Photosensitive assembly, preparation method thereof, camera module and electronic device

Abstract

The application relates to a photosensitive assembly, a preparation method thereof, a camera module and electronic equipment. The photosensitive assembly comprises a circuit board, a color filter, a conductive structure and a photosensitive chip. The color filter comprises a color filter body arranged on the circuit board. The conductive structure is arranged on the color filter body and electrically connected with the circuit board. The photosensitive chip is arranged on the color filter and electrically connected with the conductive structure. The photosensitive chip is arranged on the color filter, and the color filter is arranged on the circuit board, so that the volume of the photosensitive assembly is reduced, the volume of the camera module is reduced, and the miniaturization of the camera module is facilitated.

Description

Technical Field

[0001] This application relates to the field of camera equipment, and more particularly to a photosensitive component and its preparation method, a camera module, and an electronic device. Background Technology

[0002] With the widespread adoption of mobile electronic devices, camera modules used in these devices have been continuously developing and improving. Camera modules are widely used in many fields, such as medical, security, and industrial production. A typical camera module includes a circuit board, a photosensitive chip, a lens mount, and color filters. The photosensitive chip is mounted on the circuit board and connected to it via wire bonding. The color filters are mounted on top of the photosensitive chip via the lens mount. As technology advances, the demand for miniaturization in camera modules is increasing, but structural limitations make it difficult to meet these miniaturization requirements. Summary of the Invention

[0003] In view of the above problems, this application provides a photosensitive component and its preparation method, a camera module and an electronic device, which sets the photosensitive chip on the color filter, which facilitates the miniaturization of the camera module.

[0004] In a first aspect, this application provides a photosensitive component, comprising:

[0005] Circuit board;

[0006] Color filters, including:

[0007] The color filter body is disposed on the circuit board;

[0008] A conductive structure is disposed on the color filter body, and the conductive structure is electrically connected to the circuit board;

[0009] A photosensitive chip is disposed on the color filter, and the photosensitive chip is electrically connected to the conductive structure.

[0010] According to some embodiments of this application, the conductive structure includes a conductive coating, which is disposed on the surface of the color filter body.

[0011] According to some embodiments of this application, the surface of the color filter body is provided with a groove, and the conductive plating layer is disposed in the groove.

[0012] According to some embodiments of this application, the photosensitive chip is disposed on a first surface of the color filter body, and at least a portion of the conductive structure is disposed on a second surface of the color filter body, the second surface being opposite to the first surface.

[0013] According to some embodiments of this application, the color filter body is provided with a through hole, and the conductive structure passes through the through hole.

[0014] According to some embodiments of this application, electronic components are also included, at least a portion of which are disposed on the color filter.

[0015] According to some embodiments of this application, the circuit board is provided with a chip cavity, and the photosensitive chip is located in the chip cavity.

[0016] According to some embodiments of this application, a first adhesive is provided between the circuit board and the color filter, and the first adhesive is located at the edge of the chip cavity.

[0017] Secondly, this application provides a method for preparing the above-mentioned photosensitive component, comprising:

[0018] The conductive structure is incorporated into the color filter body;

[0019] A photosensitive chip is disposed on the color filter body, and the photosensitive chip is connected to the conductive structure;

[0020] The color filter body is placed on the circuit board, and the conductive structure is connected to the circuit board.

[0021] According to some embodiments of this application, the step of setting a conductive structure on the color filter body includes: preparing a conductive coating on the surface of the color filter body.

[0022] According to some embodiments of this application, the preparation method further includes:

[0023] Grooves adapted to the conductive coating are etched on the surface of the color filter body.

[0024] According to some embodiments of this application, the preparation method further includes:

[0025] A through hole is formed in the color filter body; and / or

[0026] Cavities adapted to electronic components are etched on the surface of the color filter body.

[0027] According to some embodiments of this application, the preparation method further includes:

[0028] A resistive plating layer is prepared on the surface of the color filter body.

