Copper alloy sheet, electronic component, and method for manufacturing copper alloy sheet

Abstract

The present invention aims to provide a copper alloy sheet having high strength in all directions relative to the direction of extension. The copper alloy sheet of the present invention contains 1.5 to 4.6 mass% of Ni, 0.10 to 0.80 mass% of Co, 0.10 to 1.3 mass% of Si, with the remainder consisting of Cu and unavoidable impurities, and has an average of the tensile strength TA (MPa) in a direction at right angles to the direction of rolling, the tensile strength TB (MPa) in a direction parallel to the direction of rolling, and the tensile strength TC (MPa) in a direction inclined at 45° to the direction of rolling of 930 MPa or more.

Description

Technical Field

[0001] This invention relates to a copper alloy plate, electronic components, and a method for manufacturing the copper alloy plate. Background Technology

[0002] Cosen alloys are copper alloys in which intermetallic compounds such as Ni-Si, Co-Si, and Ni-Co-Si are precipitated in a Cu matrix, exhibiting both high strength and high conductivity. Due to these properties, Cosen alloys are used as copper alloy components in electronic parts, for example, as lead frames in semiconductor packages to support and fix semiconductor components and form internal wiring (see, for example, Patent Document 1).

[0003] [Previous Technical Documents] [Patent Literature] [Patent Document 1]: Japanese Patent Application Publication No. 2018-035437. Summary of the Invention

[0004] [The problem that the invention aims to solve] With the increasing functionality of electronic components in recent years, copper alloy components (or specific parts of copper alloy components) made of copper alloy plates of Cosun alloy are becoming increasingly miniaturized. For copper alloy plates, high conductivity is required, while further improving the characteristics to adapt to this miniaturization.

[0005] For example, in semiconductor packages used as electronic components, the increasing functionality in recent years has led to a miniaturization of the package structure, resulting in larger packages themselves. Consequently, the leadframes, especially the leads within the leadframes, manufactured from copper alloy plates used to construct semiconductor packages, are also becoming increasingly miniaturized. Leads are the internal wiring (pins) within the semiconductor package used to connect to external wiring. Due to the miniaturization of leads, their length has increased or the spacing between them has narrowed. However, this miniaturization sometimes results in insufficient strength for the leads. The leadframe, especially the portion that forms the leads, extends in various directions relative to the rolling direction of the copper alloy plate used to manufacture the leadframe. Therefore, if the copper alloy plate does not possess high strength in all directions relative to the rolling direction, the leads may deform and be difficult to maintain their shape with high precision during lead frame or semiconductor package manufacturing steps (e.g., the step of manufacturing the desired lead frame by semi-etching the copper alloy plate, or the step of wire bonding to connect the leads to the semiconductor component after the semiconductor component is placed in the lead frame). As a result, semiconductor packages cannot always be manufactured efficiently, and for the copper alloy plate, further increases in strength in all directions relative to the rolling direction are required.

[0006] The purpose of this invention is to provide a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate.

[0007] [Technical means to solve the problem] In one embodiment of the copper alloy plate of the present invention, the copper alloy plate contains 1.5 to 4.6% by mass of Ni, 0.10 to 0.80% by mass of Co, and 0.10 to 1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), the average value of tensile strength TA, tensile strength TB, and tensile strength TC is 930 MPa or more.

[0008] In another embodiment of the copper alloy plate of the present invention, the copper alloy plate contains 1.5 to 4.6% by mass of Ni, 0.10 to 0.80% by mass of Co, and 0.10 to 1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), the minimum value among tensile strength TA, tensile strength TB, and tensile strength TC is 930 MPa or more.

[0009] In one embodiment, the electronic component of the present invention comprises the copper alloy described above.

[0010] In one embodiment, the method for manufacturing the copper alloy plate of the present invention comprises the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.6% by mass of Ni, 0.10–0.80% by mass of Co, 0.10–1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; When the electrical conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), and tensile strength (C (MPa)) of the copper alloy intermediate after the solution treatment are used to express the formula (X = (A × B) / (C)), the value of X in the formula is 17.5 or less.

[0011] [The effects of the invention] The present invention provides a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate. Attached Figure Description

[0012] [ Figure 1 [ ] is a chart obtained by organizing the parameter X, which is expressed by the formula (X=(A×B) / (C)…(1)), of the conductivity (A), 0.2% yield strength (B) and tensile strength (C) of the intermediate copper alloy plate after solution treatment, and the tensile strength of the copper alloy plate (e.g. after stress relief annealing) in the direction parallel to the rolling direction. Detailed Implementation

[0013] The embodiments of the present invention are described in detail below, but the present invention is not limited to the embodiments described below.

[0014] In this invention, "a~b" means "a or more and b or less". Here, a and b represent numerical values.

[0015] [Copper Alloy Plate] [Implementation Plan 1] The copper alloy plate of the first embodiment contains 1.5–4.6% by mass Ni, 0.10–0.80% by mass Co, and 0.10–1.3% by mass Si, with the remainder consisting of Cu and unavoidable impurities. That is, the copper alloy plate of this embodiment is a Cu-Ni-Co-Si alloy. Regarding Ni, Co, and Si, appropriate heat treatment is performed to form Ni-Co-Si intermetallic compound precipitates, achieving high conductivity and high strength.

[0016] In the copper alloy plate of the first embodiment, the Ni concentration is 1.5–4.6% by mass, and the Co concentration is 0.10–0.80% by mass. This maintains the high conductivity of the copper alloy plate while simultaneously improving its strength. When the Ni concentration is less than 1.5% by mass, the desired strength cannot be obtained. When the Co concentration is less than 0.10% by mass, the desired strength or conductivity cannot be obtained. When the Ni concentration exceeds 4.6% by mass, or the Co concentration exceeds 0.80% by mass, sufficient strength can be obtained, but conductivity will decrease.

