Leadframe, package with die cut leads and saw cut sides, and corresponding methods

Abstract

A package (100) includes a carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating at least a portion of the carrier (102) and the electronic component (104), and at least one lead (108) extending out of the encapsulant (106) and having a die cut surface (130), wherein at least a portion of at least one side (110) of the encapsulant (106) has a sawing texture (281).

Description

[0001] This application is a divisional application of the invention patent application filed on January 15, 2021, with application number 202110054527.2 and entitled "Leader Frame, Encapsulation Body with Punched Leads and Sawing Sides and Corresponding Method". Technical Field

[0002] The various embodiments generally relate to a package, a lead frame, and a method of manufacturing the package. Background Technology

[0003] An encapsulation can refer to an encapsulated electronic component having an electrical connection structure that extends from the encapsulation and is mounted to an external electronic device, such as a printed circuit board.

[0004] Packaging cost is a significant driver in the industry. Related to this are performance, size, and reliability. A wide variety of packaging solutions exist, and each must meet the specific application requirements. Summary of the Invention

[0005] It may be necessary to provide a possibility of manufacturing a package that focuses on reducing the complexity of handling while maintaining high device reliability.

[0006] According to an exemplary embodiment, a package is provided, the package comprising: a carrier, electronic components on the carrier, an encapsulant encapsulating at least a portion of the carrier and the electronic components, and at least one lead extending from the encapsulant and having a punched surface, wherein at least a portion of at least one side of the encapsulant has a sawed texture.

[0007] According to another exemplary embodiment, a method for manufacturing a package is provided, wherein the method includes: mounting an electronic component on a carrier; encapsulating the carrier and at least a portion of the electronic component with an encapsulation; punching at least one lead extending from the encapsulation; and sawing at least a portion of at least one side of the encapsulation.

[0008] According to yet another exemplary embodiment, a lead frame concept is provided, the lead frame including a patterned conductive sheet, a plurality of carriers defined within the sheet and arranged in rows and columns, and at least one lead assigned to each carrier, wherein the sheet has a larger extension scale along the rows compared to a smaller extension scale along the columns, and wherein the lead extends along the rows.

[0009] According to an exemplary embodiment, an encapsulated (particularly molded) package is provided having at least one sawed side (particularly two opposite sawed sides on the opposite side of the package) and at least one additional side (particularly two opposite additional sides on the opposite side of the package that are different from the one or more sawed sides), the additional side having one or more punched leads. The features of the at least one additional side can be defined by an encapsulation process, particularly by molding.

[0010] According to an exemplary embodiment, a package having encapsulated electronic components mounted on a carrier is provided, wherein a portion of the outer contour of the package is defined by sawing (partially by mechanical sawing), and another portion of the contour is defined by punching. The corresponding manufacturing process can be highly efficient because it can encapsulate multiple carriers with mounted electronic components using spatially extending (partially strip-shaped) encapsulations before separating the common encapsulation structure by sawing into individual encapsulations of the respective packages. One or more leads can extend from one or two opposite sides of the encapsulations assigned to the respective packages that can be separated by punching, in a direction perpendicular to the extension of this common encapsulation. Therefore, efficient multi-package encapsulation and efficient individualization by high-speed sawing can be combined with rapid and simple individualization by punching in orthogonal directions.

[0011] The described manufacturing process can be advantageously performed using a lead frame according to an exemplary embodiment, allowing for the manufacture of the package with greater resource utilization efficiency. To support the aforementioned manufacturing process, such a lead frame can orient the leads assigned to various carriers to extend from the short side of the carrier and parallel to the long side of the carrier. Descriptively, compared to conventional methods, the individual carriers can be arranged to rotate 90° within the frame of the lead frame. This ensures compatibility with the formation of a common encapsulation strip or the like extending along the shorter side of the carrier and along the shorter side of the lead frame, as a common encapsulation along the longer side of the lead frame may be technically more difficult. Accordingly, sawing can be performed along the longer sides of the carrier and the lead frame. Sawing can be performed according to a copper-poor or even copper-free sawing trajectory, thereby sawing primarily or entirely through encapsulation material that allows for high-speed sawing. On the other hand, punching can be performed along the shorter side of the lead frame, and therefore can also be performed very efficiently. Finally, the package can be manufactured based on the described lead frame concept by performing a simple and material-saving manufacturing method according to an exemplary embodiment.

[0012] Description of further exemplary embodiments Further exemplary embodiments of the package, lead frame concept, and method will be described below.

[0013] In the context of this application, the term "package" may specifically refer to an electronic device that may include one or more electronic components mounted on a carrier, the carrier comprising or consisting of a single component, multiple components joined via encapsulation or other package components, or sub-assemblies of the carrier. The components of the package may be at least partially encapsulated by an encapsulating material. Optionally, one or more conductive interconnects (e.g., connecting wires and / or clips) may be implemented in the package for example, for electrically coupling electronic components to the carrier.

[0014] In the context of this application, the term "electronic component" may specifically include semiconductor chips (particularly power semiconductor chips), active electronic devices (e.g., transistors), passive electronic devices (e.g., capacitors, inductors, or ohmic resistors), sensors (e.g., microphones, light sensors, or gas sensors), devices based on light-emitting semiconductors (e.g., light-emitting diodes (LEDs) or lasers), actuators (e.g., speakers), and microelectromechanical systems (MEMS). Specifically, an electronic component may be a semiconductor chip having at least one integrated circuit element (e.g., a diode or transistor) in its surface portion. The electronic component may be a bare die or may have been packaged or encapsulated. Semiconductor chips implemented according to several exemplary embodiments may be formed using silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0015] In the context of this application, the term "encapsulation" can specifically refer to a substantially electrically insulating material surrounding at least a portion of an electronic component and at least a portion of a carrier to provide mechanical protection, electrical isolation, and optionally facilitate heat removal during operation. In particular, the encapsulation can be a molding compound. A molding compound can include a matrix of flowable and hardenable materials and filler particles embedded therein. For example, filler particles can be used to modulate the properties of the molded component, particularly to enhance thermal conductivity.

[0016] In the context of this application, the term "carrier" may specifically refer to a support structure (which may be at least partially conductive) that serves as a mechanical support for one or more electronic components to be mounted thereon, and may also facilitate electrical interconnection between the electronic components and the periphery of the package. In other words, a carrier can perform both mechanical support and electrical connection functions. A carrier may include or consist of a single component, multiple components joined via an encapsulation or other package components, or a sub-assembly of the carrier. When the carrier forms part of a leadframe, it may be or may include a die pad.

[0017] In the context of this application, the term "lead" may specifically refer to a conductive (e.g., strip-shaped) element (which may be planar or curved) that can be functionally assigned to a carrier and used for contacting electronic components from the outside of the package. For example, a lead may be partially encapsulated and partially exposed relative to the encapsulation. When the carrier forms part of the lead frame, the lead may surround the die pads of the carrier. The one or more leads may or may not form part of the carrier.

[0018] In the context of this application, the term "leadframe" may specifically refer to a metallic structure comprising an array of carriers initially integrally connected and leads for a package. Electronic components may be attached to the carriers of the leadframe, and connecting wires and / or clips may be provided for attaching the pads of the electronic components to the leads of the leadframe. The leadframe may then be molded in a plastic shell or any other encapsulation. Externally and / or internally, corresponding portions of the leadframe may be cut to separate the respective leads and / or carriers. Prior to this cutting, other processes such as plating, final testing, packaging, etc., may be performed. The leadframe may consist of multiple carriers for the electronic components, wherein each carrier may have a mounting section and one or more leads.

[0019] In the context of this application, the term "punch-cut surface" can specifically refer to a surface area that defines one or more leads and is defined by punching. Punching can refer to a forming process that uses a punch press to force a tool, which may be called a punch, through a workpiece to form a hole via shearing. Punching can be applied to a variety of sheet materials, including metal sheets. Punching is a simple and therefore efficient method for defining structures in patterned sheets. Thus, a punch-cut surface is a surface defined by punching. Those skilled in the art will understand that punch-cut surfaces have unique properties that can be readily and clearly analyzed by those skilled in the art. At the punch-cut surface defining the leads, the corresponding sides of the encapsulation can be defined by an encapsulation process, particularly by molding. The corresponding encapsulation, such as a molding compound, may include a matrix (e.g., comprising resin) having filler particles. At the molding surface corresponding to the punch-cut surface of the leads, the filler particles are coated with a matrix material of an encapsulation, particularly of the type of molding compound, to form a defined structure with a coated pixel-like structure on the surface. Furthermore, the molded side at the punching surface of the corresponding lead wire can be tilted (e.g., at an angle between 6° and 12°, particularly in the range of 8° to 10°) to facilitate the removal of the corresponding molded body from the mold.

[0020] In the context of this application, the term "side sawing texture" can specifically refer to a surface structure or surface profile on the side surface of an encapsulation defined by sawing. Preferably, the sawing process is a mechanical sawing process using a saw blade. Alternatively, a laser saw is also feasible. Due to such a sawing process, particularly a mechanical sawing process using a saw blade, a rough surface texture (particularly having a roughness Ra greater than 0.8 μm, especially between 0.8 μm and 5 μm, for example, about 1 μm) is obtained. This roughness characteristic of sawing the side is combined with the formation of microscopic scratches, marks, grooves, or ripples formed by the sawing tool. For example, a mechanical saw blade can have a polyimide-bonded diamond body for sawing, which can, for example, produce the sawing texture. In particular, the sawing texture of the at least one side can have a roughness Ra greater than 0.8 μm and has ripples of a larger size compared to the size of the protrusions and indentations involved in the roughness. The surface roughness can be defined and measured as the average height Ra of the centerline. Ra is the arithmetic mean of all distances from the profile to the centerline. For example, as mentioned in the context of this application, the roughness Ra of the sawn surface can be measured or determined according to DIN EN ISO 4287:2010. A saw used to form the sawing texture can refer to a tool comprising a hard saw blade with hardened toothed edges. Such a saw can be used to cut encapsulation materials and, optionally, to cut one or more leads of metal material by pressing the toothed edges against the material and forcibly moving forward, and by moving less forcefully backward or continuously forward. For example, a powered circular saw blade can be used for this purpose. A fractured surface can be obtained at the sawn side of the encapsulation, particularly at the sawn side of the molded compound, where filler particles can also be sawn on the surface of the sawn side. Thus, the sawn side can be defined by the material of the aforementioned matrix of the encapsulation and can also be partially defined by the cut, uncoated filler particles.

[0021] In one embodiment, at least one other side of the encapsulation has a molded texture. Specifically, two opposite sides of the encapsulation may be at least partially sawn, and the other two sides of the encapsulation may have a molded texture. In the context of this application, the term "molded texture" may specifically refer to the characteristic surface profile of a side formed by molding. In particular, such a molded texture may include a smooth surface (particularly having a smaller surface roughness Ra than the side with the sawn texture), whose microscopic surface pixel structure corresponds to filler particles added to the molding compound and appears on the outer surface of the molded encapsulation, and is coated with a molding encapsulation material (particularly a molding resin). Thus, two sides of the encapsulation profile can be defined by sawing, while the other two sides can be defined by molding. Such encapsulation features are described below, for example, with reference to... Figure 3The description features a unique hallmark of a highly advantageous manufacturing process.

