Copper alloy sheet, electronic component, and method for manufacturing copper alloy sheet

Abstract

The present invention aims to provide a copper alloy sheet having high strength in all directions with respect to the extending direction. The copper alloy sheet of the present invention contains 1.5 to 4.5 mass% of Ni, 0.10 to 1.2 mass% of Si, and the remainder of Cu and inevitable impurities, and when the tensile strength in a direction at right angles to the calendering direction is set as tensile strength TA (MPa), the tensile strength in a direction parallel to the calendering direction is set as tensile strength TB (MPa), and the tensile strength in a direction inclined at 45° to the calendering direction is set as tensile strength TC (MPa), the average of the tensile strength TA, the tensile strength TB, and the tensile strength TC is 886 MPa or more.

Description

Technical Field

[0001] This invention relates to a copper alloy plate, electronic components, and a method for manufacturing the copper alloy plate. Background Technology

[0002] Cosen alloys are copper alloys in which intermetallic compounds such as Ni-Si, Co-Si, and Ni-Co-Si are precipitated in a Cu matrix, possessing both high strength and high conductivity. Due to these properties, Cosen alloys are used as copper alloy components in electronic parts, for example, in semiconductor packages as lead frames that support and fix semiconductor components and form internal wiring (see, for example, Patent Document 1).

[0003] Previous technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2018-035437 Summary of the Invention

[0004] [The problem the invention aims to solve] With the increasing functionality of electronic components in recent years, copper alloy components (or specific parts of copper alloy components) made of copper alloy plates of Cosun alloy are becoming increasingly miniaturized. For copper alloy plates, high conductivity is required, while further improving the characteristics to adapt to this miniaturization.

[0005] For example, in semiconductor packages used as electronic components, the lead frame, constructed from a copper alloy plate, is particularly important as the leads within the lead frame become increasingly narrower due to the increasing functionality of semiconductor packages. Leads are the internal wiring (pins) within the semiconductor package used for connecting to external wiring. To increase the number of pins and achieve higher functionality, the leads are narrowed. However, due to this miniaturization, the strength of the leads is sometimes insufficient. The lead frame, especially the portion that forms the leads, extends in various directions relative to the rolling direction of the copper alloy plate used to manufacture the lead frame. Therefore, if the copper alloy plate does not have high strength in all directions relative to the rolling direction, the leads may deform during the manufacturing steps of the lead frame or semiconductor package (e.g., the step of manufacturing the desired lead frame by half-etching the copper alloy plate, or the step of wire bonding to connect the leads to the semiconductor component after placing the semiconductor component in the lead frame). This can make it difficult to maintain the shape with high precision. As a result, semiconductor packages cannot always be manufactured efficiently, and for copper alloy plates, further increases in strength are required in all directions relative to the rolling direction.

[0006] The purpose of this invention is to provide a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate.

[0007] [Technical means to solve the problem] In one embodiment of the copper alloy plate of the present invention, the copper alloy plate contains 1.5 to 4.5% by mass of Ni, 0.10 to 1.2% by mass of Si, and the remainder is composed of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), the average value of tensile strength TA, tensile strength TB and tensile strength TC is 886 MPa or more.

[0008] In another embodiment of the copper alloy plate of the present invention, the copper alloy plate contains 1.5 to 4.5% by mass of Ni, 0.10 to 1.2% by mass of Si, and the remainder is composed of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), the minimum value of tensile strength TA, tensile strength TB, and tensile strength TC is 862 MPa or more.

[0009] In one embodiment, the electronic component of the present invention comprises the copper alloy plate of the present invention described above.

[0010] In one embodiment, the method for manufacturing the copper alloy plate of the present invention comprises the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.5% by mass of Ni, 0.10–1.2% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was cold rolled. The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; The conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), tensile strength (C (MPa)), and plate thickness (D (mm)) of the copper alloy intermediate after the solution treatment step are expressed by the formula (X = (A...). 2 When x = B) / (C × D)), the value of X in the formula is less than 500.

[0011] [The effects of the invention] The present invention provides a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate. Attached Figure Description

[0012] [ Figure 1 The conductivity (A), 0.2% yield strength (B), tensile strength (C), and plate thickness (D) of the copper alloy intermediate after solution treatment are expressed by the formula (X = (A)). 2 The graph is obtained by organizing the relationship between parameter X (×B) / (C×D)(1)) and the tensile strength (MPa) of copper alloy plate (e.g., after aging treatment) in the direction parallel to the rolling direction. Detailed Implementation

[0013] The embodiments of the present invention are described in detail below, but the present invention is not limited to the embodiments described below.

[0014] In this invention, "a~b" means "a or more and b or less". Here, a and b represent numerical values.

[0015] [Copper Alloy Plate] [Implementation Plan 1] The copper alloy plate of the first embodiment contains 1.5–4.5% by mass Ni, 0.10–1.2% by mass Si, and the remainder consists of Cu and unavoidable impurities. That is, the copper alloy plate of this embodiment is a Cu-Ni-Si alloy. Regarding Ni and Si, through aging treatment, Ni and Si form precipitated particles of intermetallic compounds, mainly fine Ni₂Si, which significantly increases the strength of the copper alloy plate. Furthermore, the precipitation of Ni₂Si during the aging treatment results in high electrical conductivity.

[0016] In the copper alloy plate of the first embodiment, the Ni concentration is 1.5 to 4.5% by mass, and the Si concentration is 0.10 to 1.2% by mass. This maintains the high conductivity of the copper alloy plate while simultaneously improving its strength. When the Ni concentration is less than 1.5% by mass or the Si concentration is less than 0.10% by mass, the desired strength cannot be obtained even with the addition of another component. When the Ni concentration exceeds 4.5% by mass or the Si concentration exceeds 1.2% by mass, sufficient strength can be obtained, but conductivity will decrease.

[0017] The Ni concentration is preferably 1.6 to 4.2% by mass. Furthermore, the lower limit of the Ni concentration can be set to 1.6% by mass, preferably 2.2% by mass. Furthermore, the upper limit of the Ni concentration can be set to 4.2% by mass, preferably 3.0% by mass. The Ni concentration can also be set to 2.2 to 4.2% by mass, or to 1.6 to 3.0% by mass.

