A semiconductor tail gas treatment device based on electromagnetic induction heating

Abstract

The application relates to the technical field of industrial waste gas treatment, and discloses a semiconductor tail gas treatment equipment based on electromagnetic induction heating, which comprises a heating cavity, one output end of the bottom end of the heating cavity is fixedly inserted into the inside of a gas-liquid separation tank, one input end of a spray washing tower is fixedly installed on the gas-liquid separation tank, and an electromagnetic induction heating reaction assembly is arranged on the heating cavity. Through cooperation of the heating cavity and the electromagnetic induction heating reaction assembly, the tail gas conveyed by the air inlet pipe is rapidly heated to the reaction temperature in a non-contact eddy current heating mode of an electromagnetic induction coil, an insulation heat insulation layer is used for heat preservation and temperature insulation, and a temperature sensor is used for real-time closed-loop temperature control, so that the technical effects of fast heating, uniform heat distribution, high energy conversion efficiency, no open fire, safety and stability are achieved, and the problems of slow heating, high energy consumption, uneven heating and easy local overheating of traditional electric heating are solved.

Description

Technical Field

[0001] This invention relates to the field of industrial waste gas treatment technology, specifically to a semiconductor exhaust gas treatment device based on electromagnetic induction heating. Background Technology

[0002] Semiconductor manufacturing processes generate complex waste gases, including acidic gases, alkaline gases, organic waste gases, flammable and explosive gases, and toxic gases. Direct emissions of these gases can pollute the environment, harm human health, and easily cause safety accidents such as pipeline corrosion, blockages, fires, and explosions.

[0003] Currently, semiconductor exhaust gas treatment mainly employs technologies such as combustion-based water washing, electric heating-based water washing, plasma-based water washing, dry adsorption, and pure water washing. Combustion-based methods require the use of combustible gases, posing a high risk of fire and consuming a large amount of energy. Electric heating methods rely on heating rods or thermal jackets, resulting in low heating efficiency, time-consuming preheating, and significant energy loss, which can easily lead to localized overheating, reducing equipment stability and lifespan. Plasma-based methods have high equipment and maintenance costs and significant electrode wear. Dry adsorption methods have limited efficiency in treating stable components, require regular replacement of the adsorbent, and have high operating costs.

[0004] Meanwhile, existing equipment generally suffers from problems such as low heat recovery and utilization rate, poor temperature control accuracy, low equipment integration, easy clogging of spray, poor gas-liquid separation effect, and insufficient automated monitoring and adjustment capabilities. Overall processing efficiency is limited, making it difficult to meet the increasingly stringent environmental emission standards and the high-quality development needs of the semiconductor industry.

[0005] In view of this, we propose a semiconductor exhaust gas treatment device based on electromagnetic induction heating. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor exhaust gas treatment device based on electromagnetic induction heating to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A semiconductor exhaust gas treatment device based on electromagnetic induction heating includes a heating chamber. One output end of the bottom of the heating chamber is fixedly inserted into the interior of a gas-liquid separation box. One input end of a spray scrubbing tower is fixedly installed on the gas-liquid separation box. The other output end of the bottom of the heating chamber is fixedly connected to the other input end of the spray scrubbing tower. An electromagnetic induction heating reaction component is provided on the heating chamber, and the electromagnetic induction heating reaction component includes an air inlet pipe.

[0009] The air inlet pipe is wrapped with an insulating and heat-insulating layer, and an electromagnetic induction coil is wound around the outside of the insulating and heat-insulating layer. Multiple temperature sensors are fixedly installed inside the arc-shaped sidewall of the heating chamber. A pH sensor and a conductivity sensor are fixedly installed inside the sidewall of the gas-liquid separator. Gas composition sensors are fixedly installed inside the bottom sidewall of both the gas-liquid separator and the spray scrubbing tower. An alkaline solution connector and an acidic solution connector are fixedly installed inside the top sidewall of the gas-liquid separator. A drain connector is provided at the liquid output end of the gas-liquid separator.

[0010] In a further embodiment, a pressure sensor is installed on the intake pipe to monitor the pressure value.

[0011] In a further embodiment, an exhaust gas detection mechanism is provided at the top output end of the spray scrubbing tower to detect whether the treated exhaust gas meets the standards.