[0029] According to some embodiments of this application, the preparation method further includes: before the conductive structure is disposed on the color filter body, a light-shielding layer is disposed on the surface of the color filter body.

[0030] According to some embodiments of this application, the step of placing the photosensitive chip on the color filter body includes: bonding the photosensitive chip and the color filter body.

[0031] According to some embodiments of this application, the step of placing the color filter body on the circuit board includes: bonding the color filter body and the circuit board.

[0032] According to some embodiments of this application, the first adhesive between the circuit board and the color filter is located at the edge of the chip cavity of the circuit board.

[0033] According to some embodiments of this application, the method further includes: applying a third adhesive between the photosensitive chip and the circuit board.

[0034] Thirdly, this application provides a camera module, including:

[0035] Lens assembly;

[0036] The lens assembly is connected to the photosensitive component as described above.

[0037] According to some embodiments of this application, the lens assembly includes a lens mount, the lens mount being provided with a receiving cavity, and the photosensitive component being disposed in the receiving cavity.

[0038] According to some embodiments of this application, the lens assembly includes a lens mount disposed on the photosensitive assembly.

[0039] Fourthly, this application provides an electronic device, comprising:

[0040] The electronic device itself;

[0041] The camera module described above is disposed on the electronic device body.

[0042] This application sets a conductive structure on the color filter, sets the photosensitive chip on the color filter, and sets the color filter on the circuit board to reduce the size of the photosensitive component, thereby reducing the size of the camera module and facilitating the miniaturization of the camera module. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without exceeding the scope of protection claimed by this application.

[0044] Figure 1 This is a schematic diagram of the photosensitive component according to an embodiment of this application;

[0045] Figure 2 This is an exploded view of the photosensitive component according to an embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the color filter according to an embodiment of this application;

[0047] Figure 4 This is a schematic diagram of the photosensitive chip disposed on the color filter according to an embodiment of this application;

[0048] Figure 5 This is a schematic diagram of the conductive coating in an embodiment of this application;

[0049] Figure 6 This is a schematic diagram of the wire trough according to an embodiment of this application;

[0050] Figure 7 This is a schematic diagram of electronic components disposed on a color filter according to an embodiment of this application;

[0051] Figure 8 This is a schematic diagram of the circuit board according to an embodiment of this application;

[0052] Figure 9 This is a flowchart of the photosensitive component fabrication method according to an embodiment of this application;

[0053] Figure 10 This is a schematic diagram of a conductive coating deposited on the surface of the color filter body according to an embodiment of this application;

[0054] Figure 11 This is a schematic diagram of the photosensitive chip according to an embodiment of this application;

[0055] Figure 12 This is a schematic diagram of the photosensitive chip being bonded to the color filter according to an embodiment of this application;

[0056] Figure 13 This is a schematic diagram of a gold ball disposed on the color filter body according to an embodiment of this application;

[0057] Figure 14 This is a schematic diagram of applying a first adhesive to a circuit board according to an embodiment of this application;

[0058] Figure 15 This is a schematic diagram of a groove being provided on the filter body according to an embodiment of this application;

[0059] Figure 16 This is a schematic diagram of the light-shielding layer in an embodiment of this application;

[0060] Figure 17 This is a schematic diagram of the cutoff coating in an embodiment of this application;

[0061] Figure 18 This is a schematic diagram of the camera module according to an embodiment of this application;

[0062] Figure 19 This is a schematic diagram of the photosensitive chip disposed on the lens mount according to an embodiment of this application;

[0063] Figure 20A and Figure 20B A schematic diagram of an electronic device according to an example embodiment of this application is shown. Detailed Implementation

[0064] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0065] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0066] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0068] To simplify the disclosure of this application, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0069] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0070] Figure 1 This is a schematic diagram of the photosensitive component according to an embodiment of this application. Figure 2 This is an exploded view of the photosensitive component according to an embodiment of this application, as shown below. Figure 1 and Figure 2 As shown, an embodiment of this application provides a photosensitive component 100, which includes a circuit board 1, a color filter 2, and a photosensitive chip 3. The photosensitive chip 3 is disposed on the color filter 2, and the color filter 2 is disposed on the circuit board 1, which helps to reduce the size of the photosensitive component 100.

