A power semiconductor module package with integrated heat spreading structure

Abstract

The application relates to the technical field of semiconductor modules, and particularly relates to a power semiconductor module package with an integrated heat dissipation structure, which comprises a frame, a top plate, an insulating substrate, a partition plate, an evaporation assembly, a heat conduction support assembly, a liquid return channel, a heat exchange assembly and a converging assembly. The partition plate and the inner bottom surface of the frame form a containing cavity, and a working medium is arranged in the containing cavity. The evaporation assembly is arranged at the central position of the partition plate. The heat conduction support assembly is arranged at the top of both ends of the evaporation assembly, is used for supporting and fixing the end part of the insulating substrate, and transmits heat to the evaporation assembly. The bottom and the top of the liquid return channel are respectively communicated with the containing cavity and the upper part of the inner cavity of the frame. The heat exchange assembly is arranged on the inner wall of the top of the frame, and is used for condensing working medium steam. The converging assembly is arranged on the inner side wall of the upper part of the frame, and is used for guiding working medium steam and working medium liquid. The application realizes the integration of high-efficiency phase-change heat dissipation and composite protection functions, reduces the overall thermal resistance of the module, and improves the power density and reliability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor module technology, specifically a power semiconductor module package with an integrated heat dissipation structure. Background Technology

[0002] Power semiconductor modules, especially new power modules represented by insulated-gate bipolar transistors (IGBTs) and silicon carbide metal-oxide-semiconductor field-effect transistors (SiC MOSFETs), are core components of modern power electronic systems and are widely used in high-power-density fields such as electric vehicles, rail transportation, industrial frequency conversion, and new energy power generation. These modules typically consist of multiple power semiconductor chips fixed to an insulating substrate by soldering or sintering, with bonding wires used to electrically connect the chips to external circuits, and then the entire module is encapsulated within a protective frame.

[0003] In existing technologies, to protect chips, bonding wires, and insulating substrates from damage caused by moisture, corrosive gases, and mechanical vibration, while providing necessary electrical insulation to withstand high voltage, mainstream packaging solutions commonly use silicone gel as the internal potting material. Silicone gel is a soft material with high dielectric strength (typically greater than 20 kV / mm) and low elastic modulus. It can fill all gaps inside the module, effectively preventing partial discharge and buffering the mechanical stress generated during temperature cycling due to the mismatch in thermal expansion coefficients between the chip, solder layer, insulating substrate, and frame (for example, the thermal expansion coefficient of silicon chips is approximately 2.6 ppm / °C, while that of copper substrates or aluminum silicon carbide frames is approximately 7-17 ppm / °C). This protects the fragile bonding wire roots from fatigue fracture.

[0004] However, as power semiconductor devices evolve towards higher power densities and higher junction temperatures (e.g., SiC devices can exceed 175°C), the limitations of existing silicon gel encapsulation technology are becoming increasingly apparent. First, silicon gel has extremely low thermal conductivity, only 0.15-0.3 W / m·K, forming a significant thermal barrier. Heat generated by the chip must pass through this low-thermal-conductivity gel layer before being transferred to an external heat sink, leading to increased chip junction temperature and limiting module output power and long-term reliability. Second, silicon gel undergoes thermal oxidation and aging under long-term high-temperature operating conditions (typically exceeding 125°C), gradually hardening and cracking. This not only results in the loss of its original mechanical buffering capacity but also introduces the risk of partial discharge due to crack formation, becoming one of the main causes of module failure.

[0005] To address the aforementioned heat dissipation bottlenecks, existing technologies often employ methods such as adding independent air-cooled heat sinks, heat pipes, or liquid cooling plates external to the module to enhance heat dissipation. While these solutions effectively reduce the thermal resistance from the external heat sink to the environment, they fail to resolve the heat conduction bottleneck within the chip packaging layer, i.e., from the chip's top surface to the module's outer shell. The area between the chip junction temperature and the module's outer shell still contains multiple layers, including a silicone gel layer, an insulating substrate, and solder layers, resulting in a still high total thermal resistance. Furthermore, some existing technologies attempt to directly integrate phase-change heat dissipation structures (such as microchannel cold plates or heat pipes) within the module. However, these solutions often lead to complex module structures, sealing difficulties, and high manufacturing costs. They also typically cannot simultaneously provide or replace the multiple functions offered by silicone gel, such as electrical insulation, mechanical buffering, and all-around protection, making widespread application in industrial practice difficult.