[0017] The Ni concentration is preferably 2.0 to 4.6% by mass, more preferably 2.3 to 4.6% by mass, and even more preferably 3.0 to 4.3% by mass.

[0018] In addition, the Co concentration is preferably 0.10 to 0.80% by mass, preferably 0.13 to 0.60% by mass, and more preferably 0.18 to 0.50% by mass.

[0019] In the copper alloy plate of the first embodiment, the Si concentration is 0.10 to 1.3% by mass. This maintains the high conductivity of the copper alloy plate while simultaneously improving its strength. If the Si concentration is less than 0.10% by mass, the desired strength cannot be obtained. Furthermore, if the Si concentration exceeds 1.3% by mass, while sufficient strength can be obtained, conductivity will decrease.

[0020] The Si concentration is preferably 0.30 to 1.3% by mass, more preferably 0.60 to 1.3% by mass, and even more preferably 0.60 to 1.0% by mass.

[0021] As mentioned above, Ni-Co-Si precipitates formed from Ni, Co, and Si are considered to be intermetallic compounds mainly composed of (Ni+Co)Si. However, Ni, Co, and Si in copper alloys may not all become precipitates due to the aging treatment during the manufacturing process of the copper alloy sheet; they may exist to some extent in a state of solid solution within the Cu matrix. The solid solution state of Ni, Co, and Si can slightly increase the strength of the copper alloy sheet, but this effect is smaller compared to the precipitated state, and it may also be a major cause of decreased conductivity. Therefore, the ratio of Ni, Co, and Si content is preferably close to the composition ratio of (Ni+Co)Si. Thus, the total mass ratio of Ni and Co to Si is preferably 3.4 to 5.4, more preferably 3.8 to 5.0.

[0022] In the composition of the copper alloy plate according to the first embodiment, in addition to the elements mentioned above, it may further contain, in total, 0.010 to 5.0% by mass, one or more elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo, and Mn (hereinafter also referred to as "added elements"). This improves the strength, heat resistance, and stress relaxation resistance of the copper alloy plate. The added element may also be Cr.

[0023] By adding elements in an amount of 0.010% by mass or more, the desired effects described above tend to be easily obtained. Furthermore, by adding elements in an amount of 5.0% by mass or less, the desired properties can be obtained while simultaneously preventing a decrease in conductivity.

[0024] The total amount of added elements is preferably 0.030 to 4.0% by mass, more preferably 0.050 to 3.0% by mass.

[0025] In the first embodiment, the remaining portion, other than the components described above, consists of Cu and unavoidable impurities. Here, unavoidable impurities refer to impurity elements that cannot be avoided from being mixed into the material during the manufacturing process. The concentration of each element that is an unavoidable impurity may be set to, for example, 0.015% by mass or less, preferably 0% (undetectable).

[0026] The composition of copper alloys can also be determined by wet analysis. Ni can be determined using the copper-separated dimethylglyoxime gravimetric method (JIS-H1056 (2003)), and Si can be determined using the silica gravimetric method (JIS-H1061 (2006)). Other added and impurity elements can be determined using ICP emission spectrometry. The analysis of other added elements is performed using an internal standard method, with Y (yttrium) as the internal standard. The internal standard can also be any element other than Y. ICP emission spectrometry is performed using an ICP emission spectrometry analyzer (ICP-OES) SPS3100 or equivalent device manufactured by Hitachi Advanced Scientific Corporation. In the case of ICP emission spectrometry, the copper alloy sample is diluted with a solution obtained by dissolving it in a mixed acid containing hydrochloric acid and nitric acid (containing hydrochloric acid, nitric acid, and water in a volume ratio of 2:1:2) before use.

[0027] Furthermore, the composition of copper alloys can also be determined using fluorescence X-ray analysis. As the fluorescence X-ray analysis apparatus, Rigaku's Simultix14 or an equivalent apparatus can be used. The analysis surface only needs to be a surface that has been cut or mechanically ground to a maximum surface roughness Rz (JIS-B0601 (2013)) of 6.3 μm or less. When collecting samples for fluorescence X-ray analysis from the molten metal during melting casting, after casting into a shape of approximately 30–40 mm Φ and 50–80 mm thickness, the sample is cut into sections approximately 10–20 mm thick, and the cut surface is used as the analysis surface. Fluorescence X-ray analysis is performed based on JIS K 0119:2008, using a wavelength dispersion method.

[0028] The copper alloy plate of the first embodiment is not particularly limited if it is an object with a three-dimensional shape composed of the above-described components and having a specified thickness. The term "plate" in the copper alloy plate of the first embodiment also includes sheets, strips, and foils. Furthermore, the copper alloy plate of the first embodiment includes, for example, not only copper alloy plates before processing for use in electronic components, but also copper alloy plates in the process of processing or after processing.

[0029] The thickness of the copper alloy plate in the first embodiment is, for example, 0.03 to 1.2 mm. This thickness is preferably 0.03 to 0.60 mm, and more preferably 0.08 to 0.30 mm.

[0030] In the copper alloy sheet of the first embodiment, the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa). In the copper alloy sheet of the first embodiment, the average value of tensile strength TA, tensile strength TB, and tensile strength TC is 930 MPa or more.

