Display apparatus, method of manufacturing display apparatus, and electronic apparatus

Abstract

A display apparatus, a method of manufacturing a display apparatus, and an electronic apparatus are provided. The display apparatus includes a substrate including a display area and a peripheral area outside the display area, a plurality of display elements disposed on the display area, an encapsulation layer disposed on the plurality of display elements, a bank layer disposed on the encapsulation layer, and the bank layer including an opening overlapping the plurality of display elements, the opening extending in a direction, a lens disposed on the encapsulation layer and overlapping the opening, and a height control pattern layer disposed on the peripheral area and disposed between the lens and the encapsulation layer.

Description

Cross-reference to related applications

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0186220, filed on December 13, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to display devices, methods of manufacturing display devices, and electronic devices, and more specifically, to display devices including lenses, methods of manufacturing display devices, and electronic devices. Background Technology

[0003] To support various functions, electronic devices include display devices that provide users with visual information such as images. Display devices operate by forming display elements, such as organic light-emitting diodes (OLEDs), and thin-film transistors (TFTs) on a substrate, allowing the display elements to emit light. Specifically, the display element may include an emitting layer between pixel electrodes and a counter electrode. To regulate the path of light emitted from the emitting layer of the display element, lenses are disposed on the display element. Lenses are formed by depositing lens-forming material onto the display element using an inkjet printing process. Summary of the Invention

[0004] In display devices based on related technologies, the height of the lens decreases towards the end of the lens, and the display quality of the display device may deteriorate.

[0005] One or more embodiments include a display device that has improved display quality due to the uniform height of the lenses, a method of manufacturing the display device, and an electronic device. However, such technical objectives are merely examples, and the embodiments are not limited thereto.

[0006] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the embodiments.

[0007] According to one or more embodiments, a display device includes: a substrate including a display area and a peripheral area outside the display area; a plurality of display elements disposed on the display area; an encapsulation layer disposed on the plurality of display elements; a dam layer disposed on the encapsulation layer, and the dam layer including an opening overlapping the plurality of display elements, the opening extending in one direction; a lens disposed on the encapsulation layer and overlapping the opening; and a height control pattern layer disposed on the peripheral area and disposed between the lens and the encapsulation layer.

[0008] The lens can extend from the display area to the peripheral area.

[0009] The lens can extend from a portion of the peripheral area adjacent to one side of the display area through the display area to a portion of the peripheral area adjacent to the opposite side of the same side.

[0010] In a plan view, the embankment can surround the lens.

[0011] The embankment can be set on the display area and the surrounding area, and the portion of the embankment set on the surrounding area can be set on the height control pattern layer.

[0012] The end of the lens can be positioned on the height control pattern layer.

[0013] The thickness of the height-controlled pattern layer can be reduced as it approaches the display area.

[0014] The height control pattern layer may include: a first pattern layer disposed adjacent to one side of the display area; and a second pattern layer disposed adjacent to a back-to-back side opposite to the same side of the display area.

[0015] A portion of the lens may overlap with a portion of the first pattern layer, and another portion of the lens may overlap with a portion of the second pattern layer.

[0016] The encapsulation layer may include: a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0017] According to one or more embodiments, a method of manufacturing a display device includes: providing a substrate including a display area and a peripheral area outside the display area, wherein a plurality of display elements are disposed on the display area; forming an encapsulation layer on the substrate to cover the plurality of display elements; forming a height control pattern layer on the peripheral area; forming a dam layer on the encapsulation layer, the dam layer including openings overlapping the plurality of display elements and extending in one direction; and forming a lens on the encapsulation layer, the lens overlapping the openings of the dam layer.

[0018] Lens formation may include: coating a lens forming material onto an encapsulation layer to fill an opening; and irradiating the lens forming material with ultraviolet light.

[0019] Lens formation may involve coating the display area and peripheral areas with a lens forming material.

[0020] The formation of the embankment may include forming an embankment such that an opening can extend from a portion of the peripheral area adjacent to one side of the display area through the display area to a portion of the peripheral area adjacent to a back-to-back side opposite to the same side.

[0021] The formation of the embankment may include forming the embankment on the display area and the peripheral area, and the embankment is formed such that the portion of the embankment formed on the peripheral area can be formed on the height control pattern layer.

[0022] Lens formation may include coating a lens-forming material onto a portion of a height-controlled pattern layer.

[0023] The formation of a height control pattern layer may include forming a height control pattern layer such that the thickness of the height control pattern layer can decrease as it approaches the display area.

[0024] The formation of a height-controlled pattern layer may include: forming a first pattern layer on a portion of the peripheral region adjacent to one side of the display area; and forming a second pattern layer on another portion of the peripheral region adjacent to a back-to-back side opposite to the same side.

[0025] Lens formation may include coating a lens forming material onto a portion of a first patterned layer and a portion of a second patterned layer.

[0026] According to one or more embodiments, an electronic device includes: a display device; and a housing that accommodates the display device and forms the appearance of the electronic device, wherein the display device includes: a substrate including a display area and a peripheral area outside the display area; a plurality of display elements disposed on the display area; an encapsulation layer disposed on the plurality of display elements; a dam layer disposed on the encapsulation layer, and the dam layer including an opening overlapping the plurality of display elements, the opening extending in one direction; a lens disposed on the encapsulation layer and overlapping the opening; and a height control pattern layer disposed on the peripheral area and disposed between the lens and the encapsulation layer.

[0027] Other aspects, features and advantages will become apparent from the specific description, claims and drawings to realize the disclosure herein. Attached Figure Description

[0028] The above and other aspects, features and advantages of particular embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of an electronic device according to an embodiment; Figure 2 This is a schematic plan view of a display device according to an embodiment; Figure 3 Is included Figure 2 A schematic diagram of the equivalent circuit of the pixel circuit in a display device; Figure 4 yes Figure 2 A schematic enlarged plan view of area A of the display device; Figure 5 It is along Figure 4The line B-B' intercepts Figure 4 A schematic cross-sectional view of the display device; Figure 6 This is a schematic plan view of a display device according to an embodiment; Figure 7 It is along Figure 6 The line C-C' intercepted Figure 6 A schematic cross-sectional view of the display device; Figure 8 It is along Figure 6 The line D-D' intercepted Figure 6 A schematic cross-sectional view of the display device; Figures 9 to 13 This is a schematic cross-sectional view illustrating a method for manufacturing a display device according to an embodiment; Figure 14 A schematic plan view of a portion of a manufactured display device according to an embodiment; and Figure 15 This is a schematic cross-sectional view used to illustrate a method for manufacturing a display device according to a comparative example. Detailed Implementation

[0029] Referring now to embodiments in detail, examples of which are shown in the accompanying drawings, wherein the same reference numerals always refer to the same elements. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to illustrate aspects of this description. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, all or variations thereof.

[0030] Because this disclosure allows for various modifications and numerous embodiments, specific embodiments will be shown in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as methods for achieving these effects and features, will be illustrated with reference to the embodiments described below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be implemented in various forms.

