Display device

Abstract

A display device includes a substrate including a plurality of sub-pixels, a cover layer disposed on the substrate, a first electrode disposed in each of the plurality of sub-pixels, and a bank. The cover layer includes a base portion and a protruding portion protruding from the base portion and having a sloped side surface. The first electrode covers a portion of the protruding portion and the base portion. The bank has a sloped side surface disposed on the first electrode and the protruding portion. The bank exposes an uncovered portion of the first electrode. The side surface of the bank includes a plurality of first side surfaces and a plurality of second side surfaces, an average inclination angle of the plurality of second side surfaces being smaller than an average inclination angle of the plurality of first side surfaces.

Description

Cross-reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10-2024-0186997, filed on December 16, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a display device, and more particularly to a display device that minimizes defects such as the organic encapsulation layer not being applied over the light-emitting diode. Background Technology

[0003] Currently, with the advent of the comprehensive information age, the field of display devices that visually express electrical information signals has developed rapidly, and continuous research is being conducted to improve the performance of various display devices, such as thinness, light weight, and low power consumption.

[0004] Among various display devices, organic light-emitting diode (OLED) displays are self-emissive, thus requiring no separate light source, unlike liquid crystal displays (LCDs). Therefore, OLED displays (hereinafter referred to as display devices) can be manufactured with light weight and thinness. Furthermore, since display devices are driven by low voltage, they offer advantages not only in terms of power consumption but also in terms of color reproduction, response speed, viewing angle, and contrast ratio (CR). Therefore, they are expected to be used in various fields.

[0005] The display device includes a light-emitting diode (LED) and a packaging unit. The LED comprises an anode, an organic layer, and a cathode and is susceptible to moisture and oxygen. The packaging unit is disposed on the LED to protect it by blocking moisture and oxygen. However, a step may appear between the central and peripheral portions of the LED. This step can cause the organic encapsulation layer of the packaging unit to not completely fill the central portion of the LED, resulting in a non-application defect. Therefore, the packaging unit can be damaged, reducing the reliability and aesthetics of the display device. Summary of the Invention

[0006] Various embodiments of this disclosure provide a display device that minimizes unapplied defects in the central portion of a light-emitting diode where the organic encapsulation layer is not fully filled, thereby improving the reliability of the display device.

[0007] Various embodiments of this disclosure provide a process-optimized display device that improves production yield by minimizing uninjected defects in the organic encapsulation layer, thereby saving production energy.

[0008] According to one aspect of this disclosure, a display device includes: a substrate including a plurality of sub-pixels; a cover layer disposed on the substrate and including a base and a protrusion, the protrusion protruding from the base and having an inclined side surface; a first electrode disposed in each of the plurality of sub-pixels and covering a portion of the protrusion and the base; and a dam having an inclined side surface disposed on the first electrode and the protrusion and exposing an uncovered portion of the first electrode. The side surface of the dam includes a plurality of first side surfaces and a plurality of second side surfaces, the average tilt angle of the plurality of second side surfaces being smaller than the average tilt angle of the plurality of first side surfaces.

[0009] According to another aspect of this disclosure, a display device includes: a substrate; a cover layer disposed on the substrate and including a base and a protrusion, the protrusion protruding from the base and having an inclined side surface; a first electrode disposed to cover a portion of the protrusion and the base; and a dam portion disposed such that the dam portion exposes an uncovered portion of the first electrode, the dam portion being disposed on the first electrode and the protrusion. The dam portion includes a top surface and a side surface, the top surface being a flat surface, the side surface being an inclined region located between the flat surface and an end of the dam portion adjacent to the uncovered portion of the first electrode, and the side surface of the dam portion defining a plurality of grooves disposed on at least a portion of the side surface of the dam portion.

[0010] Further details of the exemplary embodiments are included in the detailed description and accompanying drawings.

[0011] According to this disclosure, defects in the organic encapsulation layer caused by steps between the central and peripheral portions of a light-emitting diode (where the anode is disposed on an inclined side surface) can be minimized.

[0012] According to this disclosure, a plurality of grooves are provided on the side surface of the embankment to cause the organic encapsulation layer to move from the stepped peripheral portion of the light-emitting diode to the central portion of the light-emitting diode.

[0013] The effects of this disclosure are not limited to those illustrated above, and this specification includes many more effects.

[0014] The disclosed display device uses a dam structure with multiple tilt angles and trenches to improve encapsulation coverage on the light-emitting diode (LED). By introducing a first side surface with a steeper angle and a second side surface as a trench with a shallower angle, this design creates narrow, elongated capillary channels that guide the organic encapsulation material from the edges toward the center of the LED. This reduces the problem of the encapsulation layer not completely covering the area above the LED, thereby improving planarization, moisture resistance, and long-term device reliability.

[0015] This design also allows for flexible placement of grooves along the edges or vertices of a polygonal shape formed by the ends of the dikes in each sub-pixel, enabling optimized flow patterns based on the polygonal shape. The sloping side surfaces of the anode not only facilitate the flow of the encapsulation material but also serve as reflective surfaces, thereby improving light extraction efficiency. Therefore, this structure addresses both the optical performance and structural reliability requirements of display devices.

[0016] Furthermore, this approach is compatible with encapsulation structures that alternate between organic and inorganic layers, thus providing improved protection against moisture and oxygen while supporting scalability for large-scale manufacturing. Overall, the described structure results in improved manufacturing yields, longer device lifetimes, and enhanced display performance through relatively simple modifications to the dike and encapsulation layers.

[0017] The technical benefits of this disclosure are not limited to those described above, and other benefits not mentioned above will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0018] The above and other aspects, features and other advantages of this disclosure will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a plan view of a display device according to an exemplary embodiment of the present disclosure; Figure 2 This is an enlarged plan view of a pixel of a display device according to an exemplary embodiment of the present disclosure; Figure 3 It is along Figure 2 A cross-sectional view of the display device taken by line III-III′; Figure 4 It is along Figure 2 A cross-sectional view of the display device taken by line IV-IV′; Figure 5 It is along Figure 2 A cross-sectional view of the display device taken by line VV′; Figure 6 It is a cross-sectional view for comparing the shapes of the first side surface and the second side surface of the embankment of a display device according to an exemplary embodiment of the present disclosure; Figure 7 It is along Figure 1 A cross-sectional view of the display device taken by line VII-VII′; and Figure 8 This is an enlarged plan view of a pixel of a display device according to another exemplary embodiment of the present disclosure. Detailed Implementation

[0019] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the exemplary embodiments described in detail below, taken in conjunction with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only, so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0020] Throughout this specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related techniques may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0021] Even if not explicitly stated, the components are interpreted as including the normal error range.

[0022] When using terms such as “on,” “above,” “below,” or “beside” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts, unless these terms are used with the terms “immediately following” or “directly.”

[0023] The phrase "A is filled in B" does not imply that A is exclusively contained within B to exclude other materials. Rather, it is intended to cover a wide range of states, including but not limited to "partially filled in," "substantially filled in," "completely filled in," and "exclusively filled in." Similarly, the phrase "B is filled with A" does not imply that B is exclusively filled with A, thus excluding other materials. Rather, it covers various degrees of filling, such as "partially filled with," "substantially filled with," "completely filled with," and "exclusively filled with."

[0024] When one element or layer is placed "on" another element or layer, the other layer or element can be directly inserted onto or between the other element.

[0025] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of this disclosure, the first component referred to below can be the second component.