[0031] In copper alloy sheets, although the tensile strength may vary depending on the direction of measurement, the tensile strength in directions other than those perpendicular to the rolling direction, parallel to the rolling direction, and inclined at 45° relative to the rolling direction is highly likely to be the same as or between the tensile strengths TA, TB, and TC in the aforementioned three directions. In the first embodiment, since the average value of the tensile strengths TA, TB, and TC is high, the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction. Therefore, with the copper alloy sheet according to the first embodiment, deformation in the manufacturing process of miniaturized copper alloy parts or portions thereof for electronic components manufactured from the copper alloy sheet can be suppressed.

[0032] Specifically, the deformable copper alloy component, or a portion thereof, can extend within the copper alloy sheet before processing in various directions relative to the rolling direction of the copper alloy sheet. Since the copper alloy sheet of the first embodiment has high tensile strength in all directions relative to the extension direction of the copper alloy sheet, deformation of the copper alloy component, etc., can be suppressed during the manufacturing process of electronic components, specifically including the step of processing the copper alloy sheet to manufacture copper alloy components (e.g., lead frames).

[0033] In the copper alloy plate of the first embodiment, the average value of tensile strength TA, tensile strength TB and tensile strength TC is preferably 950 MPa, more preferably 970 MPa or more, and even more preferably 993 MPa or more.

[0034] Tensile strength in directions perpendicular to the rolling direction, parallel to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction as described below can be determined by the methods described in the column of the following examples. As a tensile testing machine for the tensile test, an AUTOCOM AC-100KN-C manufactured by TSE Co., Ltd., or an equivalent device, can be used.

[0035] Furthermore, by setting the composition of the copper alloy plate to that of the copper alloy plate in the first embodiment described above and manufacturing it using the following manufacturing method, the tensile strength in each direction can be within the desired range. By adjusting parameter X in the following manufacturing method to a smaller value, the tensile strength in each direction can be increased.

[0036] In the copper alloy plate of the first embodiment, there is no particular upper limit to the average value of tensile strength TA, tensile strength TB and tensile strength TC. The average value may be less than 1200 MPa, less than 1100 MPa or less than 1000 MPa.

[0037] Furthermore, in the first embodiment, the calculation of the average tensile strength in each direction may also include tensile strength in directions other than the aforementioned tensile strengths TA, TB, and TC, such as tensile strength TD (MPa) in a direction inclined at 22.5° relative to the rolling direction. By including the tensile strength TD in a direction inclined at 22.5° relative to the rolling direction in the calculation of the average value, it is possible to more reliably ensure that the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction.

[0038] In the first embodiment, the average value (the average of tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) including tensile strength TD can be 930 MPa or higher, or 960 MPa or higher, or 987 MPa or higher. By using such an average value, deformation during the manufacturing process of miniaturized copper alloy parts or portions of copper alloy parts used in electronic components made from copper alloy plates can be further suppressed.

[0039] In the copper alloy plate of the first embodiment, there is no particular upper limit to the average value of tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD. The average value may be, for example, less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0040] In the first embodiment, the variation of each tensile strength (tensile strength TA, tensile strength TB, and tensile strength TC, or tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) used to calculate the above average value can be small. Therefore, among the multiple tensile strengths used to calculate the average value, the difference between the maximum and minimum tensile strength can be less than 100 MPa, or less than 80 MPa. This also improves the uniformity of miniaturized copper alloy components or portions thereof used in electronic components manufactured from copper alloy plates. Furthermore, even if the copper alloy component is an asymmetrical design, the component (e.g., lead frame) can be extracted from the base material (copper alloy plate) in any direction, improving yield.

[0041] In the copper alloy sheet of the first embodiment, the tensile strength TA in the direction perpendicular to the rolling direction can be 930 MPa or higher. Therefore, deformation during the manufacturing process of miniaturized copper alloy parts or portions thereof used in electronic components made from copper alloy sheets can be further suppressed.

[0042] The tensile strength TA is preferably 1000 MPa or more, and more preferably 1041 MPa or more.

[0043] There is no particular upper limit to the tensile strength TA. For example, the tensile strength can be below 1200 MPa or below 1100 MPa.

[0044] In the copper alloy sheet of the first embodiment, the tensile strength TB in the direction parallel to the rolling direction can be 870 MPa or higher. By having such high tensile strength in the direction parallel to the rolling direction, deformation of the copper alloy sheet during the manufacturing process of electronic components can be more effectively suppressed.

[0045] The tensile strength TB is preferably 900 MPa or higher, and more preferably 977 MPa or higher.

[0046] There is no particular limit to the upper limit of the tensile strength TB. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0047] In the copper alloy sheet of the first embodiment, the tensile strength TC in the direction inclined at 45° relative to the rolling direction can be 885 MPa or higher. By having high tensile strength in the direction inclined at 45° relative to the rolling direction, deformation of the copper alloy sheet during the manufacturing process of electronic components can be more effectively suppressed.

[0048] The tensile strength TC is preferably 900 MPa or more, and more preferably 961 MPa or more.

[0049] There is no particular upper limit to the tensile strength TC. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0050] In the copper alloy sheet of the first embodiment, the tensile strength TD in the direction inclined at 22.5° relative to the rolling direction can be 880 MPa or higher. By having high tensile strength in the direction inclined at 22.5° relative to the rolling direction, deformation of the copper alloy sheet during the manufacturing process of electronic components can be more effectively suppressed.

[0051] The tensile strength TD is preferably 900 MPa or higher, and more preferably 968 MPa or higher.

[0052] There is no particular upper limit to the tensile strength TD. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0053] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction perpendicular to the rolling direction can be 895 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0054] The 0.2% yield strength in the direction perpendicular to the rolling direction is preferably 920 MPa or more, and more preferably 1010 MPa or more.

