Self-adaptive clamping system for silicon wafer film coating

Abstract

This invention provides an adaptive clamping system for silicon wafer coating, addressing the lack of existing adaptive clamping systems that can simultaneously accommodate both round and square silicon wafers, possess high-precision adaptive centering and angle adjustment functions, and effectively protect the copper plating layer. The system comprises a coating machine equipped with a receiving conveyor belt and a silicon wafer loading mechanism. A feeding platform is located at the front of the coating machine, and silicon wafers are placed on the feeding platform. A clamping seat is driven along the receiving conveyor belt, and the clamping seat is equipped with a suction cup mechanism, a circular limiting clamping mechanism, and a square limiting clamping mechanism. By incorporating the suction cup mechanism, the circular limiting clamping mechanism, and the square limiting clamping mechanism, the system can meet the needs of mixed-line production, significantly improving production efficiency, reducing equipment debugging and maintenance costs, and perfectly meeting the requirements of modern flexible manufacturing.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing equipment technology, and in particular to an adaptive clamping system for silicon wafer coating. Background Technology

[0002] In the semiconductor manufacturing and high-end photovoltaic cell production process, the silicon wafer copper plating coating process is a key step to improve the cell conversion efficiency. This process usually involves depositing a layer of metallic copper on the surface of the silicon wafer to reduce resistivity, and the coating process prevents the copper layer from oxidizing and being damaged in subsequent processing. This special process environment places stringent requirements on the transmission and clamping system: it not only requires extremely high positioning accuracy to ensure the uniformity of the coating, but also must take into account the surface cleanliness and the protection of the soft copper layer.

[0003] For the centering and clamping of silicon wafers, existing technologies mainly employ direct-contact mechanical limiting solutions, such as the "Centering Stage for a Silicon Wafer Back Sealing Machine" in publication CN118692980A. This solution uses a lead screw and slider mechanism in conjunction with helical gear transmission to drive the clamping plate to radially push and pull the silicon wafer for centering via a mechanical hard connection. This solution solves the radial positioning problem of silicon wafers to some extent. However, when applied to high-requirement silicon wafer copper plating and coating production lines, this technology still has the following significant technical defects and pain points: 1. Difficulty in compatibility with irregularly shaped silicon wafers, resulting in high production line switching costs: The centering mechanism in this technology is usually designed for a specific shape and lacks adaptability to different geometries. In actual production, in order to adapt to different types of photovoltaic cells or semiconductor devices, the production line often needs to produce round and square silicon wafers in a mixed manner. However, the existing clamping devices of this type have limited functions. When product specifications are changed, it is often necessary to stop the machine to replace the mechanical structure or adjust complex parameters. This not only leads to a significant decrease in production efficiency, but also increases the cost of equipment debugging and maintenance, which cannot meet the needs of modern flexible manufacturing.

[0004] 2. Rigid clamping easily damages silicon wafers, affecting product yield: Silicon wafers are inherently brittle and extremely sensitive to mechanical stress. However, existing clamping mechanisms often employ invasive designs with their actuators having direct, rigid mechanical contact with the edge or back of the silicon wafer to achieve positioning. This rigid compression contact presents a double hazard: Firstly, at the moment of clamping, the concentrated mechanical stress can easily cause the silicon wafer to shatter or develop microcracks, directly increasing the scrap rate. Secondly, in subsequent copper plating processes, because the silicon wafer is completely locked with no room to move, it cannot release the force through slight displacement when chemical impact or thermal stress occurs, leading to stress concentration and subsequent processing damage, severely impacting the finished product yield.

[0005] 3. Lack of angle adjustment capability makes it difficult to guarantee coating accuracy: Before copper plating, silicon wafers often need precise angle alignment. This technology can only achieve radial centering clamping. Its structural design lacks an independent rotation drive module, which cannot correct the angle deviation of the silicon wafer. This may cause the film coverage position to shift, affecting the electrical performance and consistency of the device. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an adaptive clamping system for silicon wafer coating, which solves the problem that the prior art lacks an adaptive clamping system that can simultaneously accommodate round and square silicon wafers, has high-precision adaptive centering and angle adjustment functions, and can effectively protect the copper plating layer.

[0007] To achieve the above and other related objectives, the present invention provides an adaptive clamping system for silicon wafer coating, comprising: a coating machine, wherein a receiving conveyor belt and a silicon wafer loading mechanism are mounted on the coating machine; a feeding platform is provided at the front of the coating machine, and silicon wafers are disposed on the feeding platform; a clamping seat is driven on the receiving conveyor belt; a receiving suction cup mechanism, a circular limiting clamping mechanism, and a square limiting clamping mechanism are mounted on the clamping seat; the silicon wafer loading mechanism includes a multi-joint robotic arm and a loading / unloading suction cup; the multi-joint robotic arm is mounted at the front of the coating machine, and a loading / unloading suction cup is provided at the end of the multi-joint robotic arm; and the silicon wafer loading mechanism picks up and places silicon wafers from the feeding platform onto the clamping seat.