[0026] The shapes, sizes, dimensions (e.g., length, width, height, thickness, radius, diameter, area, etc.), ratios, angles, number of elements, etc. shown in the accompanying drawings used to describe embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto.

[0027] For ease of description, dimensions including the size and thickness of each component shown in the figures are shown, and this disclosure is not limited to the size and thickness of the components shown, but it should be noted that the relative dimensions of the relative size, position and thickness of the components shown in the various figures submitted with this document are part of this disclosure.

[0028] As used herein, the term "connection" is intended to have the broadest possible meaning. Specifically, the phrase "A connected to B" covers both direct connections (where no intermediate parts or elements exist) and indirect connections (where one or more intermediate parts or elements exist between A and B). In other words, "A connected to B" includes both direct physical or electrical connections and indirect connections via one or more intermediate parts. Unless otherwise explicitly stated, these terms do not require direct physical or electrical contact. The terms "connection" and "contact" should be interpreted in the same manner.

[0029] Features of the various embodiments of this disclosure may be partially or completely dependent on or combined with each other, and may be technically interlocked and operated in various ways, and these embodiments may be performed independently or in association with each other.

[0030] In the following, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0031] Figure 1 This is a plan view of a display device according to an exemplary embodiment of the present disclosure. Figure 2 This is an enlarged plan view of a pixel of a display device according to an exemplary embodiment of the present disclosure. Figure 3 It is along Figure 2 A cross-sectional view of the display device taken by line III-III′. Figure 4 It is along Figure 2 A cross-sectional view of the display device taken by line IV-IV′. Figure 5 It is along Figure 2 A cross-sectional view of the display device taken by line VV′. Figure 6 This is a cross-sectional view used to compare the shapes of the first and second side surfaces of the embankment of a display device according to an exemplary embodiment of the present disclosure. At this time, Figure 3 and Figure 4 These are cross-sectional views of the first side surface 170a and the second side surface 170b of the embankment 170 of a display device 100 according to an exemplary embodiment of the present disclosure. Meanwhile, in Figure 6In order to compare the shapes of the first side surface 170a and the second side surface 170b of the embankment 170, the first side surface 170a and the second side surface 170b are shown to overlap, and the structure above the embankment 170 is not shown.

[0032] Reference Figures 1 to 6 The display device 100 includes a substrate 110, a transistor 120, a first cover layer 130, an auxiliary electrode 140, a second cover layer 150, a light-emitting diode 160, a dam 170, and a packaging unit 180. The display device 100 may be implemented as a top-emitting display device, but is not limited thereto.

[0033] The substrate 110 is a substrate that supports and protects multiple components of the display device 100. The substrate 110 can be formed of glass or a flexible plastic material. When the substrate 110 is formed of a plastic material, for example, the substrate can be formed of polyimide (PI), but is not limited thereto.

[0034] The substrate 110 includes an active area AA and a non-active area NA.

[0035] The display area AA is the area in the display device 100 where an image is displayed, and display elements and various driving elements for driving the display elements can be disposed in the display area AA. For example, the display element may be composed of a light-emitting diode 160 including a first electrode 161, an organic layer 162, and a second electrode 163. In addition, various driving elements for driving the display elements (such as transistors 120, capacitors, or wiring) may be disposed in the display area AA.

[0036] Multiple pixels P may be included in the display area AA. Each pixel P may include multiple subpixels SP. The subpixel SP is the smallest unit constituting the screen, and each of the multiple subpixels SP may include a light-emitting diode 160 and driving circuitry. The multiple subpixels SP may emit light with different wavelengths. For example, the multiple subpixels SP may include a red subpixel SPR, a green subpixel SPG, and a blue subpixel SPB. In addition, the multiple subpixels SP may also include a white subpixel (not shown).

[0037] At the same time, refer to Figure 2Multiple subpixels SP included in a pixel P can be configured to have different areas. For example, a blue subpixel SPB can be configured in one column, and a red subpixel SPR and a green subpixel SPG can be configured together in an adjacent column. Furthermore, the red subpixel SPR and the green subpixel SPG can be alternately configured in the same column. However, the red subpixel SPR, green subpixel SPG, and blue subpixel SPB can be configured in different columns with the same area, and the placement, quantity, and color combination of the multiple subpixels SP can vary in various forms depending on the design, but are not limited to these.

[0038] The driving circuit for the sub-pixel SP is a circuit used to control the driving of the light-emitting diode 160. For example, the driving circuit may be configured to include a transistor 120 and a capacitor, but is not limited thereto.

[0039] The non-display area NA is the area where no image is displayed, and various components used to drive the multiple sub-pixels SP that are set in the display area AA can be set in the non-display area NA. For example, a driver IC and a flexible film that provide signals for driving the multiple sub-pixels SP can be provided.

[0040] The non-display area NA can be as follows: Figure 1 The area shown encloses the display area AA, but is not limited to it. For example, the non-display area NA can be an area extending from the display area AA.

[0041] In the following text, reference will be made to Figures 3 to 6 A more detailed description is provided of the multiple sub-pixels SP set in the display area AA.

[0042] Reference Figures 3 to 6 A buffer layer 111 is disposed on the substrate 110. The buffer layer 111 can be used to improve the adhesion strength between the layer formed on the buffer layer 111 and the substrate 110, and to block alkaline components leaking from the substrate 110. The buffer layer 111 may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) and silicon oxide (SiOx), but is not limited thereto. The buffer layer 111 is not a necessary component and may be omitted depending on the type or material of the substrate 110 and the structure and type of the thin-film transistor 120.

[0043] Transistor 120 is disposed on buffer layer 111. Transistor 120 can be used as a driving element for driving light-emitting diode 160 of display area AA. Transistor 120 includes active layer 121, gate electrode 122, source electrode 123 and drain electrode 124. Figure 3 and Figure 4The transistor 120 shown is a driving transistor and a top-gate thin-film transistor, wherein the gate electrode 122 is disposed on the active layer 121. However, it is not limited thereto, and the transistor 120 may be implemented as a bottom-gate transistor.

[0044] An active layer 121 is disposed on a buffer layer 111. The active layer 121 is the layer in which a channel is formed when the transistor 120 is driven. The active layer 121 may be formed of oxide semiconductor or amorphous silicon (a-Si), polycrystalline silicon (poly-Si) or organic semiconductor.

[0045] A gate insulating layer 112 is disposed on the active layer 121. The gate insulating layer 112 is a layer used to electrically insulate the gate electrode 122 from the active layer 121, and can be formed of an insulating material. For example, the gate insulating layer 112 can be formed as a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) (which are inorganic materials) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0046] In the gate insulating layer 112, contact holes are formed for the source electrode 123 and the drain electrode 124, respectively, which contact the source and drain regions of the active layer 121. The gate insulating layer 112 can be formed on the entire surface of the substrate 110, such as... Figures 3 to 6 As shown, or patterned to have the same width as the gate electrode 122, but not limited thereto.

[0047] A gate electrode 122 is disposed on a gate insulating layer 112. The gate electrode 122 is disposed on the gate insulating layer 112 to overlap with the channel region of the active layer 121. The gate electrode 122 can be any of a variety of metallic materials, such as any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys of two or more of them, or multilayers formed therefrom, but is not limited thereto.

[0048] An interlayer insulating layer 113 is disposed on the gate electrode 122. The interlayer insulating layer 113 may be formed as a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) (which are inorganic materials) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto. In the interlayer insulating layer 113, contact holes are formed for the source electrode 123 and the drain electrode 124, respectively, which contact the source and drain regions of the active layer 121.