[0012] In a further embodiment, the spray scrubbing tower is equipped with a spray assembly, which includes multiple sets of spray pipes. The input ends of the multiple sets of spray pipes are fixedly installed inside the arc-shaped sidewall of the spray scrubbing tower, and the output ends of the spray pipes are fixedly installed with multiple sets of annular pipes. The horizontal cross-sectional diameter of the multiple sets of annular pipes on a single spray pipe gradually decreases from bottom to top. Multiple equally spaced circular array nozzles are fixedly installed at the bottom end of a single annular pipe, and the number of nozzles is halved as the horizontal cross-sectional diameter of the corresponding annular pipe decreases, thus avoiding overlap of the nozzles in the same radial position.

[0013] In a further embodiment, multiple sets of filter plates are fixedly installed inside the spray scrubbing tower, and the filter plates are located below the corresponding annular tube array group.

[0014] In a further embodiment, an auxiliary component is provided outside the heating chamber. The auxiliary component includes a filter. The input end of the filter is fixedly installed on a drain connector, and the output end of the filter is fixedly connected to the input end of a circulation pump. A bend is fixedly installed on the output end of the circulation pump, and a control valve is provided on the bend. The bend penetrates the arc-shaped sidewall of the spray scrubbing tower.

[0015] In a further embodiment, a circular cover is fixedly installed on the outside of the bent pipe. The circular cover has multiple sets of equally spaced circumferentially arranged inclined covers integrally formed on it. The inclined covers are inclined downwards, and multiple through-holes are opened on the lower side wall of the inclined covers. The bent pipe, the circular cover, and the inclined covers are internally connected. The circular cover, the inclined covers, and the liquid outlets are arranged in multiple sets, and the number of sets is the same as the number of filter plates. The inclined covers are located above the corresponding filter plates. From the top to the bottom of the spray scrubbing tower, the distance between the bottom of the inclined cover and the top of the corresponding filter plate gradually increases, thereby preventing the filter plates from clogging.

[0016] In a further embodiment, a circular sleeve is rotatably mounted on the outside of the bent pipe via a sealed bearing at both ends. Multiple sets of equally spaced circular cleaning heads are integrally formed on the circular sleeve, and the cleaning heads are inclined upwards. The bent pipe, the circular sleeve, and the cleaning heads are internally connected. Multiple sets of the circular sleeve and cleaning heads are provided, and the number of sets is the same as the number of spray pipes. The top opening of each cleaning head faces the corresponding circular pipe, and as the horizontal cross-sectional diameter of the corresponding circular pipe gradually decreases, the length of the corresponding cleaning head gradually decreases, thus adapting to the pipe while avoiding motion interference.

[0017] In a further embodiment, the spray scrubbing tower is equipped with an interception assembly, which includes an interception cover. The interception cover is fixedly installed inside the top of the spray scrubbing tower. Multiple sets of protruding covers are integrally formed on the interception cover. The vertical cross-section of the protruding covers is trapezoidal, and through-holes are provided on the side walls of the protruding covers.

[0018] In a further embodiment, two sets of the interceptor cover and the protruding cover are provided, and they are in a mirror-image fit-to-fit state, that is, the small ends of the two sets of protruding covers are fitted together, and the installation layout of the two sets of protruding covers is perpendicular to each other, so as to better separate gas and liquid.

[0019] Compared with the prior art, the present invention provides a semiconductor exhaust gas treatment device based on electromagnetic induction heating, which has the following beneficial effects:

[0020] 1. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating aims to improve the heating and decomposition efficiency of semiconductor exhaust gas, reduce energy consumption, and eliminate local overheating. It utilizes a heating chamber combined with an electromagnetic induction heating reaction component. This employs non-contact eddy current heating with an electromagnetic induction coil, insulation layer for heat preservation, and real-time closed-loop temperature control by a temperature sensor. This achieves rapid heating of the exhaust gas delivered through the inlet pipe to the reaction temperature, uniform heat distribution, high energy conversion efficiency, and safe and stable operation without open flame. It solves the problems of slow heating, high energy consumption, uneven heating, and easy local overheating associated with traditional electric heating. The water produced in the reaction is discharged through the drain connector of the gas-liquid separation tank. The treated gas enters a spray scrubbing tower. A pH sensor monitors the pH value, a conductivity sensor monitors the conductivity, a gas composition sensor performs initial gas composition analysis, and alkaline and acidic solution connectors facilitate pH adjustment. An exhaust gas detection mechanism performs secondary analysis and detection of the sprayed exhaust gas, and a pressure sensor monitors the pressure.

