Display panel and display device
By employing a design that separates organic and inorganic encapsulation layers and a hydrophobic portion in the OLED display panel, the problem of insufficient moisture resistance in the encapsulation structure is solved, thereby improving moisture resistance and extending service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HKC CORP LTD
- Filing Date
- 2026-02-13
- Publication Date
- 2026-06-16
Smart Images

Figure CN122227832A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and in particular to a display panel and a display device. Background Technology
[0002] Organic light emitting diodes (OLEDs) are widely used in some high-end display panels due to their advantages such as surface light source, cold light, energy saving, fast response, flexibility, ultra-thinness and low cost, and the increasingly mature mass production technology.
[0003] Because OLEDs are unstable and extremely sensitive to moisture, they usually require strict encapsulation in display panels. However, current encapsulation structures have weak moisture resistance, which affects the lifespan of display panels. Summary of the Invention
[0004] The main objective of this invention is to provide a display panel and display device that aims to improve the problem of weak moisture resistance in the current encapsulation structure of display panels.
[0005] To achieve the above objectives, the display panel proposed in this invention includes:
[0006] The substrate has a display area and a non-display area formed thereon; A light-emitting unit layer is disposed in the display area of the substrate; A blocking structure is disposed in the non-display area of the substrate, the blocking structure comprising two blocking portions spaced apart from each other, with a gap defined between the two blocking portions; and... An encapsulation structure is encapsulated on the substrate, the light-emitting unit layer, and the two blocking portions. An organic encapsulation layer is disposed within the encapsulation structure. The organic encapsulation layer has two parts located in the display area and the spacer space, respectively, and the two parts of the organic encapsulation layer are isolated from each other.
[0007] In one embodiment, the encapsulation structure further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, wherein the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer; The first inorganic encapsulation layer and the second inorganic encapsulation layer have a connection area that is interconnected; in the connection area, a hydrophobic portion is provided between the first inorganic encapsulation layer and the second inorganic encapsulation layer.
[0008] In one embodiment, at least one of the blocking portions is provided with the hydrophobic portion on its top.
[0009] In one embodiment, the two blocking portions include a first blocking portion located on the inner side; The first blocking portion has a hydrophobic portion at its top, and the hydrophobic portion is connected to the organic encapsulation layer.
[0010] In one embodiment, the two blocking portions further include a second blocking portion located on the outer side, and the top of the first blocking portion and the second blocking portion are respectively provided with the hydrophobic portion; Wherein, the height of the hydrophobic portion corresponding to the first blocking portion from the substrate is H1, and the height of the hydrophobic portion corresponding to the second blocking portion from the substrate is H2, and 1 / 3≤H2 / H1≤1 / 2.
[0011] In one embodiment, the hydrophobic portion is provided in a raised position on the side opposite to the substrate.
[0012] In one embodiment, a raised surface is formed on the top of the blocking portion; The first inorganic encapsulation layer and the hydrophobic portion sequentially cover the raised surface, such that the hydrophobic portion is raised on the side away from the substrate.
[0013] In one embodiment, the first inorganic encapsulation layer is encapsulated on the substrate, the light-emitting unit layer, and the two blocking portions, and the surface of the first inorganic encapsulation layer in the connection area has a plurality of arrayed protrusion structures. The hydrophobic portion includes a micro / nano crystal array deposited on the surface of the protruding structure.
[0014] In one embodiment, the hydrophobic portion further includes a metal-insulator-metal heterogeneous resonator deposited on the surface of the micro / nano crystal array.
[0015] To achieve the above objectives, the display device proposed in this invention includes the aforementioned display panel.
