A Micro LED display device

Abstract

This invention discloses a Micro LED display device, including a substrate, a driving region and a display region disposed on the same side of the substrate, and a fan-out transition layer disposed between the driving region and the display region. The driving region is provided with a driving circuit, and the display region is provided with a Micro LED lamp bead array. The fan-out transition layer includes a plurality of transition connection lines extending from the driving region toward the display region. The input ends of the plurality of transition connection lines are correspondingly connected to the output ends of the driving circuit, and the output ends of the plurality of transition connection lines are correspondingly connected to the input ends of the Micro LED lamp bead array. The linewidth of the transition connection lines gradually decreases along the direction from one end of the driving region to the end of the display region. The orderly integration and connection of the driving region and the display region are completed on a single side of the same substrate, improving the rationality of the layout and enabling pitch rearrangement and smooth impedance transition. This achieves an orderly transition connection between the driving region and the high-density display region under a single-sided integrated layout, improving the driving stability and display consistency of the device.

Description

Technical Field

[0001] This invention relates to the field of LED devices, and more particularly to a Micro LED display device. Background Technology

[0002] Micro LED display technology, as one of the next-generation display technologies, boasts advantages such as high brightness, fast response speed, low power consumption, long lifespan, and the ability to achieve high-resolution displays. In recent years, it has shown significant application value in fields such as transparent displays, automotive head-up displays (HUDs), wearable displays, window advertising displays, smart terminal display modules, and micro-projection devices. Especially in the areas of transparent displays and highly integrated display modules, to balance display quality, device thinning, and structural integration, related products place higher demands on the connection and layout between the internal driving structure and pixel array structure of the display device. Therefore, how to effectively integrate the driving functional area and the high-density display area within a limited space has become an important technical direction in the structural design of Micro LED display devices.

[0003] In existing Micro LED display devices, the driver chip and the Micro LED pixel array are typically placed in different areas of the substrate, or even on opposite sides, and signal conduction is achieved through through-board interconnects, wire bonding, or an additional PCB carrier. Due to the significant difference between the output pitch of the driver chip and the input pitch of the pixel array, existing technologies often use a single-layer metal trace for direct connection between the two. This results in a sharp contraction and abrupt change in linewidth of the signal line within a short transition distance. This structure easily leads to drastic changes in signal path impedance, causing reflection, attenuation, and transmission mismatch of the driving signal, thus affecting the uniformity and consistency of the pixel array display and limiting the device's integration density and overall reliability.

[0004] Therefore, existing technologies need to be improved to solve the technical problem of unstable signal transition between the driver chip and high-density display pixels in Micro LED display devices. Summary of the Invention

[0005] The purpose of this invention is to provide a Micro LED display device that solves the technical problem of unstable signal transition between the driver chip and high-density display pixels in Micro LED display devices.

[0006] To achieve this objective, the present invention adopts the following technical solution: A Micro LED display device includes a substrate, a driving region and a display region disposed on the same side of the substrate, and a fan-out transition layer disposed between the driving region and the display region. The driving area is provided with a driving circuit, the display area is provided with a Micro LED lamp bead array, and the fan-out transition layer includes a plurality of transition connection lines extending from the driving area toward the display area. The input ends of the plurality of transition connection lines are connected to the output ends of the driving circuit, and the output ends of the plurality of transition connection lines are connected to the input ends of the Micro LED lamp bead array. Along the direction from one end of the driving area to the end of the display area, the line width of the transition connection line is set to gradually decrease.

[0007] Optionally, the fan-out transition layer further includes at least one current equalization distribution branch extending in the lateral direction and intersecting with at least a portion of the transition connection line to form current distribution between multiple adjacent signal paths.

[0008] Optionally, the fan-out transition layer further includes a thermal management area, which is located in the side and / or edge region of the transition connection line and extends along the direction from the driving area toward the display area; The thermal management zone is located adjacent to the transition connection line and is distributed parallel to the transition connection line on the plane.

[0009] Optionally, the thermal management area is provided in at least two sets, and the at least two sets of thermal management areas are respectively located on the left and right sides of the distribution area of ​​the transition connection line, so as to form a thermal buffer structure located on both sides of the fan-out transition layer.

[0010] Optionally, the thermal management area includes a sheet-like connecting segment extending longitudinally, and a plurality of connecting segments spaced laterally and extending toward the distribution area of ​​the transition connecting line; Among them, multiple connecting segments are adjacent to and parallel to the corresponding distribution areas of the transition connecting lines.

[0011] Optionally, the fan-out transition layer further includes an isolation region, which is disposed at at least a portion of the boundary of the fan-out transition layer; The isolation zone includes a main isolation strip extending in the lateral direction and a side isolation strip extending in the longitudinal direction. The main isolation strip is located on the side of the transition connection line near the display area, and the side isolation strip is located on the side of the distribution area of ​​the transition connection line. At least one of the main isolation strip and the side isolation strip is continuously distributed along the boundary of the fan-out transition layer to define the arrangement range of the transition connection line.