[0018] Furthermore, the Si concentration is preferably 0.25 to 1.1% by mass, more preferably 0.25 to 0.9% by mass, and even more preferably 0.4 to 0.7% by mass.

[0019] As mentioned above, Ni-Si precipitates formed from Ni and Si are considered to be intermetallic compounds mainly composed of Ni₂Si. However, Ni and Si in copper alloys may not all become precipitates due to the aging treatment during the manufacturing process of the copper alloy sheet; they may exist to some extent in a state of solid solution within the Cu matrix. The solid solution state of Ni and Si can slightly increase the strength of the copper alloy sheet, but its effect is smaller compared to the precipitated state. Furthermore, it may be a major cause of decreased conductivity. Therefore, the ratio of Ni to Si content is preferably close to the composition ratio of the precipitate Ni₂Si. Thus, the mass ratio of Ni to Si is preferably 3.4 to 5.4, more preferably 3.8 to 5.0.

[0020] In the copper alloy plate of the first embodiment, in addition to the elements mentioned above, it may further contain one or more elements selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr (hereinafter also referred to as "added elements"), totaling 0.050 to 1.00% by mass. This improves the strength, heat resistance, and stress relaxation resistance of the copper alloy plate.

[0021] By adding elements in an amount of 0.050% by mass or more, the desired effects described above tend to be easily obtained. Furthermore, by adding elements in an amount of 1.00% by mass or less, the desired properties can be obtained while simultaneously preventing a decrease in conductivity.

[0022] The total amount of added elements is preferably 0.075 to 0.60% by mass, more preferably 0.10 to 0.40% by mass.

[0023] The copper alloy plate of the first embodiment may contain 0.050 to 0.80% by mass of Mg. This improves stress relaxation resistance, etc. More specifically, by having Mg content of 0.050% by mass or more, the aforementioned desired effects are more easily obtained. Furthermore, by having Mg content of 0.80% by mass or less, the desired properties can be obtained while simultaneously preventing a decrease in conductivity.

[0024] The Mg concentration is preferably 0.050 to 0.60% by mass, more preferably 0.050 to 0.30% by mass, and even more preferably 0.10 to 0.30% by mass. Furthermore, when the copper alloy plate of the first embodiment contains Mg, it may also contain one or more elements selected from the group consisting of Fe, P, Mn, Co, Pb, Zn, and Cr, other than Mg, as listed above. In this case, it may contain, in addition to Mg, one or more elements selected from the group consisting of Fe, P, Mn, Co, Pb, Zn, and Cr in total of 0.050 to 1.00% by mass.

[0025] In the first embodiment, the remaining portion, other than the components mentioned above, consists of Cu and unavoidable impurities. Here, unavoidable impurities refer to impurity elements that cannot be avoided from being mixed into the material during the manufacturing process. The concentration of each element of these unavoidable impurities can be set, for example, to 0.015% by mass or less, preferably 0% (undetectable).

[0026] The composition of copper alloys can also be determined by wet analysis. Ni can be determined using the copper-separated dimethylglyoxime gravimetric method (JIS-H1056 (2003)), and Si can be determined using the silica gravimetric method (JIS-H1061 (2006)). Other additive and impurity elements can be determined using ICP emission spectrometry. The analysis of other additive elements is performed using an internal standard method, with Y (yttrium) as the internal standard. The internal standard can also be any element other than Y. ICP emission spectrometry is performed using an ICP emission spectrometry analyzer (ICP-OES) SPS3100 manufactured by Hitachi Advanced Scientific Corporation or an equivalent device. In the case of ICP emission spectrometry, the copper alloy sample is diluted with a mixture of hydrochloric acid and nitric acid (containing hydrochloric acid, nitric acid, and water in a volume ratio of 2:1:2) before use.

[0027] Furthermore, the composition of copper alloys can also be determined using fluorescence X-ray analysis. As a fluorescence X-ray analysis apparatus, Rigaku's Simultix14 or an equivalent apparatus can be used. The analysis surface only needs to be a surface that has been cut or mechanically ground to a maximum surface roughness Rz (JIS-B0601 (2013)) of 6.3 μm or less. When collecting samples for fluorescence X-ray analysis from the molten metal during self-melting casting, after casting into a shape of approximately 30–40 mm Φ and 50–80 mm thickness, the sample is cut into sections approximately 10–20 mm thick, and the cut surface is used as the analysis surface. Fluorescence X-ray analysis is performed based on JIS K 0119:2008, using a wavelength dispersion method.

[0028] The copper alloy plate of the first embodiment is not particularly limited if it is an object with a three-dimensional shape composed of the above-described components and having a specified thickness. The term "plate" in the copper alloy plate of the first embodiment also includes sheets, strips, and foils. Furthermore, the copper alloy plate of the first embodiment includes, for example, not only copper alloy plates before processing for use in electronic components, but also copper alloy plates in the process of processing or after processing.

[0029] The thickness of the copper alloy plate in the first embodiment is, for example, 0.03 to 1.2 mm. This thickness is preferably 0.03 to 0.60 mm, and more preferably 0.08 to 0.30 mm.

[0030] In the copper alloy sheet of the first embodiment, the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa). In the copper alloy sheet of the first embodiment, the average value of tensile strength TA, tensile strength TB, and tensile strength TC is 886 MPa or more.

[0031] In copper alloy sheets, although the tensile strength may vary depending on the direction of measurement, the tensile strength in directions other than those perpendicular to the rolling direction, parallel to the rolling direction, and inclined at 45° relative to the rolling direction is highly likely to be the same as or between the tensile strengths TA, TB, and TC in the aforementioned three directions. In the first embodiment, since the average value of tensile strengths TA, TB, and TC is high, the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction. Therefore, with the copper alloy sheet according to the first embodiment, deformation during the manufacturing process of miniaturized copper alloy parts or portions thereof for electronic components manufactured from the copper alloy sheet can be suppressed.

