Semiconductor wafer etching apparatus

Abstract

The application provides a semiconductor wafer etching device and relates to the technical field of wafer etching.The semiconductor wafer etching device comprises a frame assembly, a lifting assembly, a protective cover, a driving assembly, a fixing assembly, a liquid spraying assembly, an airflow assembly and a suction assembly.The frame assembly is used for providing a supporting force.The lifting assembly is used for providing a lifting function.The protective cover is arranged on a lifting component of the lifting assembly, and an inner bottom surface of the protective cover is provided with a blocking inclined surface.The driving assembly is arranged on the frame assembly and is used for providing rotary power.The fixing assembly is arranged on a rotary component of the driving assembly and is used for fixing a wafer product.The liquid spraying assembly is arranged directly below the fixing assembly and is used for circumferentially spraying etching solution.Through the liquid spraying assembly and the airflow assembly, the etching solution can be controlled to contact or not to contact the wafer product by cooperation of the airflow assembly and the liquid spraying assembly, the etching depth is conveniently controlled, and the product failure rate is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer etching technology, specifically to a semiconductor wafer etching apparatus. Background Technology

[0002] Semiconductor wafer etching includes dry etching and wet etching. Wet etching is a chemical reaction process that uses the chemical reaction between a solution and the pre-etching material to remove the parts that are not covered by the masking film material, thereby achieving the etching purpose.

[0003] In related technologies, such as the monolithic wafer semiconductor etching apparatus and etching method disclosed in CN117542758A, the apparatus includes: an outer cover mounted on a platform, with an etching cavity formed inside the outer cover; a support portion mounted inside the etching cavity, with a rotating component rotatably mounted on the support portion, the top of which is used to clamp the wafer to be etched; a solution delivery device mounted above the rotating component; an annular vent on the top surface of the support portion, which can provide inert gas at a set pressure to the gap formed between the support portion and the wafer to be etched; and an exhaust port connected to a suction device on one side of the outer cover.

[0004] When using chemical etching solutions, the chemical solution falls onto the surface of the wafer. Due to gravity, it will continuously contact and corrode the wafer. If the etching time is too long, uneven defects will appear on the wafer surface, increasing the difficulty of subsequent processes and making it impossible to accurately control the etching quality. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a semiconductor wafer etching apparatus that solves the problems of inaccurate control of etching depth and high process difficulty.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor wafer etching apparatus, comprising: A frame assembly for providing support; A lifting assembly, wherein the lifting assembly is used to provide a lifting function; A protective cover is provided on the lifting component of the lifting assembly, and the inner bottom surface of the protective cover is provided with a blocking slope. A drive assembly, which is mounted on the frame assembly, is used to provide rotational power; A fixing component, which is disposed on the rotating part of the driving component, is used to fix the wafer product; A spraying assembly, located directly below the fixed assembly, is used to spray an etching solution circumferentially. An airflow assembly, located outside the liquid spraying assembly, is used to generate a vertically upward airflow with controllable pressure. A suction assembly, located on the upper part of the frame assembly, is used for suctioning gas. Through the arrangement of a liquid spraying assembly and an airflow assembly, the interaction between the airflow assembly and the liquid spraying assembly allows for control over whether the etching solution contacts the wafer product, facilitating control over the etching depth and reducing product defect rates. Through the arrangement of a driving assembly, a fixing assembly, and an airflow assembly, the wafer product is subjected to the negative pressure adsorption force of the fixing assembly and the supporting force of the airflow, ensuring the stability of the wafer product and improving etching quality.

[0007] Preferably, the frame assembly includes an upper plate, a support leg is fixedly connected to the lower part of the upper plate, and a mounting bracket is fixedly connected to the upper plate.

[0008] Preferably, the lifting assembly includes an electric push rod fixedly installed on the upper plate, and the output end of the electric push rod is fixedly connected to the lifting plate.

[0009] Preferably, the drive assembly includes a drive motor fixedly mounted on a mounting bracket, the output end of the drive motor is fixedly connected to a drive pulley, a driven pulley is provided on the outer side of the drive pulley, and a synchronous belt is provided between the drive pulley and the driven pulley.

[0010] Preferably, the fixing component includes a hollow shaft rotatably mounted on the upper plate, the upper part of the hollow shaft being interconnected with an external vacuum device via a rotary joint, and a vacuum suction cup being fixedly connected to the lower end of the hollow shaft; the upper part of the hollow shaft is fixedly connected to a driven pulley.

