Materials for forming patterned coatings comprising phase change materials and devices incorporating the same

Abstract

A solid-solid phase change material (PCM) for use as a patterned coating adapted to influence the directionality of the evaporation flux of a deposition material to be deposited thereon for deposition on a first layer surface of an underlying layer disposed in a first portion of a lateral orientation of an optoelectronic device such that a deposition layer comprising the deposition material is deposited on a second portion of the lateral orientation while the first portion is substantially free of a closed coating of the deposition material. An optoelectronic device comprising a solid-solid PCM.

Description

[0001] Related patent applications This application claims priority to U.S. Provisional Patent Application No. 63 / 594,260, filed October 30, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to layered semiconductor devices, and in some non-limiting examples to layered optoelectronic devices having a plurality of sub-pixel emitting regions and a plurality of light-transmitting regions, each sub-pixel including a first electrode and a second electrode separated by a semiconductor layer, wherein at least one of these electrodes, electrically coupled conductive coatings thereto, and the transmissive regions can be patterned by depositing a patterned coating, which can act as and be at least one of nucleation inhibition coatings for patterning at least one conductive deposition material, such as that deposited during the device fabrication process to form such electrodes and conductive coatings and to prevent the deposition of such deposition material to form such transmissive regions. Background Technology

[0003] In optoelectronic devices such as organic light-emitting diodes (OLEDs), at least one semiconductive layer, including an emitting layer, may be disposed between a pair of electrodes (such as an anode and a cathode). The anode and cathode may be electrically coupled to a power source and generate holes and electrons, respectively, which migrate toward each other through the at least one semiconductive layer. When a pair of holes and electrons combine, the emitting layer may emit light in the form of photons.

[0004] OLED display panels (such as active-matrix OLED (AMOLED) panels) may include multiple pixels, each pixel further including multiple (including but not limited to one of three and four) sub-pixels. In some non-limiting examples, the various sub-pixels of a pixel may be characterized by at least one of three and four different colors (including but not limited to R (red), G (green), and B (blue)). Each (sub)pixel may have an associated emission region comprising an associated pair of electrodes and a stack of at least one semiconductive layer between these electrodes. In some non-limiting examples, each sub-pixel of a pixel may emit light, including but not limited to photons, having an associated wavelength spectrum characterized by a given color (including but not limited to one of R (red), G (green), B (blue), and W (white)). In some non-limiting examples, the (sub)pixels may be selectively driven by driving circuitry including at least one thin-film transistor (TFT) structure electrically coupled to conductive metal lines within a substrate, and in some non-limiting examples, electrodes and at least one semiconductive layer are deposited on the substrate. In some non-limiting examples, various coatings (layers) of such panels may be formed by a vacuum-based deposition process.

[0005] In an AMOLED panel, a sub-pixel emits light when a voltage is applied between its anode and cathode. The emission of light from each sub-pixel in such a panel can be controlled by controlling the voltage applied between the anode and cathode. In cases where a common cathode is provided across multiple sub-pixels, the voltage across the anode and cathode in each sub-pixel can be controlled by modulating the voltage of the anode. In some non-limiting examples, adjacent anodes may be spaced apart laterally and an at least one non-emitting region may be provided between them.

[0006] In some non-limiting examples, there may be an objective to provide a patterned conductive deposition layer for each (sub)pixel of the panel on at least one of the following during the OLED manufacturing process: selectively depositing a closed coating of conductive deposition material to form device features, such as, but not limited to, electrodes and conductive elements electrically coupled thereto, and regions substantially lacking deposition material (including but not limited to) to define transparent areas of the device.

[0007] In some non-limiting examples, one approach to doing this involves inserting a fine metal mask (FMM) during the deposition of the deposited material. However, such deposited materials can have significantly high evaporation temperatures, which can affect at least one of the ability to reuse the FMM and / or the accuracy of the achievable pattern, and is accompanied by increased cost, effort, and complexity.

[0008] In some non-limiting examples, one approach to doing this involves depositing material and then removing (including, but not limited to, areas drilled by laser drilling) the unwanted areas to form a pattern. However, the removal process typically involves either the generation or presence of debris, which can affect the yield of the manufacturing process.

[0009] In some non-limiting examples, such methods may have reduced applicability in certain applications. In some non-limiting examples, this method may have reduced applicability to devices with certain morphological features.

[0010] In some non-limiting applications, there may be a goal of providing an improved mechanism for selective deposition of conductive deposition materials. Attached Figure Description

[0011] Examples of this disclosure will now be described with reference to the following figures, wherein the same reference numerals in the different figures indicate at least one of the following: the same elements and, in some non-limiting examples, similar elements and corresponding elements, and wherein: Figure 1The following is a simplified block diagram of an example device in the longitudinal orientation according to the example in this disclosure, which has multiple layers in the lateral orientation, the layers being formed by selectively depositing a patterned coating in a first portion of the lateral orientation and subsequently depositing a closed coating of deposited material in a second portion thereof; Figure 2 Based on the examples in this disclosure Figure 1 A simplified diagram of an example type of device viewed longitudinally, in which a closed coating of deposited material in the second part forms the second electrode of the optoelectronic device; Figure 3 This is a schematic diagram showing an example cross-sectional view of an example display panel according to an example of the present disclosure, the example display panel having multiple layers, the multiple layers including at least one hole through which at least one electromagnetic signal can be exchanged; Figure 4 This illustrates an example of a method for use in accordance with this disclosure. Figure 1 A schematic diagram illustrating an example process of depositing a patterned coating on the exposed surface of the lower layer in an example type of device; Figure 5 It is shown that it is used in including Figure 3 A schematic diagram of an example process of depositing deposition material in a second portion of the exposed layer surface of a patterned coating, wherein the patterned coating is a nucleation inhibition coating (NIC). Figure 6A It is shown in sectional view Figure 1 A schematic diagram of an example type of device; Figure 6B This is shown in the supplementary floor plan. Figure 6A Schematic diagram of the device; Figures 7A to 7B This is a schematic diagram illustrating various potential behaviors of a patterned coating according to various examples of the present disclosure, the patterned coating being located in Figure 1 The deposition interface with the deposited layer in an exemplary type of device; Figures 8A to 8H Based on the examples in this disclosure Figure 1 A simplified block diagram of an exemplary type of the device, viewed from a cross-sectional perspective, illustrates various examples of possible interactions between the granular patterned coating and the granular structure. Figure 9 It is a schematic diagram illustrating an example according to this disclosure. Figure 2 Example cross-sectional view of the device type, and additional example deposition steps; Figure 10 This is a schematic diagram illustrating an example stage of an example process for manufacturing an OLED device according to an example of an example type of example according to the examples in this disclosure, the example type having sub-pixel regions having a second electrode of another thickness; Figure 11 This is a schematic diagram illustrating an example cross-sectional view of an OLED device according to an example of the present disclosure, wherein the second electrode is coupled to the auxiliary electrode; Figure 12 This is a schematic diagram of an example cross-sectional view illustrating an example type of OLED device having separators and shielding areas (such as recesses) in its non-emitting region according to an example of the present disclosure; Figures 13A to 13B This is a schematic diagram illustrating an exemplary cross-sectional view of an exemplary OLED device having separators and shielding areas (such as holes) in a non-emitting region according to various examples in this disclosure; Figure 14 This is an example energy profile illustrating the energy states of surface-adsorbed atoms adsorbed onto a surface according to an example in this disclosure; Figure 15 This is a schematic diagram illustrating the formation of a membrane core according to an example in this disclosure; and Figure 16 It is a block diagram of an example computer device within a computing and communication environment that can be used to implement devices and methods according to representative examples of this disclosure.

[0012] In this disclosure, an icon symbol appended with at least one of at least a numerical value (including, but not limited to, at least one of a superscript and a subscript) and at least one letter character (including, but not limited to, in lowercase) can be considered to refer to at least one specific instance and subset of the feature (element) described by the icon symbol. As indicated by the context, indexing an icon symbol without indexing at least one of the appended value and the character can generally refer to the feature described by the icon symbol and at least one of the set of all instances described by it. Similarly, an icon symbol can use the letter "x" to replace a number. As indicated by the context, indexing such an icon symbol can generally refer to the feature described by the icon symbol, wherein the character "x" is replaced by a number and the set of all instances described by it.

[0013] In this disclosure, specific details, including but not limited to particular architectures, interfaces, and techniques, are set forth for illustrative purposes and not for limitation in order to provide a thorough understanding of the disclosure. In some instances, detailed descriptions of well-known systems, technologies, components, devices, circuits, methods, and applications have been omitted to avoid unnecessary detail that could obscure the description of this disclosure.

[0014] Furthermore, it should be understood that the block diagrams reproduced herein may represent conceptual views of exemplary components embodying the principles of this technology.

[0015] Therefore, system and method components have been appropriately indicated in the accompanying drawings using conventional symbols, with only those specific details shown that are relevant to understanding the examples of this disclosure, so that this disclosure will not be obscured by details that are obvious to those skilled in the art who will benefit from the description herein.

[0016] Any of the accompanying drawings provided herein may not be drawn to scale and should not be considered as limiting this disclosure in any way.

[0017] In some examples, any features shown in dashed outlines may be considered optional. Summary of the Invention

[0018] The purpose of this disclosure is to eliminate or mitigate at least one disadvantage of the prior art.

[0019] According to a broad aspect, a solid-solid phase change material (PCM) is disclosed as a patterned coating adapted to influence the tendency of the evaporation flux of the deposited material to be deposited thereon. The patterned coating is used to be disposed on the surface of a first layer of a lower layer in a laterally oriented first portion of an optoelectronic device, such that a deposited layer containing the deposited material can be deposited on a laterally oriented second portion, while the first portion may be substantially free of a sealing coating containing the deposited material.

[0020] In some non-limiting examples, solid-solid PCMs can exhibit solid-solid phase transitions in temperature ranges of about 0°C-200°C, 10°C-180°C, 15°C-140°C, 20°C-100°C, and 27°C-90°C.

[0021] In some non-limiting examples, solid-solid phase transitions can occur at atmospheric pressure.

[0022] In some non-limiting examples, solid-solid phase transitions can occur under reduced pressure.

[0023] In some non-limiting examples, the decompression may be no more than about 1 × 10⁻⁶. -7 Pa and 1×10 -6 One of Pa.

[0024] In some non-limiting examples, solid-solid PCMs can undergo solid-solid phase transitions when exposed to the evaporation flux of the deposited material.

[0025] In some non-limiting examples, the overall melting point of a solid-solid PCM can be at least the temperature range in which a solid-solid phase transition occurs.

[0026] In some non-limiting examples, solid-solid PCM can exhibit differential scanning calorimetry (DSC) thermograms containing at least two endothermic peaks in a single thermal cycle.

[0027] In some non-limiting examples, the DSC thermogram may include at least one exothermic peak.

[0028] In some non-limiting examples, the DSC thermogram may include a first endothermic peak, a second endothermic peak, and an exothermic peak, wherein the peak temperature of the first endothermic peak may not exceed the peak temperature of the second endothermic peak.

[0029] In some non-limiting examples, the peak temperature of the exothermic peak may be at least the peak temperature of the first endothermic peak.

[0030] In some non-limiting examples, the patterned coating may be in the solid phase during each of the first endothermic and exothermic peaks.

[0031] In some non-limiting examples, the peak temperature difference between the first endothermic peak and the second endothermic peak may be at least one of about 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, and 75°C.

[0032] In some non-limiting examples, the peak temperature difference between the first endothermic peak and the exothermic peak may be no more than one of about 60°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C and 15°C.

[0033] In some non-limiting examples, DSC thermograms can be measured at constant heating and cooling rates between approximately 5 °C / min and 20 °C / min.

[0034] In some non-limiting examples, DSC thermograms can be measured at constant heating and cooling rates of approximately 5 °C / min, 10 °C / min, 15 °C / min, and 20 °C / min.

[0035] In some non-limiting examples, a solid-solid PCM may include a core portion, a first ligand portion, and a second ligand portion, wherein the first ligand portion and the second ligand portion may each be bonded to the core portion.

[0036] In some non-limiting examples, each of the first and second ligand portions may independently comprise at least one of the following: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluoroheterocyclic alkyl group, unsubstituted fluoroheterocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group. Groups, substituted aryloxy groups, unsubstituted aryloxy groups, substituted fluoroaryloxy groups, unsubstituted fluoroaryloxy groups, substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, phosphazo groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups.

[0037] In some non-limiting examples, the first ligand moiety can be represented by the chemical formula (FCM-1): (FCM-1) in: t It can be an integer between 1 and 3; u It can be an integer between 5 and 12; and Z It can represent one of the following: H, D, and F.

[0038] In some non-limiting examples, the first ligand moiety can be represented by the chemical formula (FCM-2): (FCM-2) in: v It can be an integer between 1 and 3; w It can be an integer between 3 and 15; and Z It can represent one of the following: H, D, and F.

[0039] In some non-limiting examples, the number of F atoms in the first ligand portion and the second ligand portion may differ by no more than one of about 2, 4, 6, 8, 9, 11, 13, 15, 16, 18, 20, 24 and 48.

[0040] In some non-limiting examples, the core part can be the phosphazene part.

[0041] In some non-limiting examples, a solid-solid PCM may include: Multiple cyclophosphonitrile moieties, each cyclophosphonitrile moiety being bonded to at least one other cyclophosphonitrile moieties via at least one linker moiety; and Multiple cyclophosphine moiety functional groups are bonded to multiple cyclophosphine moiety functional groups, and at least one of the cyclophosphine moiety functional groups contains an F-containing moiety.

[0042] In some non-limiting examples, the plurality of cyclophosphonitrile portions may include a first cyclophosphonitrile portion and a second cyclophosphonitrile portion; wherein a first linker portion bonds the first cyclophosphonitrile portion to the second cyclophosphonitrile portion.

[0043] In some non-limiting examples, the molecular structure of solid-solid PCM can be represented by the chemical formula (LPH-1): (LPH-1) in: L c It can represent a linker portion, which includes at least one of the following: a single bond, C, CH, CH2, C R 1 C( R 1 2. CHF, CF2, N, NH, N R 1 S, O, ether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene, substituted heteroalkylene, substituted adamantane moiety, unsubstituted adamantane moiety, substituted diamond-like moiety and unsubstituted diamond-like moiety; R It can represent some functional groups of cyclophosphonitrile, each RIndependently comprising at least one of the following: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group. Substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups; m And n can each be an integer between 2 and 4; and Each R 1 It may independently be at least one of the following: hydrogen (H), deuterium (D), F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0044] In some non-limiting examples, the molecular structure of the compound may be represented by one of the chemical formulas (LPH-5) and (LPH-6): (LPH-5) (LPH-6) in: Each Ar It can independently represent the aromatic group; L B It can represent a bridging portion, which includes at least one of the following: single bond, C, CH, CH2, CH3, C R2 C( R 2 )2, CHF, CF2, CF3, CF2N, NH, N R 2 S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene and unsubstituted heteroalkylene; Each R f It may independently contain at least one of the following: C, F, CF2 moiety, CF2H moiety, CF3 moiety, SCF3 moiety, SF3 moiety, SF5 moiety, substituted fluoroaryl group, unsubstituted fluoroaryl group, branched fluoroalkyl group containing 2-15 C atoms, and non-branched fluoroalkyl group containing 2-15 C atoms; and Each R 2 It may independently be at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0045] In some non-limiting examples, the deposited material may be at least one of the following: metal, metal alloy, metal oxide, and metal fluoride.

[0046] In some non-limiting examples, the deposited material may include at least one of the following: potassium (K), sodium (Na), lithium (Li), barium (Ba), cesium (Cs), ytterbium (Yb), silver (Ag), gold (Au), copper (Cu), aluminum (Al), magnesium (Mg), zinc (Zn), cadmium (Cd), tin (Sn), nickel (Ni), yttrium (Y), Mg:Ag alloy, Yb:Ag alloy, Mg:Yb alloy, Ag:Mg:Yb alloy, and LiF.

[0047] According to a broad aspect, an optoelectronic device is disclosed, the optoelectronic device comprising: A patterned coating comprising a solid-solid PCM is disposed on the surface of a first layer of a lower layer in a laterally oriented first portion of the optoelectronic device; and A deposition layer containing deposited material is disposed on the second portion; The first part may have virtually no sealing coating of deposited material.

[0048] In some non-limiting examples, patterned coatings can be adapted to reduce the initial adhesion probability of the deposited material based on the evaporation flux.

[0049] In some non-limiting examples, solid-solid PCMs can undergo solid-solid phase transitions when exposed to the evaporation flux of the deposited material.

[0050] In some non-limiting examples, the device may also include an emission region comprising: substrate; First electrode and second electrode; and At least one semiconductive layer is disposed between the first electrode and the second electrode; The first electrode is disposed between the substrate and at least one semiconducting layer.

[0051] In some non-limiting examples, the first part may not include the lateral orientation of the launch area.

[0052] In some non-limiting examples, the second electrode may include at least a portion of the deposited layer as its layer.

[0053] In some non-limiting examples, the first part may include the lateral orientation of the launch area.

[0054] In some non-limiting examples, the device may further include an auxiliary electrode comprising a deposited layer as its layer.

[0055] In some non-limiting examples, the deposited material may be at least one of the following: metal, metal alloy, metal oxide, and metal fluoride.

[0056] In some non-limiting examples, the deposited material may include at least one of the following: potassium (K), sodium (Na), lithium (Li), barium (Ba), cesium (Cs), ytterbium (Yb), silver (Ag), gold (Au), copper (Cu), aluminum (Al), magnesium (Mg), zinc (Zn), cadmium (Cd), tin (Sn), nickel (Ni), yttrium (Y), Mg:Ag alloy, Yb:Ag alloy, Mg:Yb alloy, Ag:Mg:Yb alloy, and LiF. Detailed Implementation

[0057] Layered devices This disclosure relates generally to a layered semiconductor device 100, and more specifically to an optoelectronic device 200. The optoelectronic device 200 may generally encompass any device 100 that converts electrical signals into EM radiation in the form of photons and performs the reverse conversion. In some non-limiting examples, the optoelectronic device 200 may include an organic light-emitting diode (OLED).

[0058] Those skilled in the art will understand that while this disclosure relates to optoelectronic device 200, its principles can be applied, in some non-limiting examples, to any panel having multiple layers, including but not limited to at least one layer of conductive deposited material 531, which is included as a thin film, and in some non-limiting examples, electromagnetic (EM) signals can partially and completely pass through (including but not limited to) one of the multiple layers at a non-zero angle relative to the plane of at least one of these layers.

