Aluminum alloy conductor aerial insulated wire

CN122213554BActive Publication Date: 2026-10-23HEBEI TIANMA CABLE GRP CO LTD
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Patent Information

Application Number
CN202610626676.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-05-08
Publication Date
2026-10-23
Estimated Expiration
2046-05-08

AI Technical Summary

Technical Problem

[0003]针对以上技术问题,本发明提供了一种铝合金导体架空绝缘导线,本发明提供的填料加入铝合金导体架空绝缘导线绝缘层中,提高了架空绝缘导线的韧性和耐磨性,解决了现有的铝合金导体架空绝缘导线耐磨性和韧性不足的问题

Benefits of technology

[0014]与现有技术相比,本发明提供了一种铝合金导体架空绝缘导线,通过在绝缘层中加入经正硅酸乙酯、氯化铝和氯化镁协同改性的酚醛树脂作为填料,提高了架空绝缘导线绝缘层的韧性和耐磨性,其原因在于:正硅酸乙酯在酚醛树脂微球表面形成二氧化硅层,不仅增强了微球与聚丙烯基体的界面结合力,还通过二氧化硅层有效传递和分散外界冲击能量,从而提高韧性;而氯化铝和氯化镁在碱性条件下原位生成层状双金属氢氧化物,其片层结构包覆于微球表面,进一步提升了填料的硬度和耐磨性;酚醛树脂、双金属氢氧化物层与二氧化硅协同,既能借助酚醛树脂的刚性骨架支撑绝缘层结构,减少受力时的塑性变形,又能通过二氧化硅与双金属氢氧化物的界面协同作用,缓解外界冲击对绝缘层内部的损伤,进一步提升韧性和耐磨性。

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Abstract

The application relates to the technical field of cables, and discloses an aluminum alloy conductor overhead insulated wire, which comprises a conductor and an insulating layer covering the surface of the conductor; the conductor is composed of a plurality of aluminum alloy wires; the raw material of the insulating layer comprises the following components in parts by weight: 80-100 parts of polypropylene, 20-30 parts of styrene-butadiene-styrene block copolymer, 20-30 parts of filler, 1-3 parts of lubricant, 1-3 parts of antioxidant and 1-2 parts of compatibilizer; the filler comprises modified phenolic resin microspheres; the raw material of the modified phenolic resin microspheres comprises the following components in parts by weight: 100 parts of phenolic resin microspheres, 15-25 parts of ethyl silicate, 20-30 parts of aluminum chloride and 6-10 parts of magnesium chloride. The insulating layer of the aluminum alloy conductor overhead insulated wire has excellent toughness and wear resistance, and solves the problems of poor wear resistance and toughness of the existing aluminum alloy conductor overhead insulated wire.
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Description

Technical Field

[0001] This invention relates to the field of cable technology, and more specifically, to an aluminum alloy conductor overhead insulated wire. Background Technology

[0002] In the field of power transmission, overhead lines are the core carriers for power transmission. Aluminum alloy conductor overhead insulated wires, with their advantages of light weight, excellent conductivity, and corrosion resistance, are widely used in urban and rural power grid transformation and new energy grid connection. However, during long-term operation, existing insulation materials are easily thinned or even damaged due to wear caused by wind, sand, vibration, and friction and bending during installation. This leads to a decline in insulation performance. Furthermore, insufficient toughness can cause cracking at low temperatures or under impact, accelerating wire aging and affecting the safe operation and service life of the line. Therefore, developing a cable insulation material with both high toughness and high wear resistance is of great significance for improving the overall performance and operational reliability of overhead insulated wires. Summary of the Invention

[0003] To address the above technical problems, this invention provides an aluminum alloy conductor overhead insulated wire. The filler provided by this invention is added to the insulation layer of the aluminum alloy conductor overhead insulated wire, which improves the toughness and wear resistance of the overhead insulated wire and solves the problem of insufficient wear resistance and toughness of existing aluminum alloy conductor overhead insulated wires.