[0011] Preferably, the liquid spraying assembly includes a liquid inlet pipe, the upper end of which is fixedly connected to a liquid outlet component. The liquid inlet pipe is interconnected with an external etching solution source. The liquid outlet component includes a lower pipe fixedly installed at the upper end of the liquid inlet pipe. The upper part of the lower pipe is fixedly connected to a liquid outlet shell. The upper circumference of the liquid outlet shell is uniformly provided with oblique holes, and the upper center of the liquid outlet shell is provided with a top hole. The center of the liquid outlet component corresponds to the center of the vacuum suction cup.

[0012] Preferably, the airflow assembly includes an air inlet pipe, an air outlet is fixedly connected to the upper part of the air inlet pipe, and air outlet holes are uniformly provided on the upper surface of the air outlet; the air outlet is located outside the liquid outlet; the air inlet pipe is interconnected with an external inert air pressure source with a preset air pressure value.

[0013] Preferably, the suction assembly includes a suction tube, which is connected to an external air extraction device, and a pressure sensor is installed inside the protective cover.

[0014] This invention provides a semiconductor wafer etching apparatus. It has the following advantages: 1. The present invention, through the setting of the liquid spraying component and the airflow component, utilizes the cooperation between the airflow component and the liquid spraying component to control whether the etching solution contacts the wafer product, which facilitates the control of etching depth and reduces product defect rate.

[0015] 2. Through the driving component, fixing component, and airflow component, the present invention enables the wafer product to be subjected to the negative pressure adsorption force of the fixing component and the support force of the airflow, which can ensure the stability of the wafer product and improve the etching quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall internal structure of the present invention; Figure 3 This is a cross-sectional structural schematic diagram of the protective cover portion of the present invention; Figure 4 This is a schematic diagram of the liquid outlet component of the present invention.

[0017] Among them, 101, upper plate; 102, support leg; 103, mounting bracket; 201, electric push rod; 202, lifting plate; 203, protective cover; 2031, blocking slope; 301, drive motor; 302, driving pulley; 303, driven pulley; 304, hollow shaft; 305, rotary joint; 306, synchronous belt; 4, suction tube; 5, air pressure sensor; 601, liquid inlet tube; 602, liquid outlet; 701, air inlet tube; 702, air outlet; 703, air outlet hole; 10, vacuum suction cup; 6021, lower tube; 6022, liquid outlet shell; 6023, oblique hole; 6024, top hole; 9, wafer product. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] like Figures 1-4 As shown, an embodiment of the present invention provides a semiconductor wafer etching apparatus, comprising: refer to Figure 1 The frame assembly provides support; the frame assembly includes an upper plate 101, a support leg 102 is fixedly connected to the lower part of the upper plate 101, and a mounting bracket 103 is fixedly connected to the upper plate 101. The number of support legs 102 can be four, and the upper plate 101 provides installation space and stable support for other components.

[0020] refer to Figure 1 , Figure 2 The lifting assembly provides a lifting function; the lifting assembly includes an electric push rod 201 fixedly installed on the upper plate 101, and the output end of the electric push rod 201 is fixedly connected to the lifting plate 202. There are four electric push rods 201. The electric push rods 201 work under the action of an external power supply and controller. Through their telescopic ends, they can drive the lifting plate 202 to rise or fall. When the lifting plate 202 rises, it can drive the protective cover 203 to come into contact with the upper plate 101 to form a sealed etching cavity.

[0021] refer to Figure 1 , Figure 2 Protective cover 203 is provided on the lifting component of the lifting assembly, and the inner bottom surface of the protective cover 203 is provided with a blocking slope 2031. The protective cover 203 can be a circular cover, which can provide a space for the etching solution and inert gas; the blocking slope 2031 is high in the middle and low on the outer ring, which can prevent the etching solution from accumulating at the center of the protective cover 203 and avoid the etching solution from damaging the components in the middle.

[0022] refer to Figure 1 , Figure 2 The drive assembly is mounted on the frame assembly and is used to provide rotational power. The drive assembly includes a drive motor 301 fixedly mounted on the mounting frame 103. The output end of the drive motor 301 is fixedly connected to a drive pulley 302. A driven pulley 303 is provided on the outer side of the drive pulley 302. A synchronous belt 306 is provided between the drive pulley 302 and the driven pulley 303. During operation, the drive motor 301 works under the control of the external power supply and controller, driving the drive pulley 302 to rotate. The drive pulley 302 drives the driven pulley 303 to rotate through the synchronous belt 306, thereby providing rotational power.