[0032] Specifically, the deformable copper alloy component, or a portion thereof, can extend within the copper alloy sheet prior to processing in various directions relative to the rolling direction of the copper alloy sheet. Since the copper alloy sheet of the first embodiment possesses high tensile strength in all directions relative to the extension direction of the copper alloy sheet, deformation of the copper alloy component, etc., can be suppressed during the manufacturing process of electronic components, specifically including the step of processing the copper alloy sheet to manufacture copper alloy components (e.g., lead frames).

[0033] In the copper alloy plate of the first embodiment, the average value of tensile strength TA, tensile strength TB and tensile strength TC is preferably 900 MPa or more, and more preferably 920 MPa or more.

[0034] Tensile strength in directions perpendicular to the rolling direction, parallel to the rolling direction, inclined at 45° to the rolling direction, and inclined at 22.5° to the rolling direction as described below can be determined by the methods described in the column of the following examples. As a tensile testing machine for the tensile test, an AUTOCOM AC-100KN-C manufactured by TSE Co., Ltd., or an equivalent device, can be used.

[0035] Furthermore, by setting the composition of the copper alloy plate to that of the copper alloy plate in the first embodiment described above and manufacturing it using the following manufacturing method, the tensile strength in each direction can be within the desired range. By adjusting parameter X in the following manufacturing method to a smaller value, the tensile strength in each direction can be increased.

[0036] In the copper alloy plate of the first embodiment, there is no particular upper limit to the average value of tensile strength TA, tensile strength TB and tensile strength TC. The average value may be less than 1200 MPa, less than 1100 MPa or less than 1000 MPa.

[0037] Furthermore, in the first embodiment, the calculation of the average tensile strength in each direction may also include tensile strength in directions other than the aforementioned tensile strengths TA, TB, and TC, such as tensile strength TD (MPa) in a direction inclined at 22.5° relative to the rolling direction. By including the tensile strength TD in a direction inclined at 22.5° relative to the rolling direction in the calculation of the average value, it is possible to more reliably ensure that the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction.

[0038] In the first embodiment, the average value (the average of tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) including tensile strength TD can be 882 MPa or higher, or 886 MPa or higher, or 915 MPa or higher. By using such an average value, deformation during the manufacturing process of miniaturized copper alloy parts or portions thereof used in electronic components made of copper alloy plates can be further suppressed.

[0039] In the first embodiment, the variation of each tensile strength (tensile strength TA, tensile strength TB, and tensile strength TC, or tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) used to calculate the above average value can be small. Therefore, among the plurality of tensile strengths used to calculate the average value, the difference between the maximum tensile strength and the minimum tensile strength can be less than 100 MPa, or less than 80 MPa. This also improves the uniformity of miniaturized copper alloy components or portions thereof used in electronic components manufactured from copper alloy plates. Furthermore, even if the copper alloy component is an asymmetrical design, the component (e.g., lead frame) can be extracted from the base material (copper alloy plate) in any direction, improving yield.

[0040] In the copper alloy sheet of the first embodiment, the tensile strength TA in the direction perpendicular to the rolling direction can be 930 MPa or higher. Therefore, deformation during the manufacturing process of miniaturized copper alloy parts or portions thereof for electronic components manufactured from copper alloy sheets can be further suppressed.

[0041] The tensile strength TA is preferably 950 MPa or higher, and more preferably 965 MPa or higher.

[0042] There is no particular upper limit to the tensile strength TA. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0043] In the copper alloy sheet of the first embodiment, the tensile strength TB in the direction parallel to the rolling direction can be 870 MPa or higher. By having such high tensile strength in the direction parallel to the rolling direction, deformation of the copper alloy sheet during the manufacturing process of electronic components can be more effectively suppressed.

[0044] The tensile strength TB is preferably 880 MPa or higher, and more preferably 888 MPa or higher.

[0045] There is no particular limit to the upper limit of the tensile strength TB. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0046] In the copper alloy plate of the first embodiment, the tensile strength TC in the direction inclined at 45° relative to the rolling direction can be 885 MPa or higher. By having such high tensile strength in the direction inclined at 45° relative to the rolling direction, deformation of the copper alloy plate during the manufacturing process of electronic components can be more effectively suppressed.

[0047] The tensile strength TC is preferably 900 MPa or higher, and more preferably 908 MPa or higher.

[0048] There is no particular upper limit to the tensile strength TC. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0049] In the copper alloy sheet of the first embodiment, the tensile strength TD in the direction inclined at 22.5° relative to the rolling direction can be 880 MPa or higher. By having such high tensile strength in the direction inclined at 22.5° relative to the rolling direction, deformation of the copper alloy sheet during the manufacturing process of electronic components can be more effectively suppressed.

[0050] The tensile strength TD is preferably 890 MPa or higher, and more preferably 899 MPa or higher.

[0051] There is no particular upper limit to the tensile strength TD. For example, the tensile strength can be below 1200 MPa, below 1100 MPa, or below 1000 MPa.

[0052] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction perpendicular to the rolling direction can be 895 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0053] The 0.2% yield strength in the direction perpendicular to the rolling direction is preferably 905 MPa or more, and more preferably 916 MPa or more.

[0054] The 0.2% yield strength in each direction, including the direction perpendicular to the rolling direction, can be determined by the method described in the column of the following examples. As the tensile testing machine for the tensile test, the AUTO COM AC-100KN-C manufactured by TSE Corporation or an equivalent device can be used.

[0055] Furthermore, by setting the composition of the copper alloy plate to that of the copper alloy plate in the first embodiment described above and manufacturing it using the following manufacturing method, the 0.2% yield strength in each direction can be within the desired range. By adjusting parameter X in the following manufacturing method to a smaller value, the tensile strength in each direction can be increased.

[0056] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction perpendicular to the rolling direction. For example, the 0.2% yield strength can be less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0057] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction parallel to the rolling direction can be 840 MPa or higher. Therefore, deformation during the manufacturing process of electronic components, specifically miniaturized copper alloy components or portions thereof, made from copper alloy sheets, can be more effectively suppressed.

[0058] The 0.2% yield strength in the direction parallel to the rolling direction is preferably 850 MPa or more, and more preferably 858 MPa or more.