[0016] In the technical solution provided by this invention, the organic encapsulation layer inside the encapsulation structure is divided into two mutually isolated parts. The two organic encapsulation layers can be processed and formed simultaneously, and are respectively located in the space between the two parts and the display area. The organic encapsulation layer in the display area can play a buffering role. Since the organic encapsulation layer has strong water absorption and water storage characteristics, the organic encapsulation layer in the space between the two parts can absorb and store externally intruded water vapor, which reduces the degree of water vapor diffusion to the light-emitting unit layer, enhances the water vapor resistance of the display panel, and extends the encapsulation life of the encapsulation structure. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0018] Figure 1 A top view of the display panel provided by the present invention; Figure 2 A cross-sectional structural diagram of the display panel provided by the present invention; Figure 3 for Figure 2 A partially enlarged structural diagram of the first inorganic encapsulation layer and the blocking part; Figure 4 for Figure 3 A magnified schematic diagram of the central protrusion structure and the hydrophobic part.
[0019] Explanation of icon numbers: 100. Display panel; 1. Substrate; 1a. Display area; 1b. Non-display area; 2. Light-emitting unit layer; 3. Blocking structure; 3a. Spacing; 31. Blocking part; 31a. Protruding surface; 311. First blocking part; 312. Second blocking part; 4. Encapsulation structure; 41. Organic encapsulation layer; 41a. First part; 41b. Second part; 42. First inorganic encapsulation layer; 421. Protrusion structure; 43. Second inorganic encapsulation layer; 5. Liquid-repellent section; 51. Micro / nano crystal array; 52. Metal-insulator-metal heterogeneous resonator; 521. Bottom metal layer; 522. Middle insulator layer; 523. Top metal layer.
[0020] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0021] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the invention, are intended to cover non-exclusive inclusion.
[0023] In the description of the embodiments of this invention, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this invention, "multiple" means two or more, unless otherwise explicitly defined.
[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0025] In the description of the embodiments of the present invention, the term "multiple" refers to two or more (including two), similarly, "multiple groups" refers to two or more (including two groups), and "multiple pieces" refers to two or more (including two pieces).
[0026] In the description of the embodiments of the present invention, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.
[0027] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.
[0028] Organic light-emitting diodes (OLEDs) are widely used in high-end display panels due to their advantages such as surface light source, cold light, energy saving, fast response, flexibility, ultra-thinness, and low cost, as well as increasingly mature mass production technology. However, because OLEDs are unstable and extremely sensitive to moisture, they typically require rigorous encapsulation in display panels. Currently, however, the moisture resistance of encapsulation structures is relatively weak, affecting the lifespan of the display panels.
[0029] The reason for this is that the organic encapsulation layer of the packaging structure is generally prepared by inkjet printing. Since there are gaps between the printheads of inkjet printers, after inkjet printing, the ink of the organic encapsulation layer is generally spread evenly on the display area of the device to form a covering encapsulation through static leveling. With the help of a barrier structure surrounding the display area of the device, the barrier structure can prevent the ink from overflowing during the static leveling process of the organic encapsulation layer ink. Current barrier structures usually include multiple mutually spaced barrier parts. During the static leveling process, the ink of the organic encapsulation layer flows into the space between two adjacent barrier parts and forms a continuous film layer with the display area. This creates a continuous water vapor movement path from the outside to the inside (the organic encapsulation layer has strong water absorption characteristics), which directly weakens the lifespan of the OLED in the display area.
[0030] In view of this, the present invention provides a display panel and a display device, aiming to improve the problem of weak moisture resistance in the encapsulation structure of current display panels. To facilitate understanding of the display panel provided by the present invention, the following description is provided in conjunction with the accompanying drawings, wherein... Figure 1 A top view of the display panel provided by the present invention; Figure 2 A cross-sectional structural diagram of the display panel provided by the present invention; Figure 3 for Figure 2 A partially enlarged structural diagram of the first inorganic encapsulation layer and the blocking part; Figure 4 for Figure 3 A magnified schematic diagram of the central protrusion structure and the hydrophobic part.