[0055] The 0.2% yield strength in each direction, including the direction perpendicular to the rolling direction, can be determined by the method described in the column of the following examples. As the tensile testing machine for the tensile test, the AUTO COM AC-100KN-C manufactured by TSE Corporation or an equivalent device can be used.

[0056] Furthermore, by setting the composition of the copper alloy plate to that of the copper alloy plate in the first embodiment described above and manufacturing it using the following manufacturing method, the 0.2% yield strength in each direction can be within the desired range. By adjusting parameter X in the following manufacturing method to a smaller value, the tensile strength in each direction can be increased.

[0057] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction perpendicular to the rolling direction. For example, the 0.2% yield strength can be below 1200 MPa or below 1100 MPa.

[0058] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction parallel to the rolling direction can be 845 MPa or higher. Therefore, deformation during the manufacturing process of electronic components, specifically miniaturized copper alloy components or portions thereof, made from copper alloy sheets, can be more effectively suppressed.

[0059] The 0.2% yield strength in the direction parallel to the rolling direction is preferably 860 MPa or more, and more preferably 936 MPa or more.

[0060] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction parallel to the rolling direction. For example, the 0.2% yield strength can be less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0061] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction inclined at 45° relative to the rolling direction can be 845 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0062] The 0.2% yield strength in the direction inclined at 45° relative to the rolling direction is preferably 860 MPa or more, and more preferably 909 MPa or more.

[0063] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction inclined at 45° relative to the rolling direction. For example, the 0.2% yield strength can be less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0064] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction can be 845 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0065] The 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction is preferably 860 MPa or more, and more preferably 915 MPa or more.

[0066] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction. The 0.2% yield strength may be, for example, less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0067] The copper alloy plate of the first embodiment has a conductivity of 35.0% IACS or higher in the direction parallel to the rolling direction. With a conductivity of 35.0% IACS or higher, it can be effectively used as a copper alloy component for electronic parts.

[0068] The conductivity in the direction parallel to the rolling direction is preferably 37.0% IACS or higher, and more preferably 40.2% IACS or higher.

[0069] By setting the composition of the copper alloy plate to that of the copper alloy plate in the first embodiment described above and manufacturing it using the following manufacturing method, the conductivity can be made to be within the desired range.

[0070] Conductivity (EC: %IACS) can be determined using the four-terminal method according to JIS-H0505 (1975). A double bridge can be used for the measurement, and resistance can be measured based on the average cross-sectional area method. Regarding conductivity, the conductivity in the direction parallel to the rolling direction can be measured at room temperature (25°C). Furthermore, the gauge length (distance between resistance measurements) can be measured at 50 mm.

[0071] The following describes the manufacturing method of the copper alloy plate according to this embodiment.

[0072] The manufacturing method of the copper alloy plate in this embodiment includes the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.6% by mass of Ni, 0.10–0.80% by mass of Co, 0.10–1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling.

[0073] Furthermore, when the formula (X = (A × B) / (C)) is expressed using the conductivity (A (% IACS)), 0.2% yield strength (B (MPa)) and tensile strength (C (MPa)) of the copper alloy intermediate after the solution treatment step, the value of X in the formula is 17.5 or less.

[0074] In the manufacturing method of the copper alloy plate according to this embodiment, cold rolling can be performed before solution treatment. Alternatively, cold rolling can be performed after solution treatment and before aging treatment. Furthermore, solution treatment and aging treatment can be performed two or more times. Furthermore, in the manufacturing method of the copper alloy plate according to this embodiment, stress-relief annealing can be performed after fine cold rolling. After performing the above steps, appropriate methods such as grinding, polishing, bead blasting, and pickling can be performed to remove surface oxide scale.

[0075] The manufacturing method of the copper alloy plate in this embodiment is not particularly limited. More specifically, it can be manufactured by the following methods.

[0076] The method for manufacturing the copper alloy plate according to this embodiment may include a step of first melting and casting the raw material of the copper alloy having the desired composition. In this step, the raw material of the copper alloy is melted using the same method as that used for melting general copper alloys, and then an ingot is manufactured by continuous casting or semi-continuous casting. For example, an atmospheric melting furnace is first used to melt raw materials such as electrolytic copper, Ni, Co, and Si to obtain a molten liquid with the target composition. Then, the molten liquid is poured into a mold of any size to cast an ingot.

[0077] The method for manufacturing the copper alloy plate according to this embodiment may include a step of hot rolling an ingot that has undergone arbitrary homogenization annealing. The hot rolling of the ingot is not particularly limited; for example, it can be performed in multiple passes at temperatures between 950°C and 500°C. Furthermore, the overall machining degree of the hot rolling is preferably set to 90% or more.

[0078] Furthermore, if the thickness of the workpiece used for calendering is set as TB, and the thickness of the workpiece after calendering is set as TA, then the degree of processing (%) is expressed as degree of processing (%) = [(TB - TA) / TB] × 100.

[0079] Solution treatment is a heat treatment that dissolves silicides such as Ni-Si, Co-Si, and Cr-Si compounds into a Cu matrix, while simultaneously recrystallizing the Cu matrix. Hot rolling can also be used as a solution treatment.

[0080] Figure 1 This is a chart showing the relationship between parameter X, expressed as (X = (A × B) / (C)...(1)), the conductivity (A (% IACS)), 0.2% yield strength (B (MPa)), and tensile strength (C (MPa)) of the solution-treated copper alloy plate intermediate, and the tensile strength (MPa) of the copper alloy plate (e.g., after stress-relief annealing) in the direction parallel to the rolling direction. (Furthermore, conductivity (A), 0.2% yield strength (B), and tensile strength (C) are all values ​​obtained by measurement in the direction parallel to the rolling direction). The copper alloy plate of the present invention can be easily manufactured by setting the value of parameter X to 17.5 or less.

