Temperature drift compensation module and temperature drift compensation method
By combining piezoelectric material components with a control module in the camera module, the temperature is detected and a driving voltage is applied to control the expansion and contraction of the piezoelectric material components, thus solving the temperature drift problem of the camera module and achieving high-precision, low-cost optical system stability compensation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- YUYAO SUNNY OPTICAL INTELLIGENCE TECH CO LTD
- Filing Date
- 2024-12-13
- Publication Date
- 2026-06-16
AI Technical Summary
Existing camera modules are prone to temperature drift when the ambient temperature changes, which leads to a decrease in image quality and accuracy. Existing solutions are either costly or complex.
By combining piezoelectric material components with a control module, the expansion and contraction of the piezoelectric material components are controlled by detecting temperature and applying a driving voltage, thereby achieving height compensation of the lens body and maintaining the stability of the optical system.
It achieves high-precision adjustment at the micrometer level, responds quickly to environmental changes, reduces costs, eliminates the need for complex mechanical designs or temperature control systems, adapts to various environments, and improves imaging quality and accuracy.
Smart Images
Figure CN122227052A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of optical system stability control technology for camera modules, and in particular to a temperature drift compensation module and a temperature drift compensation method. Background Technology
[0002] The stability of the optical system is a crucial factor affecting camera modules, directly impacting their image quality and accuracy. One factor influencing optical system stability is ambient temperature variation. When ambient temperature changes, camera modules are prone to focus drift, a problem caused by temperature fluctuations. As ambient temperature rises, the volume of objects expands; conversely, as ambient temperature falls, the volume shrinks, affecting parameters such as lens shape, curvature, aperture, center thickness, and lens spacing, ultimately impacting the image quality of the camera module. For some existing large-aperture, high-pixel camera modules, power consumption is high, resulting in significant heat generation during use; therefore, temperature drift is also a more pronounced issue with these modules.
[0003] Currently, existing camera modules typically address temperature drift issues using solutions such as mechanical adjustment or temperature control. Mechanical adjustment methods generally maintain the stability of the optical system through the design and adjustment of mechanical structures, requiring precise mechanical design and manufacturing, resulting in high costs and limited adjustment range and precision. Temperature control methods generally reduce the impact of temperature changes on the optical system by controlling the camera's temperature. This approach requires a complex temperature control system and is significantly affected by ambient temperature. Another approach involves selecting materials with low coefficients of thermal expansion to manufacture the camera module, thus minimizing the impact of temperature changes on the optical system. This approach requires strict control over material selection and manufacturing processes, resulting in high costs. Summary of the Invention
[0004] Therefore, it is necessary to provide a temperature drift compensation module and a temperature drift compensation method to address the serious temperature drift problem in existing camera modules.
[0005] A temperature drift compensation module includes:
[0006] A circuit board, wherein a mounting cavity is provided on the front side of the circuit board;
[0007] A piezoelectric material component is laid in the mounting cavity and electrically connected to the circuit board;
[0008] A photosensitive chip is disposed above the piezoelectric material component and electrically connected to the circuit board;
[0009] A control module, wherein the control module is disposed on the circuit board and electrically connected to the piezoelectric material component; and
[0010] The lens body is disposed on the photosensitive side of the photosensitive chip.
[0011] In one embodiment, the temperature drift compensation module further includes a temperature detection element disposed on the circuit board and electrically connected to the control module.
[0012] In one embodiment, the temperature sensing element is a thermistor, which is disposed on the circuit board and electrically connected to the control module.
[0013] In one embodiment, the temperature drift compensation module further includes a reinforcing plate fixed to the back of the circuit board.
[0014] In one embodiment, the expansion and contraction direction of the piezoelectric material is set to be parallel to the optical axis of the lens body.
[0015] In one embodiment, the expansion and contraction direction of the piezoelectric material is set to be perpendicular to the optical axis of the lens body, and the piezoelectric material abuts against the sidewall of the mounting cavity.
[0016] In one embodiment, both the piezoelectric material and the mounting cavity have annular cross-sections perpendicular to the optical axis of the lens body.
[0017] In one embodiment, the circuit board has a cutout on the front side to form the mounting cavity.
[0018] In one embodiment, the circuit board has a through hole, and the reinforcing plate is disposed on one side of the through hole to form the mounting cavity, and the piezoelectric material component is fixed to the reinforcing plate.
[0019] A temperature drift compensation method includes the following steps:
[0020] Detecting the temperature within the temperature drift compensation module; and
[0021] Based on the detected temperature, a corresponding driving voltage is applied to the piezoelectric material component, causing the piezoelectric material component to expand and contract, thereby moving the photosensitive chip and achieving temperature drift compensation.
