Semiconductor silicon wafer bsd cleaning apparatus

Abstract

The application discloses a semiconductor silicon wafer BSD cleaning device, and particularly relates to the technical field of silicon wafer cleaning, which comprises a mounting frame, a conveying mesh belt is internally mounted in the mounting frame and is used for conveying semiconductor silicon wafers, a blowing mechanism is arranged above the conveying mesh belt and is used for adjusting the blowing angle and the flow size, and a flushing mechanism is arranged at the top of the conveying mesh belt. The semiconductor silicon wafer BSD cleaning device can flexibly adjust the flow size of the blowing gas according to the size and thickness of the semiconductor silicon wafer through a flow regulating valve and a flow display meter, the flow display meter can monitor the flow stability in real time, the problem of unstable blowing of the existing device is effectively solved, the controllability and stability of the blowing strength are ensured, the angle of the air knife can be adjusted through the cooperation of the electric push rod, the blowing demand of silicon wafers with different sizes and different thicknesses can be met, the thin silicon wafers are prevented from being blown off, the silicon wafer fragment loss is reduced, and the production yield is improved.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer cleaning technology, and in particular to a semiconductor silicon wafer BSD cleaning device. Background Technology

[0002] In the BSD (Best-Size-Durability) process for semiconductor silicon wafers, after BSD sandblasting, silicon dioxide powder forms a damage layer on the surface of the silicon wafer. At the same time, a large number of particulate impurities remain on the surface of the silicon wafer, which need to be removed by blowing and rinsing.

[0003] Existing purging devices often employ multiple independent, narrow nozzles arranged in parallel. This not only results in uneven airflow but also creates gaps between the nozzles, making it impossible to achieve full coverage of the silicon wafer surface. Furthermore, adjusting the angle of a single nozzle is difficult, and maintaining consistent angles across multiple nozzles further impacts cleaning effectiveness and processing adaptability. When changing to silicon wafers of different sizes, especially smaller, thinner wafers, unsuitable purging force and angle can easily cause the wafers to fall off, resulting in wafer fragments and increased production losses.

[0004] Therefore, we urgently need to provide a semiconductor silicon wafer BSD cleaning device. Summary of the Invention

[0005] The main objective of this invention is to provide a semiconductor silicon wafer BSD cleaning device that can effectively solve the problems mentioned above.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A semiconductor silicon wafer BSD cleaning device includes a mounting frame, a conveyor belt installed inside the mounting frame for transporting semiconductor silicon wafers, a blowing mechanism above the conveyor belt for adjusting the blowing angle and flow rate, a rinsing mechanism at the top of the conveyor belt for rinsing and cleaning the semiconductor silicon wafers, a sweeping mechanism at the top of the mounting frame for removing particles adhering to the surface of the silicon wafers, and a placement mechanism at the top of the conveyor belt for placing the semiconductor silicon wafers.

[0007] Preferably, the purging mechanism includes support plates, which are fixedly installed on the front and rear sides of the upper end of the mounting frame. A rotating shaft is rotatably connected to the adjacent side of the two support plates. An air knife is fixedly installed on the outer side of the rotating shaft for blowing away particulate impurities and water stains on the surface of the silicon wafer. A mounting block is fixedly installed on the front of the upper end of the mounting frame. An electric push rod is rotatably connected inside the mounting block. A connecting block is rotatably connected to the output end of the electric push rod. The end of the connecting block away from the electric push rod is fixedly connected to the rotating shaft for adjusting the purging angle of the air knife. An air pump is installed on the left side of the back of the mounting frame. An air duct is connected to the output end of the air pump. A flow regulating valve is installed inside the air duct for adjusting the gas flow rate. A flow meter is installed inside the air duct for detecting flow stability.

[0008] Preferably, the air knife has a flat air outlet structure and a continuous planar air outlet surface with no air outlet gaps, which can achieve full coverage blowing of the silicon wafer surface.