[0021] 2. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating intercepts residual fixed particles in the treated exhaust gas by setting up a spray assembly and a filter plate. The spray equipment delivers washing liquid into the spray pipe, and then sprays the treated exhaust gas moving from bottom to top through multiple sets of vertically staggered arrays of annular pipes and nozzles, thereby further removing residual acidic or alkaline gases in the exhaust gas.

[0022] 3. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating, through the installation of auxiliary components, allows the liquid inside the gas-liquid separation tank to be filtered by a filter after the circulation pump is started. After the control valve is opened, the liquid is transported to the annular hood through a curved pipe. The cleaning medium is then discharged through the liquid outlet on the inclined hood to the filter plate, thus performing reverse flushing, which is opposite to the upward-moving gas. This prevents the filter plate from clogging and improves the subsequent spraying effect. At the same time, the filter plate closer to the bottom of the spray scrubbing tower is filtered first and is therefore more prone to clogging. Since the bottom of the inclined hood is closer to its top, the cleaning effect remains optimal.

[0023] 4. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating, when the gas-liquid mixture inside the spray scrubbing tower moves upward, simultaneously delivers cleaning medium through the bend pipe, together causing the annular sleeve to drive the cleaning head to rotate. Thus, the cleaning head moving obliquely upward can clean the annular pipe and the spray nozzle, avoiding blockage and improving the practicality of the equipment.

[0024] 5. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating increases the contact area of ​​the upward-moving gas-liquid mixture by setting up an interception component and a protruding cover on the interception hood. This allows gas molecules to pass through the vent holes while the liquid medium is intercepted and eventually falls back into the gas-liquid separation tank. The two sets of mirrored configurations and the vertical distribution of the protruding covers make it more difficult for the liquid medium to escape from the spray scrubbing tower, thereby improving the gas-liquid separation effect and making the subsequent exhaust gas detection results more accurate.

[0025] 6. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating adopts a three-dimensional, layered, non-horizontal, staggered spray structure. The nozzles are staggered along the axial and radial directions of the spray scrubbing tower, not limited to installation on the same horizontal plane. It can make full use of the three-dimensional space inside the spray scrubbing tower, installing more large-diameter, high-flow nozzles. Under the same spray scrubbing tower volume, the spray flux and coverage density are increased. This three-dimensional spray structure can form a three-dimensional full-coverage spray field, eliminating planar spray blind spots and airflow short-circuiting phenomena, allowing the exhaust gas after high-temperature treatment to fully contact the scrubbing liquid, significantly improving the neutralization, absorption, and scrubbing efficiency of acidic, alkaline, and organic residual waste gases. This invention quantitatively designs the number of nozzles: according to the radial spatial distribution law of the spray scrubbing tower, the number of nozzles decreases proportionally from the outside to the inside, so that the spray flow rate matches the radial concentration and flow distribution of the exhaust gas, ensuring spray uniformity and treatment stability; at the same time, it provides a standardized and quantifiable design basis for the spray system, improving equipment consistency and adaptability to large-scale production.

[0026] 7. This semiconductor exhaust gas treatment equipment based on electromagnetic induction heating achieves standardized, quantifiable, and scalable design of a multi-layer three-dimensional spray structure by deriving and adopting general mathematical expressions for the number of nozzles, total number of nozzles, equal division angle, offset angle, and arrangement angle. Each ring of nozzles automatically forms a progressive staggered arrangement, avoiding overlap of nozzles in the same radial position, eliminating spray blind zones, and forming a three-dimensional staggered spray field. This significantly improves the uniformity of gas-liquid contact and the efficiency of washing and cooling, avoids spatial interference between nozzles in planar arrangement, effectively increases the single-ring spray throughput, reduces the risk of blockage, and is suitable for high-flow, high-concentration exhaust gas treatment conditions. The expression provides a clear quantitative basis for nozzle processing, opening, and positioning, facilitating precise control during design, processing, and assembly, avoiding errors caused by manual experience design, ensuring consistent spraying effects for different batches and specifications of equipment, and reducing production and debugging costs. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective;

[0029] Figure 3 This is a first-view schematic diagram of a partial cross-sectional view of the structure of the present invention;

[0030] Figure 4 This is a schematic diagram of a cross-sectional view of part of the structure of the present invention from a second perspective;

[0031] Figure 5 This is a partial structural diagram of the electromagnetic induction heating reaction component of the present invention;

[0032] Figure 6 This is a cross-sectional schematic diagram of a portion of the electromagnetic induction heating reaction assembly of the present invention;