[0008] The coating machine is used to perform coating processing on silicon wafers on the fixture. The silicon wafer loading mechanism is used to automate the picking and placing of silicon wafers through a multi-joint robotic arm and a loading / unloading suction cup. The feeding platform is used to place silicon wafers to be processed; The clamp base is used to support the suction cup mechanism, the circular limiting clamping mechanism and the square limiting clamping mechanism, and to provide installation space for them; The receiving suction cup mechanism is used to receive the silicon wafer and adjust its angle so that it corresponds to the clamping mechanism; The circular limiting clamping mechanism is used to radially limit the circular silicon wafer; The square limiting clamping mechanism is used to limit the four corners of the square silicon wafer.

[0009] Optionally, the clamp base includes a carrier mounting plate, a circular positioning plate, a slide rail groove, and a receiving disc groove. The carrier mounting plate is driven on the receiving conveyor belt. The circular positioning plate is fixed on the upper part of the carrier mounting plate. The slide rail groove is formed on the circular positioning plate and is in the shape of a star. The receiving disc groove is formed at the center of the circular positioning plate, and the receiving suction cup mechanism is disposed in the receiving disc groove.

[0010] Optionally, the receiving suction cup mechanism includes a servo motor, an output shaft, lifting slots, lifting blocks, a rotating spindle, a receiving suction cup, an annular guide rail, lifting cylinders, and a disc guide rail block. The servo motor is fixedly installed on the lower part of the carrier mounting plate. The output end of the servo motor is provided with an output shaft. The inner wall of the output shaft is provided with four lifting slots at equal intervals. Each lifting slot has a lifting block slidably installed in it. The inner sides of the four lifting blocks are fixedly connected to the rotating spindle. The upper end of the rotating spindle is fixedly installed with a receiving suction cup. The lower wall of the receiving suction cup is provided with an annular guide rail. Three disc guide rail blocks are slidably engaged in the annular guide rail, and the three disc guide rail blocks are radially equidistant from the center of the annular guide rail. Three lifting cylinders are radially equidistant from the center of the receiving disc slot, and the output ends of the three lifting cylinders are respectively fixedly connected to the lower walls of the three disc guide rail blocks. The limit extension length of the lifting cylinder is the same as the height of the lifting slot.

[0011] Optionally, the circular limiting clamping mechanism includes a first driving cylinder, a first connecting seat, a first linear rack, a first guide rail, a first driving gear, a first linkage sleeve, a first square active turntable, a first positioning pin, a first transmission L-shaped connecting rod, an arc-shaped positioning slider, a circular limiting seat, and a fixed shaft. The first driving cylinder is fixedly installed in the lower part of the carrier mounting plate. The output end of the first driving cylinder is fixed to the first connecting seat. The first linear rack is fixed between the first connecting seats. The lower part of the carrier mounting plate is fixed to the first guide rail. The first linear rack is slidably installed in the first guide rail. The inner side of the first linear rack is partially meshed with the first driving gear. The gear has a first linkage sleeve fixed to its inner wall. A first square active turntable is fixedly installed on the upper outer wall of the first linkage sleeve. Each of the four corners of the first square active turntable is rotatably mounted with a first transmission L-shaped connecting rod via a first positioning pin. The outer ends of the four first transmission L-shaped connecting rods are rotatably connected to arc-shaped positioning sliders via first positioning pins. The four arc-shaped positioning sliders are slidably installed in the four oblique grooves of the slide rail groove. A disc limiting seat is fixedly installed on the upper end of the arc-shaped positioning slider. The fixed shaft is fixedly installed at the center of the lower wall of the carrier mounting plate and passes through the inside of the first linkage sleeve. The first linkage sleeve is rotatably sleeved on the fixed shaft.

[0012] Optionally, the square limiting clamping mechanism includes a second driving cylinder, a second connecting seat, a second linear rack, a second guide rail, a second driving gear, a second linkage sleeve, a second square active turntable, a second positioning pin, a second transmission L-shaped connecting rod, a square positioning slider, and a square limiting seat. The second driving cylinder is fixedly installed in the lower part of the carrier mounting plate. The output end of the second driving cylinder is fixed to the second connecting seat, and a second linear rack is fixed between the second connecting seats. A second guide rail is fixed in the lower part of the carrier mounting plate, and the second linear rack is slidably installed on the second guide rail. Inside the guide rail, a second drive gear is partially meshed with the inner side of the second linear rack. A second linkage sleeve is fixed to the inner wall of the second drive gear. A second square drive turntable is fixedly installed on the upper outer wall of the second linkage sleeve. A second transmission L-shaped connecting rod is rotatably installed at each of the four corners of the second square drive turntable through a second positioning pin. A square positioning slider is rotatably connected to the outer ends of the four second transmission L-shaped connecting rods through a second positioning pin. The four square positioning sliders are slidably installed in the four radial grooves of the slide rail groove. A square limit seat is fixedly installed at the upper end of the square positioning slider.

