Integrated antenna device and method of manufacturing the same

Abstract

The present application provides an integrated antenna device, including a substrate, at least one antenna, a radio frequency integrated circuit, a plurality of metal pillars, an encapsulation body and a heat conduction structure. The antenna and the radio frequency integrated circuit are respectively arranged on a first surface and a second surface of the substrate, and a third surface of the radio frequency integrated circuit faces the second surface. A plurality of first ends of the metal pillars are arranged on the second surface, and the metal pillars surround the radio frequency integrated circuit. The encapsulation body is arranged on the second surface and encapsulates at least a part of the radio frequency integrated circuit and at least a part of each of the metal pillars. The heat conduction structure is arranged above a fourth surface of the radio frequency integrated circuit and is thermally coupled to the radio frequency integrated circuit. An outer surface of the heat conduction structure is flush with a plurality of second ends of the metal pillars, and the outer surface and the second ends are exposed to the encapsulation body. The integrated antenna device of the present application has good heat dissipation performance.

Description

Technical Field

[0001] This invention relates to an integrated antenna device and its manufacturing method, and more particularly to an integrated antenna device with good heat dissipation performance and its manufacturing method. Background Technology

[0002] In current antenna module architectures, the greater the distance between the RF integrated circuit (IC) and the antenna, the more severe the signal loss caused by the electromagnetic path. Furthermore, longer signal lines between the IC and antenna lead to more severe near-end crosstalk (NEXT) and far-end crosstalk (FEXT). One solution to these problems is to integrate the IC and antenna together. However, since both the IC and antenna generate significant heat during operation, improving heat dissipation efficiency is a key area of ​​research in this field. Summary of the Invention

[0003] This invention provides an integrated antenna device with good heat dissipation performance.

[0004] An integrated antenna device of the present invention includes a substrate, at least one antenna, a radio-frequency integrated circuit (RFIC), a plurality of metal pillars, an encapsulation body, and a thermally conductive structure. The substrate includes opposing first and second surfaces. At least one antenna is disposed on the first surface. The RFIC is disposed on the second surface and includes opposing third and fourth surfaces, with the third surface facing the second surface. The metal pillars each include opposing first and second ends, the first ends being disposed on the second surface, and the metal pillars surrounding the RFIC. The encapsulation body is disposed on the second surface, encapsulating at least a portion of the RFIC and at least a portion of each of the metal pillars. The thermally conductive structure is disposed above the fourth surface and thermally coupled to the RFIC, with its outer surface exposed above the encapsulation body, flush with and exposed above the second ends of the metal pillars.

[0005] In one embodiment of the invention, the above-described encapsulation body exposes another portion of the radio frequency integrated circuit and another portion of each of these metal pillars.

[0006] In one embodiment of the present invention, the encapsulation body encapsulates the entire radio frequency integrated circuit and encapsulates the metal pillars at locations other than the second ends.

[0007] In one embodiment of the present invention, the above-mentioned integrated antenna device further includes a thermal interlayer located between the thermally conductive structure and the radio frequency integrated circuit and respectively connecting the thermally conductive structure and the radio frequency integrated circuit.

[0008] In one embodiment of the present invention, the thermal intermediary layer described above comprises a conductive material.

[0009] In one embodiment of the present invention, the thickness of the thermal intermediary layer is less than 20 micrometers.

[0010] In one embodiment of the present invention, the thermal conductivity of the material of the above-mentioned thermally conductive structure is greater than or equal to 200 W / mK.

[0011] In one embodiment of the present invention, the above-mentioned heat-conducting structure is a heat-conducting plate.

[0012] In one embodiment of the present invention, the above-described thermally conductive structure includes a plurality of thermally conductive pillars separated from each other, which are encapsulated by another encapsulating body.

[0013] A method for manufacturing an integrated antenna device according to the present invention includes: providing a circuit board assembly, wherein the circuit board assembly includes a substrate, at least one antenna, and at least one radio frequency integrated circuit (RF IC), the substrate including opposing first and second surfaces, at least one antenna disposed on the first surface, the RF IC disposed on the second surface, each RF IC including opposing third and fourth surfaces, the third surface facing the second surface; aligning at least one set of metal pillars to the second surface of the substrate, wherein each set of metal pillars includes a plurality of metal pillars surrounding a corresponding RF IC, each metal pillar including a plurality of opposing first ends and a plurality of second ends, the first ends being disposed on the second surface; disposing an encapsulating adhesive to the second surface of the substrate and curing it into an encapsulation body to encapsulate at least a portion of each RF IC and at least a portion of each of the metal pillars; and disposing at least one thermally conductive structure to at least one RF IC, wherein each thermally conductive structure is disposed above the fourth surface of the corresponding RF IC and thermally coupled to the corresponding RF IC.

[0014] In one embodiment of the present invention, the aforementioned at least one antenna includes multiple antennas, at least one radio frequency integrated circuit includes multiple radio frequency integrated circuits, at least one set of metal pillars includes multiple sets of metal pillars, at least one thermal conductive structure includes multiple thermal conductive structures, the substrate is divided into multiple sub-regions arranged in arrays, these sub-regions are separated by multiple pre-cut lines, the antennas, the radio frequency integrated circuits, the sets of metal pillars, and the thermal conductive structures are respectively disposed in these sub-regions, and further includes cutting the encapsulation and circuit board assembly along the pre-cut lines to obtain multiple integrated antenna devices, wherein the outer surface of the thermal conductive structure of each of these integrated antenna devices is exposed on the corresponding encapsulation, and the outer surface is flush with the second ends of the corresponding metal pillars.

[0015] In one embodiment of the present invention, the step of aligning each group of metal pillars to the second surface of the substrate further includes covering the second ends of the metal pillars in each group of metal pillars with a hot melt adhesive to position the metal pillars.

[0016] In one embodiment of the invention, after the step of curing the encapsulating colloid into an encapsulation, the invention further includes heating to remove the hot melt colloid, thereby exposing the second ends.

[0017] In one embodiment of the present invention, prior to the step of setting each thermally conductive structure to the fourth surface of the corresponding radio frequency integrated circuit, it further includes setting at least one thermal intermediary layer to at least one radio frequency integrated circuit, wherein each thermal intermediary layer is set on the fourth surface of the corresponding radio frequency integrated circuit, and in the step of setting each thermally conductive structure to the fourth surface of the corresponding radio frequency integrated circuit, each thermally conductive structure is set on the corresponding thermal intermediary layer to be thermally coupled to the corresponding radio frequency integrated circuit.

[0018] In one embodiment of the present invention, after the steps of setting each heat-conducting structure to the fourth surface of the corresponding radio frequency integrated circuit, the outer surface of each heat-conducting structure is exposed to the encapsulation, and the outer surface is flush with the second ends of the corresponding metal pillars.

[0019] In one embodiment of the present invention, the steps of setting each heat-conducting structure to the fourth surface of the corresponding radio frequency integrated circuit and thermally coupling the heat-conducting structure to the radio frequency integrated circuit are performed before the step of aligning each set of metal pillars to the second surface of the substrate.

[0020] In one embodiment of the present invention, prior to the step of setting each thermally conductive structure to the fourth surface of the corresponding radio frequency integrated circuit, it further includes setting at least one thermal intermediary layer to at least one radio frequency integrated circuit, wherein each thermal intermediary layer is set on the fourth surface of the corresponding radio frequency integrated circuit, and in the step of setting each thermally conductive structure to the fourth surface of the corresponding radio frequency integrated circuit, each thermally conductive structure is set on the corresponding thermal intermediary layer to be thermally coupled to the corresponding radio frequency integrated circuit.

