retrieving hole 11 to better capture the solder ball when the adsorption chamber 111 generates negative pressure adsorption during the subsequent ball-retrieving step S11, thereby improving the ball-retrieving efficiency.

[0074] To improve the solder ball cleaning effect and efficiency, in one specific embodiment, the solder ball cleaning step S13 may include using an oscillating airflow to blow away the solder balls during the cleaning process. For example, during the cleaning process, the components in the above embodiment cause the nozzle component to oscillate, causing the airflow output by the nozzle component to oscillate left and right while blowing away the solder ball surface 12. This oscillation, through the unstable airflow, acts on the solder balls 2, making them easier to clean. Since changing the direction of the airflow output from the nozzle changes, the changing airflow can alter the direction acting on the excess solder balls during blowing, thus more effectively disrupting the stability of the excess solder balls fixed on the solder ball surface, thereby improving the solder ball cleaning effect and efficiency.

[0075] In a preferred embodiment, the solder ball cleaning step S13 can also employ two airflows to selectively clean the solder balls. These two airflows, moving in opposite directions, form a first angle with the horizontal plane in one direction and a second angle with the horizontal plane in the other direction. The first and second angles can be the same or different. Because the same solder ball is cleaned from two different directions simultaneously, the stable point of the solder ball 2 is easily disrupted or different rotational torques are generated, thus easily removing excess solder balls 2 and improving the efficiency of solder ball removal.

[0076] In a preferred embodiment, the solder ball cleaning step S13 further includes using two opposing airflows to blow the spherical surface 12. When cleaning excess solder balls 2, the distance C between the two airflows acting on the spherical surface 12 is greater than the diameter of the solder ball 2. This can avoid the interaction between the airflows output from the two nozzles when cleaning the solder balls 2, which would affect the efficiency of cleaning the solder balls.

[0077] In a preferred embodiment, the solder ball cleaning step S13 is followed by a solder ball cleaning detection step S14. This step prevents incomplete solder ball cleaning from affecting the accuracy and performance of subsequent ball placement. The solder ball cleaning detection step S14 includes acquiring an image of the solder ball removal surface after cleaning, comparing this image with a preset image after cleaning, and determining whether to re-clean the solder balls. If the acquired image does not match the preset standard image or the difference is significant, a threshold can be set for judgment. If the threshold is not reached, it indicates incomplete cleaning. The preset standard image is a preset image after cleaning, specifically an image after completely cleaning the excess solder balls from the removal surface. At this point, the process returns to the solder ball cleaning step S13, and the removal surface is swept with an airflow at a second speed greater than the first speed to remove excess solder balls. When the acquired image matches the preset image, it indicates clean cleaning, and the ball placement step S15 is performed. Because the second sweeping airflow speed is greater than the first airflow speed, it can better clean stable solder balls.

[0078] Because airflow purging removes excess solder balls that may adhere to the ball-retrieving component during the ball-retrieving process, it avoids the damage to solder balls or incomplete cleaning issues that can occur with rigid contact cleaning methods like scrapers when cleaning the ball-retrieving surface, such as when the surface is curved. It is widely applicable to both flat and warped ball-retrieving surfaces. Furthermore, if excess solder balls remain after purging at the first airflow speed (i.e., if not completely removed), a second airflow speed is used in the next solder ball cleaning step. If this is still insufficient, a third airflow speed is used until no excess solder balls remain after the next step, completing the solder ball cleaning and inspection process and allowing for subsequent steps.

[0079] When the aforementioned airflow is a pulsed airflow, the pulse frequency of this pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the nozzle and the ball-collecting plate during solder ball cleaning, and R represents the diameter of the solder ball. This ensures that each solder ball is swept by the airflow within one cycle, avoiding missed areas and incomplete cleaning. This pulsed airflow can more easily clean solder balls that are difficult to clean with a stable airflow velocity, improving cleaning efficiency. The pulsed airflow can be appropriately set to ensure it does not affect the solder balls adsorbed in the suction chamber while effectively cleaning excess solder balls.

[0080] The aforementioned changing airflow can be an oscillating airflow. During the purging of the solder ball surface, the airflow direction output by the nozzle component oscillates up and down within an angle, thus changing the direction of the airflow. Since the excess solder balls adhere to the solder ball plate in a fixed stable state, the changing airflow acts on different positions, disrupting the stability of the excess solder balls, making them easier to clean and improving cleaning efficiency. This oscillating airflow can be appropriately set to ensure it does not affect the solder balls adsorbed in the suction cavity while effectively cleaning excess solder balls. The oscillation angle can be set as needed. Generally, each excess solder ball needs to be purged by two airflows in the same direction to improve cleaning efficiency.

[0081] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A BGA ball-planting and ball-removing device, characterized in that, include, The ball-collecting component includes a ball-collecting plate with several ball-collecting holes arranged in an array. One end of each ball-collecting hole is connected to a negative pressure component, and the other end passes through the ball-collecting surface. When collecting the ball, each ball-collecting hole uses the negative pressure component to adsorb and fix the bouncing solder ball caused by vibration. The solder ball cleaning mechanism includes a nozzle component connected to pressurized gas, which moves relative to a ball-receiving component. The nozzle component outputs a variable airflow to sweep the ball-receiving surface. This airflow removes excess solder balls adhering to the surface during ball removal. The variable airflow includes airflow with changing direction, intermittent pulsed airflow, or airflow with different speeds.

2. The BGA ball-planting and ball-removing device according to claim 1, characterized in that, The solder ball cleaning mechanism also includes a nozzle swing assembly that swings the nozzle component to change the airflow direction when cleaning solder balls.