[0012] Optionally, the substrate is a transparent substrate, which may be a transparent glass substrate or a transparent polymer substrate; In the display area, there are gaps between adjacent Micro LED beads, and multiple gaps are connected to form a light-transmitting structure.

[0013] Optionally, the substrate includes, from bottom to top, a transparent support layer, a conductive pattern base layer, an insulating spacer layer, and a redistribution connection layer; The driving area and the display area are respectively disposed in the corresponding areas of the redistribution connection layer, and the fan-out transition layer is formed in the redistribution connection layer and / or the conductive pattern base layer, so that a hierarchical connection structure located on the same side of the substrate is formed between the driving area and the display area.

[0014] Optionally, the driving area includes a driving chip arrangement area, a functional device arrangement area, and an interface connection area; The driver chip arrangement area is located in the middle of the driver area, the functional device arrangement area is located on at least one side of the driver chip arrangement area, and the interface connection area is located on the side of the driver area away from the fan-out transition layer. The driving circuit is formed in the driving chip arrangement area and the functional device arrangement area, and its output terminal is distributed towards the fan-out transition layer.

[0015] Optionally, the width of the distribution area of ​​the transition connection line in the lateral direction accounts for 50% to 85% of the overall width of the fan-out transition layer; The width of each thermal management zone in the horizontal direction accounts for 5% to 20% of the overall width of the fan-out transition layer.

[0016] Compared with the prior art, the present invention has the following beneficial effects: When the Micro LED display device is working, the driving circuit in the driving area first outputs the corresponding driving signal. The driving signal is transmitted to the input end of multiple transition connection lines in the fan-out transition layer via the output end of the driving circuit. Since the multiple transition connection lines extend and are distributed along the driving area toward the display area, and their line widths are gradually decreasing, the line width of the driving signal gradually narrows as it is transmitted along the transition connection lines. This causes the larger pitch on the driving area side to gradually transition to a smaller pitch input connection adapted to the high-density pixel array of the display area, so that the impedance of the signal path gradually transitions from low to an impedance state adapted to the high-density pixel input end, thereby realizing the driving signal's effect on the Micro LED display. Stable driving and display control of LED bead arrays; the orderly integration and connection of the driving area and display area are completed on a single side of the same substrate, improving the rationality of the layout and enabling pitch rearrangement and smooth impedance transition, realizing an orderly transition connection between the driving area and the high-density display area under a single-sided integrated layout; the device uses the gradually narrowing linewidth of the transition connection line and its arrangement relationship from the driving area to the display area to gradually transform the wider and sparser output connection at the driving end into the narrower and denser input connection at the display end, avoiding sudden contraction of the connection line in a local area, reducing the risk of current concentration, voltage drop abrupt change and signal transmission mismatch, thereby improving the driving stability and display consistency of the Micro LED bead array. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0019] Figure 1 This is a schematic diagram of the overall structure of a Micro LED display device; Figure 2 This is a schematic diagram of the structural layout of the display area of ​​a Micro LED display device; Figure 3 A schematic diagram of the layout structure of the fan-out transition layer for a Micro LED display device; Figure 4 For Micro LED display devices Figure 3 A magnified schematic diagram of the partial structure at point A in the middle; Illustration: Substrate 100, driving area 110, display area 120, fan-out transition layer 130, driving circuit 200, MicroLED lamp bead array 300, transition connection line 131, current equalization distribution branch 132, thermal management area 133, sheet-like connection segment 1331, connection segment 1332, isolation area 134, main isolation strip 1341, side isolation strip 1342, spacer 121, driving chip arrangement area 111, functional device arrangement area 112, interface connection area 113. Detailed Implementation

[0020] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] Combination Figures 1 to 4 As shown, this embodiment of the invention provides a Micro LED display device, including a substrate 100, a driving region 110 and a display region 120 disposed on the same side of the substrate 100, and a fan-out transition layer 130 disposed between the driving region 110 and the display region 120, so that the functional areas of the device are arranged in an orderly manner along the same direction. It should be noted that, in the following text, the longitudinal direction refers to the length direction along the substrate 100, and the transverse direction is the direction along the plane of the substrate 100 and perpendicular to the length of the substrate 100.

[0024] This configuration allows for a more compact overall device structure, reduces the structural complexity caused by traditional double-sided wiring, flip-out routing, or cross-layer connections, and facilitates the integration of driving and display functions within a limited area.

[0025] Combination Figure 1 As shown, the driving area 110 is provided with a driving circuit 200, the display area 120 is provided with a Micro LED lamp bead array 300, and the fan-out transition layer 130 includes a plurality of transition connection lines 131 extending from the driving area 110 toward the display area 120. The input ends of the plurality of transition connection lines 131 are connected to the output ends of the driving circuit 200, and the output ends of the plurality of transition connection lines 131 are connected to the input ends of the Micro LED lamp bead array 300. It should be noted that the driving area 110 integrates a driving circuit 200, which can output driving signals corresponding to display control; the display area 120 is provided with a regularly arranged Micro LED lamp bead array 300, and each Micro LED lamp bead array 300 forms a display unit according to a predetermined pixel arrangement. The driving signals output by the driving circuit 200 are not directly and randomly introduced into the display area 120, but are first orderly distributed through multiple transition connection lines 131 in the fan-out transition layer 130 before being introduced into the corresponding Micro LED lamp bead array 300.