[0021] In one embodiment of the present invention, in the step of curing the encapsulating colloid into an encapsulation body, the encapsulating colloid covers each set of metal pillars, the corresponding radio frequency integrated circuit and the thermal conductive structure, wherein the height of each set of metal pillars protruding from the second surface is greater than the height of the thermal conductive structure relative to the second surface.

[0022] In one embodiment of the invention, after the step of curing the encapsulating colloid into an encapsulation body, the process further includes grinding the encapsulation body until the outer surfaces of each thermally conductive structure are exposed in the encapsulation body and are flush with the second ends of the corresponding metal pillars.

[0023] A method for manufacturing an integrated antenna device according to the present invention includes: providing a circuit board assembly, wherein the circuit board assembly includes a substrate and at least one antenna, the substrate including opposing first and second surfaces, and at least one antenna disposed on the first surface; aligning at least one radio frequency integrated circuit module to the second surface of the substrate, wherein each radio frequency integrated circuit module includes a radio frequency integrated circuit and a thermally conductive structure, the radio frequency integrated circuit including opposing third and fourth surfaces, the third surface facing the second surface, and the thermally conductive structure disposed above the fourth surface and thermally coupled to the radio frequency integrated circuit; aligning at least one set of metal pillars to the second surface of the substrate, wherein each set of metal pillars includes a plurality of metal pillars surrounding a corresponding radio frequency integrated circuit module, the metal pillars respectively including opposing plurality of first ends and plurality of second ends, the first ends being disposed on the second surface; disposing an encapsulating colloid to the second surface of the substrate and curing it into an encapsulation body to encapsulate each radio frequency integrated circuit module and the metal pillars; and exposing the thermally conductive structure and the second ends of the metal pillars to the encapsulation body.

[0024] In one embodiment of the present invention, prior to the step of aligning at least one radio frequency integrated circuit module to the second surface of the substrate, the method further includes: providing a first carrier having a first adhesive layer and disposing of a first guide structure above the first carrier, the first guide structure including a plurality of first through holes; extending a plurality of thermally conductive pillars into the first through holes of the first guide structure and contacting a plurality of third ends of the thermally conductive pillars with the first adhesive layer to fix them to the first carrier; disposing another encapsulating colloid to the first carrier and curing it into another encapsulation body to encapsulate the thermally conductive pillars; exposing the third ends of the thermally conductive pillars encapsulated by the other encapsulation body and a plurality of fourth ends relative to the third ends; and disposing the third ends or the fourth ends exposed in the other encapsulation body above the fourth surface of the radio frequency integrated circuit and thermally coupled to the radio frequency integrated circuit.

[0025] In one embodiment of the present invention, prior to the step of aligning at least one set of metal pillars to the second surface of the substrate, the method further includes: providing a shield fixed to a second adhesive layer and providing a second guide structure above the shield, wherein the shield includes a plurality of second through holes and the second guide structure includes a plurality of third through holes, the third through holes being located opposite to the second through holes; extending the metal pillars into the third through holes of the second guide structure and the second through holes of the shield, and fixing the first ends of the metal pillars to the second adhesive layer; moving the metal pillars to a second carrier having a third adhesive layer and contacting the second ends of the metal pillars with the third adhesive layer to fix the metal pillars to the second carrier; and separating the second adhesive layer from the metal pillars, thereby exposing the first ends of the metal pillars fixed to the second carrier.

[0026] In one embodiment of the present invention, after the step of separating the second adhesive layer from the metal pillars, the method further includes: fixing the thermally conductive structure of the radio frequency integrated circuit module to the second carrier, such that the thermally conductive structure is located between the radio frequency integrated circuit and the second carrier, the radio frequency integrated circuit module is surrounded by the metal pillars, and the third surface of the radio frequency integrated circuit is flush with the first ends of the metal pillars.

[0027] In one embodiment of the present invention, after the step of disposing the third or fourth ends of the heat-conducting pillars above the fourth surface of the radio frequency integrated circuit and before aligning the radio frequency integrated circuit module to the second surface of the substrate, the method further includes: fixing the heat-conducting structure of each radio frequency integrated circuit module to a third carrier having a fourth adhesive layer, such that the heat-conducting structure is located between the radio frequency integrated circuit and the third carrier.

[0028] In one embodiment of the present invention, the steps of aligning at least one radio frequency integrated circuit module to the second surface of the substrate and aligning at least one set of metal pillars to the second surface of the substrate are performed simultaneously.

[0029] In one embodiment of the present invention, the step of exposing the first ends of the thermally conductive structures and the metal pillars to the encapsulation further includes: grinding the encapsulation until the second ends of each thermally conductive structure and the corresponding metal pillars are exposed to the encapsulation, and the exposed surface of each thermally conductive structure is flush with the second ends of the corresponding metal pillars.

[0030] Based on the above, the antenna of the integrated antenna device of the present invention is disposed on a first surface of a substrate, and the radio frequency integrated circuit is disposed on a second surface of the substrate. This design allows the antenna and the radio frequency integrated circuit to be integrated together. Furthermore, the first ends of these metal pillars are disposed on the second surface of the substrate, and these metal pillars surround the radio frequency integrated circuit. An encapsulation is disposed on the second surface of the substrate, encapsulating at least a portion of the radio frequency integrated circuit and at least a portion of each of the metal pillars to fix the metal pillars. A thermally conductive structure is disposed above a fourth surface and thermally coupled to the radio frequency integrated circuit. The outer surface of the thermally conductive structure is flush with the second ends of these metal pillars and exposed outside the encapsulation. Therefore, the heat generated by the substrate and the radio frequency integrated circuit can be transferred away through these metal pillars and the thermally conductive structure, achieving a good heat dissipation effect. Attached Figure Description

[0031] Figures 1A to 1B This is a perspective view of an integrated antenna device according to an embodiment of the present invention from different angles;

[0032] Figure 1C yes Figure 1A A cross-sectional schematic diagram;

[0033] Figure 2 This is a cross-sectional schematic diagram of an integrated antenna device according to another embodiment of the present invention;

[0034] Figure 3 This is a schematic flowchart of a method for manufacturing an integrated antenna device according to an embodiment of the present invention;

[0035] Figures 4A to 4G yes Figure 1C A schematic diagram of the manufacturing process of an integrated antenna device;

[0036] Figure 5 This is a schematic flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention;

[0037] Figures 6A to 6G yes Figure 2 A schematic diagram of the manufacturing process of an integrated antenna device;

[0038] Figure 7 This is a cross-sectional schematic diagram of an integrated antenna device according to another embodiment of the present invention;

[0039] Figures 8A to 8I yes Figure 7 A schematic diagram of the manufacturing process of the radio frequency integrated circuit module of the integrated antenna device;

[0040] Figures 9A to 9E yes Figure 7 A schematic diagram of the positioning process of the metal column of the integrated antenna device;

[0041] Figures 10A to 10F yes Figure 7 A schematic diagram of the manufacturing process of an integrated antenna device;

[0042] Figure 11 yes Figure 10A A schematic diagram of another embodiment;

[0043] Figure 12 This is a schematic flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention.