3. The BGA ball-planting and ball-removing device according to claim 2, characterized in that, The air nozzle swing assembly includes a rack that cooperates with the air nozzle component. The air nozzle component includes an air nozzle slider that is rotatably connected to the air nozzle body via a rotating shaft. When the air nozzle slider drives the air nozzle component to move in parallel, the air nozzle component cooperates with the swing teeth on the rack, causing the air nozzle component to swing left and right via the rotating shaft. During the process of removing solder balls, the air nozzle component outputs an airflow that swings in a specific direction.

4. The BGA ball-planting and ball-removing device according to claim 3, characterized in that, The solder ball cleaning mechanism further includes a drive assembly for relatively parallel movement between the air nozzle component and the ball-collecting component. The drive assembly includes a drive component and a transmission component connected to the drive component, as well as a guide component that causes the air nozzle component to move in parallel via the transmission component. Alternatively, the drive assembly includes a drive component and a transmission component connected to the drive component, as well as a guide component that causes the ball-collecting component to move in parallel above the air nozzle component via the transmission component.

5. The BGA ball implantation and removal device according to claim 1, characterized in that, The spherical surface can be a plane or a curved surface.

6. The BGA ball-planting and ball-removing device according to claim 1, characterized in that, The nozzle component includes a nozzle body with an air inlet and an air passage located at one end of the nozzle body and communicating with the air inlet, and the other end of the air passage communicating with a nozzle disposed on the surface of the nozzle body.

7. The BGA ball-planting and ball-removing device according to claim 6, characterized in that, The air nozzle is a strip-shaped air nozzle.

8. The BGA ball-planting and ball-removing device according to claim 7, characterized in that, When there is only one strip-shaped air nozzle, the angle between the airflow direction of the strip-shaped air nozzle and the horizontal plane is 20-75 degrees.

9. The BGA ball-planting and ball-removing device according to claim 8, characterized in that, The airflow direction of the strip nozzle forms an angle of 30-45 degrees with the horizontal plane.

10. The BGA ball-planting and ball-removing device according to claim 7, characterized in that, The number of strip-shaped air nozzles is two, and the airflow directions of the two strip-shaped air nozzles are far apart, forming a first angle and a second angle with the horizontal plane respectively. The first angle and the second angle may be the same or different.

11. The BGA ball-planting and ball-removing device according to claim 7, characterized in that, The number of strip-shaped air nozzles is two, and the airflow directions of the two strip-shaped air nozzles are opposite to each other. The distance between the two airflows acting on the spherical surface is not less than the diameter of the solder ball.

12. The BGA ball-planting and ball-removing device according to claim 1, characterized in that, The BGA ball placement and removal device also includes a ball tray for storing solder balls and a solder ball vibration assembly for causing the solder balls in the ball tray to vibrate and bounce. The solder ball vibration assembly includes a vibration component that causes the solder balls to bounce through the ball tray and a vibration seat that fixes the vibration component. An elastic component that converts rigid vibration into flexible vibration is provided between the vibration seat and the ball tray.

13. The BGA ball-planting and ball-removing device according to claim 1, characterized in that, The pulse frequency of the pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the air nozzle and the ball-receiving plate when cleaning solder balls, and R represents the diameter of the solder ball.

14. A method for removing BGA implanted balls, characterized in that, include, In the ball-retrieving step, the ball-retrieving component forms an adsorption force in each ball-retrieving hole distributed in the array. The ball-retrieving hole captures the bouncing solder ball caused by vibration and adsorbs and fixes it. The ball picking detection step involves acquiring an image of the ball picking surface after the ball picking component picks up the ball, and comparing this image with a preset ball picking image. When the number of solder balls in the array of ball picking holes reaches a preset value, the solder ball picking is completed. The solder ball cleaning step involves using a nozzle component to output a variable airflow to clean the solder ball picking surface of the ball picking component, removing excess solder balls. The variable airflow includes airflow with changing direction, intermittent pulsed airflow, or airflow with different speeds.

15. The BGA ball implantation and removal method according to claim 14, characterized in that, The solder ball cleaning step also includes using airflow with changing direction to blow away the solder balls during the cleaning process.

16. The BGA ball implantation and removal method according to claim 14, characterized in that, The solder ball cleaning step also includes using two airflows that move away from each other to blow away the surface of the ball. One airflow forms a first angle with the horizontal plane, and the other airflow forms a second angle with the horizontal plane. The first angle and the second angle may be the same or different.

17. The BGA ball implantation and removal method according to claim 14, characterized in that, The solder ball cleaning step also includes using two opposing airflows to blow the surface of the solder ball, with the distance between the two airflows acting on the surface of the solder ball being greater than the diameter of the solder ball.

18. The BGA ball-planting and ball-removal method according to any one of claims 15-17, characterized in that, The solder ball cleaning step is followed by a solder ball cleaning detection step, which includes acquiring an image of the solder ball surface after cleaning with an airflow at a first speed and comparing it with a preset standard to determine whether the solder balls need to be cleaned again. If the comparison is inconsistent, the solder ball surface is swept with an airflow at a second speed to remove excess solder balls. The second speed is greater than the first speed.

19. The BGA ball implantation and removal method according to claim 14, characterized in that, The pulse frequency of the pulsed airflow is not less than V / R, where V represents the horizontal relative movement speed between the air nozzle and the ball-receiving plate when cleaning solder balls, and R represents the diameter of the solder ball.

Images