[0006] Therefore, how to fundamentally overcome the heat dissipation bottleneck inside the packaging layer and achieve efficient, compact, and highly reliable power semiconductor module packaging while maintaining or even enhancing the electrical insulation performance and mechanical reliability of existing packaging structures is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0007] The purpose of this invention is to provide a power semiconductor module package with an integrated heat dissipation structure to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A power semiconductor module package with an integrated heat dissipation structure includes a frame, a top plate detachably mounted on the top of the frame, an insulating substrate mounted in the middle of the inner cavity of the frame, and further includes:

[0010] A partition is connected to the lower part of the inner cavity of the sealing frame. The bottom of the partition and the inner bottom surface of the sealing frame form a receiving cavity, which is filled with working fluid.

[0011] An evaporation assembly, installed in the center of the partition, is used to collect the heat emitted by the insulating substrate and drive the working fluid to evaporate;

[0012] The thermally conductive support assembly is installed at the top of both ends of the evaporation assembly to support and fix the ends of the insulating substrate and transfer the heat of the insulating substrate to the evaporation assembly.

[0013] The return liquid channel is located inside the two side frames of the sealing frame. The bottom of the return liquid channel is connected to the top of the receiving cavity, and the top of the return liquid channel is connected to the upper part of the inner cavity of the sealing frame.

[0014] A heat exchange assembly is installed on the top inner wall of the sealing frame. The heat exchange assembly is located near the top inlet of the return liquid channel and is used to condense and collect the working fluid vapor.

[0015] A converging assembly is installed on the upper inner sidewall of the sealing frame. The converging assembly is disposed between the insulating substrate and the top inlet of the return liquid channel. It is used to guide the working fluid vapor from below to the upper surface of the insulating substrate and to guide the working fluid liquid from above to the top inlet of the return liquid channel.

[0016] As a further embodiment of the present invention: the evaporation assembly includes a heat collection plate and an energy-concentrating plate. The heat collection plate has a V-shaped structure with a central concave section. A heat-conducting cylinder is connected to the center of the heat collection plate. The bottom end of the heat-conducting cylinder extends to the bottom end of the receiving cavity. The energy-concentrating plate is fitted to the bottom end of the heat collection plate. A slot for the heat-conducting cylinder to pass through is provided in the center of the energy-concentrating plate. The heat collection plate and the heat-conducting cylinder are made of a material with good thermal conductivity, while the energy-concentrating plate is made of a material with poor thermal conductivity.

[0017] As a further embodiment of the present invention: the bottom of the energy-concentrating plate is integrally formed with guide plates on both sides of the heat-conducting cylinder, the two guide plates are distributed in a figure-eight shape, and a number of holes are evenly distributed on the heat-conducting cylinder.

[0018] As a further embodiment of the present invention: the partition plate has a placement groove in the center that is adapted to the shape and size of the energy-concentrating plate, the edge of the partition plate is installed in the placement groove, and the two ends of the heat collection plate are integrally formed with mounting plates, which are installed on the top of the two ends of the partition plate.

[0019] As a further embodiment of the present invention: the thermally conductive support assembly includes a support cylinder and a clamping plate. The bottom of the support cylinder is mounted on the top of the mounting plate. An elastic pad and a thermally conductive column are respectively provided in the lower and upper parts of the inner cavity of the support cylinder. A lower clamping pad is provided at the top of the support cylinder around the thermally conductive column. The longitudinal section of the clamping plate is right-angled. An upper clamping pad is provided in the inner circumference of the clamping plate. The clamping plate is detachably mounted on the support cylinder by bolts. The end of the insulating substrate is clamped between the lower clamping pad and the upper clamping pad. The top of the thermally conductive column abuts against the bottom of the insulating substrate. The lower outer wall of the thermally conductive column slides against the inner wall of the support cylinder. The support cylinder is made of a material with good thermal conductivity.

[0020] As a further embodiment of the present invention: the top inner wall of the sealing frame is provided with an embedding groove, the heat exchange assembly includes a heat exchange plate installed in the embedding groove, a capillary core layer is provided on the side of the heat exchange plate near the inner cavity of the sealing frame, and a number of fins are evenly distributed and connected on the other side of the heat exchange plate, with the other end of the fins extending through and beyond the sealing frame.

[0021] As a further embodiment of the present invention: the inner wall of the embedded groove is provided with a sealing assembly, the sealing assembly includes a sealing plate and an extension plate integrally formed and connected to the top of the sealing plate, the sealing plate wraps around the heat exchange plate, the inner top surface and inner bottom surface of the sealing plate are provided with positioning slots, the top and bottom ends of the heat exchange plate are provided with positioning blocks that cooperate with the positioning slots, the side of the sealing plate is provided with through holes for the fins to pass through, and the extension plate is clamped between the top edge of the sealing frame and the bottom edge of the bottom edge.