[0004] The specific technical solution of the present invention is as follows: According to one aspect of the present invention, an aluminum alloy conductor overhead insulated wire is provided, comprising a conductor and an insulating layer covering the surface of the conductor; the conductor is formed by stranding multiple aluminum alloy wires; the raw material of the insulating layer comprises the following components in parts by weight: 80-100 parts of polypropylene, 20-30 parts of styrene-butadiene-styrene block copolymer, 20-30 parts of filler, 1-3 parts of lubricant, 1-3 parts of antioxidant, and 1-2 parts of compatibilizer; The filler includes modified phenolic resin microspheres; The raw materials for the modified phenolic resin microspheres include the following components by weight: 100 parts of phenolic resin microspheres, 15-25 parts of tetraethyl orthosilicate, 20-30 parts of aluminum chloride, and 6-10 parts of magnesium chloride.

[0005] In the above technical solution, the preparation method of the modified phenolic resin microspheres includes the following steps: A1. After dispersing the phenolic resin microspheres evenly in solvent I, add surfactant and ammonia water and mix to obtain premix solution I; A2. Tetraethyl orthosilicate was added to premixed solution I and mixed. After filtration, drying and calcination, silica-supported modified phenolic resin microspheres were obtained. A3. Add silica-supported modified phenolic resin microspheres to an alkaline solution and mix to obtain premixed solution II. Add magnesium chloride and aluminum chloride to solvent II and mix to obtain premixed solution III. A4. Add premixed liquid III to premixed liquid II and mix. After filtration and drying, the modified phenolic resin microspheres are obtained.

[0006] In the above technical solution, in step A1, the amount of surfactant added is 1% to 3% of the mass of the phenolic resin microspheres.

[0007] In the above technical solution, the mixing time in step A2 is 4~7 hours.

[0008] In the above technical solution, in step A4, the mixing temperature is 60~70℃ and the mixing time is 5~7h.

[0009] In the above technical solution, the filler also includes bamboo charcoal powder and hollow glass microspheres.

[0010] In the above technical solution, the mass ratio of the modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres is 8:3:1 to 3, for example, it can be 8:3:1, 8:3:2, or 8:3:3, preferably 8:3:2.

[0011] In the above technical solution, the lubricant includes one or both of oxidized polyethylene wax and white oil.

[0012] In the above technical solution, the antioxidant includes one or more of antioxidant 1010, antioxidant 168, and antioxidant 1076.

[0013] In the above technical solution, the compatibilizer includes one or both of maleic anhydride-grafted polyethylene and maleic anhydride-grafted polypropylene.

[0014] Compared with existing technologies, this invention provides an aluminum alloy conductor overhead insulated wire. By adding phenolic resin, which has been synergistically modified with tetraethyl orthosilicate, aluminum chloride, and magnesium chloride as a filler to the insulation layer, the toughness and wear resistance of the overhead insulated wire insulation layer are improved. The reason is that tetraethyl orthosilicate forms a silica layer on the surface of phenolic resin microspheres, which not only enhances the interfacial bonding force between the microspheres and the polypropylene matrix, but also effectively transmits and disperses external impact energy through the silica layer, thereby improving toughness. Aluminum chloride and magnesium chloride generate layered bimetallic hydroxides in situ under alkaline conditions, and their layered structure coats the surface of the microspheres, further improving the hardness and wear resistance of the filler. The synergistic effect of phenolic resin, bimetallic hydroxide layer, and silica not only uses the rigid skeleton of phenolic resin to support the insulation layer structure and reduce plastic deformation under stress, but also mitigates the damage to the interior of the insulation layer caused by external impact through the interfacial synergistic effect of silica and bimetallic hydroxide, further improving toughness and wear resistance. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this invention more apparent, the invention is described in detail below. It should be understood that the invention is not limited to the description herein.

[0016] polypropylene The polypropylene used in this invention has excellent electrical insulation, good heat resistance and chemical stability, which can provide basic insulation protection for overhead insulated conductors; at the same time, its high crystallinity and rigidity help maintain the structural integrity of the insulation layer, and play a supporting role under stress, reducing plastic deformation.

[0017] Styrene-butadiene-styrene block copolymer The styrene-butadiene-styrene block copolymer used in this invention has excellent flexibility, elasticity and impact resistance, and good compatibility with polypropylene. It can improve the toughness, impact resistance and flexural strength of the insulation layer of overhead conductors, and alleviate the problem of brittle fracture of the insulation layer under stress.