[0049] Source electrode 123 and drain electrode 124 are disposed on interlayer insulating layer 113. Source electrode 123 and drain electrode 124 are disposed on the same layer and spaced apart from each other. Source electrode 123 and drain electrode 124 are electrically connected to active layer 121 through contact holes in gate insulating layer 112 and contact holes in interlayer insulating layer 113. Source electrode 123 and drain electrode 124 can be any of various metallic materials such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys of two or more of them, or multilayers formed from them, but are not limited thereto.

[0050] exist Figure 3 and Figure 4 Only the driving transistors among the various transistors 120 included in the display device 100 are shown, but other transistors such as switching transistors may also be provided.

[0051] A first capping layer 130 is disposed on the interlayer insulating layer 113 and the transistor 120. The first capping layer 130 is an insulating layer that protects the transistor 120 and planarizes the upper part of the transistor 120. Contact holes are formed in the first capping layer 130 to expose the source electrode 123 of the transistor 120. Even Figure 3 and Figure 4 The diagram shows a contact hole exposing the source electrode 123 formed in the first capping layer 130, but it is not limited to this. For example, a contact hole exposing the drain electrode 124 may be formed in the first capping layer 130.

[0052] The first cover layer 130 may be formed from, but is not limited to, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenyl resin, a polyphenylene sulfide resin, benzocyclobutene, and a photoresist.

[0053] Additionally, an interlayer insulating layer 113 and a passivation layer for the transistor 120 may be disposed below the first cover layer 130. The passivation layer may be formed as a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0054] An auxiliary electrode 140 is disposed on the first capping layer 130. The auxiliary electrode 140 can be used to electrically connect the transistor 120 and the light-emitting diode 160. The auxiliary electrode 140 is electrically connected to the source electrode 123 of the transistor 120 through contact holes formed in the first capping layer 130. The auxiliary electrode 140 may be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), and neodymium (Nd) or their alloys.

[0055] A second cover layer 150 is disposed on the first cover layer 130. The second cover layer 150 is an insulating layer used to planarize the upper portion of the first cover layer 130 and the upper portion of the auxiliary electrode 140. Contact holes exposing the auxiliary electrode 140 are formed in the second cover layer 150.

[0056] The second cover layer 150 may be formed from, but is not limited to, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenyl resin, a polyphenylene sulfide resin, benzocyclobutene, and a photoresist.

[0057] The second cover layer 150 includes a base 151 and a plurality of protrusions 152. For example... Figures 3 to 6 As shown, the base 151 and the plurality of protrusions 152 may be integrally formed. For example, the base 151 and the plurality of protrusions 152 may be formed from the same material and simultaneously formed by the same process (e.g., by a masking process), but are not limited thereto.

[0058] A base 151 is disposed on the first cover layer 130. The top surface of the base 151 has a surface parallel to the substrate 110. Therefore, steps caused by components disposed below it can be flattened by the base 151.

[0059] A plurality of protrusions 152 are provided on the base 151. The plurality of protrusions 152 are integrally formed with the base 151 to protrude from the base 151. The top surface of the plurality of protrusions 152 may be smaller than its bottom surface, but is not limited thereto.

[0060] Each of the plurality of protrusions 152 includes a top surface and a side surface. The top surface of the protrusion 152 is the surface located on the uppermost part of the protrusion 152 and may be a surface substantially parallel to the base 151 or the substrate 110. The side surface of the protrusion 152 may be the surface connecting the top surface of the protrusion 152 and the base 151. The side surface of the protrusion 152 may be inclined from the top surface toward the base 151, but is not limited thereto.

[0061] A light-emitting diode 160 is disposed on a second capping layer 150. The light-emitting diode 160 includes a first electrode 161 electrically connected to the source electrode 123 of the transistor 120, an organic layer 162 disposed on the first electrode 161, and a second electrode 163 formed on the organic layer 162.

[0062] The first electrode 161 is configured to correspond to each of the plurality of sub-pixels SP. The first electrode 161 is configured to cover the base 151 and the plurality of protrusions 152. The first electrode 161 may be configured along the shape of the base 151 and the plurality of protrusions 152 of the second cover layer 150. Specifically, the first electrode 161 may be configured on the top surface of the base 151 where no protrusions 152 are provided and on the side surfaces of the plurality of protrusions 152. That is, the first electrode 161 is configured along the shape of the base 151 and the plurality of protrusions 152. Furthermore, the first electrode 161 may be formed in a portion of the top surface of the plurality of protrusions 152.

[0063] The first electrode 161 can be the anode of the light-emitting diode 160. The first electrode 161 is electrically connected to the auxiliary electrode 140 through a contact hole formed in the second cover layer 150. The first electrode 161 can be electrically connected to the source electrode 123 of the transistor 120 through the auxiliary electrode 140. However, depending on the type of transistor 120 and the design of the driving circuit, the first electrode 161 can be configured to be electrically connected to the drain electrode 124 of the transistor 120.

[0064] At this time, even Figures 3 to 6 In the diagram, the first electrode 161 is shown as a single layer, but it can also be configured as a multilayer. For example, the first electrode 161 may include a reflective layer that reflects light emitted from the organic layer 162 toward the second electrode 163 and a transparent conductive layer that provides holes to the organic layer 162.

[0065] A reflective layer is disposed on the second cover layer 150 to reflect upward light emitted from the light-emitting diode 160. Light generated in the organic layer 162 of the light-emitting diode 160 can be emitted not only upwards but also laterally. Laterally emitted light is guided into the interior of the display device 100 or trapped within the display device 100 due to total internal reflection, or travels further into the interior of the display device 100 and then disappears. Therefore, the reflective layer is disposed below the organic layer 162 to cover the sides of the plurality of protrusions 152, thereby changing the direction of light traveling towards the sides of the organic layer 162 to forward.

[0066] The reflective layer can be formed of metallic materials, such as aluminum (Al), silver (Ag), copper (Cu), and magnesium-silver alloys (Mg:Ag), but is not limited to these.

[0067] A transparent conductive layer is disposed on the reflective layer. The transparent conductive layer may be formed of a conductive material with a high work function to provide holes to the organic layer 162. For example, the transparent conductive layer may be formed of a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (TO), but is not limited thereto.

[0068] A dam 170 is disposed on the second cover layer 150 and the first electrode 161. The dam 170 is disposed on the protrusion 152 of the second cover layer 150 and a portion of the first electrode 161, and has an inclined side surface. For example, as... Figure 3 and Figure 4 As shown, the top surface TS of the embankment 170 is a flat surface, and the side surface of the embankment 170 can be an inclined surface. In this case, the side surface of the embankment 170 can be defined from the top surface TS (which is a flat surface) of the embankment 170 to the end END of the embankment 170 through which the first electrode 161 is exposed (i.e., not covered), but is not limited thereto.

[0069] The dam 170 is an insulating layer that isolates adjacent sub-pixels SP. In the dam 170, an opening region can be provided that exposes the uncovered portion UP of the first electrode 161, and in the dam 170, a non-opening region is provided that covers a portion of the first electrode 161 to define the emission region and the non-emission region.

[0070] The emitting region refers to the region in which the organic layer 162 in each of the multiple sub-pixels SP directly generates light. The emitting region is the opening region of the dam 170, so the dam 170 is not disposed on the first electrode 161 in the opening region, and the organic layer 162 is directly disposed on the first electrode 161 to generate light.

[0071] The non-emitting region can refer to the region that does not directly generate light. The non-emitting region is the non-opening region of the dam 170, such that the dam 170 is disposed between the first electrode 161 and the organic layer 162 to block the direct generation of light.