[0044] Explanation of icon numbers

[0045] 100, 100a, 100b: Integrated antenna device;

[0046] 110: substrate;

[0047] 112: First surface;

[0048] 114: Second surface;

[0049] 115: Electrical contacts;

[0050] 116: Subregion;

[0051] 118: Pre-cut line;

[0052] 119: Welding ball;

[0053] 120: Antenna;

[0054] 130: Radio frequency integrated circuits;

[0055] 131: Beamforming integrated circuit;

[0056] 132: Third surface;

[0057] 134: Fourth surface;

[0058] 135: Power amplifier;

[0059] 140: Metal column;

[0060] 142: First end;

[0061] 144: Second end;

[0062] 150, 152: Encapsulating bodies;

[0063] 160, 160b: Thermally conductive structure;

[0064] 162: Thermal conductive column;

[0065] 170: Thermal interlayer;

[0066] 180: Hot melt colloid;

[0067] 184: First adhesive layer;

[0068] 185: First vehicle;

[0069] 186: First guiding structure;

[0070] 187: First perforation;

[0071] 188: Mold;

[0072] 189: Radio frequency integrated circuit module;

[0073] 190: Second adhesive layer;

[0074] 191: Shielding;

[0075] 192: Second perforation;

[0076] 193: Second guiding structure;

[0077] 194: Third perforation;

[0078] 195: Second vehicle;

[0079] 196: Third adhesive layer;

[0080] 197: The third vehicle;

[0081] 198: Fourth adhesive layer;

[0082] 200, 200a, 300: Manufacturing methods for integrated antenna devices;

[0083] 210~240, 310~350: Steps. Detailed Implementation

[0084] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same component symbols are used in the drawings and description to denote the same or similar parts.

[0085] Figures 1A to 1B This is a perspective view of an integrated antenna device according to an embodiment of the present invention. Figure 1C yes Figure 1A A cross-sectional schematic diagram. It should be noted that... Figure 1C yes Figure 1A This is a simplified diagram; the proportions between the components may vary slightly and are for illustrative purposes only.

[0086] Please see Figures 1A to 1C The integrated antenna device 100 of this embodiment includes a substrate 110, at least one antenna 120, a radio frequency integrated circuit 130, a plurality of metal pillars 140, an encapsulation body 150 and a heat-conducting structure 160.

[0087] The substrate 110 includes a first surface 112 and a second surface 114 opposite to each other. At least one antenna 120 is disposed on the first surface 112. In this embodiment, four antennas 120 are used as an example, but this is not a limitation. A radio-frequency integrated circuit (RFIC) 130 is disposed on the second surface 114. Therefore, the antennas 120 and the RFIC 130 are integrated onto the same substrate 110, which can effectively reduce the probability of signal loss and crosstalk interference.

[0088] These metal pillars 140 each include a plurality of opposing first ends 142 and a plurality of second ends 144. The first ends 142 are disposed on the second surface 114, and the metal pillars 140 surround the radio frequency integrated circuit 130. In this embodiment, the radio frequency integrated circuit 130 and the metal pillars 140 are respectively connected to the second surface 114 of the substrate 110 via solder balls 119, but the manner in which the radio frequency integrated circuit 130 and the metal pillars 140 are connected to the second surface 114 of the substrate 110 is not limited thereto. Furthermore, the material of the metal pillars 140 is, for example, copper, but the material of the metal pillars 140 is not limited thereto.

[0089] It is worth mentioning that, in this embodiment, the substrate 110 includes a radio frequency (RF) circuit (not shown), and the second surface 114 of the substrate 110 has a plurality of electrical contacts 115 electrically connected to the RF circuit. Parts of these electrical contacts 115 allow the RF integrated circuit 130 to couple to the antenna 120 through the RF circuit within the substrate 110. Other parts of these electrical contacts 115 allow certain metal pillars 140 to be electrically connected to the RF integrated circuit 130. Still other electrical contacts 115 allow certain metal pillars 140 to couple to the antenna 120.

[0090] In addition, such as Figure 1B As shown, in this embodiment, the radio frequency integrated circuit 130 includes a beamforming integrated circuit 131 (BFIC) and a power amplifier 135 (PA), but the composition of the radio frequency integrated circuit 130 is not limited thereto. Figure 1C As shown, the beamforming integrated circuit 131 of the radio frequency integrated circuit 130 includes a third surface 132 and a fourth surface 134 facing each other, with the third surface 132 facing the second surface 114.

[0091] Encapsulation 150 is disposed on the second surface 114 of substrate 110, encapsulating at least a portion of radio frequency integrated circuit 130 and at least a portion of each of these metal pillars 140, in order to better fix radio frequency integrated circuit 130 and metal pillars 140.

[0092] In this embodiment, the encapsulation 150 exposes another portion of the radio frequency integrated circuit 130 and another portion of each of the metal pillars 140. This allows the radio frequency integrated circuit 130 and the metal pillars 140 to be partially exposed, thereby improving heat dissipation. Of course, the extent of encapsulation by the encapsulation 150 is not limited thereto.

[0093] A thermally conductive structure 160 is disposed above the fourth surface 134 and thermally coupled to the radio frequency integrated circuit 130. In this embodiment, the thermally conductive structure 160 is a heat-conducting plate, but the type of thermally conductive structure 160 is not limited thereto. In this embodiment, the integrated antenna device 100 further includes a thermally insulating layer 170, located between the thermally conductive structure 160 and the radio frequency integrated circuit 130, and connecting the thermally conductive structure 160 and the radio frequency integrated circuit 130 respectively, so that the thermally conductive structure 160 is thermally coupled to the radio frequency integrated circuit 130. Specifically, the thermally insulating layer 170 is used to tightly and firmly bond the beamforming integrated circuit 131 of the radio frequency integrated circuit 130 to the thermally conductive structure 160. In this way, the heat emitted by the beamforming integrated circuit 131 can be well transferred to the thermally conductive structure 160 through the thermally insulating layer 170.

[0094] The thermal conductivity of the material of the thermally conductive structure 160 is greater than or equal to 200 W / mK. The thermally conductive structure 160 can be a conductor or a non-conductor; if grounding is required, the thermally conductive structure 160 can be a conductor. Furthermore, the thermally conductive structure 160 can be a metal, such as aluminum, gold, silver, or copper, but the type of thermally conductive structure 160 is not limited to these. In one embodiment, the thermally conductive structure 160 is, for example, a high thermal conductivity compound such as graphene, silicon carbide, or aluminum nitride, but the type of thermally conductive structure 160 is not limited to these. Additionally, although insulating materials are typically used as the material for the thermally conductive interposer 170, in some embodiments, when the radio frequency integrated circuit 130 needs to achieve grounding through the fourth surface 134, the thermally conductive interposer 170 may contain a conductive material. The thickness of the thermally conductive interposer 170 is less than 20 micrometers, for example, 10 micrometers.

[0095] Depend on Figure 1C As can be seen, the outer surface of the heat-conducting structure 160 is flush with the second ends 144 of the metal pillars 140, and the outer surface of the heat-conducting structure 160 and the second ends 144 of the metal pillars 140 are exposed in the enclosure 150. Therefore, the integrated antenna device 100 can also be optionally disposed on a heat dissipation plane (not shown), and the heat generated by the antenna 120, the substrate 110 and the radio frequency integrated circuit 130 can be transferred away through the metal pillars 140 and the heat-conducting structure 160 to achieve a good heat dissipation effect.