[0059] Now go to Figure 1 This figure may show a cross-sectional view of an example layered semiconductor device 100. In some non-limiting examples, such as Figure 2 As shown in more detail below, device 100 may include multiple layers deposited on substrate 10.

[0060] A lateral axis, designated as the X-axis, may be shown together with a longitudinal axis, designated as the Z-axis. A second lateral axis, designated as the Y-axis, may be shown substantially transverse to both the X-axis and the Z-axis. At least one of the lateral axes may define the lateral orientation of the device 100. A longitudinal axis may define the longitudinal orientation of the device 100.

[0061] The layer of device 100 may extend in a lateral orientation substantially parallel to the plane defined by the lateral axis. Those skilled in the art will understand that, in some non-limiting examples, Figure 1 The representation of a substantially flat surface shown may be an abstract concept for illustrative purposes. In some non-limiting examples, there may be localized substantially flat layers of varying thicknesses and sizes in the lateral extent of device 100, and in some non-limiting examples, at least one substantially non-existent layer separated by uneven transition regions (including lateral gaps and even interruptions).

[0062] Therefore, although for illustrative purposes, device 100 may be shown in its longitudinal orientation as a substantially layered structure of substantially parallel planar layers, such device 100 may locally exemplify different morphologies to define features, each of which may substantially exhibit the layered profile in the longitudinal orientation.

[0063] In some non-limiting examples, the lateral orientation of the exposed layer surface 11 of device 100 may include a first portion 101 and a second portion 102. In some non-limiting examples, the second portion 102 may include a portion of the exposed layer surface 11 of device 100 located outside the first portion 101. Figure 1 As shown, the layer of device 100 may include a substrate 10 and a patterned coating 110 disposed on at least a portion of the exposed layer surface 11 of the device in a laterally oriented direction. In some non-limiting examples, the patterned coating 110 may be confined in a first portion 101 in its lateral range, and the deposited layer 130 may be disposed as a sealing coating 140 on the exposed layer surface 11 of device 100 in a second portion 102 in its lateral orientation.

[0064] In some non-limiting examples, at least one particulate structure 150 may be disposed as a discontinuous layer 160 on the exposed surface 11 of the patterned coating 110. In some non-limiting examples, although not shown, at least one of the patterned coating 110, the deposited layer 130, and at least one particulate structure 150 may be deposited on a layer other than the substrate 10 (lower layer 710), including but not limited to an intermediary layer between the substrate 10 and at least one of the patterned coating 110, the deposited layer 130, and at least one particulate structure 150. In some non-limiting examples, the lower layer 710 may include at least one of an alignment layer and an organic support layer.

[0065] In some non-limiting examples, at least one of the patterned coating 110, the deposited layer 130, and at least one particulate structure 150 may be covered by at least one overlay 170.

[0066] In some non-limiting examples, this overlay 170 may include at least one of an encapsulation layer and an optical coating. Non-limiting examples of an encapsulation layer include a glass cover, barrier film, barrier adhesive, barrier coating, encapsulation layer, and thin-film encapsulation (TFE) layer provided to encapsulate device 100. Non-limiting examples of an optical coating include at least one of optical and structural coatings and at least one component thereof, including but not limited to polarizers, color filters, anti-reflective coatings, anti-glare coatings, cover glass, and optically clear adhesives (OCAs).

[0067] In some non-limiting examples, at least one of the substantially thin patterned coating 110 in the first portion 101 and the deposited layer 130 in the second portion 102 may provide a substantially flat surface on which the overcoat 170 may be deposited. In some non-limiting examples, providing such a substantially flat surface for coating the overcoat 170 may increase its adhesion to such a surface.

[0068] In some non-limiting examples, the optical coating can be used to modulate the optical properties of EM radiation transmitted, emitted, and absorbed by the device 100, including but not limited to plasmon modes. In some non-limiting examples, the optical coating can be used as at least one of an optical filter, a refractive index matching coating, an optical external coupling coating, a scattering layer, a diffraction grating, and portions thereof.

[0069] In some non-limiting examples, the optical coating can be used to modulate at least one optical microcavity effect in device 100 by adjusting, but not limited to, at least one of the total optical path length and its refractive index. At least one optical property of device 100 can be affected by adjusting at least one optical microcavity effect (including, but not limited to, output EM radiation) (including, but not limited to, at least one of its intensity's angular dependence and its wavelength shift). In some non-limiting examples, the optical coating may be a non-electric component, i.e., the optical coating may not be configured to conduct and transmit at least one of current during normal device operation.

[0070] In some non-limiting examples, the optical coating may be formed of any deposited material 531, and in some non-limiting examples, any mechanism for depositing the deposited layer 130 as described herein may be employed.

[0071] Patterning In some non-restrictive examples, see reference. Figure 1 In some non-limiting examples, the patterned coating 110 containing patterned material 411 (which may be NIC material in some non-limiting examples) may be disposed as a sealing coating 140 on the exposed layer surface 11 of the lower layer 710 (including but not limited to substrate 10) of device 100. In some non-limiting examples, the lateral extent is limited by selective deposition (including but not limited to the use of a shadow mask 415, such as but not limited to a fine metal mask (FMM), including but not limited to the first portion 101).

[0072] Therefore, in some non-limiting examples, in the second part 102 of device 100, the exposed surface 11 of the lower layer 710 of device 100 may be substantially without the closed coating 140 of the patterned coating 110.

[0073] Patterned coating The patterned coating 110 may include a patterned material 411. In some non-limiting examples, the patterned material 411 may include a NIC material. In some non-limiting examples, the patterned coating 110 may include a sealing coating 140 of the patterned material 411.

[0074] The patterned coating 110 provides an exposed layer surface 11 having a substantially low tendency for deposition of the deposited material 531 to be deposited on the exposed layer surface after the surface has been exposed to the evaporation flux 532 of the deposited material 531. This includes, but is not limited to, a substantially low initial adhesion probability (in some non-limiting examples, under the conditions confirmed in the dual QCM technique described by Walker et al.). In some non-limiting examples, this substantially low tendency may be significantly less than the tendency for deposition of the deposited material 531 to be deposited on the exposed layer surface 11 of the lower layer 710 of the device 100 (on which the patterned coating 110 has been deposited).

[0075] Due to the properties of at least one of the patterned coating 110 and the patterned material 411 for the deposition of the deposited material 531 (including, but not limited to, a low initial adhesion probability) (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100), the exposed surface 11 of the first portion 101 of the patterned coating 110 may be substantially free of the sealing coating 140 of the deposited material 531.

[0076] In some non-limiting examples, exposing device 100 to the evaporation flux 532 of deposited material 531 may result in the formation of a sealing coating 140 of deposited material 531 in the second portion 102, wherein the exposed surface 11 of the lower layer 710 may be substantially free of the sealing coating 140 of patterned coating 110.

[0077] In some non-limiting examples, the patterned coating 110 may be a NIC that provides high deposition (patterning) contrast relative to subsequent deposition of the deposited material 531, such that the deposited material 531 does not tend to deposit as a closed coating 140 in some non-limiting examples, where the patterned coating 110 has already been deposited.

[0078] In some non-limiting examples, there may be scenarios where a patterned coating 110 is required to induce the formation of at least one discontinuous layer 160 of particulate structure 150 when the patterned coating 110 in the first portion 101 is subjected to an evaporation flux 532 of the deposited material 531. In at least some applications, the properties of the patterned coating 110 may allow a closed coating 140 of the deposited material 531 to be formed in a second portion 102, which may be substantially free of the patterned coating 110, while a discontinuous layer 160 of at least one particulate structure 150 having only at least one characteristic may be formed on the patterned coating 110 in the first portion 101.

[0079] For the purpose of simplifying the discussion, in this disclosure, the patterned coating 110 may be designated as a particulate structure patterned coating 110, with regard to the deposition of the patterned coating 110 to serve as a substrate for depositing at least one particulate structure 150 thereon. p In contrast, with regard to the fact that the patterned coating 110 is deposited in the first portion 101 to substantially prevent the formation of the sealing coating 140 of the deposited layer 130 in such the first portion 101, thereby confining the deposition of the sealing coating 140 of the deposited layer 130 to the second portion 102, this patterned coating 110 can be designated as a non-particulate patterned coating 110. n Those skilled in the art will understand that, in some non-limiting examples, the patterned coating 110 can serve as a granular structure patterned coating 110. p Non-particulate patterned coating 110 n Both.

[0080] In some non-limiting examples, the following scenario may exist: a discontinuous layer 160 of at least one particulate structure 150 of the deposited material 531 needs to be formed in the second part 102 (in some non-limiting examples, the deposited material may be one of metals and metal alloys (metal / alloy), including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg), while depositing a closed coating 140 of the deposited material 531 having a thickness not limited to one of about 100 nm, 50 nm, 25 nm and 15 nm. In some non-limiting examples, the amount of deposited material 531 deposited in the first portion 101 as a discontinuous layer 160 of at least one particulate structure 150 may correspond to one of about 1%-50%, 2-25%, 5-20%, and 7-10% of the amount of deposited material 531 deposited in the second portion 102 as a sealing coating 140. As a non-limiting example, the sealing coating may correspond to a thickness not exceeding one of at least one of about 100 nm, 75 nm, 50 nm, 25 nm, and 15 nm.

[0081] In some non-limiting examples, the patterned coating 110 may be patterned, the pattern being defined by at least one area of ​​a closed coating 140 in which there may be substantially no patterned coating 110.

[0082] In some non-limiting examples, the at least one region may separate the patterned coating 110 into a plurality of discrete segments. In some non-limiting examples, the plurality of discrete segments of the patterned coating 110 may be physically spaced apart from each other in their lateral orientation. In some non-limiting examples, the plurality of discrete segments of the patterned coating 110 may be arranged in a regular structure (including, but not limited to, an array (matrix)) such that, in some non-limiting examples, the discrete segments of the patterned coating 110 may repeat a pattern construction.

[0083] In some non-limiting examples, at least one of the plurality of discrete segments of the patterned coating 110 may each correspond to an emission region 210. In some non-limiting examples, the aperture ratio of the emission region 410 may be no more than one of about 50%, 40%, 30%, and 20%.

[0084] In some non-limiting examples, the patterned coating 110 may be formed as a single monolithic coating.

[0085] Properties of patterned coatings / materials solid-solid transition In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may comprise a solid-solid phase change material (PCM).

[0086] In this disclosure, "phase change material" can refer to a material that undergoes a phase change with a change in at least one of temperature and pressure. Based on the material states before and after the phase change, PCMs can be classified into four categories: solid-solid PCMs, solid-liquid PCMs, solid-gas PCMs, and liquid-gas PCMs. In this disclosure, "solid-solid PCM" can refer to a PCM that can undergo a phase change between one of a crystalline solid phase and a semi-crystalline solid phase and another of an amorphous solid phase, a semi-crystalline solid phase, and a crystalline solid phase, wherein at least one of temperature and pressure changes. Solid-solid PCMs can exist in the solid phase in more than one molecular arrangement (polymorphism).

[0087] In some non-limiting examples, the solid-solid phase transition can occur at an elevated temperature, which in some non-limiting examples may be at least about 25°C. In some non-limiting examples, the solid-solid phase transition can occur within a temperature range of about 0°C-200°C, 10°C-180°C, 15°C-140°C, 20°C-100°C, and 27°C-90°C. In some non-limiting examples, the solid-solid phase transition can occur at atmospheric pressure, which in some non-limiting examples may be about 1 atm. In some non-limiting examples, the solid-solid phase transition can occur under reduced pressure, which in some non-limiting examples may be no more than about 1 × 10⁻⁶. -7 Pa and 1×10 -6Under ultra-high vacuum conditions of Pa. In some non-limiting examples, the solid-solid PCM can undergo a solid-solid phase transition when exposed to the evaporation flux 532 of the deposited material 531. In some non-limiting examples, the solid-solid phase transition can occur at a temperature achievable by exposing the patterned coating 110 to the evaporation flux 532 of the deposited material 531 under ultra-high vacuum conditions.

[0088] In some non-limiting examples, the overall melting point of the solid-solid PCM can be at least within the temperature range where the solid-solid phase transition occurs. In some non-limiting examples, the solid-solid PCM can exhibit a solid-solid phase transition within a temperature range of about 0°C-100°C, 10°C-95°C, 15°C-90°C, 20-85°C, and 25-80°C, and can exhibit an overall melting point at least at the temperature of the solid-solid phase transition. In some non-limiting examples, the overall melting point can be within a temperature range of about 65°C-200°C, 70°C-180°C, 75°C-160°C, 75°C-140°C, 75°C-130°C, and 75°C-110°C.

[0089] Without being bound by any particular theory, it may be assumed that, in at least some non-limiting examples, a solid-solid phase transition can correspond to a transformation between different polymorphs. In some non-limiting examples, a solid-solid phase transition can correspond to a transformation from a metastable polymorph to a stable polymorph.

[0090] In some non-limiting examples, the overall melting point of a solid-solid PCM may correspond to the melting point of a steady-state polymorph.

[0091] In some non-limiting examples, the solid-solid PCM can exhibit a differential scanning calorimetry (DSC) thermogram, which in some non-limiting examples contains at least two endothermic peaks between about 0°C and 200°C in a single thermal cycle. In some non-limiting examples, the DSC thermogram may also contain at least one exothermic peak in a single thermal cycle. In some non-limiting examples, the solid-solid PCM can exhibit a DSC thermogram including a first endothermic peak, a second endothermic peak, and an exothermic peak. In some non-limiting examples, the peak temperature of the first endothermic peak may not exceed the peak temperature of the second endothermic peak. In some non-limiting examples, the peak temperature of the exothermic peak may be at least the peak temperature of the first endothermic peak. In some non-limiting examples, the peak temperature of the exothermic peak may be at least the peak temperature of the first endothermic peak and not exceed the peak temperature of the second endothermic peak. In some non-limiting examples, the second endothermic peak may correspond to a melting event. In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may be in the solid phase during the first endothermic and exothermic peaks.

[0092] In this disclosure, the "peak temperature" of either the endothermic or exothermic peak in a DSC thermogram can refer to the temperature point at which the maximum deviation of the peak curve from the baseline can be measured.

[0093] In some non-limiting examples, the first endothermic peak and the exothermic peak may correspond to a solid-solid phase transition. In some non-limiting examples, the first endothermic peak may correspond to the melting of a metastable polymorph, and the exothermic peak may correspond to the crystallization and formation of a stable polymorph. In some non-limiting examples, the solid-solid phase transition may begin and complete within a relatively narrow temperature range. In some non-limiting examples, the beginning and completion of the solid-solid phase transition may correspond to the peak temperatures of the first endothermic peak and the exothermic peak, respectively. In some non-limiting examples, the difference between the peak temperatures of the first endothermic peak and the exothermic peak may not exceed one of about 60°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C, and 15°C.

[0094] In some non-limiting examples, the peak temperature difference between the first endothermic peak and the second endothermic peak may be at least one of about 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, and 75°C.

[0095] In some non-limiting examples, DSC thermograms can be measured at a constant heating and cooling rate between approximately 5 °C / min and 20 °C / min. In some non-limiting examples, DSC thermograms can be measured at a constant heating and cooling rate of approximately 5 °C / min, 10 °C / min, 15 °C / min, and 20 °C / min. In some non-limiting examples, DSC thermograms can be measured during a second cycle of heating and cooling, during which, in some non-limiting examples, the material can be heated and cooled a second time after the first cycle of heating and cooling. In some non-limiting examples, the temperatures of endothermic and exothermic peaks can refer to the temperatures between the peak's onset and end temperatures.

[0096] In some non-limiting examples, solid-solid PCM may have a critical surface tension of no more than one of about 12 dynes / cm, 16 dynes / cm, 20 dynes / cm, 25 dynes / cm and 30 dynes / cm.

[0097] In some non-limiting examples, using at least one of patterned coating 110 and patterned material 411 can provide at least one of the following: the patterned coating 110 containing patterned material 411 experiences a substantially low tendency to crystallize; substantially high deposition contrast; and the patterned coating 110 containing patterned material 411 experiences a substantially low tendency to cohesive failure (including, but not limited to, delamination).

[0098] It has now been found that the presence of solid-solid PCM in at least one of the patterned coating 110 and the patterned material 411 can promote the selective deposition of the deposited material 531. Without wishing to be bound by any particular theory, it can be assumed that the presence of solid-solid PCM in at least one of the patterned coating 110 and the patterned material 411 may be applicable in scenarios requiring a substantially low propensity for the deposited material 531 to deposit on the exposed surface 11 of the patterned coating 110. In some non-limiting examples, the solid-solid PCM can reconfigure its molecular arrangement via a solid-solid transition upon exposure to an evaporation flux 532 of the deposited material 531. In some non-limiting examples, this can disrupt the nucleation of the deposited material 531, thereby reducing the amount of deposited material 531 present on the surface of at least one of the patterned coating 110 and the patterned material 411. A solid-solid phase transition occurring at a temperature not exceeding the overall melting point of the solid-solid PCM can allow for the reconfiguration of its molecular arrangement without the solid-solid PCM becoming liquid. In some applications where solid-solid PCM is provided in localized areas to form a patterned coating 110, allowing this transition to occur below the overall melting point can help keep the deposited pattern of the solid-solid PCM essentially undisturbed.

[0099] composition Mixed ligand compounds In some non-limiting examples, a mixed ligand compound may be provided, comprising a core moiety, a first ligand moiety, and a second ligand moiety, the first ligand moiety and the second ligand moiety being respectively bonded to the core moiety.

[0100] In some non-limiting examples, a layered semiconductor device 100 comprising a mixed ligand compound may be provided. In some non-limiting examples, the mixed ligand compound may comprise a core portion, a first ligand portion, and a second ligand portion. In some non-limiting examples, the first ligand portion and the second ligand portion may each be bonded to the core portion.

[0101] In some non-limiting examples, a layered semiconductor device 100 comprising a composition containing multiple compounds may be provided. In some non-limiting examples, at least one of the multiple compounds may be a mixed ligand compound. In some non-limiting examples, each of the multiple compounds may contain a core portion and multiple ligand portions bonded to the core portion. In some non-limiting examples, the multiple compounds may contain at least one common ligand portion. In some non-limiting examples, at least one of the multiple compounds may contain at least one of multiple first ligand portions and second ligand portions. In some non-limiting examples, each of the multiple compounds may contain a core portion, a first ligand portion, and a second ligand portion. In some non-limiting examples, the first ligand portion and the second ligand portion may each be bonded to the core portion.

[0102] In some non-limiting examples, compositions comprising multiple compounds may be provided. In some non-limiting examples, each of the multiple compounds may comprise a cyclophosphamide core moiety and at least one ligand moiety bonded to the cyclophosphamide core moiety. In some non-limiting examples, the multiple compounds may comprise at least one common ligand moiety.