[0018] lubricant The lubricant used in this invention is a lubricant known in the art for use in overhead insulated conductors, and this invention is not limited to the lubricants listed below. As examples, the lubricant may be oxidized polyethylene wax, white oil, calcium stearate, or ethylene bis-stearamide. In the aluminum alloy conductor overhead insulated conductor of this invention, the lubricant serves to reduce the frictional resistance of the components of the insulation layer raw material during processing, improve the processing fluidity of the raw material, and simultaneously reduce wear between the components and between the components and the processing equipment during processing, ensuring the quality of the insulation layer molding and improving production efficiency.

[0019] antioxidants The antioxidants used in this invention are known in the art and can be used in overhead insulated conductors, and this invention is not limited to the antioxidants listed below. For example, antioxidants may be antioxidant 1010, antioxidant 168, antioxidant 1076, or antioxidant CA. In the aluminum alloy conductor overhead insulated conductor of this invention, the antioxidants inhibit or delay the thermo-oxidative aging and degradation of organic polymer materials in the insulation layer during processing and use, capture free radicals, and decompose peroxides, thereby improving the thermal stability and long-term service life of the insulation layer, and maintaining the mechanical properties and wear resistance of the insulation layer.

[0020] compatibilizer The compatibilizer used in this invention is a known compatibilizer in the art for use in overhead insulated conductors, and this invention is not limited to the compatibilizers listed below. As examples, the compatibilizer may be maleic anhydride-grafted polyethylene, maleic anhydride-grafted polypropylene, or ethylene-vinyl acetate copolymer. In the aluminum alloy conductor overhead insulated conductor of this invention, the compatibilizer's role is to solve problems such as uneven dispersion and delamination caused by differences in polarity of different components, ensuring uniform mixing of all components and their synergistic effect. This, in turn, guarantees the structural integrity, toughness, and wear resistance of the insulation layer, while improving the processability of the insulation layer raw material, ensuring that the insulation layer can uniformly and tightly coat the surface of the aluminum alloy conductor, and guaranteeing the overall performance and stability of the conductor.

[0021] Aluminum alloy conductor overhead insulated wire The aluminum alloy conductor overhead insulated wire of the present invention includes a conductor and an insulating layer covering the surface of the conductor; the conductor is made of multiple aluminum alloy wires stranded together; the raw materials of the insulating layer include the following components by weight: 80-100 parts of polypropylene, 20-30 parts of styrene-butadiene-styrene block copolymer, 20-30 parts of filler, 1-3 parts of lubricant, 1-3 parts of antioxidant, and 1-2 parts of compatibilizer; The filler includes modified phenolic resin microspheres; The raw materials for the modified phenolic resin microspheres include the following components by weight: 100 parts of phenolic resin microspheres, 15-25 parts of tetraethyl orthosilicate, 20-30 parts of aluminum chloride, and 6-10 parts of magnesium chloride.

[0022] In the aluminum alloy conductor overhead insulated wire, the polypropylene in the insulation layer is 80-100 parts by weight, preferably 85-100 parts, more preferably 85-95 parts, and most preferably 90-95 parts.

[0023] In the aluminum alloy conductor overhead insulated wire, the styrene-butadiene-styrene block copolymer in the insulation layer is 20 to 30 parts by weight, preferably 20 to 28 parts, and more preferably 25 to 28 parts.

[0024] In aluminum alloy conductor overhead insulated wires, the filler in the insulation layer is 20 to 30 parts by weight, preferably 23 to 30 parts, and more preferably 25 to 26 parts.

[0025] In aluminum alloy conductor overhead insulated wires, the lubricant in the insulation layer contains 1 to 3 parts by weight, preferably 1 to 2 parts, and more preferably 1 to 1.5 parts.

[0026] In aluminum alloy conductor overhead insulated wires, the antioxidant in the insulation layer is 1 to 3 parts by weight, preferably 1 to 2 parts, and more preferably 1.5 to 2 parts.

[0027] In aluminum alloy conductor overhead insulated wires, the compatibilizer in the insulation layer contains 1 to 2 parts by weight, preferably 1 to 1.5 parts.

[0028] In the aluminum alloy conductor overhead insulated wire, the weight parts of tetraethyl orthosilicate in the modified phenolic resin microspheres are 15 to 25 parts, preferably 15 to 20 parts, and more preferably 16 to 18 parts.

[0029] In the aluminum alloy conductor overhead insulated wire, the modified phenolic resin microspheres contain 20-30 parts by weight of aluminum chloride, preferably 20-28 parts, more preferably 20-25 parts, and most preferably 21-24 parts.

