Leadframe, package with die cut leads and saw cut sides, and corresponding methods
By using leadframe sawing and punching techniques, combined with molding compound materials, the problems of complexity and high cost in existing packaging technologies have been solved, achieving efficient and stable package manufacturing.
CN122228005APending Publication Date: 2026-06-16INFINEON TECHNOLOGIES AG
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INFINEON TECHNOLOGIES AG
- Filing Date
- 2021-01-15
- Publication Date
- 2026-06-16
AI Technical Summary
⚠Technical Problem
Existing packaging technologies struggle to effectively reduce processing complexity and cost while maintaining high device reliability.
⚗Method used
By employing leadframe manufacturing processes, combined with sawing and punching techniques, sawing textures are formed on the sides of the encapsulation through sawing, and specific structures are formed on the punched surface. Combined with molding compound materials, this enables efficient encapsulation manufacturing.
🎯Benefits of technology
It enables efficient package manufacturing, reduces processing complexity and resource utilization, and improves the mechanical stability of the package and simplifies electrical connections.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122228005A_ABST
Abstract
A package (100) includes a carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating at least a portion of the carrier (102) and the electronic component (104), and at least one lead (108) extending out of the encapsulant (106) and having a die cut surface (130), wherein at least a portion of at least one side (110) of the encapsulant (106) has a sawing texture (281).
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