[0072] The non-emitting area may include a reflective area RA. Here, the reflective area RA is the area corresponding to the side surface of the first electrode 161. In the reflective area RA, the reflective layer of the first electrode 161 formed on the side of the protrusion 152 serves as a side reflector, such that some light that may be captured by total internal reflection in the display device 100 is extracted to the outside of the display device 100.

[0073] The embankment 170 may be formed of inorganic materials. For example, the embankment 170 may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) and silicon oxide (SiOx). However, it is not limited to this, and the embankment 170 may be formed of organic materials.

[0074] Reference Figures 2 to 6The side surface of the embankment 170 includes a plurality of first side surfaces 170a and a plurality of second side surfaces 170b. The plurality of first side surfaces 170a and the plurality of second side surfaces 170b have different average inclination angles from each other. Therefore, in the embankment 170, a plurality of grooves defined by the side surfaces of the embankment 170 (which are formed by partially removing the side surfaces of the embankment 170) can be provided by the difference in the average inclination angles of the plurality of first side surfaces 170a and the plurality of second side surfaces 170b. For example, the second side surface 170b can be a groove obtained by partially removing the first side surface 170a. That is, the first side surface 170a is a portion of the side surface of the embankment 170 without the plurality of grooves, and the second side surface 170b can be a portion of the side surface of the embankment 170 with the plurality of grooves. By forming grooves from the side surface of the embankment 170, the second side surface 170b is adjacent to the first side surface 170a.

[0075] For example, the second side surface 170b can be formed, but is not limited to, by using a mask in which a cut is formed in a portion of the side surface of the embankment 170 corresponding to the second side surface 170b during a patterning process in which the material for forming the embankment 170 is placed on the first electrode 161 and the material for forming the embankment 170 is partially removed, to remove a portion of the side surface of the embankment 170 corresponding to the second side surface 170b (not completely, but only reducing the thickness).

[0076] Reference Figure 2 and Figure 5 On the side surface of the embankment 170, a plurality of first side surfaces 170a and a plurality of second side surfaces 170b may be alternately provided. The plurality of first side surfaces 170a and the plurality of second side surfaces 170b may be alternately provided along the end END of the embankment 170 that exposes the first electrode 161. When a corresponding first side surface 170a is adjacent to a corresponding second side surface 170b, the end END of the embankment 170 located on the corresponding first side surface 170a may be collinear with the end END of the embankment 170 located on the corresponding second side surface 170b.

[0077] For example, such as Figure 2 As shown, if the planar shape formed by the exposed end END of the first electrode 161 of the embankment 170 is a polygon, then a plurality of second side surfaces 170b can be provided on the edges of the polygon. Furthermore, a plurality of first side surfaces 170a can be provided between the vertices of the polygon and the plurality of second side surfaces 170b, respectively.

[0078] At the same time, such as Figure 2As shown, multiple first side surfaces 170a and multiple second side surfaces 170b can each exist in each sub-pixel. If the multiple sub-pixels SP have different areas, the number of multiple first side surfaces 170a and multiple second side surfaces 170b in each sub-pixel SP will differ. That is, the number of multiple second side surfaces 170b in each sub-pixel SP can vary depending on the type and area of ​​the planar shape formed by the end END of the dike 170. For example, in each sub-pixel SP, the larger the area of ​​the planar shape formed by the end END of the dike 170, the larger the number of multiple first side surfaces 170a and multiple second side surfaces 170b included in the dike 170.

[0079] Reference Figure 3 In the first side surface 170a, the inclination formed by the top surface of the base 151 increases from the top surface TS of the embankment 170 to the end END of the embankment 170. However, the first side surface 170a may be configured to form a predetermined inclination angle with the top surface of the base 151, but is not limited thereto. In this case, the average inclination angle formed by the first side surface 170a and the top surface of the base 151 may be, for example, 55° to 65°, but is not limited thereto.

[0080] Reference Figure 6 The average tilt angle of the second side surface 170b can be smaller than the average tilt angle of the first side surface 170a. That is, the average tilt angle formed by the second side surface 170b and the top surface of the base 151 can be smaller than the average tilt angle formed by the first side surface 170a and the top surface of the base 151. For example, the average tilt angle formed by the second side surface 170b and the top surface of the base 151 can be, for example, 35° to 45°, but is not limited thereto.

[0081] At the same time, refer to Figure 4 In the second side surface 170b, the inclination formed by the top surface of the base 151 increases from the top surface TS of the embankment 170 to the end of the embankment 170. However, the second side surface 170b may be configured to form a predetermined inclination angle with the top surface of the base 151, but is not limited thereto.

[0082] At the same time, refer to Figure 5 The second side surface 170b, located between a plurality of first side surfaces 170a, has a width that decreases downward. For example, as Figure 5 As shown, each second side surface 170b may have a groove shape formed by two inclined side surfaces and a bottom surface located in the region between a plurality of first side surfaces 170a, but is not limited thereto. In such an example, the second side surface 170b has a first width FW, which is smaller than a second width SW of the second side surface 170b, and the second width SW is further away from the substrate 110 than the first width FW.

[0083] Reference Figure 2 and Figure 6 The second length B, in a dimension parallel to the substrate 110, from the flat surface of the embankment 170 to the end of the embankment 170 located on the second side surface 170b, can be greater than the first length A, in a dimension parallel to the substrate 110, from the flat surface of the embankment 170 to the end of the embankment 170 located on the first side surface 170a. In other words, a sloped surface larger than the sloped surface on the first side surface 170a can be provided on the second side surface 170b.

[0084] Reference Figure 2 and Figure 5 On the second side surface 170b, the second length B from the flat surface of the embankment 170 to the end of the embankment 170 can be greater than the third length C between one first side surface 170a and another first side surface 170a adjacent to the corresponding second side surface 170b. That is, the second length B from the flat surface of the embankment 170 to the end located on the second side surface 170b can be greater than the third length C, which is the width of the second side surface 170b.

[0085] An organic layer 162 is disposed on the first electrode 161 and the embankment 170. For example, the organic layer 162 is disposed on the first electrode 161 located in the emission region and on the embankment 170 located in the non-emission region. The organic layer 162 may be disposed along the shape of the first electrode 161 and the embankment 170. The organic layer 162 includes an emission layer and a common layer.

[0086] An emission layer is an organic layer that emits light of a specific color. Different emission layers can be set in multiple sub-pixels (SPs), or the same emission layer can be set in all of the multiple sub-pixels (SPs). For example, when different emission layers are set in multiple sub-pixels (SPs), a red emission layer can be set in the red sub-pixel (SPR), a green emission layer in the green sub-pixel (SPG), and a blue emission layer in the blue sub-pixel (SPB). When the same emission layer is set in all of the multiple sub-pixels (SPs), light from the emission layer can be converted into various colors of light through separate light conversion layers and color filters.

[0087] The common layer is an organic layer configured to improve the luminous efficiency of the emitting layer. The common layer can be formed as a single layer on multiple sub-pixels (SPs). That is, the common layer of multiple sub-pixels (SPs) can be formed simultaneously using the same process and the same materials. The common layer may include, but is not limited to, hole injection layers, hole transport layers, electron transport layers, electron injection layers, and charge generation layers.