[0030] In aluminum alloy conductor overhead insulated wires, the modified phenolic resin microspheres contain 6 to 10 parts by weight of magnesium chloride, preferably 6 to 8 parts, and more preferably 7 to 8 parts.

[0031] The aluminum alloy conductor overhead insulated wire of the present invention also includes bamboo charcoal powder and hollow glass microspheres as fillers.

[0032] In the aluminum alloy conductor overhead insulated wire, the mass ratio of modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres in the filler is 8:3:1~3, preferably 8:3:1~2.5, and more preferably 8:3:1.5~2.

[0033] In this invention, the toughness and wear resistance of the insulation layer of the aluminum alloy conductor overhead insulated wire are improved by adding modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres as fillers. The reason is that bamboo charcoal powder has good dispersibility and reinforcing effect, which can further improve the mechanical properties and wear resistance of the insulation layer, and synergistically enhance the structural stability of the insulation layer with modified phenolic resin microspheres; hollow glass microspheres have a certain rigidity, which can help disperse external impact force and alleviate internal damage to the insulation layer. At the same time, the three are combined in a specific mass ratio to form a synergistic effect, jointly filling the internal voids of the insulation layer, optimizing the interface bonding state, and effectively improving the toughness and wear resistance of the insulation layer.

[0034] Preparation method of modified phenolic resin microspheres The present invention also provides a method for preparing the modified phenolic resin microspheres as described above, comprising: A1. After dispersing the phenolic resin microspheres evenly in solvent I, add surfactant and ammonia water and mix to obtain premix solution I; A2. Tetraethyl orthosilicate was added to premixed solution I and mixed. After filtration, drying and calcination, silica-supported modified phenolic resin microspheres were obtained. A3. Add silica-supported modified phenolic resin microspheres to an alkaline solution and mix to obtain premixed solution II. Add magnesium chloride and aluminum chloride to solvent II and mix to obtain premixed solution III. A4. Add premixed solution III to premixed solution II and mix. After filtration and drying, modified phenolic resin microspheres are obtained.

[0035] In the preparation method of modified phenolic resin microspheres, in step A1, the amount of surfactant added is 1% to 3% of the mass of the phenolic resin microspheres.

[0036] In the preparation method of modified phenolic resin microspheres, in step A2, the mixing time is 4~7h.

[0037] In the preparation method of modified phenolic resin microspheres, in step A4, the mixing temperature is 60~70℃ and the mixing time is 5~7h.

[0038] To further illustrate the present invention, the following examples will provide a detailed description. The raw materials used in the following examples and comparative examples of the present invention are all commercially available products, including: polypropylene (model: M800E); styrene-butadiene-styrene block copolymer (model: T161B); oxidized polyethylene wax (model: AC330); maleic anhydride-grafted polyethylene (grafting rate: 1.0%~1.3%); phenolic resin microspheres (average particle size: 5 μm); bamboo charcoal powder (average particle size: 10 μm); and hollow glass microspheres (average particle size: 20 μm).