[0023] refer to Figure 2 A fixing component is provided on the rotating part of the drive component and is used to fix the wafer product 9. The fixing component includes a hollow shaft 304 rotatably mounted on the upper plate 101. The upper part of the hollow shaft 304 is connected to an external vacuum device through a rotary joint 305. A vacuum chuck 10 is fixedly connected to the lower end of the hollow shaft 304. The upper part of the hollow shaft 304 is fixedly connected to the driven pulley 303. During the fixing operation, the external vacuum device forms a negative pressure adsorption force on the lower surface of the vacuum chuck 10 through the rotary joint 305, which can adsorb the wafer product 9 and complete the fixing operation of the product; at the same time, driven by the driven pulley 303, the hollow shaft 304 can be driven to rotate, thereby driving the wafer product 9 to rotate.

[0024] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 The spraying assembly is located directly below the fixed assembly and is used to spray etching solution circumferentially. The spraying assembly includes an inlet pipe 601, the upper end of which is fixedly connected to an outlet component 602. The inlet pipe 601 is interconnected with an external etching solution source. The outlet component 602 includes a lower pipe 6021 fixedly installed at the upper end of the inlet pipe 601. An outlet shell 6022 is fixedly connected to the upper part of the lower pipe 6021. The upper part of the outlet shell 6022 is uniformly provided with oblique holes 6023, and a top hole 6024 is provided at the center of the upper part of the outlet shell 6022. The outlet component 602 corresponds to the center of the vacuum chuck 10. During the spraying operation, the external etching chemical solution source is injected into the outlet component 602 through the inlet pipe 601. The etching chemical solution enters the outlet shell 6022 through the lower pipe 6021 and is then sprayed out through the oblique hole 6023 and the top hole 6024. The top hole 6024 is used to etch the center of the wafer product 9. The oblique hole 6023 is used to generate a radial etching solution flow from the center to the outside of the wafer product 9. Under the centrifugal force generated by the rotation of the wafer product 9, the etching solution can be thrown out evenly and stably. Due to the effect of gravity, the etching solution that leaves the wafer product 9 will be thrown out in a parabolic trajectory. Therefore, it will not affect other non-etched surfaces of the wafer product 9.

[0025] refer to Figure 1 , Figure 2 An airflow assembly is located outside the liquid spraying assembly and is used to generate a vertically upward airflow with controllable air pressure. The airflow assembly includes an air inlet pipe 701, an air outlet 702 is fixedly connected to the upper part of the air inlet pipe 701, and air outlet holes 703 are evenly provided on the upper surface of the air outlet 702. The air outlet 702 is located outside the liquid outlet 602, and the air inlet pipe 701 is connected to an external inert air pressure source with a preset air pressure value. During airflow operation, an external inert gas source provides a stable and continuous inert gas to the outlet component 702 through the inlet pipe 701 at a preset pressure value, and then blows it vertically upward from the outlet port 703. In order to control the pressure value, a pressure regulator, a pressure gauge, or a control valve component can be selected to control the pressure value. When the supporting force provided by the air pressure is greater than the gravity of the etching solution, the etching solution adheres tightly to the wafer product 9. When the supporting force provided by the air pressure is less than the gravity of the etching solution, the etching solution will be ejected in a parabolic trajectory.

[0026] refer to Figure 2 The suction assembly is located on the upper part of the frame assembly and is used for suctioning gas. The suction assembly includes a suction pipe 4, which is connected to an external suction device. A pressure sensor 5 is installed inside the protective cover 203. During the suction operation, the external suction device works under the action of the external power supply and controller, and sucks the chemical gas inside the protective cover 203 through the suction pipe 4 to ensure that the wafer product 9 is not corroded by the chemical gas; among them, the pressure sensor 5 can detect the pressure value inside the protective cover 203 to ensure the stability of the inert gas pressure value.