[0081] The heat treatment temperature for solution treatment can be appropriately selected from, for example, within the range of 800–1000 °C. Furthermore, the heat treatment time can be appropriately selected from the range of 1 second to 1 minute. By setting the heat treatment temperature for solution treatment to a relatively high level and the heat treatment time to a relatively long level, the value of parameter X can be reduced. By setting the value of parameter X to 17.5 or lower, and appropriately combining the heat treatment temperature and time for solution treatment, Ni-Co-Si compounds can be dissolved in the Cu matrix, while the Cu matrix recrystallizes. This allows for the precipitation of strength-enhancing precipitates during aging treatment, improving the tensile strength after stress-relief annealing. Furthermore, since anisotropy is eliminated due to the recrystallization of the metal structure accompanying solution treatment, high strength can also be obtained in directions other than those parallel to the rolling direction (directions inclined at 22.5° and 45° relative to the rolling direction, and directions perpendicular to the rolling direction) by setting the value of parameter X to 17.5 or lower.

[0082] The preferred heating temperature is 850–975°C, and the preferred time is 5–30 seconds.

[0083] Furthermore, the conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), and tensile strength (C (MPa)) of the copper alloy plate intermediate after solution treatment in the above formula (1) can be determined by the method described in the column of the following examples.

[0084] The method for manufacturing the copper alloy plate according to this embodiment may include an aging treatment step for the intermediate material after the above-mentioned solution treatment. The heating temperature for the aging treatment is not particularly limited, but can be set to 375–625°C, preferably 400–550°C. Furthermore, the heating time can be set to 1–50 hours, preferably 1.5–25 hours. When the aging treatment temperature or time is above the lower limit of the above range, the amount of Ni-Co-Si compounds precipitated is sufficient, and sufficient strength is easily obtained. When the aging treatment temperature or time is below the upper limit of the above range, coarsening or re-solution of the precipitates can be prevented, and the strength or conductivity can be easily and sufficiently improved.

[0085] To fully improve the strength and conductivity of copper alloy plates, the tensile strength of the aging-treated intermediate in the direction parallel to the rolling direction can be above 800 MPa. Furthermore, the conductivity of the aging-treated intermediate in the direction parallel to the rolling direction can be above 40.0% IACS.

[0086] To suppress the formation of oxide films, aging treatment is preferably carried out in an inactive environment such as Ar, N2, or H2.

[0087] The method for manufacturing the copper alloy plate according to this embodiment may include a step of fine cold rolling of the aforementioned intermediate material. Fine cold rolling is not particularly limited and may be performed in multiple passes. Preferably, it is performed in one or more passes. The total machining degree of the fine cold rolling is preferably 40% or more. By imparting processing strain to the material through fine cold rolling, its strength can be improved. In particular, the strength in directions inclined relative to the rolling direction is improved; the larger the inclination angle, the easier it is to obtain the strength-enhancing effect achieved by increasing the total machining degree of the fine cold rolling. Therefore, by having a machining degree of 40% or more, the strength in various directions relative to the rolling direction can be improved.

[0088] The degree of processing in fine cold rolling is more preferably 55% or more, which tends to easily and sufficiently improve the strength.

[0089] The upper limit of the machining degree in precision cold rolling is preferably 90% or less. By keeping the machining degree below 90%, it is possible to prevent a decrease in conductivity due to the processing strain caused by intense processing.

[0090] The manufacturing method of the copper alloy plate in this embodiment may include a stress-relief annealing step for the intermediate material after the above-mentioned fine cold rolling. Stress-relief annealing can be performed under normal conditions, for example, at 300–550°C for a holding time of 5–900 seconds. Stress-relief annealing can be performed in the atmosphere or inactive environments such as nitrogen or argon. Furthermore, the stress-relief annealed copper alloy plate can also be cooled by air cooling.

[0091] The copper alloy plate of the first embodiment can be manufactured by the manufacturing method of the copper alloy plate of this embodiment, which includes the steps described above. Furthermore, in this manufacturing method, pickling, grinding, degreasing, surface cutting, and finishing may be performed as needed after each rolling step or heat treatment step. In addition, this manufacturing method may include rolling steps or heat treatment steps other than those described above.

[0092] [Second Implementation Plan] Next, the copper alloy plate of the second embodiment will be described. Furthermore, the descriptions of components that are repeated in the copper alloy plate of the second embodiment and the copper alloy plate of the first embodiment will be appropriately omitted.

[0093] The copper alloy plate of the second embodiment contains 1.5–4.6% by mass Ni, 0.10–0.80% by mass Co, and 0.10–1.3% by mass Si, with the remainder consisting of Cu and unavoidable impurities. This maintains the high conductivity of the copper alloy plate while simultaneously increasing its strength.

[0094] In the composition of the copper alloy plate according to the second embodiment, in addition to the elements mentioned above, it may further contain, in total, 0.010 to 5.0% by mass, one or more additive elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo, and Mn. This improves the strength, heat resistance, and stress relaxation resistance of the copper alloy plate. The additive element may also be Cr.

[0095] By adding elements in an amount of 0.010% by mass or more, the desired effects described above tend to be easily obtained. Furthermore, by adding elements in an amount of 5.0% by mass or less, the desired properties can be obtained while simultaneously preventing a decrease in conductivity.

[0096] The total amount of added elements is preferably 0.030 to 4.0% by mass, more preferably 0.050 to 3.0% by mass.

