A cutting structure of a solar cell and a cutting method and application thereof

Abstract

The application relates to the technical field of solar cells, and specifically discloses a cutting structure of a solar cell, a cutting method of the solar cell and application. The cutting structure of the solar cell comprises a whole piece of a cell to be cut, the whole piece of the cell comprises a cutting area, the cutting area is fixed with a UV curing adhesive layer, the cutting area of the whole piece of the cell forms a half piece of the cell after cutting, the UV curing adhesive layer fixed on the cutting area is obtained through ultraviolet light irradiation and curing, the UV curing adhesive layer comprises a prepolymer, active monomers, a photoinitiator and a stabilizing auxiliary agent, wherein the weight percentage ranges of the raw materials are as follows: the prepolymer is 35-50%, the active monomers are 45-60%, the photoinitiator is 1-6%, and the stabilizing auxiliary agent is 1-2%. In addition, the preparation method has the advantages that the cutting process is optimized through the characteristics of the UV curing adhesive, the cutting damage of the cell matrix is reduced, and the power of the half piece of the assembly is improved.

Description

Technical Field

[0001] This application relates to the technical field of solar cells, and in particular to a cutting structure for solar cells, a cutting method thereof, and its application. Background Technology

[0002] In recent years, the solar cell module market has been dominated by half-cell modules, primarily because half-cell modules offer a significant power output increase compared to full-cell modules. This is mainly due to the reduced series resistance of half-cell modules and the improved turn-on voltage and fill factor (FF) resulting from the series connection of the half-cells. However, the current common method for achieving half-cell functionality involves laser-cutting pre-tested and sorted full-cell cells into uniform and symmetrical half-cells. This process can lead to side-cutting defects, which are then directly welded together to form modules. Traditional laser cutting methods are prone to edge chipping and cracking of the silicon substrate, affecting wafer quality and yield, and ultimately impacting module power generation efficiency.

[0003] In existing technologies, silicon substrate cutting for solar cells mainly relies on mechanical or laser cutting. These methods generate significant mechanical and thermal stresses during the cutting process, leading to damage such as chipping and cracking at the silicon wafer edges. Specifically, traditional laser cutting uses a high-energy laser beam to locally and instantaneously vaporize or melt the silicon material. However, this creates a significant heat-affected zone around the cut, generating thermal stress that causes chipping and microcrack propagation at the silicon wafer edges. This heat-affected zone also alters the microstructure of the silicon material, especially affecting thinner wafers, thus impacting their electrical properties and mechanical strength.

[0004] Furthermore, the mechanical stress introduced by laser cutting can form a damage layer inside the crystal. The resulting microcracks are prone to further propagation during subsequent processing or use, affecting the stability and reliability of the battery's internal structure. In particular, the microcracks and lattice defects formed on the cutting surface significantly increase the recombination rate of charge carriers at the defect sites, leading to a decrease in the battery's open-circuit voltage and fill factor, resulting in a loss of battery conversion efficiency.

[0005] The aforementioned technologies have the following drawbacks: solar cells need to be laser-cut into two halves, which causes microcracks and lattice damage on the cut surface. Carrier recombination at the cut surface defects increases significantly, and the cell efficiency decreases due to the reduced on-state voltage and filling capacity caused by laser damage. Summary of the Invention

[0006] This invention aims to solve the problem of damage to the silicon substrate of batteries caused by mechanical or thermal stress in existing cutting technologies. By optimizing the cutting process through the characteristics of UV-curable adhesive, the cutting damage to the battery substrate is reduced and the power of half-cell modules is improved. Therefore, this application provides a cutting structure and cutting method for solar cells.

[0007] In a first aspect, this application provides a cutting structure for a solar cell, employing the following technical solution:

[0008] A cutting structure for a solar cell includes a whole cell to be cut, the whole cell including a cutting area, the cutting area having a UV-curable adhesive layer fixed thereon, the cutting area of ​​the whole cell being cut to form a half cell, the UV-curable adhesive layer fixed in the cutting area being cured by ultraviolet light irradiation, the UV-curable adhesive layer including a prepolymer, an active monomer, a photoinitiator and a stabilizing agent, wherein the weight percentage range of each raw material is 35-50% prepolymer, 45-60% active monomer, 1-6% photoinitiator and 1-2% stabilizing agent.