[0088] A second electrode 163 is disposed on the organic layer 162. The second electrode 163 may be disposed along the shape of the organic layer 162. The second electrode 163 supplies electrons to the organic layer 162, therefore the second electrode may be formed of a conductive material with a low work function. The second electrode 163 may be the cathode of a light-emitting diode 160. The second electrode 163 may be formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) or a metal alloy such as MgAg or ytterbium (Yb) alloy, and may further include a metal doped layer, but is not limited thereto. Meanwhile, even though not shown in the figure, the second electrode 163 is also electrically connected to a low-potential power line so as to be provided with a low-potential power signal.

[0089] Encapsulation unit 180 may be formed on light-emitting diode 160 to protect the moisture-sensitive light-emitting diode 160 from moisture exposure. Encapsulation unit 180 can block oxygen and moisture from penetrating into display device 100 from the outside. For example, when display device 100 is exposed to moisture or oxygen, pixel shrinkage occurs, resulting in shrinkage of the emitting area or dead pixels in the emitting area. Therefore, encapsulation unit 180 blocks oxygen and moisture to protect display device 100. For example, encapsulation unit 180 may have a structure in which inorganic and organic layers are alternately stacked, but is not limited thereto.

[0090] Reference Figures 3 to 5 The encapsulation unit 180 includes a first inorganic encapsulation layer 181, an organic encapsulation layer 182, and a second inorganic encapsulation layer 183.

[0091] A first inorganic encapsulation layer 181 is disposed on the second electrode 163 to inhibit the penetration of moisture or oxygen. The first inorganic encapsulation layer 181 may be formed of an inorganic material, such as silicon nitride (SiNx), silicon oxynitride (SiNx xOy), or aluminum oxide (AlyOz), but is not limited thereto.

[0092] An organic encapsulation layer 182 is disposed on the first inorganic encapsulation layer 181 to planarize the surface. Furthermore, the organic encapsulation layer 182 can cover foreign matter or particles that may be generated during the manufacturing process. The organic encapsulation layer 182 is formed of organic materials, such as, but not limited to, polyimide, polycarbonate, acrylic, or epoxy resin. Meanwhile, refer to… Figure 5 The first inorganic encapsulation layer 181 and the organic encapsulation layer 182 can be disposed in the space formed by the second side surface 170b of the embankment 170. That is, the first inorganic encapsulation layer 181 and the organic encapsulation layer 182 can fill the space formed by the second side surface 170b.

[0093] The second inorganic encapsulation layer 183 is disposed on the organic encapsulation layer 182 and can inhibit the permeation of moisture or oxygen, just like the first inorganic encapsulation layer 181. The second inorganic encapsulation layer 183 may be formed of an inorganic material, such as silicon nitride (SiNx), silicon oxynitride (SiNx xOy), silicon oxide (SiOx), or aluminum oxide (AlyOz), but is not limited thereto. The second inorganic encapsulation layer 183 may be formed of the same material as the first inorganic encapsulation layer 181 or of a different material.

[0094] Meanwhile, each of the plurality of sub-pixels SP includes an emitting region and a non-emitting region. For example, the emitting region includes a first emitting region and a second emitting region, and the non-emitting region includes a first non-emitting region and a second non-emitting region. For example, the first emitting region, the first non-emitting region, the second emitting region, and the second non-emitting region may be defined by the embankment 170.

[0095] The first emitting region corresponds to the area of ​​the first electrode 161 exposed from the embankment 170; in other words, it corresponds to the uncovered portion UP of the first electrode 161. The first emitting region may refer to the area where light is generated by the organic layer 162 in each of the plurality of sub-pixels SP. In the first emitting region, the embankment 170 is not provided, and the organic layer 162 is directly disposed on the first electrode 161 to generate light.

[0096] The first non-emissive region surrounds the first emitting region and corresponds to the area where the embankment 170 is disposed on the first electrode 161 located on the base 151. At this time, the first non-emissive region corresponds to the area that does not overlap with the side surface of the protrusion 152. When the display device 100 is turned on, the first non-emissive region is in a black state or has a brightness lower than that of the first and second emitting regions due to light incident from at least one of the first and second emitting regions.

[0097] The second emitting region surrounds the first non-emitting region and corresponds to the side surface of the protrusion 152. The second emitting region may be an area where some light emitted from the organic layer 162 is reflected by the first electrode 161 (i.e., the reflective region RA) disposed on the inclined side surface of the protrusion 152 so as to be extracted to the outside of the display device 100. Each of the first side surface 170a and the second side surface 170b may be located between the reflective region RA of the first electrode 161 and the uncovered portion UP of the first electrode 161. Furthermore, the brightness of the second emitting region is lower than that of the first emitting region, but is not limited thereto.

[0098] The second non-emission region surrounds the second emission region and corresponds to the flat top surface of the protrusion 152. The second non-emission region may be an area provided with various components for driving the emission region.

[0099] When the display device 100 is turned on, the second non-emitting area is either in a black state or has a brightness lower than that of the first and second emitting areas due to light incident from at least one of the first and second emitting areas. Furthermore, when the brightness of the second non-emitting area is lower than that of the first and second emitting areas, the brightness of the first non-emitting area may be higher than that of the second non-emitting area, but is not limited thereto.

[0100] Figure 7 It is along Figure 1 A cross-sectional view of the display device taken by line VII-VII′. Figure 7 This is a cross-sectional view of the non-display area NA of a display device 100 according to an exemplary embodiment of the present disclosure.

[0101] Reference Figure 7 In the non-display area NA surrounding the display area AA, there are spacers SPC, a first dam DAM1, a second dam DAM2, a third dam DAM3, a first metal layer ML1, a second metal layer ML2, a third metal layer ML3, a first conductive layer C1, a second conductive layer C2, a third conductive layer C3, and wiring L.

[0102] Spacer SPCs are disposed above the embankment 170 in the non-display area NA. The spacer SPCs are used to maintain a predetermined gap such that during the manufacturing process of the organic layer 162 formed of organic material, the mask does not come into contact with the layer (e.g., the first electrode 161) below it and on the substrate.

[0103] The spacer SPC can be configured to surround all the outer peripheries of the display area AA in the non-display area NA. For example, the spacer SPC is configured to surround all the outer peripheries of the display area AA while forming a closed-loop shape to block the flow of the organic encapsulation layer 182. Therefore, the spacer SPC can be referred to as, for example, a top barrier, but is not limited thereto.

[0104] Furthermore, even if the spacer SPC is shown in the figure as being disposed only in the non-display area NA, the spacer SPC can also be disposed above the embankment 170 corresponding to the area between multiple sub-pixels SP in the display area AA. In this case, the organic layer 162 and the second electrode 163 can be disposed on the spacer SPC disposed above the embankment 170 in the display area AA, but are not limited thereto.

[0105] For example, spacer SPCs can be formed from inorganic insulating materials (such as silicon nitride (SiNx) or silicon oxide (SiOx)) or organic insulating materials (such as benzocyclobutene resin, acrylic resin or imide resin), but are not limited thereto.

[0106] In the non-display area NA, multiple dams are disposed outside the spacer SPC. These dams may include a first dam DAM1, a second dam DAM2, and a third dam DAM3. The first dam DAM1, second dam DAM2, and third dam DAM3 may be configured to surround all the outer peripheries of the display area AA within the non-display area NA. For example, the first dam DAM1, second dam DAM2, and third dam DAM3 may be configured to surround all the outer peripheries of the display area AA while forming a closed loop shape. The first dam DAM1, second dam DAM2, and third dam DAM3 may be configured to block the flow of components formed of organic materials (e.g., organic encapsulation layer 182 in the non-display area NA), but are not limited thereto.