[0071] A connector 11 is provided at the end of the circuit board 1. The connector 11 is used to connect the electronic device body to conduct electricity between the circuit board 1 and the electronic device body.

[0072] Figure 3 This is a schematic diagram of the color filter in an embodiment of this application, as shown below. Figure 3 As shown, the color filter 2 includes a color filter body 21 and a conductive structure 22. In the camera module, the color filter 2 is located on the optical axis of the lens assembly. The color filter body 21 is made of a light-transmitting material, capable of filtering out stray light such as infrared rays, thereby improving the image quality of the camera module. The color filter body 21 is disposed on the circuit board 1. Optionally, the color filter body 21 is disposed on the upper surface of the circuit board 1, and the color filter body 21 is bonded to the circuit board 1 by a first adhesive 5. The conductive structure 22 is disposed on the color filter body 21. The conductive structure 22 is made of a conductive material, for example, a metal plating layer. The conductive structure 22 is electrically connected to the circuit board 1. The electrical connection between the conductive structure 22 and the circuit board 1 can be achieved by at least one of the following methods: thermoforming, ultrasonic thermoforming, fusion soldering, and solder paste printing. This application does not limit this method.

[0073] Figure 4 This is a schematic diagram of the photosensitive chip disposed on the color filter according to an embodiment of this application, as shown below. Figure 4As shown, the photosensitive chip 3 is disposed on the color filter body 21 of the color filter 2. In this embodiment, the photosensitive chip 3 is connected to the first surface 21a of the color filter body 21. In this embodiment, the lower surface of the color filter body 21 is used as the first surface 21a of the color filter body 21. Optionally, the photosensitive chip 3 and the color filter body 21 are bonded together using a second adhesive 6. The photosensitive chip 3 is electrically connected to the conductive structure 22 to conduct electricity between the photosensitive chip 3 and the circuit board 1. The electrical connection between the photosensitive chip 3 and the conductive structure 22 can be achieved by at least one of thermoforming, ultrasonic thermoforming, fusion soldering, and solder paste printing, and this application does not limit this method.

[0074] In this embodiment, the photosensitive chip 3 is placed on the color filter 2, and the color filter 2 is placed on the circuit board 1. The photosensitive chip 3 and the circuit board 1 are connected through the color filter 2, which can reduce the volume of the photosensitive component 100, thereby reducing the volume of the camera module and facilitating the miniaturization of the camera module.

[0075] Figure 5 This is a schematic diagram of the conductive coating in an embodiment of this application, as shown below. Figure 5 As shown, in some embodiments, the conductive structure 22 includes a conductive plating layer 221 disposed on the surface of the color filter body 21. Optionally, the conductive plating layer 221 is made of at least one of gold, indium, silver, copper, nickel, and composite metals. The method of preparing the conductive plating layer 221 on the surface of the color filter body 21 is not limited to electroplating, electroless plating, spraying, or vacuum coating. The thickness of the conductive plating layer is set according to requirements. The smaller the thickness of the conductive plating layer, the more beneficial it is to reduce the overall thickness of the photosensitive component 100.

[0076] Figure 6 This is a schematic diagram of the wire trough in an embodiment of this application, as shown below. Figure 6 As shown, in some embodiments, the surface of the filter body 21 is provided with grooves 211, and a conductive plating layer 221 is disposed in the grooves 211. When preparing the filter 2, grooves 211 are first etched into the surface of the filter body 21. The size of the grooves 211 is set according to specific requirements. Then, the conductive plating layer 221 is prepared along the grooves 211. The conductive plating layer 221 is essentially hidden within the grooves 211, which helps to reduce the thickness of the filter 2.

