A pin device for semiconductor chip packaging and a method of using the same

Abstract

The application discloses a top pin device for semiconductor chip packaging and a use method thereof, and relates to the field of top pin devices. The top pin device for semiconductor chip packaging comprises a processing frame, an arc-shaped limiting block and an adjusting block, and first and second displacement monitors are installed on the processing frame. The top pin device for semiconductor chip packaging adopts the structure that the processing frame is arranged on the clamp pin cap, the arc-shaped limiting block for limiting the blue film with the wafer bonded thereon is arranged above the processing frame, the electric push rod drives the arc-shaped limiting block to press the other wafers that need to be ejected locally, the blue film is effectively prevented from being stretched locally during ejection, the rear heating ring starts heating and transmits heat to the top pin, the power assembly drives the top pin to rise, the glue between the contact points of the top pin and the blue film is melted, and the wafer is taken down by the external suction disc when the wafer is separated from the blue film and falls off.

Description

Technical Field

[0001] This invention relates to the field of ejector pin devices, and particularly to an ejector pin device for semiconductor chip packaging and its method of use. Background Technology

[0002] As technologies such as AI and 5G drive chips toward higher integration and miniaturization, ejector pin devices, through innovative designs such as precise control of voice coil motors and elastic buffer structures, significantly improve chip pickup success rates, reduce loss risks, and meet advanced packaging requirements.

[0003] Chips are small cubes cut from wafers. Existing semiconductor chip packaging ejector devices use ejector pins to pierce the blue film and push the chip to a predetermined position. Wafers are mostly fixed to the blue film with adhesive. When separating wafers, the blue film with the wafer attached needs to be fixed. Existing ejector devices fix part of the blue film by adsorption. However, the blue film itself has high toughness and elasticity. During separation, the blue film needs to be pushed up to a certain height, causing local stretching of the blue film, which affects the positioning of adjacent wafers. At the same time, when the blue film rebounds, it will cause the surrounding wafers to misalign, affecting the pick-and-place accuracy and increasing the difficulty of subsequent chip lifting. Summary of the Invention

[0004] The purpose of this invention is to provide a pin device for semiconductor chip packaging and a method of using the same, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a ejector pin device for semiconductor chip packaging, comprising: A processing frame is provided with a needle clamping cap at its bottom, and a pin is slidably connected inside the needle clamping cap. A first displacement monitor and a second displacement monitor are installed on the processing frame. A data processor and a battery are installed at the bottom of the processing frame. A transmission component is installed on the data processor, and the battery supplies power to the electrical components. The arc-shaped limiting block can move up and down above the processing frame; An adjusting block is capable of moving up and down above the processing frame and reaching any position on the processing frame. A vacuum generator is installed inside the adjusting block, and a flexible suction cup is installed above the vacuum generator.

[0006] A connecting rod is fixedly connected to the arc-shaped limiting block. An electric push rod is installed between the bottom of the connecting rod and the processing frame. The output end of the electric push rod is fixedly connected to the bottom of the connecting rod, and the detection end of the first displacement monitor is directly opposite the connecting rod.

[0007] A fixing frame is fixedly connected between the needle clamp cap and the processing frame. A needle clamp seat is fixedly connected inside the needle clamp cap. A power assembly is installed on the needle clamp seat. A needle clamp assembly is arranged above the power assembly. The ejector pin is located inside the needle clamp assembly.

[0008] The transmission component includes a transmission connector and a remote signal connector. The transmission connector is mounted on the side wall of the data processor, and the remote signal connector is mounted on the transmission connector. The data processor, the transmission connector, and the remote signal connector are electrically connected.

[0009] A fixed rod is fixedly connected to the processing frame, a second adjusting rod is slidably connected between the fixed rods, a first adjusting rod is slidably connected inside the second adjusting rod, and an adjusting block is slidably connected inside the first adjusting rod.

[0010] A first driving component is installed between the second adjusting rod and the processing frame. The first driving component is used to drive the second adjusting rod. A second driving component is installed between the second adjusting rod and the fixed rod. The second driving component is used to drive the first adjusting rod. A third driving component is installed inside the first adjusting rod. The third driving component is used to drive the adjusting block.