[0009] By adopting the above technical solution, the production of half-cell solar cells requires laser cutting, which can cause damage to the cut area, resulting in chipping and cracking. The UV-curable adhesive layer, as a type of colloid, acts as a buffer, reducing direct contact between the cutting tool and the silicon substrate, effectively reducing mechanical and thermal stress, thereby minimizing chipping and cracking at the silicon wafer edges. Furthermore, the UV-curable adhesive has the following advantages: it has no adverse effects on the cut cells and is suitable for industrialization.

[0010] (1) Improve processing efficiency

[0011] The core advantage of UV-curable adhesives lies in their rapid curing characteristic. Compared to traditional adhesives that require heat or long periods of natural curing, UV adhesives typically cure within seconds to tens of seconds under specific wavelengths of ultraviolet light. This significantly shortens the production cycle, making automated production lines possible and thus substantially improving overall production efficiency.

[0012] (2) Effective protection of battery cells

[0013] Laser cutting itself creates a heat-affected zone, and UV adhesive plays a crucial role as a buffer and protective layer in this process. It effectively reduces the transmission of mechanical and thermal stress generated during cutting to the solar cell body, thereby reducing the probability of microcracks and edge chipping, better maintaining the structural integrity and electrical performance of the solar cell, and extending the lifespan of the module.

[0014] (3) Achieve green manufacturing

[0015] Most UV-curable adhesives are solvent-free formulations, meaning they do not release volatile organic compounds during the curing process, complying with international environmental standards such as RoHS and REACH. This not only reduces environmental pollution but also provides operators with a safer and healthier working environment.

[0016] (4) Ensure process precision

[0017] The curing process of UV adhesives is controllable. By precisely controlling the intensity and duration of ultraviolet irradiation, the depth and extent of curing can be accurately controlled. This characteristic makes it ideal for precision devices such as solar cells, which have stringent requirements for size and cleanliness.

[0018] (5) Enhance environmental adaptability

[0019] The cured UV adhesive layer typically has excellent weather resistance, with a temperature range of -60℃ to 130℃. It is also waterproof, anti-aging, and does not yellow, which helps ensure that solar cells can work stably in various complex environments.

[0020] The instant repair capability of UV-curable adhesive is achieved simultaneously during the cutting process, avoiding the delayed effects of traditional multi-step processing and resulting in significant damage control. Besides effectively reducing cutting damage to solar cells and increasing the power of half-cell modules, the UV-curable adhesive layer also reduces direct contact between the cutting tool and the silicon substrate, effectively reducing mechanical and thermal stress, thereby minimizing edge chipping and cracking of the silicon wafers. Furthermore, it improves cell quality and yield: optimizing the cutting process, reducing wafer damage, and improving the overall quality and yield of the wafers. It also improves module power and reliability: reducing wafer damage and side composite centers, providing module power and lifespan. Moreover, it is easy to operate: by controlling the wavelength and irradiation time of UV light, the cutting process can be optimized without complex equipment adjustments.

[0021] By simultaneously curing a UV-curable adhesive on a single finished solar cell during the cutting process, a dense protective layer is formed, instantly isolating thermal stress. This mechanism significantly reduces microcracks and lattice distortion, resulting in a substantial decrease in the defect rate of the cut surface and a reduction in cell efficiency loss beyond the expectations of conventional repair methods. Utilizing the influence characteristics of different UV wavelengths of the adhesive, the cutting process can be optimized by controlling the wavelength and irradiation time of UV light, without the need for complex equipment adjustments.