[0059] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction parallel to the rolling direction. For example, the 0.2% yield strength can be less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0060] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction inclined at 45° relative to the rolling direction can be 845 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0061] The 0.2% yield strength in the direction inclined at 45° relative to the rolling direction is preferably 855 MPa or more, and more preferably 866 MPa or more.

[0062] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction inclined at 45° relative to the rolling direction. For example, the 0.2% yield strength can be less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0063] In the copper alloy sheet of the first embodiment, the 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction can be 840 MPa or higher. This allows for more effective suppression of deformation of the copper alloy sheet during the manufacturing process of electronic components.

[0064] The 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction is preferably 850 MPa or more, and more preferably 860 MPa or more.

[0065] There is no particular limitation on the upper limit of the 0.2% yield strength in the direction inclined at 22.5° relative to the rolling direction. The 0.2% yield strength may be, for example, less than 1200 MPa, less than 1100 MPa, or less than 1000 MPa.

[0066] The conductivity of the copper alloy plate in the direction parallel to the rolling direction of the first embodiment can be 35% IACS or higher. With a conductivity of 35.0% IACS or higher, it can be effectively used as a copper alloy component for electronic parts.

[0067] The conductivity in the direction parallel to the rolling direction is preferably 40.0% IACS or higher, and more preferably 43.7% IACS.

[0068] The conductivity in the direction parallel to the rolling direction can be measured by the method described in the column of the following embodiments. Furthermore, by setting the composition of the copper alloy plate to the composition of the copper alloy plate of the first embodiment described above and manufacturing it using the following manufacturing method, the conductivity can be made to be within the desired range.

[0069] The manufacturing method of the copper alloy plate in this embodiment will be described below.

[0070] The manufacturing method of the copper alloy plate in this embodiment includes the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.5% by mass of Ni, 0.10–1.2% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was cold rolled. The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling.

[0071] Furthermore, the electrical conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), tensile strength (C (MPa)), and plate thickness (D (mm)) of the copper alloy intermediate after the solution treatment step are used to express the formula (X = (A...). 2 When x = B) / (C × D)), the value of X in the formula is less than 500.

[0072] In the copper alloy plate manufacturing method of this embodiment, cold rolling can also be performed after the hot rolling step of the ingot and before the solution treatment step (this cold rolling is also referred to as the first intermediate cold rolling; in addition, the cold rolling after solution treatment is also referred to as the second intermediate cold rolling). After performing the above steps, grinding, polishing, bead blasting, pickling, etc., can be performed as appropriate to remove the oxide scale on the surface.

[0073] More specifically, in the manufacturing method of the copper alloy plate of this embodiment, it is important to perform a second intermediate cold rolling after solution treatment and before aging treatment.

[0074] Solution treatment is a heat treatment that dissolves silicides such as Ni-Si compounds into the Cu matrix while simultaneously recrystallizing the Cu matrix. Hot rolling can also be used as a solution treatment.

[0075] Aging treatment causes the silicides dissolved in the solution during the solution treatment to precipitate as fine particles of intermetallic compounds, primarily Ni₂Si. This aging treatment increases strength and conductivity.

[0076] Furthermore, by performing a second intermediate cold rolling process between solution treatment and aging treatment, the amount or size of fine particles that contribute to increased strength precipitated during aging treatment can be adjusted. Therefore, by performing a second intermediate cold rolling process, the strength of the copper alloy sheet can be increased significantly compared to the case without such a process.

[0077] The manufacturing method of the copper alloy plate in this embodiment is not particularly limited, but more specifically, it can be set as follows.

[0078] The method for manufacturing the copper alloy plate according to this embodiment may include a step of first melting and casting the raw material of the copper alloy having the desired composition. In this step, the raw material of the copper alloy is melted using the same method as that used for melting general copper alloys, and then an ingot is manufactured by continuous casting or semi-continuous casting. For example, an atmospheric melting furnace is first used to melt raw materials such as electrolytic copper, Ni, and Si to obtain a molten liquid with the target composition. Then, the molten liquid is poured into a mold of any size to cast an ingot.

[0079] The method for manufacturing the copper alloy plate according to this embodiment may include a hot rolling step of casting ingots. The hot rolling of the ingots is not particularly limited; for example, it can be performed in several passes at temperatures between 950°C and 500°C. Furthermore, the overall machining degree of the hot rolling is preferably set to 90% or more.

[0080] If the thickness of the workpiece used for calendering is set as TB, and the thickness of the workpiece after calendering is set as TA, then the degree of processing (%) is expressed as degree of processing (%) = [(TB - TA) / TB] × 100.

[0081] The method for manufacturing the copper alloy plate according to this embodiment may include a first intermediate cold rolling step of the aforementioned intermediate material. The cold rolling is not particularly limited, and may be performed in several passes. Preferably, it is performed in one or more passes. The overall machining degree is preferably set to 80% or more, more preferably 90% or more.

[0082] The method for manufacturing the copper alloy plate according to this embodiment may include a step of solution treatment of the intermediate material after any of the above-mentioned first intermediate cold pressing and rolling.

[0083] Figure 1 The conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), tensile strength (C (MPa)), and plate thickness (D (mm)) of the copper alloy intermediate after solution treatment are expressed by the formula (X = (A...). 2The graph is a summary of the relationship between parameter X (×B) / (C×D)(1)) and the tensile strength (MPa) of the aged copper alloy sheet in the direction parallel to the rolling direction. (Furthermore, the conductivity (A), 0.2% yield strength (B), and tensile strength (C) are all values ​​obtained by measurement in the direction parallel to the rolling direction.) By setting the value of parameter X to 500 or less, the copper alloy sheet of the present invention can be easily manufactured.

[0084] The heat treatment temperature for solution treatment can be set, for example, to 600–850°C. Furthermore, the heat treatment time can be set to 10 seconds–5 minutes. By setting the heat treatment temperature for solution treatment to a relatively high level and the heat treatment time to a relatively long level, the value of parameter X can be reduced. By setting the value of parameter X to 500 or below and appropriately selecting the combination of the heat treatment temperature and time for solution treatment, Ni-Si compounds can be dissolved in the Cu matrix, and the Cu matrix can be recrystallized. This allows for the precipitation of strength-enhancing precipitates during aging treatment, improving the tensile strength after stress-relief annealing. Furthermore, since anisotropy is eliminated due to the recrystallization of the metal structure accompanying solution treatment, high strength can also be obtained in directions other than those parallel to the rolling direction (directions inclined at 22.5° and 45° relative to the rolling direction, and directions perpendicular to the rolling direction) by setting the value of parameter X to 500 or below.