[0107] The first dam section DAM1 is disposed between the second dam section DAM2 and the spacer SPC. For example, the first dam section DAM1 may be formed of the same material as the embankment 170 and the spacer SPC, but is not limited thereto. For example, the first dam section DAM1 may be referred to as an intermediate barrier, but is not limited thereto.

[0108] The second dam section DAM2 is located outside the first dam section DAM1. For example, the second dam section DAM2 may be formed of the same material as the second cover layer 150, the embankment 170 and the spacer SPC, but is not limited thereto.

[0109] The third dam section DAM3 is disposed outside the second dam section DAM2. For example, the third dam section DAM3 can be formed of the same material as the second cover layer 150, the embankment 170, and the spacer SPC, but is not limited thereto. Simultaneously, the third dam section DAM3 can be configured to cover the end of the inorganic insulating layer extending from the display area AA to the non-display area NA. Therefore, the third dam section DAM3 can minimize the propagation of cracks into the inorganic insulating layer by protecting the end of the inorganic insulating layer, but is not limited thereto.

[0110] Reference Figure 7 In the non-display area NA, a first metal layer ML1, a second metal layer ML2, and a third metal layer ML3 are provided.

[0111] The first metal layer ML1 may be disposed on the interlayer insulating layer 113 located in the non-display area NA. The first metal layer ML1 may be, for example, a low-potential power line for transmitting a low-potential power voltage to the second electrode 163, but is not limited thereto.

[0112] The first metal layer ML1 may be disposed on the same layer as the source electrode 123 and the drain electrode 124 located on the interlayer insulating layer 113. For example, the first metal layer ML1 may be formed by a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0113] A second metal layer ML2 may be disposed on the first metal layer ML1 and the first cover layer 130 located in the non-display area NA. The second metal layer ML2 is disposed on the top surface of the first metal layer ML1, and the top surface of the first metal layer ML1 is exposed from the first cover layer 130 so as to be electrically connected to the first metal layer ML1.

[0114] The second metal layer ML2 is disposed on the same layer as the auxiliary electrode 140 and is formed of the same material as the auxiliary electrode 140. The second metal layer ML2 may be formed of a single layer or multiple layers of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni) and neodymium (Nd) or their alloys, but is not limited thereto.

[0115] A third metal layer ML3 may be disposed on the second metal layer ML2 and the second cover layer 150 located in the non-display area NA. The third metal layer ML3 is disposed on the second metal layer ML2, which is exposed from the second cover layer 150 for electrical connection to the second metal layer ML2.

[0116] The third metal layer ML3 is disposed on the same layer as the first electrode 161 and is formed of the same material as the first electrode 161. However, the third metal layer ML3 is spaced apart from the first electrode 161 and is not electrically connected to it, and can be used as a separate structure. For example, the third metal layer ML3 can be formed as a single layer or multiple layers containing metallic material, but is not limited thereto.

[0117] Furthermore, even if not shown in the figure, the third metal layer ML3 can be electrically connected to the second electrode 163. For example, a dam 170 is disposed on the third metal layer ML3, and the second electrode 163 can be electrically connected to the third metal layer ML3 through a contact hole formed in the dam 170, but is not limited thereto. Therefore, the first metal layer ML1 can be electrically connected to the second electrode 163 through the second metal layer ML2 and the third metal layer ML3, and a low-potential electrical voltage can be transmitted to the second electrode 163.

[0118] At the same time, refer to Figure 7In the non-display area NA, multiple conductive layers may be disposed. For example, the multiple conductive layers may include a first conductive layer C1, a second conductive layer C2, and a third conductive layer C3. For example, each of the first conductive layer C1, the second conductive layer C2, and the third conductive layer C3 may be disposed between multiple inorganic insulating layers to minimize the propagation of cracks in the multiple inorganic insulating layers, but is not limited thereto.

[0119] Simultaneously, wiring L can be provided between the second dam section DAM2 and the third dam section DAM3. Wiring L can be configured to surround the outer periphery of the display area AA in the non-display area NA. For example, wiring L is constructed for sensing cracks in the non-display area NA of the display device 100, and is formed of the same material as the gate electrode 122 provided in the display area AA. Multiple wiring L can also be provided, but it is not limited to this.

[0120] The advantage of a display device where the anode's side surface is positioned on a sloped surface to serve as a reflective surface is that light emitted from the LED is reflected from the sloped side surface of the anode, thus improving light extraction efficiency. However, because the anode is positioned on a sloped surface, a step can appear between the central and peripheral portions of the LED, resulting in an unfilled defect where the organic encapsulation layer of the encapsulation unit positioned above the LED does not completely fill the central portion of the LED. Consequently, the encapsulation unit, which blocks oxygen and moisture from penetrating the display device and flattens the upper portion of multiple LEDs, is damaged, reducing the reliability and aesthetics of the display device.

[0121] Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, the embankment 170 includes a plurality of first side surfaces 170a and a plurality of second side surfaces 170b. Thus, unapplied defects where the organic encapsulation layer 182 does not completely fill the central portion of the light-emitting diode 160 can be minimized.

[0122] Specifically, in the display device 100 according to an exemplary embodiment of the present disclosure, the side surface of the embankment 170 includes a plurality of first side surfaces 170a and a plurality of second side surfaces 170b, each having a different average tilt angle. The second side surfaces 170b may define grooves formed by partially removing the first side surfaces 170a, and have an average tilt angle smaller than that of the first side surfaces 170a. A second length B from the flat surface of the embankment 170 to the end of the embankment 170 located on the second side surface 170b may be greater than a first length A from the flat surface of the embankment 170 to the end of the embankment 170 located on the first side surface 170a. Furthermore, the second length B from the flat surface of the embankment 170 to the end of the embankment 170 located on the second side surface 170b may be greater than a third length C between one first side surface 170a and another first side surface 170a adjacent to the corresponding second side surface 170b. That is, the second side surfaces 170b may form narrow and long grooves. At this time, through the capillary effect of the narrow and long trench, the organic encapsulation layer 182 disposed above the light-emitting diode 160 can be moved from the peripheral portion of the flat surface of the light-emitting diode 160 corresponding to the embankment 170 to the central portion of the light-emitting diode 160. Therefore, in the display device 100 according to an exemplary embodiment of the present disclosure, the side surface of the embankment 170 includes a plurality of first side surfaces 170a and a plurality of second side surfaces 170b. Therefore, unapplied defects such as the organic encapsulation layer 182 not completely filling the central portion of the light-emitting diode 160 can be minimized, and the reliability and aesthetics of the display device 100 can be improved.

[0123] Figure 8 This is an enlarged plan view of a pixel of a display device according to another exemplary embodiment of the present disclosure. (Includes...) Figure 8 A display device with pixel P and containing Figure 2 The only difference between the display devices with pixel P is the position of the plurality of first side surfaces 870a and the plurality of second side surfaces 870b, but the other configurations are basically the same, so redundant descriptions will be omitted.

[0124] Reference Figure 8 If the planar shape formed by the exposed end of the first electrode 161 of the dam 870 is a polygonal shape, then a plurality of second side surfaces 870b can be disposed on the vertices of the polygon. Furthermore, a plurality of first side surfaces 870a can be disposed between the plurality of second side surfaces 870b, corresponding to the edges of the polygon. For example, when a sub-pixel SP has a small diameter of about 20µm or less, even if the second side surfaces 870b are only disposed on the vertices of the polygonal shape formed by the ends of the dam 870, the organic encapsulation layer 182 can fill the space formed by the second side surfaces 870b. However, this disclosure is not limited thereto.