[0022] As a further embodiment of the present invention: the converging assembly includes a vertical plate, a first inclined plate integrally formed and connected to the bottom end of the vertical plate, and a second inclined plate integrally formed and connected to the top end of the vertical plate. The vertical plate is detachably installed on the inner side wall of the sealing frame. One end of the first inclined plate is inclined downward toward the center of the insulating substrate, and one end of the second inclined plate is inclined upward toward the center of the top plate. The top end of the second inclined plate is aligned with the top inlet of the return liquid channel. A ceramic heat insulation layer is installed at the bottom end of the first inclined plate.

[0023] The present invention has the following advantages:

[0024] 1. This invention, through the synergistic effect of the sealing frame, the top plate, the partition, the evaporation assembly, the thermally conductive support assembly, the liquid return channel, the heat exchange assembly, and the converging assembly, constructs a packaging system integrating efficient phase change heat dissipation and composite protection functions. This effectively solves the problems of heat dissipation bottlenecks caused by the poor thermal conductivity of silicon gel in existing power semiconductor modules, as well as the aging and failure of silicon gel at high temperatures. By having the thermally conductive pillars in the thermally conductive support assembly directly abut against the bottom of the insulating substrate, a low thermal resistance solid-state thermal conduction path is established from the chip to the evaporation assembly. Simultaneously, the elastic pad absorbs the mechanical stress generated during thermal cycling, replacing the mechanical buffering function of traditional silicon gel. The partition constructs an independent receiving cavity in the lower part of the inner cavity of the sealing frame and encapsulates the working fluid. The evaporation assembly, through the V-shaped structure of its heat collection plate and the energy-concentrating plate with poor thermal conductivity, concentrates heat to the working fluid in the receiving cavity, causing the working fluid to rapidly boil and evaporate in a localized area. This efficiently converts the heat generated by the chip into latent heat of phase change for transfer, completely eliminating the thermal barrier of traditional silicon gel.

[0025] 2. The working fluid vapor generated by evaporation rises in the upper part of the inner cavity of the sealing frame and, guided by the converging component, directly impacts the upper surface of the insulating substrate, providing forced convection heat dissipation for the chip and bonding wires, achieving double-sided cooling of the chip. The vapor condenses and releases heat on the heat exchange plate of the heat exchange component, and the heat is conducted to the outside of the module through the fins. The condensed liquid working fluid is collected by the capillary core layer of the heat exchange plate and guided to the top inlet of the return liquid channel via the converging component. It then flows back to the receiving cavity along the return liquid channel, forming a self-circulating working fluid system that is entirely driven by heat and capillary force, requiring no external pump or fan, resulting in good automation.

[0026] 3. The partition and the sealing frame together form a sealed space to contain the working fluid. The sealing assembly ensures a reliable seal between the heat exchange assembly and the sealing frame through the cooperation of the sealing plate, positioning slot, and positioning block. The insulation structure in the heat-conducting support assembly and the ceramic heat insulation layer installed at the bottom of the converging assembly construct a multi-layer electrical insulation system to prevent the risk of high-voltage discharge. The clamping plate and the support cylinder are detachably connected by bolts, and the top plate and the sealing frame are detachably installed, making the module maintainable.

[0027] 4. Based on completely replacing the electrical insulation, mechanical buffering, moisture-proof and corrosion-proof functions of traditional silicone gel, this invention further integrates double-sided phase change heat dissipation, heat flow concentration, zero-energy working fluid circulation and disassembly and maintenance functions, which significantly reduces the overall thermal resistance from the chip to the outside of the module and improves the power density and high-temperature operating reliability of the module. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall internal structure of an embodiment of the present invention.

[0029] Figure 2 This is a schematic diagram of the heat exchange component in an embodiment of the present invention.

[0030] Figure 3 This is a schematic diagram of the sealing assembly in an embodiment of the present invention.

[0031] Figure 4 This is a schematic diagram of the heat collection plate in an embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram of the energy-concentrating plate in an embodiment of the present invention.

[0033] Figure 6 This is a schematic diagram of the evaporation component in an embodiment of the present invention.

[0034] Figure 7 This is a schematic diagram of the convergence component in an embodiment of the present invention.

[0035] Figure 8 for Figure 1 Enlarged diagram of part A in the image.

[0036] Figure 9 for Figure 1 Enlarged diagram of part B in the image.