[0013] Optionally, the rotating spindle is rotatably disposed within the central hole of the fixed shaft, and a bearing is provided between the rotating spindle and the fixed shaft, so that the rotation of the rotating spindle and the fixed shaft does not interfere with each other. The second linkage sleeve is sleeved on the outer wall of the first linkage sleeve, and a bidirectional rotary bearing is provided between the first linkage sleeve and the second linkage sleeve, so that the rotation of the first linkage sleeve and the second linkage sleeve does not interfere with each other.

[0014] Optionally, the first linear rack is configured to drive the first drive gear to rotate within a 90-degree range, and the second linear rack is configured to drive the second drive gear to rotate within a 90-degree range.

[0015] Optionally, the disc limiting seat has an arc-shaped block structure, and four disc limiting seats are evenly distributed along the circumference. The inner arc surfaces of the four disc limiting seats together form a cylindrical limiting space. The square limiting seat has a V-shaped block structure, and four square limiting seats are evenly distributed along the circumference. The inner corners of the four square limiting seats together form a square limiting space. The upper ends of both the disc limiting seat and the square limiting seat are provided with limiting edges, which extend inwardly.

[0016] As described above, the adaptive clamping system for silicon wafer coating of the present invention has at least the following beneficial effects: 1. By integrating a circular and a square limiting clamping mechanism on the same fixture base, and with the ingenious design of a cross-shaped slide rail groove, compatible limiting of both circular and square silicon wafers is achieved. There is no need to stop the machine to replace the mechanical structure or make complex parameter adjustments. Only the corresponding clamping mechanism action needs to be selected according to the silicon wafer specifications to meet the needs of mixed-line production. This greatly improves production efficiency, reduces equipment debugging and maintenance costs, perfectly meets the requirements of modern flexible manufacturing, and solves the problem that the clamping and positioning mechanisms in the existing technology are limited to a single silicon wafer size and shape.

[0017] 2. By setting up a suction cup mechanism, the silicon wafer is flexibly supported by vacuum adsorption, avoiding hard impact. Then, the rotating spindle driven by a servo motor can actively adjust the angle deviation of the silicon wafer to achieve adaptive centering. This ensures that the crystal orientation or specific edges of the silicon wafer are strictly aligned with the clamping limit seat and the coating process requirements. This flexible feeding method of "first accept, then adjust, and then land" eliminates the stress concentration caused by traditional mechanical hard contact, effectively preventing silicon wafer breakage, microcracks, and scratches on the copper plating layer. It significantly improves the product yield and ensures the positional accuracy and consistency of the copper plating coating, thereby ensuring the electrical performance of the device. It solves the problems of rigid clamping that easily damages the silicon wafer and copper plating layer in the existing technology, the lack of silicon wafer angle adjustment capability in the existing technology, and the film layer offset caused by feeding deviation.

[0018] 3. By setting up circular and square limiting clamping mechanisms, and using a cylinder to drive racks and gears to rotate the turntable, which in turn drives multiple sliders to move synchronously through an L-shaped connecting rod, a linkage structure is established. This ensures that the silicon wafer is subjected to balanced radial force from all sides during clamping, avoiding microcracks caused by excessive force at a single point. At the same time, the limiting edges set on the limiting seats can restrict the position of the silicon wafers, effectively preventing axial runout of the silicon wafers when subjected to chemical impact or thermal stress during the copper plating process. This ensures the stability of the clamping and limiting, while allowing the silicon wafers to have a small amount of stress release space in the radial plane, further reducing the risk of processing damage. This solves the problem of rigid clamping in existing technologies, which has no room for movement and is prone to silicon wafer breakage at the moment of clamping, and stress concentration and processing damage in subsequent copper plating processes.

[0019] 4. By integrating the suction cup mechanism, circular limit clamping mechanism and square limit clamping mechanism into the fixture seat in a coaxial manner, complex functions are integrated in a limited space, making the overall device compact and not occupying additional production line space, which is convenient for modification and deployment in existing copper plating and coating production lines. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 2This is a three-dimensional schematic diagram of the cooperation structure between the silicon wafer feeding mechanism, the unloading platform, and the fixture seat in this invention; Figure 3 This is a left-side view of the cooperation structure between the silicon wafer feeding mechanism, the unloading platform, and the fixture seat in this invention. Figure 4 This is a three-dimensional schematic diagram of the suction cup mechanism in this invention; Figure 5 This is a bottom-view perspective view of the suction cup mechanism in this invention; Figure 6 This is a three-dimensional schematic diagram of the structure in which the output shaft and the rotating spindle cooperate in this invention; Figure 7 In this invention Figure 6 Enlarged view of the structure of region A; Figure 8 This is a three-dimensional schematic diagram of the driving component of the circular limiting clamping mechanism in this invention; Figure 9 This is a three-dimensional schematic diagram of the overall structure of the circular limiting clamping mechanism in this invention; Figure 10 This is a bottom-view perspective view of the overall structure of the circular limiting clamping mechanism in this invention; Figure 11 This is a three-dimensional schematic diagram of the driving component of the square limiting clamping mechanism in this invention; Figure 12 This is a three-dimensional schematic diagram of the overall structure of the square limiting clamping mechanism in this invention; Figure 13 This is a bottom-view perspective view of the overall structure of the square limiting clamping mechanism in this invention; Figure 14 This is a three-dimensional schematic diagram of the cooperative structure of the driving components of the circular limiting clamping mechanism and the square limiting clamping mechanism in this invention; Figure 15 This is a three-dimensional schematic diagram of the cooperation structure between the circular positioning disk and the limiting seat in this invention; Figure 16 This is a three-dimensional schematic diagram of the structure in which the circular positioning disk, the limiting seat, and the receiving suction disk cooperate in this invention; Figure 17 This is a bottom-view perspective view of the structure in which the circular positioning disk, the limiting clamping mechanism, and the receiving suction cup mechanism cooperate in this invention. Figure 18 This is a three-dimensional schematic diagram of the structure in which the clamping base, clamping mechanism, and suction cup mechanism cooperate in this invention.