[0031] Please see Figure 1 and Figure 2In one embodiment of the present invention, the display panel 100 includes a substrate 1, a light-emitting unit layer 2, a blocking structure 3, and an encapsulation structure 4; the substrate 1 forms a display area 1a and a non-display area 1b; the light-emitting unit layer 2 is disposed in the display area 1a of the substrate 1; the blocking structure 3 is disposed in the non-display area 1b of the substrate 1, and the blocking structure 3 includes two blocking portions 31 spaced apart from each other, with a space 3a defined between the two blocking portions 31; the encapsulation structure 4 is encapsulated on the substrate 1, the light-emitting unit layer 2, and the two blocking portions 31, and an organic encapsulation layer 41 is disposed within the encapsulation structure 4, the organic encapsulation layer 41 having two parts respectively located in the display area 1a and the space 3a, and the two parts of the organic encapsulation layer 41 are isolated from each other.
[0032] like Figure 1 As shown, the "non-display area 1b" is usually set around the "display area 1a". The display area 1a is used to set the light-emitting unit layer 2. The specific structure of the light-emitting unit layer 2 is not limited in this embodiment of the invention, but the light-emitting unit layer 2 is more sensitive to moisture and needs to be encapsulated for protection. "The blocking structure 3 is set in the non-display area 1b of the substrate 1" can be understood as the blocking structure 3 being set around the display area 1a and having two blocking parts 31 spaced apart. The inner blocking part 31 is set closer to the display area 1a, and the outer blocking part 31 is set away from the display area 1a. The space 3a is located between the two blocking parts 31 and is usually also set around the display area 1a.
[0033] Regarding the phrase "an organic encapsulation layer 41 is provided within the encapsulation structure 4," it can be understood that an inorganic encapsulation structure 4 is encapsulated and wrapped around the outside of the organic encapsulation layer 41. This inorganic encapsulation structure 4 typically includes a first inorganic encapsulation layer 42 disposed near the substrate 1 and a second inorganic encapsulation layer 43 disposed away from the substrate 1. The phrase "the encapsulation structure 4 is encapsulated on the substrate 1, the light-emitting unit layer 2, and the two blocking portions 31" also refers to the first inorganic encapsulation layer 42 being encapsulated on the substrate 1, the light-emitting unit layer 2, and the two blocking portions 31. Considering that "the organic encapsulation layer 41 has two parts respectively located in the display area 1a and the spacing space 3a," for ease of understanding, please refer to [link to relevant documentation]. Figure 2 The organic encapsulation layer 41 located in the display area 1a is defined as the first part 41a, and the organic encapsulation layer 41 located in the space 3a is defined as the second part 41b. The first part 41a and the second part 41b of the organic encapsulation layer 41 are isolated by an inorganic encapsulation layer.
[0034] In the technical solution provided by the present invention, the organic encapsulation layer 41 inside the encapsulation structure 4 is divided into two mutually isolated parts. The two organic encapsulation layers 41 can be processed and formed simultaneously, and are respectively located in the space 3a and the display area 1a. The organic encapsulation layer 41 located in the display area 1a can play a buffering role. Since the organic encapsulation layer 41 has strong water absorption and water storage characteristics, the organic encapsulation layer 41 located in the space 3a can absorb and store externally intruded water vapor, alleviate the degree of water vapor diffusion to the light-emitting unit layer 2, enhance the water vapor resistance of the display panel 100, and extend the encapsulation life of the encapsulation structure 4.
[0035] Please see Figure 2 In one embodiment, the encapsulation structure 4 further includes a first inorganic encapsulation layer 42 and a second inorganic encapsulation layer 43, and the organic encapsulation layer 41 is disposed between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43; the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 have interconnected connection areas; in the connection areas, a hydrophobic portion 5 is disposed between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43.
[0036] The first inorganic encapsulation layer 42 is typically made of silicon oxynitride, with a thickness usually between 1 and 2 μm. The second inorganic encapsulation layer 43 is typically made of silicon nitride, with a thickness usually around 2 μm. The organic encapsulation layer 41 is typically made of acrylic or resin, with a thickness usually between 10 and 30 μm. In terms of fabrication methods, the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 are typically fabricated using vacuum deposition, while the organic encapsulation layer 41 is fabricated using inkjet printing.