[0022] The UV-curable adhesive used in this application has the following core characteristics: strong controllability of tack (peel strength after initial curing is 1-6 N / 25 mm, peel strength after debonding and tack reduction is 0.1-0.5 N / 25 mm), excellent environmental adaptability (temperature range -40℃ to 120℃), and fast response speed (tack reduction is completed within 5-20 seconds after debonding and UV irradiation).

[0023] Optionally, the prepolymer includes epoxy acrylate, polyurethane acrylate and / or polyester acrylate;

[0024] The active monomer includes tripropylene glycol diacrylate;

[0025] The photoinitiator includes benzophenone;

[0026] The stabilizing agents include o-hydroxybenzophenones, benzotriazoles, or triazine compounds.

[0027] Optionally, the stabilizing agent includes 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octyloxybenzophenone, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-5-chlorobenzotriazole or 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole.

[0028] By adopting the above technical solution, the prepolymer provides mechanical strength and temperature resistance after curing. Tripropylene glycol diacrylate is a bifunctional UV-active monomer that serves as a core component of UV-curable adhesives in solar cell half-cell cutting. Its main functions are as an active diluent and crosslinking agent. Its low viscosity, rapid curing, and good dilution properties enable it to effectively optimize the cutting process, reduce damage to the cell substrate, and thus improve the power output of the half-cell module.

[0029] Benzophenone, as a photoinitiator, can absorb ultraviolet light to generate active free radicals, triggering rapid curing.

[0030] The stabilizing agent prevents premature curing of the UV curing agent during storage. Its addition effectively absorbs ultraviolet light, preventing performance degradation of the adhesive layer due to photo-oxidation during storage or use, thus ensuring the stability of the cutting process and the quality of the solar cells. The UV-curable adhesive layer is obtained by curing a low-tack UV-curable adhesive.

[0031] This application optimizes the formulation design and crosslinking reaction control of the UV-curable adhesive layer, ensuring that the reduced-tack UV-curable adhesive does not leave any adhesive residue on the substrate surface after peeling off the reduced-tack adhesive, thus avoiding the cleaning process after peeling off traditional tape and improving production efficiency.

[0032] Optionally, the thickness of the UV-curable adhesive layer is 50-150 μm.

[0033] Optionally, the thickness of the UV-curable adhesive layer can be 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm, 120μm, 125μm, 130μm, 135μm, 140μm, 145μm, 150μm, etc.

[0034] By adopting the above technical solution, when the thickness of the UV-curable adhesive layer is in the range of 50-150μm, it can ensure good adhesion when cured on the battery cell and easy removal during the debonding process. When the thickness is too thin, the adhesive strength of the UV-curable adhesive is insufficient and it is prone to failure; when the thickness is too thick, it is difficult to remove during the subsequent debonding process.

[0035] Secondly, this application provides a cutting structure for a solar cell, employing the following technical solution:

[0036] A method for cutting a solar cell, using the aforementioned solar cell cutting structure, includes the following steps:

[0037] Preparation of UV-curable adhesive layer: Apply UV-curable adhesive to the cut area of ​​the entire battery cell;

[0038] UV curing adhesive layer curing: UV light is used to cure the cut area;

[0039] Cutting: Laser cutting or wire cutting is performed on the area where the UV-cured adhesive layer is fixed to form a half cell;

[0040] UV-cured adhesive layer debonding: UV light is used to irradiate the UV-cured adhesive layer on half of the cell to debond and remove it.

[0041] By adopting the above technical solution, this application prepares a UV-curable adhesive layer in the cutting area of ​​the entire battery cell. A layer of anti-tack UV-curable adhesive is coated on the surface of the silicon substrate. This adhesive layer cures rapidly under UV light, forming a protective layer with elasticity and buffering properties. A cutting tool (such as a steel wire or laser) is used to cut the silicon substrate coated with the UV-curable adhesive layer. During the cutting process, the UV-curable adhesive layer, through its elastic buffering effect, reduces direct contact between the cutting tool and the silicon substrate, thereby reducing the generation of mechanical and thermal stress. After cutting, non-contact UV adhesive removal irradiation can thoroughly remove residual adhesive from the protective film, avoiding micro-cracks in the battery cell caused by excessive peeling force.