[0021] Component designation explanation 1. Laminating machine; 101. Receiving conveyor belt; 2. Silicon wafer loading mechanism; 201. Multi-joint robotic arm; 202. Loading and unloading suction cups; 3. Feeding platform; 4. Fixture base; 401. Carrier mounting plate; 402. Circular positioning plate; 403. Slide rail groove; 404. Guide disc groove; 5. Receiving suction cup mechanism; 501. Servo motor; 502. Output shaft; 503. Lifting slot; 504. Lifting block; 505. Rotary spindle; 506. Receiving suction cup; 507. Circular guide rail; 508. Lifting cylinder; 509. Disc guide rail block; 6. Circular limiting clamping mechanism; 601. First drive cylinder; 602. First connecting seat; 603. First linear rack; 604. First guide rail; 605. First drive gear; 606. First linkage sleeve; 607. First square drive turntable; 608. First positioning pin; 609. First transmission L-shaped connecting rod; 610. Arc-shaped positioning slider; 611. Circular limiting seat; 612. Fixed shaft; 7. Square limiting clamping mechanism; 701. Second drive cylinder; 702. Second connecting seat; 703. Second linear rack; 704. Second guide rail; 705. Second drive gear; 706. Second linkage sleeve; 707. Second square active turntable; 708. Second positioning pin; 709. Second transmission L-shaped connecting rod; 710. Square positioning slider; 711. Square limiting seat. Detailed Implementation

[0022] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0023] Please see Figures 1 to 18 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. Example 1

[0024] like Figures 1-3As shown, to achieve automated loading and unloading of silicon wafers, this embodiment provides an adaptive clamping system for silicon wafer coating, including: a coating machine 1, a receiving conveyor belt 101 and a silicon wafer loading mechanism 2 installed on the coating machine 1, a feeding platform 3 is provided at the front of the coating machine 1, and silicon wafers are placed on the feeding platform 3, a clamp seat 4 is driven on the receiving conveyor belt 101, the clamp seat 4 can move with the receiving conveyor belt 101 to different work positions, and the silicon wafer loading mechanism 2 includes a multi-joint robotic arm 201 and a loading / unloading suction cup 202. The multi-joint robotic arm 201 is installed at the front of the coating machine 1, and the loading / unloading suction cup 202 is provided at the end of the multi-joint robotic arm 201.

[0025] During operation, the multi-joint robotic arm 201 drives the loading and unloading suction cup 202 to move to the unloading platform 3 to pick up the silicon wafers, and then moves to the clamp seat 4 to release the silicon wafers, thereby realizing automatic loading. Example 2

[0026] like Figures 1-3 and Figures 15-18 As shown, in order to achieve flexible support of silicon wafers and adjust their angle to correspond with the clamping mechanism, this embodiment provides an adaptive clamping system for silicon wafer coating, which also includes: a suction cup mechanism 5. The suction cup mechanism 5 is installed on the clamping base 4. The clamping base 4 includes a carrier mounting plate 401, a circular positioning plate 402, a slide rail groove 403 and a receiving disc groove 404. The carrier mounting plate 401 is driven on the receiving conveyor belt 101. The circular positioning plate 402 is fixed on the upper part of the carrier mounting plate 401. The slide rail groove 403 is opened on the circular positioning plate 402 and is in the shape of a star to guide the sliding of the limiting component. The receiving disc groove 404 is opened at the center of the circular positioning plate 402.