[0096] In this embodiment, the entire heat-conducting structure 160 is exposed outside the encapsulation 150, which increases the contact area with air and improves heat dissipation. Of course, in one embodiment, the heat-conducting structure 160 may also be partially encapsulated by the encapsulation 150, without... Figure 1C For restrictions.

[0097] Figure 2 This is a schematic cross-sectional view of an integrated antenna device according to another embodiment of the present invention. Please refer to... Figure 2 , Figure 2 Integrated antenna device 100a and Figure 1C The main difference in the integrated antenna device 100 is that, in this embodiment, the encapsulation 150 encapsulates the entire radio frequency integrated circuit 130, the thermal interposer 170, and the portion of the thermally conductive structure 160 other than its outer surface, and the portion of the metal pillars 140 other than their second ends 144. Therefore, the encapsulation 150 exposes only the outer surface of the thermally conductive structure 160 and the second ends 144 of the metal pillars 140.

[0098] Furthermore, a plurality of solder balls 119 are disposed on the outer surface of the heat-conducting structure 160 and on the second ends 144 of these metal pillars 140. Of course, in one embodiment, the outer surface of the heat-conducting structure 160 may also be provided with other forms of solder, such as tin sheets or solder paste, without limitation to the drawings.

[0099] This design makes the components of the integrated antenna device 100a more robust, and the heat generated by the RF integrated circuit 130, antenna 120 and substrate 110 can still be transferred to the outside through the outer surface of the thermally conductive structure 160 and the second ends 144 of these metal pillars 140, thus having good heat dissipation performance.

[0100] The following will introduce Figure 1C A method for manufacturing an integrated antenna device 100.

[0101] Figure 3 This is a schematic flowchart of a method for manufacturing an integrated antenna device 100 according to an embodiment of the present invention. Figures 4A to 4G yes Figure 1C A schematic diagram illustrating the manufacturing process of an integrated antenna device. It should be noted that... Figures 4A to 4G This example only illustrates the manufacture of two integrated antenna devices 100, but... Figure 3 The process can also produce a greater number of integrated antenna devices 100, or a single integrated antenna device 100, without being limited by the diagram.

[0102] Please refer to the following first. Figure 3 and Figure 4A The manufacturing method 200 of the integrated antenna device in this embodiment includes the following steps. First, as... Figure 3 Step 210, providing a circuit board assembly. The circuit board assembly includes a substrate 110, at least one antenna 120 and at least one radio frequency integrated circuit 130. The substrate 110 includes opposing first surfaces 112 and second surfaces 114. At least one antenna 120 is disposed on the first surface 112, and the radio frequency integrated circuit 130 is disposed on the second surface 114. Each radio frequency integrated circuit 130 includes opposing third surfaces 132 and fourth surfaces 134, with the third surface 132 facing the second surface 114.

[0103] In this embodiment, the substrate 110 distinguishes multiple sub-regions 116 arranged in an array, and these sub-regions 116 are separated by multiple pre-cut lines 118. Figure 4A The substrate 110 is illustrated with two sub-regions 116. At least one radio frequency integrated circuit 130 includes multiple radio frequency integrated circuits 130. Figure 4A The diagram uses two examples, but is not a limitation. At least one antenna 120 includes multiple antennas 120. These antennas 120 and two radio frequency integrated circuits 130 are respectively configured in two sub-regions 116.

[0104] Next, as Figure 3 Step 220 and Figure 4B As shown, at least one set of metal pillars 140 are aligned to the second surface 114 of the substrate 110. Each set of metal pillars 140 includes a plurality of metal pillars 140 surrounding a corresponding radio frequency integrated circuit 130. Each metal pillar 140 includes a plurality of opposing first ends 142 and a plurality of second ends 144, with the first ends 142 disposed on the second surface 114.

[0105] In this embodiment, at least one set of metal pillars 140 includes multiple sets of metal pillars 140, such as two sets, which are configured in two sub-regions 116, and the two sets of metal pillars 140 respectively surround two radio frequency integrated circuits 130.

[0106] It is worth mentioning that these metal pillars 140 are arranged in an array. In order to ensure that these metal pillars 140 are well aligned with the electrical contacts on the second surface 114 of the substrate 110, the step of aligning each group of metal pillars 140 to the second surface 114 of the substrate 110 further includes covering the second ends 144 of these metal pillars 140 with a hot melt adhesive 180 to position these metal pillars 140. In one embodiment, the melting point of the hot melt adhesive 180 is less than 85 degrees Celsius.

[0107] In other words, before these metal pillars 140 are disposed on the second surface 114 of the substrate 110, these metal pillars 140 can be arranged, and the second ends 144 are fixed in relative positions by the hot melt adhesive 180. Then, these metal pillars 140, whose relative positions are fixed by the hot melt adhesive 180, are aligned to the second surface 114 of the substrate 110.

[0108] Again, such as Figure 3 Step 230 and Figure 4CAs shown, an encapsulating colloid is applied to the second surface 114 of the substrate 110 and heated in an oven to 120 degrees Celsius for 20 minutes at a relative humidity of 60% or less. Alternatively, it is heated in an oven to 130 degrees Celsius for 30 minutes at a relative humidity of 60% or less. Or, it is heated to 80 degrees Celsius for 60 minutes at a relative humidity of 60% or less. The encapsulating colloid then cures into an encapsulation 150 to encapsulate at least a portion of each of the radio frequency integrated circuits 130 and at least a portion of each of the metal pillars 140.

[0109] In this embodiment, the encapsulation 150 encapsulates a portion of each of the radio frequency integrated circuits 130 and a portion of each of the metal pillars 140, and exposes another portion of each of the radio frequency integrated circuits 130 and another portion of each of the metal pillars 140. The encapsulation 150 is not encapsulated in the hot melt adhesive 180.

[0110] Next, as Figure 4D As shown, after the step of curing the encapsulating colloid into an encapsulation 150, the process further includes heating to remove the hot melt colloid 180, thereby exposing the second ends 144 of the metal pillars 140.

[0111] Again, such as Figure 4E As shown, at least one thermal interposer 170 is provided to at least one radio frequency integrated circuit 130, wherein each thermal interposer 170 is disposed on the fourth surface 134 of the corresponding radio frequency integrated circuit 130. In this embodiment, the number of thermal interposers 170 is two, corresponding to the number of radio frequency integrated circuits 130.

[0112] like Figure 3 Step 240 and Figure 4F As shown, at least one thermally conductive structure 160 is provided to at least one radio frequency integrated circuit 130, wherein each thermally conductive structure 160 is disposed above the fourth surface 134 of the corresponding radio frequency integrated circuit 130, and each thermally conductive structure 160 is thermally coupled to the corresponding radio frequency integrated circuit 130. Specifically, in this embodiment, the at least one thermally conductive structure 160 includes multiple thermally conductive structures 160, such as two. Each thermally conductive structure 160 is disposed on a corresponding thermal interposer layer 170 to thermally couple to the corresponding radio frequency integrated circuit 130.

[0113] Finally, as Figure 4G As shown, the encapsulation 150 and circuit board assembly are cut along pre-cut lines 118 to obtain multiple integrated antenna devices 100. The outer surface of the thermally conductive structure 160 of each of these integrated antenna devices 100 is exposed outside the corresponding encapsulation 150. In this embodiment, the thickness of the thermally conductive structure 160 can be selected so that the outer surface of each thermally conductive structure 160 is flush with the second ends 144 of the corresponding metal pillars 140.