[0022] The temperature drift compensation module of this application uses piezoelectric materials for height compensation. By controlling whether voltage is applied to the piezoelectric material and the value of the applied voltage, the height change of the piezoelectric material can be precisely controlled, achieving micron-level high-precision adjustment.
[0023] The temperature drift compensation module of this application has the characteristics of fast response and can quickly realize environmental changes in dynamic environments.
[0024] The piezoelectric material component of this application has a low manufacturing cost, does not require complex mechanical design and manufacturing methods to compensate for height changes, and does not require a complex temperature control system to control the ambient temperature.
[0025] The temperature drift compensation module of this application is not affected by ambient temperature and can maintain a stable optical system in various environments. It has good environmental adaptability and has obvious advantages over existing temperature control schemes. It is more reliable and practical in actual applications.
[0026] The temperature drift compensation module of this application does not require large-scale modifications to the existing structure, is easy to integrate into existing camera designs, can provide a convenient improvement solution for existing cameras, and is conducive to the promotion and application of the technology. Attached Figure Description
[0027] Figure 1 A three-dimensional schematic diagram of a temperature drift compensation module provided in one embodiment of this application;
[0028] Figure 2 A top view schematic diagram of the circuit board of the temperature drift compensation module according to the above embodiments of this application is shown;
[0029] Figure 3 A schematic diagram illustrating the temperature variation with the focal length of the lens body is shown as an example of the temperature drift compensation module of the above embodiments of this application.
[0030] Figure 4 A top view schematic diagram of the mounting cavity of the circuit board of the temperature drift compensation module according to the above embodiments of this application is shown;
[0031] Figure 5 This is a schematic diagram illustrating the steps of a temperature drift compensation method provided in one embodiment of this application.
[0032] Reference numerals: 10, circuit board; 11, mounting cavity; 20, piezoelectric material component; 30, photosensitive chip; 40, lens body; 50, reinforcing plate. Detailed Implementation
[0033] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0039] Given the serious temperature drift problem in existing camera modules, this application provides a temperature drift compensation module and a temperature drift compensation method. This temperature drift compensation module features high-precision adjustment capability, rapid response, low cost, good environmental adaptability, and ease of integration.
[0040] Specifically, please refer to Figure 1 and Figure 2 The temperature drift compensation module of this application may include a circuit board 10, a piezoelectric material component 20, a photosensitive chip 30, a control module, and a lens body 40. The circuit board 10 has a mounting cavity 11 on its front side. The piezoelectric material component 20 is laid within the mounting cavity 11 and is electrically connected to the circuit board 10. The photosensitive chip 30 is disposed above the piezoelectric material component 20 and is electrically connected to the circuit board 10. The control module is disposed on the circuit board 10 and electrically connected to the piezoelectric material component 20. The control module is used to apply a driving voltage to the piezoelectric material component 20. The lens body 40 is disposed on the photosensitive side of the photosensitive chip 30.
[0041] It is understood that the piezoelectric material component 20 is made of piezoelectric material and has good piezoelectric properties. By applying different voltages to the piezoelectric material component 20, its expansion and contraction can be controlled, thereby achieving micron-level height adjustment of the camera. When the lens body 40 experiences temperature drift, the temperature drift compensation module can detect the temperature within the module and then change the driving voltage applied to the piezoelectric material through the control module. This causes a thickness change in the piezoelectric material along the optical axis of the lens body 40, thereby changing the height of the photosensitive chip 30 on the piezoelectric material component 20. This compensates for the change in focal length of the lens body 40, thus avoiding temperature drift and maintaining the stability of the optical system of the lens body 40, improving the imaging quality and accuracy of the camera.
[0042] Compared to existing solutions to the temperature drift problem, the temperature drift compensation module of this application utilizes piezoelectric materials for height compensation. By controlling whether voltage is applied to the piezoelectric material component 20 and the value of the applied voltage, the height change of the piezoelectric material can be precisely controlled, achieving micron-level high-precision adjustment. Due to the excellent response speed of piezoelectric materials, height adjustment can be completed in a very short time. Based on this rapid response characteristic, the temperature drift compensation module of this application can quickly adapt to environmental changes in dynamic environments. Because the manufacturing cost of the piezoelectric material component 20 of this application is low, the temperature drift compensation module of this application does not require complex mechanical design and manufacturing methods to compensate for height changes, nor does it require a complex temperature control system to control ambient temperature, thereby reducing the overall cost of the camera. Since the temperature drift compensation module of this application is unaffected by ambient temperature, it can maintain a stable optical system in various environments, exhibiting good environmental adaptability. Compared with existing temperature control solutions, it has significant advantages and is more reliable and practical in practical applications. The temperature drift compensation module of this application does not require large-scale modifications to existing structures, making it easy to integrate into existing camera designs. It can provide a convenient improvement solution for existing cameras, which is conducive to the promotion and application of the technology.