[0033] Figure 7 This is a cross-sectional view of the auxiliary component structure of the present invention;

[0034] Figure 8 For the present invention Figure 7 Enlarged structural diagram of region A in the middle;

[0035] Figure 9 For the present invention Figure 7 Enlarged structural diagram of region B in the middle;

[0036] Figure 10 For the present invention Figure 7 Enlarged structural diagram of region C in the middle;

[0037] Figure 11 This is a cross-sectional view of the auxiliary component structure of the present invention;

[0038] Figure 12 This is a schematic diagram of the interception component structure of the present invention;

[0039] Figure 13 This is a schematic diagram of the spray assembly structure of the present invention;

[0040] Figure 14 This is a schematic cross-sectional view of the spray scrubbing tower of the present invention;

[0041] Figure 15 This is a top view of the structure of the spray assembly of the present invention.

[0042] Explanation of icon numbers:

[0043] 1. Heating chamber; 2. Gas-liquid separation box; 3. Spray scrubbing tower; 4. Electromagnetic induction heating reaction assembly; 41. Air inlet pipe; 42. Insulation layer; 43. Electromagnetic induction coil; 44. Temperature sensor; 45. pH sensor; 46. Conductivity sensor; 47. Gas composition sensor; 48. Alkaline solution connector; 49. Acidic solution connector; 410. Drain connector; 411. Exhaust detection mechanism; 412. Pressure sensor; 5. Spray assembly; 51. Spray pipe; 52. Circular pipe; 53. Spray head; 54. Filter plate; 6. Auxiliary assembly; 61. Filter; 62. Circulating pump; 63. Bend; 64. Control valve; 65. Circular cover; 66. Slanted cover; 67. Liquid outlet; 68. Circular sleeve; 69. Cleaning head; 7. Interception assembly; 71. Interception cover; 72. Protruding cover; 73. Vent hole. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] In this application, the term "above" indicates the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is primarily used to better describe this application and its embodiments, and is not intended to limit the indicated device, element, or component to having a specific orientation, or to construct and operate in a specific orientation. Furthermore, the term "above" may also be used in certain circumstances to indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0046] Please see Figures 1-15 The present invention provides a technical solution:

[0047] A semiconductor exhaust gas treatment device based on electromagnetic induction heating includes a heating chamber 1. One output end of the bottom of the heating chamber 1 is fixedly inserted into the gas-liquid separation tank 2. One input end of a spray scrubbing tower 3 is fixedly installed on the gas-liquid separation tank 2. The other output end of the bottom of the heating chamber 1 is fixedly connected to the other input end of the spray scrubbing tower 3. An electromagnetic induction heating reaction assembly 4 is provided on the heating chamber 1. The electromagnetic induction heating reaction assembly 4 includes an air inlet pipe 41, which is wrapped with an insulating heat insulation layer 42. An electromagnetic induction coil 43 is wound around the outside of the insulating heat insulation layer 42. An electromagnetic induction coil 43 is fixedly installed inside the arc-shaped sidewall of the heating chamber 1. Two sets of temperature sensors 44 are provided. A pH sensor 45 and a conductivity sensor 46 are fixedly installed inside the side wall of the gas-liquid separator 2. Gas composition sensors 47 are fixedly installed inside the bottom side wall of both the gas-liquid separator 2 and the spray scrubbing tower 3. An alkaline solution connector 48 and an acidic solution connector 49 are fixedly installed inside the top side wall of the gas-liquid separator 2. A drain connector 410 is provided at the liquid output end of the gas-liquid separator 2. In addition, a pressure sensor 412 is provided on the air inlet pipe 41 to monitor the pressure value. In addition, an exhaust detection mechanism 411 is provided at the top output end of the spray scrubbing tower 3 to detect whether the treated exhaust gas meets the standards.

[0048] Example 1

[0049] The spray scrubbing tower 3 is equipped with a spray assembly 5, which includes two sets of spray pipes 51. The input ends of the two sets of spray pipes 51 are fixedly installed inside the arc-shaped sidewall of the spray scrubbing tower 3. The output ends of the spray pipes 51 are fixedly installed with three sets of annular pipes 52. The horizontal cross-sectional diameter of the three sets of annular pipes 52 on a single spray pipe 51 gradually decreases from bottom to top. Multiple equally spaced circular array nozzles 53 are fixedly installed at the bottom of a single annular pipe 52. The number of nozzles 53 is halved as the horizontal cross-sectional diameter of the corresponding annular pipe 52 decreases, so as to avoid the nozzles 53 overlapping in the same radial position. In addition, two sets of filter plates 54 are fixedly installed inside the spray scrubbing tower 3. The filter plates 54 are located below the corresponding array of annular pipes 52.