[0085] The preferred heating temperature is 650–800°C, and the preferred time is 20 seconds to 3 minutes.

[0086] The method for manufacturing the copper alloy plate according to this embodiment may include a second intermediate cold rolling step of the intermediate material after the above-described solution treatment. The cold rolling of the intermediate material is not particularly limited, and may be performed in several passes, for example. Preferably, it is performed in one or more passes. The total finish of the second intermediate cold rolling is preferably 5% or more, more preferably 10% or more. Furthermore, the total finish is preferably 90% or less, more preferably 60% or less. By setting this finish within the desired range described above, high conductivity can be maintained in various directions relative to the rolling direction while simultaneously increasing strength.

[0087] In order to fully improve the strength and conductivity of the copper alloy plate, the tensile strength of the intermediate material after the second intermediate cold rolling in the direction parallel to the rolling direction can be above 500 MPa.

[0088] Furthermore, the total degree of processing in the first intermediate cold rolling and the second intermediate cold rolling is preferably 90% or more, and more preferably 93% or more.

[0089] The method for manufacturing the copper alloy plate according to this embodiment may include an aging treatment step for the intermediate material after the second intermediate cold pressing and calendering described above. The heating temperature for the aging treatment is not particularly limited, but may be set to 375–625°C, preferably 400–550°C. Furthermore, the heating treatment time may be set to 1–50 hours, preferably 1.5–25 hours.

[0090] When the aging treatment temperature or time is above the lower limit of the above range, the amount of Ni2Si precipitation becomes sufficient, and sufficient strength is easily obtained. When the aging treatment temperature or time is below the upper limit of the above range, coarsening of the precipitates or resolution can be prevented, and the strength or conductivity can be easily and sufficiently improved.

[0091] To fully improve the strength and conductivity of copper alloy plates, the tensile strength of the aging-treated intermediate in the direction parallel to the rolling direction can be above 750 MPa. Furthermore, the conductivity of the aging-treated intermediate in the direction parallel to the rolling direction can be above 40.0% IACS.

[0092] To suppress the formation of oxide films, aging treatment is preferably carried out in inactive environments such as Ar, N2, and H2.

[0093] The method for manufacturing the copper alloy plate according to this embodiment may include a step of fine cold rolling of the aforementioned intermediate material. Fine cold rolling is not particularly limited, and may be performed in several passes. Preferably, it is performed in one or more passes. The total machining degree of the fine cold rolling is preferably 40% or more. By imparting processing strain to the material through fine cold rolling, its strength can be improved.

[0094] A processing degree of 40% or more in cold rolling tends to significantly improve strength. The preferred processing degree in cold rolling is 40% to 80%. A processing degree of 80% or less can prevent a decrease in conductivity due to processing strain from intense processing.

[0095] To fully improve the strength and conductivity of copper alloy plates, the tensile strength of the intermediate material after fine cold rolling in the direction parallel to the rolling direction can be above 850 MPa. Furthermore, the conductivity of the intermediate material after fine cold rolling in the direction parallel to the rolling direction can be above 40.0% IACS.

[0096] The manufacturing method of the copper alloy plate according to this embodiment may include a stress-relief annealing step for the intermediate material after the above-mentioned fine cold rolling. Stress-relief annealing can be performed under normal conditions, for example, at 300–550°C for a holding time of 5–900 seconds. Stress-relief annealing can be performed in the atmosphere or inactive environments such as nitrogen or argon. Furthermore, the copper alloy plate after stress-relief annealing can also be cooled by air cooling.

[0097] The copper alloy plate of the first embodiment can be manufactured by the manufacturing method of the copper alloy plate of this embodiment, which includes the above-described steps. Furthermore, in this manufacturing method, pickling, grinding, degreasing, surface cutting (surface trimming), and finishing may be performed as needed after each rolling step or heat treatment step. In addition, this manufacturing method may include rolling steps or heat treatment steps other than those described above.

[0098] [Second Implementation Plan] Next, the copper alloy plate of the second embodiment will be described. Furthermore, the descriptions of components that are repeated in the copper alloy plate of the second embodiment and the copper alloy plate of the first embodiment will be omitted as appropriate.

[0099] The copper alloy plate of the second embodiment contains 1.5 to 4.5% by mass of Ni, 0.10 to 1.2% by mass of Si, and the remainder consists of Cu and unavoidable impurities. This composition improves stress relaxation resistance, maintains the high conductivity of the copper alloy plate, and further enhances its strength.

[0100] The Ni concentration is preferably 1.6 to 4.2% by mass. Furthermore, the lower limit of the Ni concentration can be set to 1.6% by mass, preferably 2.2% by mass. Furthermore, the upper limit of the Ni concentration can be set to 4.2% by mass, preferably 3.0% by mass. The Ni concentration can also be set to 2.2 to 4.2% by mass, or to 1.6 to 3.0% by mass.

[0101] Furthermore, the Si concentration is preferably 0.25 to 1.1% by mass, more preferably 0.25 to 0.9% by mass, and even more preferably 0.4 to 0.7% by mass.

[0102] The copper alloy plate of the second embodiment may also contain one or more elements selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn, and Cr. In this case, it may contain a total of 0.050 to 1.00% by mass, preferably 0.075 to 0.60% by mass, and more preferably 0.10 to 0.40% by mass of one or more elements selected from the group consisting of Fe, P, Mn, Co, Pb, Zn, and Cr.

[0103] The copper alloy plate of the second embodiment may contain 0.050 to 0.80% by mass of Mg. This improves stress relaxation resistance, etc. The Mg concentration is preferably 0.075 to 0.60% by mass, more preferably 0.10 to 0.40% by mass. When Mg is present, in addition to Mg, it may also contain a total of 0.050 to 1.00% by mass of one or more elements selected from the group consisting of Fe, P, Mn, Co, Pb, Zn, and Cr.

