Micro display panel packaging structure and forming method thereof

Abstract

The present application relates to a kind of micro display panel packaging structure and its forming method, micro display panel packaging structure includes: substrate, hollow in middle portion, and the substrate is configured to be able to be electrically connected with micro light emitting diode chip;Metal plate has bump, the substrate is fixedly connected with the metal plate, and the bump is configured to be able to insert the hollow portion of the substrate;And micro light emitting diode chip is set on the bump and is electrically connected with the substrate.In the micro display panel packaging structure of the present application, middle portion of substrate is hollow, metal plate with bump is assembled with substrate, micro light emitting diode chip is directly set on metal plate, and heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the field of micro light-emitting diode technology, and in particular to a micro display panel packaging structure and its formation method. Background Technology

[0002] With technological advancements, light-emitting diode (LED) chips are becoming increasingly miniaturized and integrated, leading to the emergence of micro LED chips, which have attracted widespread attention. Micro LED chips integrate a micro LED array epitaxial wafer and an integrated circuit backplane. Currently, this new type of micro LED chip lacks suitable packaging structures and processes.

[0003] Traditional packaging technology involves mounting a miniature LED chip onto a substrate and then electrically connecting the miniature LED chip to the substrate via wire bonding. However, this packaging structure suffers from poor heat dissipation. Summary of the Invention

[0004] To address at least some of the problems mentioned above in the prior art, the present invention aims to provide a micro-display panel packaging structure, comprising:

[0005] A substrate with a hollowed-out center, and the substrate is configured to be electrically connected to a micro light-emitting diode chip;

[0006] A metal plate having protrusions, a substrate fixedly connected to the metal plate, and the protrusions being configured to insert into a cutout portion of the substrate; and

[0007] A miniature light-emitting diode chip is disposed on the bump and electrically connected to the substrate.

[0008] Furthermore, the shape of the hollowed-out portion of the substrate is the same as the shape of the micro light-emitting diode chip.

[0009] Furthermore, the size of the cutout portion of the substrate is the same as or larger than the size of the micro LED chip.

[0010] Furthermore, the front side of the substrate is provided with multiple substrate pads.

[0011] Furthermore, multiple substrate pads are distributed around the cutout portion of the substrate.

[0012] Furthermore, multiple substrate pads are distributed on both sides, three sides, or one side of the cutout portion of the substrate.

[0013] Furthermore, a connector interface is provided on the back side of the substrate.

[0014] Furthermore, a power interface is provided on the back side of the substrate.

[0015] Furthermore, the substrate has multiple substrate through holes, which are distributed at multiple corners of the substrate.

[0016] Furthermore, the bump is located on the front side of the metal plate.

[0017] Furthermore, the back side of the substrate is bonded to the front side of the metal plate.

[0018] Furthermore, the size of the bump is the same as or smaller than the size of the cutout portion of the substrate.

[0019] Furthermore, the metal plate has a first notch configured to expose the connector interface when the metal plate is assembled with the substrate.

[0020] Furthermore, the size of the first notch is larger than the size of the connector interface.

[0021] Furthermore, the metal plate has a second notch configured to expose the power interface when the metal plate is assembled with the substrate.

[0022] Furthermore, the size of the second notch is larger than the size of the power interface.

[0023] Furthermore, the metal plate also has multiple metal plate through holes, which are distributed at multiple corners of the metal plate.

[0024] Furthermore, the front side of the micro LED chip is provided with multiple chip pads.

[0025] Furthermore, the chip pads are electrically connected to the substrate pads of the substrate via conductive lines.

[0026] Furthermore, the front side of the micro LED chip has a light-emitting area, and the light-emitting area has multiple micro LEDs arranged in an array.

[0027] Furthermore, multiple chip pads are distributed around the light-emitting area.

[0028] Furthermore, multiple chip pads are distributed on both sides of the light-emitting area, or on three sides of the light-emitting area, or on one side of the light-emitting area.

[0029] Furthermore, it also includes a connector, which is mounted at the connector interface of the substrate.

[0030] The present invention also provides a method for forming a micro-display panel encapsulation structure, comprising:

[0031] A substrate is arranged on the front side of a metal plate, wherein the center of the substrate is hollowed out, and the front side of the metal plate has a protrusion that inserts into the hollowed-out portion of the substrate; and

[0032] Miniature LED chips are arranged on bumps.