[0011] A circular hole is stamped at the center of the processing frame, and a heating coil is embedded in the inner wall of the circular hole. A fixed foot is fixedly connected to the bottom of the processing frame, and the fixed foot and the bottom of the clamping cap are on the same horizontal plane. The detection end of the second displacement monitor is directly opposite the inner wall of the processing frame.

[0012] The bottom of the arc-shaped limiting block is fixedly connected to a rubber pad with the same shape as the arc-shaped limiting block, and through holes are provided at corresponding positions on the arc-shaped limiting block and the rubber pad.

[0013] The circular hole on the processing frame is in the same vertical position as the arc-shaped limiting block and the through hole on the rubber pad.

[0014] A method of using a ejector pin device for semiconductor chip packaging includes the following steps: S1. The blue film with the wafer attached is transferred to the processing frame by an external conveying mechanism. Then, the movement of the adjusting block is controlled by the driving component. The vacuum generator in the adjusting block causes the flexible suction cup to generate an adsorption force, transferring the blue film with the wafer attached to the preset position. During the transfer, the second displacement monitor monitors the blue film in real time. The data processor processes the monitoring data of the second displacement monitor and transmits it to the central controller through the transmission component. The central controller judges the value. If the data of the two second displacement monitors are not equal to the preset value, the central controller immediately issues a power cut-off command to the power component and issues an alarm. If the data of the two second displacement monitors are equal to the preset value, the next operation is performed. S2. When the wafer to be ejected is located at the center of the through hole, the electric push rod first drives the arc-shaped limiting block to press down other wafers in the area to be ejected. Then the heating coil starts heating and transfers heat to the ejector pin. During the downward pressing of the arc-shaped limiting block, the first displacement monitor detects its position in real time. The data processor processes the monitoring data of the first displacement monitor and transmits it to the central controller through the transmission device. The central controller judges the value. If the data of the two first displacement monitors are not equal to the preset value, the central controller immediately issues a power cut-off command to the power component and issues an alarm. If the data of the two first displacement monitors are equal to the preset value, the next operation is performed. S3. The power unit drives the ejector pin to rise, and the glue between the ejector pin and the blue film melts. When the wafer separates from the blue film, the wafer is removed by an external suction cup.

[0015] The technical effects and advantages of this invention are as follows: 1. This ejector pin device for semiconductor chip packaging adopts a structure with a processing frame on the pin cap. Above the processing frame, there is an arc-shaped limiting block that limits the blue film bonded to the wafer. During the ejection operation, the movement of the adjusting block is controlled by the driving component. The vacuum generator inside the adjusting block causes the flexible suction cup to generate an adsorption force, which facilitates the transfer of the blue film bonded to the wafer to the preset position. At this time, the electric push rod drives the arc-shaped limiting block to press down other wafers in the part of the wafer that needs to be ejected, effectively preventing the blue film from being stretched in part during ejection. Then, the heating coil starts to heat up and transfers the heat to the ejector pin. The power component drives the ejector pin to rise, and the adhesive between the contact point between the ejector pin and the blue film melts. When the wafer separates from the blue film, the wafer is removed by the external suction cup.

[0016] 2. The ejector pin device for semiconductor chip packaging has a first displacement monitor and a second displacement monitor installed on the processing frame. The displacement monitor plays a real-time detection role during the ejection operation. The data processor processes the monitoring data of the displacement monitor and transmits it to the central controller through the transmission device. The central controller judges the value and issues subsequent commands to improve the wafer pick-and-place accuracy. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the electric actuator structure of the present invention; Figure 3 This is a schematic diagram of the data processor structure of the present invention; Figure 4 This is a schematic diagram of the ejector pin structure of the present invention; Figure 5 This is a schematic diagram of the heating coil structure of the present invention; Figure 6This is a schematic diagram of the vacuum generator structure of the present invention; Figure 7 This is a flowchart of the processing steps of the present invention; Figure 8 This is a flowchart of the judgment process of the displacement monitor of the present invention.

[0018] In the diagram: 1. Machining frame; 11. Fixing foot; 12. Heating coil; 2. Arc-shaped limiting block; 21. Connecting rod; 22. Electric push rod; 3. Adjusting block; 31. Vacuum generator; 32. Flexible suction cup; 33. First adjusting rod; 34. Second adjusting rod; 35. Fixing rod; 4. Needle clamp cap; 41. Fixing frame; 42. Needle clamp seat; 43. Power assembly; 44. Needle clamp assembly; 45. Ejector pin; 5. First driving component; 51. Second driving component; 52. Third driving component; 6. Data processor; 61. Transmission connector; 62. Remote signal connector; 63. Battery; 7. First displacement monitor; 71. Second displacement monitor. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] This invention provides, for example Figure 1 - Figure 6 The ejector pin device shown includes a processing frame 1, an arc-shaped limiting block 2, and an adjusting block 3.