[0077] like Figure 4As shown, in some embodiments, the photosensitive chip 3 is disposed on the first surface 21a of the color filter body 21, for example, the photosensitive chip 3 is bonded to the first surface 21a of the color filter body 21. At least a portion of the conductive structure 22 is disposed on the second surface 21b of the color filter body 21, the second surface 21b being opposite to the first surface 21a. In this embodiment, the lower surface of the color filter body 21 is used as the first surface 21a, and the upper surface of the color filter body 21 is used as the second surface 21b. By providing a portion of the conductive structure 22 on the second surface 21b of the color filter body 21, some electronic components can be disposed on the second surface 21b of the color filter body 21, making the structure of the photosensitive assembly 100 more compact.

[0078] like Figure 6 As shown, in some embodiments, the color filter body 21 is provided with a through hole 212, which penetrates the first surface 21a and the second surface 21b of the color filter body 21. A conductive structure 22 passes through the through hole 212, enabling the conductive structure located on the first surface 21a to be connected to the second surface 21b. Taking a conductive plating layer as an example, the conductive plating layer covers the hole wall of the through hole 212 to connect the conductive plating layer located on the first surface 21a to the second surface 21b, facilitating electrical connection between the conductive plating layer on the first surface 21a and the circuit board 1. The opening method of the through hole 212 can be mechanical opening, laser opening, TGV (Through Glass Via) or chemical etching, etc.

[0079] Figure 7 This is a schematic diagram of electronic components disposed on a color filter according to an embodiment of this application, as shown below. Figure 7 As shown, in some embodiments, the photosensitive assembly 100 further includes an electronic component 4, at least partially disposed on the color filter 2. For example, the electronic component 4 is disposed on a first surface 21a and / or a second surface 21b of the color filter body 21. Optionally, the electronic component 4 includes a capacitor and / or a resistor, for example, a silicon capacitor. A cavity 213 adapted to the electronic component 4 is disposed on the surface of the color filter body 21, and the electronic component 4 is disposed in the cavity 213. A groove 211 communicates with the cavity 213 to allow the conductive structure 22 to conduct electricity with the electronic component 4.

[0080] In traditional photosensitive components, electronic components are all mounted on circuit boards. In this embodiment, at least some of the electronic components 4 are mounted on the color filter 2, which reduces the number of electronic components mounted on the circuit board 1 and thus reduces the size of the circuit board 1.

[0081] Figure 8 This is a schematic diagram of the circuit board according to an embodiment of this application, as shown below. Figure 8As shown, in some embodiments, the circuit board 1 is provided with a chip cavity 12, and the photosensitive chip 3 is located in the chip cavity 12 to further reduce the thickness of the photosensitive component 100. The chip cavity 12 can be a through hole or a recess. Optionally, the conductive area 13 on the upper surface of the circuit board 1 is located close to the chip cavity 12 to facilitate the electrical connection between the conductive structure 22 and the conductive area 13. After the photosensitive chip 3 is placed on the color filter 2, the color filter body 21 is mounted on the upper surface of the circuit board 1, the photosensitive chip 3 enters the chip cavity 12, and the conductive structure 22 is electrically connected to the conductive area 13.

[0082] In some embodiments, the first adhesive 5 between the circuit board 1 and the color filter 2 is located at the edge of the chip cavity 12. The first adhesive 5 is an opaque adhesive, which can effectively reduce the light transmission from the back of the circuit board 1 and improve the imaging effect of the camera module.

[0083] Optionally, a third adhesive 7 is provided on the back side of the circuit board 1, between the photosensitive chip 3 and the circuit board 1. The third adhesive 7 is an opaque adhesive to further reduce light transmission from the back side of the circuit board 1.