[0037] In the diagram: 1. Sealing frame; 101. Top plate; 102. Partition plate; 103. Receiving cavity; 104. Sealing sleeve; 105. Liquid return channel; 106. Placement slot; 107. Embedding slot; 2. Evaporation assembly; 201. Heat collection plate; 202. Heat conduction cylinder; 203. Hole; 204. Mounting plate; 205. Energy concentrator; 206. Slot; 207. Guide plate; 3. Insulating substrate; 301. Semiconductor element; 302. Terminal; 4. Heat exchange assembly; 401. Heat exchange plate; 402, Fin; 403, Capillary Core Layer; 404, Positioning Insert; 5, Converging Assembly; 501, Vertical Plate; 502, First Inclined Plate; 503, Second Inclined Plate; 504, Ceramic Insulation Layer; 6, Thermal Conductive Support Assembly; 601, Support Cylinder; 602, Clamping Plate; 603, Thermal Conductive Column; 604, Elastic Pad; 605, Lower Clamping Pad; 606, Upper Clamping Pad; 7, Sealing Assembly; 701, Sealing Plate; 702, Through Hole; 703, Extension Plate; 704, Positioning Slot. Detailed Implementation

[0038] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0040] Example 1: Please refer to Figures 1 to 9A power semiconductor module package with an integrated heat dissipation structure includes a frame 1. A top plate 101 is detachably mounted on the top of the frame 1. The top plate 101 is connected to the frame 1 by bolts or clips. An insulating substrate 3 is mounted in the middle of the inner cavity of the frame 1. The insulating substrate 3 is made of ceramic material, such as aluminum nitride or aluminum oxide, and its upper and lower surfaces are coated with copper layers for circuit connection. A semiconductor element 301 is mounted on the top of the insulating substrate 3. The semiconductor element 301 is fixed to the top of the insulating substrate 3 by a solder layer or a sintered silver layer. The semiconductor element 301 is electrically connected to the top of the semiconductor element 301 via a bonding wire. The top of the terminal 302 extends through the top plate 101 to the outside of the enclosure 1. A sealing sleeve 104 is provided at the connection between the terminal 302 and the top plate 101. The sealing sleeve 104 is made of fluororubber or perfluoroether rubber, and its inner wall is press-fitted with the outer wall of the terminal 302. Its outer wall is press-fitted with the inner wall of the through hole in the top plate 101. The sealing sleeve 104 can prevent the working fluid vapor from leaking out. It also includes:

[0041] A partition 102 is connected to the lower part of the inner cavity of the sealing frame 1. The partition 102 is fixedly connected to the inner wall of the sealing frame 1 by welding or laser sealing welding. A receiving cavity 103 is formed between the bottom of the partition 102 and the inner bottom surface of the sealing frame 1. The receiving cavity 103 is filled with a working medium, which is a perfluorocarbon liquid, and the filling volume is 30%-50% of the volume of the receiving cavity 103.

[0042] Evaporation assembly 2 is installed in the center of partition 102 to collect the heat emitted by insulating substrate 3 and drive the working fluid to evaporate;

[0043] The thermally conductive support assembly 6 is installed at the top of both ends of the evaporation assembly 2 to support and fix the ends of the insulating substrate 3 and transfer the heat of the insulating substrate 3 to the evaporation assembly 2.

[0044] The return channel 105 is located inside the two side frames of the sealing frame 1. The bottom of the return channel 105 is connected to the top of the receiving cavity 103, and the top of the return channel 105 is connected to the upper part of the inner cavity of the sealing frame 1.

[0045] The heat exchange component 4 is installed on the top inner side wall of the sealing frame 1. The heat exchange component 4 is located near the top inlet of the return liquid channel 105 and is used to condense and collect the working fluid vapor.

[0046] The converging component 5 is installed on the upper inner side wall of the sealing frame 1. The converging component 5 is disposed between the insulating substrate 3 and the top inlet of the return liquid channel 105. It is used to guide the working fluid vapor from below to the upper surface of the insulating substrate 3 and to guide the working fluid liquid from above to the top inlet of the return liquid channel 105.