[0103] ligand portion As used herein, the term "ligand moiety" can be understood to generally refer to at least one of the first and second ligand moieties in a mixed ligand compound.

[0104] In some non-limiting examples, the ligand moiety may independently include at least one of the following: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted Substituted fluoroaryloxy groups, substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups.

[0105] In some non-limiting examples, at least one ligand portion, including but not limited to at least one of a first ligand portion and a second ligand portion, may be an F-containing portion. In some non-limiting examples, the first ligand portion may be an F-containing portion, and the second ligand portion may be substantially F-free. In some non-limiting examples, both the first ligand portion and the second ligand portion may be F-containing portions.

[0106] In some non-limiting examples, at least one ligand moiety may comprise a main chain and at least one F atom attached thereto. In some non-limiting examples, the main chain may be a C-containing main chain. In some non-limiting examples, the main chain may comprise heteroatoms, including but not limited to silicon (Si).

[0107] In some non-limiting examples, the ligand moiety may include: a linker group. R B terminal groups R T and arranged in the connecting group R B With terminal groups R T intermediate groups between R D .

[0108] In some non-limiting examples, the ligand moiety can be represented by chemical formula (E-1): (E-1) in: Indicates the attachment sites within a mixed ligand compound. R B Indicates a linking group. R D Indicates an intermediate group, and R T This indicates a terminal group.

[0109] In some non-limiting examples, the ligand moiety may contain branched groups. R E In some non-limiting examples, this ligand moiety may comprise one of the chemical formulas (E-2)-(E-4):

[0110] In some non-limiting examples, the ligand portion may contain at least one saturated bond. In some non-limiting examples, the bonds in the ligand portion may be substantially saturated bonds, such that the ligand portion may be a saturated portion. In some non-limiting examples, at least one portion of the ligand portion, including but not limited to… R B , R D , R T and R E At least one of the ligand portions can be saturated. In some non-limiting examples, the ligand portion can contain unsaturated bonds. In some non-limiting examples, the bonds in the ligand portion can be substantially unsaturated, such that the ligand portion can be unsaturated. In some non-limiting examples, at least one portion of the ligand portion, including but not limited to... R B , R D , R T and R E At least one of them can be an unsaturated part.

[0111] In some non-limiting examples, the ligand moiety may contain no more than one of about 4, 3, 2, and 1 ether units. Without wishing to be bound by any particular theory, it may be assumed that the presence of multiple ether units within a single ligand moiety (which can lower the melting point of the compound) may have reduced applicability in some cases.

[0112] In some non-limiting examples, the linking group R B This can correspond to the terminal portion of the ligand portion, which may be close to the core portion and may contain atoms that attach the ligand portion to the core portion. In some non-limiting examples, R B It may contain one of the following: O, N, S, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted arylene, unsubstituted arylene, substituted heteroarylene, and unsubstituted heteroarylene. In some non-limiting examples, R B It can contain P=N And one of the phosphazene group. In some non-limiting examples, R B It may contain at least one of fluoromethylene and difluoromethylene. In some non-limiting examples, R B It can be selected from: -O- and -O-CH2-.

[0113] In some non-restrictive examples, the middle part R D This typically corresponds to the arrangement of the ligand moiety between the linker group and the terminal group. In some non-limiting examples, R D It may contain: O, ether, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted aryl, unsubstituted aryl, substituted phenyl, unsubstituted phenyl, substituted biphenyl, unsubstituted biphenyl, substituted binaphthalene, unsubstituted binaphthalene, substituted heteroaryl, and unsubstituted heteroaryl. In some non-limiting examples, R D It may contain F. In some non-restrictive examples, R D It may contain fluorinated alkylene units. In some non-limiting examples, R D It may contain at least one of CF2 units, CFH units, and CH2 units. In some non-limiting examples, R D It may comprise multiple CF2 units bonded together to form a fluoroalkylene group and a portion thereof. In some non-limiting examples, R D It may contain at least one CH2 unit and at least one CF2 unit. In some non-limiting examples,R D It may contain ether units. In some non-limiting examples, R D It can contain saturated bonds. In some non-restrictive examples, R D It can contain virtually no unsaturated bonds. In some non-restrictive examples, R D It can contain unsaturated bonds. In some non-restrictive examples, R D It may contain no more than one of approximately 25, 15, 13, 12, and 10 C atoms.

[0114] In some non-limiting examples, the terminal group R T This can correspond to the terminal portion of the ligand moiety, including but not limited to the distal portion of the ligand moiety relative to the core moiety. In some non-limiting examples, the terminal portion can correspond to the terminal portion of the ligand moiety opposite to the linker group. In some non-limiting examples where the ligand moiety includes a cyclic intermediate group, R T It may include portions of ring atoms attached to intermediate groups. In some non-limiting examples, R T It may contain F. In some non-restrictive examples, R T It may contain hydrogen (H). In some non-limiting examples, R T It may contain Si. In some non-limiting examples, R T It may contain at least one of the following: substituted alkyl, unsubstituted alkyl, branched fluoroalkyl, non-branched fluoroalkyl, substituted heterocyclic alkyl, unsubstituted heterocyclic alkyl, substituted alkoxy, unsubstituted alkoxy, branched siloxy, non-branched siloxy, branched fluoroalkoxy, non-branched fluoroalkoxy, fluoroaryl, polyfluorosulfide, and fluorocycloalkyl. In some non-limiting examples, R T It can be at least one of the following: F, H, CF2H, CF3, OCF3, CF2CF3, CF2CF2H, CH2CF2H, and CH2CF3. In some non-limiting examples, R T It may contain no more than one of approximately 8, 6, 5, 3, 2, and 1 C atoms.

[0115] branched groups R EThis typically corresponds to a portion of the ligand moiety, from which multiple branches of the main chain can extend. In some non-limiting examples, R E It can serve as a branching point for the main chain. In some non-limiting examples, branching can be achieved by bonding at least three other groups forming the ligand moiety to... R E It will happen. In some non-restricted examples, R E It allows for various configurations (positions) of the ligand portion and can bond to at least one of the following: R B , R D and R T In some non-restrictive examples, the bond is to R E At least three parts can be one of the following: R B , R D and R T ; R B , R B and R B ; R D , R D and R D ;as well as R T , R T and R T In some non-restrictive examples, R E It can be bonded to at least one of the following: multiple R D and multiple R T The ligand portion comprises multiple components: R D and R T At least one of them. In some non-restrictive examples, R EIt may contain at least one of the following: O, N, S, amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted aryl, unsubstituted aryl, substituted heteroalkylene, and unsubstituted heteroalkylene. In some non-limiting examples, R E It may contain no more than one of about 8, 6, 5, 3, 2, and 1 C atoms. In some non-limiting examples, R E It can be essentially free of carbon atoms.

[0116] In some non-limiting examples, the chemical formula (E-1) R B It can be represented by one of the chemical formulas (EA-1)-(EA-6):

[0117] In the chemical formula (EA-2), R H It is one of the following: H, deuterated (D), CF3, and containing R D and R T The second ligand portion of both.

[0118] In some non-limiting examples, the terminal group R T Intermediate groups that can be bonded to the second ligand moiety R D .

[0119] In some non-limiting examples, the second ligand moiety can be represented by chemical formula (ED-1): (ED-1) In some non-limiting examples, the second ligand portion of chemical formula (ED-1) R D and R T In terms of molecular structure, it can interact with the ligand portion of chemical formula (E-1). R D and R T The same. In some non-limiting examples, the second ligand portion of chemical formula (ED-1) is... R D and R TAt least one of them may be different from those of the ligand moiety in chemical formula (E-1). In some non-limiting examples, the ligand moiety in relation to chemical formula (E-1) provided herein is... R D and R T The description of various non-limiting examples can be applied to the second ligand part of chemical formula (ED-1). R D and R T .

[0120] In some non-limiting examples, the chemical formula (E-1) R D It can be represented by the chemical formula (EB-1): (EB-1) in: X Each time it appears, it is independently one of H, D, F and CF3; a It is an integer between 0 and 6; and b It is an integer between 0 and 12; and a and b The sum of them is at least 1.

[0121] In some non-restrictive examples, a and b The sum can not exceed one of approximately 15, 12, 10, and 9.

[0122] In some non-limiting examples, the chemical formula (EB-1) R D It may include at least one of the chemical formulas (EB-10) to (EB-21):

[0123] In each of the chemical formulas (EB-10)-(EB-21): b It is an integer between 4 and 9.

[0124] In some non-restrictive examples, a It can be an integer between 1 and 4. b It can be an integer between 4 and 9, and a and b The sum can be an integer between 6 and 13.

[0125] In some non-restrictive examples,a It can be an integer between 2 and 4. b It can be an integer between 5 and 9, and a and b The sum can be an integer between 7 and 13.

[0126] In some non-limiting examples, the chemical formula (E-1) R T It can be represented by one of the chemical formulas (EC-1) to (EC-11):

[0127] In some non-limiting examples, the ligand moiety may comprise a C-containing backbone in a closed-ring configuration. In some non-limiting examples, to form a cyclic structure, it may comprise at least one of the following: fluorocycloalkyl (including but not limited to perfluorocyclopentyl and perfluorocyclohexyl), aryl (including but not limited to phenyl and naphthyl), and biaryl (including but not limited to biphenyl and binatyl).

[0128] In some non-limiting examples, the ligand moiety may comprise a C-containing main chain in a closed cage configuration, including but not limited to adamantyl groups.

[0129] In some non-limiting examples, the ligand moiety may include an F-containing moiety, including but not limited to fluoroalkyl and fluoroaryl moieties.

[0130] Those skilled in the art will understand that, in some non-limiting examples, R B , R D , R E and R T Various descriptions can be applied to some non-limiting examples of the ligand moiety, including but not limited to those with chemical formulas (E-2) to (E-4). In some non-limiting examples, the ligand moiety comprises a plurality of given groups, including but not limited to at least one of the following: a plurality of R B Multiple R D Multiple R E and multiple R T Each of these groups can be selected independently of the others.

[0131] In some non-limiting examples, the compound may contain a ligand moiety selected from one of the chemical formulas (LF-1) to (LF-314):

[0132] In each of the chemical formulas (LF-1)-(LF-314): This indicates the attachment point to the core part.

[0133] First ligand portion and second ligand portion In some non-limiting examples, a mixed ligand compound may contain at least one of a first ligand moiety and a second ligand moiety.

[0134] In some non-limiting examples, each of the first and second ligand portions may include a low surface tension portion. In some non-limiting examples, each of the first and second ligand portions may include an F-containing portion.

[0135] In some non-limiting examples, the number of second ligand moieties in a compound may not exceed the number of first ligand moieties therein.

[0136] In some non-limiting examples, the compound may contain multiple first ligand moieties and a single second ligand moieties.

[0137] In some non-limiting examples, at least one of the first ligand portion and the second ligand portion may be an F-containing portion. In some non-limiting examples, one of the first ligand portion and the second ligand portion may be an F-containing portion, while the other of the first ligand portion and the second ligand portion may be a substantially F-free portion, including but not limited to one of the following: H, Cl, hydroxyl portion, alkyl portion, cycloalkyl portion, alkoxy portion, aryloxy portion, aryl portion, heteroaryloxy portion, alkylsilyl portion, alkylsiloxy portion, amino portion, amine portion, alkylamine portion, arylamine portion, cyano portion, azophosphatidyl group portion, siloxane portion, silane portion, and organosilicon portion.

[0138] In some non-limiting examples, the first ligand portion and the second ligand portion may be F-containing portions. In some non-limiting examples, the first ligand portion and the second ligand portion may each contain fluorocarbon units. In some non-limiting examples, the first ligand portion and the second ligand portion may each contain different numbers of fluorocarbon units.

[0139] In some non-limiting examples, one of the first ligand portion and the second ligand portion may contain a fluorocarbon unit, which may not be present in the other of the second ligand portion and the first ligand portion. In some non-limiting examples, the terminal group of the first ligand portion may be different from the terminal group of the second ligand portion. In some non-limiting examples, the terminal group of the first ligand portion may contain CF3, and the terminal group of the second ligand portion may contain CF2H.

[0140] In some non-limiting examples, the second ligand moiety may be substantially free of fluorinated sp. 2 C atom. In some non-limiting examples, the second ligand moiety may be substantially fluorine-free.

[0141] In some non-limiting examples, the mixed ligand compound may comprise: a first ligand portion comprising a fluoroalkyl moiety, and a second ligand portion comprising at least one of the following: a substituted alkyl moiety, an unsubstituted alkyl moiety, a substituted fluoroalkyl moiety, an unsubstituted fluoroalkyl moiety, a substituted fluoroaryl moiety, an unsubstituted fluoroaryl moiety, a substituted aryl moiety, an unsubstituted aryl moiety, a substituted polycyclic aromatic moiety, an unsubstituted polycyclic aromatic moiety, a substituted binaphthyl moiety, an unsubstituted binaphthyl moiety, a substituted biphenyl moiety, an unsubstituted biphenyl moiety, a substituted adamantyl alkyl moiety, and an unsubstituted adamantyl alkyl moiety.

[0142] In some non-limiting examples, the second ligand moiety may have an F content not exceeding that of the first ligand moiety. In some non-limiting examples, the second ligand moiety may contain no more F atoms than the first ligand moiety. In some non-limiting examples, the second ligand moiety may have a degree of fluorination not exceeding that of the first ligand moiety. In some non-limiting examples, the second ligand moiety may contain no more fluorocarbon units than the first ligand moiety. In some non-limiting examples, the second ligand moiety may contain no more carbon atoms than the first ligand moiety.

[0143] In some non-limiting examples, the first ligand portion may comprise a first fluoroalkyl portion, and the second ligand portion may comprise a second fluoroalkyl portion. In some non-limiting examples, the first fluoroalkyl portion may comprise a different number of carbon atoms than the second fluoroalkyl portion. In some non-limiting examples, the number of carbon atoms in the first and second ligand portions may differ by one of 1, 2, 3, and 4. In some non-limiting examples, the number of carbon atoms in the first and second ligand portions may differ by approximately one of 2-7, 2-6, 2-5, and 3-5.

[0144] In some non-limiting examples, the first ligand portion and the second ligand portion may contain different numbers of F atoms. In some non-limiting examples, the number of F atoms in the first ligand portion and the second ligand portion may differ by no more than one of about 2, 4, 6, 8, 9, 11, 13, 15, 16, 18, 20, 24, and 48. In some non-limiting examples, the first ligand portion and the second ligand portion may contain the same number of fluorine atoms.

[0145] In some non-limiting examples, the first ligand portion and the second ligand portion may contain different numbers of CF2 portions. In some non-limiting examples, the number of CF2 portions in the first ligand portion and the second ligand portion may differ by no more than one of about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 22. In some non-limiting examples, the first ligand portion and the second ligand portion may contain the same number of CF2 portions.

[0146] In some non-limiting examples, the first ligand portion and the second ligand portion may contain different numbers of C atoms. In some non-limiting examples, the number of C atoms in the first ligand portion and the second ligand portion may differ by no more than one of about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, and 22. In some non-limiting examples, the first ligand portion and the second ligand portion may contain the same number of C atoms.

[0147] In some non-limiting examples, the molar weight attributable to the first ligand moiety may differ from the molar weight attributable to the second ligand moiety. In some non-limiting examples, the molar weight attributable to the first ligand moiety and the second ligand moiety may differ by at least one of about 14 g / mol, 30 g / mol, 45 g / mol, 50 g / mol, 75 g / mol, 100 g / mol, 150 g / mol, and 200 g / mol. In some non-limiting examples, the molar weight attributable to the first ligand moiety and the second ligand moiety may differ by no more than one of about 20 g / mol, 40 g / mol, 50 g / mol, 100 g / mol, 150 g / mol, 200 g / mol, 300 g / mol, 400 g / mol, 500 g / mol, 600 g / mol, 700 g / mol, 800 g / mol, 900 g / mol, and 1,100 g / mol. In some non-limiting examples, the molar weight attributable to the second ligand portion may not exceed the molar weight attributable to the first ligand portion.

[0148] As used herein, the term “F content” for a ligand moiety can be understood to generally correspond to the amount of F contained in the ligand moiety, which in some non-limiting examples is measured by at least one of the atomic percentage, weight percentage, and volume percentage of the ligand moiety.

[0149] In some non-limiting examples, the first ligand portion and the second ligand portion may have different degrees of fluorination. In some non-limiting examples, the degree of fluorination can be measured by the F content of each ligand portion. In some non-limiting examples, the degree of fluorination can be measured by the F / C quotient, which can represent the ratio of the number of F atoms to the number of C atoms present in the ligand portion. In some non-limiting examples, the degree of fluorination of the first ligand portion and the second ligand portion may differ by no more than one of about 0.03, 0.09, 0.14, 0.18, 0.22, 0.28, 0.36, 0.56, 0.71, 0.78, 0.82, 0.99, 1.56, 1.64, 1.78, 1.85, 1.98, 2.34, 3.56, 3.64, and 3.70.

[0150] Core part In some non-limiting examples, the core portion of the mixed ligand compound may include at least one of the following: an aromatic portion (including but not limited to aromatic hydrocarbon portions, polycyclic aromatic hydrocarbon portions, and heterocyclic aromatic portions (including but not limited to those containing polycyclic structures)); a cyclic hydrocarbon portion; a heterocyclic portion; a straight-chain portion (including but not limited to those containing at least one of the following: a straight-chain portion containing at least one heteroatom and a straight-chain hydrocarbon portion); a branched portion (including but not limited to those containing at least one of the following: a branched portion containing at least one heteroatom and a branched hydrocarbon portion); a crosslinked portion (including but not limited to those containing at least one of the following: a crosslinked portion containing at least one heteroatom and a hydrocarbon crosslinked portion); a portion having a cage-like structure; an oligomerized portion; and a polymeric portion.

[0151] In some non-limiting examples, the core portion may include a heterocyclic portion, including but not limited to a heterocyclic portion containing at least one N atom. In some non-limiting examples, the heterocyclic portion may include a triazole portion. In some non-limiting examples, the core portion may include metal atoms, including but not limited to transition atoms and post-transition atoms. In some non-limiting examples, the metal atoms may include at least one of the following: aluminum (Al) atoms, copper (Cu) atoms, iridium (Ir) atoms, and platinum (Pt) atoms. In some non-limiting examples, the core portion may include at least one of the following: N atoms, O atoms, and phosphorus (P) atoms. In some non-limiting examples, the core portion may include a cyclic hydrocarbon portion, which in some non-limiting examples may be aromatic. In some non-limiting examples, the core moiety may include at least one of the following: substituted alkyl, unsubstituted alkyl, cycloalkynyl (including but not limited to those containing between 1 and 7 C atoms), alkenyl, alkynyl, aryl (including but not limited to one of phenyl, naphthyl, thiophene, and indolyl), arylalkyl, heterocyclic moiety (including but not limited to cyclic amines, including but not limited to one of morpholino, piperidinyl, and pyrrolidinyl), cyclic ether moiety (including but not limited to one of tetrahydrofuran and tetrahydropyran), heteroaryl (including but not limited to one of pyrrole, furan, thiophene, imidazole, oxazole, thiazole, triazole, pyrazole, pyridine, pyrazine, pyrimidine, polycyclic heteroaryl moiety, and dibenzylphenylthio), fluorene moiety, and silyl.