[0084] Figure 9 This is a flowchart of the photosensitive component fabrication method according to an embodiment of this application, such as... Figure 9 As shown, an embodiment of this application provides a method for fabricating the above-described photosensitive component 100, the method comprising:

[0085] S1. The conductive structure 22 is disposed on the filter body 21.

[0086] Figure 10 This is a schematic diagram of a conductive coating deposited on the surface of the color filter body according to an embodiment of this application, as shown below. Figure 10 As shown, for example, when the conductive structure 22 is a conductive plating layer 221, the conductive plating layer 221 is deposited on the surface of the color filter body 21, and the conductive plating layer 221 is located on the second surface 21b of the color filter body 21, or the conductive plating layer 221 is located on the first surface 21a and the second surface 21b of the color filter body 21.

[0087] S2. Place the photosensitive chip 3 on the color filter body 21 and connect the photosensitive chip 3 to the conductive structure 22.

[0088] Figure 11 This is a schematic diagram of the photosensitive chip according to an embodiment of this application, as shown below. Figure 11 As shown, for example, a first gold ball 31 is disposed on the pad of the photosensitive chip 3, and for example, the first gold ball 31 is soldered to the pad of the photosensitive chip 3.

[0089] Figure 12 This is a schematic diagram of the photosensitive chip being bonded to the color filter according to an embodiment of this application, as shown below. Figure 12As shown, in some embodiments, a second adhesive 6 is coated on the first surface 21a of the color filter body 21, and the photosensitive chip 3 is mounted on the first surface 21a of the color filter body 21 using an ultrasonic thermo-press welding process. Heat and pressure are maintained until the second adhesive 6 cures, thus bonding the photosensitive chip 3 to the color filter body 21. The ultrasonic thermo-press welding process enables the first gold ball 31 on the photosensitive chip 3 to conduct electricity with the conductive structure 22.

[0090] In some embodiments, the photosensitive chip 3 is first soldered to the conductive structure 22 of the color filter 2, and then the gap between the photosensitive chip 3 and the color filter body 21 is filled with adhesive to bond the photosensitive chip 3 to the color filter body 21. The electrical connection between the photosensitive chip 3 and the conductive structure 22 can be achieved by at least one of thermoforming, ultrasonic thermoforming, fusion soldering, and solder paste printing.

[0091] S3. Place the color filter body 21 on the circuit board 1 and connect the conductive structure 22 to the circuit board 1.

[0092] Figure 13 This is a schematic diagram of an embodiment of this application in which gold balls are disposed on the color filter body, as shown. Figure 13 As shown, for example, a second gold ball 23 is provided at the end of the conductive structure 22 on the first surface 21a of the filter body 21, and the second gold ball 23 is welded to the conductive structure 22.

[0093] Figure 14 This is a schematic diagram of applying a first adhesive to a circuit board according to an embodiment of this application, as shown below. Figure 14 As shown, in some embodiments, a first adhesive 5 is coated on the upper surface of the circuit board 1, and the color filter body 21 of the color filter 2 is mounted on the circuit board 1, with the color filter body 21 abutting against the first adhesive 5. The second gold ball 23 is electrically connected to the conductive area 13 of the circuit board 1 to connect the photosensitive chip 3 to the circuit board 1. The electrical connection between the second gold ball 23 and the conductive area 13 can be achieved by at least one of thermoforming, ultrasonic thermoforming, fusion soldering, and solder paste printing; this application does not limit this method. After the first adhesive 5 cures, the color filter body 21 and the circuit board 1 are bonded together.

[0094] Optionally, the second gold ball 23 is first electrically connected to the conductive area 13, and then the first adhesive 5 is filled between the color filter body 21 and the circuit board 1.

[0095] Optionally, the circuit board 1 is provided with a chip cavity 12 adapted to the photosensitive chip 3, and the photosensitive chip 3 can enter the chip cavity 12. The chip cavity 12 can be a through hole or a recess.