[0042] This application employs a unique curing-tack reduction multi-mechanism, dividing the processing into two precisely controllable stages. The first stage involves UV curing to form a dense adhesive layer, providing stable support. In the second stage, under UV light irradiation of a specific wavelength, the adhesive layer undergoes a controllable reaction at a designated interface, resulting in a significant reduction in tack, thus enabling easy, clean, and non-destructive peeling.

[0043] Optionally, during the curing of the UV-curable adhesive, the UV wavelength used is 395nm, the energy density range is 500-2000 mJ / cm², the irradiation time is 5-15 seconds, and the curing temperature is 20-30℃.

[0044] Optionally, during the curing of the UV-curable adhesive, the energy density range can be 500 mJ / cm², 800 mJ / cm², or 1000 mJ / cm². 2 1300mJ / cm 2 1500mJ / cm 2 1800mJ / cm 2 2000mJ / cm 2 The light exposure time can be 5 seconds, 8 seconds, 10 seconds, 12 seconds, 15 seconds, etc., and the curing temperature can be 20℃, 22℃, 25℃, 28℃, 30℃, etc.

[0045] By adopting the above technical solution, when UV curing adhesives is performed, the UV wavelength used is 395nm, which has relatively low energy and is more gentle. It is suitable for rapid curing of UV curing adhesives and can effectively avoid local overheating or excessive reaction.

[0046] Optionally, in the process of UV-cured adhesive peeling off: the UV wavelength used is 365nm, the energy density range is 3000-4000mJ / cm², the irradiation time is 10-20s, and the irradiation temperature is 20-30℃. Optionally, the energy density range can be 3000mJ / cm². 2 3200mJ / cm 2 3500mJ / cm 2 3800mJ / cm 2 4000mJ / cm 2 The light exposure time can be 5 seconds, 8 seconds, 10 seconds, 12 seconds, 15 seconds, etc., and the curing temperature can be 20℃, 22℃, 25℃, 28℃, 30℃, etc.

[0047] By employing the above technical solution, UV light with a wavelength of 365nm is used to irradiate and cause the UV-cured adhesive layer to peel off. The 365nm UV wavelength belongs to the UV-A band, with high photon energy, which can effectively penetrate the adhesive layer and activate specific photodegradation components, causing the cross-linked network structure to break down, thus resulting in a significant decrease in adhesion. Its characteristics include strong penetration, ensuring a sufficient reaction occurs even inside the adhesive layer, thereby achieving complete, clean, and non-destructive peeling. Afterwards, it can be completely removed simply by gently blowing it away.

[0048] By controlling the intensity and duration of UV light irradiation, the curing state of the UV-cured adhesive layer is optimized, ensuring that it maintains an appropriate buffering effect during the cutting process.

[0049] Optionally, in the preparation of the UV-curable adhesive layer, the thickness of the UV-curable adhesive layer is 50-150 μm. The thickness of the UV-curable adhesive layer can be 50 μm, 70 μm, 90 μm, 100 μm, 110 μm, 130 μm, 150 μm, etc.

[0050] Optionally, before applying UV-curing adhesive to the cut areas of the entire battery cell, the process further includes testing the entire battery cell.

[0051] By adopting the above technical solution, the entire battery cell is graded according to its efficiency (eI / efficiency) test, which facilitates the subsequent series-parallel packaging of battery cells with the same efficiency.

[0052] Thirdly, this application provides an application of a method for cutting solar cells, which includes the following technical solutions:

[0053] An application of a method for cutting solar cells involves welding half-cells and encapsulating the module after the UV-cured adhesive is desorbed to form a half-cell module.

[0054] Optionally, the half-piece assembly can be of the 210N-66-piece type, the 210R-66-piece type, or the 183R-72-piece type.