[0039] Example 1 After mixing 80 parts of polypropylene, 20 parts of styrene-butadiene-styrene block copolymer, 20 parts of filler, 1 part of oxidized polyethylene wax, 1 part of antioxidant 1010 and 1 part of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 1% of the mass of phenolic resin microspheres) and 5 parts of ammonia water are added and mixed to obtain premix solution I; 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 7h. After filtration and drying, the mixture is calcined at 500℃ for 3h to obtain silica-supported modified phenolic resin microspheres; silica-supported modified phenolic resin microspheres are then prepared by adding silica... Silicon dioxide-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silicon dioxide-supported modified phenolic resin microspheres), and mixed to obtain premix solution II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix solution III. Premix solution III was added to premix solution II and mixed at 60℃ for 7 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0040] Example 2 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I; 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-supported modified phenolic resin microspheres; Silica-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silica-supported modified phenolic resin microspheres), and mixed to obtain premix II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0041] Example 3 100 parts of polypropylene, 30 parts of styrene-butadiene-styrene block copolymer, 30 parts of filler, 3 parts of oxidized polyethylene wax, 3 parts of antioxidant 1010 and 2 parts of maleic anhydride grafted polyethylene are mixed evenly and then extruded and coated onto the surface of 7 intertwined aluminum alloys to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 3% of the mass of phenolic resin microspheres) and 10 parts of ammonia water are added and mixed to obtain premix solution I; 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 4 hours. After filtration and drying, the mixture is calcined at 600℃ for 2 hours to obtain silica-supported modified phenolic resin microspheres; silica-supported modified phenolic resin microspheres are then prepared by adding silica... Silicon dioxide-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silicon dioxide-supported modified phenolic resin microspheres), and mixed to obtain premix solution II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix solution III. Premix solution III was added to premix solution II and mixed at 70℃ for 5 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0042] Example 4 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I; 20 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-supported modified phenolic resin microspheres; Silica-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silica-supported modified phenolic resin microspheres), and mixed to obtain premix solution II. 8 parts of magnesium chloride and 25 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix solution III. Premix solution III was added to premix solution II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0043] Example 5 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I; 25 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-supported modified phenolic resin microspheres; silica-supported modified phenolic resin microspheres are then prepared by adding 100 parts of phenolic resin microspheres to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL), dispersing them evenly, then adding hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and calcining them to obtain silica-supported modified phenolic resin microspheres; Silicon dioxide-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silicon dioxide-supported modified phenolic resin microspheres), and mixed to obtain premix solution II. 10 parts of magnesium chloride and 30 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix solution III. Premix solution III was added to premix solution II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0044] Example 6 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler consists of modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres in a mass ratio of 8:3:1. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-loaded... Modified phenolic resin microspheres: Silica-loaded modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silica-loaded modified phenolic resin microspheres), and mixed to obtain premix II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0045] Example 7 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler consists of modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres in a mass ratio of 8:3:2. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-loaded... Modified phenolic resin microspheres: Silica-loaded modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silica-loaded modified phenolic resin microspheres), and mixed to obtain premix II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0046] Example 8 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler consists of modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres in a mass ratio of 8:3:3. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-loaded... Modified phenolic resin microspheres: Silica-loaded modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for the silica-loaded modified phenolic resin microspheres), and mixed to obtain premix II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0047] Example 9 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler consists of modified phenolic resin microspheres and bamboo charcoal powder in a mass ratio of 8:3. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-supported modified phenolic resin microspheres. Resin microspheres: Silica-supported modified phenolic resin microspheres were added to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for silica-supported modified phenolic resin microspheres), and mixed to obtain premix II. 6 parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), and mixed to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0048] Example 10 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler consists of modified phenolic resin microspheres and hollow glass microspheres in a mass ratio of 8:2. The preparation method of the modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6 hours. After filtration and drying, the mixture is calcined at 550℃ for 2.5 hours to obtain silica-supported modified phenolic resin microspheres. Phenolic resin microspheres were prepared by adding silica-supported modified phenolic resin microspheres to an alkaline aqueous solution (the alkaline aqueous solution consisted of 1g:5g:50mL of calcium carbonate, sodium hydroxide, and water, with a mass-to-volume ratio of 1g:20mL for silica-supported modified phenolic resin microspheres), mixing to obtain premix II. Six parts of magnesium chloride and 20 parts of aluminum chloride were added to water (the mass-to-volume ratio of magnesium chloride and water was 1g:10mL), mixing to obtain premix III. Premix III was added to premix II and mixed at 65℃ for 6 hours. After filtration and drying, modified phenolic resin microspheres were obtained.

[0049] Comparative Example 1 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of phenolic resin microspheres, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene were mixed evenly and then extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire.

[0050] Comparative Example 2 After mixing 90 parts of polypropylene, 25 parts of styrene-butadiene-styrene block copolymer, 25 parts of filler, 2 parts of oxidized polyethylene wax, 2 parts of antioxidant 1010, and 1.5 parts of maleic anhydride grafted polyethylene evenly, the mixture is extruded and coated onto the surface of 7 intertwined aluminum alloy strands to obtain an aluminum alloy conductor overhead insulated wire. The filler is modified phenolic resin microspheres. The preparation method of modified phenolic resin microspheres includes the following steps: 100 parts of phenolic resin microspheres are added to anhydrous ethanol (the mass-volume ratio of phenolic resin microspheres to anhydrous ethanol is 1g:10mL) and dispersed evenly. Then, hexadecyltrimethylammonium bromide (hexadecyltrimethylammonium bromide is 2% of the mass of phenolic resin microspheres) and 7 parts of ammonia water are added and mixed to obtain premix solution I. 15 parts of tetraethyl orthosilicate are added to premix solution I and mixed for 6h. After filtration and drying, the mixture is calcined at 550℃ for 2.5h to obtain modified phenolic resin microspheres.