[0050] Specifically, let the number of nozzles 53 on the first ring (the outermost ring, i.e., the bottommost annular tube 52) be: ;

[0051] For each inward rotation (i.e., each upward rotation), the number of nozzles 53 is halved. The number of rotations is expressed as:

[0052]

[0053] The derivation process is as follows:

[0054] Lap 1: The number of nozzles 53 is: ;

[0055] Lap 2: The number of nozzles 53 is: ;

[0056] Lap 3: The number of nozzles 53 is: ;

[0057] Induction The number of 53 nozzles in the circle satisfies the expression:

[0058]

[0059] Specifically: when When the number of nozzles 53 on the bottommost first ring tube 52 is 12, the number of nozzles 53 on the middle second ring tube 52 is 6, and the number of nozzles 53 on the topmost third ring tube 52 is 3.

[0060] Furthermore, the total number of nozzles S (53) is the sum of a geometric series: Divide the circumference of the circular section containing the annular tube 52 into equal parts. A portion, with each portion divided equally at the following angles: The center of a nozzle 53 on the first ring of the annular pipe 52 is aligned with the center of the circular cross-section and the center of the spray pipe 51. Using this line as a reference line, the offset angle expression for the first nozzle 53 in the nth ring is: The circumferential arrangement angle of the k-th nozzle 53 in the n-th ring satisfies a unified expression: ,

[0061] Specifically: In one embodiment of the spraying device of the present invention, the number of outermost ring spray heads 53 is set. Total number of laps Therefore, the number of nozzles 53 in the first ring is 12, the number of nozzles 53 in the second ring is 6, the number of nozzles 53 in the third ring is 3, and the total number of nozzles 53 is... Divide the circumference of the circular section containing the annular tube 52 into 21 equal parts, and divide each part into equal angles. Using the position of the nozzle 53 collinear with the center of the spray pipe 51 on the first ring as the reference line, the initial offset angle of the nozzle 53 in each ring is determined according to the formula. Calculation: The offset angle for the first lap is The offset angle for the second lap is The offset angle for the third lap is This creates a staggered three-dimensional spraying layout with three layers of nozzles 53, achieving a spraying effect with no blind spots and uniform coverage.

[0062] Example 2

[0063] An auxiliary component 6 is installed outside the heating chamber 1. The auxiliary component 6 includes a filter 61. The input end of the filter 61 is fixedly installed on the drain connector 410, and the output end of the filter 61 is fixedly connected to the input end of the circulation pump 62. A bend 63 is fixedly installed at the output end of the circulation pump 62. A control valve 64 is installed on the bend 63. The bend 63 penetrates the arc-shaped sidewall of the spray scrubbing tower 3. In addition, a circular cover 65 is fixedly installed outside the bend 63. The circular cover 65 has five sets of equally spaced circular arrays of oblique angles integrally formed on it. The shroud 66 is inclined downwards, and four through-holes 67 are provided on the lower side wall of the shroud 66. The bent pipe 63, the annular shroud 65 and the shroud 66 are internally connected. There are two sets of annular shroud 65, shroud 66 and outlet holes 67, and the number of these sets is the same as the number of filter plates 54. The shroud 66 is located above the corresponding filter plate 54. From the top to the bottom of the spray scrubbing tower 3, the distance between the bottom of the shroud 66 and the top of the corresponding filter plate 54 gradually increases, thereby avoiding clogging of the filter plate 54.

[0064] Example 3

[0065] The upper and lower ends of the bend 63 are rotatably mounted on the outside of the bend 63 via sealed bearings. Multiple sets of equally spaced circular cleaning heads 69 are integrally formed on the circular sleeve 68. The cleaning heads 69 are inclined upwards. The bend 63, the circular sleeve 68 and the cleaning heads 69 are internally connected. There are three sets of circular sleeves 68 and cleaning heads 69, and the number of sets is the same as the number of spray pipes 51. The top opening of the cleaning head 69 faces the corresponding circular pipe 52. As the horizontal cross-sectional diameter of the corresponding circular pipe 52 gradually decreases, the length of the corresponding cleaning head 69 gradually decreases to adapt to the pipe while avoiding motion interference.

