Low-altitude meteorological guarantee special chip and packaging method of chip
By using a stacked interconnect structure of silicon interposer and heat spreader, the problems of high interconnect delay and heat accumulation in traditional packaging technology are solved, achieving efficient inter-chip data exchange and heat dissipation, and improving system performance and reliability.
CN122227982APending Publication Date: 2026-06-16BEIJING TFLYING TRANSDUCER TECH CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING TFLYING TRANSDUCER TECH CO LTD
- Filing Date
- 2026-03-17
- Publication Date
- 2026-06-16
Smart Images
Figure CN122227982A_ABST
Abstract
The application provides a low-altitude meteorological guarantee special chip and a chip packaging method, which comprises a packaging top plate, a packaging substrate, a solder ball array, at least one top chip and at least one bottom chip, and further comprises a silicon interlayer, the silicon interlayer is arranged between the bottom chip and the top chip, and the top chip is connected with the bottom chip through the silicon interlayer to form a stacked interconnection structure. In the application, the stacked interconnection structure is formed between the top chip, the silicon interlayer and the bottom chip, the bottom chip is interconnected with the top chip through the silicon interlayer, and the interconnection delay can be reduced by at least 60% relative to the existing PCB connection mode.
Need to check novelty before this filing date? Find Prior Art