[0022] In one embodiment, the at least one lead is arranged on the shorter side of a carrier (e.g., generally rectangular), particularly on two opposite shorter sides of the carrier. By arranging the one or more leads on the shorter sides of the carrier, the arrayed packages can be grouped together and can be punched along the columns and sawn along the rows. This architecture represents a paradigm shift from conventional methods.

[0023] In one embodiment, the at least one sawn side is specifically defined only by an encapsulation. In such an embodiment, sawing of the side can be performed only through the encapsulation material, particularly the molding compound material. Since metal sawing can be completely avoided in such an embodiment, high-speed sawing can be ensured, thereby ensuring efficient processing.

[0024] In another embodiment, the at least one sawn side is specifically defined only by the encapsulation and a (particularly metallic) tie bar connected to the carrier. Such a tie bar can be used to integrally connect various carriers in the leadframe compound before monomerization into the package. Specifically, the ratio between the surface area of ​​the exposed tie bar at the respective sawn side and the total surface area of ​​the respective sawn side can be less than 10%, particularly less than 5%, and more particularly less than 3%. In such an alternative embodiment, sawing is performed through the material of the (particularly molded) encapsulation and the material of the very limited metallic tie bar. This highly limited tie bar sawing can cut only a few percent of the surface area of ​​the metallic material, retaining the advantage of substantially high-speed sawing through the encapsulation material. Simultaneously, the tie bar can connect different carriers of the leadframe, thereby improving mechanical stability during manufacturing. Therefore, a high-precision package can be obtained.

[0025] In one embodiment, the tie bar has a thicker portion within the encapsulation compared to the thinner portion at the corresponding sawn side. The amount or percentage of metal material sawn during the monomerization process of the encapsulation can be further reduced by locally refining the tie bar segment in the sawn area of ​​the processed lead frame using methods such as stamping or other methods. By taking this measure, high mechanical stability and high-speed sawing can be achieved simultaneously.

[0026] In one embodiment, the encapsulation has at least one sloping sidewall, at which the at least one lead extends out of the encapsulation. Specifically, the molding surface may feature sloping sidewalls, which can be a distinctive feature of the molding process for removing the subsequently cured encapsulation from the mold. To facilitate this removal process, sloping sidewalls typically ranging from 6% to 10%, particularly 6° to 8°, are obtained. Therefore, the side of the encapsulation corresponding to the punched lead extending out of the encapsulation can be sloping. In contrast, sawn sides can be vertical.

[0027] In one embodiment, the at least one sawn side having a sawed texture has vertical sidewalls. Since the saw blade cuts substantially vertically through the encapsulation (primarily the packaging) material during the sawing process, the one or more sidewalls defined by the sawing also extend vertically.

[0028] In one embodiment, the at least one lead is partially or completely covered by a plating layer. For example, the exposed portion of the lead may be covered by a plating layer such as tin. More generally, this plating layer may be made of a solderable material, thereby simplifying the solder connection between the package and the mounting base (e.g., a printed circuit board, PCB) after the package is formed. For example, the entire exposed surface of the lead may be coated with the plating layer. Alternatively, only a portion of the exposed surface of the at least one lead may be coated with this plating layer. The material of the lead covered by the plating layer may be, for example, copper.

[0029] In one embodiment, the encapsulation has at least one recess in at least one of the at least one side having a sawed texture. In other words, a portion (particularly the central portion) of at least one of the sides can be defined by a recess formed not by sawing but, for example, by punching. Thus, only a portion of the side can be sawed, while the other portion can be punched. By punching such a recess in the encapsulation, for example, the metal tie rods that hold the carrier together in the lead frame can be removed before sawing. Thus, since tie rod residue can be removed, sawing through the metal material can be completely prevented, thereby further accelerating sawing. Therefore, it is advantageous to form the punched recess before sawing.

[0030] In one embodiment, the carrier is exposed relative to the encapsulation on the bottom side of the package. Therefore, a conductive surface can be provided on the bottom side of the package, which simplifies electrical connections within the package and also facilitates heat dissipation during operation of the package, particularly when the electronic component is a power semiconductor chip.

[0031] In one embodiment, the package includes a clip electrically connected to the upper main surface of an electronic component. This clip may be a bent conductor that provides an electrical connection to the upper main surface of the corresponding electronic component with a high connection area. By embedding the clip within the package to electrically connect the encapsulated electronic component, any desired conductive path can be effortlessly established. As a complement or alternative to this clip, one or more other conductive interconnects, such as connecting wires and / or connecting strips, may also be implemented within the package.

[0032] In one embodiment, the clip is integrally formed with the at least one lead. Therefore, at least a portion of the lead can form part of the clip. Thus, the clip may also include at least one lead. Therefore, the connection between the clip and the at least one lead can be solderless. In particular, a direct physical connection between the clip and the lead is possible. Advantageously, the clip itself can therefore include the aforementioned lead or at least one additional lead, which is partially covered by an encapsulation and partially exposed relative to the encapsulation. Therefore, the integrally formed clip-lead-structure can significantly simplify the manufacture of the package because additional connections between the clip and the lead (e.g., by soldering) can be unnecessary. This further simplifies the manufacturing process.

[0033] In one embodiment, the clip electrically connects the upper main surface of the electronic component to the at least one lead that forms part of the carrier. Therefore, at least a portion of the lead may form part of the carrier, or may at least be part of a lead frame initially connected to the carrier. It is also possible that a portion of the lead is provided by the carrier, while another portion of the lead is provided by the clip.

[0034] In one embodiment, a portion of the clip is positioned at the same vertical height as the carrier. For example, the clip may be a curved body having an upper flat portion connected to the upper main surface of the electronic component and a lower plate-like portion arranged coplanarly with the carrier or lead frame. Thus, a highly compact configuration of the package can be obtained.

[0035] In one embodiment, the punched surface is the exposed surface of the at least one lead or lead portion that is not covered by the encapsulation. Specifically, the exposed surface can be the punched end surface of the at least one lead (see, for example, the punched end surface of the lead). Figure 4 and Figure 5 ) and punched side surfaces (see, for example) Figure 37 One of them. In particular, the at least one lead may be locally thickened at the punched side surface (see also, for example, see...). Figure 37Therefore, a portion of the lead frame can be punched at the free end of the respective lead, i.e., the end that defines its length, to form or define one or more leads. However, additionally or alternatively, the punching process can also be performed laterally on the punched surface forming the at least one lead, for example, to separate the different leads by removing the corresponding portion of the tie rod, etc. In the latter case, due to tolerances or similar reasons, it is possible that the respective lead has a locally thickened portion at its punched location.

[0036] In one embodiment, the method includes: mounting additional electronic components onto an additional (preferably conductive) carrier, such that the electronic components and the carrier are arranged in multiple rows and columns; encapsulating at least a portion of the additional carrier and the additional electronic components with an additional encapsulation; punching additional leads extending from the additional encapsulation; and sawing additional sides of the additional encapsulation. In other words, the manufacturing method can be performed at the lead frame or panel level, i.e., for multiple carriers and multiple electronic components simultaneously. This batch processing further reduces manufacturing workload and allows for industrial-scale manufacturing of packages. The carriers, and therefore the packages, can be arranged in rows and columns in a matrix manner. Descriptively, sawing can be performed horizontally, i.e., along the rows, while punching can be performed vertically, i.e., along the columns. In this way, an efficient manufacturing process can be achieved.

[0037] In one embodiment, the method includes forming a plurality of parallel strips of encapsulating material and additional encapsulating material, wherein each strip at least partially encapsulates all carriers and all electronic components of a corresponding column. According to such a preferred embodiment, encapsulating material strips can be formed that simultaneously cover all carriers and electronic components of a column of preforms of the package in a matrix arrangement. Thus, a barcode-like arrangement of parallel, vertically extending encapsulating strips can be obtained. This can be advantageously achieved through molding. Further advantageously, this batch molding process can eliminate the need for runner structures on the leadframe, further simplifying the manufacturing process. Furthermore, the gate structure used to define the encapsulation path can be significantly simplified or even completely omitted. In particular, the combination of the formation of vertically extending encapsulating strips with the horizontal extension of the leads is of greatest advantage. In one embodiment, such encapsulating material strips can have a strip-shaped rectangular shape on the treated leadframe in a top view. However, alternatively, the strips can also have a more complex structure, such as having one or more notches extending along the sidewalls of the strip. In addition, surface structures or textures, such as grooves (e.g., V-grooves), can be formed in the upper main surface of the encapsulation strip to further simplify the subsequent sawing process, which is performed to individualize the individual packages while forming sawed sides.

[0038] In one embodiment, the method includes sawing each strip to separate multiple packages. Thus, each package strip can be cut into multiple individual portions, each portion being assigned to a corresponding package. The cutting can be accomplished by sawing, particularly mechanical sawing. However, multiple package strips can also be sawed in a common process, in which the saw blade can saw all parallel and spaced-apart package strips by first sawing along a first horizontal sawing line and then along a second horizontal sawing line.

[0039] In one embodiment, the method includes connecting the strips by transverse or vertical auxiliary strips made of encapsulating material prior to sawing. To further improve the stability of the lead frame of the semi-finished strip encapsulation, the vertically extending spaced-apart encapsulating strips can be temporarily connected, for example, by auxiliary encapsulating strips connecting all, for example, vertically extending spaced-apart encapsulating strips, during a portion of the manufacturing process. Such auxiliary strips or connecting strips can then be separated from the encapsulation during sawing. By providing such encapsulating strips for stabilizing other parallel-arranged encapsulating strips, the need for tie strips can be reduced or even eliminated, further simplifying the sawing process. This simplification benefits from the fact that sawing can then be performed only through or substantially only through the encapsulating material and only through a very small amount of the tie strip's metal material, or not through the tie strip's metal material at all.

[0040] In one embodiment, the method includes connecting at least one column of carriers to at least one tie bar. The resulting structure can then optionally be monomerized into multiple packages by sawing through the at least one tie bar. Tie bars can be provided, either attached to or instead of providing auxiliary encapsulation strips, to connect corresponding columns or even adjacent columns of carriers in, for example, vertically or obliquely. These tie bars can improve the stability of the lead frame and the structure obtained during package fabrication. Advantageously, the cross-section of the thin tie bars can be kept very small, so that the sawing process primarily cuts through the encapsulation material containing only a small amount of metal.

[0041] In one embodiment, the method includes sawing the encapsulation strip into multiple packages while simultaneously sawing through the at least one tie bar. Therefore, the separation of the tie bar and the individualization of the packages can be performed simultaneously.