[0026] Combination Figure 3 and Figure 4 As shown, preferably, the line width of the transition connection line 131 gradually decreases along the direction from one end of the driving area 110 to the end of the display area 120.

[0027] Furthermore, the multiple transition connection lines 131 within the fan-out transition layer 130 not only have a linewidth tapering relationship but also a center-to-center spacing tapering relationship. Specifically, adjacent transition connection lines 131 near the driving area 110 have a first center-to-center spacing P1, and adjacent transition connection lines 131 near the display area 120 have a second center-to-center spacing P2, where P1 is greater than P2; in the direction from the driving area 110 towards the display area 120, the center-to-center spacing between adjacent transition connection lines 131 gradually transitions from the first center-to-center spacing P1 to the second center-to-center spacing P2. Thus, the transition connection lines 131 simultaneously complete both linewidth tapering and pitch tapering, enabling the larger pad pitch at the output end of the driving circuit 200 to be gradually rearranged to adapt to the smaller pixel pitch at the input end of the Micro LED lamp bead array 300.

[0028] The transition connection line 131 does not maintain the same linewidth throughout, but rather gradually narrows along the extension direction from the driving area 110 towards the display area 120. Specifically, the transition connection line 131 closer to the driving area 110 has a relatively larger linewidth to accommodate the relatively large pitch and high connection stability requirements of the output end of the driving area 110. As the transition connection line 131 gradually extends towards the display area 120, its linewidth gradually decreases, allowing the connection line to gradually adapt to the high-density input distribution of the MicroLED lamp bead array 300 within the display area 120. Through this gradual linewidth layout, the connection between the driving area 110 side and the display area 120 side no longer exhibits an abrupt narrowing, but rather forms a continuous and gentle transition process.

[0029] Specifically, at least some of the transition connection lines 131 are not simply single straight conductive lines, but are formed as a continuous, branching conductive pattern. Specifically, each set of transition connection lines 131 may include an input backbone section near the driving area 110, a tapered transition section extending from the input backbone section towards the display area 120, and at least one branch connection section extending from the end of the tapered transition section towards the corresponding input position within the display area 120. The input backbone section is used to connect to the output pads or output conductive terminals of the driving circuit 200. The tapered transition section completes the continuous transition from a larger linewidth and pitch on the driving area 110 side to a smaller linewidth and pitch on the display area 120 side. The branch connection section is used to guide the driving signal transmitted through the tapered transition section to the corresponding pixel input terminal, column input terminal, or row input terminal in the Micro LED lamp bead array 300.

[0030] In practical design, this gradient process can be adjusted in combination with the drive end layout density, display end pixel pitch and overall device size to balance connection reliability and high-density display layout requirements.

[0031] The working principle of this invention is as follows: When this Micro LED display device is working, the driving circuit 200 in the driving area 110 first outputs a corresponding driving signal. The driving signal is transmitted to the input end of multiple transition connection lines 131 in the fan-out transition layer 130 via the output end of the driving circuit 200. Since the multiple transition connection lines 131 extend and are distributed along the driving area 110 toward the display area 120, and their line widths are gradually decreasing, the line width of the driving signal gradually narrows as it is transmitted along the transition connection lines 131. This causes the larger pitch on the driving area 110 side to gradually transition to a smaller pitch input connection adapted to the high-density pixel array of the display area 120, so that the impedance of the signal path gradually transitions from low to an impedance state adapted to the high-density pixel input end, thereby realizing the driving signal's effect on the Micro LED display. Stable driving and display control of the LED lamp bead array 300; the orderly integration and connection of the driving area 110 and the display area 120 are completed on a single side of the same substrate 100, improving the rationality of the layout and enabling pitch rearrangement and smooth impedance transition. This achieves an orderly transition connection between the driving area 110 and the high-density display area 120 under the single-sided integrated layout. The device uses the gradually narrowing linewidth of the transition connection line and its arrangement relationship from the driving area to the display area to gradually transform the wider and sparser output connection at the driving end into the narrower and denser input connection at the display end. This avoids sudden contraction of the connection line in a local area, reduces the risk of current concentration, voltage drop change and signal transmission mismatch, thereby improving the driving stability and display consistency of the Micro LED lamp bead array.