[0097] The Ni concentration is preferably 2.0–4.6% by mass, more preferably 2.3–4.6% by mass, and even more preferably 3.0–4.3% by mass. Furthermore, the Co concentration is preferably 0.10–0.80% by mass, more preferably 0.13–0.60% by mass, and even more preferably 0.18–0.50% by mass. The Si concentration is preferably 0.30–1.3% by mass, more preferably 0.60–1.3% by mass, and even more preferably 0.60–1.0% by mass.

[0098] In the copper alloy plate of the second embodiment, the minimum value of tensile strength TA, tensile strength TB, and tensile strength TC is 930 MPa or higher. In the second embodiment, because the minimum value of tensile strength TA, tensile strength TB, and tensile strength TC is high, the copper alloy plate has high tensile strength in all directions (any direction) relative to the stretching direction. Therefore, deformation of the copper alloy plate during the manufacturing process of electronic components can be suppressed.

[0099] The minimum value is preferably 940 MPa or more, and more preferably 961 MPa or more.

[0100] In the copper alloy plate of the second embodiment, there is no particular upper limit to the minimum values ​​of tensile strength TA, tensile strength TB and tensile strength TC. The minimum values ​​may be, for example, below 1100 MPa or below 1000 MPa.

[0101] Furthermore, in the second embodiment, the calculation of the minimum tensile strength in each direction may also include tensile strength in directions other than the tensile strengths TA, TB, and TC mentioned above, such as tensile strength TD (MPa) in a direction inclined at 22.5° relative to the rolling direction. By including tensile strength TD in the calculation of the minimum value, it is possible to more reliably ensure that the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction.

[0102] In the second embodiment, the minimum value (the minimum of tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) can be 930 MPa or more, or 940 MPa or more, or 961 MPa or more. By setting the minimum value to this value, deformation during the manufacturing process of miniaturized copper alloy components or portions thereof used in electronic components made of copper alloy plates can be further suppressed.

[0103] In the copper alloy plate of the second embodiment, there is no particular upper limit to the minimum value of the tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD. The minimum value may be, for example, below 1100 MPa or below 1000 MPa.

[0104] In the second embodiment, the variation of each tensile strength (tensile strength TA, tensile strength TB, and tensile strength TC, or tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) calculated for the aforementioned minimum value can be reduced. Therefore, among the multiple tensile strengths calculated for the minimum value, the difference between the maximum tensile strength and the minimum tensile strength can be less than 100 MPa, or less than 80 MPa. This also improves the uniformity of miniaturized copper alloy components or portions thereof used in electronic components manufactured from copper alloy plates. Furthermore, even if the copper alloy component is an asymmetrical design, the component (e.g., lead frame) can be extracted from the base material (copper alloy plate) in any direction, improving yield.

[0105] In the copper alloy plate of the second embodiment, the tensile strength in the directions perpendicular to the rolling direction, parallel to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction can be set to be the same as that in the copper alloy plate of the first embodiment. Furthermore, in the copper alloy plate of the second embodiment, the 0.2% yield strength in the directions perpendicular to the rolling direction, parallel to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction can be set to be the same as that in the copper alloy plate of the first embodiment. Moreover, in the copper alloy plate of the second embodiment, the conductivity in the direction parallel to the rolling direction can be set to be the same as that in the copper alloy plate of the first embodiment.

[0106] The copper alloy plate of the second embodiment can be manufactured by the manufacturing method of the copper alloy plate of this embodiment described above.

[0107] [Electronic Components] The electronic component of this embodiment is an electronic component containing the copper alloy plate of the first and second embodiments described above (hereinafter also referred to as the copper alloy plate of this embodiment). More specifically, the electronic component of this embodiment has a copper alloy component manufactured from the copper alloy plate of this embodiment inside it. For example, a semiconductor package can be cited as an electronic component. The miniaturized copper alloy component that can be manufactured from the copper alloy plate of this embodiment has the characteristic of suppressing deformation during the manufacturing process of the electronic component; therefore, the copper alloy plate of this embodiment is suitable for manufacturing semiconductor packages with more miniaturized structures.

[0108] Furthermore, when the electronic component is a semiconductor package, the semiconductor package is not particularly limited. For example, it can be manufactured by using the copper alloy plate of this embodiment to manufacture a lead frame, then supporting and fixing the semiconductor component on the lead frame, wire bonding the semiconductor component and the leads to form internal wiring, and then sealing the semiconductor component with a specified resin component. As described above, the electronic component of this embodiment may also contain the copper alloy plate of the above embodiment.

[0109] While the embodiments of the present invention have been described above, the copper alloy plate, electronic components, and manufacturing method of the copper alloy plate of the present invention are not limited to the above examples and may be appropriately modified.

[0110] (The solution of this invention) The first aspect of the present invention is a copper alloy plate containing 1.5 to 4.6% by mass Ni, 0.10 to 0.80% by mass Co, 0.10 to 1.3% by mass Si, with the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° relative to the rolling direction is defined as tensile strength TC (MPa), The average values ​​of tensile strength TA, tensile strength TB and tensile strength TC are above 930 MPa.

[0111] The second aspect of the present invention is a copper alloy plate as described in the first aspect, wherein, when the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The average values ​​of tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD are above 930 MPa.

[0112] The third aspect of the present invention is a copper alloy plate as described in the second aspect, wherein the average value is 987 MPa or higher.

[0113] The fourth aspect of the present invention is a copper alloy plate as described in any one of the first to third aspects, wherein the average value is 993 MPa or more.