[0042] In one embodiment, the method includes connecting a clamp frame comprising a plurality of clips between two adjacent columns. The clamp frame, for example, comprising an integral structure of a plurality of clips extending in rows and / or columns, can be attached to each electronic component of a respective carrier. When the clamp frame is connected to a lead frame, the clips of the clamp frame can be interconnected. As described above, the clips can be bent conductors that achieve electrical connection to the upper main surface of the respective electronic component mounted on the carrier with a high connection area. The clamp frame can also be separated into individual clips when the obtained structure is monolithized to form individual packages. Highly advantageously, such a clamp frame can be connected to the aforementioned lead frame very early in the manufacturing process, for example, after the electronic component is mounted on the carrier of the lead frame. Therefore, the formation of the clips can also be performed at the panel level, or in other words, simultaneously (ideally) for multiple preforms of the package. In one embodiment, such a clamp frame can establish a connection between the upper main surface of the electronic component and the respective carrier. Even more advantageously, the clamp frame itself can include the leads of the package (e.g., initially still integrally connected), making separate solder connections between the carrier's leads and the clips unnecessary.

[0043] In one embodiment, the method specifically includes: connecting a clamp frame to a carrier via a plug-in connection, wherein the clamp frame includes a plurality of clamps between two adjacent columns; and separating the clamp frame into a plurality of clamps by sawing and / or punching. Specifically, the clamp frame can be separated into a plurality of clamps by punching the tie bars connecting adjacent clamps.

[0044] In one embodiment, the method includes connecting a clamp frame to a lead frame via a plug-in connection, particularly without soldering. Specifically, a simple mechanical form-locking engagement can be established between the clamp frame and the lead frame. For example, the clamp frame can be snapped into or plugged into the lead frame. This can be achieved, for example, by functionally cooperating a connecting pin of the clamp frame with a connecting recess of the lead frame, or vice versa. By taking this approach, connections for multiple clamps for multiple packages can be established simultaneously and efficiently.

[0045] In one embodiment, the method includes connecting each clip of the clip frame between a corresponding carrier and a corresponding electronic component. Thus, the clip can establish a conductive connection between the electronic component and, in particular, the leads of the corresponding package. However, alternatively, the clip may also include one or more leads, making the aforementioned connection optional.

[0046] In one embodiment, the method includes separating the clamp frame into multiple clamps by sawing and / or punching. For example, when the clamp frame is mounted on a lead frame already incorporating electronic components, the clamp frame may have tie bars or support structures interconnecting the individual clamps. This simplifies the provision of the clamps. When the overall structure of the lead frame, clamp frame, electronic components, and encapsulation is monolithized into a single package, the clamp frame can be separated into individual clamps by sawing and punching processes. By sawing, the clamp frame can be separated into multiple vertically separated clamps or clamp groups. By punching, vertical separation of the clamp frame can be achieved, which is advantageous when the clamp frame has vertically arranged tie bars or support structures that need to be removed to separate two clamps arranged in a butterfly configuration on two opposite sides of such tie bars or support structures.

[0047] Therefore, the clamp frame can be separated into clamps by sawing in the horizontal direction and / or by punching in the vertical direction. For example, multiple clamps can be arranged in columns along the lead frame. However, additionally or alternatively, the clamp frame can also have two separate clamps, for example, arranged along each row of the lead frame, i.e., in the horizontal direction. This can be described as a butterfly configuration. One or more tie bars described above can connect the clamps of the integral clamp frame vertically and / or horizontally. By simultaneously and in a common process breaking the tie bars by punching, the processed lead frame can be separated into a package, thus allowing the package to be manufactured with high process efficiency.

[0048] In one embodiment, the method includes plating at least a portion of the at least one lead, particularly prior to punching. This plating process allows the exposed surfaces of the lead to be solderable, for example, by tin coating. By plating before punching, the punched end of the lead can remain unplated. However, alternatively, such a free end can also be plated after punching, particularly along with the remaining exposed surfaces of the at least one lead.

[0049] In one embodiment, the method includes punching before sawing. Therefore, the aforementioned encapsulation strips remain intact and provide stability after punching. Finally, they can be sawn into individual encapsulations using a mechanical saw blade.

[0050] In one embodiment, the method includes punching along a punching direction and sawing along a sawing direction perpendicular to the punching direction. In another embodiment, the method includes sawing along a sawing direction perpendicular to the extension direction of each column. Highly advantageously, sawing can be performed along a sawing trajectory corresponding to the extension direction of the row. Therefore, a rapid sawing process can be performed all at once along the longer extension direction of the lead frame, thus allowing for high efficiency. Punching can be performed along the shorter side of the lead frame. It has been found that forming encapsulation strips along the longer side of the lead frame can be difficult, while sawing along that direction is less challenging.

[0051] In one embodiment, the method includes punching along a punching direction parallel to the extension direction of each column. In other words, punching can be performed along the shorter extension direction of the lead frame, i.e., in a vertical direction or perpendicular to the index strip.

[0052] In one embodiment, the shorter side of the carrier extends along the column direction. By taking this measure, it is advantageous to complete the formation of the encapsulation strip along the shorter side and to be sawn along the longer side.

[0053] In one embodiment, the method includes testing the package before sawing, particularly after punching. Testing the package, such as for electronic functionality, before it is fully monolithized, i.e., while still on the leadframe or panel level, greatly simplifies the testing process. During such testing, conductive pins of a test device can be connected to the exposed pads or leads of the package, test signals can be applied, and response signals can be detected. This can be performed in a highly parallel manner at the panel level, i.e., before the processed leadframe is separated into individual packages.

[0054] In one embodiment, the method includes punching multiple leads by removing a continuous strip of material from the connecting carrier. For example, this continuous strip of material may be a tie bar that can be removed entirely. This may be advantageous when such a tie bar is positioned at the ends of the leads to be separated.

[0055] In one embodiment, the method includes punching multiple leads by removing multiple discontinuous segments of the material of the connecting carrier. In such an alternative embodiment, the punching process may be performed not at the ends of the leads, but at the central portion of the leads or at a portion of the encapsulating material immediately surrounding the leads. In this case, multiple separate island-like portions of the tie rod or the like can be removed by punching.

[0056] In one embodiment, the method includes arranging leads in an interleaved manner. Arranging leads in an interleaved manner can specifically mean configuring the leads as an interleaved finger structure. Such a configuration allows for a compact design of the lead frame, thereby further improving the resource efficiency of package manufacturing.

[0057] In one embodiment, the method includes connecting the leads by tie bars extending along the column, particularly by forming a mesh structure consisting of leads and tie bars. Such alternative embodiments are highly advantageous in terms of compactness and workload. Multiple tie bars can form vertical beams of the mesh structure, while the leads can form horizontal beams. For modularity, portions of the tie bars in this mesh structure located between the lead portions can be selectively removed.

[0058] In one embodiment of the lead frame, no leads extend along columns. In such an embodiment, all leads of the carrier assigned to the lead frame may extend along rows, particularly at one or both of the opposite row sides of the carrier.

[0059] In one embodiment, the lead frame includes at least one tie bar extending along a column and connecting at least one column of carriers. Tie bars at the lead frame level are highly advantageous for holding the individual carriers of the lead frame together before separation. Especially before encapsulation, the individual carriers can be difficult to manipulate without a connecting structure such as a tie bar. Furthermore, such vertically extending tie bars can be easily removed from the processed lead frame by punching during the monomerization process of the manufactured package.

[0060] In one embodiment, the leadframe includes two indexing strips extending along rows (particularly parallel to each other) and spaced apart along columns by a carrier. Such indexing strips can be metal strips including multiple through-holes and can be used to simplify automated manipulation of the leadframe. Furthermore, the indexing strips can facilitate precise alignment of the leadframe components during package manufacturing. Additionally, the indexing strips with holes can facilitate the transfer of leadframe portions to the processing side.

[0061] In one embodiment, the leads extend parallel to the lead frame's lead strip. This can include a lead frame design where individual devices are perpendicular to the lead strip or wire extension, but their leads (at least one) are parallel to the lead strip or wire extension.

[0062] In one embodiment, the lead frame includes at least one clamping frame comprising a plurality of clamps for the carrier and extending along the columns between two adjacent columns. Such clamping frames, as described above, can be manipulated integrally and can be easily connected to the lead frame, for example, by plug-in or snap-fit ​​operation. The connection between the lead frame and the clamping frame can be made after electronic components are mounted onto the carrier of the lead frame. The clamps of the clamping frame can then electrically connect the electronic components. The clamping frame can establish a connection between the leads of the electronic components and the carrier, or it can contain the leads itself, thereby simplifying the electrical connection of the electronic components. The clamping frame can include a plurality of clamps arranged horizontally and / or vertically. The clamping frame and the lead frame can have mating connection structures for establishing a connection between the clamping frame and the lead frame. Preferably, the plurality of clamping frames are connected to a lead frame having a carrier arranged in a matrix array of rows and columns. For example, each individual clamping frame can serve two columns of lead frames.

[0063] In one embodiment, at least one clamping frame includes a central tie bar extending along a column, and clamps on two opposite sides of the central tie bar. This central tie bar or support structure of the clamping frame can connect the clamps of the clamping frame in both vertical and horizontal directions. The individual clamps of the clamping frame can preferably be separated into individual clamps by punching along the vertical direction, i.e., along the column direction, with each clamp assigned to a corresponding package. However, multiple portions of the clamping frame can also be separated by sawing during the individualization of the package in the horizontal direction. Within the lead frame, the shorter side of the carrier can extend along the column. Correspondingly, the longer side of the carrier can extend along the row.

[0064] In another embodiment, the carrier (rather than a metal plate segment implemented as a lead frame as described above) comprises a stack consisting of a central electrically insulating and thermally conductive layer (e.g., a ceramic layer) and corresponding conductive layers (e.g., copper or aluminum layers, wherein the corresponding conductive layers may be continuous or patterned layers) covering two opposite main surfaces. Specifically, each carrier may also be implemented as a direct copper bonding (DCB) substrate or a direct aluminum bonding (DAB) substrate.

[0065] In one embodiment, the package is suitable for double-sided cooling. For example, a first interface structure can thermally couple the encapsulated chip and carrier to a first heat sink, while a second interface structure can thermally couple the encapsulated chip and carrier to a second heat sink.

[0066] In one embodiment, the electronic component is configured as a power semiconductor chip. Therefore, the electronic component (such as a semiconductor chip) can be used in power applications, for example, in the automotive field, and can, for example, have at least one integrated insulated-gate bipolar transistor (IGBT) and / or at least another transistor of another type (e.g., MOSFET, JFET, etc.) and / or at least one integrated diode. Such integrated circuit elements can be fabricated, for example, using silicon technology or based on wide-bandgap semiconductors (such as silicon carbide or gallium nitride). The semiconductor power chip may include one or more field-effect transistors, diodes, inverter circuits, half-bridges, full-bridges, drivers, logic circuits, other devices, etc.