[0047] The evaporation assembly 2 includes a heat collection plate 201 and an energy-concentrating plate 205. The heat collection plate 201 has a V-shaped structure with a central concave section. The lowest point of this V-shaped structure is fixedly connected to the top of the heat-conducting cylinder 202, which can be achieved by welding or integral molding. The heat-conducting cylinder 202 is connected to the center of the heat collection plate 201, and the top of the heat-conducting cylinder 202 is welded and fixed to the center of the heat collection plate 201. The bottom end of the heat-conducting cylinder 202 extends to the bottom end of the receiving cavity 103. A gap of 0.2-0.5 mm is left between the bottom end of the heat-conducting cylinder 202 and the inner bottom surface of the sealing frame 1 to ensure that the working fluid can enter from the bottom of the heat-conducting cylinder 202. The energy-concentrating plate 205 is attached to the bottom end of the heat-collecting plate 201, with the top surface of the energy-concentrating plate 205 and the bottom surface of the heat-collecting plate 201 in contact. The two are fixed by bolts or pressed together by a limiting structure. A slot 206 is provided in the center of the energy-concentrating plate 205 for the heat-conducting cylinder 202 to pass through. The heat-collecting plate 201 and the heat-conducting cylinder 202 are made of materials with good thermal conductivity. In this embodiment, the heat-collecting plate 201 and the heat-conducting cylinder 202 are made of copper alloy or oxygen-free copper, and the surface can be plated with nickel to improve corrosion resistance. The energy-concentrating plate 205 is made of materials with poor thermal conductivity. The energy-concentrating plate 205 can be made of stainless steel or titanium alloy. The bottom of the energy-concentrating plate 205 is integrally formed with guide plates 207 on both sides of the heat-conducting cylinder 202. The two guide plates 207 are distributed in a figure-eight shape. The lower ends of the guide plates 207 open to both sides at an angle of 60°-90° to concentrate heat to the bottom of the heat-conducting cylinder 202. The heat-conducting cylinder 202 is evenly distributed with a number of holes 203. The diameter of the holes 203 is 0.5-1.0mm. They are evenly distributed in 2-4 rows along the circumference of the heat-conducting cylinder 202 and in 3-5 layers along the axial direction. The partition 102 has a placement groove 106 in the center that matches the shape and size of the energy-concentrating plate 205. The edge of the energy-concentrating plate 205 is installed in the placement groove 106. A high-temperature resistant sealant or metal sealing ring is provided between the edge of the energy-concentrating plate 205 and the inner wall of the placement groove 106 to prevent the working fluid vapor from leaking from the edge. The two ends of the heat collection plate 201 are integrally formed with mounting plates 204. The mounting plates 204 are installed on the top of both ends of the partition 102. A heat-conducting pad is provided between the mounting plates 204 and the top of both ends of the partition 102 and is fixedly connected by bolts.

[0048] The heat collection plate 201 absorbs radiant heat from the bottom of the insulating substrate 3 and conductive heat from the thermally conductive support assembly 6. The heat energy is collected in the working fluid liquid around the heat-conducting cylinder 202, causing the working fluid liquid around the heat-conducting cylinder 202 to evaporate into steam. Then, the working fluid steam moves upward through the heat-conducting cylinder 202 and contacts the bottom end of the insulating substrate 3. The heat and working fluid steam are guided into the heat-conducting cylinder 202 by the energy-concentrating plate 205 and the guide plate 207. The heat transfer efficiency is improved by setting the holes 203, and the working fluid steam can enter the upper part of the inner cavity of the heat-conducting cylinder 202 better.

[0049] The thermally conductive support assembly 6 includes a support cylinder 601 and a clamping plate 602. The bottom of the support cylinder 601 is mounted on the top of the mounting plate 204. The bottom of the support cylinder 601 is fixed to the top of the mounting plate 204 by welding or threaded connection. The lower and upper parts of the inner cavity of the support cylinder 601 are respectively provided with an elastic pad 604 and a thermally conductive column 603. The elastic pad 604 is a wave spring or a disc spring. Its bottom contacts the bottom surface of the inner cavity of the support cylinder 601, and its top contacts the bottom end of the thermally conductive column 603. The lower outer wall of the thermally conductive column 603 slides against the inner wall of the support cylinder 601. The top of the support cylinder 601 is provided with a lower clamping pad 605 located around the thermally conductive column 603. The lower clamping pad 605 is made of high-temperature resistant thermally conductive silicone or flexible graphite material. Its top surface contacts the bottom edge of the insulating substrate 3. The longitudinal section of the clamping plate 602 is right-angled. The inner circumference of the clamping plate 602 is provided with... An upper clamping pad 606 is made of the same material as the lower clamping pad 605, and its bottom surface contacts the top edge of the insulating substrate 3. The clamping plate 602 is detachably mounted on the support cylinder 601 by bolts. The horizontal section of the clamping plate 602 is fixedly connected to the side of the support cylinder 601 by bolts. The vertical section of the clamping plate 602 extends downward and covers the end of the insulating substrate 3. The end of the insulating substrate 3 is clamped between the lower clamping pad 605 and the upper clamping pad 606. The top of the heat-conducting pillar 603 abuts against the bottom of the insulating substrate 3. A thin indium sheet or thermal grease can be provided between the top of the heat-conducting pillar 603 and the bottom of the insulating substrate 3 to reduce the contact thermal resistance. The lower outer wall of the heat-conducting pillar 603 slides against the inner wall of the support cylinder 601. The support cylinder 601 is made of a material with good thermal conductivity. The support cylinder 601 can be made of copper alloy or oxygen-free copper.

