An image sensor and a method of manufacturing the same
By setting a conductive oxide layer between the top metal layer of the logic chip and the pixel chip, the spatial coupling interference problem caused by the current change of the logic circuit is solved, thereby improving the imaging quality and compatibility of the image sensor.
CN122227698APending Publication Date: 2026-06-16WUHAN CHUXING TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUHAN CHUXING TECH CO LTD
- Filing Date
- 2024-12-16
- Publication Date
- 2026-06-16
AI Technical Summary
⚠Technical Problem
In stacked CMOS image sensors, current variations within logic circuits can cause spatial coupling interference in pixel chips, affecting image quality.
⚗Method used
A conductive oxide layer is placed between the top metal layer of the logic chip and the pixel chip to shield interference signals generated by the logic circuit. The thickness and uniformity of the conductive oxide layer are precisely controlled by controlling the fabrication process of the conductive oxide layer, such as magnetron sputtering, to reduce signal interference.
🎯Benefits of technology
It effectively shields the signal interference of logic circuits, improves the imaging quality of image sensors, has good compatibility, and is suitable for hybrid bonding and through-silicon via (TSV) processes.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122227698A_ABST
Abstract
The application relates to the technical field of image sensors, in particular to an image sensor and a preparation method thereof. The image sensor comprises a logic chip and a pixel chip which are stacked, the logic chip comprises a logic circuit and a top metal layer of the logic chip which are stacked, and the pixel chip comprises a top metal layer of the pixel chip, wherein a conductive oxide layer is arranged between the top metal layer of the logic chip and the top metal layer of the pixel chip, and the conductive oxide layer is used for shielding interference signals generated by the logic circuit. The conductive oxide layer can shield signal interference of the logic circuit, has good compatibility with a wafer bonding process, reduces or avoids the influence on signals of the pixel chip, and further improves the imaging quality of the image sensor.
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