[0104] In the copper alloy sheet of the second embodiment, the minimum value of tensile strength TA, tensile strength TB, and tensile strength TC is 862 MPa or higher. The tensile strength in directions other than those perpendicular to the rolling direction, parallel to the rolling direction, and inclined at 45° relative to the rolling direction is highly likely to be the same as or between the tensile strengths TA, TB, and TC in the aforementioned three directions. In the second embodiment, because the minimum value of tensile strength TA, tensile strength TB, and tensile strength TC is high, the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction. Therefore, deformation of the copper alloy sheet during the manufacturing process of electronic components can be suppressed.

[0105] The minimum value is preferably 870 MPa or higher, and more preferably 888 MPa or higher.

[0106] In the copper alloy plate of the second embodiment, there is no particular upper limit to the minimum values ​​of tensile strength TA, tensile strength TB and tensile strength TC. The minimum values ​​may be, for example, below 1100 MPa or below 1000 MPa.

[0107] Furthermore, in the second embodiment, the calculation of the minimum tensile strength in each direction may also include tensile strength in directions other than the tensile strengths TA, TB, and TC mentioned above, such as tensile strength TD (MPa) in a direction inclined at 22.5° relative to the rolling direction. By including tensile strength TD in the calculation of the minimum value, it is possible to more reliably ensure that the copper alloy sheet has high tensile strength in all directions (any direction) relative to the stretching direction.

[0108] In the second embodiment, the minimum value (the minimum of tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) can be 862 MPa or higher, or 870 MPa or higher, or 888 MPa or higher. By setting the minimum value to this value, deformation during the manufacturing process of miniaturized copper alloy components or portions thereof used in electronic components made of copper alloy plates can be further suppressed.

[0109] In the copper alloy plate of the second embodiment, there is no particular upper limit to the minimum value of the tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD. The minimum value may be, for example, below 1100 MPa or below 1000 MPa.

[0110] In the second embodiment, the variation of each tensile strength (tensile strength TA, tensile strength TB, and tensile strength TC, or tensile strength TA, tensile strength TB, tensile strength TC, and tensile strength TD) calculated for the aforementioned minimum value can be reduced. Therefore, among the plurality of tensile strengths calculated for the minimum value, the difference between the maximum tensile strength and the minimum tensile strength can be less than 100 MPa, or less than 80 MPa. This also improves the uniformity of miniaturized copper alloy components or portions thereof used in electronic components manufactured from copper alloy plates. Furthermore, even if the copper alloy component is an asymmetrical design, the component (e.g., lead frame) can be extracted from the base material (copper alloy plate) in any direction, improving yield.

[0111] In the copper alloy sheet of the second embodiment, the tensile strength in the direction perpendicular to the rolling direction, the direction parallel to the rolling direction, and the direction inclined at 22.5° relative to the rolling direction can be set to be the same as that in the copper alloy sheet of the first embodiment. Furthermore, in the copper alloy sheet of the second embodiment, the 0.2% yield strength in the direction perpendicular to the rolling direction, the direction parallel to the rolling direction, the direction inclined at 45° relative to the rolling direction, and the direction inclined at 22.5° relative to the rolling direction can be set to be the same as that in the copper alloy sheet of the first embodiment.

[0112] The copper alloy plate of the second embodiment can be manufactured by the manufacturing method of the copper alloy plate of this embodiment described above.

[0113] [Electronic Components] The electronic component of this embodiment is an electronic component containing the copper alloy plate of the first and second embodiments described above (hereinafter also referred to as the copper alloy plate of this embodiment). More specifically, the electronic component of this embodiment has a copper alloy component manufactured from the copper alloy plate of this embodiment inside it. For example, a semiconductor package can be cited as an electronic component. The miniaturized copper alloy component manufactured from the copper alloy plate of this embodiment has the characteristic of suppressing deformation during the manufacturing process of the electronic component; therefore, the copper alloy plate of this embodiment is suitable for manufacturing semiconductor packages with more miniaturized structures.

[0114] Furthermore, when the electronic component is a semiconductor package, the semiconductor package is not particularly limited. For example, it can be manufactured by using the copper alloy plate of this embodiment to manufacture a lead frame, then supporting and fixing the semiconductor component on the lead frame, wire bonding the semiconductor component and the leads to form internal wiring, and then sealing the semiconductor component with a specified resin component. As described above, the electronic component of this embodiment may also contain the copper alloy plate of the above embodiment.

[0115] The embodiments of the present invention have been described above, but the copper alloy plate, electronic components and manufacturing method of the copper alloy plate of the present invention are not limited to the above examples and can be appropriately modified.

[0116] (Example of the present invention) The copper alloy plate of the first example of the present invention contains 1.5 to 4.5% by mass of Ni, 0.10 to 1.2% by mass of Si, and the remainder consists of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), The average values ​​of tensile strength TA, tensile strength TB and tensile strength TC are above 886 MPa.

[0117] The second example of the present invention is a copper alloy plate as described in the first example, wherein the average value is 920 MPa or more.

[0118] The third example of the present invention is a copper alloy plate as described in the first or second example, wherein, when the tensile strength in the direction inclined at 22.5° relative to the rolling direction is set as the tensile strength TD (MPa), The average values ​​of tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD are above 882 MPa.

[0119] The fourth example of the present invention is a copper alloy plate as described in Examples 1 to 3, wherein the average value is 915 MPa or higher.

[0120] The fifth example of the present invention is a copper alloy plate as described in any one of the first to fourth examples, which further contains a total of 0.050 to 1.00% by mass of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

[0121] The sixth example of the present invention is a copper alloy plate as described in any one of the first to fifth examples, which further contains 0.050 to 0.80% by mass of Mg.

[0122] The seventh example of the present invention is a copper alloy plate as described in any one of the first to sixth examples, wherein the tensile strength TA is 930 MPa or more.

[0123] The eighth example of the present invention is a copper alloy plate as described in any one of the first to seventh examples, wherein the tensile strength TB is 870 MPa or more.