[0152] In some non-limiting examples, the core portion may include at least one of the chemical formulas (CR-1) to (CR-31):

[0153] In each of the chemical formulas (CR-1) to (CR-31): XIndependently representing either C or a heteroatom, which in some non-limiting examples may serve as a core component. R The bonding sites of groups (including but not limited to ligand moieties); and Q Independently representing either C or a heteroatom, which in some non-limiting examples may serve as a core component. R The bonding site of a group (including but not limited to the ligand portion).

[0154] In some non-restrictive examples, X It can be a heteroatom selected from O and N, including but not limited to substituted and unsubstituted heteroatoms.

[0155] In some non-restrictive examples, Q It can be a heteroatom selected from N, S, O and Si, including but not limited to substituted and unsubstituted heteroatoms.

[0156] In some non-limiting examples, the core portion may include a cyclophosphonitrile portion. In some non-limiting examples, the cyclophosphonitrile portion may be one of a cyclic triphosphonitrile portion and a cyclic tetraphosphonitrile portion.

[0157] In some non-limiting examples, the mixed ligand compounds may include those represented by any of the chemical formulas (C-1) to (C-6):

[0158] Explanation of chemical formulas (C-1) to (C-6) R Non-limiting examples of bonding arrangements between the groups and the core moiety. In each of the chemical formulas (C-1) to (C-6), R Each group can independently represent a ligand moiety each time it appears. In some non-limiting examples, R At least one of the groups can represent the first ligand moiety, and the others R At least one of the groups can represent the second ligand moiety.

[0159] In some non-limiting examples, the core moiety may include a silsesquioxane moiety. In some non-limiting examples, the mixed ligand compound may contain a core moiety represented by one of the following: (RSiO 1.5 8. (RSiO) 1.5 ) 10 and (RSiO) 1.5 ) 12 In some non-limiting examples, the molecular structure of such mixed ligand compounds can be represented by one of the chemical formulas (PO-1) to (PO-3):

[0160] In some non-limiting examples, the chemical formulas (PO-1) to (PO-3) R Groups can be present in each (RSiO) 1.5 The unit is selected independently when it appears. In some non-restricted examples, two different units are included. R Chemical formula of the group (RSiO) 1.5 ) v Compounds can also be made from chemical formulas (R... 1 SiO 1.5 ) w (R 2 SiO 1.5 ) x It means that among them w and x The sum equals v In some non-limiting examples, this compound and compounds containing a variety of different... R Other compounds of the group can be derived from the general chemical formula (RSiO). 1.5 ) v Coverage. In some non-restrictive examples, R At least one of the groups can represent the first ligand moiety, and the others R At least one of the groups can represent the second ligand moiety.

[0161] In some non-limiting examples, the core portion may include a heterocyclic portion. In some non-limiting examples, the heterocyclic portion may comprise a monocyclic structure, including but not limited to those represented by any of the chemical formulas (MC-1) to (MC-23):

[0162] In each of the chemical formulas (MC-1) to (MC-23), R A and R B Each occurrence can independently represent the ligand portion. R In some non-restrictive examples, R At least one of the groups can represent the first ligand moiety, and the others R At least one of the groups can represent the second ligand moiety.

[0163] In some non-limiting examples, the heterocyclic portion may comprise a fused polycyclic structure comprising multiple fused ring structures such that adjacent ring structures may share multiple adjacent atoms.

[0164] In some non-limiting examples, the heteroaryl moiety may comprise a polycyclic structure, including but not limited to those represented by any of the chemical formulas (PC-1) to (PC-27):

[0165] In each of the chemical formulas (PC-1) to (PC-27), R A and R B Each occurrence can independently represent the ligand portion. R In some non-restrictive examples, R At least one of the groups can represent the first ligand moiety, and the others R At least one of the groups can represent the second ligand moiety.

[0166] In some non-limiting examples, the core portion may include one of the following: an aryl and heteroaryl moiety represented by any of the chemical formulas (AN-1) to (AN-66):

[0167] It should be understood that, when denoteing a core portion, either the aryl or heteroaryl moiety according to chemical formulas (AN-1) to (AN-66) can be bonded to another portion of the molecule at any site of either the C or the heteroatom, which can be used to form such a bond, including but not limited to either the first ligand moiety or the second ligand moiety. In some non-limiting examples, in formulas containing an NH group, the H can be replaced by a “bond” with another portion of the molecule, such that, in some non-limiting examples, an NC bond can be formed between the N atom of the heteroaryl group and the C atom of another portion of the molecule.

[0168] Phosphazene core and multiple ligand moieties In some non-limiting examples, the mixed ligand compound may comprise a phosphazene moiety as a core portion and multiple ligand moieties bonded thereto. In some non-limiting examples, the core portion may be a cyclophosphazene moiety.

[0169] In some non-limiting examples, the molecular structure of the mixed ligand compound may be represented by any of formulas (XAA-1) to (XAA-5) and (XAB-1) to (XAB-7):

[0170] In each of the aforementioned chemical formulas (XAA-1) to (XAA-5) and (XAB-1) to (XAB-7), R 1 Indicates the first ligand portion. R 2 This refers to the second ligand portion.

[0171] In some non-limiting examples, the first ligand moiety can be represented by the chemical formula (FCM-1): (FCM-1) in: t It is an integer between 1 and 3; u It is an integer between 5 and 12; and Z It represents one of the following: H, D, and F.

[0172] In some non-limiting examples, the first ligand moiety can be represented by the chemical formula (FCM-2): (FCM-2) in: v It is an integer between 1 and 3; w It is an integer between 3 and 15; and Z It represents one of the following: H, D, and F.

[0173] In some non-restrictive examples, w It can not exceed u In some non-restrictive examples, w and u The difference between them can be one of 2, 3, 4, 5, and 6.

[0174] In some non-restrictive examples, t and v They can represent the same value. In some non-restricted examples, t and v Both can be 1.

[0175] In some non-limiting examples, the chemical formula (FCM-1) Z and chemical formula (FCM-2) Z They can represent the same atom. In some non-limiting examples, the first ligand portion... Z and the second ligand portion Z It can represent one of the following: H and D. In some non-limiting examples, the chemical formula (FCM-1)Z It can represent one of the following: H and D, and the chemical formula (FCM-2) Z It can represent F.

[0176] In some non-limiting examples, this paper summarizes compounds based on one of the chemical formulas (XAA-5) and (XAB-2), wherein R 1 Represented by the chemical formula (FCM-1), and R 2 It is represented by the chemical formula (FCM-2).

[0177]

[0178] Compositions containing multiple mixed ligand compounds In some non-limiting examples, a composition comprising multiple compounds may be provided. In some non-limiting examples, each of the multiple compounds may comprise a core portion and at least one ligand portion bonded to the core portion. In some non-limiting examples, at least one of the multiple compounds may be a mixed ligand compound. In some non-limiting examples, the multiple compounds may comprise at least one common ligand portion. In some non-limiting examples, the composition may comprise a mixed ligand compound containing at least one first ligand portion and at least one second ligand portion, and a second compound containing at least one first ligand portion of the mixed ligand compound. In some non-limiting examples, such a composition may be provided as a formulation for forming thin films for various applications, including semiconductors, displays, and optical coatings. In some non-limiting examples, such a composition may be part of a layered semiconductor device 100.

[0179] In some non-limiting examples, at least one compound of the composition may include a ligand moiety that is not present in another compound of the composition.

[0180] In some non-limiting examples, the number of first ligand portions of the second compound may be equal to the sum of the numbers of first and second ligand portions of the mixed ligand compound. In some non-limiting examples, the number of second ligand portions in at least one of the mixed ligand compound and the second compound may not exceed the number of first ligand portions therein. In some non-limiting examples, the ligand portions of the mixed ligand compound may consist substantially of first and second ligand portions. In some non-limiting examples, the ligand portions of the second compound may consist substantially of first ligand portions.

[0181] In some non-limiting examples, the mixed ligand compound may comprise a second ligand moiety, and the remaining ligand moiety may consist substantially of a first ligand moiety. In some non-limiting examples, the majority of the composition may consist substantially of the mixed ligand compound, and the remainder of the composition may consist substantially of the second compound. In some non-limiting examples, the mixed ligand compound may constitute at least one of about 50%, 60%, 70%, 75%, 80%, 85%, 90%, 95%, 98%, and 99% of the composition.

[0182] In some non-limiting examples, the mixed ligand compound may comprise a first ligand portion to a second ligand portion in a ratio of approximately 1:1 based on the number of ligand portions constituted by such a compound. In some non-limiting examples, the composition may comprise additional mixed ligand compounds, including but not limited to a second compound, comprising a first ligand portion to a second ligand portion in a ratio of at least approximately 1:2, 2:1, 1:5, and 5:1 based on the number of ligand portions constituted by such compounds. In some non-limiting examples, the percentage of the mixed ligand compound in the composition may be a percentage of at least any other compound in the composition.

[0183] In some non-limiting examples, each of the multiple compounds in the composition may comprise a first ligand portion and a second ligand portion. In some non-limiting examples, each of the multiple compounds may be a mixed ligand compound. In some non-limiting examples, the multiple compounds in the composition may comprise at least one first ligand portion and at least one second ligand portion. In some non-limiting examples, the multiple compounds in the composition may have different ratios in the number of first ligand portions to the number of second ligand portions. In some non-limiting examples, the composition may comprise an additional compound comprising one of the first ligand portion and the second ligand portion.

[0184] In some non-limiting examples, the core moiety of each of the multiple compounds may be substantially identical in chemical structure. In some non-limiting examples, the core moiety may be a cyclophosphonitrile moiety, including but not limited to one of a cyclic triphosphonitrile moiety and a cyclic tetraphosphonitrile moiety.

[0185] In some non-limiting examples, compositions comprising multiple compounds having substantially similar chemical structures (including, but not limited to, compounds comprising at least one of a common core portion, a first ligand portion, and a second ligand portion) may tend to exhibit a set of corresponding properties that differ from a set of properties of any single compound in the composition. Without wishing to be bound by any particular theory, it can be assumed that the composition may be suitable for providing a patterned coating 110 in at least some cases. In some non-limiting examples, it has been found that a patterned coating 110 comprising a composition may tend to exhibit a melting point at least that of a first compound and an initial adhesion probability not exceeding that of a second compound, the composition comprising: a first compound having a low melting point and a low initial adhesion probability, and a second compound having a high melting point and a high initial adhesion probability. In some non-limiting examples, such compositions may provide the ability to tune at least one property of the patterned coating 110 by, but not limited to, adjusting the individual amounts of the compounds in the composition.

[0186] In some non-limiting examples, the molar weight of the compounds in the composition may vary by no more than one of about 4,300 g / mol, 4,000 g / mol, 3,700 g / mol, 3,500 g / mol, 3,100 g / mol, 2,800 g / mol, 2,400 g / mol, 2,200 g / mol, 1,800 g / mol, 1,400 g / mol, 1,200 g / mol, 900 g / mol, 800 g / mol, 700 g / mol, 600 g / mol, 500 g / mol, 400 g / mol, 300 g / mol, 200 g / mol, 100 g / mol, 40 g / mol, and 20 g / mol.

[0187] Without wishing to be bound by any particular theory, it may be assumed that substantially small differences in the molar weights of the compounds in the composition may be applicable in at least some cases. In some non-limiting examples, compositions comprising multiple compounds may be applicable in some cases, wherein the molar weights of these compounds differ by no more than one of about 1,000 g / mol, 900 g / mol, 800 g / mol, 700 g / mol, 600 g / mol, 500 g / mol, 400 g / mol, 300 g / mol, and 200 g / mol. In some non-limiting examples, compounds with substantially small molar weight differences may tend to exhibit similar sublimation properties, which in some non-limiting examples may correspond to similar sublimation temperatures and partial pressures exhibited by the compounds at a given temperature. In some non-limiting examples, wherein the composition sublimates to provide a patterned coating 110, the compounds in the composition, including but not limited to compounds with substantially small molar weight differences, may facilitate the provision of a substantially uniform patterned coating 110, even over extended deposition periods.

[0188] Those skilled in the art will understand that polydispersity is roughly analogous to the polydispersity index (PDI), which is the quotient of the weight-average molar weight and the number-average molar weight of the composition according to equation (1): (1) in: Indicates the polydispersity index; M w Indicates weight-average molar weight; and M n This indicates the number-average molar weight.

[0189] In some non-limiting examples, the polydispersity of the composition may be no more than one of about 2.08, 2.06, 2.04, 2.02, and 2.00. In some non-limiting examples, the polydispersity of the composition may be at least one of about 1.04, 1.03, 1.02, 1.01, and 1.00.

[0190] In some non-limiting examples, the compounds in the composition may exhibit substantially the same vapor pressure.

[0191] Linked cyclophosphonitrile compounds In some non-limiting examples, the layered semiconductor device 100 may include a connected cyclophosphonitrile compound comprising: a plurality of cyclophosphonitrile moieties, each cyclophosphonitrile moiety being bonded to at least one other cyclophosphonitrile moieties via at least one connecting base moieties; and a plurality of cyclophosphonitrile moiety functional groups bonded to the plurality of cyclophosphonitrile moieties, at least one of the cyclophosphonitrile moiety functional groups comprising a fluorine (F) moieties. In some non-limiting examples, the plurality of cyclophosphonitrile moieties may include a first cyclophosphonitrile moieties and a second cyclophosphonitrile moieties; wherein a first connecting base moieties bonds the first cyclophosphonitrile moieties to the second cyclophosphonitrile moieties. In some non-limiting examples, the chemical structures of the plurality of cyclophosphonitrile moieties may be either the same as or different from each other. In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may include such a connected cyclophosphonitrile compound.

[0192] In some non-limiting examples, at least one phosphorus (P) atom of one of the plurality of cyclophosphinitrogen moieties may be bonded to the linking base moieties.

[0193] In some non-limiting examples, the P atom of at least one of the plurality of cyclophosphonitrile moieties may be (including but not limited to) substituted by at least one cyclophosphonitrile moiety functional group. In some non-limiting examples, at least one of the plurality of cyclophosphonitrile moiety functional groups may be a low surface tension moiety.

[0194] In some non-limiting examples, the linked cyclophosphonitrile compound may comprise at least three cyclophosphonitrile moieties. In some non-limiting examples, the linked cyclophosphonitrile compound may comprise a first cyclophosphonitrile moiety, a second cyclophosphonitrile moiety, and a third cyclophosphonitrile moiety.

[0195] In some non-limiting examples, the third cyclophosphamide moiety can be bonded to at least one of the first cyclophosphamide moiety and the second cyclophosphamide moiety via at least one of the first linker moiety and at least one additional linker moiety. In some non-limiting examples, the third cyclophosphamide moiety can... The second linker portion is bonded to one of the first cyclophosphonitrile portion and the second cyclophosphonitrile portion, and the second linker portion can be either structurally the same as or different from each other. In some non-limiting examples, the third cyclophosphonitrile portion can be bonded to one of the first cyclophosphonitrile portion and the second cyclophosphonitrile portion via the first linker portion.

[0196] In some non-limiting examples, the molecular structure of the linked cyclophosphamide compound may be represented by any of the chemical formulas (LP-1)-(LP-17):

[0197] in: L c Independently represent the connecting base portion; and R Independently represents the functional groups of cyclophosphonitriles.

[0198] In some non-limiting examples, sp in the linked cyclophosphinitron compound 2 The total number of carbon (C) atoms may not exceed one of about 30, 24, 18, 15, 12, 10, and 6. In some non-limiting examples, the sp atoms in any one of the plurality of cyclophosphamide moiety functional groups... 2 The total number of C atoms may not exceed the number of sp atoms in at least one linker group. 2 The total number of C atoms.

[0199] In some non-limiting examples, sp in the linked cyclophosphinitron compound 2 The total number of C atoms can be at least about 1. In linked cyclophosphonitrile compounds, sp... 2 In some non-limiting examples, the total number of C atoms is between approximately 1 and 6, representing the total number of fluorinated C atoms in the compound / the sp atoms in the linked cyclophosphinitrogen compound. 2 The quotient of the total number of C atoms can be at least one of about 7, 8, 10, 12, 13, 14, 15, 16, 17, 18, and 20. In linked cyclophosphinitriles, sp... 2 In some non-limiting examples where the total number of C atoms is at least about 7, the ratio of the total number of fluorinated C atoms in the compound to the total number of sp atoms in the compound is given. 2 The quotient of the total number of C atoms can be at least one of approximately 1, 2, 4, 6, 8, 10, 12, 13, 14, 15, 16, 17, 18, and 20.

[0200] Without wishing to be bound by any particular theory, it may be assumed, in some non-limiting examples, that the total number of fluorinated C atoms in the compound / the number of sp atoms in the compound is... 2 Cyclophosphazene compounds with a specific quotient of the total number of C atoms can be suitable as patterning materials in some scenarios 411.

[0201] In some non-restrictive examples, sp is included. 2 The C-atom portion can exhibit substantially high surface tension, thereby promoting the nucleation and growth of the deposited material 531 on the surface, which may have reduced applicability in some applications. In some non-limiting examples, it can be assumed that sp... 2 C atoms, especially in this type of sp 2C atoms are in a scenario where they are positioned, oriented, and otherwise configured such that they are substantially exposed to the evaporation flux 532 of the deposited material 531 directed to the surface of the patterned coating 110, and can serve as nucleation sites to which the deposited material 531 can condense.

[0202] Without being bound by any particular theory, it can be assumed that the presence of low surface tension portions (including, but not limited to, portions containing at least one fluorinated C atom, including, but not limited to, fluoroalkyl portions) can reduce the surface tension caused by the presence of sp... 2 The presence of the high surface tension portion of C atoms makes it possible for the nucleation and growth of the deposited material 531.