[0033] Furthermore, the front side of the micro LED chip has chip pads; and

[0034] The front side of the substrate has substrate pads.

[0035] Furthermore, it also includes connecting the chip pads to the substrate pads via conductive lines.

[0036] Furthermore, arranging the substrate on the front side of the metal plate includes:

[0037] A first adhesive material is disposed on the front side of the metal plate, the first adhesive material surrounding the protrusion; and

[0038] The substrate is placed on the front of the metal plate, the protrusion is inserted into the hollow part of the substrate, and then heated and pressurized to fix the metal plate and the substrate together with the first adhesive material.

[0039] Furthermore, the metal plate has multiple through holes, which are distributed at multiple corners of the metal plate; and

[0040] The substrate has multiple substrate through holes, which are distributed at multiple corners of the substrate.

[0041] Furthermore, during the process of placing the substrate on the front side of the metal plate, positioning is achieved through the through-holes in the metal plate and the through-holes in the substrate. When the central axes of the through-holes in the metal plate and the through-holes in the substrate coincide, the substrate and the metal plate are aligned.

[0042] Furthermore, the arrangement of the micro-LED chip on the bump includes:

[0043] A second adhesive material is applied to the surface of the protrusion; and

[0044] The micro LED chip is placed face up on the bump, and the back of the micro LED chip is in contact with the second adhesive material. After heating and pressurizing, the metal plate and the micro LED chip are fixed by the second adhesive material.

[0045] Furthermore, it also includes mounting the connector at the connector interface of the substrate, wherein the connector interface is located on the back side of the substrate.

[0046] Furthermore, the metal plate has a first notch, which exposes the connector interface after the metal plate is assembled with the substrate.

[0047] Furthermore, the back of the substrate has a power interface; and

[0048] The metal plate has a second notch that exposes the power interface after the metal plate is assembled with the substrate.

[0049] The present invention has at least the following beneficial effects: In the micro-display panel packaging structure of the present invention, the center of the substrate is hollowed out, and a metal plate with bumps is assembled with the substrate. The micro-light-emitting diode chip is directly mounted on the metal plate, which improves the heat dissipation effect. The bumps, in addition to ensuring that the micro-light-emitting diode chip can directly contact the metal plate, also form a snap-fit ​​connection with the substrate to increase the packaging strength. Furthermore, the metal plate has notches to expose the interface of the substrate to prevent short circuits. Moreover, the process for forming the micro-display panel packaging structure is simple and low in cost. Attached Figure Description

[0050] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0051] Figure 1A A front view schematic diagram of a micro-display panel packaging structure according to an embodiment of the present invention is shown;

[0052] Figure 1B A rear view schematic diagram of a micro-display panel packaging structure according to an embodiment of the present invention is shown;

[0053] Figure 1C An example of an embodiment of the invention is shown along Figure 1A A cross-sectional view of the PP' line in the middle section;

[0054] Figure 1D A right-side schematic view of a micro-display panel packaging structure according to an embodiment of the present invention is shown;

[0055] Figure 2A and 2B Schematic diagrams of the front and back sides of a substrate according to an embodiment of the present invention are shown respectively;

[0056] Figure 3A and 3B Schematic diagrams of the front and back sides of a metal plate according to an embodiment of the present invention are shown respectively;

[0057] Figure 3C A bottom view of a metal plate according to an embodiment of the present invention is shown;

[0058] Figure 4A and 4B Schematic diagrams of the front and back sides of a micro light-emitting diode chip according to an embodiment of the present invention are shown respectively;

[0059] Figure 5A A schematic diagram of the front side of a metal plate with a first adhesive material disposed thereon is shown according to an embodiment of the present invention;

[0060] Figure 5B A front view schematic diagram of a substrate and a metal plate assembled according to an embodiment of the present invention is shown;

[0061] Figure 5C An example of an embodiment of the invention is shown along Figure 5B Cross-sectional schematic diagram of line OO' in the middle;

[0062] Figure 5D A rear view schematic diagram of the substrate and metal plate after assembly according to an embodiment of the present invention is shown;

[0063] Figure 5E A schematic diagram showing a connector mounted on a substrate according to an embodiment of the present invention is shown;

[0064] Figure 5F A schematic diagram is shown after a second adhesive material is disposed on a protrusion according to an embodiment of the present invention;

[0065] Figure 5G A schematic diagram is shown after a miniature light-emitting diode chip is arranged on a bump according to an embodiment of the present invention;

[0066] Figure 5H An example of an embodiment of the invention is shown along Figure 5G A cross-sectional view of the QQ' line;

[0067] Figure 5I A schematic diagram of a substrate and a micro light-emitting diode chip after wire bonding according to an embodiment of the present invention is shown. Detailed Implementation

[0068] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0069] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0070] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0071] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0072] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0073] It should also be noted that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0074] Furthermore, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of the present invention, the order of each step can be adjusted according to the process.