[0096] In some embodiments, step S1, disposing the conductive structure 22 on the color filter body 21, includes: preparing a conductive plating layer 221 on the surface of the color filter body 21. The material and size of the conductive plating layer 221 are set according to requirements. The method of preparing the conductive plating layer 221 on the surface of the color filter body 21 is not limited to electroplating, electroless plating, spraying, or vacuum coating.

[0097] Figure 15 This is a schematic diagram of a color filter body with grooves provided in an embodiment of this application, as shown below. Figure 15 As shown, in some embodiments, the method for preparing the photosensitive component 100 further includes: before preparing the conductive plating layer 221, etching grooves 211 adapted to the conductive plating layer 221 on the surface of the color filter body 21.

[0098] For example, grooves 211 are etched on the second surface 21b of the color filter body 21, or on the first surface 21a and the second surface 21b. The pattern of the grooves 211 is set according to requirements. A conductive plating layer 221 is deposited in the grooves 211, making the structure of the photosensitive component 100 more compact.

[0099] In some embodiments, the method for fabricating the photosensitive component 100 further includes: forming a through hole 212 in the color filter body 21. The through hole 212 penetrates the first surface 21a and the second surface 21b of the color filter body 21. A conductive plating layer 221 covers the hole wall of the through hole 212 to conduct the conductive plating layer located on the first surface 21a to the second surface 21b, facilitating the connection of the conductive plating layer on the first surface 21a to the circuit board 1. This embodiment does not limit the opening method of the through hole 212.

[0100] In some embodiments, the method for fabricating the photosensitive component 100 further includes etching a cavity 213 adapted to an electronic component on the surface of the color filter body 21. The cavity 213 is disposed on a first surface 21a and / or a second surface 21b, and a groove 211 communicates with the cavity 213. An electronic component 4 is disposed in the cavity 213 so that the conductive plating layer 221 is conductive to the electronic component 4. The electronic component 4 includes a capacitor, for example, a silicon capacitor. Disposing at least a portion of the electronic component 4 on the color filter 2 is beneficial for improving the compactness of the photosensitive component 100.

[0101] like Figure 10As shown, in some embodiments, the fabrication method of the photosensitive component 100 further includes: fabricating a resistive plating layer 222 on the surface of the color filter body 21. When fabricating the conductive plating layer 221 on the surface of the color filter body 21, a plating area for the resistive plating layer 222 is reserved. After the conductive plating layer 221 is fabricated, the resistive plating layer 222 is deposited in the reserved area, and the resistive plating layer 222 is electrically connected to the conductive plating layer 221. The material of the resistive plating layer 222 is set according to requirements, and the resistive plating layer 222 is equivalent to a traditional resistor structure on a circuit board. Providing a resistive plating layer 222 on the color filter 2 helps to reduce the size of the photosensitive component 100.

[0102] Figure 16 This is a schematic diagram of the light-shielding layer in an embodiment of this application, as shown below. Figure 16 As shown, in some embodiments, the fabrication method of the photosensitive component 100 further includes: before the conductive structure 22 is disposed on the color filter body 21, a light-shielding layer 24 is disposed on the surface of the color filter body 21. The light-shielding layer 24 does not cover the surface of the color filter body 21 corresponding to the photosensitive area of ​​the photosensitive chip 3, so as to form a light-transmitting area 25 corresponding to the photosensitive area of ​​the photosensitive chip 3. For example, the light-shielding layer 24 is located outside the light-transmitting area 25. Disposing of the light-shielding layer 24 on the surface of the color filter body 21 can reduce the interference of stray light on the photosensitive chip 3 and improve the imaging effect of the camera module.

[0103] Figure 17 This is a schematic diagram of the cutoff coating in an embodiment of this application, as shown below. Figure 17 As shown, in some embodiments, providing a light-shielding layer 24 on the surface of the color filter body 21 includes:

[0104] A cutoff coating 241 is prepared on all surfaces of the color filter body 21. The cutoff coating 241 is made of an opaque material.