[0203] In some non-limiting examples, the presence of cyclophosphonitrile moiety functional groups containing low surface tension portions (including, but not limited to, portions containing at least one fluorinated C atom, including, but not limited to, fluoroalkyl portions) in the linked cyclophosphonitrile compounds may be significantly reduced, including, but not limited to, preventing the high surface tension portions that may be provided as part of the linking base portion in some non-limiting examples from being exposed to the evaporation flux 532 of the deposited material 531, thereby enhancing the patterning capability of the patterned coating 110 containing such linked cyclophosphonitrile compounds, including, but not limited to, the ability to inhibit the deposition of the deposited material 531 thereon.

[0204] In some non-limiting examples, the total number of fluorinated C atoms in the compound / the number of sp atoms in the compound 2 The quotient of the total number of C atoms can be approximately between 1-15, 2-12, and 3-9.

[0205] In some non-limiting examples, the quotient of the total number of F atoms in the linked cyclophosphonitrile compound of at least one patterned material 411 / the total number of C atoms in the linked cyclophosphonitrile compound (including but not limited to) may be at least one of about 1.51, 1.52, 1.54, 1.56, 1.58, 1.60, 1.61, 1.62, 1.63, 1.64, 1.65, 1.66, 1.67, 1.68, 1.69, 1.70, 1.72, 1.75, 1.77 and 1.81.

[0206] In some non-limiting examples, the presence of a low surface tension portion in the compound may be related to the quotient of the total number of F atoms in the linked cyclophosphonitrile compound / the total number of C atoms in the linked cyclophosphonitrile compound. In some non-limiting examples, linked cyclophosphonitrile compounds having substantially high F / C quotients of at least about one of 1.51, 1.52, 1.54, 1.56, 1.58, 1.60, 1.61, 1.62, 1.63, 1.64, 1.65, 1.66, 1.67, 1.68, 1.69, 1.70, 1.72, 1.75, 1.77, and 1.81 may be suitable as patterning materials 411 in some scenarios.

[0207] In some non-limiting examples, the quotient of the total number of F atoms in the plurality of cyclophosphamide partial functional groups / the total number of C atoms in the plurality of cyclophosphamide partial functional groups may be at least one of about 1.55, 1.58, 1.62, 1.65, 1.68, 1.70, 1.73, 1.77 and 1.81.

[0208] In some non-limiting examples, the presence of low surface tension portions in the cyclophosphamide moiety may be related to the quotient of the total number of F atoms in the plurality of cyclophosphamide moiety functional groups / the total number of C atoms in the plurality of cyclophosphamide moiety functional groups. In some non-limiting examples, cyclophosphamide compounds having substantially high F / C quotients of at least one of the plurality of cyclophosphamide moiety functional groups of at least about 1.55, 1.58, 1.62, 1.65, 1.68, 1.70, 1.73, 1.77 and 1.81 in some non-limiting examples may be suitable as patterning materials 411 in some scenarios.

[0209] In some non-limiting examples, the molecular structure of the linked cyclophosphonitrile compound can be represented by the chemical formula (LPH-1): (LPH-1) in: L c This represents a linker portion, which includes at least one of the following: a single bond, C, CH, CH2, C R 1 C( R 1 2. CHF, CF2, Nitrogen (N), NH, N R 1Sulfur (S), Oxygen (O), Ether, Substituted Amine, Unsubstituted Amine, Substituted Alkylene, Unsubstituted Alkylene, Substituted Fluorinated Alkylene, Unsubstituted Fluorinated Alkylene, Substituted Arylidene, Unsubstituted Arylidene, Substituted Fluorinated Arylidene, Unsubstituted Fluorinated Arylidene, Substituted Heteroarylene, Unsubstituted Heteroarylene, Substituted Cycloalkylene, Unsubstituted Cycloalkylene, Substituted Heteroalkylene, Unsubstituted Heteroalkylene, Substituted Heteroalkylene, Substituted Adamantane Moiety, Unsubstituted Adamantane Moiety, Substituted Diamond-like Moiety and Unsubstituted Diamond-like Moiety; R This indicates that each of the functional groups in cyclophosphonitrile is... R Independently comprising at least one of the following: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group. Substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups; m and n Each is an integer between 2 and 4; and Each R 1 Independently, it is at least one of the following: hydrogen (H), deuterium (D), F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0210] In some non-restrictive examples, m and n The absolute value of the difference between them can be either 0 or 1. In some unrestricted examples, m and n Each can be an integer between 2 and 3.

[0211] In some non-restrictive examples, n and m At least one of them can be 2, such that the corresponding cyclophosphinitrogen moiety can be a cyclotriphosphinitrogen moiety. In some non-limiting examples, n and m At least one of them can be 3, such that the corresponding cyclophosphonitrile moiety can be a cyclotetraphosphonitrile moiety.

[0212] Without being bound by any particular theory, it may be assumed that the linked cyclophosphonitrile compound represented by chemical formula (LPH-1) is suitable as at least one of the patterning material 411 for patterning coating 110 and promoting selective deposition of deposition material 531. In some non-limiting examples, it has been found that using such patterning material 411 can provide at least one of the following: substantially high deposition contrast; substantially low tendency of patterned coating 110 containing patterning material 411 to undergo crystallization; and substantially low tendency of patterned coating 110 containing patterning material 411 to undergo cohesive failure (including but not limited to delamination).

[0213] In some non-limiting examples, the quotient of the total number of F atoms in the linked cyclophosphonitrile compound / the total number of silicon (Si) atoms may be no more than one of about 5, 4 and 3.

[0214] In some non-limiting examples, the linked phosphazene compound may exhibit substantially no light absorption in at least one of the visible and NIR spectra, including but not limited to wavelengths between about 350 nm and 1,400 nm.

[0215] In some non-limiting examples, the linked cyclophosphonitrile compound may have an optical band gap of at least one of about 3.4 eV, 3.5 eV, 4.1 eV, 5.0 eV and 6.2 eV.

[0216] In some non-limiting examples, linked cyclophosphonitrile compounds can exhibit essentially no photoluminescence in the wavelength range of about 380 nm to 700 nm.

[0217] In some non-limiting examples, the linked cyclophosphonitrile compounds may be solid at room temperature and pressure.

[0218] In some non-limiting examples, the melting point of the linked cyclophosphonitrile compound may not exceed its sublimation temperature.

[0219] In some non-limiting examples, the melting point of the linked cyclophosphonitrile compound may be at least one of about 70°C, 80°C, 85°C, 90°C, 100°C, 110°C and 120°C.

[0220] In some non-limiting examples, the melting point of the linked cyclophosphonitrile compound may be no more than one of about 350°C, 330°C, 300°C, 280°C, 250°C, 230°C and 210°C.

[0221] In some non-limiting examples, the sublimation temperature of the linked cyclophosphonitrile compound may be at least one of about 110°C, 130°C, 150°C, 160°C, 170°C, 180°C and 200°C.

[0222] In some non-limiting examples, the melting point of the linked cyclophosphonitrile compound may be at least one of about 70°C, 80°C, 85°C, 90°C, 100°C, 110°C and 120°C, and the sublimation temperature of the compound may be between about 110°C and 300°C.

[0223] Connecting base portion, L c In some non-restrictive examples, the connection base portion L c It may include at least one of annular and acyclic portions.

[0224] In some non-restrictive examples, the connection base portion L c It can form a chain structure with the first cyclic phosphazene moiety and the second cyclic phosphazene moiety.

[0225] In some non-restrictive examples, the connection base portion L c It can form a cyclic structure with the P atom of at least one of the first and second cyclic phosphazene moieties.

[0226] In some non-restrictive examples, the connection base portion L c It may contain at least one of the following: single bond, C, CH, CH2, C R 1 C( R 1 2. CHF, CF2, N, NH, N R 1S, O, ether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene, substituted heteroalkylene, substituted adamantane moiety, unsubstituted adamantane moiety, substituted diamond-like moiety and unsubstituted diamond-like moiety; each R 1 Independently, it may be at least one of the following: H, D, F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group. In some non-limiting examples, the amine may be at least one of secondary and tertiary amines. In some non-limiting examples, the aryl group may be C5-C. 30 Aromaticyl group. In some non-limiting examples, the heteroaryl group may be C4-C. 30 Heteroaryl. In some non-limiting examples, the cycloalkylene group may be C3-C. 30 Cycloalkylene.

[0227] In some non-limiting examples where the linker portion contains a heteroatom, the heteroatom may act as a cyclophosphamide moiety and at least one to be bonded. R L The bonding site of at least one of the groups, wherein a heteroatom can be used to form such a bond.

[0228] In some non-limiting examples, the linker may have a molar mass of at least one of about 12 g / mol, 13 g / mol, 15 g / mol, 16 g / mol, 20 g / mol, 25 g / mol, 30 g / mol, 40 g / mol, 50 g / mol, 70 g / mol, 100 g / mol, 120 g / mol, 130 g / mol, and 150 g / mol.

[0229] In some non-limiting examples, each linker may have a molar mass not exceeding one of about 500 g / mol, 450 g / mol, 400 g / mol, 350 g / mol, 300 g / mol, 250 g / mol, and 200 g / mol.

[0230] In some non-limiting examples, the percentage of the molar mass of the linked cyclophosphamide compound attributable to at least one linker moiety may be at least one of about 0.2%, 0.3%, 0.5%, 0.7%, 1.1%, 1.5%, 1.7%, 1.8%, 2.0%, 2.3%, 2.5%, 2.7%, 2.9%, 3.1%, 3.3%, 3.5%, 3.7%, 4.0%, and 4.5%.

[0231] In some non-limiting examples, the percentage of the molar mass of the linked cyclophosphonitrile compound attributable to at least one linker moiety may be no more than one of about 5.5%, 5.8%, 6.0%, 6.8%, 7.0%, 8.5%, 8.7%, 9.0%, 9.2%, 9.5%, 9.7%, 10.0%, and 12.0%.

[0232] Connecting base portion including ring-shaped portion In some non-restrictive examples, the connection base portion L c It may contain at least one annular portion.

[0233] In some non-limiting examples, the cyclic portion may be connected to at least one of the plurality of cyclophosphinitrogen portions in one of the following ways, including but not limited to a first cyclophosphinitrogen portion and a second cyclophosphinitrogen portion: directly and indirectly. In some non-limiting examples, the ring atom of at least one cyclic portion may be directly connected to at least one P atom of at least one cyclophosphinitrogen portion of the plurality of cyclophosphinitrogen portions. In some non-limiting examples, the ring atom of at least one cyclic portion may be connected to at least one P atom of at least one cyclophosphinitrogen portion of the plurality of cyclophosphinitrogen portions via a spacer base portion.

[0234] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-1): (LK-1) in: L Cy Indicates the ring-shaped portion; Each L s Independently represent the spacer base portion; and Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0235] In some non-limiting examples, the connection base portion may include at least two annular portions and at least one bridging portion. In some non-limiting examples, the connection base portion may include a first annular portion, a second annular portion, and a bridging portion bonded to the first annular portion and the second annular portion.

[0236] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-2): (LK-2) in: Each L Cy Independently representing the ring-shaped portion; Each L s Independently represent the spacer base portion; L B Indicates the bridge connection; and Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0237] In some non-limiting examples, the connection base portion may include at least three ring portions. In some non-limiting examples, the connection base portion may include a first ring portion, a second ring portion, a third ring portion, and a bridging portion bonded to the first ring portion, the second ring portion, and the third ring portion.

[0238] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-3): (LK-3) in: Each L Cy Independently representing the ring-shaped portion; Each L s Independently represent the spacer base portion; L B Indicates the bridge connection; and Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0239] In some non-limiting examples, the connection base portion may contain multiple bridging portions. Within the connection base portion, there exist... N In some non-limiting examples of the annular portion, the number of bridging portions can be from 1 to ( N Between -1). In some non-limiting examples, the connection base portion may include a first annular portion, a second annular portion, a third annular portion, a first bridging portion bonded to the first annular portion and the second annular portion, and a second bridging portion bonded to the second annular portion and the third annular portion.

[0240] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-4): (LK-4) in: Each L Cy Independently representing the ring-shaped portion; Each L s Independently represent the spacer base portion; Each L B Independently represent the bridge connection; and Each Independently represents the attachment point with the cyclophosphonitrile moiety.

[0241] Spacer base portion, L s In some non-restrictive examples, the spacer base portion L s This can correspond to a portion of the connecting base portion disposed between the annular portion and the cyclophosphamide portion. In some non-limiting examples, the spacer base portion... L s It can bond to one of the P atoms of the cyclophosphonitrile moiety and one of the C atoms and heteroatoms of the cyclic moiety. In some non-limiting examples, the total number of spacer base moieties may not exceed the total number of cyclophosphonitrile moieties in the linked cyclophosphonitrile compound.

[0242] In some non-limiting examples, the spacer group may include at least one of the following: single bond, O, S, N, C, ether, thioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted aryl, unsubstituted aryl, substituted heteroaryl, and unsubstituted heteroaryl.

[0243] In some non-limiting examples, the spacer portion may include O. In some non-limiting examples, the linker portion may be represented by one of the chemical formulas (LK-5) and (LK-6): (LK-5) (LK-6) in: Each L Cy Independently representing the ring-shaped portion; L B Indicates the bridge connection; and Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0244] Ring-shaped part, L Cy In some non-limiting examples, the ring-shaped portion L Cy It may independently contain at least one of the following: substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkyl, unsubstituted cycloalkyl, substituted heteroalkyl and unsubstituted heteroalkyl.

[0245] In some non-limiting examples, at least one of the arylene and fluoroarylene may contain 5-30 sp. 2 C atom. In some non-limiting examples, the heteroaryl group may contain 4-30 sp atoms. 2 C atoms. In some non-limiting examples, cycloalkylene groups may contain 3-6 C atoms.

[0246] In some non-limiting examples, the cycloalkylene group may include at least one of the following: cyclopropylene, cyclopentylene, and cyclohexylene.

[0247] In some non-limiting examples, the heteroaryl group can be derived by replacing at least one ring C atom of the aryl group with a corresponding number of heteroatoms. In some non-limiting examples, at least one such heteroatom may be independently selected from one of N, O, and S.

[0248] In some non-limiting examples, at least one ring atom of the cyclic moiety may be independently attached to at least one substituent group, including but not limited to at least one of the following: H; D; F; Cl; alkyl groups, including but not limited to C1-C6 alkyl groups; fluoroalkyl groups; fluoromethyl groups; difluoromethyl groups; trifluoromethyl groups; fluoroethyl groups; polyfluoroethyl groups; cycloalkyl groups, including but not limited to C3-C6 cycloalkyl groups; alkoxy groups, including but not limited to C1-C6 alkoxy groups; haloalkoxy groups; fluoroalkoxy groups; difluoromethoxy groups; trifluoromethoxy groups; aryl groups; heteroaryl groups; fluoroaryl groups; polyfluoroaryl groups; 4-fluorophenyl groups; 3,4,5-trifluorophenyl groups; 4-(trifluoromethoxy)phenyl groups; thioalkyl groups; fluoroalkylthioalkyl groups; and trifluoromethylthioalkyl groups. In some non-limiting examples, the substituent group may include F.

[0249] In some non-limiting examples, the cyclic portion may include one of the chemical formulas (LR-1)-(LR-65):

[0250] In each of the chemical formulas (LR-1)–(LR-65): Each Independently represents the attachment point to at least one of the cyclophosphonitrile moiety, the spacer group moiety, and the bridging moiety.

[0251] u Integers between 0 and 7; v Integers between 0 and 4; w Integers between 0 and 6; Q C represents R 4 R 5 N R 4 S, O and Si R 4 R 5 At least one of them, Y C represents R 4 N and Si R 4 at least one of them, and R 2 , R 3 , R 4 , R 5 Each of the following can be independently represented as at least one of the following: H; D; F; Cl; bromine (Br); alkyl group, including but not limited to C1-C6 alkyl group; fluoroalkyl group; fluoromethyl group, difluoromethyl group, trifluoromethyl group; fluoroethyl group; polyfluoroethyl group; cycloalkyl group, including but not limited to C3-C6 cycloalkyl group; alkoxy group, including but not limited to C1-C6 alkoxy group; haloalkoxy group; fluoroalkoxy group; difluoromethoxy group, trifluoromethoxy group, aryl group; haloaryl group; heteroaryl group; fluoroaryl group; polyfluoroaryl group; 4-fluorophenyl group; 3,4,5-trifluorophenyl group; 4-(trifluoromethoxy)phenyl group; nitro group; nitrile group; phosphine oxide group; diphenylphosphine oxide group; pentafluorothioalkyl group; fluoroalkylthioalkyl group; and trifluoromethylthioalkyl group.

[0252] Fang ethnic group In some non-limiting examples, the ring-shaped portion L Cy It may contain aromatic portions. In some non-limiting examples, the cyclic portion... L Cy It could be part of the Fang ethnic group.

[0253] The connecting base portion contains two ring-shaped parts. Cy 1 and Cy In some non-restrictive examples of 2, Cy 1 and Cy At least one of 2 can be an aromatic part. In some non-restrictive examples, Cy 1 and Cy 2. Both can be aromatic components. In some non-restrictive examples, Cy 1 and Cy One of 2 may be an aromatic moiety, and the other may be a non-aromatic cyclic moiety, including but not limited to: substituted cycloalkyl moiety, unsubstituted cycloalkyl moiety, substituted fluorocycloalkyl moiety, unsubstituted fluorocycloalkyl moiety, substituted heterocycloalkyl moiety, unsubstituted heterocycloalkyl moiety, substituted fluoroheterocycloalkyl moiety, and unsubstituted fluoroheterocycloalkyl moiety.

[0254] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-7): (LK-7) in: Each Ar Independently representing the aromatic group; L B Indicates the bridge connection; and Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0255] The connecting base contains three ring-shaped parts. Cy 1. Cy 2 and Cy In some non-restrictive examples of 3, Cy 1. Cy 2 and Cy At least one of the components in 3 can be an aromatic moiety, while the remaining cyclic moiety components can each be a non-aromatic cyclic moiety. In some non-limiting examples, Cy 1. Cy 2 and Cy At least two of the components in 3 can be aromatic portions, while the remaining cyclic portions can be non-aromatic cyclic portions. In some non-limiting examples, Cy 1. Cy 2 and Cy 3 may be entirely aromatic. In some non-limiting examples, the non-aromatic cyclic moiety may be one of the following: cycloalkyl moiety, fluorocycloalkyl moiety, heterocycloalkyl moiety, and fluoroheterocycloalkyl moiety.

[0256] In some non-limiting examples, the linker portion may be represented by the chemical formula (LK-8): (LK-8) in: Each Ar Independently representing the aromatic group; Each L B Independently represent the bridge connection; and Each This indicates the attachment point to one of the multiple cyclophosphinitrogen moieties.