[0032] It should be noted that the gradual transition of the signal path impedance from low to an impedance state suitable for the high-density pixel input means that the tapering of the linewidth is not merely used to change the external dimensions of the transition connection line 131, but rather to make the changes in the equivalent conductive cross-sectional area, line resistance, and parasitic capacitance of the transition connection line 131 along the signal transmission direction more continuous. If the wider output conductor on the driving area 110 side abruptly changes to the narrower input conductor on the display area 120 side, the abrupt change location is prone to forming a current congestion area, causing an increase in local current density and resulting in concentrated voltage drop, concentrated heat generation, or distortion at the edges of the driving signal. In contrast, this embodiment gradually reduces the linewidth of the transition connection line 131 along the transmission direction, causing the current to gradually converge from the wide line area to the narrow line area, reducing the current concentration at the abrupt contraction location, and allowing adjacent pixel inputs to obtain closer driving current and driving voltage, thereby improving the display brightness consistency of the Micro LED lamp bead array 300.

[0033] In this embodiment, combined with Figure 3 As shown, the fan-out transition layer 130 further includes at least one current equalization distribution branch 132, which extends in the lateral direction and intersects with at least a portion of the line in the transition connection line 131, for forming current distribution between multiple adjacent signal paths.

[0034] Specifically, the current balancing branch 132 can be located in the upper region, middle region, or a local region near the display area 120 of the fan-out transition layer 130. Its extension direction intersects with the main extension direction of the transition connection line 131, causing the signal path, which was originally transmitted mainly along the longitudinal direction, to form a lateral current redistribution relationship at a local location. In this way, when multiple adjacent transition connection lines 131 correspond to different drive output channels, the current balancing branch 132 can make the current distribution between adjacent paths smoother, thereby reducing the uneven current distribution between channels caused by differences in local path length, line width, or connection status.

[0035] Furthermore, in actual implementation, the current equalization distribution branch 132 can be formed in the form of strip-shaped conductive lines, horizontal bridging lines or local bus lines. Its number can be set according to the arrangement density of the transition connection line 131, the number of signal channels and the driving consistency requirements of the display area 120, thereby helping to improve the power uniformity and display stability of each Micro LED lamp bead array 300 in the display area 120.

[0036] It should be noted that the current balancing branch 132 is not used to arbitrarily connect all different control signals via transition lines 131. Instead, it is preferably located between adjacent transition lines 131 that are in the same scan row, the same column drive group, the same common electrode group, the same power supply polarity group, or have the same drive potential relationship. In other words, the multiple transition lines 131 connected by the current balancing branch 132 belong to the same type of signal path that can share current or balance potential, thereby avoiding unexpected short circuits between different control signals.

[0037] As another option, when the current equalization distribution branch 132 needs to be set between adjacent but not completely equal potential signal paths, a current limiting section, a narrow neck section, a resistive film section or a high-resistance conductive section can be connected in series on the current equalization distribution branch 132, so that it only provides a slow equalization effect when the local potential difference is small, without destroying the independent control relationship of the corresponding drive signals of each transition connection line 131.

[0038] The cross-connection between the current balancing branch 132 and the transition connection line 131 can be achieved by: forming an integrated conductive node at its location, which is located within the same conductive pattern layer as the transition connection line 131 and formed through the same patterning process; or, the current balancing branch 132 and the transition connection line 131 can be located in different conductive layers and electrically connected through interlayer vias penetrating the insulating spacer layer. For cross-connections where electrical connection is not required, the current balancing branch 132 and the corresponding transition connection line 131 can be separated by an insulating spacer layer to avoid misconnections between non-target signal paths.

[0039] In this embodiment, combined with Figure 3 As shown, the fan-out transition layer 130 also includes a thermal management area 133, which is located in the side area and / or edge area of ​​the transition connection line 131 and extends along the direction from the drive area 110 toward the display area 120. The thermal management area 133 is disposed adjacent to the transition connection line 131 and is distributed in parallel with the transition connection line 131 on the plane.

[0040] It should be noted that the thermal management area 133 may be located on one side, both sides or a local edge of the distribution area of ​​the transition connection line 131, and shall be adjacent to the transition connection line 131, so that while the transition connection line 131 undertakes the signal transmission function, its surrounding area has the spatial conditions for heat buffering and heat diffusion.

[0041] Since the transition area between the driving area 110 and the display area 120 has both changes in line density and potential local current concentration, a thermal management area 133 is set in the side and / or edge area of ​​the transition connection line 131. This is beneficial to improve the heat distribution state within the fan-out transition layer 130 and reduce the tendency of heat to be concentrated and transferred along a single signal path.

[0042] Furthermore, the thermal management area 133 can form a continuous heat-conducting region, a locally extended region, or a mesh-like heat diffusion region. Its material can be set in conjunction with the conductive functional layer in the fan-out transition layer 130, or it can be formed by an independent thermally conductive structure, thereby improving the overall thermal stability and structural reliability of the fan-out transition layer 130 without interfering with the main transmission path of the transition connection line 131.