[0050] The top inner wall of the sealing frame 1 is provided with an embedding groove 107, which is an annular groove and is continuously arranged along the inner walls of the sealing frame 1. The heat exchange assembly 4 includes a heat exchange plate 401 installed in the embedding groove 107. The heat exchange plate 401 is made of copper or aluminum and its external dimensions are adapted to the embedding groove 107. A capillary core layer 403 is connected to one side of the heat exchange plate 401 near the inner cavity of the sealing frame 1. The capillary core layer 403 is a copper powder sintered layer or a woven copper mesh with a porosity of 50%-70% and a thickness of 0.3-0.8 mm. Several fins 402 are evenly distributed and connected to the other side of the heat exchange plate 401. The fins 402 are integrally formed with the heat exchange plate 401 or fixed by welding. The fins 402 are made of copper or aluminum, and the other end of the fins 402 extends through to the outside of the sealing frame 1.

[0051] Example 2: See Figure 1 , Figure 3 , Figure 7 , Figure 9Based on Embodiment 1, the inner wall of the embedded groove 107 is provided with a sealing assembly 7. The sealing assembly 7 includes a sealing plate 701 and an extension plate 703 integrally formed and connected to the top of the sealing plate 701. The sealing plate 701 and the extension plate 703 are made of stainless steel or titanium alloy. The sealing plate 701 wraps around the heat exchange plate 401. A high-temperature resistant sealant is provided between the inner wall of the sealing plate 701 and the outer wall of the heat exchange plate 401. The inner top surface and inner bottom surface of the sealing plate 701 are provided with positioning slots 704. The positioning slots 704 are rectangular grooves that extend horizontally along the inner top surface and inner bottom surface of the sealing plate 701. The heat exchange plate 401... The top and bottom ends are provided with positioning blocks 404 that mate with positioning slots 704. The positioning blocks 404 are integrally formed with the heat exchange plate 401, and their outer walls are clearance-fitted with the inner walls of the positioning slots 704. The side of the sealing plate 701 is provided with through holes 702 for the fins 402 to pass through. The diameter of the through holes 702 is slightly larger than the thickness of the fins 402. The inner wall of the through holes 702 and the fins 402 are filled with high-temperature resistant sealant. The extension plate 703 is clamped between the top end of the sealing frame 1 and the bottom edge of the top plate 101. Sealing gaskets are provided between the extension plate 703 and the top end of the sealing frame 1, and between the extension plate 703 and the bottom end of the top plate 101.

[0052] The converging assembly 5 includes a vertical plate 501, a first inclined plate 502 integrally formed and connected to the bottom end of the vertical plate 501, and a second inclined plate 503 integrally formed and connected to the top end of the vertical plate 501. The vertical plate 501, the first inclined plate 502, and the second inclined plate 503 are made of integrally formed stainless steel or aluminum alloy, and their surfaces can be coated with an anti-corrosion coating. The vertical plate 501 is detachably installed on the inner wall of the sealing frame 1. The vertical plate 501 is fixedly connected to the inner wall of the sealing frame 1 by bolts. A sealing gasket is provided between the vertical plate 501 and the inner wall of the sealing frame 1. One end of the first inclined plate 502 is inclined downward toward the center of the insulating substrate 3 at an angle of 30°-60°. A gap of 1-2 cm is left between its lower edge and the upper surface of the insulating substrate 3 for the working fluid. Steam passes through, and the first inclined plate 502 guides the working fluid steam below to the upper surface of the insulating substrate 3. The working fluid steam first contacts the upper surface of the insulating substrate 3, and then moves upward to be captured by the heat exchange component 4, improving the cooling effect on the insulating substrate 3. One end of the second inclined plate 503 is inclined upward towards the center of the top plate 101, and the inclination angle of the second inclined plate 503 is 30°-60°. The top end of the second inclined plate 503 is aligned with the top inlet of the return liquid channel 105, and the top end of the second inclined plate 503 is connected to the lower edge of the top inlet of the return liquid channel 105, forming a continuous guide surface. A ceramic heat insulation layer 504 is installed at the bottom end of the first inclined plate 502. The ceramic heat insulation layer 504 is made of alumina or aluminum nitride ceramic sheet and is fixed to the bottom end of the first inclined plate 502 by bonding or snap-fitting. The ceramic heat insulation layer 504 enhances insulation and can better guide the working fluid steam to the upper surface of the insulating substrate 3.