[0124] The ninth example of the present invention is a copper alloy plate as described in any one of the first to eighth examples, wherein the tensile strength TC is 885 MPa or more.

[0125] The tenth example of the present invention is a copper alloy plate as described in any one of the first to ninth examples, wherein the tensile strength TD is 880 MPa or more.

[0126] The 11th example of the present invention is a copper alloy plate as described in any one of the 1st to 10th examples, having an electrical conductivity of 35.0% IACS or higher in the direction parallel to the rolling direction.

[0127] The copper alloy plate of the 12th example of the present invention contains 1.5 to 4.5% by mass of Ni, 0.10 to 1.2% by mass of Si, and the remainder consists of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), The minimum value among tensile strength TA, tensile strength TB and tensile strength TC is above 862 MPa.

[0128] The 13th example of the present invention is a copper alloy plate as described in the 12th example, wherein, when the tensile strength in the direction inclined at 22.5° relative to the rolling direction is set as the tensile strength TD (MPa), The minimum value among tensile strength TA, tensile strength TB, tensile strength TC and tensile strength TD is above 862 MPa.

[0129] The 14th example of the present invention is a copper alloy plate as described in the 12th or 13th example, wherein the minimum value is 888 MPa or more.

[0130] The 15th example of the present invention is a copper alloy plate as described in any one of the 12th to 14th examples, which further contains a total of 0.050 to 1.00% by mass of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

[0131] The 16th example of the present invention is a copper alloy plate as described in any one of the 12th to 15th examples, which further contains 0.050 to 0.80% by mass of Mg.

[0132] The 17th example of the present invention is a copper alloy plate as described in any one of the 12th to 16th examples, wherein the tensile strength TA is 930 MPa or more.

[0133] The 18th example of the present invention is a copper alloy plate as described in any one of the 12th to 17th examples, wherein the tensile strength TB is 870 MPa or more.

[0134] The 19th example of the present invention is a copper alloy plate as described in any one of the 12th to 18th examples, wherein the tensile strength TC is 885 MPa or more.

[0135] The 20th example of the present invention is a copper alloy plate as described in any one of the 12th to 19th examples, wherein the tensile strength TD is 880 MPa or more.

[0136] The 21st example of the present invention is a copper alloy plate as described in any one of the 12th to 20th examples, having an electrical conductivity of 35.0% IACS or higher in a direction parallel to the rolling direction.

[0137] The 22nd example of the present invention is an electronic component comprising a copper alloy plate as described in any one of the 1st to 21st examples.

[0138] The 23rd example of the present invention is a method for manufacturing a copper alloy plate, which comprises the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.5% by mass of Ni, 0.10–1.2% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was cold rolled. The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; The conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), tensile strength (C (MPa)), and plate thickness (D (mm)) of the copper alloy intermediate after the solution treatment step are expressed by the formula (X = (A...). 2 When x = B) / (C × D)), the value of X in the formula is less than 500.

[0139] The 24th example of the present invention is a method for manufacturing a copper alloy plate as described in the 23rd example, wherein the copper alloy plate further contains a total of 0.050 to 1.00% by mass of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

[0140] The 25th example of the present invention is a copper alloy plate as described in any of the 23rd or 24th examples, which further contains 0.050 to 0.80% by mass of Mg.

[0141] [Example] The present invention will be further described in detail below through embodiments, but the present invention is not limited to any of the embodiments described below.

[0142] Example 1 and Comparative Example 1 are copper alloy plates manufactured under the conditions shown in Table 1.

[0143] Electrolytic copper was used as raw material, and the copper alloy with the composition shown in Table 1 was melted and cast in an atmospheric melting furnace. The ingot was homogenized and annealed at 850–980°C for 250 minutes, followed by hot rolling until the plate thickness reached 11.5 mm. After hot rolling, surface cutting was performed. Then, under the conditions shown in Table 1, a first intermediate cold rolling, solution treatment, a second intermediate cold rolling, and aging treatment were performed respectively.

[0144] Next, the obtained intermediate was pickled and ground, and then cold rolled to the finish shown in Table 1 until the plate thickness reached 0.151 mm. Further, stress-relief annealing was performed in the atmosphere under the conditions shown in Table 1. The stress-relief annealed copper alloy plate was cooled by air cooling, thereby obtaining the copper alloy plates of Example 1 and Comparative Example 1.

[0145] [Table 1] The copper alloy plates of Example 1 and Comparative Example 1 were subjected to the following measurements. The results are shown in Table 2. In addition, the average and minimum tensile strengths in each direction are shown in Table 3.

[0146] [composition] The composition of the obtained copper alloy was confirmed by fluorescence X-ray analysis. A Rigaku Simultix14 fluorescence X-ray analyzer was used. The analysis surface was prepared by cutting or mechanical grinding to achieve a maximum surface roughness Rz (JIS-B0601 (2013)) of 6.3 μm or less. Fluorescence X-ray analysis was performed according to JIS K 0119:2008, using a wavelength dispersion method.

[0147] [Tensile Strength (TS)] The tensile strength (TS) of the obtained copper alloy plates was determined by a tensile testing machine according to JIS-Z2241 (2011). The tensile strength was measured in the direction parallel to the rolling direction, in the direction perpendicular to the rolling direction, in the direction inclined at 45° to the rolling direction, and in the direction inclined at 22.5° to the rolling direction.

[0148] Specifically, JIS 13B test pieces were prepared from each specimen using a pressing machine, with the tensile direction aligned with the calendering direction. Regarding the tensile test conditions, the test piece width was set to 12.5 mm, the measurement temperature to room temperature (15–35°C), the tensile speed (crosshead displacement speed) to 5 mm / min, and the gauge length to 50 mm. The test was conducted with two test pieces, and the average of the two data points is shown in Table 2.

[0149] [0.2% yield strength] For copper alloys, the 0.2% yield strength (MPa) was determined using a tensile testing machine according to JIS-Z2241 (2011) (transverse distance method, 0.2%). The 0.2% yield strength was measured in the direction parallel to the rolling direction, in the direction perpendicular to the rolling direction, in the direction inclined at 45° to the rolling direction, and in the direction inclined at 22.5° to the rolling direction.