[0114] An integrated antenna device 100 can be manufactured in the above manner. The heat generated by this integrated antenna device 100 can be transferred away through these metal pillars 140 and the heat-conducting structure 160, thereby achieving a good heat dissipation effect.

[0115] The following will introduce Figure 2 A method for manufacturing an integrated antenna device 100a.

[0116] Figure 5 This is a schematic flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention. Figures 6A to 6G yes Figure 2 A schematic diagram illustrating the manufacturing process of an integrated antenna device. Similarly, Figures 6A to 6G This is only an illustrative example of manufacturing two integrated antenna devices 100a, but... Figure 5 The process can also produce a greater number of integrated antenna devices 100a, or a single integrated antenna device 100a, without being limited by the drawings.

[0117] The manufacturing method 200a for an integrated antenna device includes the following steps: Please refer to [the relevant documentation / reference]. Figure 5 and Figure 6A First, such as Figure 5 Step 210, providing a circuit board assembly. The circuit board assembly includes a substrate 110, at least one antenna 120 and at least one radio frequency integrated circuit 130. The substrate 110 includes opposing first surfaces 112 and second surfaces 114. At least one antenna 120 is disposed on the first surface 112, and the radio frequency integrated circuit 130 is disposed on the second surface 114. Each radio frequency integrated circuit 130 includes opposing third surfaces 132 and fourth surfaces 134, with the third surface 132 facing the second surface 114.

[0118] In this embodiment, the substrate 110 distinguishes multiple sub-regions 116 arranged in an array, and these sub-regions 116 are separated by multiple pre-cut lines 118. Figure 6A The substrate 110 in the example has two sub-regions 116, but is not limited thereto. At least one radio frequency integrated circuit 130 includes multiple radio frequency integrated circuits 130. Figure 6A Two examples are used, but this is not a limitation. At least one antenna 120 includes multiple antennas 120. These antennas 120 and two radio frequency integrated circuits 130 are respectively configured in two sub-regions 116.

[0119] Next, as Figure 6B As shown, at least one thermal interposer 170 is provided to at least one radio frequency integrated circuit 130, wherein each thermal interposer 170 is disposed on the fourth surface 134 of the corresponding radio frequency integrated circuit 130. In this embodiment, the number of thermal interposers 170 is two, corresponding to the number of radio frequency integrated circuits 130.

[0120] Again, such as Figure 5 Step 240 and Figure 6C As shown, at least one thermally conductive structure 160 is provided to at least one radio frequency integrated circuit 130, wherein each thermally conductive structure 160 is disposed above the fourth surface 134 of the corresponding radio frequency integrated circuit 130, and each thermally conductive structure 160 is thermally coupled to the corresponding radio frequency integrated circuit 130. Specifically, in this embodiment, the at least one thermally conductive structure 160 includes multiple thermally conductive structures 160, such as two. Each thermally conductive structure 160 is disposed on a corresponding thermal interposer layer 170 to thermally couple to the corresponding radio frequency integrated circuit 130.

[0121] Next, as Figure 5 Step 220 and Figure 6D As shown, at least one set of metal pillars 140 are aligned to the second surface 114 of the substrate 110. Each set of metal pillars 140 includes a plurality of metal pillars 140 surrounding a corresponding radio frequency integrated circuit 130. Each metal pillar 140 includes a plurality of opposing first ends 142 and a plurality of second ends 144, with the first ends 142 disposed on the second surface 114.

[0122] In this embodiment, at least one set of metal pillars 140 includes multiple sets of metal pillars 140, such as two sets, which are disposed in two sub-regions 116, and the two sets of metal pillars 140 respectively surround two radio frequency integrated circuits 130, two thermal interposers 170 and two thermally conductive structures 160.

[0123] exist Figure 6D As can be seen, after this step is completed, the height of each group of metal pillars 140 protruding from the second surface 114 is greater than the height of the heat-conducting structure 160 relative to the second surface 114. That is, the second ends 144 of these metal pillars 140 are higher than the outer surface of the heat-conducting structure 160.

[0124] Again, such as Figure 5 Step 230 and Figure 6E As shown, an encapsulating colloid is applied to the second surface 114 of the substrate 110 and cured into an encapsulation 150 to encapsulate at least a portion of each of the radio frequency integrated circuits 130 and at least a portion of each of the metal pillars 140.

[0125] In this embodiment, after this step is completed, the encapsulation 150 encapsulates each of the radio frequency integrated circuits 130, each of the thermal interposers 170, each of the thermally conductive structures 160, and each of the metal pillars 140, with only the second ends 144 of the metal pillars 140 exposed. In other embodiments, the encapsulation 150 may also cover the second ends 144 of the metal pillars 140.

[0126] Next, as Figure 6FAs shown, the encapsulation 150 is ground until the outer surfaces of each thermally conductive structure 160 are exposed outside the encapsulation 150, and the outer surfaces of the thermally conductive structures 160 are flush with the second ends 144 of the corresponding metal pillars 140. Next, a plurality of solder balls 119 are disposed on the outer surfaces of the thermally conductive structures 160 and the second ends 144 of the metal pillars 140. Of course, in one embodiment, the outer surface of the thermally conductive structure 160 may also be provided with other forms of solder, such as solder sheets or solder paste, without limitation to the drawings.

[0127] Finally, as Figure 6G As shown, the encapsulation 150 and circuit board assembly are cut along these pre-cut lines 118 to obtain a plurality of integrated antenna devices 100a. The outer surface of the thermally conductive structure 160 of each of these integrated antenna devices 100a is exposed to the corresponding encapsulation 150, and the outer surface is flush with the second ends 144 of the corresponding metal pillars 140.

[0128] An integrated antenna device 100a can be manufactured using the above method. The heat generated by this integrated antenna device 100a can be transferred away through these metal pillars 140 and the heat-conducting structure 160, thereby achieving a good heat dissipation effect.

[0129] Figure 7 This is a schematic cross-sectional view of an integrated antenna device according to another embodiment of the present invention. Please refer to... Figure 7 , Figure 7 Integrated antenna device 100b and Figure 2 The main difference between the integrated antenna device 100a and the previous one lies in the form of the thermal conductive structures 160 and 160b. In this embodiment, the thermal conductive structure 160b includes a plurality of thermal conductive pillars 162 separated from each other, which are encapsulated and fixed by an encapsulation body 152.

[0130] Similarly, Figure 7 The heat generated by the integrated antenna device 100b can be transferred away through the metal pillars 140 and the heat-conducting pillars 162 of the heat-conducting structure 160b, thus achieving a good heat dissipation effect.

[0131] Next, we will introduce... Figure 7 The manufacturing process of the integrated antenna device 100b. First, let's introduce... Figure 7 The manufacturing process of the radio frequency integrated circuit module 189 in the integrated antenna device 100b.

[0132] Figures 8A to 8I yes Figure 7 A schematic diagram illustrating the manufacturing process of the RF integrated circuit module for an integrated antenna device. Please refer to [the relevant documentation / reference]. Figure 8AA first carrier 185 having a first adhesive layer 184 is provided, and a first guide structure 186 is disposed above the first carrier 185, the first guide structure 186 including a plurality of first perforations 187.

[0133] Next, please refer to Figure 8B This allows multiple heat-conducting pillars 162 to extend into the first through-holes 187 of the first guiding structure 186, and for multiple ends of these heat-conducting pillars 162 to contact the first adhesive layer 184, thereby fixing them to the first carrier 185. Furthermore, as... Figure 8C As shown, the first guide structure 186 is removed.