[0125] In a display device according to another exemplary embodiment of the present disclosure, the side surface of the embankment 870 includes a plurality of first side surfaces 870a and a plurality of second side surfaces 870b. Therefore, unapplied defects where the organic encapsulation layer 182 does not completely fill the central portion of the light-emitting diode 160 can be minimized.

[0126] Specifically, in a display device according to another exemplary embodiment of the present disclosure, the side surface of the embankment 870 includes a plurality of first side surfaces 870a and a plurality of second side surfaces 870b, each having a different average tilt angle. The plurality of second side surfaces 870b may be grooves formed by partially removing the first side surfaces 870a, and have an average tilt angle smaller than that of the first side surfaces 870a. A second length B from the flat surface of the embankment 870 to the end of the embankment 870 located on the second side surface 870b may be greater than a first length A from the flat surface of the embankment 870 to the end of the embankment 870 located on the first side surface 870a. Furthermore, the second length B from the flat surface of the embankment 870 to the end of the embankment 870 located on the second side surface 870b may be greater than a third length C between one first side surface 870a and another first side surface 870a adjacent to the corresponding second side surface 870b. That is, the second side surface 870b may form a narrow and long groove. At this time, through the capillary effect of the narrow and long trench, the organic encapsulation layer 182 disposed above the light-emitting diode 160 can be moved from the peripheral portion of the flat surface of the light-emitting diode 160 corresponding to the embankment 870 to the central portion of the light-emitting diode 160. Therefore, in a display device according to another exemplary embodiment of the present disclosure, the side surface of the embankment 870 includes a plurality of first side surfaces 870a and a plurality of second side surfaces 870b. Thus, unapplied defects such as the organic encapsulation layer 182 not completely filling the central portion of the light-emitting diode 160 can be minimized, and the reliability and aesthetics of the display device can be improved.

[0127] Exemplary embodiments of this disclosure can also be described as follows:

[0128] According to one aspect of this disclosure, a display device may include: a substrate including a plurality of sub-pixels; a cover layer disposed on the substrate and including a base and a protrusion, the protrusion protruding from the base and having an inclined side surface; a first electrode disposed in each of the plurality of sub-pixels and covering a portion of the protrusion and the base; and a dam having an inclined side surface disposed on the first electrode and the protrusion and exposing an uncovered portion of the first electrode.

[0129] The side surface of the embankment may include multiple first side surfaces and multiple second side surfaces, wherein the average tilt angle of the multiple second side surfaces is smaller than the average tilt angle of the multiple first side surfaces.

[0130] Multiple second side surfaces can define multiple trenches obtained by partially removing multiple first side surfaces. Each trench can be adjacent to a first side surface of the multiple first side surfaces of the embankment.

[0131] The top surface of the embankment can be a flat surface, and the side surface of the embankment can connect the flat surface and the end of the embankment adjacent to the uncovered portion of the first electrode. The length from the flat surface of the embankment to the end of the embankment on the second side surface in a dimension parallel to the substrate can be greater than the length from the flat surface of the embankment to the end of the embankment on the first side surface in a dimension parallel to the substrate.

[0132] On the second side surface, the length from the flat surface to the end of the embankment may be greater than the distance between one first side surface and another first side surface adjacent to the corresponding second side surface.

[0133] The end of the embankment disposed on the corresponding first side surface may be collinear with the end of the embankment disposed on the corresponding second side surface, and the corresponding first side surface and the corresponding second side surface are adjacent.

[0134] The second side surface may have a width that decreases downward. Each second side surface may have a first width that is smaller than the second width of the corresponding second side surface, and the second width of the corresponding second side surface is further away from the substrate than the first width of the corresponding second side surface.

[0135] Multiple first side surfaces and multiple second side surfaces can be alternately arranged.

[0136] The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode can be a polygon, and multiple second side surfaces can be disposed on the sides of the polygon.

[0137] The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode can be a polygon, and multiple second side surfaces can be disposed at the vertices of the polygon.

[0138] The display device may further include an organic layer disposed on the first electrode and the diaphragm, a second electrode disposed on the organic layer, and an encapsulation unit disposed on the second electrode and including an organic encapsulation layer and a plurality of inorganic encapsulation layers.

[0139] The organic encapsulation layer can be configured to extend into the space formed by a plurality of second side surfaces located between a plurality of first side surfaces.

[0140] Multiple first side surfaces and multiple second side surfaces may be located between the reflective area of ​​the first electrode and the uncovered portion of the first electrode, the reflective area corresponding to the inclined side surface of the first electrode.

[0141] Multiple first side surfaces and multiple second side surfaces may each exist in each sub-pixel.

[0142] According to another aspect of this disclosure, a display device may include: a substrate; a cover layer disposed on the substrate and including a base and a protrusion, the protrusion protruding from the base and having an inclined side surface; a first electrode disposed to cover a portion of the protrusion and the base; and a dam disposed on the first electrode and the protrusion, the dam being disposed such that the dam exposes an uncovered portion of the first electrode.

[0143] The embankment may include a top surface and a side surface, the top surface being a flat surface, the side surface being an inclined region located between the flat surface and the end of the embankment adjacent to the uncovered portion of the first electrode, and the side surface of the embankment defining a plurality of grooves that may be disposed on at least a portion of the side surface of the embankment.

[0144] The average inclination angle of the side surface of the embankment located in the area with multiple trenches can be smaller than the average inclination angle of the side surface of the embankment located in the area without multiple trenches.

[0145] The length from the flat surface of the embankment to the end of the embankment in the region where multiple grooves are provided, in a dimension parallel to the substrate, can be greater than the length from the flat surface of the embankment to the end of the embankment in the region where multiple grooves are not provided, in a dimension parallel to the substrate.

[0146] In a dimension parallel to the substrate, the length of each trench from the flat surface to the end of the embankment can be greater than the width of each trench.

[0147] The end of the embankment located in the area with multiple trenches may be collinear with the end of the embankment located in the area without multiple trenches, wherein the area with multiple trenches is adjacent to the area without multiple trenches.

[0148] The trench may have a width that decreases downwards. The trench may have a first width that is smaller than a second width of the trench, and the second width of the trench is further away from the substrate than the first width of the trench.

[0149] The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode can be a polygon, and multiple grooves can be provided on the sides of the polygon.

[0150] The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode can be a polygon, and multiple grooves can be provided at the vertices of the polygon.

[0151] The display device may further include: an organic layer disposed on the first electrode and the diaphragm; a second electrode disposed on the organic layer; and an encapsulation unit disposed on the second electrode and including an organic encapsulation layer and a plurality of inorganic encapsulation layers.

[0152] The organic encapsulation layer can be configured to extend into multiple trenches.

[0153] The side surface of the embankment may be located between the reflective area of ​​the first electrode and the uncovered portion of the first electrode, with the reflective area corresponding to the inclined side surface of the first electrode.

[0154] The side surface of the embankment can define a plurality of grooves on at least a portion of the side surface of the embankment in each sub-pixel.

[0155] This disclosure also provides embodiments relating to a method of forming a display device.