[0031] While terms such as "first" and "second" can be used to describe various components, such components are not necessarily limited to these terms. These terms are used to distinguish one component from another.

[0032] Unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” used herein are intended to include the plural forms as well.

[0033] It will be understood that the terms “comprising” and / or “including” as used herein indicate the presence of the stated features or components, but do not exclude the addition of one or more other features or components.

[0034] In the description, "A and / or B" means A or B, or A and B. In the description, "at least one of A and B" means A or B, or A and B.

[0035] In the description, when various elements such as layers, zones, and plates are disposed "on" another element, the element can not only be disposed "directly" on the other element, but the other element can also be disposed between the element and the other element.

[0036] It will be understood that when a layer, area, or component is referred to as being "connected" to another layer, area, or component, the layer, area, or component may be "directly connected" to the other layer, area, or component, or may be "indirectly connected" to the other layer, area, or component, with the other layer, area, or component located between the two layers, areas, or components. For example, it will be understood that when a layer, area, or element is referred to as being "electrically connected" to another layer, area, or element, the layer, area, or element may be "directly electrically connected" to the other layer, area, or element, or may be "indirectly electrically connected" to the other layer, area, or element, with the other layer, area, or element located between the two layers, areas, or components.

[0037] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0038] Where specific embodiments can be implemented differently, the specific process sequence may be performed in a different order than that described. As an example, two processes described consecutively may be performed substantially simultaneously and in reverse order.

[0039] In the description, when "plan view" is mentioned, it means the target portion as viewed from above. In the description, "on a plane" means "when viewed from a direction perpendicular to the base."

[0040] In the following description, embodiments will be illustrated with reference to the accompanying drawings, wherein the same reference numerals refer to the same elements throughout, and repeated descriptions of them are omitted. For ease of illustration, the dimensions of elements in the drawings may be exaggerated or reduced. As an example, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented for ease of description, and therefore, embodiments are not necessarily limited thereto.

[0041] Figure 1This is a schematic perspective view of electronic device 2 according to an embodiment. Figure 2 This is a schematic plan view of display device 1 according to an embodiment.

[0042] like Figure 1 and Figure 2 As shown, display device 1 can be a device for displaying moving or still images. Display device 1 can display images or input or output data from electronic device 2.

[0043] Despite Figure 1 The illustration shows display device 1 used as an example in a mobile phone, but the embodiments are not limited thereto. As an example, display device 1 can be used as a display screen in various electronic devices including televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation systems, and ultra-mobile personal computers (UMPCs).

[0044] For example, the display device 1 according to the embodiment can be used in electronic devices such as wearable devices including smartwatches, smartwatch phones, glasses displays, and head-mounted displays (HMDs). In the embodiment, the display device 1 can be adapted to a display screen in various electronic devices. For example, various electronic devices may include dashboards for automobiles, central dashboards for automobiles or central information displays (CIDs) arranged on dashboards, interior mirror displays that replace side mirrors of automobiles, and displays for entertainment systems arranged on the back of the front seats for rear passengers in automobiles.

[0045] In an embodiment, the display device 1 may be housed within a housing 3 of the electronic device 2. The housing 3 may be a cover that protects internal components such as the display device 1 and forms the exterior of the electronic device 2. For example, the display device 1 may be connected to an electronic module of the electronic device 2 and driven within the electronic device 2. The display device 1 will be described below.

[0046] like Figure 2 As shown, display device 1 may include a display area DA and a peripheral area PA. For example, pixels PX may be disposed within the display area DA, and the peripheral area PA may be outside the display area DA. For example, the peripheral area PA may completely surround the display area DA. This is understood to mean that the substrate 100 included in display device 1 (see...) Figure 5 It has a display area DA and a peripheral area PA.

[0047] Each pixel PX of display device 1 can be an area that emits light of a preset color. Display device 1 can display an image by using the light from the pixels PX. As an example, each pixel PX can emit red, green, or blue light. Figure 2 As shown, the display area DA can have a polygonal shape, including a quadrilateral shape. As an example, the display area DA can have a rectangular shape where the horizontal length of the display area DA is smaller than the vertical length of the display area DA, a rectangular shape where the horizontal length of the display area DA is larger than the vertical length of the display area DA, or a square shape. In another example, the display area DA can have various shapes such as an ellipse or a circle.

[0048] The peripheral area PA can be a non-display area where no pixels PX are located. Drivers and the like, used to provide electrical signals or power to the display elements corresponding to the pixels PX, can be located in the peripheral area PA. Pads can be located in the peripheral area PA. For example, electronic components or printed circuit boards can be electrically connected to the pads. The pads can be spaced apart from each other in the peripheral area PA and electrically connected to the printed circuit board or integrated circuit components.

[0049] In the following description, although the organic light-emitting display device is described as an example of display device 1 according to an embodiment, the embodiment is not limited thereto. In another embodiment, display device 1 according to the embodiment may be an inorganic light-emitting display device or a quantum dot light-emitting display device. As an example, the emitting layer of the display element of display device 1 may include organic or inorganic materials. For example, display device 1 may include an emitting layer and a quantum dot layer disposed in the path of light emitted from the emitting layer.

[0050] Figure 3 Is included Figure 2 A schematic diagram of the equivalent circuit of the pixel circuit PC in the display device 1. The pixel circuit PC can be electrically connected to the display element, and a display element can be connected to a pixel PX (see [reference]). Figure 2 (Corresponding to each other). For example, display elements can emit red, green, or blue light. Figure 3 The image shows an organic light-emitting diode (OLED) as a display element.

[0051] The pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. The second transistor T2 may be a switching thin-film transistor, connected to the scan line SL and the data line DL, and turned on according to a switching signal to transmit a data signal to the first transistor T1. The data signal is input from the data line DL, and the switching signal is input from the scan line SL. The storage capacitor Cst may include one end electrically connected to the second transistor T2 and the other end electrically connected to the drive voltage line PL. The storage capacitor Cst may store a voltage corresponding to the difference between the voltage transmitted from the second transistor T2 and the drive power voltage ELVDD supplied to the drive voltage line PL.

[0052] The first transistor T1 can be a driving transistor, connected to the driving voltage line PL and the storage capacitor Cst. The magnitude of the driving current is controlled according to the voltage stored in the storage capacitor Cst, and the driving current flows from the driving voltage line PL to the organic light-emitting diode (OLED). The OLED can emit light with a preset brightness corresponding to the driving current. The opposite electrode of the OLED can receive the electrode power voltage ELVSS.

[0053] Although reference Figure 3 The pixel circuit PC is described as including two transistors and one storage capacitor, but the embodiments are not limited to this. As an example, the number of transistors and the number of storage capacitors can be varied depending on the design of the pixel circuit PC.

[0054] Figure 4 yes Figure 2 A schematic enlarged plan view of area A of display device 1. For convenience, Figure 4 A plan view of the pixel-limiting layer 120 is shown.