[0066] Example 4

[0067] The spray scrubbing tower 3 is equipped with an interception component 7, which includes an interception cover 71. The interception cover 71 is fixedly installed inside the top of the spray scrubbing tower 3. Multiple sets of protruding covers 72 are integrally formed on the interception cover 71. The vertical cross-section of the protruding cover 72 is trapezoidal. The side wall of the protruding cover 72 is provided with a through-hole vent 73. In addition, there are two sets of interception covers 71 and protruding covers 72, which are in a mirror fit with each other. That is, the small ends of the two sets of protruding covers 72 are fitted together, and the installation layout of the two sets of protruding covers 72 is perpendicular to each other, so as to better separate gas and liquid.

[0068] Working principle: The semiconductor exhaust gas to be treated is stably delivered into the heating chamber 1 through the intake pipe 41. A high-frequency current is passed through the electromagnetic induction coil 43 to generate an alternating magnetic field, which causes eddy current effect inside the heating chamber 1 and rapidly raises the temperature. The insulating heat insulation layer 42 is wrapped between the intake pipe 41 and the electromagnetic induction coil 43, which not only prevents the high temperature of the heating chamber 1 from being conducted to the electromagnetic induction coil 43 to extend the service life of the coil, but also achieves electrical insulation to prevent high voltage arcing and short circuit. The temperature sensor 44 collects the internal temperature of the heating chamber 1 in real time and feeds it back to the control system to achieve closed-loop precise control of the heating temperature, ensuring that the exhaust gas is fully decomposed within the set high temperature range, converting flammable and explosive organic harmful components into harmless substances, and completing the high-temperature pyrolysis treatment of the exhaust gas.

[0069] The pyrolyzed gas-liquid mixture is output from the heating chamber 1 into the gas-liquid separator 2, where preliminary gas-liquid separation is completed. The pH sensor 45 continuously monitors the acidity and alkalinity of the liquid in the separator, the conductivity sensor 46 detects the conductivity parameter of the liquid in real time, and the gas composition sensor 47 synchronously collects the gas composition data in the separator. The alkaline solution connector 48 and the acidic solution connector 49 automatically connect to the corresponding solutions according to the real-time monitoring results, dynamically adjusting the acidity and alkalinity of the liquid and the processing parameters. The separated liquid is collected at the bottom of the gas-liquid separator 2 and output to the outside through the drain connector 410. The pressure sensor 412 monitors the internal pressure of the air inlet pipe 41 in real time to ensure stable exhaust gas delivery pressure and avoid abnormal pressure affecting the processing efficiency.

[0070] After preliminary separation, the gas enters the spray scrubbing tower 3 from the bottom up. The spray pipe 51 delivers the scrubbing liquid to the multi-layered annular pipe 52. The diameter of the annular pipe 52 decreases gradually from bottom to top along the radial direction of the spray scrubbing tower 3. The nozzles 53 are arranged in an array at equal intervals along the circumference of the annular pipe 52, and their number decreases proportionally with the decrease in the diameter of the annular pipe 52, forming a three-dimensional, full-coverage spray field. This sprays and washes the gas flowing from bottom to top in all directions, effectively neutralizing and removing residual acidic, alkaline, and harmful components in the gas. The filter plate 54 is arranged below the annular pipe 52 to intercept solid particulate impurities carried in the gas, preventing particles from clogging the spray structure and improving the purity of the gas purification.

[0071] The liquid output from drain connector 410 enters auxiliary component 6. Filter 61 filters the liquid to remove impurities. Circulation pump 62 provides the conveying power, transporting the filtered liquid through bend pipe 63 and control valve 64 to the interior of spray scrubbing tower 3. The liquid enters annular cover 65 and inclined cover 66 through bend pipe 63, and is sprayed downwards through liquid outlet hole 67 at the bottom of inclined cover 66, performing reverse flushing on the lower filter plate 54. The flushing direction is opposite to the upward flow direction of the gas, effectively removing blockages on the surface of filter plate 54. The distance between inclined cover 66 and filter plate 54 gradually increases from top to bottom, matching the working condition where the bottom filter plate 54 is more prone to blockage, ensuring a balanced and stable cleaning effect for each layer of filter plate 54. After the current batch is completed, wastewater is discharged through another output end of circulation pump 62.