[0134] Next, as Figure 8D As shown, the first carrier 185, together with the first adhesive layer 184 and these heat-conducting pillars 162, is placed inside the mold 188. Figure 8E As shown, encapsulating colloid is injected into mold 188 and cured into encapsulation body 152 to encapsulate these heat-conducting pillars 162. Then, as... Figure 8F As shown, the first carrier 185, the first adhesive layer 184, and the heat-conducting pillars 162 encapsulating the encapsulated body 152 are removed from the mold 188. That is, in Figures 8D to 8F In this stage, the encapsulating colloid is placed onto the first carrier 185 and cured into an encapsulation 152 to encapsulate the thermally conductive pillars 162.

[0135] Next, please refer to Figure 8G This exposes the opposite ends of each of the heat-conducting pillars 162 encapsulated by the encapsulation body 152. In this embodiment, this step can be performed by means of grinding or the like to remove the first carrier 185, the first adhesive layer 184, and a portion of the encapsulation body 152.

[0136] Next, please refer to Figure 8H A radio frequency integrated circuit 130 is provided. In this embodiment, a thermally insulating layer 170 is provided on the fourth surface 134 of the radio frequency integrated circuit 130.

[0137] Please see Figure 8I One end of each of the heat-conducting pillars 162 exposed in the encapsulation 152 is positioned above and thermally coupled to the fourth surface 134 of the RF integrated circuit 130. In this embodiment, the ends of the heat-conducting pillars 162 exposed in the encapsulation 152 are connected to the thermal interposer 170 for thermal coupling to the RF integrated circuit 130. In one embodiment, the encapsulation 152 may be selected from a material whose coefficient of thermal expansion is close to that of the RF integrated circuit 130, so that thermal stress can be dispersed and the thermal interposer 170 is less prone to cracking.

[0138] The following is an introduction Figure 7The positioning process of the metal column 140 of the integrated antenna device 100b. Figures 9A to 9E yes Figure 7 A schematic diagram illustrating the positioning process of the metal pillar in the integrated antenna device. Please refer to [the relevant documentation / reference]. Figure 9A A shield 191 is provided fixed to the second adhesive layer 190, and a second guide structure 193 is disposed above the shield 191, wherein the shield 191 includes a plurality of second perforations 192, and the second guide structure 193 includes a plurality of third perforations 194, which are located on the second perforations 192.

[0139] Next, please refer to Figure 9B This allows the metal pillars 140 to extend into the third through-holes 194 of the second guide structure 193 and the second through-holes 192 of the shield 191, and fixes the first ends 142 of the metal pillars 140 to the second adhesive layer 190. Next, please refer to... Figure 9C Remove the second guide structure 193.

[0140] Next, please refer to Figure 9D Flip Figure 9C The structure is such that the metal pillars 140 are moved to the side of the second carrier 195 having the third adhesive layer 196, and the second ends 144 of the metal pillars 140 are brought into contact with the third adhesive layer 196, so that the metal pillars 140 are fixed to the second carrier 195.

[0141] Please see Figure 9E The second adhesive layer 190 is separated from the metal posts 140, exposing the first ends 142 of the metal posts 140 fixed to the second carrier 195. Furthermore, the second adhesive layer 190 and the shield 191 are removed.

[0142] Next, we will introduce Figure 7 The manufacturing process of the integrated antenna device 100b.

[0143] Figures 10A to 10F yes Figure 7 A schematic diagram of the manufacturing process of an integrated antenna device. Figure 11 yes Figure 10A A schematic diagram of another embodiment. Figure 12 This is a schematic flowchart of a method for manufacturing an integrated antenna device according to another embodiment of the present invention.

[0144] Please refer to the following documents first. Figure 10A , Figure 10B and Figure 12The manufacturing method 300 of the integrated antenna device in this embodiment includes the following steps. First, in step 310, a circuit board assembly is provided, wherein the circuit board assembly includes a substrate 110 and at least one antenna 120. The substrate 110 includes a first surface 112 and a second surface 114 opposite to each other, and at least one antenna 120 is disposed on the first surface 112. In this embodiment, the number of antennas 120 is exemplified by two sets, but the number of antennas 120 is not limited thereto.

[0145] Next, as in step 320, at least one radio frequency integrated circuit module 189 is aligned to the second surface 114 of the substrate 110. Each radio frequency integrated circuit module 189 includes a radio frequency integrated circuit 130 and a thermally conductive structure 160b. The radio frequency integrated circuit 130 includes a third surface 132 and a fourth surface 134 facing each other. The third surface 132 faces the second surface 114, and the thermally conductive structure 160b is disposed above the fourth surface 134 and thermally coupled to the radio frequency integrated circuit 130. In this embodiment, two radio frequency integrated circuit modules 189 are used as an example, but the number of radio frequency integrated circuit modules 189 is not limited to this.

[0146] Furthermore, as in step 330, at least one set of metal pillars 140 are aligned to the second surface 114 of the substrate 110. In this embodiment, there are multiple sets of metal pillars 140 surrounding the outside of the radio frequency integrated circuit module 189. Each set of metal pillars 140 includes multiple metal pillars 140 surrounding the corresponding radio frequency integrated circuit module 189. Each metal pillar 140 includes multiple opposing first ends 142 and multiple second ends 144. The first ends 142 face and are disposed on the second surface 114.

[0147] It is worth mentioning that, in this embodiment, before performing steps 320 and 330, the thermally conductive structure 160b of the RF integrated circuit module 189 is first fixed to the third adhesive layer 196 on the second carrier 195, so that the thermally conductive structure 160b is located between the RF integrated circuit 130 and the second carrier 195. Figure 10A As shown, the radio frequency integrated circuit module 189 is surrounded by these metal pillars 140, and the third surface 132 of the radio frequency integrated circuit 130 is flush with the first ends 142 of these metal pillars 140. Subsequently, a plurality of solder balls 119 may be disposed on the third surface 132 of the radio frequency integrated circuit 130 and the first ends 142 of these metal pillars 140.

[0148] Next, step 320, which involves aligning at least one RF integrated circuit module 189 to the second surface 114 of the substrate 110, and step 330, which involves aligning at least one set of metal pillars 140 to the second surface 114 of the substrate 110, can be performed simultaneously, thereby reducing the number of steps. The solder balls 119 on the third surface 132 of the RF integrated circuit 130 and the solder balls 119 on the first ends 142 of the metal pillars 140 are connected to the electrical contacts 115 on the second surface 114 of the substrate 110.

[0149] It should be noted that, in another embodiment, the thermally conductive structure 160b of the radio frequency integrated circuit module 189 may not be fixed to the second carrier 195, but may be located on a structure independent of the second carrier 195. Please refer to [link / reference]. Figure 11 , Figure 11 and Figure 10A The main difference is that the thermal conductive structure 160b of each RF integrated circuit module 189 is fixed to the third carrier 197 having the fourth adhesive layer 198, so that the thermal conductive structure 160b is located between the RF integrated circuit 130 and the third carrier 197, and the third carrier 197 is separated from the second carrier 195, which allows for greater flexibility in alignment.

[0150] exist Figure 11 In one embodiment, since the third vehicle 197 is separated from the second vehicle 195, step 320 can be performed before step 330, or step 320 can be performed after step 330, or step 320 and step 330 can be performed simultaneously.