[0051] Test case The insulation layers of the aluminum alloy conductor overhead insulated wires prepared in Experimental Examples 1-10 and Comparative Example 2 were tested according to the following methods: 1. Bending strength: The bending strength of the insulation layer shall be tested according to the method specified in GB / T 9341-2008 "Determination of bending properties of plastics"; 2. Wear amount: The wear amount of the insulation layer shall be tested according to the method specified in GB / T 3960-2016 "Plastics Sliding Friction and Wear Test Method"; The test results are shown in Table 1 below.

[0052] Table 1. Performance test results of the insulation layer of aluminum alloy conductor overhead insulated wires in Examples 1-10 and Comparative Examples 1-2

[0053] The bending strength of Examples 1-5 is higher than that of Comparative Examples 1-2, and the wear of Examples 1-5 is less than that of Comparative Examples 1-2. This indicates that the present invention improves the toughness and wear resistance of the insulation layer of overhead insulated conductors by adding phenolic resin synergistically modified with tetraethyl orthosilicate, aluminum chloride and magnesium chloride as a filler.

[0054] The bending strength of Examples 6-8 is higher than that of Examples 2 and Examples 9-10, and the wear of Examples 6-8 is less than that of Examples 2 and Examples 9-10. This indicates that the present invention improves the toughness and wear resistance of the insulation layer of overhead insulated conductors by adding phenolic resin modified by tetraethyl orthosilicate, aluminum chloride and magnesium chloride, bamboo charcoal powder and hollow glass microspheres as fillers.

[0055] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An aluminum alloy conductor overhead insulated wire, characterized in that, It includes a conductor and an insulating layer covering the surface of the conductor; the conductor is made of multiple strands of aluminum alloy wire; the raw material of the insulating layer includes the following components by weight: 80-100 parts of polypropylene, 20-30 parts of styrene-butadiene-styrene block copolymer, 20-30 parts of filler, 1-3 parts of lubricant, 1-3 parts of antioxidant, and 1-2 parts of compatibilizer; The filler includes modified phenolic resin microspheres; The raw materials for the modified phenolic resin microspheres include the following components by weight: 100 parts of phenolic resin microspheres, 15-25 parts of tetraethyl orthosilicate, 20-30 parts of aluminum chloride, and 6-10 parts of magnesium chloride. The preparation method of the modified phenolic resin microspheres includes the following steps: A1. After dispersing the phenolic resin microspheres evenly in solvent I, add surfactant and ammonia water and mix to obtain premix solution I; A2. Tetraethyl orthosilicate was added to premixed solution I and mixed. After filtration, drying and calcination, silica-supported modified phenolic resin microspheres were obtained. A3. Add silica-supported modified phenolic resin microspheres to an alkaline solution and mix to obtain premixed solution II. Add magnesium chloride and aluminum chloride to solvent II and mix to obtain premixed solution III. A4. Add premixed liquid III to premixed liquid II and mix. After filtration and drying, the modified phenolic resin microspheres are obtained.

2. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, In step A1, the amount of surfactant added is 1% to 3% of the mass of the phenolic resin microspheres.

3. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, In step A2, the mixing time is 4 to 7 hours.

4. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, In step A4, the mixing temperature is 60~70℃ and the mixing time is 5~7h.

5. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, The fillers also include bamboo charcoal powder and hollow glass microspheres.

6. The aluminum alloy conductor overhead insulated wire according to claim 5, characterized in that, The mass ratio of the modified phenolic resin microspheres, bamboo charcoal powder, and hollow glass microspheres is 8:3:1~3.

7. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, The lubricant includes one or both of oxidized polyethylene wax and white oil.

8. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, The antioxidant includes one or more of antioxidant 1010, antioxidant 168, and antioxidant 1076.

9. The aluminum alloy conductor overhead insulated wire according to claim 1, characterized in that, The compatibilizer includes one or both of maleic anhydride-grafted polyethylene and maleic anhydride-grafted polypropylene.

Citation Information

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