[0072] The cleaning liquid inside the bend 63 simultaneously enters the annular sleeve 68 and the cleaning head 69. Under the combined action of the liquid jet thrust and the upward thrust of the gas-liquid mixture inside the spray scrubbing tower 3, the annular sleeve 68 automatically rotates around the bend 63, driving the cleaning head 69 to rotate synchronously. The cleaning head 69 is angled upward toward the corresponding annular pipe 52 and nozzle 53, continuously rotating and rinsing the pipe wall of the annular pipe 52 and the nozzle of the nozzle 53 to prevent scaling and clogging of the spray structure. Moreover, the length of the cleaning head 69 is adaptively adjusted as the diameter of the annular pipe 52 decreases, avoiding motion interference during rotation and ensuring the long-term stable operation of the spray system.

[0073] After spray washing and purification, the gas-liquid mixture continues to flow upward to the interception component 7. The interception cover 71 is fixed inside the top of the spray washing tower 3. The protruding cover 72 increases the contact path and interception area of ​​the gas-liquid mixture. Gas molecules flow upward through the vent holes 73 on the protruding cover 72, while the liquid medium is intercepted and adhered to, and falls back into the gas-liquid separation box 2 under the action of gravity. The two sets of interception covers 71 and protruding covers 72 are arranged in mirror fit and perpendicular to each other, further enhancing the gas-liquid separation effect and preventing the liquid from escaping with the gas. Finally, the purified gas that meets the standards is tested for composition and concentration by the exhaust detection mechanism 411. After confirming that it meets the standards, it is safely discharged into the external environment.

[0074] All electrical components appearing in this application are electrically connected to the controller, processor, and 220V AC mains power. The controller is a conventional and known device capable of controlling the electromagnetic induction coil 43, temperature sensor 44, pH sensor 45, conductivity sensor 46, gas composition sensor 47, exhaust detection mechanism 411, pressure sensor 412, circulating pump 62, and control valve 64. The signal interaction between the components adopts the PLC control protocol commonly used in industrial equipment, which is common knowledge to those skilled in the art and can be implemented without further detailed description. The control logic and signal interaction method are existing technologies and will not be elaborated further. All standard parts used in this application can be purchased from the market. The specific connection methods of each part are all conventional methods such as riveting and welding, which are mature technologies in the prior art. The standard parts all adopt conventional models in the prior art, and the circuit connections adopt conventional connection methods in the prior art.

[0075] It should be noted that the above electrical components are all existing technology products. They are selected, installed and debugged by those skilled in the art according to the needs of use to ensure that all electrical appliances can work normally. The components are all general standard parts or parts known to those skilled in the art. Their structure and principle can be known by those skilled in the art through technical manuals or conventional experimental methods. No specific restrictions are made here.