[0037] "The first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 have interconnected connection areas." The connection areas include two parts corresponding to the two blocking parts 31 respectively. The connection area corresponding to the outer blocking part 31 can encapsulate and wrap the organic encapsulation layer 41, while the connection area corresponding to the inner blocking part 31 can isolate the two parts of the organic encapsulation layer 41.
[0038] according to Figure 2 It can be seen that the connection area between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 can be located at the top of the blocking part 31 or at the side of the blocking part 31. The hydrophobic part 5 can be provided only at the side or top of the blocking part 31, or the hydrophobic part 5 can be provided at both the side and top of the blocking part 31.
[0039] In the above technical solution, a hydrophobic portion 5 is provided in the connection area between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43. The hydrophobic portion 5, by virtue of its superhydrophobic properties, can delay the diffusion process of water vapor in the connection area, thereby further enhancing the water vapor resistance of the display panel 100.
[0040] In one embodiment, at least one of the blocking portions 31 is provided with the hydrophobic portion 5 on its top.
[0041] "The top of the barrier 31 is provided with the hydrophobic portion 5" means that a hydrophobic portion 5 is provided between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 in the connection area corresponding to the top of the barrier 31. Considering the processing sequence of the encapsulation structure 4, the hydrophobic portion 5 is usually first provided on the surface of the first inorganic encapsulation layer 42, and then the second inorganic encapsulation layer 43 covers the first inorganic encapsulation layer 42 and the hydrophobic portion 5.
[0042] In the above technical solution, a hydrophobic part 5 is provided on the top of at least one of the blocking parts 31. With the hydrophobic properties of the hydrophobic part 5, when the organic encapsulation layer 41 is prepared by inkjet printing, the ink can spontaneously roll off to the inside and outside of the hydrophobic part 5, reducing the possibility of ink residue on the top of the blocking part 31, that is, reducing the possibility of forming a water vapor transmission path on the top of the blocking part 31, and improving the encapsulation reliability of the encapsulation structure 4.
[0043] Please see Figure 2 In one embodiment, the two blocking portions 31 include a first blocking portion 311 located on the inner side; wherein the top of the first blocking portion 311 is provided with the hydrophobic portion 5, and the hydrophobic portion 5 is connected to the organic encapsulation layer 41.
[0044] In this embodiment, "organic encapsulation layer 41" refers to the first part 41a located in the display area 1a.
[0045] Based on the statement that "the blocking structure 3 is disposed in the non-display area 1b of the substrate 1" and "a gap space 3a is defined between the two blocking portions 31", it can be determined that the display area 1a is located inside the first blocking portion 311, and the gap space 3a is located outside the first blocking portion 311. Based on this, a hydrophobic portion 5 is provided on the top of the first blocking portion 311. When the organic encapsulation layer 41 is prepared by inkjet printing, the ink can spontaneously roll down to the inside and outside of the hydrophobic portion 5, thereby reaching the display area 1a and the gap space 3a respectively. After the inkjet printing of the organic encapsulation layer 41 is completed, the organic encapsulation layer 41 can spontaneously form two parts isolated by the first blocking portion 311, which simplifies the process of forming two mutually isolated organic encapsulation layers 41.
[0046] Furthermore, a hydrophobic portion 5 is provided on the top of the first blocking portion 311. Based on the hydrophobic properties of this hydrophobic portion 5, the hydrophobic portion 5 can directly contact the organic encapsulation layer 41 located in the display area 1a, which significantly reduces the height requirement of the first blocking portion 311, thereby reducing the overall cell thickness of the display panel 100. When the first inorganic encapsulation layer 42 is prepared above the first blocking portion 311, the climbing height difference of the first inorganic encapsulation layer 42 is significantly reduced, which effectively reduces the probability of film layer climbing causing breakage and ensures the encapsulation reliability of the encapsulation structure 4.