[0055] like Figure 4 As shown, pixel PX can be set in display area DA (see...) Figure 2 In the PX, each pixel can emit, for example, red, green, or blue light. Red light can be light within a wavelength band of about 580 nm to about 780 nm, green light can be light within a wavelength band of about 495 nm to about 580 nm, and blue light can be light within a wavelength band of about 400 nm to about 495 nm.

[0056] Such as organic light-emitting diodes (e.g., Figure 3The display elements of an organic light-emitting diode (OLED) can correspond to each pixel PX. For example, each of the display elements included in display device 1 corresponds to each pixel PX of display device 1, and each of the display elements can emit red, green, or blue light. In the description, when a display element corresponds to a pixel, or when a pixel corresponds to a display element, this means that a pixel is the emission area of ​​a display element.

[0057] A stacked structure of pixel electrodes, an emitter layer, and a counter electrode can form a display element (e.g., an organic light-emitting diode). As an example, pixel electrode 210 can be disposed on substrate 100 (see [reference]). Figure 5 The pixel electrodes 210 are disposed on the display area DA of the display element. The pixel electrodes 210 can be disposed separately from each other in the plan view. A pixel defining layer 120 can be disposed on the pixel electrodes 210. The pixel defining layer 120 may include pixel openings OP1. Each of the pixel openings OP1 can expose the central portion of a corresponding pixel electrode 210. For example, a portion of the pixel electrode 210 of the display element can be exposed through the pixel openings OP1. The pixel defining layer 120 may not be disposed on the portion of the pixel electrode 210 exposed through the pixel openings OP1, but the pixel defining layer 120 may be disposed on another portion of the pixel electrode 210 not exposed through the pixel openings OP1.

[0058] For example, the emitting layers for emitting light can be positioned within pixel openings OP1 of the pixel defining layer 120. Counter electrodes can be disposed on the emitting layers. A pixel opening OP1 of the pixel defining layer 120 can define an emitting region of a display element. The emitting region defined by the pixel opening OP1 can be defined as a pixel PX. Although in Figure 4 The illustration shows pixel openings OP1 with the same size, but the embodiment is not limited to this. Pixel openings OP1 can have different sizes.

[0059] Figure 5 It is along Figure 4 The line B-B' intercepts Figure 4 Display device 1 (see Figure 2 A schematic cross-sectional view of ( ). For example... Figure 5 As shown, the display device 1 according to an embodiment includes a substrate 100.

[0060] Substrate 100 may comprise a variety of flexible (e.g., bendable) materials. As an example, substrate 100 may comprise glass, metal, or polymer resin. For instance, substrate 100 may comprise polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Substrate 100 may have two layers, each comprising a polymer resin, and an inorganic material (such as silicon dioxide (SiO2)) between the two layers. x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y (e.g., a multi-layered barrier structure. However, various modifications can be made.)

[0061] Display elements DPE and pixel circuits PC electrically connected to display elements DPE can be disposed on substrate 100. For example, pixel circuits PC can be disposed on substrate 100. Each of the pixel circuits PC can be electrically connected to a corresponding display element DPE. Because the structures of pixel circuits PC are identical to each other, and the structures of display elements DPE are identical to each other, a pixel circuit PC and a display element DPE are described.

[0062] The pixel circuit PC can be disposed on the substrate 100. The pixel circuit PC may include a transistor TFT and a storage capacitor Cst. For ease of illustration, Figure 5 The diagram shows a transistor TFT, and the transistor TFT can be coupled to a first transistor T1 (see [reference]). Figure 3 )correspond.

[0063] Including silicon dioxide (SiO2) x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y An inorganic material buffer layer 111 can be disposed between the transistor TFT and the substrate 100. The buffer layer 111 can increase the flatness of the upper surface of the substrate 100, or prevent or reduce the penetration of impurities from the substrate 100 and the like into the semiconductor layer Act of the transistor TFT.

[0064] like Figure 5 As shown, the transistor TFT may include a semiconductor layer Act comprising amorphous silicon, polycrystalline silicon, organic semiconductor material, or oxide semiconductor material. The transistor TFT may include a gate electrode GE, a source electrode SE, and / or a drain electrode DE. The gate electrode GE may include various conductive materials, have various layer structures, and include, for example, a Mo layer and an Al layer. In another example, the gate electrode GE may include TiN. xThe source electrode SE and drain electrode DE may also comprise various conductive materials, have various layer structures, and include, for example, Ti layers, Al layers, and / or Ti layers.

[0065] To ensure insulation between the semiconductor layer Act and the gate electrode GE, a gate insulating layer 113 may be disposed between the semiconductor layer Act and the gate electrode GE. For example, the gate insulating layer 113 may include silicon oxide (SiO2). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y Inorganic materials. Although in Figure 5 The diagram shows that the gate insulating layer 113 has a shape corresponding to the entire surface of the substrate 100 and has a structure in which contact holes are formed in a predetermined portion, but the embodiment is not limited thereto. As an example, the gate insulating layer 113 may be patterned in the same shape as the gate electrode GE.

[0066] For example, the first interlayer insulating layer 115 may be disposed on the gate electrode GE. For example, the first interlayer insulating layer 115 may include silicon oxide (SiO2). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y The first interlayer insulation layer 115 may comprise a single-layer or multi-layer structure containing the above materials. The insulation layer comprising the inorganic insulating material can be formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD). This also applies to the following embodiments and their modifications.

[0067] The storage capacitor Cst may include a first capacitor electrode CE1 and a second capacitor electrode CE2 that overlap each other, with a first interlayer insulating layer 115 between the first capacitor electrode CE1 and the second capacitor electrode CE2. The storage capacitor Cst may overlap with a transistor TFT. Regarding this aspect, although... Figure 5 The diagram illustrates that the gate electrode GE of the transistor TFT serves as the first capacitor electrode CE1 of the storage capacitor Cst, but the embodiment is not limited thereto. As an example, the storage capacitor Cst may not overlap with the transistor TFT. The second capacitor electrode CE2 of the storage capacitor Cst may comprise a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti) and have a single-layer or multi-layer structure comprising the above materials.

[0068] The second interlayer insulating layer 117 can be disposed on the second capacitor electrode CE2 of the storage capacitor Cst. For example, the second interlayer insulating layer 117 may include silicon oxide (SiO2). xSilicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y The second interlayer insulation layer 117 may include a single-layer structure or a multi-layer structure containing the above materials.

[0069] The source electrode SE and drain electrode DE can be disposed on the second interlayer insulating layer 117. The source electrode SE and drain electrode DE can each comprise a highly conductive material. The source electrode SE and drain electrode DE can each comprise a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti) and can comprise a single-layer structure or a multilayer structure containing the above materials. As an example, the source electrode SE and drain electrode DE can have a Ti / Al / Ti multilayer structure.