[0067] As the substrate or wafer forming the basis of electronic components, a semiconductor substrate, preferably a silicon substrate, can be used. Alternatively, a silicon oxide substrate or another insulating substrate can be provided. A germanium substrate or a III-V semiconductor material substrate can also be implemented. For example, exemplary embodiments can be implemented using gallium nitride or silicon carbide technology.

[0068] For encapsulation, plastic-like or ceramic materials that can be supplemented by filler particles, additional resins, or other encapsulating additives can be used.

[0069] Furthermore, exemplary embodiments may utilize standard semiconductor processing techniques such as appropriate etching techniques (including isotropic and anisotropic etching techniques, particularly plasma etching, dry etching, and wet etching), patterning techniques (which may involve photomasks), and deposition techniques (e.g., chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), sputtering, etc.).

[0070] The above and other objects, features and advantages will become apparent from the following description taken in conjunction with the accompanying drawings, in which similar or identical parts or elements are indicated by similar or identical reference numerals. Attached Figure Description

[0071] The accompanying drawings, which are included to provide a further understanding of the exemplary embodiments and form part of the specification, illustrate several exemplary embodiments.

[0072] In the attached diagram: Figure 1A A top view of the package according to an exemplary embodiment is shown.

[0073] Figure 1BA top view of a lead frame according to an exemplary embodiment is shown.

[0074] Figure 2 A block diagram of a method for manufacturing a package according to an exemplary embodiment is shown.

[0075] Figure 3 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0076] Figure 4 A top view of a package according to an exemplary embodiment is shown. Figure 5 A side view of the package is shown.

[0077] Figure 6 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0078] Figure 7 A top view of a structure obtained during the execution of a method for manufacturing a package, according to another exemplary embodiment, is shown.

[0079] Figure 8 A cross-sectional view of a preform of an encapsulation manufactured according to an exemplary embodiment is shown.

[0080] Figure 9 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0081] Figure 10 A schematic diagram and a partial enlargement of the structure obtained during the manufacture of the package are shown according to an exemplary embodiment.

[0082] Figure 11 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0083] Figure 12 A top view of a structure obtained during the execution of a method for manufacturing a package, according to another exemplary embodiment, is shown.

[0084] Figure 13 A schematic diagram and a partial enlargement of the structure obtained during the manufacture of the package are shown according to an exemplary embodiment.

[0085] Figure 14 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0086] Figure 15A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0087] Figure 16 A top view of a package according to an exemplary embodiment is shown. Figure 17 A side view of the package is shown.

[0088] Figure 18 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0089] Figure 19 Different views of the structure obtained during the manufacture of the package are shown according to an exemplary embodiment.

[0090] Figure 20 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0091] Figure 21 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0092] Figure 22 A three-dimensional view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0093] Figure 23 It shows that according to Figure 22 A magnified view of a portion of the structure.

[0094] Figure 24 A three-dimensional view of a clamping frame for manufacturing a package is shown according to an exemplary embodiment.

[0095] Figure 25 A cross-sectional view of a clamping frame for a package body is shown according to an exemplary embodiment.

[0096] Figure 26 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0097] Figure 27 A cross-sectional view of a portion of an encapsulation according to an exemplary embodiment is shown.

[0098] Figure 28 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0099] Figure 29 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0100] Figure 30 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0101] Figure 31 A top view of the package according to an exemplary embodiment is shown.

[0102] Figures 32 to 36 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0103] Figure 37 It shows how to execute according to Figures 32 to 36 A top view of a package obtained according to an exemplary embodiment, obtained by a method of manufacturing a package.

[0104] Figure 38 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown.

[0105] Figure 39 A top view of a structure obtained during the execution of a method for manufacturing a package, according to an exemplary embodiment, is shown. Detailed Implementation

[0106] The illustrations in the attached figures are schematic and not to scale.

[0107] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations will be summarized based on the exemplary embodiments that have been developed.

[0108] According to one exemplary embodiment, a package is provided having an external contour defined or delineated by sawing (particularly by mechanical sawing) at least primarily through the encapsulating material, by punching (particularly for one or more leads), and by encapsulation (particularly by molding). Such a package, having punched leads and sawn sides, as well as other preferably molded sides assigned to the leads, can be advantageously manufactured using a lead frame provided by another exemplary embodiment. This lead frame comprises a carrier arranged in a matrix form, having leads extending along the longer direction of the generally rectangular lead frame. The formation of the horizontally arranged leads enables encapsulation (particularly molding) in the transverse or vertical direction while forming stable encapsulating strips (e.g., molded strips), which can be formed parallel to each other and spaced apart from each other. Typical dimensions of the shorter side of such a lead frame (e.g., in the range of 50 mm to 150 mm, particularly in the range of 60 mm to 120 mm) are well compatible with molding techniques. Furthermore, it is possible to monolithize the package by sawing along the longer direction of the lead frame in a very fast manner. Therefore, multiple parallel and horizontal sawing paths can be used for the monolithization of the package and for dividing each encapsulation strip into portions corresponding to the individual packages. Advantageously, this manufacturing process does not result in significant loss of molding material, thus allowing for efficient resource utilization. Furthermore, when performing the formation of the described encapsulation strips, in collaboration with the mold, the conventionally required molding structures (especially runners, and to some extent, gate structures) in the lead frame can be omitted. Such a manufacturing process is very fast, especially when the described mechanical sawing process using a mechanical saw blade can be carried out by sawing horizontally only (or essentially only) through the encapsulation material, without sawing through (or only to a very limited extent, e.g., through tiny metal-tied strips) the metal material. In addition, this manufacturing process also enables testing of easily manufactured packages still at the panel level, i.e., while still forming an integral structure with the lead frame.

[0109] Preferably, the lead frame may be equipped with a clamping frame including a plurality of clamps arranged in both horizontal and vertical directions. Preferably, the clamps of the clamping frame may be arranged such that a 180° twist or rotation of the clamping frame will not cause misalignment.

[0110] The embodiments are also compatible with dual-gate packages, i.e., packages that include different portions with different lead frame thicknesses.

[0111] According to an exemplary embodiment, a multi-process block concept is provided for reducing manufacturing workload (particularly for double-sided) package platforms. This embodiment makes it possible to achieve full LTI (lead end inspection) functionality with ultra-high lead frame density, providing a very simple molding layout, enabling efficient EMC (epoxy molding compound) usage, and allowing panel-level testing. Advantageously, these features can be obtained using existing equipment and the current equipment footprint can be maintained.

[0112] The key feature of the exemplary embodiment, as described, is that the carrier of the lead frame is rotated by 90° compared to conventional methods. Specifically, the structure can be held horizontally by using tie rods that can be connected to the vertical leads. Furthermore, it becomes possible to use cavity molding without runners and gates, and only for defining the sides with leads. Molding strips (or more generally, encapsulation strips) can be formed along the short sides of the lead frame for easy filling. As described, it is therefore possible to form a barcode-shaped molding pattern to simultaneously encapsulate the electronic components and carrier along a complete column of the lead frame. Advantageously, a punching process along a vertical channel or direction is possible. This allows for the formation of LTI features and the simultaneous removal of the vertical leads in a common process. Furthermore, it is possible to hold the preform of the package vertically using only the molding material. In particular, panel-level testing can be performed using this processed panel. Furthermore, thin slitting (e.g., a slitting track thickness of at least 30 µm, preferably 150 µm, and most preferably 200 µm to 400 µm, especially for certain metal contents) and rapid slitting only in horizontal channels or directions are possible (e.g., sawing speeds up to 1000 mm / s (or even higher effective speeds when deploying multiple spindle designs), but preferably 300 mm / s to 600 mm / s). Advantageously, no metal (e.g., copper) is present within this channel. Moreover, slitting can produce very narrow device pitches. This allows for highly parallel designs and processing. Slitting can be performed in a particularly fast manner and, for example, only in one direction.

[0113] Such embodiments can provide significant improvements to the manufacturing process, thereby reducing manufacturing effort and material waste during high-volume production of different types of packages, particularly SON, TOLL, and DSO packages. This simultaneously achieves the goal of maintaining the device's footprint while avoiding additional work on more complex manufacturing equipment.

[0114] In particular, exemplary embodiments can provide ultra-high leadframe density, bypass conventional bottlenecks in molding processes, allow panel-level testing, and efficiently utilize leadframe areas and efficiently monolithize the package. The process flow according to an exemplary embodiment can further enable LTI feature integration.

[0115] Exemplary embodiments can be implemented for, for example, DSO, TOLL, and SON packages. These types and certain other types of packages (e.g., TDSON or HSOF packages) typically sacrifice lead frame density to achieve efficient monomerization. Other packages, such as S3O8 packages (e.g., TSDSON type), can provide adequate lead frame density but may require a sawing monomerization process, which is typically slower than a rapid punching process, for example, due to excessive copper in the corresponding sawing passes.

[0116] Exemplary embodiments can reduce the manufacturing workload of various package types, such as SON packages (e.g., TDSON, TSDSON), DSO packages (e.g., DSO), and TOLL packages (e.g., HSOF). First, exemplary embodiments can improve leadframe design. Second, the molding process can be simplified. Furthermore, final monomerization can be improved.

[0117] Regarding leadframe design, according to an exemplary embodiment, the dead zone traditionally reserved for the flow channel structure on the leadframe can be reduced by rotating each individual package 90° within the upper structure of its leadframe, thereby reducing the package spacing. Therefore, the workload of manufacturing the leadframe can be significantly reduced.

[0118] Considering the molding process, the formation of encapsulating strips for cavity molding can make the traditional runner structure on the lead frame redundant or unnecessary. This method allows for easier increases in panel size.

[0119] Regarding package immobilization, the lead frame design can be adapted through exemplary embodiments to allow for punched immobilization of the leads. Immobilization along a longer lead frame axis can be designed to allow for rapid sawing immobilization, particularly when copper or any other metal is completely or largely omitted in the sawing pass. In one embodiment, device testing at the panel level prior to final sawing immobilization is advantageous. Furthermore, the manufacturing process can be designed to allow for full LTI functionality.

[0120] Therefore, the key points of the exemplary embodiment consist of the following: (a) a single package is rotated 90° within its leadframe assembly (particularly unlike conventional methods), (b) replacing the molding flow channel structure with a limited space-map molding route along the short semi-axis of the leadframe significantly reduces leadframe dead zones and molding material waste, and (c) a combination of punching-based and sawing-based monolithization is performed along the horizontal, lead-terminal, and vertical, leadless package sides, respectively. Sawing also allows for the creation of complete LTI features. The manufacturing process according to an exemplary embodiment results in a neutral (particularly dual-profile) package with punched lead terminals and two split sides.