[0075] like Figure 1A-1D As shown, a micro-display panel packaging structure includes a micro light-emitting diode chip 100, a substrate 200, a metal plate 300, and a connector 400.

[0076] like Figure 2A and 2B As shown, the center of the substrate 200 is hollowed out, and multiple substrate pads 201 are provided on the front side of the substrate 200. Furthermore, the shape of the hollowed-out portion of the substrate 200 is the same as the shape of the micro light-emitting diode chip 100, and the size of the hollowed-out portion of the substrate 200 is the same as or larger than the size of the micro light-emitting diode chip 100.

[0077] In some embodiments, a plurality of substrate pads 201 are distributed around the cutout portion of the substrate 200.

[0078] In other embodiments, multiple substrate pads 201 are distributed on both sides, three sides, or one side of the cutout portion of the substrate 200. The distribution of the substrate pads 201 is not limited.

[0079] In some embodiments, electronic components 202, such as one or more of capacitors, inductors, and resistors, are disposed on the front side of the substrate 200. The number of electronic components 202 is not limited.

[0080] In some embodiments, a connector interface 203 is provided on the back side of the substrate 200, and the connector interface 203 is used to connect to the connector 400.

[0081] In some embodiments, a power interface 204 is provided on the back side of the substrate 200 for connecting an external power source. Furthermore, the number of power interfaces 204 can be one or more, for example, three; the number of power interfaces 204 is not limited. The multiple power interfaces 204 can be of the same or different types, and their sizes can be the same or different. Furthermore, the multiple power interfaces 204 are located on the same side of the cutout portion of the substrate 200. In other embodiments, the multiple power interfaces 204 can also be distributed on both sides of the cutout portion of the substrate 200.

[0082] In some embodiments, the substrate 200 is further provided with substrate through holes 205, and the plurality of substrate through holes 205 are distributed at a plurality of corners of the substrate 200, wherein each corner may have one or more substrate through holes 205. For example, in a top view of the front of the substrate ( Figure 2A The substrate 200 has a circular hole and an oblong hole at its upper left corner, a circular hole at its lower left corner, and two circular holes at its lower right corner. The substrate through-hole 205 can be used for positioning. The metal plate 300 also has metal plate through-holes, the positions of which correspond to the positions of the substrate through-holes 205 on the substrate 200. When the substrate 200 and metal plate 300 are assembled, if the through-holes on the metal plate 300 coincide with the central axis of the substrate through-holes 205, it proves that the substrate 200 and metal plate 300 are aligned.

[0083] In some embodiments, the substrate 200 is quadrilateral, such as rectangular. Furthermore, the four corners of the substrate 200 are rounded.

[0084] like Figures 3A-3C As shown, the front side of the metal plate 300 has a bump 301, which is configured to be inserted into a cutout portion of the substrate 200. Furthermore, the shape of the bump 301 is the same as that of the cutout portion of the substrate 200, and the size of the bump 301 is the same as or slightly smaller than the size of the cutout portion of the substrate 200, allowing the bump 301 to be inserted into the substrate 200 from the cutout portion. For example, the length and width of the bump 301 are 50 micrometers to 300 micrometers smaller than the length and width of the cutout portion of the substrate 200.

[0085] Furthermore, the material of metal plate 300 is copper.

[0086] The metal plate 300 is an integrally formed irregularly shaped metal plate. The metal plate 300 has a first notch 302 and a second notch 303. If the first notch 302 and the second notch 303 are filled in, the shape of the metal plate 300 is quadrilateral, which is the same as the shape of the substrate 200. Furthermore, after filling in the first notch 302 and the second notch 303, the size of the metal plate 300 is the same as the size of the substrate 200.