[0055] In summary, this application has the following beneficial effects:

[0056] 1. Reduce silicon wafer cutting damage: The buffering effect of the UV-cured adhesive layer reduces the direct contact between the cutting tool and the silicon substrate, effectively reducing the generation of mechanical and thermal stress, thereby reducing edge chipping and cracking of the silicon wafer.

[0057] 2. Improve cell quality and yield: Optimize the cutting process, reduce silicon wafer damage, and improve the overall quality and yield of silicon wafers.

[0058] 3. Improve module power and reliability: Reduce silicon wafer damage and side composite centers, thereby increasing module power and lifespan.

[0059] 4. Easy to operate: By controlling the wavelength and irradiation time of UV light, the cutting process can be optimized without complicated equipment adjustments.

[0060] 5. Wide range of applications: This method has been successfully applied in key areas such as precision cutting and protection of semiconductors, wafers, UTG glass, and PCB / FPC, solving long-standing problems in precision manufacturing such as difficulty in controlling peel force, easy damage to substrates, easy residue, and low efficiency. Detailed Implementation

[0061] Experimental methods in the following embodiments of this application that do not specify specific conditions are generally performed under conventional conditions or as recommended by the manufacturer. All commonly used chemical reagents used in the embodiments are commercially available products.

[0062] Raw material source:

[0063] Tripropylene glycol diacrylate: CAS No. 42978-66-5;

[0064] Benzophenone: CAS No. 119-61-9;

[0065] 2-Hydroxy-4-methoxybenzophenone (UV-9): CAS No. 131-57-7;

[0066] 2-Hydroxy-4-n-octyloxybenzophenone (UV-531): CAS No. 1843-05-6;

[0067] 2-(2'-hydroxy-3',5'-ditert-butylphenyl)-5-chlorobenzotriazole (UV-327): CAS No. 3864-99-1;

[0068] 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole (UV-326): CAS No. 3896-11-5.

[0069] Example

[0070] Example 1

[0071] A cutting structure for a solar cell includes a whole cell to be cut, the whole cell includes a cutting area, and a UV-curable adhesive layer is fixed in the cutting area, the thickness of the UV-curable adhesive layer being 100μm.

[0072] The cutting area of ​​the whole cell is cut to form a half cell. The UV-curable adhesive layer is obtained by mixing prepolymer, active monomer, photoinitiator and stabilizer. The amount of each raw material is 40g of prepolymer, 54g of active monomer, 4.5g of photoinitiator and 1.5g of stabilizer.

[0073] The prepolymer comprises epoxy acrylate and polyurethane acrylate in a mass ratio of 1:1; the active monomer is tripropylene glycol diacrylate; the photoinitiator is benzophenone; and the stabilizing agent is 2-hydroxy-4-methoxybenzophenone.

[0074] A method for cutting a solar cell, comprising the following steps:

[0075] (1) Test the entire battery cell;

[0076] (2) Preparation of the curing adhesive layer: UV curing adhesive is applied to the cut area of ​​the whole cell with a thickness of 100μm;

[0077] (3) UV curing of adhesive layer: UV light is used to cure the cut area. The curing parameters are: UV wavelength is 395nm, energy density range is 1500 mJ / cm², light exposure time is 10 seconds, and curing temperature is 25℃.

[0078] (4) Cutting: Laser cutting is performed on the area where the UV-cured adhesive layer is fixed. The laser grooving rated power is 80W and the frequency is 90KHZ to form a half cell.

[0079] (5) UV-cured adhesive layer debonding: UV light is used to irradiate the UV-cured adhesive layer on half of the cell to debond and remove it. The debonding parameters are: UV wavelength of 365nm, energy density range of 3500 mJ / cm², irradiation time of 15s, and irradiation temperature of 25℃.

[0080] (6) Welding and encapsulation of half-cell batteries to obtain half-cell battery modules.

[0081] Example 2-3

[0082] The difference between Examples 2-3 and Example 1 is that the proportions of raw materials used in the cured adhesive layer are different, as shown in Table 1.