[0043] Optionally, since some photosensitive chips 30 have built-in temperature detection functions and can output temperature detection signals, while others do not, in some embodiments, the temperature drift compensation module of this application further includes a temperature detection element. This temperature detection element is disposed on the circuit board 10 and electrically connected to the control module. This temperature detection element can detect temperature changes within the lens body 40 in real time and output a temperature signal value to the control module, causing the control module to adjust the driving voltage applied to the piezoelectric material component 20 to compensate for the impact of temperature changes on the stability of the optical system.
[0044] Preferably, in one embodiment, the temperature sensing element is a thermistor, which is disposed on the circuit board 10 and electrically connected to the control module. The thermistor can sense temperature changes and convert them into electrical signals, which are transmitted to the control module of the piezoelectric material component 20 on the circuit board 10. The control module adjusts the voltage applied to the piezoelectric material component 20 according to the electrical signal, causing a thickness change in the piezoelectric material along the optical path to compensate for height changes.
[0045] It is worth noting that the effective focal length of a lens can increase or decrease with rising temperature. Some lenses experience a decrease in effective focal length as temperature increases and an increase as temperature decreases. Therefore, when the temperature rises, the thickness of the piezoelectric material 20 can be increased by applying a positive voltage, and when the temperature decreases, its thickness can be decreased by applying a reverse voltage, thus compensating for the change in focal length of the lens body 40. However, some lenses experience an increase in effective focal length as temperature rises and a decrease as temperature decreases. Therefore, the temperature drift compensation module of this application needs to set voltages at different temperatures according to the actual changes in the effective focal length of the lens to achieve temperature drift compensation.
[0046] like Figure 3 The figure shows a temperature-to-focal-length curve of an example temperature drift compensation module provided in an embodiment of this application. As can be seen from the figure, the effective focal length of the lens body gradually increases as the temperature rises. The control module can calibrate the conversion relationship between the driving voltage and temperature based on the curve, thereby achieving temperature drift compensation.
[0047] Optionally, in some embodiments, the piezoelectric material can be electrically connected to the circuit board by means of gold wire connection, welding, or conductive adhesive bonding.
[0048] Alternatively, in some embodiments, the photosensitive chip can be bonded to the piezoelectric material using adhesive.
[0049] Optionally, in some embodiments, the piezoelectric material can be made of PZT piezoelectric ceramic material or other materials with good piezoelectric properties.
[0050] Furthermore, in some embodiments, the temperature drift compensation module of this application further includes a reinforcing plate 50, which is fixed to the back of the circuit board 10. The reinforcing plate 50 can strengthen the structure of the circuit board 10, prevent the circuit board 10 from having low local structural strength due to the opening of the mounting cavity 11, and enhance the reliability of the temperature drift compensation module.
[0051] Alternatively, in some embodiments, the reinforcing plate may be implemented as a steel sheet or other plate material with high hardness.
[0052] Optionally, in some embodiments, the expansion and contraction direction of the piezoelectric material 20 is set parallel to the optical axis of the lens body 40. When a voltage is applied to the piezoelectric material 20, it can directly expand and contract, thereby moving the photosensitive chip 30 and achieving temperature drift compensation. This expansion and contraction direction is suitable when the expansion and contraction ratio of the piezoelectric material 20 is sufficient.
[0053] Alternatively, due to the limitation of module height, in some embodiments, the piezoelectric material element 20 is implemented as a thin film structure, which can reduce the overall height of the temperature drift compensation module.
[0054] Optionally, due to the limitation of module height, when the height change caused by temperature drift is large, the expansion and contraction of the piezoelectric material component 20 cannot meet the requirements of temperature drift compensation. In some embodiments, the expansion and contraction direction of the piezoelectric material component 20 is set to be perpendicular to the optical axis of the lens body 40, and the piezoelectric material component 20 abuts against the sidewall of the mounting cavity 11. When the piezoelectric material component 20 is subjected to voltage and expands or contracts, the sidewall of the mounting cavity 11 can lock the piezoelectric material component 20, restricting its lateral expansion and contraction, and allowing its expansion and contraction to be conducted longitudinally along the optical axis, thereby achieving temperature drift compensation. In this way, it is possible to avoid affecting the module height.
[0055] Optionally, in some embodiments, the cross-sections of the piezoelectric material 20 and the mounting cavity 11 perpendicular to the optical axis of the lens body 40 are both rectangular.