[0027] More comprehensively, such as Figures 1-2 and Figures 4-7As shown, the suction cup mechanism 5 is installed in the receiving disc groove 404. The suction cup mechanism 5 includes a servo motor 501, an output shaft 502, lifting slots 503, lifting blocks 504, a rotating spindle 505, a suction cup 506, an annular guide rail 507, a lifting cylinder 508, and a disc guide rail block 509. The servo motor 501 is fixedly installed on the lower part of the carrier mounting plate 401. The output end of the servo motor 501 is provided with an output shaft 502. Four lifting slots 503 are equidistantly opened on the inner wall of the output shaft 502. A lifting block 504 is slidably installed in each lifting slot 503. The rotating spindle 505 is fixedly connected to the inner sides of the four lifting blocks 504. The suction cup 506 is fixedly installed on the upper end of the rotating spindle 505 for adsorbing silicon wafers. The lower wall of 06 is provided with an annular guide rail 507. Three disc guide rail blocks 509 are slidably engaged in the annular guide rail 507. The three disc guide rail blocks 509 are radially equidistant from the center of the annular guide rail 507. Three lifting cylinders 508 are radially equidistant from the center of the receiving disc groove 404. The output ends of the three lifting cylinders 508 are fixedly connected to the lower wall of the three disc guide rail blocks 509 respectively. The limit extension length of the lifting cylinder 508 is the same as the height of the lifting slot 503 to prevent dislodgement and ensure the accuracy of the lifting position. The spline fit structure between the lifting slot 503 and the lifting block 504 allows the rotating spindle 505 to rotate synchronously with the output shaft 502 and to move axially relative to the output shaft 502 under the push of the lifting cylinders 508.

[0028] Working principle: Before the silicon wafer is placed on the receiving suction cup 506 by the silicon wafer loading mechanism 2, the lifting cylinder 508 can be extended to push the receiving suction cup 506 to rise smoothly to the unloading height of the silicon wafer loading mechanism 2, thus receiving the silicon wafer. During this process, the receiving suction cup 506 pulls the lifting block 504 on the rotating spindle 505 to slide upward in the lifting slot 503. If the vision system detects a deviation in the silicon wafer angle, the servo motor 501 can drive the rotating spindle 505 and the receiving suction cup 506 to rotate, automatically correcting the silicon wafer angle. During the correction process, the receiving suction cup 506 rotates with the rotating spindle 505, and the annular guide rail 507 is linked, causing the disc guide block 509 to slide relative to the annular guide rail 507. Then, the receiving suction cup 506 and the silicon wafer are smoothly lowered to the clamping height, the pressure is released, and the silicon wafer can be delivered to... In this clamping and limiting mechanism, flexible vacuum adsorption of silicon wafers is achieved, avoiding hard impacts. Furthermore, the servo motor 501 drives the rotating spindle 505 to actively adjust the angle deviation of the silicon wafer, achieving adaptive centering. This ensures that the crystal orientation or specific edges of the silicon wafer are strictly aligned with the clamping and limiting seat and the coating process requirements. This flexible feeding method of "first accepting, then adjusting, and then placing" eliminates the stress concentration caused by traditional mechanical hard contact, effectively preventing silicon wafer breakage, microcracks, and scratches on the copper plating layer. It significantly improves product yield and ensures the positional accuracy and consistency of the copper plating coating, thereby ensuring the electrical performance of the device. This solves the problems of rigid clamping easily damaging silicon wafers and copper plating layers in existing technologies, the lack of silicon wafer angle adjustment capability in existing technologies, and film layer offset caused by feeding deviations. Example 3

[0029] like Figure 2 , Figures 8-10 and Figures 14-18As shown, to achieve radial positioning of circular silicon wafers, this invention provides an adaptive clamping system for silicon wafer coating, further comprising: a circular positioning clamping mechanism 6, which is mounted on a clamping base 4. The circular positioning clamping mechanism 6 includes a first driving cylinder 601, a first connecting seat 602, a first linear rack 603, a first guide rail 604, a first driving gear 605, a first linkage sleeve 606, a first square active turntable 607, a first positioning pin 608, a first transmission L-shaped connecting rod 609, an arc-shaped positioning slider 610, a circular limiting seat 611, and a fixed shaft 612. The first driving cylinder 601 is fixedly installed in the lower part of the carrier mounting plate 401. The output end of the first driving cylinder 601 is fixed to the first connecting seat 602. The first linear rack 603 is fixed between the first connecting seats 602. The first guide rail 604 is fixed in the lower part of the carrier mounting plate 401. The first linear rack 603 is slidably mounted... The first linear rack 603 is partially meshed with a first drive gear 605 inside the first guide rail 604. The inner wall of the first drive gear 605 is fixed with a first linkage sleeve 606. The upper outer wall of the first linkage sleeve 606 is fixedly installed with a first square active turntable 607. The four corners of the first square active turntable 607 are rotatably installed with first transmission L-shaped connecting rods 609 through first positioning pins 608. The outer ends of the four first transmission L-shaped connecting rods 609 are rotatably connected with arc-shaped positioning sliders 610 through first positioning pins 608. The four arc-shaped positioning sliders 610 are slidably installed in the four inclined slots of the slide rail groove 403. The upper end of the arc-shaped positioning slider 610 is fixedly installed with a disc limit seat 611. The fixed shaft 612 is fixedly installed at the center of the lower wall of the carrier mounting plate 401, and the fixed shaft 612 passes through the inside of the first linkage sleeve 606. The first linkage sleeve 606 is rotatably sleeved on the fixed shaft 612.