[0047] Please continue reading. Figure 2 In one embodiment, the two blocking portions 31 further include a second blocking portion 312 located on the outer side, and the top of the first blocking portion 311 and the second blocking portion 312 are respectively provided with the hydrophobic portion 5; wherein, the height of the hydrophobic portion 5 corresponding to the first blocking portion 311 from the substrate 1 is H1, and the height of the hydrophobic portion 5 corresponding to the second blocking portion 312 from the substrate 1 is H2, and 1 / 3≤H2 / H1≤1 / 2.
[0048] according to Figure 2 As indicated by the label, "the height of the hydrophobic portion 5 corresponding to the barrier portion 31" refers to the height of the barrier dam formed by the barrier portion 31, the portion of the first inorganic encapsulation layer 42 corresponding to the top of the barrier portion 31, and the hydrophobic portion 5 from the substrate 1. The thickness of the "hydrophobic portion 5" can be between 1000 and 2000 angstroms, and the thickness of the "first inorganic encapsulation layer 42" can be between 2000 and 3000 angstroms.
[0049] In the above technical solution, a hydrophobic portion 5 is also provided on the top of the second blocking portion 312. Based on the same principle, when the organic encapsulation layer 41 is prepared by inkjet printing, the ink can spontaneously roll off to the inside and outside of the hydrophobic portion 5 on the top of the second blocking portion 312, thereby reducing the possibility of ink residue on the top of the second blocking portion 312, and thus reducing the possibility of forming a water vapor transport path on the top of the second blocking portion 312. Furthermore, the hydrophobic portion 5 on the top of the second blocking portion 312 also significantly reduces the height requirement of the second blocking portion 312, thereby reducing the edge thickness of the display panel 100.
[0050] In one embodiment, the hydrophobic portion 5 is provided in a raised position on the side opposite to the substrate 1.
[0051] There are various ways to "the liquid-repellent portion 5 is raised on the side away from the substrate 1". For example, nanoimprint lithography or wet etching technology can be used to process the flat liquid-repellent portion 5 into a raised shape. This embodiment does not limit this. At the same time, since the blocking portion 31 is arranged around the light-emitting unit layer 2 and is a surrounding structure, the liquid-repellent portion 5 should also have annular inclined surfaces facing the inner and outer sides respectively.
[0052] In the above technical solution, based on the protruding shape of the hydrophobic part 5, when the organic encapsulation layer 41 is prepared by inkjet printing, the contact angle between the ink and the hydrophobic part 5 is further reduced. The hydrophobic part 5 can also guide the ink to roll inward and outward respectively, further reducing the possibility of ink residue on the surface of the hydrophobic part 5, that is, reducing the possibility of forming a water vapor transmission path on the top of the blocking part 31.
[0053] In one embodiment, a raised surface 31a is formed on the top of the blocking portion 31; the first inorganic encapsulation layer 42 and the hydrophobic portion 5 sequentially cover the raised surface 31a, so that the hydrophobic portion 5 is raised on the side away from the substrate 1.
[0054] In the above technical solution, a raised surface 31a is formed on the top of the blocking part 31. When the first inorganic encapsulation layer 42 is prepared by vacuum deposition, the area of the first inorganic encapsulation layer 42 corresponding to the raised surface 31a of the blocking part 31 can spontaneously form a protrusion. On this basis, a liquid-repellent part 5 is provided. The side of the liquid-repellent part 5 away from the substrate 1 can also spontaneously form a protrusion, which simplifies the molding process of the liquid-repellent part 5.
[0055] Please see Figure 2 and Figure 3 In one embodiment, the first inorganic encapsulation layer 42 is encapsulated on the substrate 1, the light-emitting unit layer 2 and the two blocking portions 31. The first inorganic encapsulation layer 42 has a plurality of arrayed protrusions 421 formed on the surface of the connection area. The hydrophobic portion 5 includes a micro-nano crystal array 51 deposited on the surface of the protrusions 421.