[0070] However, the embodiments are not limited thereto. As an example, a transistor TFT may have only one of a source electrode SE and a drain electrode DE, or neither. As an example, one transistor TFT may not have a drain electrode DE, another transistor TFT connected to the transistor TFT may not have a source electrode SE, and the semiconductor layers Act of the two transistors may be connected to each other. This connection structure can result in the same operational behavior as when one transistor TFT has a source electrode SE and the other transistor TFT has a drain electrode DE, and the source electrode SE of the transistor TFT is connected to the drain electrode DE of the other transistor TFT.

[0071] like Figure 5 As shown, the organic insulating layer 118 can be configured to cover the transistor TFT and the storage capacitor Cst. The organic insulating layer 118 can include organic insulating materials. As an example, the organic insulating layer 118 can include benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), polystyrene, polymer derivatives having phenolic groups, acrylic polymers, imide polymers, aromatic ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, vinyl alcohol polymers, or mixtures thereof. For example, a third interlayer insulating layer can also be disposed below the organic insulating layer 118. The third interlayer insulating layer can include materials such as silicon oxide (SiO2). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y Inorganic insulating materials.

[0072] The display element DPE can be disposed on the organic insulating layer 118. As an example, the display element DPE can be an organic light-emitting diode. The display element DPE can include a pixel electrode 210, an emitting layer 220, and a counter electrode 230. The counter electrode 230 can be integrally provided throughout the entire surface of the display device 1, and therefore, is commonly provided throughout the display element DPE.

[0073] Pixel electrode 210 may include a light-transmitting conductive layer and a reflective layer. For example, the light-transmitting conductive layer may include a light-transmitting conductive oxide such as indium tin oxide (ITO), indium oxide (In₂O₃), or indium zinc oxide (IZO), and the reflective layer may include a metal such as aluminum (Al) or silver (Ag). As an example, pixel electrode 210 may have a three-layer structure of ITO / Ag / ITO. Figure 5 As shown, pixel electrode 210 can be electrically connected to the transistor TFT by contacting one of the source electrode SE and the drain electrode DE. For example, pixel electrode 210 can contact one of the source electrode SE and the drain electrode DE through a contact hole formed in the organic insulating layer 118.

[0074] Pixel defining layer 120 may be disposed on organic insulating layer 118. As described above, pixel defining layer 120 may include pixel opening OP1. Pixel opening OP1 may expose the central portion of pixel electrode 210 of display element DPE. For example, pixel defining layer 120 may define emission region of display element DPE by including openings corresponding to pixels PX (e.g., openings that at least expose the central portion of pixel electrode 210). For example, in Figure 5 In the structure shown, the pixel defining layer 120 can increase the distance between the edge portion of the pixel electrode 210 and the opposing electrode 230 above the pixel electrode 210. Therefore, it is possible to prevent electric arcing or the like at the edge portion of the pixel electrode 210. The pixel defining layer 120 may comprise an organic material such as polyimide or HMDSO.

[0075] A counter electrode 230 may be disposed on the pixel electrode 210. The counter electrode 230 may be integrally provided throughout the display element DPE. Therefore, the counter electrode 230 may be disposed on the pixel electrode 210. The counter electrode 230 may include a light-transmitting conductive layer comprising ITO, In2O3, or IZO, and a semi-transmitting layer comprising a metal such as aluminum (Al) or silver (Ag). As an example, the counter electrode 230 may be a semi-transmitting layer comprising magnesium (Mg) or silver (Ag).

[0076] An emitting layer 220 for emitting light may be disposed between the pixel electrode 210 and the opposing electrode 230. The emitting layer 220 may emit red, green, or blue light. The emitting layer 220 may comprise a polymeric organic material or a small-molecule organic material that emits light with a preset color (e.g., red, green, or blue). As an example, the emitting layer 220 may comprise a polymeric material such as polyphenylene oxide (PPV) or polyfluorene. The emitting layer 220 may be formed using processes such as screen printing, inkjet printing, or laser-induced thermal imaging (LITI). However, the embodiments are not limited thereto.

[0077] In an embodiment, the functional layers may be disposed below and on the emitter layer 220. The functional layers may include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and / or an electron injection layer (EIL). The functional layers may be integral on top of the pixel electrode 210 or patterned to correspond to each of the pixel electrodes 210.

[0078] The encapsulation layer 400 can be disposed on the display element DPE. For example, the encapsulation layer 400 can be disposed on the opposing electrode 230. For example, because the display element DPE may be easily damaged by external moisture or oxygen, the encapsulation layer 400 can protect the display element DPE by covering it. Figure 5 As shown, the encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430. For example, the encapsulation layer 400 may be disposed on the opposing electrode 230. For example, the encapsulation layer 400 may include a first inorganic encapsulation layer 410, a second inorganic encapsulation layer 430, and an organic encapsulation layer 420 between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430. The second inorganic encapsulation layer 430 may be disposed on the first inorganic encapsulation layer 410.

[0079] The first inorganic encapsulation layer 410 may cover the opposing electrode 230 and may include silicon oxide (SiO2). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y For example, other layers, including the capping layer, can be disposed between the first inorganic encapsulation layer 410 and the opposing electrode 230. Because the first inorganic encapsulation layer 410 is formed along the structure beneath it, therefore... Figure 5The upper surface of the first inorganic encapsulation layer 410 shown may not be flat. An organic encapsulation layer 420 may cover the first inorganic encapsulation layer 410, and unlike the first inorganic encapsulation layer 410, the upper surface of the organic encapsulation layer 420 may be substantially flat. The organic encapsulation layer 420 may include at least one material selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polysulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer 430 may cover the organic encapsulation layer 420 and may include silicon dioxide (SiO₂). x Silicon nitride (SiN) x ) and / or silicon oxynitride (SiO) x N y ).

[0080] Because the encapsulation layer 400 includes a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, even if a crack occurs inside the encapsulation layer 400, the crack can pass through the multi-layer structure described above without connecting between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. This configuration prevents or reduces the formation of pathways through which external moisture or oxygen can penetrate into the interior of the display device 1.

[0081] A dam layer (BNK) may be disposed on the encapsulation layer 400. The dam layer BNK may include a dam opening OP2. The dam opening OP2 may overlap with the display element DPE. For example, the dam opening OP2 may overlap with a pixel opening OP1. The dam layer BNK may include a hydrophobic material. Therefore, because the lens-forming material coated on the dam layer BNK is not widely distributed, the cross-section of the lens 500 formed on the dam layer BNK may have a shape similar to a semicircle. For this purpose, the dam layer BNK may include an organic material containing fluorine. In another example, the dam layer BNK may include at least one of benzocyclobutene (BCB), polyimide (PI), polyamide (PA), acrylic resin, and phenolic resin. However, the embodiments are not limited thereto.

[0082] Lens 500 may be disposed on encapsulation layer 400. Lens 500 may overlap with dam opening OP2. For example, lens 500 may overlap with display element DPE and pixel opening OP1. A portion of lens 500 may be disposed in dam opening OP2, and another portion of lens 500 may be disposed on dam layer BNK. For example, a portion of lens 500 may be positioned at the same distance as the distance between dam layer BNK and substrate 100, and another portion of lens 500 may be positioned at a distance greater than the distance between dam layer BNK and substrate 100.