[0053] Working principle:

[0054] When this package is in operation, the semiconductor element 301 is energized and generates heat, which is first transferred to the insulating substrate 3. The end of the insulating substrate 3 is clamped and fixed by the lower clamping pad 605 and the upper clamping pad 606 in the thermally conductive support assembly 6. The top end of the thermally conductive pillar 603 abuts against the bottom end of the insulating substrate 3. The heat of the insulating substrate 3 is transferred to the support cylinder 601 through the thermally conductive pillar 603, and then transferred from the support cylinder 601 to the mounting plate 204, and finally collected on the heat collection plate 201.

[0055] After the heat collector plate 201 absorbs radiant heat from the bottom of the insulating substrate 3 and conductive heat from the thermally conductive support assembly 6, the heat is concentrated and guided to the central heat-conducting cylinder 202 due to the V-shaped structure with a concave center in the middle of the heat collector plate 201. The energy-concentrating plate 205 is made of a material with poor thermal conductivity and is fitted to the bottom end of the heat collector plate 201. Its slot 206 allows the heat-conducting cylinder 202 to pass through. The energy-concentrating plate 205 acts as a barrier and concentrates the heat, forcing the heat to concentrate in the area of ​​the heat-conducting cylinder 202. The heat is transferred through the heat-conducting cylinder 202 to the working fluid liquid at the bottom of the receiving cavity 103. The guide plates 207 are distributed in a V-shape, further concentrating the heat around the heat-conducting cylinder 202, causing the working fluid liquid in this area to heat up rapidly and boil and evaporate to produce working fluid vapor.

[0056] After the working fluid vapor is generated, it moves upward through the evenly distributed holes 203 on the heat-conducting cylinder 202, first contacting the bottom end of the insulating substrate 3 to directly heat and cool it. The working fluid vapor continues to rise, and guided by the first inclined plate 502 of the converging component 5, the first inclined plate 502 tilts downward toward the center of the insulating substrate 3, guiding the working fluid vapor to the upper surface of the insulating substrate 3. The working fluid vapor first contacts the semiconductor element 301 on the upper surface of the insulating substrate 3, achieving forced convection heat dissipation, and then continues to rise.

[0057] The rising working fluid vapor reaches the heat exchange component 4, where it releases heat and condenses into liquid working fluid on the surface of the heat exchange plate 401. The heat is conducted out to the outside of the sealing frame 1 through the fins 402. The liquid working fluid is adsorbed and collected by the capillary core layer 403 on one side of the heat exchange plate 401 and diffuses to both sides under the action of capillary force. The second inclined plate 503 of the converging component 5 is inclined upward toward the center of the top plate 101, and its top end is aligned with the top inlet of the return liquid channel 105, accurately guiding the liquid working fluid to the top inlet of the return liquid channel 105. The liquid working fluid flows downward along the return liquid channel 105 and returns to the bottom of the receiving cavity 103, completing the evaporation, condensation, and return circulation of the working fluid.

[0058] During the circulation process, the sealing assembly 7 is wrapped around the heat exchange plate 401 by the sealing plate 701. The positioning block 404 and the positioning slot 704 cooperate to achieve positioning. The extension plate 703 is clamped between the top of the sealing frame 1 and the bottom edge of the top plate 101 to ensure the sealing between the heat exchange assembly 4 and the sealing frame 1. The sealing sleeve 104 is set at the connection between the terminal 302 and the top plate 101 to prevent the working fluid vapor from leaking out along the terminal 302. The ceramic heat insulation layer 504 is installed at the bottom of the first inclined plate 502 to enhance insulation and help guide the working fluid vapor to the upper surface of the insulating substrate 3. The elastic pad 604 is set in the lower part of the inner cavity of the support cylinder 601 to absorb the stress generated by thermal expansion during the thermal cycle and ensure that the heat conduction column 603 maintains stable contact with the bottom of the insulating substrate 3.

[0059] All components of this invention are general standard parts or parts known to those skilled in the art. Their structure and principles are readily known to those skilled in the art through technical manuals or conventional experimental methods. It is obvious to those skilled in the art that this invention is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this invention is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A power semiconductor module package with an integrated heat dissipation structure, comprising a frame, a top plate detachably mounted on the top of the frame, and an insulating substrate mounted in the middle of the inner cavity of the frame, characterized in that, Also includes: A partition is connected to the lower part of the inner cavity of the sealing frame. The bottom of the partition and the inner bottom surface of the sealing frame form a receiving cavity, which is filled with working fluid. An evaporation assembly, installed in the center of the partition, is used to collect the heat emitted by the insulating substrate and drive the working fluid to evaporate; The thermally conductive support assembly is installed at the top of both ends of the evaporation assembly to support and fix the ends of the insulating substrate and transfer the heat of the insulating substrate to the evaporation assembly. The return liquid channel is located inside the two side frames of the sealing frame. The bottom of the return liquid channel is connected to the top of the receiving cavity, and the top of the return liquid channel is connected to the upper part of the inner cavity of the sealing frame. A heat exchange assembly is installed on the top inner side wall of the sealing frame. The heat exchange assembly is located close to the top inlet of the return liquid channel and is used to condense and collect the working fluid vapor. A converging assembly is installed on the upper inner sidewall of the sealing frame. The converging assembly is disposed between the insulating substrate and the top inlet of the return liquid channel. It is used to guide the working fluid vapor from below to the upper surface of the insulating substrate and to guide the working fluid liquid from above to the top inlet of the return liquid channel.