[0043] In this embodiment, the thermal management area 133 can be formed using a metal thermally conductive layer, a transparent conductive oxide layer, a graphene thermally conductive layer, a metal oxide thermally conductive layer, or an insulating thermally conductive adhesive layer. When the thermal management area 133 is formed using a conductive material, an insulating gap is provided between the thermal management area 133 and the transition connection line 131, or the thermal management area 133 is configured as a ground reference area, a common potential area, or an electrically levitated area to avoid forming an unintended electrical connection between the thermal management area 133 and the transition connection line 131. When the thermal management area 133 is formed using an insulating thermally conductive material, it can be arranged directly adjacent to the transition connection line 131 to improve lateral heat dissipation capability without affecting the signal transmission path.

[0044] As an optional solution in this embodiment, combined with Figure 3 As shown, the thermal management zone 133 is provided with at least two sets, and the at least two sets of thermal management zones 133 are located on the left and right sides of the distribution area of ​​the transition connection line 131, respectively, to form a thermal buffer structure on both sides of the fan-out transition layer 130.

[0045] By using this left-right distributed arrangement, the fan-out transition layer 130 forms a functional partition structure of "central transmission and side buffer" in the planar layout, so that the local heat generated during the transfer from the driving area 110 to the display area 120 can be dispersed to both sides, avoiding excessive heat concentration in the central area where the transition connection lines 131 are densely arranged.

[0046] This dual-sided distributed thermal management structure is particularly suitable for device layouts where the output terminals of the drive area 110 are relatively concentrated and the input terminals of the display area 120 are relatively dense. In such scenarios, the fan-out area often bears both high wiring density and complex connection relationships. By setting thermal management areas 133 on the left and right sides respectively, the transition area can be made more geometrically stable and the heat distribution more balanced. Furthermore, at least two sets of thermal management areas 133 can be arranged symmetrically or non-symmetrically according to the device width, fan-out area width, and local heat load level to adapt to different layout design requirements.

[0047] In this embodiment, the thermal management area 133 includes a sheet-like connecting segment 1331 extending longitudinally, and a plurality of connecting segments 1332 spaced laterally and extending toward the distribution area of ​​the transition connecting line 131; wherein the plurality of connecting segments 1332 are adjacent to and parallel to the distribution area of ​​the corresponding transition connecting line 131.

[0048] Specifically, the sheet-like connecting segment 1331 can serve as the main support part of the thermal management zone 133, which is arranged along the main extension direction of the fan-out transition layer 130, thereby forming a continuous heat conduction foundation as a whole; multiple connecting segments 1332 extend from the sheet-like connecting segment 1331 toward the distribution area of ​​the transition connecting line 131, and maintain an adjacent and parallel relationship with the distribution area of ​​the transition connecting line 131 to form a local heat exchange interface.

[0049] Through this "main body + branch segment" structure, the thermal management zone 133 has both continuous longitudinal heat conduction capability and can locally approach the densely distributed area of ​​the transition connection line 131 in the transverse direction, thereby enhancing the response capability to key thermal zones.

[0050] Furthermore, a certain spacing can be maintained between multiple connecting segments 1332 to avoid excessive occupation of the normal wiring of the transition connecting line 131, while also allowing the thermal management area 133 to form a comb-like, finger-like, or segmented thermal expansion pattern on the plane. With this arrangement, on the one hand, the coverage capability of the thermal management area 133 for local heat-generating areas can be improved, and on the other hand, it is also beneficial to improve the thermal uniformity and overall operational stability of the fan-out transition layer 130 without significantly increasing the structural complexity.

[0051] It should be noted that the multiple connection segments 1332 can respectively correspond to areas with significant changes in line width in the transition connection line 131, areas with small spacing between adjacent transition connection lines 131, or areas where branch connection segments converge. Each connection segment 1332 maintains a preset insulation distance from adjacent transition connection lines 131. This preset insulation distance is greater than the minimum inter-line insulation distance of the rewiring connection layer to avoid the thermal management area 133 occupying the electrical isolation space of the transition connection line 131. A clearance gap is formed between two adjacent connection segments 1332. This clearance gap is used for the arrangement of branch segments, bends, or end connection pads of the transition connection line 131, so that the thermal management area 133 is close to the heat-generating area without compromising the routing freedom of the fan-out transition layer 130.

[0052] As a preferred embodiment, along the lateral direction of the fan-out transition layer 130, the width of the thermal management area 133 is greater than the line width of a single transition connection line 131; along the longitudinal direction of the fan-out transition layer 130, the length of the thermal management area 133 is not less than the length of the region where the line width of the transition connection line 131 gradually changes.

[0053] The reason for this design is that the thermal management zone 133 does not serve as a single-path conductor, but rather needs to cover the critical transition areas in the fan-out transition layer 130 where the line width changes significantly and the line layout is complex. Therefore, it needs to have sufficient coverage in both the horizontal and vertical directions.

[0054] Specifically, a larger lateral width is beneficial to enhancing the heat dissipation capacity of the thermal management zone 133 in the plane, so that local heat can be spread in the lateral direction; while a longitudinal dimension that is not less than the length of the gradient region allows the thermal management zone 133 to fully correspond to the area where the linewidth of the transition connection line 131 changes most significantly, thereby providing a more effective structural buffer in such transitional areas where stress and heat are relatively concentrated.