[0083] Lens 500 can adjust the path of light emitted from the emitting layer 220 of the display element DPE and acts as a condenser lens. Lens 500 can change the path of light emitted from the emitting layer 220 of the display element DPE that travels in a direction not parallel to the axis (z-axis) perpendicular to the substrate 100, and allows light to travel in a direction substantially perpendicular to the substrate 100 (z-axis direction).

[0084] For this purpose, lens 500 may have a high refractive index. For example, lens 500 may have a refractive index greater than that of the layer disposed on lens 500 or the atmosphere. As an example, the refractive index of lens 500 may be about 1.5 or greater, for example, about 1.5 to about 1.8. As an example, lens 500 may comprise an acrylic organic material having a refractive index of about 1.6. In another example, lens 500 may comprise an acrylic organic material having a refractive index of about 1.65.

[0085] Lens 500 may include acrylic resins (e.g., polymethyl methacrylate and polyacrylic acid), ethylhexyl acrylate, pentafluoropropyl acrylate, polyethylene glycol dimethacrylate, or ethylene glycol dimethacrylate. Lens 500 may also include thermosetting agents and / or UV curing agents such as epoxy resins.

[0086] In an embodiment, lens 500 may be covered by a low-refractive layer having a smaller refractive index than lens 500. As an example, the refractive index of the low-refractive layer may be about 1.2 or greater, for example, about 1.2 to about 1.5. The low-refractive layer may cover the entire upper surface of substrate 100, and the upper surface of the low-refractive layer may be substantially flat.

[0087] The low-refractive-index layer may include acrylic resins (e.g., polymethyl methacrylate and polyacrylic acid), ethylhexyl acrylate, pentafluoropropyl acrylate, polyethylene glycol dimethacrylate, or ethylene glycol dimethacrylate. The refractive index of the low-refractive-index layer material may be lower than that of the material of lens 500.

[0088] In this embodiment, the dam opening OP2 and the lens 500 may overlap with multiple display elements DPE. For example, the dam opening OP2 and the lens 500 may overlap with multiple pixel openings OP1.

[0089] Figure 6 This is a schematic plan view of display device 1 according to an embodiment. Figure 6 This is a plan view on the second inorganic encapsulation layer 430, showing the dam layer BNK and the lens 500. For ease of description, Figure 6 The pixel opening OP1, located below the second inorganic encapsulation layer 430, is also shown. For ease of description, in Figure 6 The text shows the display area DA and the surrounding area PA.

[0090] like Figure 6 As shown, the embankment layer BNK can be disposed on the display area DA and the peripheral area PA. The lens 500 can also be disposed on the display area DA and the peripheral area PA.

[0091] For this purpose, the dike opening OP2 included in the dike layer BNK can extend in one direction. For example, each of the dike openings OP2 can extend in one direction. For example, the dike opening OP2 can extend in a first direction (e.g., the y-axis direction) and extend from the display area DA to the peripheral area PA. As an example, the dike opening OP2 can extend from a portion of the peripheral area PA adjacent to one side of the display area DA through the display area DA to a portion of the peripheral area PA adjacent to the opposite side (e.g., the back-to-back side) of the same side.

[0092] For example, a single dam opening OP2 can overlap with multiple pixel openings OP1. For example, a single dam opening OP2 can overlap with multiple display elements DPE (see...). Figure 7 (overlap). For example, multiple pixel openings OP1 that overlap with a single dike opening OP2 can be arranged in one direction. In another example, multiple display elements DPEs that overlap with a single dike opening OP2 can be arranged in one direction.

[0093] As described above, because lens 500 overlaps with the embankment opening OP2, lens 500 can also extend in one direction. For example, each of the lenses 500 can extend in one direction. For example, lens 500 can extend in a first direction (e.g., the y-axis direction) and extend from the display area DA to the peripheral area PA. As an example, lens 500 can extend from a portion of the peripheral area PA adjacent to one side of the display area DA through the display area DA to a portion of the peripheral area PA adjacent to a back-to-back side opposite to the same side.

[0094] For example, lens (or a single lens) 500 may overlap with multiple pixel openings OP1. For example, lens 500 may overlap with multiple display elements DPE. For example, the multiple pixel openings OP1 overlapping with lens 500 may be arranged in one direction. In another example, the multiple display elements DPE overlapping with lens 500 may be arranged in one direction.

[0095] Therefore, as Figure 6As shown, when viewed from a direction perpendicular to the substrate 100, the dam layer BNK may surround the lens 500. For example, in a plan view, the dam layer BNK may surround the lens 500. In an embodiment, a plurality of display elements DPEs overlapping with the dam opening OP2 may emit light of the same color. As an example, a plurality of display elements DPEs overlapping with one of the dam openings OP2 may emit red light. A plurality of display elements DPEs overlapping with another of the dam openings OP2 may emit green light, and a plurality of display elements DPEs overlapping with yet another of the dam openings OP2 may emit blue light.

[0096] For example, multiple display elements (DPEs) overlapping a lens 500 can emit light of the same color. As an example, multiple display elements (DPEs) overlapping one of the lenses 500 can emit red light. Multiple display elements (DPEs) overlapping another of the lenses 500 can emit green light, and multiple display elements (DPEs) overlapping yet another of the lenses 500 can emit blue light.

[0097] Despite Figure 6 The diagram shows the dike opening OP2 extending in a first direction (e.g., the y-axis direction), but the embodiment is not limited thereto. As an example, the dike opening OP2 may extend in a second direction (e.g., the x-axis direction) intersecting the first direction (e.g., the y-axis direction). For example, the lens 500 may extend in the second direction (e.g., the x-axis direction).

[0098] Figure 7 It is along Figure 6 The line C-C' intercepted Figure 6 A schematic cross-sectional view of display device 1, and Figure 8 It is along Figure 6 The line D-D' intercepted Figure 6 A schematic cross-sectional view of the display device 1.

[0099] like Figure 7 and Figure 8 As shown, the display device 1 may further include a height control pattern layer HCP disposed on the peripheral region PA. The height control pattern layer HCP may include a first pattern layer P1 and a second pattern layer P2. The first pattern layer P1 may be disposed adjacent to one side (or one side) of the display region DA, and the second pattern layer P2 may be disposed adjacent to a back-to-back side opposite to the same side of the display region DA, with the display region DA located between the first pattern layer P1 and the second pattern layer P2. For example, the first pattern layer P1 may be disposed on the portion of the peripheral region PA adjacent to one side of the display region DA, and the second pattern layer P2 may be disposed on another portion of the peripheral region PA adjacent to the back-to-back side opposite to the same side of the display region DA.