[0030] Working principle: When a circular silicon wafer needs to be processed, the first drive cylinder 601 is extended, which pushes the first linear rack 603 to move linearly. The first linear rack 603 drives the first drive gear 605 to mesh and rotate, which in turn drives the first linkage sleeve 606 and the first square active turntable 607 to rotate. The first square active turntable 607 pulls the arc-shaped positioning slider 610 along the inclined groove through the first transmission L-shaped connecting rod 609, so that the four disc limiting seats 611 converge towards the center or move away from each other. This causes the four disc limiting seats 611 to form an adjustable diameter cylindrical limiting space, which centers and limits the outer edge of the circular silicon wafer, but does not contact or squeeze the surface of the silicon wafer. In this way, it is ensured that the silicon wafer is subjected to a balanced radial force from all sides during the clamping process, avoiding microcracks caused by excessive force at a single point. Example 4

[0031] like Figure 2 and Figures 11-18As shown, to achieve four-corner positioning of a square silicon wafer, this embodiment provides an adaptive clamping system for silicon wafer coating, which further includes: a square positioning clamping mechanism 7. The square positioning clamping mechanism 7 is mounted on the clamping base 4. The square positioning clamping mechanism 7 includes a second drive cylinder 701, a second connecting seat 702, a second linear rack 703, a second guide rail 704, a second drive gear 705, a second linkage sleeve 706, a second square active turntable 707, a second positioning pin 708, a second transmission L-shaped connecting rod 709, a square positioning slider 710, and a square limiting seat 711. The second drive cylinder 701 is fixedly installed in the lower part of the carrier mounting plate 401. The output end of the second drive cylinder 701 is fixed with the second connecting seat 702. The second linear rack 703 is fixed between the second connecting seats 702. A second guide rail 704 is fixedly installed in the lower part of the disk 401. A second linear rack 703 is slidably installed in the second guide rail 704. A second drive gear 705 is partially meshed with the inner side of the second linear rack 703. A second linkage sleeve 706 is fixed to the inner wall of the second drive gear 705. A second square active turntable 707 is fixedly installed on the upper outer wall of the second linkage sleeve 706. A second transmission L-shaped connecting rod 709 is rotatably installed at each of the four corners of the second square active turntable 707 through a second positioning pin 708. A square positioning slider 710 is rotatably connected to the outer ends of the four second transmission L-shaped connecting rods 709 through a second positioning pin 708. The four square positioning sliders 710 are slidably installed in the four radial grooves of the slide rail groove 403 respectively. A square limit seat 711 is fixedly installed at the upper end of the square positioning slider 710.

[0032] More comprehensively, such as Figures 9-10 , Figure 15 and Figure 17 As shown, the rotating spindle 505 is rotatably disposed within the central hole of the fixed shaft 612, and a bearing is provided between the rotating spindle 505 and the fixed shaft 612. The rotation of the rotating spindle 505 and the fixed shaft 612 does not interfere with each other. The second linkage sleeve 706 is sleeved on the outer wall of the first linkage sleeve 606, and a bidirectional rotary bearing is provided between the first linkage sleeve 606 and the second linkage sleeve 706. The rotation of the first linkage sleeve 606 and the second linkage sleeve 706 does not interfere with each other. The multi-layer structure of coaxial sleeves greatly saves space, allowing three independent functional mechanisms to be compactly integrated into the same fixture seat 4.

[0033] More comprehensively, such as Figures 8-14 and Figure 17 As shown, the first linear rack 603 is configured to drive the first drive gear 605 to rotate within a range of ninety degrees, and the second linear rack 703 is configured to drive the second drive gear 705 to rotate within a range of ninety degrees, which can realize the opening and closing control of the disc limit seat 611 and the square limit seat 711, ensuring that the clamping action is within the effective range.

[0034] More comprehensively, such as Figures 9-10 , Figures 12-13 , Figures 15-16 and Figure 18 As shown, the circular limiting seat 611 has an arc-shaped block structure. The four circular limiting seats 611 are evenly distributed along the circumference. The inner arc surfaces of the four circular limiting seats 611 together form a cylindrical limiting space, which is suitable for limiting the circular silicon wafer. The square limiting seat 711 has a V-shaped block structure. The four square limiting seats 711 are evenly distributed along the circumference. The inner corners of the four square limiting seats 711 together form a square limiting space, which is suitable for limiting the four corners of the square silicon wafer. The upper ends of both the circular limiting seat 611 and the square limiting seat 711 are provided with limiting edges. The limiting edges protrude inward and extend, providing a certain buffer space for the silicon wafer while preventing the silicon wafer from being impacted by the liquid during the copper plating process, causing axial jump and detachment from the limiting seat.