[0087] The function of the first notch 302 is to expose the connector interface 203 when the metal plate 300 is assembled with the substrate 200. The size of the first notch 302 is larger than the size of the connector interface 203.

[0088] The function of the second notch 303 is to expose the power interface 204 when the metal plate 300 is assembled with the substrate 200. The size of the second notch 303 is larger than the size of the power interface 204.

[0089] Furthermore, the first gap 302 and the second gap 303 are adjacent.

[0090] In some embodiments, the metal plate 300 further has metal plate through holes 304, and a plurality of metal plate through holes 304 are distributed at a plurality of corners of the metal plate 300, wherein each corner may have one or more metal plate through holes 304. For example, in a top front view of the metal plate 30 ( Figure 3A The metal plate 300 has a round hole and an oblong hole at its upper left corner, a round hole at its lower left corner, and two round holes at its lower right corner. The metal plate through-hole 304 can be used for positioning. The position of the metal plate through-hole on the metal plate 300 corresponds to the position of the substrate through-hole 205 on the substrate 200. When the substrate 200 and the metal plate 300 are assembled, when the central axis of the metal plate through-hole 304 on the metal plate 300 coincides with that of the substrate through-hole 205, it proves that the substrate 200 and the metal plate 300 are aligned.

[0091] like Figure 4A and 4B As shown, the front side of the micro LED chip 100 has multiple chip pads 101. The chip pads 101 can be electrically connected to the substrate pads 201 of the substrate 200 via conductive lines. The front side of the micro LED chip 100 includes a light-emitting area 102 and a non-light-emitting area 103.

[0092] In some embodiments, a plurality of chip pads 101 are distributed around the light-emitting area 102 of the micro LED chip 100. The chip pads 101 are located in the non-light-emitting area 103.

[0093] In other embodiments, multiple chip pads 101 are distributed on both sides, three sides, or one side of the light-emitting area 102. The distribution of the substrate pads 201 is not limited.

[0094] Furthermore, the number of chip pads 101 is the same as the number of substrate pads 201.

[0095] In some embodiments, the light-emitting region has an array of micro-light-emitting diodes (LEDs). The size of each micro-LED chip is no more than 1 cm, preferably no more than 20 micrometers. The micro-LEDs are formed in an array within the micro-LED chip, with resolutions such as 720*480, 640*480, 1920*1080, 1280*720, 2K, or 4K. The diameter of the micro-LED structure is in the nanometer range, for example, 20 nm to 100 nm. Each micro-LED can form at least a portion of a pixel element on the micro-LED chip.

[0096] In some embodiments, the spacing of the micro-LED array, i.e. the minimum center-to-center distance between the micro-LEDs, can be between about 2 micrometers and about 50 micrometers.

[0097] In some embodiments, the number of pixels on a micro LED chip can range from thousands to millions.

[0098] In some embodiments, the micro LED chip also includes an integrated circuit (IC) backplane, with the micro LED array located on the IC backplane.

[0099] In some embodiments, the IC backplane can be electrically connected to a miniature light-emitting diode via a metal interconnect.

[0100] In some embodiments, the IC backplane can be electrically connected to each micro-LED in the micro-LED array via separate metal interconnects.

[0101] In some embodiments, each miniature LED can be individually electrically controlled by the IC backplane.

[0102] In some embodiments, a dielectric layer may be formed in the gaps between the micro-light-emitting diodes. In some embodiments, a dielectric layer may also be formed in the gaps between interconnects.

[0103] In some embodiments, each micro-LED in the micro-LED array may include a micrometer-scale mesa structure.

[0104] In some embodiments, the micron-scale mesa structure may include, from bottom to top, a first type epitaxial layer, a light-emitting layer, and a second type epitaxial layer. That is, in the three-layer structure, the first type epitaxial layer is closest to the IC backplane; the light-emitting layer is located above the first type epitaxial layer and further away from the IC backplane; and the second type epitaxial layer is located above the light-emitting layer and furthest away from the IC backplane.

[0105] In some embodiments, the light-emitting layer is formed of a plurality of stacked quantum well layers, particularly superlattice stacked quantum well layers. Preferably, the superlattice stacked quantum well layers include multiple pairs of quantum well layers stacked with quantum barrier layers.