[0021] The bottom of the processing frame 1 is provided with a clamping cap 4, and a ejector pin 45 is slidably connected inside the clamping cap 4. A first displacement monitor 7 and a second displacement monitor 71 are installed on the processing frame 1. A data processor 6 and a battery 63 are installed at the bottom of the processing frame 1. The data processor 6 receives the monitoring data from the first displacement monitor 7 and the second displacement monitor 71. The battery 63 ensures that the device can operate normally without an external power source. A transmission component is installed on the data processor 6. The battery 63 supplies power to the electrical components. The circular hole at the center of the processing frame 1 provides operating space for the ejector pin 45 to eject the wafer. The fixed foot 11 at its bottom is used to stabilize the device and is located on the same horizontal plane as the bottom of the clamping cap 4 to ensure the overall stability of the device. The clamping cap 4 provides guidance and protection for the ejector pin 45. At the same time, the clamping seat 42 fixedly connected inside is used to install the power component 43, so that the power component 43 can accurately drive the ejector pin 45 to move. The ejector pin 45 contacts the blue film. By heating, the glue between the contact points melts, thereby ejecting and separating the wafer from the blue film. The first displacement monitor 7 is used to detect the position of the arc-shaped limit block 2 in real time to ensure that it is pressed down accurately during the ejection operation; the second displacement monitor 71 is used to monitor the position of the blue film with the wafer attached in real time to ensure that the blue film is accurately positioned during the transfer and ejection process, and to prevent the displacement of the blue film from affecting the wafer positioning and pick-and-place accuracy. During the operation of the device, the displacement monitor transmits the data to the data processor 6. After the data processor 6 analyzes and processes the data, it transmits it to the central controller through the transmission device. The central controller determines whether to issue an alarm or continue the subsequent operation based on the data. The central controller processes and analyzes the data, and then transmits the processed data to the central controller through the transmission device so that the central controller can make a judgment and issue corresponding commands based on the data.

[0022] The arc-shaped limiting block 2 can move up and down above the processing frame 1. During the ejection operation, the electric push rod 22 drives the other wafers that need to be ejected to press down, effectively preventing the blue film from being stretched during ejection. This avoids the surrounding wafers from being misaligned due to the stretching and rebound of the blue film, which would affect the pick-and-place accuracy. When a wafer needs to be ejected, the electric push rod 22 is activated, which drives the connecting rod 21 and the arc-shaped limiting block 2 to move downward. The rubber pad fixedly connected to the bottom of the arc-shaped limiting block 2 contacts the wafer, gently pressing down the surrounding wafers to prevent them from moving during the ejection process. The adjusting block 3 can be raised and lowered above the processing frame 1, and the adjusting block 3 can reach any position of the processing frame 1. A vacuum generator 31 is installed inside the adjusting block 3, and a flexible suction cup 32 is installed above the vacuum generator 31. The flexible suction cup 32 generates an adsorption force through the vacuum generator 31, which facilitates the transfer of the blue film with the wafer attached to the preset position.

[0023] A connecting rod 21 is fixedly connected to the arc-shaped limiting block 2. An electric push rod 22 is installed between the bottom of the connecting rod 21 and the processing frame 1. The output end of the electric push rod 22 is fixedly connected to the bottom of the connecting rod 21. The detection end of the first displacement monitor 7 is directly opposite the connecting rod 21. After receiving the instruction from the central controller, the electric push rod 22 starts to work. Its output end pushes the connecting rod 21 to move up or down. The connecting rod 21 drives the arc-shaped limiting block 2 to accurately reach the designated position, completing the task of limiting the surrounding wafers.

[0024] A fixing frame 41 is fixedly connected between the needle clamp cap 4 and the processing frame 1. A needle clamp seat 42 is fixedly connected inside the needle clamp cap 4. A power assembly 43 is installed on the needle clamp seat 42. A needle clamp assembly 44 is arranged above the power assembly 43. An ejector pin 45 is located inside the needle clamp assembly 44. The ejector pin 45 is the same as the ejector pin device with publication number CN120261382A.