[0035] Working principle: When a square silicon wafer needs to be processed, the second drive cylinder 701 extends, pushing the second linear rack 703 to move linearly. The second linear rack 703 drives the second drive gear 705 to rotate, which in turn drives the second linkage sleeve 706 and the second square active turntable 707 to rotate. The second square active turntable 707 pushes the square positioning slider 710 to slide along the radial groove through the second transmission L-shaped connecting rod 709, causing the four square limiting seats 711 to converge towards the center and abut against the four right angles of the square silicon wafer, thereby achieving centering and limiting of the square silicon wafer. In this way, the circular limiting clamping mechanism 6 and the square limiting clamping mechanism 7 are integrated on the same fixture, and the ingenious design of the star-shaped slide rail groove 403 is combined with this. This technology achieves compatible positioning of both round and square silicon wafers, eliminating the need for downtime to replace mechanical structures or perform complex parameter adjustments. Simply selecting the appropriate clamping mechanism action based on the wafer specifications is sufficient to meet the needs of mixed-line production, significantly improving production efficiency and reducing equipment debugging and maintenance costs. It perfectly aligns with the requirements of modern flexible manufacturing, solving the problem of limited applicable wafer sizes and shapes in existing clamping and positioning mechanisms. Furthermore, the flexible non-contact protection of the positioning seat restricts only the wafer's degrees of freedom without contacting the wafer surface, completely avoiding physical scratches and stress damage to the copper plating layer on the wafer surface. At the same time, it allows for a small elastic deformation space under the impact of the chemical solution, preventing stress concentration that could lead to microcracks.

[0036] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0037] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An adaptive clamping system for silicon wafer coating, characterized in that, include: A coating machine (1) is equipped with a receiving conveyor belt (101) and a silicon wafer loading mechanism (2). A feeding platform (3) is provided at the front of the coating machine (1), and silicon wafers are provided on the feeding platform (3). A clamp seat (4) is driven on the receiving conveyor belt (101). A receiving suction cup mechanism (5), a circular limiting clamping mechanism (6) and a square limiting clamping mechanism (7) are installed on the clamp seat (4). The silicon wafer loading mechanism (2) includes a multi-joint robotic arm (201) and a loading / unloading execution suction cup (202). The multi-joint robotic arm (201) is installed at the front of the coating machine (1). The end of the multi-joint robotic arm (201) is provided with a loading / unloading execution suction cup (202). The silicon wafer loading mechanism (2) picks up and places silicon wafers from the feeding platform (3) and places them on the clamp seat (4). The coating machine (1) is used to coat silicon wafers on the fixture (4); The silicon wafer loading mechanism (2) is used to automatically pick up and place silicon wafers through a multi-joint robotic arm (201) and a loading / unloading suction cup (202); The feeding platform (3) is used to place the silicon wafers to be processed; The clamp base (4) is used to support the suction cup mechanism (5), the circular limiting clamping mechanism (6) and the square limiting clamping mechanism (7), and to provide installation space for them; The receiving suction cup mechanism (5) is used to receive the silicon wafer and adjust its angle so that it corresponds to the clamping mechanism; The circular limiting clamping mechanism (6) is used to radially limit the circular silicon wafer; The square limiting clamping mechanism (7) is used to limit the four corners of the square silicon wafer.

2. The adaptive clamping system for silicon wafer coating according to claim 1, characterized in that: The clamp base (4) includes a carrier mounting plate (401), a circular positioning plate (402), a slide rail groove (403), and a receiving disc groove (404). The carrier mounting plate (401) is driven on the receiving conveyor belt (101). The circular positioning plate (402) is fixed on the upper part of the carrier mounting plate (401). The slide rail groove (403) is opened on the circular positioning plate (402) and the slide rail groove (403) is in the shape of a star. The receiving disc groove (404) is opened at the center of the circular positioning plate (402). The receiving suction cup mechanism (5) is set in the receiving disc groove (404).

3. The adaptive clamping system for silicon wafer coating according to claim 2, characterized in that: The receiving suction cup mechanism (5) includes a servo motor (501), an output shaft (502), lifting slots (503), lifting blocks (504), a rotating spindle (505), a receiving suction cup (506), an annular guide rail (507), a lifting cylinder (508), and a disc guide block (509). The servo motor (501) is fixedly installed on the lower part of the carrier mounting plate (401). The output end of the servo motor (501) is provided with an output shaft (502). The inner wall of the output shaft (502) is provided with four lifting slots (503) at equal intervals. Each lifting slot (503) is slidably installed with a lifting block (504). The inner sides of the four lifting blocks (504) are fixedly connected. A rotating spindle (505) is connected to the upper end of the rotating spindle (505), and a suction cup (506) is fixedly installed on the upper end of the suction cup (506). An annular guide rail (507) is provided on the lower wall of the suction cup (506). Three disc guide blocks (509) are slidably engaged in the annular guide rail (507), and the three disc guide blocks (509) are radially equidistant from the center of the annular guide rail (507). Three lifting cylinders (508) are radially equidistant from the center of the receiving disc groove (404), and the output ends of the three lifting cylinders (508) are fixedly connected to the lower wall of the three disc guide blocks (509). The limit extension length of the lifting cylinder (508) is the same as the height of the lifting groove (503).