[0105] Remove the cutoff coating 241 corresponding to the photosensitive area of ​​the photosensitive chip 3. Form a light-transmitting area 25 on the color filter body 21. Light passes through the light-transmitting area 25 and enters the photosensitive area of ​​the photosensitive chip 3.

[0106] In some embodiments, the second adhesive 6 covers at least a portion of the conductive structure 22 to improve the reliability of the electrical connection between the photosensitive chip 3 and the conductive structure 22.

[0107] In some embodiments, the first adhesive 5 is applied to the edge of the chip cavity 12. The first adhesive 5 is an opaque adhesive, which can effectively reduce the light penetration from the back of the circuit board 1 after curing, thereby improving the imaging effect of the camera module.

[0108] In some embodiments, the method further includes: applying a third adhesive 7 to the back of the circuit board 1, the third adhesive 7 covering the gap between the photosensitive chip 3 and the circuit board 1. The third adhesive 7 is an opaque adhesive to further reduce light transmission from the back of the circuit board 1.

[0109] In some embodiments, an anti-reflection film is provided in the light-transmitting area 25 of the color filter body 21 to improve the imaging effect of the camera module.

[0110] Figure 18 This is a schematic diagram of the camera module according to an embodiment of this application, as shown below. Figure 18 As shown, an embodiment of this application provides a camera module 200, which includes a lens assembly 210 and a photosensitive component 100 as described above. The lens assembly 210 is connected to the photosensitive component 100. For example, the lens assembly 210 is bonded to the circuit board 1, and the photosensitive chip 3 is located on the optical axis of the lens assembly 210.

[0111] In some embodiments, the lens assembly 210 includes a lens mount disposed on the photosensitive assembly 100. For example, the lens mount is disposed on the circuit board 1.

[0112] Figure 19 This is a schematic diagram of the photosensitive chip disposed on the lens mount according to an embodiment of this application, as shown above. Figure 19 As shown, in some embodiments, the lens assembly 210 includes a lens mount with a receiving cavity 220. The photosensitive assembly 100 is disposed in the receiving cavity 220, and the lens mount protects the photosensitive assembly 100. Optionally, a through hole is provided on the side wall of the lens mount, communicating with the receiving cavity 220. A connecting plate 230 passes through the through hole and is in communication with the circuit board 1. The connecting plate 230 is used to connect to the electronic device body. Optionally, the connecting plate 230 is a flexible circuit board.

[0113] Figure 20A and Figure 20B A schematic diagram of an electronic device illustrating an example embodiment of this application is shown. Figure 20A and Figure 20B As shown, according to another aspect of this application, an embodiment of this application provides an electronic device, wherein the electronic device includes an electronic device body 300 and at least one camera module 200 as described above. Each camera module 200 is respectively disposed on the electronic device body 300 for acquiring images. It is worth mentioning that the type of electronic device body 300 is not limited; for example, the electronic device body 300 can be a smartphone, tablet computer, laptop computer, e-reader, personal digital assistant, camera, or any electronic device that can be configured with a camera module 200. Those skilled in the art will understand that, although the appended... Figure 20A and attached Figure 20B The example of the electronic device body 300 being implemented as a smartphone does not constitute a limitation on the content and scope of this application.

[0114] For example, such as Figure 20AAs shown, the camera module 200 is disposed on the electronic device body 300 and faces the front of the electronic device body 300, so that the camera module 200 serves as a front-facing camera of the electronic device for capturing images of objects in the space in front of the electronic device body 300.

[0115] In addition, such as Figure 20B As shown, the camera module 200 is disposed on the electronic device body 300 and faces the rear side of the electronic device body 300, so that the camera module 200 serves as a rear camera of the electronic device for capturing images of objects in the space behind the electronic device body 300.