[0009] Preferably, the rinsing mechanism includes a water tank, which is installed on the right side of the back of the mounting frame. A water pump is installed on the top of the water tank, and the output end of the water pump is connected to a liquid distribution pipe. Both output ends of the liquid distribution pipe are equipped with connecting pipes, and multiple nozzles are installed at the lower ends of the two connecting pipes for rinsing semiconductor silicon wafers.

[0010] Preferably, the cleaning mechanism includes a limiting frame, which is fixedly installed on the left and right sides of the upper end of the mounting frame, and the two limiting frames are located between two connecting pipes. A slider is slidably connected to the outer side of each of the two limiting frames. A brush is installed at the bottom of each slider for cleaning impurity particles attached to the surface of the semiconductor silicon wafer. A rack is fixedly installed on the adjacent side of each slider. A fixing frame is fixedly installed on the outer side of each limiting frame. A motor is fixedly installed at the top inside the fixing frame. A connecting rod is fixedly installed at the output end of the motor. A half gear that meshes with the rack is fixedly installed on the outer side of the lower end of the connecting rod for driving the two sliders to move back and forth.

[0011] Preferably, the slider has a T-shaped groove on its side, and the slider is slidably connected to the outer wall of the limiting frame through the T-shaped groove to limit the movement of the slider.

[0012] Preferably, the placement mechanism includes a connecting plate, which is fixedly installed on the surface of the conveyor belt by screws. Guide plates are fixedly installed at the front and rear ends of the top of the connecting plate. A placement plate is installed above the guide plates for placing semiconductor silicon wafers. Insert plates are fixedly installed at the front and rear ends of the bottom of the placement plate, which cooperate with the guide plates to install the placement plate on the connecting plate. Bolts are threaded inside the insert plates to fix the placement plate on the connecting plate.

[0013] Preferably, both the guide plate and the insert plate have threaded holes on their sides. The guide plate and the insert plate are threadedly connected by bolts, which can fix the placement plate on the connecting plate. At the same time, the placement plate can be disassembled and replaced, so that the appropriate placement plate can be selected according to the semiconductor silicon wafer.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. This device, through its designed purging mechanism, uses a flow regulating valve and a flow meter to flexibly adjust the flow rate of the purging gas according to the size and thickness of the semiconductor silicon wafer. The flow meter can also monitor the flow stability in real time, effectively solving the problem of unstable purging in existing devices and ensuring the controllability and stability of the purging force. At the same time, in conjunction with the electric push rod to adjust the angle of the air knife, it can adapt to the purging needs of silicon wafers of different sizes and thicknesses, preventing thin silicon wafers from being blown off, reducing silicon wafer fragment loss, and improving production yield.

[0015] 2. This device uses a designed cleaning mechanism that drives a motor to rotate a connecting rod and a half gear. When the half gear rotates, it meshes with the racks on the left and right sliders, causing the sliders to move the brush back and forth along the limit frame to clean the semiconductor silicon wafers, removing attached impurities and improving the cleaning quality of the silicon wafers. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 for Figure 1 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the cleaning mechanism structure of the present invention; Figure 5 This is a schematic diagram of the storage mechanism of the present invention.

[0017] In the diagram: 1. Mounting frame; 2. Conveyor belt; 31. Support plate; 32. Rotating shaft; 33. Air knife; 34. Mounting block; 35. Electric push rod; 36. Connecting block; 37. Air pump; 38. Air duct; 39. Flow regulating valve; 310. Flow meter; 41. Water tank; 42. Water pump; 43. Dispensing pipe; 44. Connecting pipe; 45. Nozzle; 51. Limiting frame; 52. Sliding block; 53. Brush; 54. Rack; 55. Fixing frame; 56. Motor; 57. Connecting rod; 58. Half gear; 61. Connecting plate; 62. Guide plate; 63. Shelf plate; 64. Insert plate; 65. Bolt. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0019] Example 1, as Figures 1-3 As shown, a semiconductor silicon wafer BSD cleaning device includes a mounting frame 1, a conveyor belt 2 installed inside the mounting frame 1 for conveying semiconductor silicon wafers, a water receiving tray installed below the conveyor belt 2, and a drain outlet installed on the outside of the water receiving tray to collect wastewater and ensure the cleanliness of the cleanroom environment. A blowing mechanism is provided above the conveyor belt 2 for adjusting the blowing angle and flow rate.