[0156] In one embodiment, a method of forming a display device includes distributing a cover layer 150 on a substrate 110. The cover layer 150 includes a base 151 and a protrusion 152, the protrusion 152 protruding from the base 151 and having an inclined side surface. The substrate 110 includes a plurality of sub-pixels SP. The cover layer 150 may be configured to cover at least a portion of the substrate 110 and define the protrusion 152 relative to the base 151. A first electrode 161 is disposed in each of the plurality of sub-pixels SP such that the first electrode 161 covers at least a portion of the protrusion 152 and the base 151, as shown below. Figure 3 As shown. Then, a dam 170 with inclined side surfaces is provided on the first electrode 161 and the protrusion 152, such that at least a portion of the first electrode 161 remains uncovered by the dam 170, as shown. Figures 3 to 4 As shown. Then, a portion of the side surface of the embankment 170 is removed to form multiple trenches, such that the side surface of the embankment 170 includes multiple first side surfaces 170a and multiple second side surfaces 170b, the average inclination angle of the multiple second side surfaces 170b being smaller than the average inclination angle of the multiple first side surfaces 170a, as shown. Figure 6 As shown.

[0157] In some embodiments, and as Figures 3 to 4As shown, the embankment 170 includes a top surface TS, which is a flat surface, and side surfaces of the embankment 170 connect the flat surface and the end END of the embankment 170 adjacent to the uncovered portion UP of the first electrode 161. In such an embodiment, a plurality of trenches are formed such that the length measured in a dimension parallel to the substrate 110, from the flat surface of the embankment 170 to the end END of the embankment 170 located on the second side surface 170b, is greater than the length measured in the same dimension, from the flat surface of the embankment 170 to the end END of the embankment 170 located on the first side surface 170a, as shown in the figure. Figure 6 As shown.

[0158] In another embodiment, such as Figure 6 As shown, multiple trenches are formed such that the length, measured in a dimension parallel to the substrate 110, from the flat surface of the embankment 170 to the end END of the embankment 170 located on the second side surface 170b, is greater than the distance between one first side surface 170a and another first side surface 170a adjacent to the corresponding second side surface 170b. In this way, the relative lengths of the first and second side surfaces and the spacing between adjacent first side surfaces can be selectively controlled to achieve a desired geometry in the formed embankment structure.

[0159] In some embodiments, a plurality of trenches are formed such that the ends of the embankment 170 along each respective first side surface 170a are collinear with the ends of the embankment 170 along each respective second side surface 170b, the respective first side surface 170a and the respective second side surface 170b being adjacent. Figure 2 As shown, when viewed from above the substrate 110, this collinearity contributes to the uniformity of the planar structure of the embankment 170.

[0160] In another embodiment, and as Figure 5 As shown, multiple trenches are formed such that the width of each second side surface 170b tapers, having a first width closer to the substrate 110, which is smaller than a second width further away from the substrate 110. The resulting tapered geometry can facilitate desired capillary behavior during the deposition of subsequent layers.

[0161] In some embodiments, the plurality of trenches are formed such that a plurality of first side surfaces 170a and a plurality of second side surfaces 170b are alternately arranged along the side surfaces of the embankment 170, such as Figure 2 As shown. This alternating arrangement can be repeated along the side surface of the embankment 170 to provide uniformity in the trench distribution.

[0162] In another embodiment, the formation of a plurality of trenches defines a planar shape at the end of the embankment 170 adjacent to the uncovered portion of the first electrode 161, which, when viewed from above the substrate 110 (e.g., in a plan view), is polygonal, such as... Figure 2 As shown. In one embodiment, a plurality of second side surfaces 170b are disposed along the edges of the polygon, while in another embodiment, a plurality of second side surfaces 170b are disposed at the vertices of the polygon, as shown. Figure 8 As shown. The placement of the second side surface 170b can be selected as either edge-placed or vertex-placed, depending on pixel size, shape, or other design considerations.

[0163] In some embodiments, after forming multiple trenches, the method further includes providing an organic layer 162 on the first electrode 161 and the embankment 170, providing a second electrode 163 on the organic layer 162, and providing an encapsulation unit 180 on the second electrode 163. Figure 5 As shown, the encapsulation unit 180 includes a first inorganic encapsulation layer 181, a second inorganic encapsulation layer 183, and an organic encapsulation layer 182. The encapsulation unit 180 is positioned such that the organic encapsulation layer 182 extends into a space defined by a plurality of second side surfaces 170b located between a plurality of first side surfaces 170a. The extended configuration of the organic encapsulation layer 182 provides improved planarization and sealing performance.

[0164] Finally, in some embodiments, the multiple trenches are formed such that each sub-pixel SP includes both a plurality of first side surfaces 170a and a plurality of second side surfaces 170b. This arrangement ensures a consistent trench geometry across all sub-pixels SP of the display device, thereby improving the uniformity and reliability of the device.

[0165] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the following claims, and all technical concepts within the equivalent scope thereof should be understood to fall within the scope of the present disclosure.

[0166] The various embodiments described above can be combined to provide further embodiments. Based on the detailed description above, these and other changes can be made to the embodiments. Generally, the terminology used in the following claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to include all possible embodiments and the full scope of equivalents conferred by these claims. Therefore, the claims are not limited to this disclosure.

Claims

1. A display device, comprising: A substrate comprising multiple sub-pixels; A cover layer is disposed on the substrate and includes a base and a protrusion, the protrusion protruding from the base and having an inclined side surface; A first electrode is disposed in each of the plurality of sub-pixels and covers a portion of the protrusion and the base; as well as The embankment has inclined side surfaces disposed on the first electrode and the protrusion, and exposes the uncovered portion of the first electrode. The side surface of the embankment includes a plurality of first side surfaces and a plurality of second side surfaces, wherein the average tilt angle of the plurality of second side surfaces is smaller than the average tilt angle of the plurality of first side surfaces.

2. The display device according to claim 1, wherein, The plurality of second side surfaces define a plurality of grooves, each groove being adjacent to a first side surface of the plurality of first side surfaces of the embankment.

3. The display device according to claim 1, wherein, The top surface of the embankment is a flat surface, and the side surfaces of the embankment connect the flat surface and the end of the embankment adjacent to the uncovered portion of the first electrode. The length from the flat surface of the embankment to the end of the embankment disposed on each second side surface in a dimension parallel to the substrate is greater than the length from the flat surface of the embankment to the end of the embankment disposed on each first side surface in a dimension parallel to the substrate.

4. The display device according to claim 3, wherein, The length from the flat surface to the end of the embankment located on each second side surface is greater than the distance between a first side surface adjacent to each corresponding second side surface and another first side surface.

5. The display device according to claim 3, wherein, The end of the embankment disposed on the corresponding first side surface is collinear with the end of the embankment disposed on the corresponding second side surface, and the corresponding first side surface is adjacent to the corresponding second side surface.

6. The display device according to claim 1, wherein, Each second side surface has a first width, which is smaller than the second width of the corresponding second side surface, and the second width of the corresponding second side surface is further away from the substrate than the first width of the corresponding second side surface.

7. The display device according to claim 1, wherein, The plurality of first side surfaces and the plurality of second side surfaces are alternately arranged.

8. The display device according to claim 1, wherein, The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode is a polygon, and the plurality of second side surfaces are disposed on the sides of the polygon.

9. The display device according to claim 1, wherein, The planar shape formed by the end of the embankment adjacent to the uncovered portion of the first electrode is a polygon, and the plurality of second side surfaces are disposed at the vertices of the polygon.

10. The display device according to claim 1, wherein, The display device further includes: An organic layer is disposed on the first electrode and the embankment; The second electrode is disposed on the organic layer; The encapsulation unit, disposed on the second electrode, includes an organic encapsulation layer and multiple inorganic encapsulation layers. The organic encapsulation layer is configured to extend into the space formed by the plurality of second side surfaces located between the plurality of first side surfaces.

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