[0106] In some embodiments, the first type of epitaxial layer is a semiconductor material having a first conductivity type and includes multiple semiconductor layers. The main substrate material of the first type of epitaxial layer may be, but is not limited to, materials such as Ga, N, As, P, In, or Al. Furthermore, the first type of epitaxial layer may, from top to bottom, include, but is not limited to, a waveguide layer, a confinement layer, a transition layer, and a window layer; additionally, an ohmic contact layer may be formed below the window layer.

[0107] In some embodiments, the second epitaxial layer is a semiconductor material having a second conductivity type and includes multiple semiconductor layers. The main substrate material of the second epitaxial layer may be, but is not limited to, materials such as Ga, N, As, P, In, or Al. Furthermore, the first epitaxial layer may include, from top to bottom, a confinement layer and a waveguide layer; additionally, in some embodiments, an ohmic contact layer may be formed on the confinement layer.

[0108] In some embodiments, a top conductive layer may be formed on the top surface of the micro-LED array. In some embodiments, the top conductive layer may be shared by all the micro-LEDs in the micro-LED array.

[0109] In some embodiments, the micro-LED array may include a single-layer micro-LED structure. In some embodiments, the micro-LED array may include a multi-layer vertically stacked micro-LED structure. In some embodiments, the micro-LED array may include blue micro-LEDs.

[0110] like Figure 1A-1D As shown, the substrate 200 is disposed on the metal plate 300, and the protrusions 301 of the metal plate 300 are inserted into the hollow portion of the substrate 200. Furthermore, the substrate 200 and the metal plate 300 are bonded together.

[0111] A miniature light-emitting diode chip 100 is disposed on a bump 301 of a metal plate 300. Furthermore, the back side of the miniature light-emitting diode chip 100 is bonded to the surface of the bump 301 of the metal plate 300.

[0112] The chip pad 101 of the micro light-emitting diode chip 100 is electrically connected to the substrate pad 201 of the substrate 200 via a conductive line 500.

[0113] The connector 400 is soldered onto the connector interface on the back side of the substrate 200.

[0114] A method for forming a microdisplay panel encapsulation structure includes the following steps:

[0115] Step 1, as follows Figures 5A to 5D As shown, a substrate 200 is arranged on the front side of a metal plate 300. The center of the substrate 200 is hollowed out, and the front side of the metal plate 300 has a protrusion 301 that is inserted into the hollowed-out portion of the substrate 200.

[0116] Specifically, a first adhesive material 501 is arranged on the front side of the metal plate 300, and the first adhesive material surrounds the protrusion 301. The substrate 200 is placed on the front side of the metal plate 300, the protrusion 301 is inserted into the hollow part of the substrate 200, and then heated and pressurized to fix the metal plate 300 and the substrate 200 by the first adhesive material.

[0117] Furthermore, the first bonding material can be conductive adhesive, silver paste, or heat-dissipating double-sided adhesive, etc.

[0118] In some embodiments, a connector interface 203 is provided on the back side of the substrate 200, and the connector interface 203 is used to connect to the connector 400.

[0119] In some embodiments, a power interface 204 is provided on the back side of the substrate 200 for connecting an external power source.

[0120] Furthermore, the number of power interfaces 204 can be one or more, such as three, and there is no limit to the number of power interfaces 204. The multiple power interfaces 204 can be of the same or different types, and their sizes can be the same or different. Furthermore, the multiple power interfaces 204 are located on the same side of the cutout portion of the substrate 200.

[0121] In other embodiments, multiple power interfaces 204 may also be distributed on both sides of the cutout portion of the substrate 200.

[0122] In some embodiments, the substrate 200 has substrate through-holes 205, and a plurality of substrate through-holes 205 are distributed at a plurality of corners of the substrate 200, wherein each corner may have one or more substrate through-holes 205. For example, in a front top view of the substrate and metal plate combined ( Figure 5B The substrate 200 has a circular hole and an oblong hole at its upper left corner, a circular hole at its lower left corner, and two circular holes at its lower right corner. The through-hole 205 can be used for positioning.

[0123] In some embodiments, the metal plate 300 has metal plate through holes 304, and a plurality of metal plate through holes 304 are distributed at a plurality of corners of the metal plate 300, wherein each corner may have one or more metal plate through holes 304. For example, in a top view of the front of the metal plate ( Figure 5A The metal plate 300 has a round hole and an oblong hole at its upper left corner, a round hole at its lower left corner, and two round holes at its lower right corner. The through hole 304 in the metal plate can be used for positioning.