[0056] The specific operation of depositing the micro / nano crystal array 51 on the surface of the protrusion structure 421 is as follows: using nanoimprint lithography or wet etching technology, a neatly arranged and uniformly distributed micron-scale protrusion structure 421 is prepared on the first inorganic encapsulation layer 42. Then, using the protrusion structure 421 as a basic module, an aluminum layer is deposited on the protrusion structure 421 using magnetron sputtering technology. During this process, due to the combined effect of atomic shadowing effect and curvature of the protrusion structure 421, aluminum atoms spontaneously grow into a columnar crystal array with a rich nanoscale wrinkled surface. Since more aluminum particles are deposited on the top of the protrusion structure 421, a rougher columnar crystal can be formed, thereby constructing a structured micro / nano crystal array 51.
[0057] In the above technical solution, a micro-nano crystal array 51 is deposited on the surface of the protrusion structure 421. With the help of the rich nanoscale wrinkled surface of the micro-nano crystal array 51, the contact area with the liquid can be minimized, thereby improving hydrophobicity from the physical structure level. Moreover, the rough surface of the liquid-repellent part 5 is also conducive to increasing the contact area between the second inorganic encapsulation layer 43 and it, increasing the adhesion between the film layers, and improving the encapsulation stability.
[0058] Further, please refer to Figure 4 The hydrophobic portion 5 further includes a metal-insulator-metal heterogeneous resonator 52 deposited on the surface of the micro / nano crystal array 51.
[0059] "Metal-Insulator-Metal" refers to the top metal layer 523, the middle insulating layer 522, and the bottom metal layer 521 covering the micro / nano crystal array 51, such as... Figure 4 As shown, it can specifically be a Ti@PTFE-SiO2-Ti three-layer structure. Combining the above specific operation method, a photothermal superhydrophobic modification is achieved by sputtering and depositing a Ti@PTFE-SiO2-Ti three-layer MIM structure. Under the influence of the wrinkled surface of the aluminum columnar crystal, the MIM structure spontaneously forms heterogeneous resonators. These resonators vary in size, angle, and thickness, providing more electromagnetic wave response sites and scattering surfaces. This transforms the discrete absorption sites in the uniform MIM structure into continuous absorption bands, thereby achieving a solar spectral absorptivity of up to 96%. The top Ti@PTFE layer employs a gradient composition design, with the titanium content decreasing from the bottom to the top. Only hydrophobic and anti-reflective PTFE (polytetrafluoroethylene) is retained at the top, balancing hydrophobicity and photothermal capabilities.
[0060] In the above technical solution, a metal-insulator-metal heterogeneous resonator 52 is deposited on the surface of the micro-nano crystal array 51 to achieve a high solar spectrum absorption rate, thereby giving the hydrophobic part 5 the ability to absorb light and generate heat. When the organic encapsulation layer 41 is prepared by inkjet printing, external light source irradiation can cause the hydrophobic part 5 to generate heat energy, which is used to heat the ink of the encapsulation layer, thereby improving the evaporation efficiency of the solvent in the ink, which in turn improves the production efficiency of the display panel 100.