[0257] In some non-limiting examples, the aromatic moiety may be a monocyclic aromatic moiety. In some non-limiting examples, the aromatic moiety may be a polycyclic aromatic moiety, including but not limited to bicyclic and tricyclic aromatic moiety. In some non-limiting examples, the aromatic moiety may be an aromatic hydrocarbon moiety. In some non-limiting examples, the aromatic moiety may be a heterocyclic aromatic moiety, in which at least one C ring atom of the aromatic moiety has been replaced by a corresponding number of heteroatoms (including but not limited to at least one of O, N, and S). In some non-limiting examples, the aromatic moiety may be one of a substituted phenyl moiety and an unsubstituted phenyl moiety.

[0258] In some non-limiting examples, the aromatic moiety may include at least one of 6-20 nucleotide aromatic moiety, 6-15 nucleotide aromatic moiety, and 6-9 nucleotide aromatic moiety. In some non-limiting examples, the aromatic moiety may contain 6-30 C atoms. In some non-limiting examples, the aromatic moiety may contain no more than about 15, 12, 11, 10, and 6 sp atoms. 2 One of the C atoms.

[0259] In some non-limiting examples, the aromatic moiety may comprise a six-membered ring structure, including but not limited to phenyl. In some non-limiting examples, at least one spacer portion (including but not limited to O) may be attached to a ring atom of the aromatic moiety and may be located in one of the ortho, meta, or para positions relative to a bridging portion attached to another ring atom of the aromatic moiety. In some non-limiting examples, at least one spacer portion (including but not limited to O) may be located in the para position relative to a bridging portion.

[0260] In some non-limiting examples, the aromatic moiety may contain a structure represented by one of the chemical formulas (AR-1)-(AR-34):

[0261] In each of the chemical formulas (AR-1)-(AR-34), at least one ring atom may be attached to one of the cyclophosphonitrile moiety, the spacer moiety, and another aromatic moiety. In some non-limiting examples, at least one ring atom of the remaining ring atoms may be attached to a substituent. R’ In some non-restrictive examples, R’ It may contain at least one of the following: H, D, F, Cl, alkyl group, alkenyl group, alkynyl group, fluoroalkyl group, fluoromethyl group, difluoromethyl group, trifluoromethyl group, fluoroethyl group, polyfluoroethyl group, cycloalkyl group, fluorocycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, difluoromethoxy group, trifluoromethoxy group, aryl group, heteroaryl group, fluoroaryl group, polyfluoroaryl group, 4-fluorophenyl group, 3,4,5-trifluorophenyl group, 4-(trifluoromethoxy)phenyl group, sulfonyl group, fluoroalkylthioalkyl group, trifluoromethylthioalkyl group, silanoxy group, thioether group, carbonyl group, nitro group, nitrile group, phosphine oxide group, and diphenylphosphine oxide group.

[0262] In some non-limiting examples, the linker portion containing the aromatic moiety may comprise a structure represented by at least one of the chemical formulas (LM-1)-(LM-106):

[0263] In each of the chemical formulas (LM-1) to (LM-106): This indicates the attachment point to one of the cyclophosphonitrile moiety, spacer group moiety, cyclic moiety, and bridging moiety. R 6Independently representing at least one of the following: S; O; carbonyl group; sulfonyl group; substituted phosphine oxide group; unsubstituted phosphine oxide group; substituted alkyl group, including but not limited to substituted C1-C6 alkyl group; unsubstituted alkyl group, including but not limited to unsubstituted C1-C6 alkyl group; cycloalkyl group, including but not limited to C3-C6 cycloalkyl group; and aryl group; R 7 , R 8 and R 9 Each of the following can independently represent at least one of the following: H; D; F; Cl; alkyl group, including but not limited to C1-C6 alkyl group; cycloalkyl group, including but not limited to C3-C6 cycloalkyl group; alkoxy group, including but not limited to C1-C6 alkoxy group; fluoroalkyl group; haloaryl group; heteroaryl group; haloalkoxy group; fluoroaryl group; fluoroalkoxy group; fluoroalkylthioalkyl group; fluoromethyl group; difluoromethyl group; trifluoromethyl group; difluoromethoxy group; trifluoromethoxy group; fluoroethyl group; polyfluoroethyl group; 4-fluorophenyl group; 3,4,5-trifluorophenyl group; polyfluoroaryl group; 4-(trifluoromethoxy)phenyl group; carbonyl group; nitro group; nitrile group; phosphine oxide group; diphenylphosphine oxide group; and trifluoromethylthioalkyl group; x Integers between 0 and 2; y Integers between 0 and 12; z It is an integer between 0 and 4; and M It represents one of O and S.

[0264] Those skilled in the art will understand that any of the portions represented by the chemical formulas (LM-1)-(LM-106), when representing a linker portion, can be bonded to another portion of the molecule (including, but not limited to, the P atom of the cyclophosphonitrile portion) at any site where such a bond can be formed by means of at least one of the C atom and heteroatoms.

[0265] In some non-limiting examples, at least one C atom of the linking base portion (including, but not limited to, those portions represented by any of the chemical formulas (LM-1)-(LM-106)) may be replaced by a corresponding number of heteroatoms (including, but not limited to, at least one of O, N, S and Si).

[0266] In some non-limiting examples, the linker portion may be represented by one of the chemical formulas (LK-9), (LK-10), and (LK-11): (LK-9) (LK-10) (LK-11) in: Each L B Independently representing the bridge connection portion; Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties; Each R Independently representing at least one of the following: H, D, F, Cl, bromine (Br), alkyl group, cycloalkyl group, alkoxy group, fluoroalkyl group, haloaryl group, heteroaryl group, haloalkoxy group, fluoroaryl group, fluoroalkoxy group, fluoroalkylthioalkyl group, fluoromethyl group, difluoromethyl group, trifluoromethyl group, difluoromethoxy group, trifluoromethoxy group, fluoroethyl group, polyfluoroethyl group, 4-fluorophenyl group, 3,4,5-trifluorophenyl group, polyfluoroaryl group, 4-(trifluoromethoxy)phenyl group, carbonyl group, nitro group, nitrile group, phosphine oxide group, diphenylphosphine oxide group, and trifluoromethylthioalkyl group; and n It is an integer between 0 and 4.

[0267] Bridge connection section, L B In some non-restrictive examples, the bridging portion L B This can correspond to a portion of the connecting base portion arranged between at least two annular portions. In some non-limiting examples, the bridging portion... L B It can bond to one of the C atoms and heteroatoms in each ring portion. In some non-limiting examples where at least two ring portions are present, the linker portion may include at least one bridging portion bonded to at least two ring portions. In some non-limiting examples, the linker portion may bond to more than two ring portions. N In some non-limiting examples, a ring-shaped portion exists in the connecting base portion, and the number of bridging portions can be from 1 to ( N Between -1).

[0268] In some non-restrictive examples, the bridging portion L B It may contain at least one of the following: single bond, C, CH, CH2, CH3, C R 2 C(R 2 )2, CHF, CF2, CF3, CF2N, NH, N R 2 S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene, and unsubstituted heteroalkylene. In some non-limiting examples, each R 2 It can independently represent at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0269] In some non-restrictive examples, the bridging portion L B It can be represented by any of the chemical formulas (BM-1)-(BM-56):

[0270] Among them In each of the chemical formulas (BM-1)-(BM-56): Indicates the attachment point to at least one annular portion.

[0271] In some non-limiting examples, the linker portion comprising at least one ring-shaped portion may be represented by one of the chemical formulas (LC-1)-(LC-297):

[0272] In each of the chemical formulas (LC-1)-(LC-297): Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties.

[0273] Connecting base portion including acyclic portion In some non-restrictive examples, the connection base portion L c It may contain an acyclic portion, which includes, but is not limited to, at least one of the following: single bond, C, CH, CH2, C R 4 C( R 4 2. CHF, CF2, N, NH, N R 4 S, O, ethers, substituted amines (including but not limited to secondary and tertiary amines), unsubstituted amines (including but not limited to secondary and tertiary amines), substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted heteroalkylene, and unsubstituted heteroalkylene. In some non-limiting examples, R 4 Each can independently represent at least one of the following: H, D, F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0274] In some non-restrictive examples, L c It may include a phosphazene moiety, which includes, but is not limited to, at least one of a linear moiety and a branched moiety, and may be represented as follows: (N=P) x ,in x The value is an integer. In some non-limiting examples, the phosphazene moiety may be provided in combination with one of a plurality of cyclophosphazene moietyes of a connected cyclophosphazene compound.

[0275] In some non-restrictive examples, L c It may contain at least one of the CH2, CF2, CF2H and CF3 components.

[0276] In some non-limiting examples, the atoms of the acyclic moiety may be directly attached to at least one P atom of at least one cyclophosphinitrogen moiety among a plurality of cyclophosphinitrogen moieties. In some non-limiting examples, the atoms of the acyclic moiety may be indirectly attached to at least one P atom of at least one cyclophosphinitrogen moiety among a plurality of cyclophosphinitrogen moieties via a spacer base portion. In some non-limiting examples, the spacer base portion may include at least one of the following: single bond, O, S, N, C, ether, thioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted aryl, unsubstituted aryl, substituted heteroaryl, and unsubstituted heteroaryl.

[0277] In some non-limiting examples, the linker portion may comprise a structure represented by at least one of the chemical formulas (LA-1)-(LA-6):

[0278] In each of the chemical formulas (LA-1)-(LA-6): Indicates the attachment point to one of the cyclophosphamide portion and the spacer base portion; R 2 and R 3 Each of the following can be independently represented as at least one of the following: H; D; F; Cl; alkyl group, including but not limited to C1-C6 alkyl group; cycloalkyl group, including but not limited to C3-C6 cycloalkyl group; alkoxy group, including but not limited to C1-C6 alkoxy group; fluoroalkyl group, haloaryl group, heteroaryl group, haloalkoxy group, fluoroaryl group, fluoroalkoxy group, fluoroalkylthioalkyl group, fluoromethyl group, difluoromethyl group, trifluoromethyl group, difluoromethoxy group, trifluoromethoxy group, fluoroethyl group, polyfluoroethyl group, 4-fluorophenyl group, 3,4,5-trifluorophenyl group, polyfluoroaryl group, 4-(trifluoromethoxy)phenyl group and trifluoromethylthioalkyl group.

[0279] In some non-limiting examples, the linker portion may contain a structure represented by chemical formula (LA-7): (LA-7) in: Each Independently represents the attachment point of one of the multiple cyclophosphinitrogen moieties; x Integers between 0 and 6; y Integers between 0 and 20; x+y It is at least 1; and A It is one of H, D, and F.

[0280] Some functional groups of cyclophosphonitrile R In some non-limiting examples, the linked cyclophosphamide compound may contain multiple cyclophosphamide moiety functional groups. R (This article is also known as " R (group). In some non-limiting examples, at least one P atom of at least one cyclophosphamide moiety in a plurality of cyclophosphamide moieties may be, but is not limited to, a plurality of... R At least one group in the group is substituted.

[0281] In some unrestricted examples, each R The group may independently include at least one of the following: F, Cl, hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group. Groups, substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups.

[0282] In some unrestricted examples, each RThe group may independently include at least one of the following: F, Cl, hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryl group, unsubstituted aryl group, substituted fluoroaryl group, unsubstituted fluoroaryl group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group, amino group, amine group, alkylamine group and arylamine group.

[0283] In some unrestricted examples, each R The group may independently contain at least one of the following: F, Cl, hydroxyl group, C1-C 12 Alkyl groups, C1-C 12 Fluorinated alkyl groups, C1-C 12 alkoxy groups, C1-C 12 Fluoroalkoxy group, C3-C 18 aryl group, C3-C 18 Fluorinated aryl group, C3-C 18 aryloxy group, C3-C 18 Fluoroaryloxy groups, amino groups, C1-C 12 alkylamine groups and C6-C 18 Arylamine group.

[0284] In some unrestricted examples, each R The group may independently contain at least one of the following: C1-C 12 alkoxy group, C6-C 18 aryloxy groups and C6-C 18 Fluoroaryloxy group.

[0285] In some non-restrictive examples, R At least one of the groups may comprise a main chain and at least one F atom attached thereto. In some non-limiting examples, the main chain may be a C-containing main chain. In some non-limiting examples, the main chain may comprise heteroatoms, including but not limited to Si.

[0286] In some non-restrictive examples, R Each group in the group may contain a linker group. R B intermediate groups R D and terminal groups R T In some non-restrictive examples, R The group may contain branched groups. RE In some non-restrictive examples, R The group may contain at least one saturated bond. In some non-limiting examples, R The bonds of the groups can be essentially saturated bonds, making R The group is a saturated moiety. In some non-limiting examples, R Various parts of the group, including but not limited to R B , R D , R T and R E It can be the saturated portion.

[0287] To avoid being bound by any particular theory, it can be assumed that multiple ether units exist in a single... R The presence within the group can lower the melting point of the linked cyclophosphonitrile compound, which may be applicable in at least some scenarios. In some non-limiting examples, R The group may contain no more than one of about four, three, two, and one ether units.

[0288] In some non-restrictive examples, R The group can be represented by the chemical formula (EL-1): (EL-1) in: This indicates the attachment point to one of the multiple cyclophosphinitrogen moieties; R B Indicates a linking group; R D Indicates an intermediate group; and R T This indicates a terminal group.

[0289] In some non-limiting examples, the linking group R B It can correspond to R The terminal portion of the group near the cyclophosphonitrile moiety and may contain R A group is an atom that can bond with it.

[0290] In some non-restrictive examples, R BIt may contain at least one of the following: single bond, O, N, S, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted aryl, unsubstituted aryl, substituted heteroaryl and unsubstituted heteroaryl, phosphazene main chain monomer and phosphazene group. In some non-limiting examples, R B It may contain at least one of the following: a single bond, O, N, S, a substituted alkylene group, an unsubstituted alkylene group, a substituted fluoroalkylene group, and an unsubstituted fluoroalkylene group. In some non-limiting examples, R B It may contain at least one of the following: single bond, O, N, S, alkylene, fluoromethylene and difluoromethylene.

[0291] In some non-restrictive examples, R B It may contain at least one of the following: single bond, O, N, C, CH, CH2, C R 3 C( R 3 2. CHF, CF2, N, NH, N R 3 And S. In some non-restrictive examples, R 3 Each can independently represent at least one of the following: H, D, F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0292] In some non-limiting examples, intermediate groups R D This can correspond to the arrangement between the linking group and the terminal group. R Part of a group. In some non-limiting examples, R D It may contain at least one of the following: O, ether, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted arylene, unsubstituted arylene, substituted heteroarylene, and unsubstituted heteroarylene. In some non-limiting examples, R D It may contain F atoms. In some non-limiting examples, R DIt may contain fluorinated alkylene units. In some non-limiting examples, R D It may contain at least one of CF2 units, CFH units, and CH2 units. In some non-limiting examples, R D It may contain multiple CF2 units bonded together to form a fluoroalkylene group, including but not limited to a portion thereof. In some non-limiting examples, R D It may contain at least one CH2 unit and at least one CF2 unit. In some non-limiting examples, R D It may contain ether units. In some non-limiting examples, R D It can contain saturated bonds. In some other non-limiting examples, R D It can contain virtually no unsaturated bonds. In some non-restrictive examples, R D It may contain no more than one of 15, 13, 12, and 10 C atoms. In some non-limiting examples, R D It may contain at least one of the following: O, ether, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, and unsubstituted fluoroalkylene.

[0293] In some non-limiting examples, the terminal group R T It can correspond to R The terminal portion of the group includes, but is not limited to, its distal portion relative to the cyclophosphamide moiety. In some non-limiting examples, the terminal portion may correspond to... R The terminal portion of the group opposite the linking group. R The group includes a cyclic linker group. R B In some non-restrictive examples, R T It can refer to the portion of the ring atom attached to the cyclic linker group. In some non-limiting examples, R T It may contain F atoms. In some non-limiting examples, R T It may contain branched alkyl groups, unbranched alkyl groups, branched fluoroalkyl groups, unbranched fluoroalkyl groups, substituted heterocyclic alkyl groups, unsubstituted heterocyclic alkyl groups, branched fluoroalkoxy groups, unbranched fluoroalkoxy groups, fluoroaryl groups, polyfluorosulfide alkyl groups, and fluorocycloalkyl groups. In some non-limiting examples, R TIt may contain branched alkyl groups, non-branched alkyl groups, branched fluoroalkyl groups, non-branched fluoroalkyl groups, branched fluoroalkoxy groups, and non-branched fluoroalkoxy groups. In some non-limiting examples, R T It may contain no more than one of about 8, 6, 5, 3, 2, and 1 C atoms. In some non-limiting examples, R T It may include at least one of H, D, F, CF2, CF2H, CF3, OCF3 and SF5.

[0294] In some non-limiting examples, branching groups R E Can correspond to R A portion of a group from which at least two branches of the main chain extend. In some non-limiting examples, R E It can serve as a branching point for the main chain. In some non-restricted examples, branching can be achieved by... R E With formation R This occurs through the bonding of at least three other parts of the group. In some non-limiting examples, R E Can R The groups can be arranged in various configurations and can be bonded to at least one of the following: R B , R D and R T In some non-restrictive examples, at least three are related to... R E The bonded parts can be either the same or different. In some non-restrictive examples, R E Can be used with multiple R D and R T At least one of them is bonded, where R Groups may contain multiple R D and R T At least one of them. In some non-restrictive examples, R E It may contain at least one of the following: O, N, S, amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted aryl, unsubstituted aryl, substituted heteroalkylene, and unsubstituted heteroalkylene. In some non-limiting examples,R E It may contain at least one of the following: O, N, S, amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, and unsubstituted fluoroalkylene. In some non-limiting examples, R E It may contain no more than one of about 8, 6, 5, 3, 2, and 1 C atoms. In some non-limiting examples, R E It can contain virtually no carbon atoms.

[0295] In some non-limiting examples, the chemical formula (EL-1) R B It can be represented by one of the chemical formulas (EA-1)-(EA-6):

[0296] in R H It represents one of the following: H, D, CF3, and the second. R Group, which contains intermediate groups R D and terminal groups R T .

[0297] In some non-limiting examples, the terminal group R T Can be bonded to the second R intermediate group of the group R D In some non-restrictive examples, the second... R The group can be represented by the chemical formula (ED-1): (ED-1) In some non-restrictive examples, the second R group R D and R T In terms of molecular structure, it can be related to R Groups (including but not limited to those in chemical formula (EL-1)) R D and R T The same. In some non-restrictive examples, the second... R group R D and R T At least one of them can be with R group RD and R T They are different. Those skilled in the art will understand that, in some non-limiting examples, the descriptions provided herein are different from those provided elsewhere. R Group-related information R D and R T The description is applicable to the second R group R D and R T .