[0020] The purging mechanism includes a support plate 31, which is fixedly installed on the front and rear sides of the upper end of the mounting frame 1. The two support plates 31 are rotatably connected to a rotating shaft 32 on the adjacent side. An air knife 33 is fixedly installed on the outside of the rotating shaft 32, which is used to blow away particulate impurities and water stains on the surface of the silicon wafer. The air knife 33 has a flat air outlet structure and a continuous planar structure with no air outlet gap, which can achieve full coverage purging of the silicon wafer surface.

[0021] Mounting block 34 is fixedly mounted on the upper front of mounting bracket 1. Electric push rod 35 is rotatably connected inside mounting block 34. Connecting block 36 is rotatably connected to the output end of electric push rod 35. The end of connecting block 36 away from electric push rod 35 is fixedly connected to rotating shaft 32 for adjusting the blowing angle of air knife 33. Air pump 37 is mounted on the left side of the back of mounting bracket 1. Air duct 38 is connected to the output end of air pump 37. Flow regulating valve 39 is installed inside air duct 38 for adjusting gas flow rate. Flow display meter 310 is installed inside air duct 38 for detecting flow stability. Flow display meter 310 is a real-time display flow meter for real-time monitoring of gas flow data in the pipeline.

[0022] like Figures 1-2 As shown, a rinsing mechanism is provided on the top of the conveyor belt 2 for rinsing and cleaning semiconductor silicon wafers. The rinsing mechanism includes a water tank 41, which is installed on the right side of the back of the mounting frame 1. A water pump 42 is installed on the top of the water tank 41 to provide power for the flow of clean water. The output end of the water pump 42 is connected to a liquid distribution pipe 43. Both output ends of the liquid distribution pipe 43 are equipped with connecting pipes 44. Multiple nozzles 45 are installed at the lower ends of the two connecting pipes 44 for rinsing semiconductor silicon wafers.

[0023] Example 2, as Figure 4As shown, a cleaning mechanism is provided on the top of the mounting frame 1 to remove particles attached to the surface of the silicon wafer. The cleaning mechanism includes a limiting frame 51, which is fixedly installed on the left and right sides of the upper end of the mounting frame 1. The two limiting frames 51 are located between the two connecting pipes 44. Sliding blocks 52 are slidably connected to the outer sides of the left and right limiting frames 51. Brushes 53 are installed at the bottom of the two sliding blocks 52 to clean the impurity particles attached to the surface of the semiconductor silicon wafer. The brushes 53 are made of ultra-fine fiber bristles. The contact pressure between the brush surface and the surface of the silicon wafer is 5-10N, which is a flexible contact without hard scraping. A T-shaped groove is opened on the side of the sliding block 52, and the sliding block 52 is slidably connected to the outer wall of the limiting frame 51 through the T-shaped groove to limit the movement of the sliding block 52.

[0024] A rack 54 is fixedly installed on one side of the two adjacent sliders 52. A fixing bracket 55 is fixedly installed on the outside of the two limit brackets 51. A motor 56 is fixedly installed on the top inside the fixing bracket 55. The motor 56 is a stepper motor with a rated speed of 10-50 r / min and an output torque of 5-20 N. m drives the half gear 58 to rotate continuously in one direction. A connecting rod 57 is fixedly installed at the output end of the motor 56. A half gear 58 that meshes with the rack 54 is fixedly installed on the outer side of the lower end of the connecting rod 57, which is used to drive the two sliders 52 to move back and forth.

[0025] Example 3, as Figure 5 As shown, a placement mechanism is provided on the top of the conveyor belt 2 for placing semiconductor silicon wafers. The placement mechanism includes a connecting plate 61, which is fixedly installed on the surface of the conveyor belt 2 by screws. Guide plates 62 are fixedly installed at the front and rear ends of the top of the connecting plate 61. A placement plate 63 is installed above the guide plates 62 for placing semiconductor silicon wafers. Insert plates 64 are fixedly installed at the front and rear ends of the bottom of the placement plate 63. These insert plates 64 cooperate with the guide plates 62 to install the placement plate 63 on the connecting plate 61. Bolts 65 are threaded inside the insert plates 64 to fix the placement plate 63 on the connecting plate 61 and to facilitate the disassembly and replacement of the placement plate 63.