2. The power semiconductor module package with an integrated heat dissipation structure according to claim 1, characterized in that, The evaporation assembly includes a heat collection plate and an energy-concentrating plate. The heat collection plate has a V-shaped structure with a central concave section. A heat-conducting cylinder is connected to the center of the heat collection plate, and the bottom end of the heat-conducting cylinder extends to the bottom end of the receiving cavity. The energy-concentrating plate is fitted to the bottom end of the heat collection plate, and a slot for the heat-conducting cylinder to pass through is provided in the center of the energy-concentrating plate. The heat collection plate and the heat-conducting cylinder are made of a material with good thermal conductivity, while the energy-concentrating plate is made of a material with poor thermal conductivity.

3. The power semiconductor module package with an integrated heat dissipation structure according to claim 2, characterized in that, The bottom of the energy-concentrating plate is integrally formed with guide plates on both sides of the heat-conducting cylinder. The two guide plates are distributed in a figure-eight shape. Several holes are evenly distributed on the heat-conducting cylinder.

4. The power semiconductor module package with an integrated heat dissipation structure according to claim 3, characterized in that, The partition has a placement groove in the center that matches the shape and size of the energy-concentrating plate. The edge of the partition is installed in the placement groove. The two ends of the heat collection plate are integrally formed with mounting plates, which are installed on the top of the two ends of the partition.

5. The power semiconductor module package with an integrated heat dissipation structure according to claim 4, characterized in that, The thermally conductive support assembly includes a support cylinder and a clamping plate. The bottom of the support cylinder is mounted on the top of the mounting plate. The lower and upper parts of the inner cavity of the support cylinder are respectively provided with an elastic pad and a thermally conductive column. The top of the support cylinder is provided with a lower clamping pad around the thermally conductive column. The longitudinal section of the clamping plate is right-angled, and an upper clamping pad is provided around the inner circumference of the clamping plate. The clamping plate is detachably mounted on the support cylinder by bolts. The end of the insulating substrate is clamped between the lower clamping pad and the upper clamping pad. The top of the thermally conductive column abuts against the bottom of the insulating substrate. The lower outer wall of the thermally conductive column slides against the inner wall of the support cylinder. The support cylinder is made of a material with good thermal conductivity.

6. The power semiconductor module package with an integrated heat dissipation structure according to claim 1, characterized in that, The top inner wall of the sealing frame is provided with an embedding groove. The heat exchange assembly includes a heat exchange plate installed in the embedding groove. A capillary core layer is provided on the side of the heat exchange plate near the inner cavity of the sealing frame. Several fins are evenly distributed and connected on the other side of the heat exchange plate. The other end of the fins extends through and out of the sealing frame.

7. A power semiconductor module package with an integrated heat dissipation structure according to claim 6, characterized in that, The inner wall of the embedded groove is provided with a sealing assembly, which includes a sealing plate and an extension plate integrally formed and connected to the top of the sealing plate. The sealing plate wraps around the heat exchange plate. The inner top and inner bottom surfaces of the sealing plate are provided with positioning slots. The top and bottom ends of the heat exchange plate are provided with positioning blocks that cooperate with the positioning slots. The side of the sealing plate is provided with through holes for the fins to pass through. The extension plate is clamped between the top and bottom edges of the sealing frame.

8. The power semiconductor module package with an integrated heat dissipation structure according to claim 1, characterized in that, The converging assembly includes a vertical plate, a first inclined plate integrally formed and connected to the bottom end of the vertical plate, and a second inclined plate integrally formed and connected to the top end of the vertical plate. The vertical plate is detachably installed on the inner side wall of the sealing frame. One end of the first inclined plate is inclined downward toward the center of the insulating substrate, and one end of the second inclined plate is inclined upward toward the center of the top plate. The top end of the second inclined plate is aligned with the top inlet of the return liquid channel. A ceramic heat insulation layer is installed at the bottom end of the first inclined plate.

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