[0055] Furthermore, in actual design, the lateral width and longitudinal length of the thermal management area 133 can be matched and adjusted according to the maximum line width, minimum line width, gradient distance and overall size of the fan-out area of ​​the transition connection line 131, so as to take into account both layout utilization and thermal stability requirements.

[0056] In this embodiment, the fan-out transition layer 130 further includes an isolation region 134, which is disposed at at least a portion of the boundary of the fan-out transition layer 130. The isolation region 134 includes a main isolation strip 1341 extending in the lateral direction and a side isolation strip 1342 extending in the longitudinal direction. The main isolation strip 1341 is located on the side of the transition connection line 131 near the display area 120, and the side isolation strip 1342 is located on the side of the distribution area of ​​the transition connection line 131. At least one of the main isolation strip 1341 and the side isolation strip 1342 is continuously distributed along the boundary of the fan-out transition layer 130 to define the arrangement range of the transition connection line 131.

[0057] Specifically, through the cooperation of the main isolation band 1341 and the side isolation band 1342, the fan-out transition layer 130 can form a relatively complete boundary enclosure relationship, thereby ensuring that multiple transition connection lines 131 maintain an orderly arrangement during the fan-out rearrangement process, avoiding situations where the arrangement boundaries are blurred, the extension range is out of control, or the lines are too close to adjacent functional areas in local areas. Furthermore, the isolation area 134 can be set continuously or segmented according to the device size, the area of ​​the fan-out transition layer 130, and the boundary position of the display area 120.

[0058] In this embodiment, the isolation region 134 is used at least to define the wiring boundary of the transition connection line 131 on the plane, and may further serve as electrical isolation, light-shielding isolation, or process alignment isolation. Specifically, the main isolation band 1341 is located on the side of the transition connection line 131 near the display area 120, and is used to define the termination boundary of the transition connection line 131 extending into the display area 120, so that the end connection position of the transition connection line 131 corresponds to the input terminal of the Micro LED lamp bead array 300; the side isolation band 1342 is located on the side of the distribution area of ​​the transition connection line 131, and is used to define the lateral boundary between the transition connection line 131, the thermal management area 133, and adjacent functional areas. The isolation region 134 may be formed of an insulating material, a light-shielding material, a low-dielectric material, or the same material as the passivation layer on the surface of the substrate 100.

[0059] As a preferred embodiment, the substrate 100 is a transparent substrate, which is made of transparent glass substrate or transparent polymer substrate; In the display area 120, there are spacers 121 between adjacent Micro LED beads, and multiple spacers 121 are connected to form a light-transmitting structure.

[0060] It should be noted that the transparent glass substrate 100 has good dimensional stability, flatness and heat resistance, making it suitable for high-precision circuit construction and chip mounting; while the transparent polymer substrate 100 has certain advantages in terms of flexibility, lightweight and processing adaptability, and can be selected according to different product forms.

[0061] Furthermore, within the display area 120, a spacer 121 is provided between adjacent Micro LED beads. Multiple spacers 121 are interconnected to form a light-transmitting structure that penetrates the display area 120, so that the display area 120 retains a certain area of ​​light-transmitting channel while realizing pixel light-emitting display.

[0062] This configuration not only makes the device more suitable for transparent display, overlay display, and background-visible display scenarios, but also helps to reduce the surface density burden of the display area 120 and reduce the visual occlusion of the display area 120.

[0063] Furthermore, the shape of the aforementioned interval 121 can be strip-shaped, grid-shaped, polygonal open-shaped, or irregularly spaced. Its size and arrangement can be designed in combination with the pixel pitch of the lamp array, display accuracy requirements, and transmittance targets, thereby achieving a balance between display effect and light transmission effect.

[0064] Specifically, the spacing portion 121 in the display area 120 is staggered from the input terminal of the Micro LED lamp bead array 300. The output terminal of the transition connection line 131 is preferably connected to the pixel pad, row electrode pad, or column electrode pad corresponding to the Micro LED lamp bead array 300, without crossing the main light-transmitting opening area. In other words, the light-transmitting structure formed by the spacing portion 121 is mainly located in the non-electrical connection area between adjacent Micro LED lamp beads, while the end connection structure of the fan-out transition layer 130 is concentrated near the pixel input terminal. This ensures the light transmittance of the display area 120 while avoiding excessive shading of the light-transmitting area by the fan-out connection line.

[0065] In this embodiment, the substrate 100 includes, from bottom to top, a transparent support layer, a conductive pattern base layer, an insulating spacer layer, and a redistribution connection layer; the driving region 110 and the display region 120 are respectively disposed in the corresponding regions of the redistribution connection layer, and the fan-out transition layer 130 is formed in the redistribution connection layer and / or the conductive pattern base layer, so that a hierarchical connection structure located on the same side of the substrate 100 is formed between the driving region 110 and the display region 120.