[0026] Both the guide plate 62 and the insert plate 64 have threaded holes on their sides. The guide plate 62 and the insert plate 64 are threadedly connected by bolts 65, which can fix the placement plate 63 on the connecting plate 61. At the same time, the placement plate 63 can be disassembled and replaced, so that the appropriate placement plate 63 can be selected according to the semiconductor silicon wafer.

[0027] Working principle: First, select the appropriate placement plate 63 according to the size of the semiconductor silicon wafer to be cleaned. Then, adjust the flow rate of the flow regulating valve 39 and the angle of the air knife 33 according to the thickness of the silicon wafer. By starting the electric push rod 35, push the connecting block 36 to drive the rotating shaft 32 to rotate. When the rotating shaft 32 rotates, it drives the air knife 33 to rotate to a suitable blowing angle. The flow display meter 310 displays the flow data, which makes it easy for the operator to confirm the stability of the flow.

[0028] Then, the corresponding placement plate 63 is connected to the guide plate 62 via the insert plate 64, and then connected to the guide plate 62 and the insert plate 64 via bolts 65, fixing the placement plate 63 to the top of the connecting plate 61. The semiconductor silicon wafer to be cleaned is then placed inside the placement plate 63, and the conveyor belt 2 is started to transport the semiconductor silicon wafer from right to left. During the transport process, the water pump 42, air pump 37, and motor 56 are started respectively. The water pump 42 pumps clean water from the water tank 41 into the connecting pipe 44 via the liquid distribution pipe 43, and sprays it out from multiple nozzles 45 to clean the semiconductor wafer. The silicon wafer surface undergoes a first rinse. Subsequently, the semiconductor silicon wafer moves to a position below the brush 53. The motor 56 drives the connecting rod 57 and the half gear 58 to rotate. When the half gear 58 rotates, it meshes with the racks 54 on the left and right sliders 52 respectively. Under the limiting action of the limiting frame 51, the slider 52 drives the brush 53 to move back and forth along the limiting frame 51, cleaning the semiconductor silicon wafer back and forth and removing the attached impurity particles. Then, the cleaned silicon wafer is rinsed a second time through the nozzle 45 on the left side to improve the cleaning quality.

[0029] After rinsing, the semiconductor silicon wafer moves toward the air knife 33, where high-pressure gas is generated by the air pump 37. The gas is blown out of the air knife 33 through the air duct 38. The continuous air outlet of the air knife 33 achieves full coverage and uniform cleaning of the silicon wafer surface, removing impurities, particles and water stains from the semiconductor silicon wafer surface, thus completing the cleaning process after the BSD process of the semiconductor silicon wafer.

[0030] When cleaning silicon wafers of different sizes or thicknesses, only the corresponding placement plate 63 needs to be replaced. At the same time, the flow rate can be adjusted by the flow regulating valve 39, and the blowing angle of the air knife 33 can be adjusted by the electric push rod 35. This allows for quick adaptation to new processing requirements, making operation convenient and eliminating the need to replace parts such as nozzles. This effectively improves production efficiency and avoids the problem of silicon wafer fragments being blown off due to unsuitable blowing force and angle.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor silicon wafer BSD cleaning device, comprising a mounting frame (1), wherein a conveyor belt (2) is installed inside the mounting frame (1) for conveying semiconductor silicon wafers, characterized in that: A blowing mechanism is provided above the conveyor belt (2) for adjusting the blowing angle and flow rate. A rinsing mechanism is provided on the top of the conveyor belt (2) for rinsing and cleaning the semiconductor silicon wafer. A cleaning mechanism is provided on the top of the mounting frame (1) for sweeping away particles attached to the surface of the silicon wafer. A placement mechanism is provided on the top of the conveyor belt (2) for placing the semiconductor silicon wafer.