[0100] like Figure 7and Figure 8 As shown, a height control pattern layer HCP can be disposed between the lens 500 and the encapsulation layer 400. For example, a portion of the lens 500 can be disposed on the height control pattern layer HCP. In another example, the lens 500 can overlap with a portion of the height control pattern layer HCP. As an example, a portion of the lens 500 can overlap with a portion of the first pattern layer P1, and another portion of the lens 500 can overlap with a portion of the second pattern layer P2.

[0101] For example, lens 500 may overlap with a portion of height control pattern layer HCP in the peripheral region PA. For example, lens 500 may overlap with a portion of first pattern layer P1 in the portion of peripheral region PA adjacent to one side of display region DA. Lens 500 may overlap with a portion of second pattern layer P2 in another portion of peripheral region PA adjacent to the back-to-back side opposite to the same side of display region DA.

[0102] As described above, in the plan view, because the embankment layer BNK surrounds the lens 500, the portion of the embankment layer BNK located on the outer region PA can be located on the height control pattern layer HCP. As an example, such as... Figure 7 and Figure 8 As shown, a portion of the embankment layer BNK disposed on the peripheral region PA can be disposed on the first pattern layer P1, and another portion of the embankment layer BNK disposed on the peripheral region PA can be disposed on the second pattern layer P2. For example, the end of the lens 500 can overlap with the height control pattern layer HCP. The end of the lens 500 can be disposed on the height control pattern layer HCP.

[0103] For example, the two opposite ends of the lens 500 in the direction in which the lens 500 extends may overlap with the height control pattern layer HCP. The two opposite ends of the lens 500 in the direction in which the lens 500 extends may be disposed on the height control pattern layer HCP. For example, one of the two opposite ends of the lens 500 in the direction in which the lens 500 extends may be disposed on the first pattern layer P1, and the other may be disposed on the second pattern layer P2.

[0104] In this embodiment, the thickness of the height control pattern layer HCP can increase as the height control pattern layer HCP moves away from the display area DA. For example, the thickness of the height control pattern layer HCP can decrease towards the display area DA. As an example, such as Figure 7As shown, the thickness of the first pattern layer P1 can decrease in the direction toward the display area DA, and the thickness of the second pattern layer P2 can decrease in the direction toward the display area DA. In the description, the thickness of a layer or a pattern represents the length of a layer or a pattern in a direction perpendicular to the substrate 100 (e.g., the z-axis direction).

[0105] In another embodiment, the height control pattern layer HCP may include a first portion adjacent to the display area DA and a second portion less adjacent to the display area DA than the first portion, and the thickness of the second portion may be greater than the thickness of the first portion. As an example, the first pattern layer P1 may include a first-1 portion adjacent to the display area DA and a first-2 portion less adjacent to the display area DA than the first-1 portion, and the thickness of the first-2 portion may be greater than the thickness of the first-1 portion. Similarly, the second pattern layer P2 may include a second-1 portion adjacent to the display area DA and a second-2 portion less adjacent to the display area DA than the second-1 portion, and the thickness of the second-2 portion may be greater than the thickness of the second-1 portion.

[0106] For example, the thickness of the height control pattern layer HCP can vary depending on its location, and the thickest portion of the height control pattern layer HCP (e.g., the portion of the height control pattern layer HCP furthest from the display area DA) can have a thickness of approximately 8 μm. In contrast, the embankment layer BNK can have a uniform thickness across both the display area DA and the peripheral area PA. For example, the thickness of the embankment layer BNK disposed on the height control pattern layer HCP can be equal to or similar to the thickness of the embankment layer BNK disposed on the display area DA. Because the thickness of the embankment layer BNK is sufficiently thin compared to the height control pattern layer HCP, even if a portion of the embankment layer BNK is disposed on the height control pattern layer HCP, the thickness of the embankment layer BNK disposed on the height control pattern layer HCP can be equal to or similar to the thickness of the embankment layer BNK disposed on the display area DA. As an example, the thickness of the embankment layer BNK can be approximately 2 µm.

[0107] When the two opposite ends of the lens 500 in the direction in which the lens 500 extends are disposed on the height control pattern layer HCP, the lens forming material P500 (see below) is as described below. Figure 13 The height of the lens forming material P500 can be uniform during the manufacturing process of the display device 1. For example, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens forming material P500 may not decrease towards the end of the lens forming material P500.

[0108] Therefore, the height of the lens 500 can be uniform. The length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 does not need to decrease towards the end of the lens 500. In the description, the height of the lens forming material P500 represents the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens forming material P500 in a direction perpendicular to the substrate 100 (e.g., the z-axis direction). In the description, the height of the lens 500 represents the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 in a direction perpendicular to the substrate 100 (e.g., the z-axis direction). Therefore, in the display device 1 according to the embodiment, the light characteristics of the display element DPE disposed adjacent to the peripheral region PA can be maintained without degradation. For example, the display quality of the display device 1 can be improved.

[0109] like Figure 7 As shown, dam 130 can be disposed on the peripheral region PA of substrate 100. For example, dam 130 can be adjacent to an edge portion of substrate 100 and disposed on the peripheral region PA to surround display region DA. During the process of forming organic encapsulation layer 420, dam 130 can prevent or reduce leakage of material used to form organic encapsulation layer 420 to the outside of dam 130. Dam 130 and pixel defining layer 120 can include the same material. As an example, dam 130 can be formed simultaneously with pixel defining layer 120 using the same material as pixel defining layer 120. However, embodiments are not limited to this, and dam 130 can include a different material than pixel defining layer 120 and be formed at a different height than pixel defining layer 120. Although in Figure 7 The illustration shows a dam 130, but the embodiment is not limited to this. As an example, dam 130 may include sub-dams, and the number, height, and material of the sub-dams may be modified in various ways.

[0110] Figures 9 to 13 This is for illustrating the manufacture of a display device 1 according to an embodiment (see [reference]). Figure 1 A schematic cross-sectional view of the method. For example, Figures 9 to 13 This is a schematic cross-sectional view illustrating the process of forming the lens 500 of the display device 1. Figures 9 to 13 In the text, for ease of description, based on along Figure 6 The line C-C' intercepted Figure 6 The cross-section of display device 1 is described below, along with a method for manufacturing display device 1. In the following text, with reference to... Figures 9 to 13 When describing the method of manufacturing display device 1 according to the embodiment, because of... Figures 1 to 8 The same reference numerals in the accompanying drawings indicate the same components, so repeated descriptions are omitted.

[0111] First, such as Figure 9As shown, a substrate 100 may be provided. The substrate 100 may include a display area DA and a peripheral area PA outside the display area DA. For example, in providing the substrate 100, the substrate 100 may be in a state where display elements DPE and pixel circuits PC electrically connected to the display elements DPE are formed on the substrate 100. Multiple display elements DPE and multiple pixel circuits PC may be provided. Each of the display elements DPE may be electrically connected to a corresponding pixel circuit PC. For example, the area where the display elements DPE are disposed may be the display area DA, and the area surrounding the display area DA may be the peripheral area PA of the substrate 100. For example, a substrate 100 may be provided comprising a display area DA on which display elements DPE are disposed and a peripheral area PA outside the display area DA.