[0150] Specifically, test pieces were prepared using the same method as the tensile strength test described above. Furthermore, the tests were conducted under the same conditions as the tensile strength test described above. Additionally, two test pieces were used in the tests, and the average of the two data points is shown in Table 2.

[0151] [Elongation at break] For copper alloys, the elongation at break (%) was determined using a tensile testing machine according to JIS-Z2241 (2011). Regarding the elongation at break (%), the elongation at break (%) was measured in the direction parallel to the rolling direction, in the direction perpendicular to the rolling direction, in the direction inclined at 45° to the rolling direction, and in the direction inclined at 22.5° to the rolling direction.

[0152] Specifically, test pieces were prepared using the same method as the tensile strength test described above. Furthermore, the tests were conducted under the same conditions as the tensile strength test described above. Two test pieces were used in the tests, and the average values ​​of the two data points are shown in Table 2.

[0153] [Conductivity] Conductivity (EC: %IACS) was measured according to JIS-H0505 (1975) using the four-terminal method. A double bridge was used for the measurement, and resistance was measured based on the average cross-sectional area method. Conductivity was measured at room temperature (25°C). Furthermore, the gauge length (distance between resistance measurements) was set to 50 mm. Conductivity was measured in directions parallel to the rolling direction, perpendicular to the rolling direction, at a 45° angle to the rolling direction, and at a 22.5° angle to the rolling direction. Two test pieces were used, and the average of the two data points is shown in Table 2.

[0154] [Table 2] [Table 3] As shown in Tables 2 and 3, by performing a second intermediate cold rolling process between solution treatment and aging treatment, high electrical conductivity is achieved, and the tensile strengths TA, TB, TC, and TD in all directions are simultaneously improved. Therefore, the copper alloy plate of Example 1 can be said to have high tensile strength in all directions (any direction) relative to the stretching direction. Thus, the miniaturized copper alloy components for electronic parts manufactured from the copper alloy plate can effectively suppress deformation during the manufacturing process of electronic parts.

[0155] [Industry availability] According to the present invention, a copper alloy plate having high strength in all directions relative to the extension direction, an electronic component containing the same, and a method for manufacturing the copper alloy plate can be provided.

Claims

1. A copper alloy plate containing 1.5–4.5% by mass Ni, 0.10–1.2% by mass Si, and the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), The average value of the tensile strength TA, the tensile strength TB and the tensile strength TC is above 886 MPa.

2. The copper alloy plate as described in claim 1, wherein, The average value is above 920 MPa.

3. The copper alloy plate as described in claim 1, wherein, When the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The average value of the tensile strength TA, the tensile strength TB, the tensile strength TC and the tensile strength TD is above 882 MPa.

4. The copper alloy plate as described in claim 3, wherein, The average value is above 915 MPa.

5. The copper alloy plate as claimed in claim 1, further comprising a total of 0.050 to 1.00% by mass of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

6. The copper alloy plate as claimed in claim 1, further comprising 0.050 to 0.80% by mass of Mg.

7. The copper alloy plate as described in claim 1, wherein, The tensile strength TA is above 930 MPa.

8. The copper alloy plate as described in claim 1, wherein, The tensile strength TB is above 870 MPa.

9. The copper alloy plate as described in claim 1, wherein, The tensile strength TC is above 885 MPa.

10. The copper alloy plate as described in claim 3, wherein, The tensile strength TD is above 880 MPa.

11. The copper alloy plate as claimed in claim 1, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

12. A copper alloy plate containing 1.5–4.5% by mass Ni, 0.10–1.2% by mass Si, and the remainder consisting of Cu and unavoidable impurities. When the tensile strength in the direction perpendicular to the rolling direction is defined as tensile strength TA (MPa), the tensile strength in the direction parallel to the rolling direction is defined as tensile strength TB (MPa), and the tensile strength in the direction inclined at 45° to the rolling direction is defined as tensile strength TC (MPa), The minimum of the tensile strengths TA, TB, and TC is above 862 MPa.

13. The copper alloy plate as described in claim 12, wherein, When the tensile strength in the direction inclined at 22.5° relative to the rolling direction is defined as the tensile strength TD (MPa), The minimum of the tensile strengths TA, TB, TC, and TD is above 862 MPa.

14. The copper alloy plate as described in claim 12, wherein, The minimum value is above 888 MPa.

15. The copper alloy plate of claim 12, further comprising a total of 0.050 to 1.00% by mass of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

16. The copper alloy plate of claim 12, further comprising 0.050 to 0.80% by mass of Mg.

17. The copper alloy plate as described in claim 12, wherein, The tensile strength TA is above 930 MPa.

18. The copper alloy plate as described in claim 12, wherein, The tensile strength TB is above 870 MPa.

19. The copper alloy plate as described in claim 12, wherein, The tensile strength TC is above 885 MPa.

20. The copper alloy plate as described in claim 13, wherein, The tensile strength TD is above 880 MPa.

21. The copper alloy plate as claimed in claim 12, wherein the conductivity in the direction parallel to the rolling direction is 35.0% IACS or higher.

22. An electronic component comprising a copper alloy plate according to any one of claims 1 to 21.

23. A method for manufacturing a copper alloy plate, comprising the following steps in sequence: Hot rolling is performed on ingots of copper alloys containing 1.5–4.5% by mass of Ni, 0.10–1.2% by mass of Si, with the remainder consisting of Cu and unavoidable impurities. The obtained copper alloy intermediate was subjected to solution treatment; The copper alloy intermediate was cold rolled. The copper alloy intermediate was subjected to aging treatment; and The copper alloy intermediate was subjected to fine cold rolling; The conductivity (A (%IACS)), 0.2% yield strength (B (MPa)), tensile strength (C (MPa)), and plate thickness (D (mm)) of the copper alloy intermediate after the solution treatment step are expressed by the formula (X = (A...). 2 When x = B) / (C×D), the value of X in this expression is less than 500.

24. The method for manufacturing a copper alloy plate as described in claim 23, wherein, The copper alloy plate further contains a total of 0.050 to 1.00% by mass of one or more elements selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn and Cr.

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