[0076] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A semiconductor exhaust gas treatment device based on electromagnetic induction heating, comprising a heating chamber (1), wherein one output end of the bottom of the heating chamber (1) is fixedly inserted into the interior of a gas-liquid separation tank (2), one input end of a spray scrubbing tower (3) is fixedly installed on the gas-liquid separation tank (2), and the other output end of the bottom of the heating chamber (1) is fixedly connected to the other input end of the spray scrubbing tower (3), characterized in that: The heating chamber (1) is provided with an electromagnetic induction heating reaction assembly (4), which includes an air inlet pipe (41). The air inlet pipe (41) is wrapped with an insulating heat insulation layer (42), and an electromagnetic induction coil (43) is wound around the outside of the insulating heat insulation layer (42). Multiple temperature sensors (44) are fixedly installed inside the arc-shaped sidewall of the heating chamber (1). A pH value sensor (45) and a conductivity sensor (46) are fixedly installed inside the sidewall of the gas-liquid separator (2). Gas composition sensors (47) are fixedly installed inside the bottom sidewall of both the gas-liquid separator (2) and the spray scrubbing tower (3). An alkaline solution connector (48) and an acidic solution connector (49) are fixedly installed inside the top sidewall of the gas-liquid separator (2). A drain connector (410) is provided at the liquid output end of the gas-liquid separator (2). The spray scrubbing tower (3) is provided with a spray assembly (5), which includes multiple sets of spray pipes (51). The input ends of the multiple sets of spray pipes (51) are fixedly installed inside the arc-shaped sidewall of the spray scrubbing tower (3). The output ends of the spray pipes (51) are fixedly installed with multiple sets of annular pipes (52). The horizontal cross-sectional diameter of the multiple sets of annular pipes (52) on a single spray pipe (51) gradually decreases from bottom to top. Multiple equally spaced circular array nozzles (53) are fixedly installed at the bottom of a single annular pipe (52). The number of nozzles (53) is halved as the horizontal cross-sectional diameter of the corresponding annular pipe (52) decreases. The spray scrubbing tower (3) has multiple sets of filter plates (54) fixedly installed inside, and the filter plates (54) are located below the corresponding array of annular tubes (52). An auxiliary component (6) is provided outside the heating chamber (1). The auxiliary component (6) includes a filter (61). The input end of the filter (61) is fixedly installed on the drain connector (410). The output end of the filter (61) is fixedly connected to the input end of the circulating pump (62). A bend (63) is fixedly installed on the output end of the circulating pump (62). A control valve (64) is provided on the bend (63). The bend (63) penetrates the arc-shaped sidewall of the spray washing tower (3). The bent pipe (63) is rotatably mounted on the upper and lower ends of the annular sleeve (68) via a sealed bearing. The annular sleeve (68) has multiple sets of equally spaced circular array cleaning heads (69) integrally formed on it. The cleaning heads (69) are inclined upwards. The bent pipe (63), the annular sleeve (68) and the cleaning heads (69) are internally connected. The annular sleeve (68) and the cleaning heads (69) are provided in multiple sets, and the number of sets is the same as the number of spray pipes (51). The top opening of the cleaning head (69) faces the corresponding annular pipe (52). As the horizontal cross-sectional diameter of the corresponding annular pipe (52) gradually decreases, the length of the corresponding cleaning head (69) gradually decreases. The liquid output from the drain connector (410) enters the auxiliary component (6). The filter (61) filters the liquid to remove impurities. The circulating pump (62) provides the conveying power and conveys the filtered liquid through the bend (63) and control valve (64) to the inside of the spray scrubbing tower (3). The cleaning liquid in the bend (63) enters the ring sleeve (68) and the cleaning head (69). Under the combined action of the liquid jet thrust and the upward thrust of the gas-liquid mixture inside the spray scrubbing tower (3), the ring sleeve (68) rotates automatically around the bend (63), driving the cleaning head (69) to rotate synchronously. The cleaning head (69) is angled upward toward the corresponding ring pipe (52) and nozzle (53) to continuously rotate and rinse the pipe wall of the ring pipe (52) and the nozzle (53).

2. The semiconductor exhaust gas treatment device based on electromagnetic induction heating according to claim 1, characterized in that: A pressure sensor (412) is installed on the air intake pipe (41).

3. The semiconductor exhaust gas treatment device based on electromagnetic induction heating according to claim 1, characterized in that: The spray scrubbing tower (3) is equipped with an exhaust detection mechanism (411) at the top output end.

4. The semiconductor exhaust gas treatment device based on electromagnetic induction heating according to claim 1, characterized in that: A circular cover (65) is fixedly installed on the outside of the bent pipe (63). Multiple sets of equally spaced circumferentially arranged inclined covers (66) are integrally formed on the circular cover (65). The inclined covers (66) are inclined downwards, and multiple through-holes (67) are provided on the lower sidewall of the inclined covers (66). The bent pipe (63), the circular cover (65), and the inclined covers (66) are internally connected. Multiple sets of the circular cover (65), inclined covers (66), and liquid outlets (67) are provided, and the number of these sets is equal to the number of... The number of filter plates (54) is the same. The inclined shroud (66) is located above the corresponding filter plate (54). From the top to the bottom of the spray scrubbing tower (3), the distance between the bottom of the inclined shroud (66) and the top of the corresponding filter plate (54) gradually increases. The liquid enters the annular shroud (65) and the inclined shroud (66) simultaneously through the bent pipe (63) and is sprayed downward through the liquid outlet hole (67) at the bottom of the inclined shroud (66) to backwash the filter plate (54) below.

5. The semiconductor exhaust gas treatment device based on electromagnetic induction heating according to claim 1, characterized in that: The spray scrubbing tower (3) is equipped with an interception component (7). The interception component (7) includes an interception cover (71). The interception cover (71) is fixedly installed inside the top of the spray scrubbing tower (3). Multiple sets of protruding covers (72) are integrally formed on the interception cover (71). The vertical cross section of the protruding cover (72) is trapezoidal. A through-hole (73) is opened on the side wall of the protruding cover (72).

6. The semiconductor exhaust gas treatment device based on electromagnetic induction heating according to claim 5, characterized in that: The interceptor cover (71) and the protruding cover (72) are provided in two sets and are in a mirror fit with each other, that is, the small ends of the two sets of protruding covers (72) are fitted together, and the installation layout of the two sets of protruding covers (72) is perpendicular to each other.

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