[0112] Subsequently, as Figure 10 As shown, an encapsulation layer 400 can be formed on the substrate 100. To prevent external moisture or oxygen from reaching the display element DPE on the display area DA, the encapsulation layer 400 can be formed in at least a portion of the display area DA and the peripheral area PA. Therefore, the encapsulation layer 400 can cover the display element DPE. For example, the encapsulation layer 400 can be formed on the substrate 100 to cover the display element DPE. The encapsulation layer 400 may include a first inorganic encapsulation layer 410, a second inorganic encapsulation layer 430, and an organic encapsulation layer 420 disposed between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430. For example, the first inorganic encapsulation layer 410, the organic encapsulation layer 420, and the second inorganic encapsulation layer 430 can be formed sequentially on the substrate 100.

[0113] Subsequently, as Figure 11 As shown, a height control pattern layer HCP can be formed on the peripheral region PA. For example, the height control pattern layer HCP may include a first pattern layer P1 and a second pattern layer P2. The first pattern layer P1 may be formed in the portion of the peripheral region PA adjacent to one side of the display region DA, and the second pattern layer P2 may be formed in the portion of the peripheral region PA adjacent to the back-to-back side opposite to the same side of the display region DA, with the display region DA between the first pattern layer P1 and the second pattern layer P2. For example, the height control pattern layer HCP may be formed to include a first pattern layer P1 disposed adjacent to one side of the display region DA and a second pattern layer P2 disposed adjacent to the back-to-back side opposite to the same side of the display region DA, with the display region DA between the first pattern layer P1 and the second pattern layer P2.

[0114] The height control pattern layer HCP can be configured such that its thickness increases as it moves away from the display area DA. For example, the height control pattern layer HCP can be configured such that its thickness decreases towards the display area DA. As an example, the first pattern layer P1 can be configured such that its thickness decreases towards the display area DA, and the second pattern layer P2 can be configured such that its thickness decreases towards the display area DA.

[0115] In another embodiment, the height control pattern layer HCP may include a first portion adjacent to the display area DA and a second portion less adjacent to the display area DA than the first portion, and the height control pattern layer HCP may be configured such that the thickness of the second portion is greater than the thickness of the first portion. As an example, the first pattern layer P1 may include a first-1 portion adjacent to the display area DA and a first-2 portion less adjacent to the display area DA than the first-1 portion, and the first pattern layer P1 may be configured such that the thickness of the first-2 portion is greater than the thickness of the first-1 portion. Similarly, the second pattern layer P2 may include a second-1 portion adjacent to the display area DA and a second-2 portion less adjacent to the display area DA than the second-1 portion, and the second pattern layer P2 may be configured such that the thickness of the second-2 portion is greater than the thickness of the second-1 portion.

[0116] When forming a height-controlled patterned layer (HCP) with varying thicknesses depending on location, photolithography and etching processes utilizing halftone masks can be used. In the photolithography process, either negative or positive photoresist can be used. However, the embodiments are not limited to this, and any process can be used as long as it is a process commonly used to form a layer or pattern with varying thicknesses depending on location.

[0117] Subsequently, as Figure 12 As shown, a dam layer BNK can be formed on the encapsulation layer 400. The dam layer BNK can be formed in the display area DA and the peripheral area PA. The dam layer BNK may include a dam opening OP2 that overlaps with a plurality of display elements DPE and extends in one direction. For example, as shown in a schematic plan view as part of a manufactured display device 1 according to an embodiment. Figure 14 As shown, each of the dam openings OP2 in the dam layer BNK can extend in one direction. For example, a single dam opening OP2 can overlap with multiple pixel openings OP1. For example, a single dam opening OP2 can overlap with multiple display elements DPE. For convenience, Figure 14A plan view of the second inorganic encapsulation layer 430 is shown. For ease of description, the pixel opening OP1 disposed below the second inorganic encapsulation layer 430 is also shown. For ease of description, in Figure 14 The text shows the display area DA and the surrounding area PA.

[0118] The dike opening OP2 can extend from the display area DA to the peripheral area PA. For example, the dike opening OP2 can extend from a portion of the peripheral area PA adjacent to one side of the display area DA through the display area DA to a portion of the peripheral area PA adjacent to a back-to-back side opposite to the same side. Therefore, the portion of the dike layer BNK formed in the peripheral area PA can be formed on the height control pattern layer HCP. For example, a portion of the dike opening OP2 can overlap with a portion of the height control pattern layer HCP.

[0119] Subsequently, as Figure 13 As shown, a lens 500 can be formed on the encapsulation layer 400. For example, a lens forming material P500 can be coated to fill the dam opening OP2, and ultraviolet light can be irradiated onto the lens forming material P500. Therefore, as... Figure 6 As shown, a lens 500 can be formed that overlaps with the dam opening OP2.

[0120] As an example, lens forming material P500 can be deposited on encapsulation layer 400 using an inkjet printing process. The coated lens forming material P500 can fill the dike opening OP2. For example, lens forming material P500 can be coated on encapsulation layer 400 to fill dike opening OP2.

[0121] Lens forming material P500 can be a solution manufactured by mixing an acrylic polymer and / or acrylic monomers with an organic solvent. For example, lens forming material P500 can be a solution manufactured by mixing an organic material forming lens 500 with an organic solvent through photocuring or the like. The acrylic polymer may include polymethyl methacrylate, polyacrylic acid, or polyethylene glycol dimethacrylate, and the acrylic monomer may include ethylhexyl acrylate, pentafluoropropyl acrylate, or ethylene glycol dimethacrylate. However, the embodiments are not limited thereto.

[0122] The organic solvent can be any solvent used to dissolve acrylic polymers and acrylic monomers. However, the examples are not limited thereto. As an example, the organic solvent may include at least one of propylene glycol methyl ether acetate (PGMEA), ethyl lactate, ethyl 2-methoxyacetate, propylene glycol monomethyl ether, methyl ethyl ketone, methyl isobutyl ketone, and 1-methyl-2-pyrrolidone.

[0123] The lens forming material P500 may also include a photocuring agent. The photocuring agent can be any photocuring agent used for photocuring acrylic polymers and acrylic monomers. However, the embodiments are not limited thereto. For example, the lens forming material P500 can be a solution in which the acrylic polymer and / or acrylic monomers and the photocuring agent are dissolved in an organic solvent.

[0124] The coated lens forming material P500 can be irradiated with ultraviolet light. Therefore, the coated lens forming material P500 can be photocured to form a lens 500. For example, the lens 500 can be a photocured coated lens forming material P500. For example, it has a coating strength of approximately 1,000 mJ / cm². 2 Approximately 3,000 mJ / cm 2 Ultraviolet light of sufficient intensity can irradiate the coated lens-forming material P500. For example, it has an intensity of approximately 2,000 mJ / cm². 2 Ultraviolet light of sufficient intensity can be irradiated onto the coated lens-forming material P500. Ultraviolet light with a wavelength of approximately 300 nm to approximately 400 nm can be used for photocuring. Light-emitting diodes (LEDs) or metal halides can be used as the ultraviolet source. For example, lens 500 can be formed by irradiating the coated lens-forming material P500 with ultraviolet light.