[0083] Table 1. Raw material consumption of the cured adhesive layer in Examples 1-3 (unit: g)

[0084]

[0085] Example 4

[0086] A method for cutting solar cells, which differs from Example 1, involves applying a UV-curable adhesive with a thickness of 50 μm to the cutting area of ​​the entire cell.

[0087] Example 5

[0088] A method for cutting solar cells, which differs from Example 1, involves applying a UV-curable adhesive with a thickness of 150 μm to the cutting area of ​​the entire cell.

[0089] Example 6

[0090] A method for cutting solar cells, which differs from Example 1, involves applying a UV-curable adhesive with a thickness of 30 μm to the cutting area of ​​the entire cell.

[0091] Example 7

[0092] A method for cutting solar cells, which differs from Example 1, involves applying a UV-curable adhesive with a thickness of 200 μm to the cutting area of ​​the entire cell.

[0093] Comparative Example 1

[0094] A method for cutting solar cells involves directly laser-cutting a whole cell to obtain a half cell.

[0095] Comparative Example 2

[0096] The battery cell was prepared using the edge passivation method for reducing cutting damage disclosed in Example 1 of Patent Publication No. CN119403268A.

[0097] Performance test results

[0098] 1. Defects in laser cutting of half-cell modules

[0099] The half-cell batteries obtained in Examples 1-7 and Comparative Example 1 were respectively fabricated into half-cell modules of 210N-66 cell type, 210R-66 cell type and 183R-72 cell type, and the improvement of module yield was tested. The test results are shown in Table 2.

[0100] EL inspection (electroluminescence detection): A positive voltage is applied to the solar cell, causing electrons and holes to recombine and emit light. An infrared camera captures the image, and defects are determined by the uniformity of light emission.

[0101] The EL testing standard for solar cell modules is conducted according to standards such as IEC 60904-13.

[0102] Table 2. Test results of improvement in main laser cutting defect rate of half-cell battery modules in Examples 1-7 and Comparative Example 1.

[0103]

[0104] 2. Power performance of half-cell modules

[0105] The half-cell cells obtained in Examples 1-7 and Comparative Example 1 were respectively fabricated into half-cell modules of 210N-66 cell, 210R-66 cell, and 183R-72 cell types, and their power performance was tested. The test results are shown in Table 3. The power testing standard for solar cell modules was carried out according to standards such as IEC 61215, with the following test conditions: irradiance 1000 W / m², cell temperature 25°C, and spectrum AM1.5.

[0106] Table 3 Power improvement test results of Examples 1-7 and Comparative Example 1

[0107]

[0108] As shown in Table 2, the laser cutting-related defects of the module under the test of relevant indicators of the present invention have been significantly reduced, which is in line with expectations. As shown in Table 3, the power of the half-cell module prepared using the present invention has been significantly improved, which is in line with expectations. The reason for this may be that the instant repair capability of the UV-cured adhesive is realized simultaneously during the cutting process, avoiding the delay effect of traditional multi-step processing, and the damage control effect is significant. In addition to effectively reducing the cutting damage of the cell and improving the power of the half-cell module, it can also reduce the direct contact between the cutting tool and the silicon substrate through the buffering effect of the UV-cured adhesive layer, effectively reducing the generation of mechanical stress and thermal stress, thereby reducing edge chipping and cracking of the silicon wafer. In addition, it can also improve the quality and yield of the cell: optimize the cutting process, reduce silicon wafer damage, and improve the overall quality and yield of the silicon wafer. And improve the power and reliability of the module: reduce silicon wafer damage and side composite center, and provide module power and service life. Moreover, it is easy to operate: by controlling the wavelength and irradiation time of UV light, the cutting process can be optimized without complex equipment adjustments.

[0109] 3. The efficiency of the batteries obtained in Example 1 and Comparative Example 2 was tested.

[0110] Efficiency testing was conducted according to the testing method disclosed in patent publication number CN119403268A: the efficiency of the finished battery cells was tested using an IV tester, and the cell efficiency before and after cutting and before and after passivation was measured. The test results are shown in Table 4.