[0298] In some non-limiting examples, the chemical formula (EL-1) R D It can be represented by the chemical formula (EB-1): (EB-1) in: X Each occurrence independently represents one of H, D, F, and CF3; a Integers between 0 and 6; b It is an integer between 0 and 12; and a and b The sum of them is at least 1.

[0299] In some non-restrictive examples, a and b The sum can be no more than one of 15, 12, 10, and 9.

[0300] In some non-limiting examples, the chemical formula (EB-1) R D It can be represented by one of the chemical formulas (EB-10)-(EB-21):

[0301] In each of the chemical formulas (EB-10)-(EB-21): b It is an integer between 4 and 9.

[0302] In some non-restrictive examples, a It can be an integer between 2 and 4, and b It can be an integer between 5 and 9, and a and b The sum can be an integer between 6 and 13.

[0303] In some non-limiting examples, the chemical formula (EL-1) R T It can be represented by one of the chemical formulas (EC-1)-(EC-7), (EC-10), and (EC-11):

[0304] In some non-restrictive examples, R The functional group (including, but not limited to, one of the chemical formulas (E-2)-(E-4)) may contain a branched moiety. In some non-limiting examples, this... R The group can contain one of the chemical formulas (E-2)-(E-4):

[0305] In some non-restrictive examples, R The group may contain a C-containing main chain in a closed-ring configuration, including but not limited to those forming cyclic structures, including but not limited to those cyclic structures containing fluorocycloalkyl groups, including but not limited to perfluorocyclopentyl and perfluorocyclohexyl.

[0306] In some non-restrictive examples, for this paper R B , R D , R E and R T The description of at least one of them can be applied to the R Groups (including but not limited to those in chemical formulas (E-2)-(E-4)) R B , R D , R E and R T The corresponding reference.

[0307] exist R The group contains multiple identical parts (including but not limited to multiple R B , R D , R E and R T In some non-restrictive examples (at least one of which), each such part can be selected independently each time it appears.

[0308] In some non-limiting examples, at least one of the linked cyclophosphinitron compounds R The group can contain a low surface tension part.

[0309] The surface tension of fragments attributable to the molecular structure (including, but not limited to, at least one of the functional groups of the first cyclophosphamide moiety, the second cyclophosphamide moiety, the linker moiety, and the cyclophosphamide moiety) can be determined using various methods known in the art, including, but not limited to, using Parachor, as can be described by non-limiting example in "Conception and Significance of the Parachor". Nature Further described in 196: 890–891.

[0310] In some non-limiting examples, the critical surface tension attributable to the low surface tension portion may be no more than one of about 25 dynes / cm, 21 dynes / cm, 20 dynes / cm, 19 dynes / cm, 18 dynes / cm, 17 dynes / cm, 16 dynes / cm, 15 dynes / cm, 14 dynes / cm, 13 dynes / cm, 12 dynes / cm, 11 dynes / cm and 10 dynes / cm.

[0311] In some non-limiting examples, the low surface tension portion may be an F-containing portion. In some non-limiting examples, at least one of the linked cyclophosphonitrile compounds... R The group may contain an F-containing moiety. In some non-limiting examples, most of them contain multiple F-containing moieties. R The group can independently contain the F-containing moiety. In some non-limiting examples, essentially all of the multiple groups... R A group can independently contain an F-containing moiety.

[0312] In some non-limiting examples, the F-containing portion may be bonded to the P atom of the phosphazene main chain monomer in at least one of the following ways: directly and via a linking group. In some non-limiting examples, the linking group may comprise at least one of the following: single bond, O, N, C, CH, CH2, C. R 3 C( R 3 2. CHF, CF2, N, NH, N R 3 And S. In some non-restricted examples, each R 3 It can independently represent at least one of the following: H, D, F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0313] In some non-limiting examples, the linker group may include at least one of the following: single bond, O, N, S, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted aryl, unsubstituted aryl, substituted heteroaryl and unsubstituted heteroaryl, phosphazene main chain monomer and phosphazene group. In some non-limiting examples, the linker group may include at least one of the following: single bond, O, N, S, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene and unsubstituted fluoroalkylene. In some non-limiting examples, the linker group may include at least one of the following: single bond, O, N, S, alkylene, fluoromethylene and difluoromethylene.

[0314] In some non-limiting examples, the F-containing moiety may include at least one of the following: substituted fluoroalkyl, unsubstituted fluoroalkyl, substituted fluoroalkoxy, unsubstituted fluoroalkoxy, substituted fluoroalkylsilyloxy, unsubstituted fluoroalkylsilyloxy, substituted fluorocycloalkyl, unsubstituted fluorocycloalkyl, substituted fluoroaryl, and unsubstituted fluoroaryl. In some non-limiting examples, the F-containing moiety may include a fluorocarbon unit, including but not limited to at least one of CF, CF2, CF3, and CF2H units. In some non-limiting examples, the F-containing moiety may include a terminal unit, including one of CF2CF2H, CF2CF3, CH2CF2H, and CH2CF3. In some non-limiting examples, the terminal unit may correspond to a distal portion of the F-containing moiety relative to the P atom of the cyclophosphinitrogen moiety to which the F-containing moiety may be attached.

[0315] In some non-limiting examples, the F-containing portion may include a fluoroalkyl portion, which includes, but is not limited to, C3-C... 15 Fluoroalkyl groups.

[0316] In some non-limiting examples, the fluoroalkyl group may include at least one of a CF2 group, a CF2H group, a CH2CF3 group, and a CF3 group. In some non-limiting examples, the F-containing part may include a fluoroalkyl part represented by chemical formula (FL-1): (FL-1) in: x Integers between 0 and 6 y It is an integer between 1 and 20; and A It is one of H, D, and F.

[0317] In some non-restrictive examples,x It can be an integer between 1 and 4. y It can be an integer between 3 and 10, and A It can be either H or F. In some non-restrictive examples, x It can be either 1 or 2. y It can be one of 3, 4, 6, and 8, and A It can be either H or F. In some non-restrictive examples, x It can be 2, y It can be 1, and A It can be either H or F. In some non-restrictive examples, x and y The sum can be no more than one of 15, 12, 10, and 8.

[0318] In some non-limiting examples, the F-containing part may include a fluoroalkyl part of the chemical formula (FL-2): (FL-2) in: x , y , z and u Each is an integer between 1 and 6, and A It is either H or F.

[0319] In some non-restrictive examples, x It can be an integer between 1 and 3. y It can be an integer between 1 and 6. z It can be an integer between 1 and 3, and u It can be an integer between 1 and 6. In some unrestricted examples, y and u At least one of the following can be no more than 5, 4, or 3. In some non-restrictive examples, x , y , z and u The sum can be no more than one of 15, 12, 10, and 8.

[0320] In some non-limiting examples, the F-containing portion may include a terminal group according to chemical formula (FL-3): (FL-3) in: p It is an integer between 1 and 6.

[0321] In some non-limiting examples, the chemical formula (FL-3) may correspond to the terminal group of at least one of fluoroalkyl and fluoroalkoxy.

[0322] It has been found that cyclophosphonitrile compounds containing an F-containing moiety with a CH2CF3 terminal group can exhibit at least one property that may be applicable in some scenarios compared to other compounds containing an F-containing moiety with at least one of a CF2CF3 terminal group and a CF2CF2H terminal group.

[0323] In some non-limiting examples, the F-containing portion may include a fluoroalkoxy portion, which includes, but is not limited to, C3-C. 15 Fluoroalkoxy group.

[0324] In some non-limiting examples, the F-containing part may contain no more than 15 C atoms.

[0325] In some non-limiting examples, at least one of the substituted fluoroalkoxy group and the unsubstituted fluoroalkoxy group can be derived by replacing at least one H atom of an alkoxy group containing, but not limited to, about 1-15 C atoms with a corresponding number of F atoms. In some non-limiting examples, the fluoroalkoxy group can be derived by attaching an ether bridging group to at least one of the substituted fluoroalkyl group and the unsubstituted fluoroalkyl group. In some non-limiting examples, the fluoroalkoxy group can be derived by replacing at least one H atom of an alkoxy group containing, but not limited to, about 1-15 C atoms with a corresponding number of F atoms. In some non-limiting examples, the fluoroalkoxy group can be derived by attaching an ether bridging group to at least one of the substituted fluoroalkyl group and the unsubstituted fluoroalkyl group.

[0326] In some non-limiting examples, the F-containing portion may include a continuous fluorinated chain of a C substance having no more than 6 fluorinated C atoms. In some non-limiting examples, the F-containing portion may include at least one of the following: fluoroalkyl, fluoroalkoxy, and fluoroalkylsiloxy (each of which may be substituted and unsubstituted), wherein no more than 6 fluorinated C atoms form a continuous fluorinated chain. In some non-limiting examples, the F-containing portion may include a continuous fluorinated chain of a C substance having no more than 5, 4, and 3 fluorinated C atoms. In some non-limiting examples, the F-containing portion may contain no more than 6 C atoms.

[0327] In this disclosure, as used herein, the term "non-fluorinated moiety" may generally refer to a moiety that is substantially free of F and may contain at least one substituent (including, but not limited to, a moiety containing additional atoms) in some non-limiting examples, including, but not limited to, at least one of the following: substituted alkyl, unsubstituted alkyl, substituted alkoxy, unsubstituted alkoxy, substituted silyloxy, unsubstituted silyloxy, substituted cycloalkyl, unsubstituted cycloalkyl, substituted aryl, unsubstituted aryl, substituted heteroaryl, and unsubstituted heteroaryl. In some non-limiting examples, any of the alkyl, alkoxy, cycloalkyl, aryl, and heteroaryl groups may contain about 1-15 C atoms, and the silyloxy group may contain about 1-15 Si atoms. In some non-limiting examples, linked cyclophosphonitrile compounds may contain a non-fluorinated moiety. In some non-limiting examples, linked cyclophosphonitrile compounds may contain an F-containing moiety and a non-fluorinated moiety.

[0328] In some non-limiting examples, the linked cyclophosphamide compound may contain a cyclophosphamide moiety functional group of one of the chemical formulas (F-1)-(F-494). R :

[0329] In some non-restrictive examples, R At least one C atom of a group (including but not limited to any of the chemical formulas (F-1) to (F-494) may be replaced by a corresponding number of heteroatoms (including but not limited to at least one of O, N, S and Si).

[0330] Without being bound by any particular theory, it may be assumed that patterned materials 411 containing cyclophosphamide derivatives with CF2H terminal groups may be suitable in some scenarios compared to phosphamide derivatives containing CF3 terminal groups. In some non-limiting examples, it has been found that using such patterned material 411 can provide at least one of the following: substantially high deposition contrast; substantially low tendency for patterned coatings 110 containing patterned material 411 to undergo crystallization; and substantially low tendency for patterned coatings 110 containing patterned material 411 to undergo cohesive failure (including but not limited to delamination).

[0331] In some non-limiting examples, most of the cyclophosphamide moiety functional groups have the same chemical structure. In some non-limiting examples, at least one of the cyclophosphamide moiety functional groups in approximately 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, and 95% of the cyclophosphamide moiety functional groups has the same chemical structure. In some non-limiting examples, substantially all of the cyclophosphamide moiety functional groups have the same structure.

[0332] In some non-limiting examples, the molecular structures of cyclophosphonitrile compounds linked according to chemical formula (LPH-1) are described in Table 1.

[0333] Table 1

[0334] In some non-limiting examples, the low surface tension portion may include a Si-containing portion. In some non-limiting examples, the Si-containing portion may be a siloxane-containing group.

[0335] In some non-limiting examples, at least one of the plurality of cyclophosphamide molar functional groups may have a molar mass of at least about 50 g / mol, 80 g / mol, 100 g / mol, 200 g / mol, 300 g / mol, 400 g / mol, 430 g / mol, 480 g / mol, 530 g / mol and 580 g / mol.

[0336] In some non-limiting examples, at least one of the plurality of cyclophosphamide moiety functional groups may have a molar mass not exceeding one of about 550 g / mol, 600 g / mol, 650 g / mol, 700 g / mol, 750 g / mol, 800 g / mol, 850 g / mol, 900 g / mol, 950 g / mol, 1,000 g / mol, and 1,200 g / mol.

[0337] Implementation Plan In some non-limiting examples, the molecular structure of the linked cyclophosphonitrile compound can be represented by the chemical formula (LPH-2): (LPH-2) in: L c This represents a linker portion, which includes at least one of the following: a single bond, C, CH, CH2, C R 1 C( R 1 2. CHF, CF2, N, NH, N R 1 S, O, ether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted C5–C 30 Aromatic, unsubstituted C5–C 30 arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted C4–C 30 heteroaryl, unsubstituted C4–C 30 Heteroaryl, substituted C3–C 30 Cycloalkylene, unsubstituted C3–C 30 Cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene, substituted heteroalkylene, substituted adamantane moiety, unsubstituted adamantane moiety, substituted diamond-like moiety and unsubstituted diamond-like moiety; R Independently representing the functional groups of cyclophosphonitrile, each RIndependently comprising at least one of the following: F, Cl, hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryl group, unsubstituted aryl group, substituted fluoroaryl group, unsubstituted fluoroaryl group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group, amino group, amine group, alkylamine group, and arylamine group; and Each R 1 Independently, it is at least one of the following: H, D, F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0338] In some non-limiting examples, the linked cyclophosphamide compound may include at least one cyclic moiety in its linker portion. In some non-limiting examples, the molecular structure of the linked cyclophosphamide compound may be represented by one of the chemical formulas (LPH-3) and (LPH-4): (LPH-3) (LPH-4) in: L cy Indicates the ring-shaped portion, each L cy Independently comprising at least one of the following: substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene and unsubstituted heteroalkylene.

[0339] L B The bridging portion represents a portion that includes at least one of the following: a single bond, C, CH, CH2, CH3, or C. R 2 C( R 2 )2, CHF, CF2, CF3, CF2N, NH, N R 2S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene and unsubstituted heteroalkylene; R This indicates that each of the functional groups in cyclophosphonitrile is... R Independently contains at least one of the following: F, Cl, hydroxyl group, C1-C 12 Alkyl groups, C1-C 12 Fluorinated alkyl groups, C1-C 12 alkoxy groups, C1-C 12 Fluoroalkoxy group, C3-C 18 aryl group, C3-C 18 Fluorinated aryl group, C3-C 18 aryloxy group, C3-C 18 Fluoroaryloxy groups, amino groups, C1-C 12 alkylamine groups and C6-C 18 arylamine group; and Each R 2 Independently, it is at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0340] In some non-limiting examples, the molecular structure of the linked cyclophosphamide compound can be represented by one of the chemical formulas (LPH-5) and (LPH-6): (LPH-5) (LPH-6) in: Each Ar Independently representing the aromatic group; L B The bridging portion represents a portion that includes at least one of the following: a single bond, C, CH, CH2, CH3, or C. R 2 C( R 2 )2, CHF, CF2, CF3, CF2N, NH, NR 2 S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene and unsubstituted heteroalkylene; Each R f Independently comprising at least one of the following: C, F, CF2 moiety, CF2H moiety, CF3 moiety, SCF3 moiety, SF3 moiety, SF5 moiety, substituted fluoroaryl group, unsubstituted fluoroaryl group, branched fluoroalkyl group containing 2-15 C atoms, and non-branched fluoroalkyl group containing 2-15 C atoms; and Each R 2 Independently, it is at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0341] In some non-limiting examples, the aromatic moiety may be substituted with at least one of the following: H, D, F, Cl, alkyl group, alkenyl group, alkynyl group, fluoroalkyl group, fluoromethyl group, difluoromethyl group, trifluoromethyl group, fluoroethyl group, polyfluoroethyl group, cycloalkyl group, fluorocycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, difluoromethoxy group, trifluoromethoxy group, aryl group, heteroaryl group, fluoroaryl group, polyfluoroaryl group, 4-fluorophenyl group, 3,4,5-trifluorophenyl group, 4-(trifluoromethoxy)phenyl group, sulfonyl group, fluoroalkylthioalkyl group, trifluoromethylthioalkyl group, silanoxy group, thioether group, carbonyl group, nitro group, nitrile group, phosphine oxide group, and diphenylphosphine oxide group.

[0342] In some non-limiting examples, the aromatic moiety may be one of a monocyclic aromatic moiety containing at least 5 C atoms, a bicyclic aromatic moiety containing 6-15 C atoms, and a polycyclic aromatic moiety containing 6-20 C atoms.

[0343] In some non-restrictive examples, R f It can be produced by –(CH2) x (CF2)y Z represents x, where x is an integer between 1 and 5, y is an integer between 1 and 20, and Z is either F or H.

[0344] Without wishing to be bound by any particular theory, it may be assumed that a linked cyclophosphonitrile compound represented by one of the chemical formulas (LPH-3) to (LPH-6) is suitable as at least one of the patterned coating 110 and the patterned material 411, and in particular, is suitable for scenarios requiring a low initial adhesion probability relative to the deposited material 531, including but not limited to at least one of metals and alloys, including but not limited to Yb, Ag, Mg and Ag-containing materials, including but not limited to MgAg.

[0345] In some non-limiting examples, the molecular structure of the linked cyclophosphonitrile compound can be represented by the chemical formula (LPH-7): (LPH-7) in: Each Ph Independently representing the phenyl moiety; L B The bridging portion represents a portion that includes at least one of the following: a single bond, C, CH, CH2, CH3, or C. R 2 C( R 2 )2, CHF, CF2, CF3, CF2N, NH, N R 2 S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene and unsubstituted heteroalkylene; Each R f Independently comprising at least one of the following: C, F, CF2 moiety, CF2H moiety, CF3 moiety, branched fluoroalkyl group comprising 2 to 15 C atoms, and non-branched fluoroalkyl group comprising 2 to 15 C atoms; and Each R 2Independently, it is at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

[0346] In some non-limiting examples, the phenyl moiety may be substituted with at least one of the following: F, Cl, C1-C7 alkyl group, C1-C7 fluoroalkyl group, fluoromethyl group, difluoromethyl group, trifluoromethyl group, fluoroethyl group, polyfluoroethyl group, C1-C7 fluoroalkoxy group, trifluoromethoxy group, cycloalkyl group, fluorocycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, difluoromethoxy group, trifluoromethoxy group, sulfonyl group, fluoroalkylthioalkyl group, trifluoromethylthioalkyl group, silanoxy group, thioether group, carbonyl group, nitro group, nitrile group, and phosphine oxide group.

[0347] In some non-restrictive examples, R f It can be produced by –(CH2) x (CF2) y Z represents x, where x is an integer between 1 and 5, y is an integer between 1 and 20, and Z is either F or H.