[0125] Because the embankment opening OP2 extends from the display area DA to the peripheral area PA, the lens forming material P500 can be coated throughout both the display area DA and the peripheral area PA. Therefore, the lens forming material P500 can be coated on a portion of the height-controlled pattern layer HCP. For example, the lens forming material P500 can be coated on a portion of the first pattern layer P1 and a portion of the second pattern layer P2. Thus, as... Figure 6 As shown, the two back-to-back ends of the lens 500 in the direction in which the lens 500 extends can be disposed on the height control pattern layer HCP.

[0126] Typically, when coating the lens forming material P500 and filling the dam opening OP2 to form the lens 500, the height of the lens forming material P500 filling the dam opening OP2 can decrease towards the end of the lens forming material P500. Therefore, as shown in the schematic cross-sectional view illustrating the method of manufacturing a display device according to the comparative example... Figure 15 As shown, the height of the portion of the lens forming material P500 disposed on the peripheral region PA can be different from the height of the portion of the lens forming material P500 disposed on the display region DA. For example, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens forming material P500 can decrease towards the end of the lens forming material P500.

[0127] Figure 15This illustrates a case where lens forming material P500 is coated on encapsulation layer 400 to fill dam opening OP2 in the absence of height control pattern layer HCP. For example, the length from the upper surface of encapsulation layer 400 to the upper surface of lens forming material P500 in peripheral region PA can be smaller than the length from the upper surface of encapsulation layer 400 to the upper surface of lens forming material P500 in display region DA.

[0128] Even when the lens 500 is formed of lens forming material P500, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 can decrease towards the end of the lens 500. For example, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 in the peripheral region PA can be smaller than the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 in the display region DA. Therefore, when using the lens 500 as a condenser lens, the optical characteristics of the display element DPE disposed adjacent to the peripheral region PA may deteriorate.

[0129] According to an embodiment, the lens forming material P500 filling the dam opening OP2 can be coated on a portion of the height control pattern layer HCP. Therefore, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens forming material P500 does not need to decrease towards the end of the lens forming material P500. For example, in the peripheral region PA, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens forming material P500 can be equal to or similar to the length in the display region DA.

[0130] Similarly, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 may not decrease towards the end of the lens 500. For example, the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 in the peripheral region PA may be equal to or similar to the length from the upper surface of the encapsulation layer 400 to the upper surface of the lens 500 in the display region DA. For example, the lens 500 may have a uniform height. Therefore, in the display device 1 manufactured according to the embodiment, the optical characteristics of the display element DPE disposed adjacent to the peripheral region PA may not deteriorate. For example, the display quality of the display device 1 may be improved.

[0131] According to embodiments, because the lens has a uniform height, a display device, a method for manufacturing the display device, and an electronic device with improved display quality can be achieved. However, the scope of this disclosure is not limited to the above-described effects.

[0132] It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for limiting purposes. The description of features or aspects within each embodiment should generally be taken into account for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, wherein, The display device includes: The substrate includes a display area and a peripheral area outside the display area; Multiple display elements are disposed on the display area; An encapsulation layer is disposed on the plurality of display elements; A dam layer is disposed on the encapsulation layer, and the dam layer includes an opening that overlaps with the plurality of display elements, the opening extending in one direction; A lens is disposed on the encapsulation layer and overlaps with the opening of the dam layer; and A height-controlled pattern layer is disposed on the peripheral area and between the lens and the encapsulation layer.

2. The display device according to claim 1, wherein, The lens extends from a portion of the peripheral region adjacent to one side of the display area through the display area to a portion of the peripheral region adjacent to the opposite side of the same side.

3. The display device according to claim 1, wherein, The embankment is disposed on the display area and the peripheral area, and in the plan view, the embankment surrounds the lens. The portion of the embankment layer located in the outer area is disposed on the height control pattern layer, and The end of the lens is disposed on the height control pattern layer.

4. The display device according to claim 1, wherein, The thickness of the height control pattern layer decreases as it approaches the display area, and the height control pattern layer includes: A first pattern layer is disposed adjacent to one side of the display area; and The second pattern layer is disposed adjacent to the back-to-back side opposite to the side of the same display area, wherein, A portion of the lens overlaps with a portion of the first patterned layer, and Another portion of the lens overlaps with a portion of the second patterned layer.

5. The display device according to claim 1, wherein, The encapsulation layer includes: First inorganic encapsulation layer The second inorganic encapsulation layer, and An organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

6. A method for manufacturing a display device, wherein, The method includes: A base is provided that includes a display area and a peripheral area outside the display area, and a plurality of display elements are disposed on the display area; An encapsulation layer is formed on the substrate to cover the plurality of display elements; A height-controlled pattern layer is formed on the peripheral region; A dam layer is formed on the encapsulation layer, the dam layer including openings overlapping the plurality of display elements, the openings extending in one direction; and A lens is formed on the encapsulation layer, and the lens overlaps with the opening of the dam layer.

7. The method according to claim 6, wherein, The formation of the lens includes: Applying a lens-forming material to the encapsulation layer to fill the opening; and Ultraviolet light is irradiated onto the lens forming material. The formation of the lens includes coating the display area and the peripheral area with the lens forming material.

8. The method according to claim 7, wherein, The formation of the dam layer includes forming the dam layer on the display area and the peripheral area, such that a portion of the dam layer formed on the peripheral area is formed on the height control pattern layer, and such that the opening extends from a portion of the peripheral area adjacent to one side of the display area through the display area to a portion of the peripheral area adjacent to a back-to-back side opposite to the same side, and the formation of the lens includes coating a lens forming material onto a portion of the height control pattern layer.

9. The method according to claim 7, wherein, The formation of the height-controlled pattern layer includes: A first pattern layer is formed on a portion of the peripheral region adjacent to one side of the display area; and A second pattern layer is formed on another portion of the peripheral region adjacent to the back-to-back side opposite to the same side. The formation of the height control pattern layer includes forming the height control pattern layer such that the thickness of the height control pattern layer decreases as it approaches the display area, and The formation of the lens includes coating the lens forming material onto a portion of the first pattern layer and a portion of the second pattern layer.

10. An electronic device, wherein, The electronic device includes: Display devices; and The housing, which accommodates the display device and forms the exterior of the electronic device. The display device includes: The substrate includes a display area and a peripheral area outside the display area; Multiple display elements are disposed on the display area; An encapsulation layer is disposed on the plurality of display elements; A dam layer is disposed on the encapsulation layer, and the dam layer includes an opening that overlaps with the plurality of display elements, the opening extending in one direction; A lens is disposed on the encapsulation layer and overlaps with the opening; and A height-controlled pattern layer is disposed on the peripheral area and between the lens and the encapsulation layer.

Images