[0121] According to another exemplary embodiment, the clamp mounting process can be parallelized. Specifically, the aforementioned manufacturing process can be used for the arrangement of device structures including clamps. In such embodiments, the aforementioned features or advantages (particularly in cavity molding, sawn sides, punched leads with LTI, etc.) can be combined with (e.g., butterfly-shaped) leadframe design and clamp frame design. Specifically, each leadframe panel can mount one or more clamp frames. In such embodiments, the leads of the clamp frames can be at the same height level as the leads of the leadframes. Specifically, no protrusions from this surface are provided, thus enabling a simple and conventional mold design. After assembling one or more clamp frames, the leads of both the leadframes and clamp frames can be punched. Specifically, the clamp frames can have gate contact terminals separated from the source terminals and incorporated by punching one or more leads. Therefore, exemplary embodiments can realize embedded clamp frame architectures to reduce manufacturing effort in (particularly double-sided) package platforms.

[0122] In particular, an embedded clip design can be deployed that (a) avoids the manufacturing workload that may occur in conventional leadframe designs and (b) can significantly reduce the workload in the conventional clip attachment process. Therefore, a universal process design can be provided for high-volume manufacturing of package platforms (particularly double-sided), which can significantly reduce workload during package manufacturing. Similarly, using the described clip frame design, virtually no additional manufacturing equipment is required, and the final package footprint can be maintained.

[0123] According to one exemplary embodiment, a clamping frame can be added to such a lead frame, the lead frame being designed to avoid one lead side of the double-sided package in its initial lead frame upper structure. Additionally, a package column can be connected to its identical but mirror-image column via a lead wire structure that holds the two package columns in a butterfly arrangement within the lead frame.

[0124] In several embodiments, after die attachment (i.e., mounting electronic components onto a carrier of the leadframe), an embedded clamping frame can be attached to the leadframe. Such an embedded clamping frame can be designed with a similar butterfly-shaped upper structure and can be deposited or placed within the leadframe. Such clamping frames can be punched from a continuous roll and deployed in a multi-part pick-and-place process, at which point all individual clamping frames required to load a leadframe can be simultaneously attached to the leadframe. Furthermore, the individual clamping frames can be bent such that the final leads of the clamping frames and the leadframe are at the same height level. The clamping frames and the leadframe can be connected via conductive (e.g., solder bed-facilitated) plug-in connections to allow for efficient plating.

[0125] Therefore, the clamp frame can be transferred into the lead frame. The leads of both the clamp frame and the lead frame can be arranged at the same height level. The clamp frame and the lead frame can be connected via conductive plug-in connections. All subsequent manufacturing processes can be similar to the multi-process block concept of the previously described (especially double-sided) package platform.

[0126] According to an exemplary embodiment, the clamp frame design allows for the deposition of conductive solderable points (e.g., silver dots) on the gate leads via continuous plating. When the gate leads are designed as part of the clamp frame, the plating can be performed before the clamp frame is punched from its original source roll.

[0127] Therefore, one exemplary embodiment relates to a package having punched leads, sawn sides, and no heterogeneous medium-mediated connection between the clip and the leads. In other words, such an embodiment can provide one or more leads that are part of the clip, rather than separately connected to it. Advantageously, such a clip frame can be provided with a rotating butterfly design within the lead frame pattern, which can allow for a high clip frame density. In particular, the absence of solder joints between the clip and the leads can characterize a clip structure in which the clip itself can have one or more integrally formed leads.

[0128] Instead of butterfly-shaped clamp frames and lead frames, both frames can be stacked on top of each other to create a multi-layer lead frame structure to be punched through.

[0129] According to yet another exemplary embodiment, an embedded frame can be provided to reduce the manufacturing workload of (particularly TO-type) package platforms. In such embodiments, it is permissible to manufacture packages, particularly dual-track packages, using multi-process blocks that reduce workload. In particular, a modified leadframe manipulation concept can be introduced into the manufacturing process, which can allow for labor-saving molding processes (particularly by forming encapsulation strips formed by molding) and a monomerization method that combines punching and sawing monomerization.

[0130] For example, a dual-track package similar to the TO 247 type package can be manufactured through exemplary embodiments, as follows: Regarding leadframes, standard leadframes can form the basis for further manufacturing processes. Custom leadframes can be created by cutting the lead length via punching prior to molding.

[0131] For the subsequent molding process, multiple package assemblies can be placed in the mold cavity to create interlaced leads. Then, as described above, strip molding can be performed, and horizontal auxiliary molding strips connecting multiple package assemblies can be incorporated. For lead plating, appropriately shaped (e.g., alligator-shaped) clips can be attached to the lead frame on the opposite side of the molding strips to achieve electrochemical plating.

[0132] At the end of the manufacturing process, such as as described above, a separation or monomerization process can be performed. Specifically, punching monomerization can be performed along the short side of the lead frame. Monomerization along the long lead frame axis can be designed to allow for rapid sawing monomerization (especially where no metal, such as copper, is present in the sawing path). The easily manufactured package according to such an embodiment can have slightly modified contours or footprints, and can produce asymmetrical packages (see, for example, see...). Figure 37 ).

[0133] The manufacturing process described according to an exemplary embodiment allows for a relatively small manufacturing workload while achieving a highly mature leaded TO package through increased lead frame density, reduced molding waste, and a highly advantageous monolithization approach. In particular, the staggered side-by-side arrangement of segmented standard dual-track lead frame strips, along with highly material-saving strip molding and sawing monolithization, can be used in an advantageous process combination to produce a device with only a slightly altered footprint.

[0134] The resulting package, according to an exemplary embodiment, may have punched leads, sawed sides, and an asymmetrical final package footprint. The reassembled lead frame can be connected via horizontal auxiliary molding strips. The described manufacturing process may be particularly advantageous for dual-track packages.

[0135] Figure 1A A top view of a package 100 according to an exemplary embodiment is shown.

[0136] The illustrated package 100 includes a carrier 102. Electronic components 104 are mounted on the carrier 102. An encapsulant 106 encapsulates the carrier 102 and the electronic components 104. A lead 108 extends from the encapsulant 106 and has a punched surface 130, i.e., a surface formed by punching. Opposite sides 110 of the encapsulant 106 have sawed textures 281, i.e., surface textures formed by sawing (see reference). Figure 5 (To be described in more detail).

[0137] Figure 1B A lead frame 180 according to an exemplary embodiment is shown. The lead frame 180 shown includes a patterned conductive sheet 182. A plurality of carriers 102 are defined within the sheet 182 and arranged in rows 134 (along...). Figure 1B (extending horizontally) and column 136 (along...) Figure 1B (Extending vertically). Leads 108 are assigned to each carrier 102. The sheet 180 has a larger extension scale L along row 134 compared to the smaller extension scale D along column 136. Leads 108 extend along row 134 instead of along column 136.

[0138] Figure 2 The manufacturing process according to an exemplary embodiment is shown as follows. Figure 1A A block diagram of the method of the package 100 shown. See the following reference. Figure 2 The reference numerals mentioned in the description correspond to those based on Figure 1A An embodiment of the package 100.

[0139] As shown in box 210, electronic component 104 can be mounted on carrier 102. Referring to box 220, at least a portion of carrier 102 and at least a portion of electronic component 104 can be encapsulated with encapsulant 106. In box 230, at least one lead 108 extending beyond encapsulant 106 can be punched. Furthermore, referring to box 240, at least a portion of at least one side 110 of encapsulant 106 can be sawn.

[0140] For example, although the two opposite sides 110 of the encapsulation 106 are partially or completely sawn and thus have sawn texture 281, the other two opposite sides of the encapsulation 106 (from which the lead 108 extends) have molded texture, i.e., have the surface characteristics of a molded surface (as shown in the reference). Figure 5 For a more detailed description, see figure 285).

[0141] Figure 3 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0142] According to an exemplary embodiment, the structure shown is obtained by processing a lead frame 180. The lead frame 180 includes a patterned conductive sheet 182, such as a punched or etched copper plate. A plurality of carriers 102 are defined within the sheet 182 in a matrix pattern, each carrier 102 being configured to carry a corresponding electronic component 104. In other words, the carriers 102 are arranged in rows 134 of the lead frame 180 (according to...). Figure 3 (extending horizontally) and column 136 (according to) Figure 3 (Vertically extending) arrangement. As shown, the shorter side 132 of the carrier 102 may extend along the direction of column 136. In the embodiment described herein, a plurality of leads 108 configured to form an external connection structure for an easily manufactured package 100 are assigned to each carrier 102 and form part of a lead frame 180. More specifically, the respective leads 108 can electrically connect a respective electronic component 104 mounted on a respective carrier 102 to the electronic environment of the easily manufactured package 100. The connection between the leads 108 and the electronic component 104 may be formed by conductive connection elements such as clips 252 and / or connecting wires 254.

[0143] like Figure 3 As schematically shown, the lead frame 180 has a larger extension dimension L in the horizontal or main direction compared to a smaller extension dimension D in the vertical or lateral direction. Figure 3 In some embodiments, the length L can be, for example, in the range of 250 mm to 300 mm (e.g., about 250 mm or about 300 mm), while the width D can be, for example, in the range of 60 mm to 100 mm (e.g., about 62 mm, about 70 mm, or about 100 mm). In the easily manufactured package 100, all leads 108 extend along the main direction and along two antiparallel directions. Furthermore, Figure 3 A tiny tie bar 112 is shown, integrally formed with the carrier 102, extending laterally and connecting the carriers 102 of corresponding columns 136 to each other. The tie bar 112 can provide stability to the lead frame 180 in early processing stages, particularly before encapsulation. In other words, each column 136 of the carriers 102 may be provided with a tie bar 112 connecting all the carriers 102 of the corresponding column 136. (Using according to...) Figure 3 The manufacturing process results in a package 100 whose horizontal parallel side 110 is primarily defined by the material of the encapsulant 106 and, to a lesser extent, by the copper material of the tie bar 112 connected to the corresponding carrier 102.

[0144] Similarly, Figure 3 As shown, two parallel metal index strips 184 form the upper and lower ends of the lead frame 180 and extend along the main direction. Rows 134 of the carrier 102 are arranged vertically between the upper index strip 184 and the lower index strip 184. The index strips 184 simplify the automatic manipulation and alignment of the lead frame 180 during processing.

[0145] As already mentioned, corresponding electronic components 104, such as semiconductor chips, are mounted on each carrier 102. Subsequently, the carrier 102 and corresponding portions of each of the electronic components 104 mounted on the carrier 102 can be encapsulated by a molded encapsulant 106. Thus, parallel and spaced vertically extending encapsulant strips 124 are formed, each encapsulant strip being made of molded component material and covering the corresponding column 136 of electronic components 104. Multiple packages 100 can be efficiently encapsulated using a common encapsulation process. Therefore, multiple parallel encapsulant strips 124 made of the material of the encapsulant 106 can be formed during the manufacturing process, wherein each strip 124 encapsulates all carriers 102 and all electronic components 104 of the corresponding column 136.

[0146] After the electronic component 104 is surface-mounted on the carrier 102 and connected to the carrier 102 by clips 252 and connecting wires 254, and after encapsulation, the method includes plating the exposed portions of the leads 108. Plating the leads 108 with a soldering material such as tin enables lead end inspection of the manufactured package 100 and facilitates the connection of the package 100 to the electronic environment through soldering.