[0124] Furthermore, during the process of placing the substrate 200 on the front side of the metal plate 300, positioning is achieved through the metal plate through hole 304 and the substrate through hole 205. When the central axis of the metal plate through hole 304 on the metal plate 300 coincides with that of the substrate through hole 205, it proves that the substrate 200 and the metal plate 300 are aligned.

[0125] The metal plate 300 is an integrally formed irregularly shaped metal plate. The metal plate 300 has a first notch 302 and a second notch 303. If the first notch 302 and the second notch 303 are filled in, the shape of the metal plate 300 is quadrilateral, which is the same as the shape of the substrate 200. Furthermore, after filling in the first notch 302 and the second notch 303, the size of the metal plate 300 is the same as the size of the substrate 200.

[0126] The function of the first notch 302 is to expose the connector interface 203 when the metal plate 300 is assembled with the substrate 200. The size of the first notch 302 is larger than the size of the connector interface 203.

[0127] The function of the second notch 303 is to expose the power interface 204 when the metal plate 300 is assembled with the substrate 200. The size of the second notch 303 is larger than the size of the power interface 204.

[0128] Furthermore, the first gap 302 and the second gap 303 are adjacent.

[0129] Step 2, as follows Figure 5E As shown, connector 400 is installed at connector interface 203 of substrate 200.

[0130] Step 3, as follows Figures 5F to 5H As shown, the micro LED chip 100 is mounted upright on the bump 301. Specifically, a second adhesive material 502 is disposed on the surface of the bump 301, and then the micro LED chip 100 is placed on the bump 301 with its front side facing up, and the back side of the micro LED chip 100 is in contact with the second adhesive material 502. Then, through heating and pressurization, the metal plate 300 and the micro LED chip 100 are fixed together by the second adhesive material 502.

[0131] Furthermore, the area occupied by the second adhesive material 502 does not exceed the size of the surface of the bump and does not exceed the size of the back side of the chip.

[0132] Furthermore, the second adhesive material 502 can be conductive adhesive, silver paste, or heat-dissipating double-sided adhesive, etc.

[0133] Step 3, as follows Figure 5I As shown, the chip pad 101 and the substrate pad 201 are connected by a conductive line 500 through a wire bonding process.

[0134] The front side of the micro light-emitting diode chip 100 has chip pads 101; the front side of the substrate 200 has substrate pads 201.

[0135] While some embodiments of the present invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A micro-display panel packaging structure, characterized in that, include: A substrate with a hollowed-out center, and the substrate is configured to be electrically connected to a micro light-emitting diode chip; A metal plate having protrusions, a substrate being fixedly connected to the metal plate, and the protrusions being configured to be inserted into a cutout portion of the substrate; as well as A miniature light-emitting diode chip is disposed on the bump and electrically connected to the substrate.

2. The micro-display panel packaging structure according to claim 1, characterized in that, The shape of the hollowed-out portion of the substrate is the same as that of the micro light-emitting diode chip.

3. The micro-display panel packaging structure according to claim 2, characterized in that, The size of the cutout portion of the substrate is the same as or larger than the size of the micro LED chip.

4. The micro-display panel packaging structure according to claim 1, characterized in that, The front side of the substrate has multiple substrate pads.

5. The micro-display panel packaging structure according to claim 4, characterized in that, Multiple substrate pads are distributed around the cutout portion of the substrate.

6. The micro-display panel packaging structure according to claim 4, characterized in that, Multiple substrate pads are distributed on both sides, three sides, or one side of the cutout portion of the substrate.

7. The micro-display panel packaging structure according to claim 1, characterized in that, A connector interface is provided on the back side of the substrate.

8. The micro-display panel packaging structure according to claim 1, characterized in that, A power interface is provided on the back of the substrate.

9. The micro-display panel packaging structure according to claim 1, characterized in that, The substrate has multiple substrate through holes, which are distributed at multiple corners of the substrate.

10. The micro-display panel packaging structure according to claim 1, characterized in that, The bump is located on the front side of the metal plate.

11. The micro-display panel packaging structure according to claim 10, characterized in that, The back side of the substrate is bonded to the front side of the metal plate.

12. The micro-display panel packaging structure according to claim 1, characterized in that, The size of the bump is the same as or smaller than the size of the cutout portion of the substrate.