[0025] The transmission components include a transmission connector 61 and a remote signal connector 62. The transmission connector 61 is mounted on the side wall of the data processor 6, and the remote signal connector 62 is mounted on the transmission connector 61. The data processor 6, the transmission connector 61, and the remote signal connector 62 are electrically connected. The data processor 6, as the core processing unit, is responsible for data computation, analysis, and processing. The transmission connector 61 is the key hub for data transmission. It has standardized interfaces and protocol adaptation capabilities. After the data processor 6 completes data processing, it transmits the data to the transmission connector 61 in a specific format. The transmission connector 61 encapsulates and modulates the data according to the Ethernet communication protocol to adapt it to the corresponding transmission medium. The remote signal connector 62 is located at the remote end and is connected to the transmission connector 61 through a physical line. The transmission connector 61 sends the modulated signal to the remote signal connector 62 through the line. After receiving the signal, the remote signal connector 62 demodulates and decodes it to restore the original data, realizing reliable long-distance data transmission and interaction.

[0026] A fixed rod 35 is fixedly connected to the processing frame 1. A second adjusting rod 34 is slidably connected between the fixed rods 35. A first adjusting rod 33 is slidably connected inside the second adjusting rod 34. An adjusting block 3 is slidably connected inside the first adjusting rod 33.

[0027] A first driving component 5 is installed between the second adjusting rod 34 and the processing frame 1. The first driving component 5 is used to drive the second adjusting rod 34. A second driving component 51 is installed between the second adjusting rod 34 and the fixed rod 35. The second driving component 51 is used to drive the first adjusting rod 33. A third driving component 52 is installed inside the first adjusting rod 33. The third driving component 52 is used to drive the adjusting block 3.

[0028] A circular hole is stamped at the center of the processing frame 1, and a heating coil 12 is embedded in the inner wall of the circular hole. When ejection is required, the heating coil 12 is powered on and starts to heat up. The heat generated is quickly transferred to the ejector pin 45 through heat conduction. The ejector pin 45 transfers the heat to the contact point with the blue film, causing the glue to melt and the wafer to separate smoothly from the blue film. A fixing foot 11 is fixedly connected to the bottom of the processing frame 1. The fixing foot 11 and the bottom of the clamping cap 4 are on the same horizontal plane. The detection end of the second displacement monitor 71 is directly opposite the inner wall of the processing frame 1.

[0029] The bottom of the arc-shaped limiting block 2 is fixedly connected to a rubber pad with the same shape as the arc-shaped limiting block 2. The arc-shaped limiting block 2 and the rubber pad are provided with through holes at corresponding positions. The rubber pad is made of soft material and can play a buffering role when in contact with the wafer to avoid damage to the wafer. At the same time, the design of the through holes does not affect the ejector pin 45 from ejecting the wafer.

[0030] The round hole on the processing frame 1, the arc-shaped limiting block 2, and the through hole on the rubber pad are in the same vertical position.

[0031] Figure 7 and Figure 8 The method of using the ejector pin device for semiconductor chip packaging includes the following steps: S1, the blue film with the wafer attached is transferred to the processing frame 1 by an external conveying mechanism, and then the movement of the adjusting block 3 is controlled by the driving component. The vacuum generator 31 in the adjusting block 3 causes the flexible suction cup 32 to generate an adsorption force, transferring the blue film with the wafer attached to the preset position. During the transfer, the second displacement monitor 71 monitors the blue film in real time. The data processor 6 processes the monitoring data of the second displacement monitor 71 and transmits it to the central controller through the transmission component. The central controller judges the value. If the data of the two second displacement monitors 71 are not equal to the preset value, the central controller immediately issues a power cut-off command to the power component 43 and issues an alarm. If the data of the two second displacement monitors 71 are equal to the preset value, the next operation is performed. S2. When the wafer to be ejected is located at the center of the through hole, the electric push rod 22 first drives the arc-shaped limiting block 2 to press down other wafers in the area to be ejected. Then the heating coil 12 starts heating and transfers the heat to the ejector pin 45. During the downward pressing of the arc-shaped limiting block 2, the first displacement monitor 7 detects the position in real time. The data processor 6 processes the monitoring data of the first displacement monitor 7 and transmits it to the central controller through the transmission device. The central controller judges the value. If the data of the two first displacement monitors 7 are not equal to the preset value, the central controller immediately issues a power cut-off command to the power assembly 43 and issues an alarm. If the data of the two first displacement monitors 7 are equal to the preset value, the next operation is performed. S3, the power component 43 drives the ejector pin 45 to rise, the glue between the ejector pin 45 and the blue film melts, and when the wafer separates from the blue film, the wafer is removed by an external suction cup.