[0056] Optionally, such as Figure 4 As shown, in some embodiments, both the piezoelectric material component 20 and the mounting cavity 11 have annular cross-sections perpendicular to the optical axis of the lens body 40. By setting the piezoelectric material component 20 and the mounting cavity 11 as annular structures, the locking effect of the mounting cavity 11 can be improved, preventing the piezoelectric material from warping. This annular structure can be implemented as a circular ring, a square ring, or other annular shapes.
[0057] Optionally, in some embodiments, a cutout groove on the front side of the circuit board 10 forms the mounting cavity 11. The piezoelectric material component 20 is disposed within the cutout groove. The sidewall of the cutout groove can serve as a locking structure for securing the piezoelectric material component 20.
[0058] Optionally, in some embodiments, the circuit board 10 has a through hole, and the reinforcing plate 50 covers one side of the through hole to form the mounting cavity 11. The piezoelectric material component 20 is fixed to the reinforcing plate 50. The piezoelectric material component 20 is disposed in the through hole and can be bonded to the reinforcing plate 50 with adhesive. The sidewall of the through hole can serve as a locking structure for securing the piezoelectric material component 20.
[0059] Optionally, in some embodiments, the circuit board 10 has a through hole, the reinforcing plate 50 has a groove, and the reinforcing plate 50 covers one side of the through hole so that the through hole and the groove form the mounting cavity 11. The piezoelectric material 20 is fixed in the groove of the reinforcing plate 50, and the sidewall of the groove and the sidewall of the through hole can both serve as a locking structure for locking the piezoelectric material 20.
[0060] Furthermore, such as Figure 5 As shown, this application also provides a temperature drift compensation method, including the following steps:
[0061] S100, detecting the temperature within the temperature drift compensation module; and
[0062] S200. Based on the detected temperature, a driving voltage is applied to the piezoelectric material to cause the piezoelectric material to expand and contract, thereby moving the photosensitive chip and achieving temperature drift compensation.
[0063] It is understood that when the temperature drift compensation module of this application is compensating for temperature drift, it can detect the temperature inside the temperature drift compensation module, and then, based on the temperature detected by the temperature drift compensation module, refer to the driving voltage required for temperature drift compensation at that temperature, and apply a corresponding driving voltage to the piezoelectric material component, causing the piezoelectric material component to expand and contract, thereby driving the photosensitive chip to move and realize temperature drift compensation.
[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0065] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A temperature drift compensation module, characterized in that, include: A circuit board, wherein a mounting cavity is provided on the front side of the circuit board; A piezoelectric material component is laid in the mounting cavity and electrically connected to the circuit board; A photosensitive chip is disposed above the piezoelectric material component and electrically connected to the circuit board; A control module is disposed on the circuit board and electrically connected to the piezoelectric material component; as well as The lens body is disposed on the photosensitive side of the photosensitive chip.
2. The temperature drift compensation module according to claim 1, characterized in that, The temperature drift compensation module further includes a temperature detection element, which is disposed on the circuit board and electrically connected to the control module.
3. The temperature drift compensation module according to claim 2, characterized in that, The temperature sensing element is a thermistor, which is disposed on the circuit board and electrically connected to the control module.
4. The temperature drift compensation module according to any one of claims 1 to 3, characterized in that, The temperature drift compensation module further includes a reinforcing plate, which is fixed to the back of the circuit board.
5. The temperature drift compensation module according to claim 4, characterized in that, The circuit board has a cutout groove on the front side to form the mounting cavity.
6. The temperature drift compensation module according to claim 4, characterized in that, The circuit board has a through hole, and the reinforcing plate is placed on one side of the through hole to form the mounting cavity. The piezoelectric material component is fixed to the reinforcing plate.
7. The temperature drift compensation module according to any one of claims 1 to 3, characterized in that, The expansion and contraction direction of the piezoelectric material is set to be parallel to the optical axis of the lens body.
8. The temperature drift compensation module according to any one of claims 1 to 3, characterized in that, The expansion and contraction direction of the piezoelectric material is set to be perpendicular to the optical axis of the lens body, and the piezoelectric material abuts against the side wall of the mounting cavity.
9. The temperature drift compensation module according to claim 8, characterized in that, Both the piezoelectric material component and the mounting cavity have annular cross-sections perpendicular to the optical axis of the lens body.
10. A method for compensating for temperature drift, characterized in that, Includes the following steps: Detect the temperature inside the temperature drift compensation module; as well as Based on the detected temperature, a corresponding driving voltage is applied to the piezoelectric material component, causing the piezoelectric material component to expand and contract, thereby moving the photosensitive chip and achieving temperature drift compensation.