4. The adaptive clamping system for silicon wafer coating according to claim 3, characterized in that: The circular limiting clamping mechanism (6) includes a first driving cylinder (601), a first connecting seat (602), a first linear rack (603), a first guide rail (604), a first driving gear (605), a first linkage sleeve (606), a first square active turntable (607), a first positioning pin (608), a first transmission L-shaped connecting rod (609), an arc-shaped positioning slider (610), a circular limiting seat (611), and a fixed shaft (612). The first driving cylinder ( 601) Fixedly installed in the lower part of the vehicle mounting plate (401), the output end of the first drive cylinder (601) is fixed with a first connecting seat (602), a first linear rack (603) is fixed between the first connecting seats (602), a first guide rail (604) is fixed in the lower part of the vehicle mounting plate (401), the first linear rack (603) is slidably installed in the first guide rail (604), and the inner side of the first linear rack (603) is partially meshed with a A first drive gear (605) has a first linkage sleeve (606) fixed to its inner wall. A first square drive turntable (607) is fixedly installed on the upper outer wall of the first linkage sleeve (606). A first transmission L-shaped connecting rod (609) is rotatably installed at each of the four corners of the first square drive turntable (607) through a first positioning pin (608). The outer ends of the four first transmission L-shaped connecting rods (609) are rotatably connected through the first positioning pin (608). There are arc-shaped positioning sliders (610), and four arc-shaped positioning sliders (610) are slidably installed in four inclined grooves of the slide rail groove (403). A disc limiting seat (611) is fixedly installed on the upper end of the arc-shaped positioning slider (610). The fixed shaft (612) is fixedly installed at the center of the lower wall of the carrier mounting plate (401), and the fixed shaft (612) passes through the inside of the first linkage sleeve (606). The first linkage sleeve (606) is rotatably sleeved on the fixed shaft (612).

5. The adaptive clamping system for silicon wafer coating according to claim 4, characterized in that: The square limiting clamping mechanism (7) includes a second driving cylinder (701), a second connecting seat (702), a second linear rack (703), a second guide rail (704), a second driving gear (705), a second linkage sleeve (706), a second square active turntable (707), a second positioning pin (708), a second transmission L-shaped connecting rod (709), a square positioning slider (710), and a square limiting seat (711). The second driving cylinder (701) is fixedly installed in the lower part of the carrier mounting plate (401). The output end of the second driving cylinder (701) is fixed with the second connecting seat (702). The second linear rack (703) is fixed between the second connecting seats (702). The second guide rail (704) is fixed in the lower part of the carrier mounting plate (401). The second linear rack (703) slides... Installed in the second guide rail (704), the second linear rack (703) is partially meshed with the second drive gear (705), the inner wall of the second drive gear (705) is fixed with the second linkage sleeve (706), the upper outer wall of the second linkage sleeve (706) is fixedly installed with the second square active turntable (707), the four corners of the second square active turntable (707) are rotatably installed with the second transmission L-shaped connecting rod (709) through the second positioning pin (708), the outer ends of the four second transmission L-shaped connecting rods (709) are rotatably connected with the square positioning slider (710) through the second positioning pin (708), the four square positioning sliders (710) are respectively slidably installed in the four radial grooves of the slide rail groove (403), and the upper end of the square positioning slider (710) is fixedly installed with the square limit seat (711).

6. The adaptive clamping system for silicon wafer coating according to claim 5, characterized in that: The rotating spindle (505) is rotatably disposed in the center hole of the fixed shaft (612), and a bearing is provided between the rotating spindle (505) and the fixed shaft (612). The rotation of the rotating spindle (505) and the fixed shaft (612) does not interfere with each other. The second linkage sleeve (706) is sleeved on the outer wall of the first linkage sleeve (606), and a bidirectional rotary bearing is provided between the first linkage sleeve (606) and the second linkage sleeve (706). The rotation of the first linkage sleeve (606) and the second linkage sleeve (706) does not interfere with each other.

7. The adaptive clamping system for silicon wafer coating according to claim 6, characterized in that: The first linear rack (603) is configured to drive the first drive gear (605) to rotate within a range of ninety degrees, and the second linear rack (703) is configured to drive the second drive gear (705) to rotate within a range of ninety degrees.

8. The adaptive clamping system for silicon wafer coating according to claim 7, characterized in that: The disc limiting seat (611) has an arc-shaped block structure. The four disc limiting seats (611) are evenly distributed along the circumference. The inner arc surfaces of the four disc limiting seats (611) together form a cylindrical limiting space. The square limiting seat (711) has a V-shaped block structure. The four square limiting seats (711) are evenly distributed along the circumference. The inner corners of the four square limiting seats (711) together form a square limiting space. The upper ends of both the disc limiting seat (611) and the square limiting seat (711) are provided with limiting edges, which extend inward.

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