[0151] Next, please return to Figure 10C and Figure 12 In step 340, an encapsulating colloid is applied to the second surface 114 of the substrate 110 and cured into an encapsulation body 150 to encapsulate each radio frequency integrated circuit module 189 and the metal pillars 140. In this embodiment, the encapsulation body 150 is formed in the space between the second surface 114 of the substrate 110 and the third adhesive layer 196, thereby encapsulating each radio frequency integrated circuit module 189 and the metal pillars 140.

[0152] Next, please refer to Figure 10D and Figure 12In step 350, the thermally conductive structures 160b and the second ends 144 of the metal pillars 140 are exposed in the encapsulation 150. In step 350, the second carrier 195 and the third adhesive layer 196 can be removed by grinding the encapsulation 150 until the exposed surfaces of the thermally conductive pillars 162 of each thermally conductive structure 160b and the second ends 144 of the corresponding metal pillars 140 are flush with the encapsulation 150, thereby exposing the thermally conductive pillars 162 of the thermally conductive structure 160b and the second ends 144 of the metal pillars 140. However, the removal method is not limited to this. Next, a plurality of solder balls 119 are disposed on the ends of the thermally conductive pillars 162 of the thermally conductive structure 160b and the second ends 144 of the metal pillars 140.

[0153] Finally, please see Figure 10E and Figure 10F The encapsulation 150 and circuit board assembly are cut along these pre-cut lines 118 to obtain multiple integrated antenna devices 100b. The integrated antenna device 100b can be manufactured in this manner, and the heat generated by this integrated antenna device 100b can be transferred away through the metal pillars 140 and the thermally conductive structure 160b, achieving good heat dissipation. In summary, the antenna of the integrated antenna device of the present invention is disposed on a first surface of a substrate, and the radio frequency integrated circuit is disposed on a second surface of the substrate. This design allows the antenna and the radio frequency integrated circuit to be integrated together. Furthermore, the first ends of these metal pillars are disposed on the second surface of the substrate, and these metal pillars surround the radio frequency integrated circuit. The encapsulation is disposed on the second surface of the substrate, encapsulating at least a portion of the radio frequency integrated circuit and at least a portion of each of these metal pillars to fix the metal pillars. The thermally conductive structure is disposed above a fourth surface and thermally coupled to the radio frequency integrated circuit. The outer surface of the thermally conductive structure is flush with the second ends of these metal pillars and exposed outside the encapsulation. Therefore, the heat generated by the substrate and the radio frequency integrated circuit can be transferred away through these metal pillars and thermally conductive structures, achieving a good heat dissipation effect.

[0154] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated antenna device, characterized in that, include: A substrate, comprising a first surface and a second surface opposite to each other; At least one antenna is disposed on the first surface; A radio frequency integrated circuit is disposed on the second surface, the radio frequency integrated circuit includes opposing third and fourth surfaces, the third surface facing the second surface; Multiple metal pillars, each including multiple opposing first ends and multiple second ends, the multiple first ends being disposed on the second surface, and the multiple metal pillars surrounding the radio frequency integrated circuit; An encapsulation body is disposed on the second surface, encapsulating at least a portion of the radio frequency integrated circuit and at least a portion of each of the plurality of metal pillars; as well as A thermally conductive structure is disposed above the fourth surface and thermally coupled to the radio frequency integrated circuit. The outer surface of the thermally conductive structure is flush with the plurality of second ends of the plurality of metal pillars, and the outer surface and the plurality of second ends are exposed in the encapsulation.

2. The integrated antenna device according to claim 1, characterized in that, The encapsulation body exposes another portion of the radio frequency integrated circuit and another portion of each of the plurality of metal pillars.

3. The integrated antenna device according to claim 1, characterized in that, The encapsulation body encapsulates the entire radio frequency integrated circuit and encapsulates the plurality of metal pillars outside the plurality of second ends.

4. The integrated antenna device according to claim 1, characterized in that, Including: A thermal intermediary layer is located between the thermally conductive structure and the radio frequency integrated circuit, and connects the thermally conductive structure and the radio frequency integrated circuit respectively.

5. The integrated antenna device according to claim 4, characterized in that, The thermal interlayer contains a conductive material.

6. The integrated antenna device according to claim 4, characterized in that, The thickness of the thermal interlayer is less than 20 micrometers.

7. The integrated antenna device according to claim 1, characterized in that, The thermal conductivity of the material of the thermally conductive structure is greater than or equal to 200 W / mK.

8. The integrated antenna device according to claim 1, characterized in that, The heat-conducting structure is a heat-conducting plate.

9. The integrated antenna device according to claim 1, characterized in that, The thermally conductive structure includes a plurality of thermally conductive pillars separated from each other, the plurality of thermally conductive pillars being encapsulated by another encapsulating body.

10. A method for manufacturing an integrated antenna device, characterized in that, include: A circuit board assembly is provided, wherein the circuit board assembly includes a substrate, at least one antenna and at least one radio frequency integrated circuit, the substrate includes opposing first surfaces and second surfaces, the at least one antenna is disposed on the first surface, the radio frequency integrated circuit is disposed on the second surface, and each of the radio frequency integrated circuits includes opposing third surfaces and fourth surfaces, the third surface facing the second surface; At least one set of metal pillars is aligned to the second surface of the substrate, wherein each set of metal pillars includes a plurality of metal pillars surrounding the corresponding radio frequency integrated circuit, and the plurality of metal pillars respectively include a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being disposed on the second surface; An encapsulating colloid is applied to the second surface of the substrate and cured into an encapsulation to encapsulate at least a portion of each of the radio frequency integrated circuits and at least a portion of each of the plurality of metal pillars; as well as At least one thermally conductive structure is provided to the at least one radio frequency integrated circuit, wherein each of the thermally conductive structures is disposed above the fourth surface of the corresponding radio frequency integrated circuit, and each of the thermally conductive structures is thermally coupled to the corresponding radio frequency integrated circuit.

11. The method for manufacturing the integrated antenna device according to claim 10, characterized in that, The at least one antenna includes multiple antennas, the at least one radio frequency integrated circuit includes multiple radio frequency integrated circuits, the at least one set of metal pillars includes multiple sets of metal pillars, the at least one thermal conductive structure includes multiple thermal conductive structures, the substrate is divided into multiple sub-regions arranged in arrays, the multiple sub-regions are separated by multiple pre-cut lines, the multiple antennas, the multiple radio frequency integrated circuits, the multiple sets of metal pillars, and the multiple thermal conductive structures are respectively disposed in the multiple sub-regions, and further includes: The encapsulation and the circuit board assembly are cut along the plurality of pre-cut lines to obtain a plurality of integrated antenna devices, wherein the outer surface of the thermally conductive structure of each of the plurality of integrated antenna devices is exposed on the corresponding encapsulation, and the outer surface is flush with the plurality of second ends of the corresponding plurality of metal pillars.

12. The method for manufacturing the integrated antenna device according to claim 10, characterized in that, The step of aligning each of the groups of metal pillars to the second surface of the substrate further includes: A hot-melt colloid is applied to the plurality of second ends of the plurality of metal pillars in each of the groups of metal pillars to position the plurality of metal pillars.

13. The method for manufacturing the integrated antenna device according to claim 12, characterized in that, After the step of curing the encapsulating colloid into the encapsulation body, the method further includes: Heating is used to remove the hot melt colloid, exposing the plurality of second ends.