13. The microdisplay panel packaging structure according to claim 7, characterized in that, The metal plate has a first notch configured to expose the connector interface when the metal plate is assembled with the substrate.

14. The micro-display panel packaging structure according to claim 13, characterized in that, The size of the first notch is larger than the size of the connector interface.

15. The micro-display panel packaging structure according to claim 8, characterized in that, The metal plate has a second notch configured to expose the power interface when the metal plate is assembled with the substrate.

16. The micro-display panel packaging structure according to claim 15, characterized in that, The second notch is larger than the power interface.

17. The micro-display panel packaging structure according to claim 8, characterized in that, The metal plate also has multiple through holes, which are distributed at multiple corners of the metal plate.

18. The micro-display panel packaging structure according to claim 4, characterized in that, The front side of the micro LED chip has multiple chip pads.

19. The microdisplay panel packaging structure according to claim 18, characterized in that, The chip pads are electrically connected to the substrate pads of the substrate via conductive lines.

20. The microdisplay panel packaging structure according to claim 18, characterized in that, The front side of the micro LED chip has a light-emitting area, and the light-emitting area has multiple micro LEDs arranged in an array.

21. The microdisplay panel packaging structure according to claim 20, characterized in that, Multiple chip pads are distributed around the light-emitting area.

22. The microdisplay panel packaging structure according to claim 20, characterized in that, Multiple chip pads are distributed on both sides of the light-emitting area, or on three sides of the light-emitting area, or on one side of the light-emitting area.

23. The micro-display panel packaging structure according to claim 7, characterized in that, It also includes a connector, which is mounted at the connector interface of the substrate.

24. A method for forming a micro-display panel encapsulation structure, characterized in that, include: A substrate is arranged on the front side of a metal plate, wherein the center of the substrate is hollowed out, and the front side of the metal plate has a protrusion that is inserted into the hollowed-out portion of the substrate. as well as Miniature LED chips are arranged on bumps.

25. The method for forming a micro-display panel encapsulation structure according to claim 24, characterized in that, The front side of the micro LED chip has chip pads; and The front side of the substrate has substrate pads.

26. The method for forming a micro-display panel encapsulation structure according to claim 25, characterized in that, Also includes: The chip pads are connected to the substrate pads via conductive lines.

27. The method for forming a micro-display panel encapsulation structure according to claim 24, characterized in that, Arranging the substrate on the front side of the metal plate includes: A first adhesive material is disposed on the front side of the metal plate, the first adhesive material surrounding the protrusion; and The substrate is placed on the front of the metal plate, the protrusion is inserted into the hollow part of the substrate, and then heated and pressurized to fix the metal plate and the substrate together with the first adhesive material.

28. The method for forming a micro-display panel encapsulation structure according to claim 27, characterized in that, The metal plate has multiple through holes, which are distributed at multiple corners of the metal plate; and The substrate has multiple substrate through holes, which are distributed at multiple corners of the substrate.

29. The method for forming a micro-display panel encapsulation structure according to claim 28, characterized in that, During the process of placing the substrate on the front side of the metal plate, positioning is achieved through the through-holes in the metal plate and the through-holes in the substrate. When the central axes of the through-holes in the metal plate and the through-holes in the substrate coincide, the substrate and the metal plate are aligned.

30. The method for forming a micro-display panel encapsulation structure according to claim 28, characterized in that, The arrangement of miniature light-emitting diode chips on the bumps includes: A second adhesive material is applied to the surface of the protrusion; and The micro LED chip is placed face up on the bump, and the back of the micro LED chip is in contact with the second adhesive material. After heating and pressurizing, the metal plate and the micro LED chip are fixed by the second adhesive material.

31. The method for forming a micro-display panel encapsulation structure according to claim 24, characterized in that, It also includes mounting the connector at the connector interface of the substrate, wherein the connector interface is located on the back side of the substrate.

32. The method for forming a micro-display panel encapsulation structure according to claim 31, characterized in that, The metal plate has a first notch, which exposes the connector interface after the metal plate is assembled with the substrate.

33. The method for forming a micro-display panel encapsulation structure according to claim 24, characterized in that, The back of the substrate has a power interface; and The metal plate has a second notch that exposes the power interface after the metal plate is assembled with the substrate.

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