[0066] It should be noted that the hierarchical connection structure on the same side of the substrate 100 means that the driving area 110, the fan-out transition layer 130, and the display area 120 are all located on the same surface side of the transparent support layer, and the conductive pattern base layer, the insulating spacer layer, and the rewiring connection layer are sequentially stacked along this same surface side. Therefore, even if the fan-out transition layer 130 is partially formed on the conductive pattern base layer and partially formed on the rewiring connection layer, it still belongs to the wiring integration structure on the same side of the substrate 100, rather than a double-sided interconnection structure achieved by flipping the front and back sides of the substrate 100 or penetrating the substrate 100.

[0067] It should be noted that the substrate 100 is not a single homogeneous structure, but is composed of multiple functional layers stacked from bottom to top. Specifically, the transparent support layer constitutes the basic load-bearing part of the entire device, and a conductive pattern base layer, an insulating spacer layer, and a rewiring connection layer are sequentially disposed on it, thereby forming a hierarchical substrate structure suitable for the joint integration of the driving area 110, the display area 120, and the fan-out transition layer 130.

[0068] The conductive pattern base layer is responsible for forming the basic conductive pattern and bearing the local electrical connections. The insulating spacer layer is located between the conductive pattern base layer and the upper connection structure to form an electrical isolation relationship between different conductive areas. The rewiring connection layer is used to complete a more refined circuit layout and build the connection relationship between areas.

[0069] The driving area 110 and the display area 120 are respectively formed in the corresponding areas of the redistribution connection layer, while the fan-out transition layer 130 is formed in the redistribution connection layer and / or the conductive pattern base layer, so that the fan-out transition layer 130 not only connects the driving area 110 and the display area 120 in the plane, but also cooperates with the conductive layer inside the substrate 100 in the layer structure.

[0070] In this embodiment, the driving region 110 includes a driving chip arrangement region 111, a functional device arrangement region 112, and an interface connection region 113. The driving chip arrangement region 111 is located in the middle of the driving region 110, the functional device arrangement region 112 is located on at least one side of the driving chip arrangement region 111, and the interface connection region 113 is located on the side of the driving region 110 away from the fan-out transition layer 130. The driving circuit 200 is formed in the driving chip arrangement region 111 and the functional device arrangement region 112, and its output terminal is distributed towards the fan-out transition layer 130.

[0071] With this arrangement, the driving circuit 200 is formed between the driving chip arrangement area 111 and the functional device arrangement area 112, and its output terminals are distributed towards the fan-out transition layer 130, thereby forming a path relationship from the interface connection area 113 to the driving chip arrangement area 111, and then from the driving chip arrangement area 111 to the fan-out transition layer 130.

[0072] This layout helps to shorten the signal output path from the driving region 110 into the fan-out transition layer 130, reduce the connection backlash between the driving output and the fan-out transition layer 130, and also makes the device arrangement inside the driving region 110 more directional and hierarchical.

[0073] As an optional solution in this embodiment, the width of the distribution area of ​​the transition connection line 131 in the horizontal direction accounts for 50% to 85% of the overall width of the fan-out transition layer 130; that is, the central area of ​​the fan-out transition layer 130 mainly serves as the arrangement area of ​​the transition connection line 131, so as to ensure that the signal fan-out and pitch transition between the driving area 110 and the display area 120 can be completed in a sufficient horizontal range.

[0074] Each thermal management zone 133 has a width in the lateral direction that accounts for 5% to 20% of the overall width of the fan-out transition layer 130. This ensures that the thermal management zone 133 is located at the edge of the fan-out transition layer 130 while retaining adequate space for heat diffusion.

[0075] By setting the above proportions, the fan-out transition layer 130 can form a "central connection and edge buffer" structure on the layout, which avoids the transition connection line 131 being over-compressed and affecting the rearrangement effect, and also avoids the thermal management area 133 occupying too much width and squeezing the main connection area.

[0076] In one specific implementation, the maximum linewidth W1 of the transition connection line 131 near the driving area 110 can be 0.05mm to 0.50mm, and the minimum linewidth W2 near the display area 120 can be 0.02mm to 0.20mm, with W1 being greater than W2. Further, the longitudinal length L of the transition connection line 131 where the linewidth gradually changes can be 2mm to 30mm to accommodate the wiring transition space between the driving area 110 and the display area 120 in a 5cm×10cm level display panel. The first center-to-center distance P1 between adjacent transition connection lines 131 near the driving area 110 can be 0.10mm to 1.00mm, and the second center-to-center distance P2 near the display area 120 can be 0.05mm to 0.50mm, with P1 being greater than P2. Thus, the transition connection line 131 can achieve a gradual rearrangement on the centimeter-level display substrate from the larger output pitch on the driving circuit 200 side to the smaller input pitch on the Micro LED lamp bead array 300 side, avoiding the sudden contraction of the line over a short distance that would cause a concentration of local current density.