[0032] Example 1: This example provides a method for ejecting a semiconductor chip packaging ejector pin device. First, the blue film on the bonded wafer is transferred to the processing frame 1 via an external conveying mechanism. The vacuum generator 31 in the adjusting block 3 drives the flexible suction cup 32 to adsorb the blue film and transfer it to a preset position S1. During this process, the position of the blue film is monitored in real time by a second displacement monitor 71. If the monitored data deviates from the preset value by more than the limit, the central controller immediately interrupts the power assembly 43 and alarms. Next, for the target wafer, the electric push rod 22 drives the arc-shaped limiting block 2 to press down, fixing the surrounding wafers with the bottom rubber pad to prevent displacement S2; at the same time, the heating coil 12 heats up and conducts heat to the ejector pin 45, melting the adhesive at the contact point of the blue film. The pressing position of the arc-shaped limiting block 2 is verified by the first displacement monitor 7, and a power-off protection is triggered when there is an abnormality. Finally, the power assembly 43 drives the ejector pin 45 to rise and eject the wafer. After it separates from the blue film, it is removed by the external suction cup S3. The entire process is handled by data processor 6, which integrates displacement monitoring data and transmits it to the central controller for decision-making, ensuring ejection accuracy and safety.

[0033] Example 2: This example illustrates the dual displacement monitoring module of the ejector pin device. The module includes a first displacement monitor 7 and a second displacement monitor 71. The first displacement monitor 7 faces the connecting rod 21 and detects the rising and falling position of the arc-shaped limiting block 2 in real time to ensure its precise downward pressure to fix the surrounding wafers. The second displacement monitor 71 faces the inner wall of the processing frame 1 and dynamically tracks the position of the blue film on the bonded wafer to ensure positioning accuracy during the transfer and ejection process. The data from both monitors is transmitted to the data processor 6 in real time for calculation and analysis. If the displacement value deviates from the preset threshold (different blue film thresholds for different sizes), the data processor 6 immediately sends an abnormal signal to the central controller through the transmission device, triggering the power component 43 to cut off power and triggering an audible and visual alarm. If the data is normal, subsequent operations are allowed. The system is powered by the battery 63 and can still operate without an external power source. Combined with the vertical alignment design of the central circular hole of the processing frame 1, the limiting block, and the through hole of the rubber pad, closed-loop monitoring of the entire wafer ejection process is achieved, significantly improving packaging yield and equipment reliability.

[0034] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A ejector pin device for semiconductor chip packaging, characterized in that, include: The processing frame (1) has a needle cap (4) at its bottom, and a pin (45) is slidably connected inside the needle cap (4). A first displacement monitor (7) and a second displacement monitor (71) are installed on the processing frame (1). A data processor (6) and a battery (63) are installed at the bottom of the processing frame (1). A transmission component is installed on the data processor (6), and the battery (63) supplies power to the electrical components. Arc-shaped limiting block (2) can be raised and lowered above the processing frame (1); An adjustment block (3) is able to move up and down above the processing frame (1) and can reach any position of the processing frame (1). A vacuum generator (31) is installed inside the adjustment block (3) and a flexible suction cup (32) is installed above the vacuum generator (31).

2. The ejector pin device for semiconductor chip packaging according to claim 1, characterized in that, A connecting rod (21) is fixedly connected to the arc-shaped limiting block (2). An electric push rod (22) is installed between the bottom of the connecting rod (21) and the processing frame (1). The output end of the electric push rod (22) is fixedly connected to the bottom of the connecting rod (21). The detection end of the first displacement monitor (7) is directly opposite the connecting rod (21).