[0147] As a first process of monomerizing the processed lead frame 180 into individual packages 100, the leads 108 extending beyond the encapsulation 106 of the carrier 102 can be cut by punching on both lateral sides of each package 100. The punching of the leads 108 can be achieved by removing the continuous strip of material connecting the lead frames 180 of the different carriers 102.

[0148] As a second process during the monomerization of individual packages 100, the two opposite horizontal sides 110 of the encapsulation 106 of each respective package 100 can be defined by mechanical sawing using a rotating saw blade (not shown). Thus, each strip 124 is divided into multiple segments by sawing, each segment forming a part of the corresponding package 100. In this way, easily manufactured encapsulated packages 100 are obtained, having partially exposed leads 108 on two opposite side surfaces, while the two opposite horizontal side surfaces or sides 110 of the encapsulation 106 have no leads 108 and are defined by sawing. Specifically, the method includes sawing through the tie bars 112 of the corresponding column 136 while sawing each encapsulation strip 124 into multiple packages 100. The sawing process is quick and simple by ensuring that most of the material being sawn is the molding material of the large volume encapsulation strip 124 and only to a very small extent the copper material of the tiny tie bars 112.

[0149] Advantageously, a special punching can be performed before horizontal sawing. More specifically, the punching process can be performed along the vertical punching direction 142, and sawing can be performed along the horizontal sawing direction 144, i.e., perpendicular to the punching direction 142. Figure 3 As shown, sawing can be performed in a sawing direction 144 that is perpendicular to the extension direction of each column 136.

[0150] Optionally, the package 100 can be tested for electronic functionality before sawing and after punching. Testing the package 100 at the panel level can greatly simplify the testing process.

[0151] like Figure 3 As shown, the described manufacturing process can be performed in batches, enabling the package 100 to be produced at the panel level, i.e., by processing the common lead frame 180 in a highly parallel manner.

[0152] according to Figure 3 The manufacturing process and lead frame design provide a space-optimized design without the need for gates and runner areas for encapsulation. This allows for the acquisition of high-density, easily manufacturable packages 100. The formation of the molding strip 124, formed by cavity molding, is compatible with gateless layout schemes. This manufacturing concept eliminates dead zones, allowing for more efficient use of molding compound per device or package 100. Furthermore, the elimination of degates further simplifies the manufacturing process. During manufacturing, lead / connector punching can be performed via single-sided punching. Therefore, additional lead wires are not required. The described plating process allows for the simple fabrication of LTI (Lead End Inspection) features. Through two-stage punching, there are no electrical connections between leads 108. Furthermore, panel-level marking and testing are possible. Cutting in one direction eliminates the need for segmented cutting. The amount of copper in the cut channel is very small (if any), enabling rapid cutting, particularly at speeds of 100 mm / s or higher. The punching of the connectors is perfectly compatible with the formation of LTI features because it is a parallel process. Since punching requires some space on the lead frame 180, punching is only used in one direction. Slitting is a space-saving unitization process, but it can be slow if there is too much metal in the slitting channel. Therefore, an efficient manufacturing process can remove all the main metal components in the slitting channel, for example, by configuring the slitting channel to consist only of encapsulating material (optionally only except for the small metal-tethered pull strip 112). A certain amount of material in the slitting channel can also be removed from above along with the punching process to further accelerate the sawing process. Referring again to the molding strip 124, the device or preform of the package 100 can be held in place solely by the material of the molding compound. Therefore, there is no risk of shortage. Testing of the package 100 in the panel or lead frame 180 is also possible.

[0153] Furthermore, the panel or lead frame 180 can be provided without connecting ribs and can be manipulated for plating, marking, and testing. It can be attached to a slit foil (not shown) or placed on a slit chuck (not shown) for tape-free slitting. The easily manufactured package 100 or device can have a surface textured cut on both sides (see [reference]). Figure 1A and Figure 5 (See attached figure 281) and the surface texture of the cavities on both sides (see attached figure 281) Figure 5 (Ref. 285 in the accompanying drawings). The package 100 has punched leads 108 and sawn sides 110. In one embodiment, the two sawn sides 110 may involve only the surface of the molding compound, without cutting the tie bar 112 that forms part of the sawn surface. In another embodiment, the sawn surface at the side 110 may be formed primarily of the material of the encapsulation 106, with a very small portion involving cutting the tie bar 112.

[0154] In the manufacturing process executed according to the workflow corresponding to arrow 250, this process can be referenced from the above. Figure 1BBeginning with a leadframe 180 of the type described, which can here be implemented as a punched or etched copper plate. Various carriers 102 and tie bars 112 between opposing lead strips 184 can be formed as part of the leadframe 180. The manufacturing process can then proceed to die attachment, during which electronic components 104, such as semiconductor chips, can be attached to corresponding mounting sections (e.g., die pads) of the carriers 102. The upper main surface of such electronic components 104 can be connected to leads 108 via clips 252, connecting wires 254, etc. After the clip attachment and lead connection formation processes, encapsulation can be performed by molding, as schematically shown by reference numeral 256. The molding process can be performed in a simple manner without a gating system (which might traditionally be necessary) and with limited work related to the gating, thereby forming a plurality of parallel encapsulation strips 124 implemented here as molding compound strips. After molding and as indicated by reference numeral 258, a plating process can then be performed to plating the exposed surface portions of the leads 108. Thus, the leads 108 can be covered with a plating layer 120. This plating process can be performed to provide lead end inspection (LTI) functionality. Subsequently, as indicated by reference numeral 260, a punching process can be performed, in which the vertically arranged tie bars 112 between the carriers 102 and the integrally connected leads 108 of adjacent carriers 102 can be separated. At the stage of the manufacturing process indicated by reference numeral 262, the still integrally connected package 100 can be tested and marked at the panel or lead frame level. As indicated by reference numeral 264, the individual packages 100 can be individually separated from the previously integral encapsulation strips 124 and connecting components by sawing along horizontally arranged saw marks 266. Subsequently, a tape-and-reel process can be performed, see reference numeral 268, and the individual packages 100 can be detached from the tape into a bowl. During the manufacturing process of the lead frame 180 using the described manufacturing method, the guide tape 184 with through holes 270 simplifies the transport and alignment of the lead frame 180 and the described components.

[0155] In particular, the combination of the design of the lead frame 180, the formation of the encapsulation strip 124, and the combined punching and sawing monomerization process has the greatest advantage in simplifying the manufacturing process and manufacturing the package 100 with less effort, while reducing or even minimizing waste.

[0156] Figure 4 A top view of a package 100 according to an exemplary embodiment is shown. Figure 5 A side view of the package 100 is shown.

[0157] Figure 4 and Figure 5The package 100 shown includes a conductive carrier 102, which is implemented herein as a lead frame 180 (e.g., Figure 3 The copper portion (as shown). The carrier 102 is encapsulated by the encapsulant 106, therefore in Figure 4 and Figure 5 It is not visible in the image. Furthermore, electronic components 104 (e.g., semiconductor dies) are also not visible in the image. Figure 4 and Figure 5 (As shown in the figure) The surface is mounted on the carrier 102. Furthermore, a molded encapsulation 106 encapsulates the carrier 102 and the electronic component 104. As shown, an array of parallel leads 108 extend from the encapsulation 106 at two opposite sides. Each lead 108 has a punched end face 130. The two remaining sides 110 of the encapsulation 106 are entirely formed by sawing.

[0158] like Figure 4 As shown, leads 108 are arranged at two opposite, shorter sides 132 of the carrier 102. Sides 110 are defined by sawing and are defined solely by the material of the encapsulant 106, i.e., by a molded compound material having filler particles 284. Figure 5 As can be seen, the encapsulation 106 has inclined sidewalls 114 at the surface defined by molding, and the lead 108 extends from the encapsulation 106 at these sidewalls 114. The side portion 110 defined by sawing has vertical sidewalls. On the bottom side of the package 100, the carrier 102 (in Figure 4 and Figure 5 (Not shown in the image) can be exposed from the encapsulation 106.

[0159] Figure 4 and Figure 5 The embodiment illustrates a package 100 having leads 108 extending parallel to encapsulants 106 at two opposite, sloping sidewalls 114 of the package body 100. In other words, the package 100 is a double-sided package. The free ends of the leads 108 are formed by punched surfaces 130. The surface portion 274 of the encapsulants 106 adjacent to the leads 108 is defined by a molding process. However, the sides 110 are defined by sawing, more specifically by mechanical sawing. Figure 5As shown, the sawn surface 276 of the package 100 has a high roughness, for example, Ra = 1 μm, and has micro-ripples 278, as shown in the partially enlarged sawn texture 281. The cut filler particles 282 can also be seen on this surface. Since the inclined sidewall 114 is defined by a molding process, the inclined sidewall 114 has a surface appearance as shown in the partially enlarged molding texture 285. The filler particles 284 of the molding compound at the inclined sidewall 114 defined by the molding process are coated with a molding material (different from the cut filler particles 282) and form a dot or pixel structure on the outer surface of the inclined sidewall 114.

[0160] Figure 6 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown. Figure 7 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to another exemplary embodiment, is shown.

[0161] Figure 6 and Figure 7 Different tie bars 112 are shown, which connect different carriers 102 and extend vertically or obliquely. The vertically extending tie bars 112 connect and stabilize the carriers 102 of individual columns 136. The oblique tie bars 112 also allow even carriers 102 of adjacent columns 136 to be connected to each other. For individualization, the tie bars 112 can be removed by sawing and / or punching. According to... Figure 7 All tie rods 112 are vertically oriented. According to Figure 6 Some tie bars 112 are oriented vertically, while others are oriented at an angle. Therefore, in the exemplary embodiment, thin tie bars 112 can be added within the sawing path to increase stability at the expense of a slightly reduced sawing speed. Thus, all leads 108 can remain connected after lead wire punching. Plating can be applied to create LTI features.

[0162] Figure 8 A cross-sectional view of a preform of a package 100 manufactured according to an exemplary embodiment is shown. Figure 8 As shown, the ratio between the surface area of ​​the exposed tie strip section 112 at the corresponding side 110 and the total surface area of ​​the corresponding side 110 is quite small, for example, less than 10% or preferably less than 3%. By configuring the tie strip 112 to have a thicker portion 113 inside the encapsulation 106 and a thinner portion 116 at the side 110, it is advantageous to confine the metal in the sawing path to achieve a high sawing speed. Descriptively, it can be based on... Figure 8Create a molded tie bar 112. This can increase the sawing speed. Therefore, the reduced amount of copper can be located within the sawing path. The cutting speed can be further increased by using a thicker saw blade (e.g., 100 μm to 400 μm thick, preferably 300 μm to 400 μm).

[0163] therefore, Figure 8 This illustrates how the amount of copper to be sawn in the cutting path can be further reduced. To achieve this, the tie bar 112 can be locally thinned at the sawing point. Through the illustrated design of the tie bar 112, a fast and simple sawing process can be achieved while maintaining high stability of the carrier 102 in the lead frame 180.