[0027] Working principle: The electric push rod 201 works, and its telescopic end can drive the lifting plate 202 to descend, providing space for the wafer product 9 to be placed; The wafer product 9 is placed on the lower surface of the vacuum chuck 10. The external vacuum device forms a negative pressure adsorption force on the lower surface of the vacuum chuck 10 through the rotary joint 305, which can adsorb the wafer product 9 and complete the product fixation operation. Then the electric push rod 201 works, and through its telescopic end, it can drive the lifting plate 202 to rise, causing the protective cover 203 to fit tightly against the upper plate 101. The drive motor 301 operates, causing the drive pulley 302 to rotate. The drive pulley 302 drives the driven pulley 303 to rotate via the synchronous belt 306, which in turn drives the hollow shaft 304 to rotate, thereby driving the wafer product 9 to rotate. The external etching chemical solution source is injected into the outlet component 602 through the inlet pipe 601, and enters the etching chemical solution in the outlet shell 6022 through the lower pipe 6021. It is then ejected through the oblique hole 6023 and the top hole 6024. The top hole 6024 is used to etch the center of the wafer product 9. An external inert gas source provides a stable and continuous inert gas to the outlet component 702 through the inlet pipe 701 at a preset pressure value, and then blows it vertically upward from the outlet hole 703. This pressure allows the etching solution to adhere tightly to the lower surface of the wafer product 9. By controlling the magnitude of the air pressure, it is possible to control whether the etching solution contacts the lower surface of the wafer product 9. When the supporting force provided by the air pressure is greater than the weight of the etching solution, the etching solution adheres tightly to the wafer product 9; when the supporting force provided by the air pressure is less than the weight of the etching solution, the etching solution will be ejected in a parabolic trajectory.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer etching apparatus, characterized in that, include: A frame assembly for providing support; A lifting assembly, wherein the lifting assembly is used to provide a lifting function; A protective cover (203) is provided on the lifting component of the lifting assembly, and the inner bottom surface of the protective cover (203) is provided with a blocking slope (2031). A drive assembly, which is mounted on the frame assembly, is used to provide rotational power; A fixing component is disposed on the rotating part of the drive component and is used to fix the wafer product (9). A spraying assembly, located directly below the fixed assembly, is used to spray an etching solution circumferentially. An airflow assembly, located outside the liquid spraying assembly, is used to generate a vertically upward airflow with controllable pressure. A suction assembly, located on the upper part of the frame assembly, is used for suctioning gas.

2. The semiconductor wafer etching apparatus according to claim 1, characterized in that: The frame assembly includes an upper plate (101), a support leg (102) is fixedly connected to the lower part of the upper plate (101), and an mounting bracket (103) is fixedly connected to the upper plate (101).

3. The semiconductor wafer etching apparatus according to claim 2, characterized in that: The lifting assembly includes an electric push rod (201) fixedly installed on the upper plate (101), and the output end of the electric push rod (201) is fixedly connected to a lifting plate (202).

4. The semiconductor wafer etching apparatus according to claim 2, characterized in that: The drive assembly includes a drive motor (301) fixedly mounted on a mounting bracket (103). The output end of the drive motor (301) is fixedly connected to a drive pulley (302). A driven pulley (303) is provided on the outer side of the drive pulley (302). A synchronous belt (306) is provided between the drive pulley (302) and the driven pulley (303).

5. The semiconductor wafer etching apparatus according to claim 4, characterized in that: The fixing assembly includes a hollow shaft (304) rotatably mounted on the upper plate (101). The upper part of the hollow shaft (304) is connected to an external vacuum device through a rotary joint (305). A vacuum suction cup (10) is fixedly connected to the lower end of the hollow shaft (304). The upper part of the hollow shaft (304) is fixedly connected to a driven pulley (303).

6. The semiconductor wafer etching apparatus according to claim 5, characterized in that: The liquid spraying assembly includes an inlet pipe (601), and an outlet component (602) is fixedly connected to the upper end of the inlet pipe (601). The inlet pipe (601) is interconnected with an external etching solution source. The outlet component (602) includes a lower pipe (6021) fixedly installed at the upper end of the inlet pipe (601). An outlet shell (6022) is fixedly connected to the upper part of the lower pipe (6021). The outlet shell (6022) has oblique holes (6023) evenly distributed around its upper circumference. A top hole (6024) is provided at the center of the upper part of the outlet shell (6022). The outlet component (602) corresponds to the center of the vacuum chuck (10).

7. The semiconductor wafer etching apparatus according to claim 6, characterized in that: The airflow assembly includes an air inlet pipe (701), and an air outlet component (702) is fixedly connected to the upper part of the air inlet pipe (701). The upper surface of the air outlet component (702) is uniformly provided with air outlet holes (703). The air outlet component (702) is located outside the liquid outlet component (602). The air inlet pipe (701) is connected to an external inert air pressure source with a preset air pressure value.

8. The semiconductor wafer etching apparatus according to claim 1, characterized in that: The suction assembly includes a suction tube (4), which is connected to an external air extraction device, and a pressure sensor (5) is installed inside the protective cover (203).

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