[0061] In a specific embodiment of the present invention, the display panel 100 includes a substrate 1, a light-emitting unit layer 2, a blocking structure 3, and an encapsulation structure 4; the substrate 1 forms a display area 1a and a non-display area 1b; the light-emitting unit layer 2 is disposed in the display area 1a of the substrate 1; the blocking structure 3 is disposed in the non-display area 1b of the substrate 1, and the blocking structure 3 includes two blocking portions 31 spaced apart, with a space 3a defined between the two blocking portions 31; the two blocking portions 31 include a first blocking portion 311 on the inner side and a second blocking portion 312 on the outer side; the encapsulation structure 4 includes a first inorganic encapsulation layer 42, an organic encapsulation layer 41, and a second inorganic encapsulation layer 43; the first inorganic encapsulation layer 42 is encapsulated on the substrate 1, the light-emitting unit layer 2, and the two blocking portions 31; the organic encapsulation layer 41 is disposed between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43; the organic encapsulation layer 41 has two parts respectively located in the display area 1a and the space 3a, and the two parts of the organic encapsulation layer 41 are isolated from each other; the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43 are... The substrate has interconnected connection areas. At the top positions of the first blocking portion 311 and the second blocking portion 312, a hydrophobic portion 5 is provided between the first inorganic encapsulation layer 42 and the second inorganic encapsulation layer 43. The hydrophobic portion 5 corresponding to the first blocking portion 311 is at a height H1 from the substrate 1, and the hydrophobic portion 5 corresponding to the second blocking portion 312 is at a height H2 from the substrate 1, where 1 / 3 ≤ H2 / H1 ≤ 1 / 2. The hydrophobic portion 5 located at the top of the first blocking portion 311 connects to the first organic encapsulation layer. Layer 41 is provided, and the surface of the first inorganic encapsulation layer 42 in the connection area is formed with a plurality of arrayed protrusions 421. The liquid-repellent part 5 includes a micro-nano crystal array 51 deposited on the surface of the protrusions 421. The liquid-repellent part 5 also includes a metal-insulator-metal heterogeneous resonator 52 deposited on the surface of the micro-nano crystal array 51. A protruding surface 31a is formed on the top of the blocking part 31. The first inorganic encapsulation layer 42 and the liquid-repellent part 5 sequentially cover the protruding surface 31a, so that the side of the liquid-repellent part 5 away from the substrate 1 is protruding.
[0062] The present invention also proposes a display device, which includes a display panel 100. It should be noted that the specific structure of the display panel 100 refers to the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A display panel, characterized in that, include: The substrate has a display area and a non-display area formed thereon; A light-emitting unit layer is disposed in the display area of the substrate; A blocking structure is disposed in the non-display area of the substrate, the blocking structure comprising two blocking portions spaced apart from each other, with a space defined between the two blocking portions; as well as, An encapsulation structure is encapsulated on the substrate, the light-emitting unit layer, and the two blocking portions. An organic encapsulation layer is disposed within the encapsulation structure. The organic encapsulation layer has two parts located in the display area and the spacer space, respectively, and the two parts of the organic encapsulation layer are isolated from each other.
2. The display panel as described in claim 1, characterized in that, The encapsulation structure further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, wherein the organic encapsulation layer is disposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer; The first inorganic encapsulation layer and the second inorganic encapsulation layer have a connection area that is interconnected; in the connection area, a hydrophobic portion is provided between the first inorganic encapsulation layer and the second inorganic encapsulation layer.
3. The display panel as described in claim 2, characterized in that, At least one of the blocking portions has the hydrophobic portion provided on its top.
4. The display panel as described in claim 3, characterized in that, The two blocking portions include a first blocking portion located on the inner side; The first blocking portion has a hydrophobic portion at its top, and the hydrophobic portion is connected to the organic encapsulation layer.
5. The display panel as described in claim 4, characterized in that, The two blocking portions also include a second blocking portion on the outer side, and the top of the first blocking portion and the second blocking portion are respectively provided with the liquid-repellent portion; Wherein, the height of the hydrophobic portion corresponding to the first blocking portion from the substrate is H1, and the height of the hydrophobic portion corresponding to the second blocking portion from the substrate is H2, and 1 / 3≤H2 / H1≤1 / 2.
6. The display panel as described in claim 3, characterized in that, The hydrophobic portion is convex on the side opposite to the substrate.
7. The display panel as described in claim 6, characterized in that, The top of the blocking part has a raised surface; The first inorganic encapsulation layer and the hydrophobic portion sequentially cover the raised surface, such that the hydrophobic portion is raised on the side away from the substrate.
8. The display panel as described in any one of claims 2 to 7, characterized in that, The first inorganic encapsulation layer is encapsulated on the substrate, the light-emitting unit layer and the two blocking portions, and the first inorganic encapsulation layer has a plurality of arrayed protrusion structures formed on the surface of the connection area. The hydrophobic portion includes a micro / nano crystal array deposited on the surface of the protruding structure.
9. The display panel as described in claim 8, characterized in that, The hydrophobic portion also includes a metal-insulator-metal heterogeneous resonator deposited on the surface of the micro / nano crystal array.
10. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 9.