14. The method for manufacturing the integrated antenna device according to claim 13, characterized in that, Prior to the step of setting each of the aforementioned thermally conductive structures to the corresponding fourth surface of the radio frequency integrated circuit, the method further includes: At least one thermal interposer layer is disposed on the at least one radio frequency integrated circuit, wherein each thermal interposer layer is disposed on the fourth surface of the corresponding radio frequency integrated circuit, and In the step of setting each of the thermally conductive structures to the fourth surface of the corresponding radio frequency integrated circuit, each of the thermally conductive structures is disposed on the corresponding thermal interposer layer to thermally couple to the corresponding radio frequency integrated circuit.

15. The method for manufacturing the integrated antenna device according to claim 14, characterized in that, After the step of setting each of the thermally conductive structures to the fourth surface of the corresponding radio frequency integrated circuit, the outer surface of each of the thermally conductive structures is exposed to the encapsulation, and the outer surface is flush with the plurality of second ends of the corresponding plurality of metal pillars.

16. The method for manufacturing the integrated antenna device according to claim 10, characterized in that, The step of setting each of the aforementioned thermal conductive structures to the fourth surface of the corresponding radio frequency integrated circuit and thermally coupling the thermal conductive structures to the radio frequency integrated circuit is performed before the step of aligning each of the groups of metal pillars to the second surface of the substrate.

17. The method for manufacturing the integrated antenna device according to claim 16, characterized in that, Prior to the step of setting each of the aforementioned thermally conductive structures to the corresponding fourth surface of the radio frequency integrated circuit, the method further includes: At least one thermal interposer layer is disposed on the at least one radio frequency integrated circuit, wherein each thermal interposer layer is disposed on the fourth surface of the corresponding radio frequency integrated circuit, and In the step of setting each of the thermally conductive structures to the fourth surface of the corresponding radio frequency integrated circuit, each of the thermally conductive structures is disposed on the corresponding thermal interposer layer to thermally couple to the corresponding radio frequency integrated circuit.

18. The method for manufacturing the integrated antenna device according to claim 17, characterized in that, In the step of curing the encapsulating colloid into the encapsulation body, the encapsulating colloid covers each of the groups of metal pillars, the corresponding radio frequency integrated circuit, and the thermally conductive structure, wherein the height of each of the groups of metal pillars protruding from the second surface is greater than the height of the thermally conductive structure relative to the second surface.

19. The method for manufacturing the integrated antenna device according to claim 18, characterized in that, After the step of curing the encapsulating colloid into the encapsulation body, the method further includes: The encapsulation is ground until the outer surface of each of the thermally conductive structures is exposed in the encapsulation and the outer surface is flush with the second ends of the corresponding plurality of metal pillars.

20. A method for manufacturing an integrated antenna device, characterized in that, include: A circuit board assembly is provided, wherein the circuit board assembly includes a substrate and at least one antenna, the substrate including opposing first and second surfaces, and the at least one antenna being disposed on the first surface; At least one radio frequency integrated circuit module is aligned to the second surface of the substrate, wherein each radio frequency integrated circuit module includes a radio frequency integrated circuit and a thermal conductive structure, the radio frequency integrated circuit includes opposing third and fourth surfaces, the third surface faces the second surface, and the thermal conductive structure is disposed above the fourth surface and thermally coupled to the radio frequency integrated circuit; At least one set of metal pillars is aligned to the second surface of the substrate, wherein each set of metal pillars includes a plurality of metal pillars, the plurality of metal pillars surround the corresponding radio frequency integrated circuit module, and the plurality of metal pillars respectively include a plurality of opposing first ends and a plurality of second ends, the plurality of first ends being disposed on the second surface; An encapsulating colloid is applied to the second surface of the substrate and cured into an encapsulation body to encapsulate each of the radio frequency integrated circuit modules and the plurality of metal pillars; as well as The thermally conductive structure and the plurality of second ends of the plurality of metal pillars are exposed outside the encapsulation.

21. The method for manufacturing the integrated antenna device according to claim 20, characterized in that, Prior to the step of aligning the at least one radio frequency integrated circuit module to the second surface of the substrate, the method further includes: A first carrier having a first adhesive layer is provided, and a first guide structure is disposed above the first carrier, the first guide structure including a plurality of first perforations; Multiple heat-conducting pillars are inserted into the multiple first perforations of the first guide structure, and multiple third ends of the multiple heat-conducting pillars are made to contact the first adhesive layer, thereby fixing them to the first carrier. Another encapsulating colloid is applied to the first carrier and cured into another encapsulation body to encapsulate the plurality of thermally conductive pillars; The plurality of third ends of the plurality of heat-conducting pillars encapsulated by the other encapsulating body and the plurality of fourth ends relative to the plurality of third ends are exposed; and The plurality of third ends or the plurality of fourth ends exposed in the other encapsulation are disposed above the fourth surface of the radio frequency integrated circuit and thermally coupled to the radio frequency integrated circuit.

22. The method for manufacturing the integrated antenna device according to claim 20, characterized in that, Prior to the step of aligning the at least one set of metal pillars to the second surface of the substrate, the method further includes: A shield is provided fixed to a second adhesive layer, and a second guiding structure is disposed above the shield, wherein the shield includes a plurality of second perforations, the second guiding structure includes a plurality of third perforations, and the plurality of third perforations are located on the plurality of second perforations; The plurality of metal pillars are inserted into the plurality of third through holes of the second guide structure and the plurality of second through holes of the shield, and the plurality of first ends of the plurality of metal pillars are fixed to the second adhesive layer. Move the plurality of metal pillars to a second carrier having a third adhesive layer, and bring the plurality of second ends of the plurality of metal pillars into contact with the third adhesive layer, thereby fixing the plurality of metal pillars to the second carrier; and The second adhesive layer is separated from the plurality of metal pillars, thereby exposing the plurality of first ends of the plurality of metal pillars fixed to the second carrier.

23. The method for manufacturing the integrated antenna device according to claim 22, characterized in that, Following the step of separating the second adhesive layer from the plurality of metal pillars, the method further includes: The thermally conductive structure of the radio frequency integrated circuit module is fixed to the second carrier, such that the thermally conductive structure is located between the radio frequency integrated circuit and the second carrier. The radio frequency integrated circuit module is surrounded by the plurality of metal pillars, and the third surface of the radio frequency integrated circuit is flush with the plurality of first ends of the plurality of metal pillars.

24. The method for manufacturing the integrated antenna device according to claim 21, characterized in that, After the step of positioning the plurality of third ends or the plurality of fourth ends of the plurality of heat-conducting pillars above the fourth surface of the radio frequency integrated circuit, and before aligning the radio frequency integrated circuit module to the second surface of the substrate, the method further includes: The thermally conductive structure of each of the radio frequency integrated circuit modules is fixed to a third carrier having a fourth adhesive layer, such that the thermally conductive structure is located between the radio frequency integrated circuit and the third carrier.

25. The method for manufacturing the integrated antenna device according to claim 20, characterized in that, The steps of aligning the at least one radio frequency integrated circuit module to the second surface of the substrate and aligning the at least one set of metal pillars to the second surface of the substrate are performed simultaneously.

26. The method for manufacturing the integrated antenna device according to claim 20, characterized in that, The step of exposing the thermally conductive structure and the plurality of first ends of the plurality of metal pillars to the encapsulation further includes: The encapsulation is ground until each of the thermally conductive structures and the corresponding second ends of the plurality of metal pillars are exposed in the encapsulation, and the exposed surfaces of each of the thermally conductive structures are flush with the corresponding second ends of the plurality of metal pillars.

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