[0077] In this scheme, during manufacturing, a conductive pattern base layer can first be formed on a transparent support layer, and the basic conductive pattern can be formed through photolithography, sputtering, evaporation, electroplating or etching processes; then an insulating spacer layer is formed on the conductive pattern base layer, and vias are formed at the locations where interlayer conductivity is required; then a rewiring connection layer is formed on the insulating spacer layer, and the output connection terminal of the driving area 110, the transition connection line 131 in the fan-out transition layer 130, the current equalization distribution branch 132 and the pixel input connection terminal of the display area 120 are formed through patterning processes; finally, the driving circuit 200 and the Micro LED lamp bead array 300 are respectively installed at the corresponding positions of the driving area 110 and the display area 120, so that the output terminal of the driving circuit 200 is connected to the input terminal of the Micro LED lamp bead array 300 through the fan-out transition layer 130.

[0078] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Micro LED display device, characterized in that, It includes a substrate (100), a driving region (110) and a display region (120) disposed on the same side of the substrate (100), and a fan-out transition layer (130) disposed between the driving region (110) and the display region (120). The driving area (110) is provided with a driving circuit (200), the display area (120) is provided with a Micro LED lamp bead array (300), and the fan-out transition layer (130) includes a plurality of transition connection lines (131) extending from the driving area (110) toward the display area (120). The input ends of the plurality of transition connection lines (131) are connected to the output ends of the driving circuit (200), and the output ends of the plurality of transition connection lines (131) are connected to the input ends of the Micro LED lamp bead array (300). Along the direction from one end of the driving area (110) to the end of the display area (120), the line width of the transition connection line (131) is gradually reduced; The fan-out transition layer (130) further includes at least one current equalization distribution branch (132), which extends in the lateral direction and intersects and connects with at least a portion of the lines in the transition connection line (131) to form a current distribution path between adjacent transition connection lines (131). The fan-out transition layer (130) further includes a thermal management area (133), which is located in the side area and / or edge area of ​​the transition connection line (131) and extends along the drive area (110) toward the display area (120). The thermal management zone (133) is arranged adjacent to the transition connection line (131) and is distributed in parallel with the transition connection line (131) on the plane. 2.The Micro LED display device of claim 1, wherein, The thermal management zone (133) is provided in at least two sets, and the at least two sets of thermal management zones (133) are respectively located on the left and right sides of the distribution area of ​​the transition connection line (131) to form a thermal buffer structure located on both sides of the fan-out transition layer (130). 3.The Micro LED display device of claim 2, wherein, The thermal management area (133) includes a sheet-like connecting segment (1331) extending longitudinally, and a plurality of connecting segments (1332) spaced laterally and extending toward the distribution area of ​​the transition connecting line (131). Among them, multiple connecting segments (1332) are adjacent to and parallel to the distribution area of ​​the corresponding transition connecting lines (131). 4.The Micro LED display device of claim 1, wherein, The fan-out transition layer (130) further includes an isolation region (134), which is disposed at at least a portion of the boundary of the fan-out transition layer (130); The isolation zone (134) includes a main isolation strip (1341) extending in the lateral direction and a side isolation strip (1342) extending in the longitudinal direction. The main isolation strip (1341) is located on the side of the transition connection line (131) near the display area (120), and the side isolation strip (1342) is located on the side of the distribution area of ​​the transition connection line (131). At least one of the main isolation strip (1341) and the side isolation strip (1342) is continuously distributed along the boundary of the fan-out transition layer (130) to define the arrangement range of the transition connection line (131).

5. The Micro LED display device according to claim 1, characterized in that, The substrate (100) is a transparent substrate (100), which is made of transparent glass substrate or transparent polymer substrate; In the display area (120), there is a spacer (121) between adjacent Micro LED beads, and multiple spaces (121) are connected to form a light-transmitting structure.

6. The Micro LED display device according to claim 5, characterized in that, The substrate (100) includes, from bottom to top, a transparent support layer, a conductive pattern base layer, an insulating spacer layer, and a rewiring connection layer; The driving area (110) and the display area (120) are respectively disposed in the corresponding areas of the redistribution connection layer, and the fan-out transition layer (130) is formed in the redistribution connection layer and / or the conductive pattern base layer, so that a hierarchical connection structure located on the same side of the substrate (100) is formed between the driving area (110) and the display area (120).

7. The Micro LED display device according to claim 1, characterized in that, The driving area (110) includes a driving chip arrangement area (111), a functional device arrangement area (112), and an interface connection area (113). The driver chip arrangement area (111) is located in the middle of the driver area (110), the functional device arrangement area (112) is located on at least one side of the driver chip arrangement area (111), and the interface connection area (113) is located on the side of the driver area (110) away from the fan-out transition layer (130). The driving circuit (200) is formed in the driving chip arrangement area (111) and the functional device arrangement area (112), and its output terminal is distributed toward the fan-out transition layer (130).

8. The Micro LED display device according to claim 2, characterized in that, The width of the distribution area of ​​the transition connection line (131) in the horizontal direction accounts for 50% to 85% of the overall width of the fan-out transition layer (130); The width of each thermal management zone (133) in the lateral direction accounts for 5% to 20% of the overall width of the fan-out transition layer (130).

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