[0116] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Therefore, any changes or modifications made by those skilled in the art based on the ideas of this application, and on the specific implementation methods and application scope of this application, are all within the scope of protection of this application. In summary, the content of this specification should not be construed as a limitation of this application.

Claims

1. A photosensitive component, characterized in that, include: Circuit board; Color filters, including: The color filter body is disposed on the circuit board; A conductive structure is disposed on the color filter body, and the conductive structure is electrically connected to the circuit board; A photosensitive chip is disposed on the color filter, and the photosensitive chip is electrically connected to the conductive structure.

2. The photosensitive component according to claim 1, characterized in that, The conductive structure includes a conductive coating, which is disposed on the surface of the color filter body.

3. The photosensitive component according to claim 2, characterized in that, The surface of the color filter body is provided with grooves, and the conductive plating layer is disposed in the grooves.

4. The photosensitive component according to claim 1, characterized in that, The photosensitive chip is disposed on the first surface of the color filter body, and at least a portion of the conductive structure is disposed on the second surface of the color filter body, the second surface being opposite to the first surface.

5. The photosensitive component according to claim 4, characterized in that, The color filter body is provided with a through hole, and the conductive structure passes through the through hole.

6. The photosensitive component according to claim 1, characterized in that, It also includes electronic components, at least a portion of which are disposed on the color filter.

7. The photosensitive component according to claim 1, characterized in that, The circuit board has a chip cavity, and the photosensitive chip is located in the chip cavity.

8. The photosensitive component according to claim 7, characterized in that, A first adhesive is provided between the circuit board and the color filter, and the first adhesive is located at the edge of the chip cavity.

9. A method for preparing a photosensitive component, characterized in that, include: The conductive structure is incorporated into the color filter body; A photosensitive chip is disposed on the color filter body, and the photosensitive chip is connected to the conductive structure; The color filter body is placed on the circuit board, and the conductive structure is connected to the circuit board.

10. The preparation method according to claim 9, characterized in that, The step of setting a conductive structure on the color filter body includes: preparing a conductive coating on the surface of the color filter body.

11. The preparation method according to claim 10, characterized in that, Also includes: Grooves adapted to the conductive coating are etched on the surface of the color filter body.

12. The preparation method according to claim 11, characterized in that, Also includes: A through hole is formed in the color filter body; and / or Cavities adapted to electronic components are etched on the surface of the color filter body.

13. The preparation method according to claim 10, characterized in that, Also includes: A resistive plating layer is prepared on the surface of the color filter body.

14. The preparation method according to claim 9, characterized in that, Also includes: Before the conductive structure is disposed on the color filter body, a light-shielding layer is disposed on the surface of the color filter body.

15. The preparation method according to claim 9, characterized in that, The step of placing the photosensitive chip on the color filter body includes: The photosensitive chip and the color filter body are bonded together.

16. The preparation method according to claim 9, characterized in that, The step of placing the color filter body on the circuit board includes: The color filter body and the circuit board are bonded together.

17. The preparation method according to claim 16, characterized in that, The first adhesive between the circuit board and the color filter is located at the edge of the chip cavity of the circuit board.

18. The preparation method according to claim 17, characterized in that, Also includes: A third adhesive is applied between the photosensitive chip and the circuit board.

19. A camera module, characterized in that, include: Lens assembly; The photosensitive component as described in any one of claims 1 to 8, wherein the lens assembly is connected to the photosensitive component.

20. The camera module according to claim 19, characterized in that, The lens assembly includes a lens mount, the lens mount having a receiving cavity, and the photosensitive component disposed within the receiving cavity.

21. The camera module according to claim 19, characterized in that, The lens assembly includes a lens mount, which is disposed on the photosensitive assembly.

22. An electronic device, characterized in that, include: The electronic device itself; The camera module as described in any one of claims 19 to 21, wherein the camera module is disposed on the electronic device body.

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