[0164] Figure 9 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0165] Figure 9 The embodiment illustrates the pin-side design of the leadframe 180. According to... Figure 9 Some tie bars 112 are arranged vertically to connect a row of 136 carriers 102. Other tie bars 112 have horizontally extending tie bar sections that can be removed by punching before sawing. By taking this measure, the carriers 102 in the lead frame 180 can be sawed quickly and easily while maintaining high stability, because the tie bars 112 can be partially removed by punching before sawing.

[0166] Figure 9 The preferred embodiment corresponds to a pin-side design, wherein only one tie bar 112 is retained at the cut. Other tie bars can be punched out after plating.

[0167] Figure 10 A schematic diagram and a partial enlargement of the structure obtained during the manufacture of package 100 according to an exemplary embodiment are shown.

[0168] Figure 10 The schematic diagram 280 and the enlarged partial diagram 282 of the figure with lead frame 180 again show that all leads 108 extend horizontally along the vertical side of the carrier 102, while there are no leads 108 on the horizontal side of the carrier 102.

[0169] Figure 11 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0170] like Figure 11As indicated by arrow 284, barcode-shaped cavities can be used for bar molding. Therefore, parallel and spaced encapsulation strips 124 can be formed without complex runners and without gate requirements.

[0171] Figure 12 A top view of a structure obtained during a method of manufacturing package 100 according to an exemplary embodiment is shown. This embodiment provides a very simple molding flow design capable of handling leadframe designs of standard sizes (60mm to 70mm × 250mm) and also capable of handling leadframes with larger panel sizes, such as 300mm × 100mm leadframes.

[0172] Figure 12 The above architecture can be appropriately scaled in the vertical direction. For example, Figure 11 The configuration shown can have an extension dimension of, for example, 300 mm in the horizontal direction, while the dimension in the vertical direction can be, for example, 60 mm to 70 mm. According to... Figure 12 The vertical dimension can be, for example, 100 mm, while the horizontal extension can be, for example, 300 mm. Therefore, the exemplary embodiment can be appropriately scaled to different panel sizes.

[0173] Figure 13 A schematic diagram 280 and a partial enlargement 282 of the structure obtained during the manufacture of package 100 according to an exemplary embodiment are shown.

[0174] Figure 14 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to another exemplary embodiment, is shown.

[0175] like Figure 13 and Figure 14 As shown, exemplary embodiments can be applied to distinctly different package types. Figure 13 The embodiment corresponds to the TSDSON-8 design of the S3O8 package platform, while Figure 14 The embodiments relate to the HSOF design of the TOLL package platform.

[0176] Figure 15 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to yet another exemplary embodiment, is shown. This embodiment corresponds to punching out tie rods and lead wires within a molding window.

[0177] Figure 15 A DSO package design using bare die pads and leads 108 as the corresponding carrier 102 is shown. According to... Figure 15Encapsulation windows 286 can be formed in the molded encapsulation strip 124. Therefore, these windows 286 can be referred to as molded windows. Within the molded windows 286, the metal tie rod 112 and / or lead wire can be removed by punching, thereby simplifying the subsequent sawing process. After sawing, due to the presence of the previous windows 286, a recess 150 is formed at the edge of the obtained encapsulation 100.

[0178] Figure 16 A top view of a package 100 according to an exemplary embodiment is shown. Figure 17 A side view of the package 100 is shown. Figure 16 and Figure 17 In one embodiment, the encapsulation 106 has two recesses 150, each located in the central portion of a corresponding one of two opposite sides 110. Therefore, each sawn surface can be provided with a corresponding recessed area.

[0179] Therefore, the forming of the molded window 286 and the subsequent punching process of removing the tie bar 112 in the corresponding window 286 can result in the formation of a recess 150 in the side 110 defined by sawing. In other words, according to Figure 16 and Figure 17 The side portion 110 is partially formed by sawing; that is, the outer section of the side portion 110 is formed by sawing. In contrast, the formation of the side portion 110 has a corresponding central section of the recess 150 defined by molding and punching rather than sawing. Regarding Figure 16 and Figure 17 The texture of the sawn surface 276 of the package 100 shown can be referenced. Figure 5 The accompanying figure is labeled 281.

[0180] Figure 18 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to another exemplary embodiment, is shown. Figure 18 A lead frame 180 designed according to a DSO package is shown.

[0181] Figure 19 Different views of the structure obtained during the manufacture of package 100 according to an exemplary embodiment are shown. Figure 19 Enlarged details related to the barcode cavity molding are shown. The molded V-groove 290 in the encapsulation 106 reduces any potential warping issues, which will be described in more detail below.

[0182] In undesirable circumstances, the barcode cavity molding design that produces encapsulation strip 124 may involve warping issues. Figure 19An embodiment capable of strongly suppressing any warping tendency is shown. As shown in the top and cross-sectional views of the partially processed lead frame 180, grooves 290 can be formed at locations where the processed lead frame 180 can be subsequently individualized into individual packages 100 by sawing. These grooves 290, preferably V-shaped, thus reduce the sawing depth, simplify the sawing process, and strongly suppress warping, such as... Figure 19 The right side is schematically shown as warping.

[0183] Figure 20 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to another exemplary embodiment, is shown.

[0184] according to Figure 20 In one embodiment, the illustrated lead frame 180 includes clamp frames 138, each clamp frame 138 including a plurality of integrally formed clamps 152 for the carrier 102, and extending laterally between two adjacent columns 136 of the carrier 102 of the lead frame 118. More specifically, each clamp frame 138 includes a central tie bar 140 extending laterally, and includes clamps 152 on two opposite sides of the central tie bar 140. The illustrated clamp frames 138 can be connected to the carrier 102 (or more precisely, to the electronic components 104 mounted on the respective carrier 102) between two adjacent columns 136 of the lead frame 180. The connection between the clamp frames 138 and the carrier 102 can be established by a mechanical plug mechanism. However, conductive paste, such as solder paste, may also be provided at the joint between the lead frame 180 and the respective clamp frames 138, for example. By connecting the clamp frames 138 to the lead frame 180, each clamp 152 of the clamp frames 138 can be simultaneously connected to a corresponding one of the electronic components 104 assembled on the carrier 102. Following the connection process, the method includes separating the clamp frame 138 into individual clamps 152 by a punching process, which separates and individualizes the individual package bodies 100. More specifically, the method may include separating the clamp frame 138 into clamps 152 by punching away the tie bars 140 connecting adjacent clamps 152 of the respective clamp frame 138.

[0185] Advantageously, each corresponding clip 152 may integrally include (and thus provide to) the corresponding package 100) a lead 108 (therefore forming an integral portion of the corresponding clip 152). Thus, a direct physical connection exists between the component contact portion of the corresponding clip 152 and the lead 108. The portion of the three-dimensionally curved clip 152 providing the integral lead 108 can be arranged at the same vertical height as the carrier 102.

[0186] therefore, Figure 20The embodiments provide a parallel clamp mounting concept based on inserting an electronic clamp frame 138 into the lead frame 180. This allows for the establishment of an electrical connection between the lead frame 180 and the clamp frame 138, which also facilitates the creation of LTI plating. The electrical connection can also be provided via wire connection, conductive adhesive, or solder connection.

[0187] about Figure 20 Implementation examples, refer to Figure 3 A detailed description is provided below. The explanation will be based on... Figure 20 Manufacturing concept and Figure 3 The differences are compared. According to... Figure 20 A clamping frame 138 is provided with a plurality of clamps 152 arranged on both sides of a vertically extending clamping bar 140. Thus, a linear arrangement of vertically extending clamps 152 is provided on each side of the clamping bar 140. Due to... Figure 20 The clamping frame 138 is configured in a butterfly shape, with corresponding clamps 102 formed on the left and right sides of the clamping strip 140, respectively.

[0188] Although according to Figure 20 The clamping frame 138 exhibits a certain degree of anisotropy, but it can also be arranged symmetrically with respect to the central axis defined by the clamping tie bar 140. In this case, the manipulation of the clamping frame 138 is particularly resistant to failure.

[0189] The clamping frame 138 shown can be used as follows Figure 20 The lead frame 180 is connected in the manner shown, such that the corresponding clip 152 is attached to the upper main surface of the surface-mounted electronic component 104, which has previously been mounted on the die pads of the carrier 102. Highly advantageously, the clip 152 of the clip frame 138 already includes the structure for later forming the leads 108. In other words, a clip 152 with integrally formed leads 108 can be provided. After molding the encapsulation strips 124 as described above, the exposed clamping strips 140 between adjacent encapsulation strips 124 can be removed by punching. Subsequently, the package 100 can be individualized by horizontal sawing.

[0190] Figure 21 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0191] Figure 21A lead frame 180 with a clamping frame 138 is shown, which can be easily inserted into the lead frame 180. The clamping frame 138 can be connected manually or automatically by simply creating a shape closure between the cooperating connection structure 294 of the clamping frame 138 and the cooperating connection structure 296 of the lead frame 180. In the illustrated embodiment, as shown in partial magnification 295, the connection structure 294 can be a pin, while the connection structure 296 can be a corresponding recess. The reverse is also true.

[0192] Figure 22 A three-dimensional view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown. Figure 23 It shows that according to Figure 22 A partial magnification of the structure. Figure 22 and Figure 23 This relates to the connection between the butterfly clip frame 138 and the lead frame 180.

[0193] The electrical connection required for electroplating can be established between the clamping frame 138 and the lead frame 180. For example, the electrical connection can be formed by printing solder paste onto the seams of the lead frame 180. The pins or bars of the clamping frame 138 can slide over the solder paste and can be applied. Additional connecting ribs may optionally be provided for greater stability and better molding. Roll forming is possible in a cross-section with a single bending direction. In particular, in one embodiment, silver plating of the strip is possible.

[0194] Figure 22 The butterfly arrangement of the clamp frame 138 is shown. The actual clamp 152 is configured to protrude vertically so that it can be attached to the upper main surface of the electronic component 104. When the clamp frame 138 is mounted in the lead frame 180, the lower lead portion of the clamp 152, including the integrally formed lead 108, can be arranged at the same vertical height as the carrier 102.

[0195] Figure 24 A three-dimensional view of a clamping frame 138 for manufacturing a package 100 is shown according to an exemplary embodiment. Figure 25 A cross-sectional view of a clamping frame 138 for a package 100 according to an exemplary embodiment is shown. Figure 26 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown. Figure 26 The clamping frame 138 is assembled onto the lead frame 180. Figure 27 A cross-sectional view of a portion of an encapsulation 100 created using a clip 152 of a clip frame 138 according to an exemplary embodiment is shown.