2. The semiconductor silicon wafer BSD cleaning equipment according to claim 1, characterized in that: The purging mechanism includes a support plate (31), which is fixedly installed on the front and rear sides of the upper end of the mounting frame (1). A rotating shaft (32) is rotatably connected to the adjacent side of the two support plates (31). An air knife (33) is fixedly installed on the outside of the rotating shaft (32) for blowing away particulate impurities and water stains on the surface of the silicon wafer. A mounting block (34) is fixedly installed on the front of the upper end of the mounting frame (1). An electric push rod (35) is rotatably connected inside the mounting block (34). The output of the electric push rod (35) is... A connecting block (36) is rotatably connected to the end of the mounting bracket (1). The end of the connecting block (36) away from the electric push rod (35) is fixedly connected to the rotating shaft (32) for adjusting the blowing angle of the air knife (33). An air pump (37) is installed on the left side of the back of the mounting bracket (1). An air duct (38) is connected to the output end of the air pump (37). A flow regulating valve (39) is installed inside the air duct (38) for adjusting the gas flow rate. A flow display meter (310) is installed inside the air duct (38) for detecting flow stability.

3. The semiconductor silicon wafer BSD cleaning equipment according to claim 2, characterized in that: The air knife (33) is a flat air outlet structure with a continuous planar air outlet surface and no air outlet gap, used for full-coverage blowing of the silicon wafer surface.

4. The semiconductor silicon wafer BSD cleaning equipment according to claim 2, characterized in that: The rinsing mechanism includes a water tank (41), which is installed on the right side of the back of the mounting bracket (1). A water pump (42) is installed on the top of the water tank (41). The output end of the water pump (42) is connected to a liquid distribution pipe (43). Both output ends of the liquid distribution pipe (43) are equipped with connecting pipes (44). Multiple nozzles (45) are installed at the lower ends of the two connecting pipes (44) for rinsing semiconductor silicon wafers.

5. A semiconductor silicon wafer BSD cleaning device according to claim 4, characterized in that: The cleaning mechanism includes a limiting frame (51), which is fixedly installed on the left and right sides of the upper end of the mounting frame (1), and the two limiting frames (51) are located between two connecting pipes (44). Sliding blocks (52) are slidably connected to the outer sides of the two limiting frames (51). Brushes (53) are installed at the bottom of the two sliding blocks (52) for cleaning impurity particles attached to the surface of the semiconductor silicon wafer. A rack (54) is fixedly installed on the adjacent side of the two sliding blocks (52). A fixing frame (55) is fixedly installed on the outer side of the two limiting frames (51). A motor (56) is fixedly installed at the top inside the fixing frame (55). A connecting rod (57) is fixedly installed at the output end of the motor (56). A half gear (58) that meshes with the rack (54) is fixedly installed on the outer side of the lower end of the connecting rod (57) for driving the two sliding blocks (52) to move back and forth.

6. The semiconductor silicon wafer BSD cleaning device according to claim 5, characterized in that: The slider (52) has a T-shaped groove on its side, and the slider (52) is slidably connected to the outer wall of the limiting frame (51) through the T-shaped groove, which is used to limit the movement of the slider (52).

7. A semiconductor silicon wafer BSD cleaning device according to claim 2, characterized in that: The placement mechanism includes a connecting plate (61), which is fixedly installed on the surface of the conveyor belt (2) by screws. Guide plates (62) are fixedly installed at the front and rear ends of the top of the connecting plate (61). A placement plate (63) is installed above the guide plate (62) for placing semiconductor silicon wafers. Insert plates (64) are fixedly installed at the front and rear ends of the bottom of the placement plate (63) to cooperate with the guide plate (62) to install the placement plate (63) on the connecting plate (61). Bolts (65) are threaded inside the insert plate (64) to fix the placement plate (63) on the connecting plate (61).

8. A semiconductor silicon wafer BSD cleaning device according to claim 7, characterized in that: The guide plate (62) and the insert plate (64) are both provided with threaded holes on their sides. They are connected to the guide plate (62) and the insert plate (64) by bolts (65) for disassembling and replacing the shelf (63).

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