[0111] Table 4 Test results of Example 1 and Comparative Example 2

[0112]

[0113] Combining the test results of Example 1 and Comparative Example 2, it can be seen that the cutting structure and method of Example 1 of this application reduce stress by setting a UV curing layer as a physical buffer before cutting. The UV adhesive acts as a buffer protective layer during the cutting process, directly absorbing and dispersing the cutting stress, reducing edge chipping and cracking from the source, and reducing cutting damage. Comparative Example 2 uses UV adhesive as an edge protection layer after cutting to selectively retain the edge alumina film during acid pickling, which is effective in repairing cutting damage, but cannot avoid stress damage at the moment of cutting. Furthermore, Example 1 of this application adopts low-temperature operation throughout, avoiding the potential impact of high temperature on the battery structure, so that the battery cell efficiency of this application has no significant difference before and after cutting, and can ensure good battery efficiency without the need for passivation repair, reducing the occurrence of edge chipping and cracking caused by cutting stress.

[0114] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A cutting structure for a solar cell, characterized in that: The method includes a whole cell to be cut, the whole cell including a cutting area, the cutting area having a UV-curable adhesive layer fixed thereon, the cutting area of ​​the whole cell being cut to form a half cell, the UV-curable adhesive layer fixed in the cutting area being cured by ultraviolet light irradiation, the UV-curable adhesive layer including prepolymer, active monomer, photoinitiator and stabilizer, wherein the weight percentage range of each raw material is 35-50% prepolymer, 45-60% active monomer, 1-6% photoinitiator and 1-2% stabilizer.

2. The cutting structure of a solar cell according to claim 1, characterized in that: The prepolymer includes epoxy acrylate, polyurethane acrylate and / or polyester acrylate; The active monomer includes tripropylene glycol diacrylate; The photoinitiator includes benzophenone; The stabilizing agents include o-hydroxybenzophenones, benzotriazoles, or triazine compounds.

3. The cutting structure of a solar cell according to claim 2, characterized in that: The stabilizing agents include 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octyloxybenzophenone, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-5-chlorobenzotriazole or 2'-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole.

4. The cutting structure of a solar cell according to claim 1, characterized in that: The thickness of the UV-curable adhesive layer is 50-150 μm.

5. A method for cutting a solar cell, characterized in that: The solar cell cutting structure as described in any one of claims 1-4 includes the following steps: Preparation of UV-curable adhesive layer: Apply UV-curable adhesive to the cut area of ​​the entire battery cell; UV curing adhesive layer curing: UV light is used to cure the cut area; Cutting: Laser cutting or wire cutting is performed on the area where the UV-cured adhesive layer is fixed to form a half cell; UV-cured adhesive layer debonding: UV light is used to irradiate the UV-cured adhesive layer on half of the cell to debond and remove it.

6. The method for cutting a solar cell according to claim 5, characterized in that, During the curing process of the UV-curable adhesive, the UV wavelength used is 395nm, the energy density range is 500-2000 mJ / cm², the light exposure time is 5-15 seconds, and the curing temperature is 20-30℃.

7. The method for cutting a solar cell according to claim 5, characterized in that, In the process of UV-cured adhesive peeling off: the UV wavelength used is 365nm, the energy density range is 3000-4000 mJ / cm², the light exposure time is 10-20s, and the light exposure temperature is 20-30℃.

8. A method for cutting a solar cell according to claim 5, characterized in that, In the preparation of the UV-curable adhesive layer, the thickness of the UV-curable adhesive layer is 50-150 μm.

9. A method for cutting a solar cell according to claim 5, characterized in that, Before applying UV-curing adhesive to the cut areas of the entire battery cell, the process also includes testing the entire battery cell.

10. The application of a method for cutting a solar cell according to any one of claims 5-9, characterized in that, After the UV-cured adhesive is desorbed, half of the cell is welded and the module is encapsulated to form a half-cell module.

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