[0196] To utilize the conductive clip 152, solder and double copper layers are not required in the lead terminal area. To easily, densely, and in a dimensionally variable manner, the lead frame 180 can be manufactured by punching into corresponding recesses. A corresponding clip frame 138 can be used as an insertion portion to be inserted into a corresponding recess in the lead frame 180, thereby achieving a high-density clip frame manufacturing process. The tie bars 112, 140 can be punched (and optionally sawn) for both the lead frame 180 and the clip frame 138, preferably in a common process. The resulting package 100 or device may have a double-sided sawn surface texture, a double-sided cavity surface texture, and the conductive clip 152. Specifically, such a package 100 or device may have punched leads 108, sawn sides, and the conductive clip 152.

[0197] The lead wire 108 of the clamping frame 138 can be individually cut off by punching out the clamping bar 140. Figures 24 to 26 More details of the described arrangement are shown. Figure 27 A cross-sectional view of the corresponding package 100 is shown in the figure.

[0198] Figure 28 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0199] In particular, the space-saving staggered design of the leads 108 is advantageous for manufacturing dual-track packages 100 (e.g., packages 100 in which the carrier 102 includes segments of different thicknesses). In particular, the embedded lead frame 180 can be very efficient in terms of space saving. Such a concept can be advantageously combined with single-pass slitting (preferably slitting in a metal-free manner).

[0200] Figure 28 This illustrates how a conventional lead frame can be processed to be compatible with manufacturing processes, according to an exemplary embodiment. The embodiments described below relate to a package 100 having a lead 108 extending only from one side 110 of the encapsulation 106. As shown, a carrier 102 with the manufactured-ready lead 108 (i.e., already having free ends) is provided together with a tie bar structure 112. Two... Figure 28 The structures shown at the top are combined to form Figure 28 The lower part of the structure is shown. For this purpose, the connecting structure 299 can be removed, and one of the two resulting structures is rotated 180°. As shown, the electronic component 104 can be mounted on the bare die pads of the carrier 102 and can be connected via connecting wires 254. Thus, an interleaved design that can be manufactured in a space-saving manner is obtained. Described as such, this interleaved design has leads 108 connected as interleaved finger-like structures.

[0201] Figure 29 A top view of another structure obtained during a method of manufacturing package 100 according to an exemplary embodiment is shown. According to the embodiment, the method may include connecting the leads 108 by means of vertical tie bars 112, particularly by forming a mesh structure 156 consisting of leads 108 and tie bars 112. Therefore, Figure 29 Another embodiment of a lead frame or lead frame portion used according to another exemplary embodiment is shown. Figure 29 The configuration has a mesh structure 156 consisting of tie bars 112 and lead wires 108.

[0202] Figure 28 and Figure 29 Both structures shown can be used to execute the above reference. Figure 3 or Figure 20 The basis of the aforementioned manufacturing process.

[0203] Figure 30 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0204] In such an embodiment, the method includes forming and connecting the encapsulation strips 124 using right-angled or vertical auxiliary strips 154 made of the material of the encapsulation strip 106. Furthermore, the leads 108 can be punched by removing multiple discontinuous segments of the material of the tie strip 112. Then, as described above, monomerization by sawing can be performed. As shown, the described method includes arranging the leads 108 in an interlaced manner.

[0205] After the lead length is cut by punching, the multi-package assembly is placed in a mold to produce an interlaced lead frame design. Following barcode molding (including the connecting top molding strip), multiple alligator-type electrical connections are electroplated. This forms a plating layer 120. Monomerization can then be performed by punching (for separating the leads 108) and sawing (on the top and bottom sides of the resulting package 100).

[0206] Figure 30 Details of a possible manufacturing process are shown. It can be used according to... Figure 28The structure is shown in the bottom view and can be processed by encapsulation, particularly by molding. Through this molding process, the encapsulating strip 124 can be manufactured as described above. However, multiple spaced and separate encapsulating strips 124 can be connected to each other by horizontally extending auxiliary strips 154, which can be made of the same encapsulating material and can be formed simultaneously with the molding process in which the encapsulating strips 124 are also formed. Subsequently, the exposed portions of the leads 108 can be plated, for example, with a solderable material such as tin. Then, the unconnected sections of the tie bar 112 can be removed by punching. Further subsequently, the unconnected sections can be further processed along the... Figure 30 The sawing trajectory schematically shown by reference numeral 298 in the figure is used to perform horizontal sawing to monolithize the individual molded strips 124 having the encapsulated carrier 102 and electronic components 104.

[0207] Figure 31 A top view of a package 100 having an asymmetrical design (more specifically, having an asymmetrical left-right design) according to an exemplary embodiment is shown.

[0208] As a basis Figure 28 and Figure 30 The results of the manufacturing process can obtain Figure 31 The package 100 shown. As shown in the figure, and as a result of the described manufacturing process, it is possible to obtain according to... Figure 28 The lower image shows the asymmetrical design of the package 100 on the left and right sides. (Example) Figure 31 As indicated by reference numeral 130 in the figure, the punched surface portion of the lead 108 can now be positioned on its side surface rather than its flange surface.

[0209] Furthermore, and as Figure 31 As shown by reference numeral 300 in the figure, the package 100 may have a mounting recess through which it can be connected to an electronic environment, for example, it can be threaded onto a heat sink or printed circuit board.

[0210] Figures 32 to 36 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0211] refer to Figure 32 This shows a standard lead frame, which can be used as a base for subsequent manufacturing processes. Lead length cutting can be performed.

[0212] refer to Figure 33 , showing according to Figure 32 The arrangement of the two interlaced lead frames obtained can then be subjected to transfer molding.

[0213] refer to Figure 34It can perform the transfer strip system.

[0214] refer to Figure 35 The punched surface 130 is formed by punching. The punched surface 130 can be the punched side surface of the lead 108. As shown in the figure, the lead 108 can be locally thickened at the punched side surface.

[0215] refer to Figure 36 Then, it can preferably be slit in a copper-free manner.

[0216] Figure 32 A leadframe structure is shown, which can be obtained by cutting the lead length from a standard leadframe of the TO247 package type, as referenced above. Figure 28 As described above. It can be as follows: Figure 32 The two such structures shown are interlaced to form interlaced leads 108, as... Figure 33 As shown. Then it can be made Figure 33 The structure undergoes the corresponding molding process described above. For example... Figure 34 As shown, an encapsulating strip 124 can be formed, and optionally an auxiliary strip 154 ​​can also be formed (compare). Figure 30 Through punching, it is possible to obtain... Figure 35 The structure is shown. During this punching process, discontinuous or non-continuous portions of the tie bar 112 are removed, and the individual leads 108 of the corresponding package 100 can be separated from each other. Thereafter, and as... Figure 36 As shown, advantageously, only the material passing through the molded encapsulation 106 is slit or sawn. This allows for high-speed and simple sawing.

[0217] Figure 37 A top view of a completed package 100 according to an exemplary embodiment is shown, the package being constructed by performing an embodiment according to... Figures 32 to 36 The package 100 was obtained by a method for manufacturing the package.

[0218] Figure 37 A package 100 obtained through the described manufacturing process is shown. A slight asymmetry in the encapsulation 106 that allows differentiation between the left and right packages 100 is indicated by reference numeral 302. The encapsulation portion corresponding to reference numeral 304 is identical for both the left and right packages 100.

[0219] Figure 38 A top view of the structure obtained during the execution of a method for manufacturing package 100 according to an exemplary embodiment is shown. A standard lead frame (e.g., by laser welding) that can be used as the starting point of a manufacturing process according to an exemplary embodiment can be arranged on a lead tape 184 having the functions described above.

[0220] Figure 32 The structure can be used to create Figure 38 The structure shown (similar to) Figure 33 ).to this end, Figure 32 The two structures shown can be arranged on the lead tape 184 to form the lead frame 180. The connection to the lead tape 184 can be achieved, for example, by laser welding.

[0221] Figure 39 A top view of a structure obtained during the execution of a method for manufacturing package 100, according to an exemplary embodiment, is shown.

[0222] Instead of using a standard double-track lead frame design as a starting point, an embedded frame can be used where interleaved leads 108 have already been created. This can have the advantage of a particularly space-saving architecture. Figure 39 This alternative lead frame embedding design can also be used according to an exemplary embodiment.

[0223] It should be noted that the term "comprising" does not exclude other elements or features, and "an" or "a" does not exclude multiple or more. Furthermore, elements described in different embodiments may be combined and integrated. It should also be noted that reference numerals should not be construed as limiting the scope of the claims. Moreover, the scope of this application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, measures, methods, and steps described in the specification. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, measures, methods, or steps within their scope.

Claims

1. A semiconductor package, comprising: - Carrier (102); - Electronic components (104) located on the carrier (102); - An encapsulation (106) encapsulating at least a portion of the carrier (102) and the electronic component (104); and - At least one lead (108) extending from the encapsulation (106) and having a punched surface (130). - wherein at least a portion of at least one side (110) of the encapsulation (106) has a sawed texture (281). - Wherein, the carrier (102) includes two tie strips (112) respectively arranged on two opposite sides of the carrier, wherein each tie strip has a curved pattern such that: a portion of the tie strip is coplanar with a portion of the electronic component (104) attached to the carrier, and another portion of the tie strip is bent upward and exposed at a side with a sawed texture.

2. The semiconductor package according to claim 1, wherein, Each tie bar (112) has a thicker portion (113) and a thinner portion (116).

3. The semiconductor package according to claim 1, wherein, The thicker portion of each tie bar (112) is located inside the encapsulation, while the thinner portion of each tie bar (112) is exposed at the side with a sawed texture.

4. The semiconductor package according to claim 2, wherein, The finer portion of each tie bar (112) includes a top surface and a bottom surface covered by the encapsulation (106) from the top side and bottom side respectively, and also includes an exposed surface that is coplanar with the side but not covered by the encapsulation.

5. The semiconductor package according to claim 3, wherein, The exposed surface of the tie bar includes a sawed texture.

6. A semiconductor package, comprising: - Carrier (102); - Electronic components (104) located on the carrier (102); - A clip (152) arranged on the electronic component (104); and - Encapsulation (106) that encapsulates at least a portion of the carrier (102), the electronic component (104), and the clip (152). - wherein the clip (152) includes at least one lead (108) extending from the first side of the encapsulation (106) and having a punched surface (130). - The package includes a second side perpendicular to the first side and a third side opposite to it, wherein at least a portion of the second side and the third side (110) has a sawed texture (281).

7. The semiconductor package according to claim 6, wherein, The package also includes a fourth side opposite to the first side, and the carrier (102) includes a surface exposed at the fourth side.

8. The semiconductor package according to claim 6, wherein, The exposed surface of the carrier (102) is formed by punching the side of the fourth side.

9. The semiconductor package according to claim 6, wherein, The carrier (102) does not include a tie bar (112) in the area where the electronic component is attached.

10. The semiconductor package according to claim 6, wherein, At least one lead (108) of the clip (152) includes remnants of the tie bar (140) formed during the punching process.

11. The semiconductor package according to claim 8 or 9, wherein, The package does not have any metal exposed on the second and third sides.

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