光子芯片测试方法及光电集成测试装置
The optoelectronic integrated testing device enables efficient and accurate testing of photonic chips, solving the problems of complexity and insufficient applicability of photonic chip testing systems, and promoting the rapid iteration and industrialization of photonic chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NAT UNIV OF DEFENSE TECH
- Filing Date
- 2026-05-18
- Publication Date
- 2026-07-17
AI Technical Summary
The development of photonic chip testing methods and devices is lagging behind. The testing systems are complex and have limited applicability to photonic chips with different characteristics. Further improvements are urgently needed, which affects the iteration cycle of photonic chip development and the industrialization process.
This invention provides a photonic chip testing method and an optoelectronic integrated testing device. By integrating a pulsed light source system and a signal acquisition system, it enables efficient testing of photonic chips. The method includes vertical coupling of the fiber array of the pulsed light source system and electrical signal conversion of the signal acquisition system, thereby improving the testing capability for large-scale, high-loss photonic chips.
It enables rapid and accurate automated testing of photonic chips, eliminates measurement errors, improves testing efficiency and compatibility, supports the entire lifecycle from wafer-level R&D to chip-level mass production, and shortens the iteration cycle of photonic chips.
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Figure CN122217599B_ABST