3. The ejector pin device for semiconductor chip packaging according to claim 1, characterized in that, A fixing frame (41) is fixedly connected between the needle clamp cap (4) and the processing frame (1). A needle clamp seat (42) is fixedly connected inside the needle clamp cap (4). A power assembly (43) is installed on the needle clamp seat (42). A needle clamp assembly (44) is provided above the power assembly (43). The ejector pin (45) is located inside the needle clamp assembly (44).

4. The ejector pin device for semiconductor chip packaging according to claim 1, characterized in that, The transmission component includes a transmission connector (61) and a remote signal connector (62). The transmission connector (61) is mounted on the side wall of the data processor (6), and the remote signal connector (62) is mounted on the transmission connector (61). The data processor (6), the transmission connector (61), and the remote signal connector (62) are electrically connected.

5. A ejector pin device for semiconductor chip packaging according to claim 1, characterized in that, A fixed rod (35) is fixedly connected to the processing frame (1), and a second adjusting rod (34) is slidably connected between the fixed rods (35). A first adjusting rod (33) is slidably connected inside the second adjusting rod (34), and the adjusting block (3) is slidably connected inside the first adjusting rod (33).

6. A ejector pin device for semiconductor chip packaging according to claim 5, characterized in that, A first driving member (5) is installed between the second adjusting rod (34) and the processing frame (1). The first driving member (5) is used to drive the second adjusting rod (34). A second driving member (51) is installed between the second adjusting rod (34) and the fixed rod (35). The second driving member (51) is used to drive the first adjusting rod (33). A third driving member (52) is installed inside the first adjusting rod (33). The third driving member (52) is used to drive the adjusting block (3).

7. A ejector pin device for semiconductor chip packaging according to claim 1, characterized in that, A circular hole is stamped at the center of the processing frame (1), and a heating coil (12) is embedded in the inner wall of the circular hole. A fixed foot (11) is fixedly connected to the bottom of the processing frame (1). The fixed foot (11) and the bottom of the clamping cap (4) are located on the same horizontal plane. The detection end of the second displacement monitor (71) is directly opposite the inner wall of the processing frame (1).

8. A ejector pin device for semiconductor chip packaging according to claim 7, characterized in that, The bottom of the arc-shaped limiting block (2) is fixedly connected to a rubber pad with the same shape as the arc-shaped limiting block (2), and through holes are provided at the corresponding positions of the arc-shaped limiting block (2) and the rubber pad.

9. A ejector pin device for semiconductor chip packaging according to claim 8, characterized in that, The circular hole on the processing frame (1) is in the same vertical position as the arc-shaped limiting block (2) and the through hole on the rubber pad.

10. A method of using the ejector pin device for semiconductor chip packaging according to any one of claims 1-9, characterized in that, Includes the following steps: S1. The blue film with the wafer attached is transferred to the processing frame (1) by the external conveying mechanism. Then, the movement of the adjustment block (3) is controlled by the drive component. The vacuum generator (31) in the adjustment block (3) causes the flexible suction cup (32) to generate adsorption force, and the blue film with the wafer attached is transferred to the preset position. During the transfer, the second displacement monitor (71) monitors the blue film in real time. The data processor (6) processes the monitoring data of the second displacement monitor (71) and transmits it to the central controller through the transmission component. The central controller judges the value. If the data of the two second displacement monitors (71) are not equal to the preset value, the central controller immediately issues a power cut-off command to the power component (43) and issues an alarm. If the data of the two second displacement monitors (71) are equal to the preset value, the next operation is performed. S2. When the wafer to be ejected is located at the center of the through hole, the electric push rod (22) first drives the arc-shaped limiting block (2) to press down other wafers in the part of the wafer to be ejected. Then the heating coil (12) starts to heat and transfers the heat to the ejector pin (45). During the pressing process of the arc-shaped limiting block (2), the first displacement monitor (7) detects its position in real time. The data processor (6) processes the monitoring data of the first displacement monitor (7) and transmits it to the central controller through the transmission device. The central controller judges the value. If the data of the two first displacement monitors (7) are not equal to the preset value, the central controller immediately issues a power cut-off command to the power component (43) and issues an alarm. If the data of the two first displacement monitors (7) are equal to the preset value, the next operation is performed. S3, the power component (43) drives the ejector pin (45) to rise, the glue between the ejector pin (45) and the blue film melts, and when the wafer separates from the blue film, the wafer is removed by the external suction cup.

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