[0114] The fifth aspect of the present invention is a copper alloy plate as described in any one of the first to fourth aspects, which further contains a total of 0.010 to 5.0% by mass of one or more elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo and Mn.

[0115] The sixth aspect of the present invention is a copper alloy plate as described in any one of the first to fifth aspects, which further contains 0.010 to 0.50% by mass of Cr.

[0116] The seventh aspect of the present invention is a copper alloy plate as described in any one of the first to sixth aspects, wherein the tensile strength TA is 930 MPa or more.

[0117] The eighth aspect of the present invention is a copper alloy plate as described in any one of the first to seventh aspects, wherein the tensile strength TB is 870 MPa or more.

[0118] The ninth aspect of the present invention is a copper alloy plate as described in any one of the first to eighth aspects, wherein the tensile strength TC is 885 MPa or more.

[0119] The tenth aspect of the present invention is a copper alloy plate as described in any one of the first to ninth aspects, wherein the tensile strength TD is 880 MPa or more.

[0120] The eleventh aspect of the present invention is a copper alloy plate as described in any one of the first to tenth aspects, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

[0121] The 12th aspect of the present invention is a copper alloy plate containing 1.5 to 4.6% by mass Ni, 0.10 to 0.80% by mass Co, 0.10 to 1.3% by mass Si, with the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° relative to the rolling direction is defined as tensile strength TC (MPa), The minimum value among tensile strength TA, tensile strength TB and tensile strength TC is above 930 MPa.

[0122] The 13th aspect of the present invention is a copper alloy plate as described in the 12th aspect, wherein, when the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The minimum value among tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD is above 930 MPa.

[0123] The 14th aspect of the present invention is a copper alloy plate as described in the 12th or 13th aspect, wherein the minimum value is 961 MPa or more.

[0124] The 15th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 14th aspects, which further contains a total of 0.010 to 5.0% by mass of one or more elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo and Mn.

[0125] The 16th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 15th aspects, which further contains 0.010 to 0.50% by mass of Cr.

[0126] The 17th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 16th aspects, wherein the tensile strength TA is 930 MPa or more.

[0127] The 18th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 17th aspects, wherein the tensile strength TB is 870 MPa or more.

[0128] The 19th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 18th aspects, wherein the tensile strength TC is 885 MPa or more.

[0129] The 20th aspect of the present invention is a copper alloy plate as described in any one of the 12th to 19th aspects, wherein the tensile strength TD is 880 MPa or more.

[0130] The 21st aspect of the present invention is a copper alloy plate as described in any one of the 12th to 20th aspects, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

[0131] The 22nd aspect of the present invention is an electronic component comprising a copper alloy plate as described in any one of the 1st to 21st aspects.

[0132] The 23rd aspect of the present invention is a method for manufacturing a copper alloy plate, which comprises the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.6% by mass of Ni, 0.10–0.80% by mass of Co, 0.10–1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; When the electrical conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), and tensile strength (C (MPa)) of the copper alloy intermediate after the solution treatment are used to express the formula (X = (A × B) / (C)), the value of X in the formula is 17.5 or less.

[0133] The 24th aspect of the present invention is a method for manufacturing a copper alloy plate as described in the 23rd aspect, wherein the copper alloy plate further contains 0.010 to 0.50% by mass of Cr.

[0134] [Example] The present invention will be further described in detail below through embodiments, but the present invention is not limited to any of the embodiments described below.

[0135] The copper alloy plates of Example 1 and Comparative Example 1 were manufactured under the conditions shown in Table 1. Electrolytic copper was used as the raw material, and the copper alloy with the composition shown in Table 1 was melted and cast using an atmospheric melting furnace. After homogenizing annealing at 980°C for 3 hours, the ingot was hot rolled until the plate thickness reached 10 mm, followed by face cutting. Then, intermediate cold rolling was performed, and solution treatment and aging treatment were carried out under the conditions shown in Table 1.

[0136] Next, the obtained intermediate was pickled and ground, and then cold rolled to the finish shown in Table 1 until the plate thickness was 0.151 mm. Then, stress-relief annealing was performed in the atmosphere under the conditions shown in Table 1. The stress-relief annealed copper alloy plate was cooled by air cooling, thereby obtaining the copper alloy plates of Example 1 and Comparative Example 1.

[0137] [Table 1] The physical properties of the copper alloy plates and intermediates of Example 1 and Comparative Example 1 were determined by the following methods. The results are shown in Table 2. In addition, the average and minimum tensile strengths in each direction are shown in Table 3.

[0138] [composition] The composition of the obtained copper alloy was confirmed by fluorescence X-ray analysis. A Rigaku Simultix14 fluorescence X-ray analyzer was used. The analysis surfaces were machined or mechanically ground to achieve a maximum surface roughness Rz (JIS-B0601 (2013)) of 6.3 μm or less. Fluorescence X-ray analysis was performed according to JIS K 0119:2008, using wavelength dispersion.

[0139] [Tensile Strength (TS)] The tensile strength was determined using a tensile testing machine according to JIS-Z2241 (2011). The tensile strength was measured in the following directions: parallel to the rolling direction, perpendicular to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction.

[0140] Specifically, JIS 13B test pieces were prepared from each specimen using a pressing machine, with the tensile direction aligned with the calendering direction. Regarding the tensile test conditions, the test piece width was set to 12.5 mm, the measurement temperature to room temperature (15–35°C), the tensile speed (crosshead displacement speed) to 5 mm / min, and the gauge length to 50 mm. The test was conducted with two test pieces, and the average of the two data points is shown in Table 2.

[0141] [0.2% yield strength] The yield strength was determined using a tensile testing machine according to JIS-Z2241 (2011) (transverse distance method, 0.2%). The 0.2% yield strength was determined in the following directions: parallel to the rolling direction, perpendicular to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction.

[0142] Specifically, test pieces were prepared using the same method as the tensile strength test described above. Furthermore, the tests were conducted under the same conditions as the tensile strength test described above.

[0143] [Elongation at break] The tensile testing machine was used to determine the elongation at break according to JIS-Z2241 (2011). The elongation at break (%) was measured in the direction parallel to the rolling direction, in the direction perpendicular to the rolling direction, in the direction inclined at 45° to the rolling direction, and in the direction inclined at 22.5° to the rolling direction.

[0144] Specifically, test pieces are prepared using the same method as described above for tensile strength testing. Furthermore, the test is conducted under the same conditions as described above for tensile strength testing. The method for determining elongation at break is as follows: The final gauge length and the original gauge length are defined as being the same as in JIS-Z2241 (2011).

[0145] Elongation at break (%) = (Final gauge length - Original gauge length) ÷ Original gauge length [Conductivity] Conductivity (EC: %IACS) was determined according to JIS-H0505 (1975) using the four-terminal method. A double bridge was used for the measurement, and resistance was measured based on the average cross-sectional area method. Conductivity was measured at room temperature (25°C) in directions parallel to the rolling direction, perpendicular to the rolling direction, inclined at 45° relative to the rolling direction, and inclined at 22.5° relative to the rolling direction. Furthermore, the gauge length (distance between resistance measurements) was measured to be 50 mm.

[0146] [Table 2] [Table 3] As shown in Tables 2 and 3, it can be seen that by manufacturing under the conditions of each step, especially by using relatively high processing temperatures for solution treatment and aging treatment, and by using relatively high precision cold rolling, high electrical conductivity is achieved, and the tensile strengths TA, TB, TC, and TD in all directions are improved. Therefore, the copper alloy plate of Example 1 can be said to have high tensile strength in all directions (any direction) relative to the stretching direction. Thus, the miniaturized copper alloy components for electronic components manufactured from the copper alloy plate can effectively suppress deformation during the manufacturing process of electronic components.

[0147] [Industry availability] According to the present invention, a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate can be provided.

Claims

1. A copper alloy plate containing 1.5–4.6% by mass Ni, 0.10–0.80% by mass Co, 0.10–1.3% by mass Si, with the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° relative to the rolling direction is defined as tensile strength TC (MPa), The average value of the tensile strength TA, the tensile strength TB and the tensile strength TC is above 930 MPa.

2. The copper alloy plate as described in claim 1, wherein, When the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The average value of the tensile strength TA, the tensile strength TB, the tensile strength TC and the tensile strength TD is above 930 MPa.

3. The copper alloy plate as described in claim 2, wherein, The average value is above 987 MPa.

4. The copper alloy plate as described in claim 1, wherein, The average value is above 993 MPa.

5. The copper alloy plate as claimed in claim 1, further comprising a total of 0.010 to 5.0% by mass of one or more elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo, and Mn.

6. The copper alloy plate as claimed in claim 1, further comprising 0.010 to 0.50% by mass of Cr.

7. The copper alloy plate as described in claim 1, wherein, The tensile strength TA is above 930 MPa.

8. The copper alloy plate as described in claim 1, wherein, The tensile strength TB is above 870 MPa.

9. The copper alloy plate as described in claim 1, wherein, The tensile strength TC is above 885 MPa.

10. The copper alloy plate as described in claim 2, wherein, The tensile strength TD is above 880 MPa.

11. The copper alloy plate as claimed in claim 1, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

12. A copper alloy plate containing 1.5–4.6% by mass Ni, 0.10–0.80% by mass Co, and 0.10–1.3% by mass Si, the remainder being composed of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° relative to the rolling direction is defined as tensile strength TC (MPa), The minimum of the tensile strengths TA, TB, and TC is above 930 MPa.

13. The copper alloy plate as described in claim 12, wherein, When the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The minimum of the tensile strengths TA, TB, TC, and TD is above 930 MPa.

14. The copper alloy plate as described in claim 12, wherein, The minimum value is above 961 MPa.

15. The copper alloy plate of claim 12, further comprising a total of 0.010 to 5.0% by mass of one or more elements selected from the group consisting of Mg, Fe, P, Cr, Ag, Zn, Sn, Pb, Zr, Al, As, Se, Te, Sb, Bi, Au, Ti, Nb, V, Ta, W, Mo and Mn.

16. The copper alloy plate of claim 12, further comprising 0.010 to 0.50% by mass of Cr.

17. The copper alloy plate as described in claim 12, wherein, The tensile strength TA is above 930 MPa.

18. The copper alloy plate as described in claim 12, wherein, The tensile strength TB is above 870 MPa.

19. The copper alloy plate as described in claim 12, wherein, The tensile strength TC is above 885 MPa.

20. The copper alloy plate as described in claim 13, wherein, The tensile strength TD is above 880 MPa.

21. The copper alloy plate as claimed in claim 12, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

22. An electronic component comprising a copper alloy plate according to any one of claims 1 to 21.

23. A method for manufacturing a copper alloy plate, comprising the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.6% by mass of Ni, 0.10–0.80% by mass of Co, 0.10–1.3% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; When the electrical conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), and tensile strength (C (MPa)) of the copper alloy intermediate after the solution treatment are used to express the formula (X = (A × B) / (C)), the value of X in the formula is 17.5 or less.

24. The method for manufacturing a copper alloy plate as described in claim 23, wherein, The copper alloy plate further contains 0.010 to 0.50% by mass of Cr.

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