[0348] In some non-limiting examples, in a linked cyclophosphamide compound represented by one of the chemical formulas (LPH-5), (LPH-6), and (LPH-7), the quotient of the total number of F atoms in the plurality of cyclophosphamide moiety functional groups / the total number of C atoms in the plurality of cyclophosphamide moiety functional groups may be at least one of about 1.55, 1.58, 1.62, 1.65, 1.68, 1.70, 1.73, 1.77, and 1.81.

[0349] In some non-limiting examples, the molecular structure of the linked cyclophosphonitrile compound can be represented by the chemical formula (LPH-8): (LPH-8) in: Each Ph Independently constitutes the phenyl moiety; L BThe bridging portion comprises at least one of the following: single bond, C, CH3, CF3, C(CH3)2, C(CF3)2, C(Ph)CH3, C(Ph)2, S, O, carbonyl, sulfone, ether, thioether, dithioether, substituted cyclohexylene, unsubstituted cyclohexylene, arylene comprising 6-12 C atoms, and heteroarylene comprising at least 4 C atoms; x Integers between 1 and 5; y It is an integer between 1 and 20; and Z It is either F or H.

[0350] In some non-limiting examples, the phenyl moiety may be substituted with at least one of the following: F, a C1-C6 alkyl group, and a C1-C6 alkoxy group.

[0351] In some non-limiting examples, the sp in the compound represented by the chemical formula (LPH-8) 2 The total number of C atoms can be at least 7; and the total number of fluorinated C atoms in the compound / the total number of sp atoms in the compound 2 The quotient of the total number of C atoms can be at least one of approximately 1, 2, 4, 6, 8, 10, 12, 13, 14, 15, 16, 17, 18, and 20.

[0352] Without wishing to be bound by any particular theory, it may be assumed that the linked cyclophosphonitrile compound represented by the chemical formula (LPH-8) is suitable as at least one of the patterned coating 110 and the patterned material 411, and in particular, has increased applicability in scenarios requiring substantially high thermal stability for long-term thermal evaporation processes.

[0353] Compounds containing multiple linker moieties In some non-limiting examples, the first and second cyclophosphonitrile moieties may be bonded to each other via multiple linker moieties. In some non-limiting examples, the molecular structure of the linked cyclophosphonitrile compound may be represented by chemical formula (LPH-9): (LPH-9) in: L C 1 and L C 2 Independently represented: the first connecting base portion and the second connecting base portion; RIndependently representing the cyclophosphonitrile functional group, and each occurrence may include at least one of the following: F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted fluoroalkylsilyloxy group, unsubstituted fluoroalkylsilyloxy group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted aryl group, unsubstituted aryl group, substituted fluoroaryl group, unsubstituted fluoroaryl group, substituted fluoroalkylthioalkyl group, unsubstituted fluoroalkylthioalkyl group, substituted heteroaryl group, unsubstituted heteroaryl group, substituted polyfluorothioalkyl group, and unsubstituted polyfluorothioalkyl group; and m and n Each is an integer between 2 and 4.

[0354] In some non-restrictive examples, L C 1 and L C 2 It can be one of the following: the same or different.

[0355] In some non-limiting examples, the molecular structure of the linked cyclophosphamide compound can be represented by one of the chemical formulas (LPH-9-1)-(LPH-9-7):

[0356] in: Each R Independently representing at least one of the following: F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted fluoroalkylsilyloxy group, unsubstituted fluoroalkylsilyloxy group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted aryl group, unsubstituted aryl group, substituted fluoroaryl group, unsubstituted fluoroaryl group, substituted fluoroalkylthioalkyl group, unsubstituted fluoroalkylthioalkyl group, substituted heteroaryl group, unsubstituted heteroaryl group, substituted polyfluorothioalkyl group and unsubstituted polyfluorothioalkyl group; m andn Each is an integer between 2 and 4; and R' It is at least one of the following: H; D; F; Cl; alkyl group, including but not limited to C1-C6 alkyl group; cycloalkyl group, including but not limited to C3-C6 cycloalkyl group; alkoxy group, including but not limited to C1-C6 alkoxy group; fluoroalkyl group; haloaryl group; heteroaryl group; haloalkoxy group; fluoroaryl group; fluoroalkoxy group; fluoroalkylthioalkyl group; fluoromethyl group; difluoromethyl group; trifluoromethyl group; difluoromethoxy group; trifluoromethoxy group; fluoroethyl group; polyfluoroethyl group; 4-fluorophenyl group; 3,4,5-trifluorophenyl group; polyfluoroaryl group; 4-(trifluoromethoxy)phenyl group; and trifluoromethylthioalkyl group.

[0357] weight In some non-limiting examples, the molar mass of the cyclophosphonitrile compound linked to at least one patterned material 411 may be at least about 2,500 g / mol. In some non-limiting examples, the molar mass of the compound may be one of at least about 3,000 g / mol, 3,700 g / mol, 4,000 g / mol, 4,200 g / mol, and 4,500 g / mol.

[0358] In some non-limiting examples, the molar mass of the linked cyclophosphonitrile compound in at least one patterned material 411 may not exceed about 6,000 g / mol. In some non-limiting examples, the molar mass of the linked cyclophosphonitrile compound may be one of about 6,000 g / mol, 5,700 g / mol, 5,500 g / mol, 5,300 g / mol, and 5,000 g / mol.

[0359] In some non-limiting examples, the molar mass of the cyclophosphonitrile compound linked to at least one patterned material 411 may be one of about 3,000 g / mol to 6,000 g / mol, 3,300 g / mol to 5,700 g / mol, 3,500 g / mol to 5,500 g / mol, and 4,500 g / mol to 4,900 g / mol.

[0360] Without wishing to be bound by any particular theory, it may be assumed, in some non-limiting examples, that cyclophosphonitrile compounds with substantially neither high nor low molar masses may be suitable as patterning materials in some scenarios 411. It may be assumed that cyclophosphonitrile compounds with substantially high molar masses (including, but not limited to, at least about 3,000 g / mol) may allow the compound to sublimate without causing thermal degradation. In some non-limiting examples, cyclophosphonitrile compounds with substantially high molar masses (including, but not limited to, at least about 3,000 g / mol) may tend to exhibit high sublimation temperatures, which may be one of those approaching or exceeding the decomposition temperature of such compound. It may be assumed that cyclophosphonitrile compounds with substantially low molar masses (including, but not limited to, not exceeding about 3,000 g / mol) may tend to exhibit substantially low melting points, which may result in such compounds being in liquid or semi-solid form at approximately normal temperatures and pressures, which in some non-limiting examples may correspond to a temperature of 20 °C and a pressure of 1 atm. Compounds exhibiting substantially low melting points may have substantially reduced applicability for certain applications requiring substantially high temperature stability. In some non-limiting examples, compounds in semi-solid (including, but not limited to, liquid) form at approximately normal temperatures and pressures may have substantially reduced applicability for certain applications where materials in solid form under such conditions are required.

[0361] In some non-limiting examples, the percentage of the molar weight of such linked cyclophosphonitrile compounds (including, but not limited to, those of the patterned material 411) attributable to F atoms may be one of about 40%-90%, 45%-85%, 50%-80%, 55%-75%, and 60%-70%. In some non-limiting examples, F atoms may constitute the majority of the molar weight of such compound.

[0362] In some non-limiting examples, the percentage of the molar weight of such connected cyclophosphonitrile compounds (including but not limited to) of at least one patterned material 411 attributable to a plurality of cyclophosphonitrile moiety functional groups may be at least one of about 30%, 40%, 50%, 60% and 70%.

[0363] In some non-limiting examples, the percentage of molar weight of such linked cyclophosphonitrile compounds (including but not limited to) of at least one patterned material 411 attributable to multiple cyclophosphonitrile moiety functional groups may not exceed about 80%, 85%, and 90%.

[0364] In some non-limiting examples, the percentage of molar weight attributable to the fluorocarbon compound portion of such linked cyclophosphamide compounds (including, but not limited to, those of the patterned material 411) of at least one of about 50%, 60%, 65%, 70%, 75%, 80%, and 85%. In some non-limiting examples, the fluorocarbon compound portion may constitute the majority of the molar weight of such compound. In some non-limiting examples, the fluorocarbon compound portion may be the portion primarily constituting F and C atoms. In some non-limiting examples, such fluorocarbon compound portions may include those comprising at least one of CF, CF2, CF3, and CF2H units.

[0365] Fluorine and silicon In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may include at least one of F atoms and Si atoms. In some non-limiting examples, the patterned material 411 used to form the patterned coating 110 may be a compound containing at least one of F and Si.

[0366] In some non-limiting examples, patterning material 411 may include compounds that may contain F. In some non-limiting examples, patterning material 411 may include compounds that may contain both F and C atoms. In some non-limiting examples, patterning material 411 may include compounds that may contain both F and C, wherein the atomic ratio of F to C corresponds to an F / C quotient of at least one of about 1.3, 1.5, 1.7, and 2. In some non-limiting examples, the atomic ratio of F to C may be determined by counting all F atoms present in the compound structure, and for C atoms, only counting sp atoms present in the compound structure. 3 The hybrid C atoms are counted. In some non-limiting examples, the patterned material 411 may include a compound that may include F and C portions as part of its molecular substructure, wherein the atomic ratio of F to C corresponds to an F / C quotient of no more than one of about 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, 5.0, 5.5, 6.0, 6.5 and 7.0.

[0367] Initial adhesion probability In some non-limiting examples, the initial adhesion probability of the patterned material 411 can be determined by depositing such material as at least one of a film or coating, and in an environment similar to the deposition of the patterned coating 110 within the device 100, having a sufficient thickness to mitigate / reduce any effect on the degree of intermolecular interaction with the underlying layer 710 when deposited on the surface. In some non-limiting examples, the initial adhesion probability can be measured on films / coatings with thicknesses of at least about 20 nm, 25 nm, 30 nm, 50 nm, 60 nm, and 100 nm.

[0368] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an initial adhesion probability to the deposition of the deposited material 531 of no more than one of about 0.3, 0.2, 0.15, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, 0.001, 0.0008, 0.0005, 0.0003, and 0.0001.

[0369] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an initial adhesion probability for the deposition of at least one of Ag and Mg, not exceeding one of about 0.3, 0.2, 0.15, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, 0.001, 0.0008, 0.0005, 0.0003, and 0.0001.

[0370] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a strength of about 0.15-0.0001, 0.1-0.0003, 0.08-0.0005, or 0.08-0.0008. 0.05-0.001, 0.03-0.0001, 0.03-0.0003, 0.03-0.0005, 0.03-0.0008, 0.03-0.001, 0.03-0.005, 0.03-0.008, 0.03-0.01, 0.02-0.0001, 0.02-0.0003, 0.02-0.0005, 0.02-0.0 008, 0.02-0.001, 0.02-0.005, 0.02-0.008, 0.02-0.01, 0.01-0.0001, 0.01-0.0003, 0.01-0.0005, 0.01-0.0008, 0.01-0.001, 0.01-0.005, 0.01-0.008, 0.008-0.0001, 0.008- The initial adhesion probability of the deposition of the deposition material 531 is one of the following values: 0.0003, 0.008-0.0005, 0.008-0.0008, 0.008-0.001, 0.008-0.005, 0.005-0.0001, 0.005-0.0003, 0.005-0.0005, 0.005-0.0008, and 0.005-0.001.

[0371] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an initial adhesion probability for the deposition of the plurality of deposited materials 531 not exceeding a threshold. In some non-limiting examples, such a threshold may be one of about 0.3, 0.2, 0.18, 0.15, 0.13, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, and 0.001.

[0372] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an initial adhesion probability of no more than such a threshold for the deposition of a plurality of deposition materials 531 selected from at least one of Ag, Mg, Yb, Cd, and Zn. In some non-limiting examples, the patterned coating 110 may exhibit an initial adhesion probability of no more than such a threshold for the deposition of a plurality of deposition materials 531 selected from at least one of Ag, Mg, and Yb.

[0373] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may exhibit an initial adhesion probability for the deposition of the first deposited material 531 equal to, but not limited to, a first threshold, and an initial adhesion probability for the deposition of the second deposited material 531 equal to, but not limited to, a second threshold, lower than a second threshold. In some non-limiting examples, the first deposited material 531 may be Ag, and the second deposited material 531 may be Mg. In some non-limiting examples, the first deposited material 531 may be Ag, and the second deposited material may be Yb. In some non-limiting examples, the first deposited material 531 may be Yb, and the second deposited material 531 may be Mg. In some non-limiting examples, the first threshold may exceed the second threshold.

[0374] In some non-limiting examples, there may be a scenario where a patterned coating 110 is required to induce the formation of at least one discontinuous layer 160 of a particulate structure 150 when the patterned coating 110 is subjected to an evaporation flux 532 of the deposited material 531. In some non-limiting examples, the patterned coating 110 may exhibit a substantially low initial adhesion probability, such that a closed coating 140 of the deposited material 531 may be formed in a second portion 102, which may be substantially free of the patterned coating 110, while a discontinuous layer 160 of at least one particulate structure 150 having at least one characteristic may be formed on the patterned coating 110 in the first portion 101. In some non-limiting examples, the following scenario may exist: a discontinuous layer 160 of at least one particulate structure 150 of deposited material 531 needs to be formed in the first portion 101 (in some non-limiting examples, the deposited material may be one of metal and metal alloy), while a sealing coating 140 having a thickness of, for example, no more than one of about 100 nm, 50 nm, 25 nm, and 15 nm is deposited in the second portion 102. In some non-limiting examples, the amount of deposited material 531 deposited as the discontinuous layer 160 of at least one particulate structure 150 in the first portion 101 may correspond to one of about 1%-50%, 2-25%, 5-20%, and 7-10% of the amount of deposited material 531 deposited as the sealing coating 140 in the second portion 102, and in some non-limiting examples, the sealing coating may correspond to a thickness of no more than one of about 100 nm, 75 nm, 50 nm, 25 nm, and 15 nm.

[0375] In some non-limiting examples, there may be a positive correlation between the initial adhesion probability of the deposition of the deposited material 531 to at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) and the average layer thickness of the deposited material 531 thereon.

[0376] transmittance In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a transmittance of at least a threshold transmittance value for EM radiation after being subjected to an evaporation flux 532 of the deposited material 531, including but not limited to Ag.

[0377] In some non-limiting examples, this transmittance can be measured under typical conditions suitable for depositing electrodes of optoelectronic device 200 (in some non-limiting examples, which may be the cathode of organic light-emitting diode (OLED) device 200) after exposing the exposed layer surface 11 of at least one of the patterned coating 110 and patterned material 411 formed as a thin film to an evaporation flux 532 of deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)).

[0378] In some non-limiting examples, conditions under which the exposed layer surface 11 is subjected to an evaporation flux 532 of the deposited material 531 (including, but not limited to, at least one of metals and alloys, including, but not limited to, at least one of Yb, Ag, Mg and Ag-containing materials (including, but not limited to, MgAg)) may include: maintaining a vacuum pressure at a reference pressure, including, but not limited to, about 10 -4 To and 10 -5 One of the deposited materials 531; the evaporation flux 532 of the deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)) is substantially consistent with a reference deposition rate, including but not limited to about 1 Å / s, which may be monitored using a QCM in some non-limiting examples; the evaporation flux 532 of the deposited material 531 is directed to the exposed layer surface 11 at an angle substantially close to perpendicular to the plane of the exposed layer surface 11; the exposed layer surface 11 is subjected to the deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)) evaporation flux 532, until a reference average layer thickness of including but not limited to about 15 nm is reached; and when such a reference average layer thickness is reached, the exposed layer surface 11 is not further subjected to the evaporation flux of the deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)).

[0379] In some non-limiting examples, the exposed layer surface 11 subjected to an evaporation flux 532 of the deposited material 531 (including but not limited to at least one of Yb, Ag, Mg, and Ag-containing materials (including but not limited to MgAg)) may be substantially at room temperature (including but not limited to about 25°C). In some non-limiting examples, the exposed layer surface 11 subjected to an evaporation flux 532 of the deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg, and Ag-containing materials (including but not limited to MgAg)) may be positioned about 65 cm away from the evaporation source, through which the deposited material 531 (including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg, and Ag-containing materials (including but not limited to MgAg)) evaporates.

[0380] In some non-limiting examples, the threshold transmittance value can be measured at a wavelength in the visible spectrum, which may be at least about 460 nm, 500 nm, 550 nm, and 600 nm. In some non-limiting examples, the threshold transmittance value can be measured at a wavelength in at least one of the IR and NIR spectra. In some non-limiting examples, the threshold transmittance value can be measured at a wavelength, which may be about 700 nm, 900 nm, and 1000 nm. In some non-limiting examples, the threshold transmittance value may be expressed as a percentage of the incident EM power that can be transmitted through the sample. In some non-limiting examples, the threshold transmittance value may be at least about 60%, 65%, 70%, 75%, 80%, 85%, and 90%.

[0381] Those skilled in the art will understand that high transmittance generally indicates the absence of a sealing coating 140 containing deposited material 531 (including, but not limited to, at least one of Yb, Ag, Mg, and Ag-containing materials (including, but not limited to, MgAg)). On the other hand, low transmittance generally indicates the presence of a sealing coating 140 containing deposited material 531 (including, but not limited to, Yb, Ag, Mg, and Ag-containing materials (including, but not limited to, MgAg)) because the metal film (especially when formed as a sealing coating 140) can exhibit high absorption of EM radiation.

[0382] A series of samples were manufactured to measure the transmittance of the example material and to visually observe whether an Ag-sealing coating 140 was formed on the exposed surface 11 of the example material.

[0383] The molecular structures of the example materials used in the samples in this article are listed in Table 2 below: Table 2

[0384] Those skilled in the art will understand that a sample having little to no deposited material 531 (including, but not limited to, at least one of metals and alloys, including, but not limited to, at least one of Yb, Ag, Mg, and Ag-containing materials (including, but not limited to, MgAg)) can be substantially transparent, while a sample having a large amount of at least one of metals and alloys deposited thereon (including, but not limited to, as a sealing coating 140) can exhibit significantly reduced transmittance in some non-limiting examples. Therefore, the performance of various exemplary coatings as patterned coating 110 can be evaluated by measuring the transmittance through the sample, which can be negatively correlated with at least one of the amount of deposited material 531 deposited thereon and the average layer thickness, including, but not limited to, at least one of metals and alloys, including, but not limited to, in the form of at least one of Yb, Ag, Mg, and Ag-containing materials (including, but not limited to, MgAg), because metal films (including, but not limited to, when formed as sealing coating 140) can exhibit high absorption of EM radiation.

[0385] Specifically, in order to compare the performance of the patterned coating 110 containing various exemplary materials, the following experiments were conducted.

[0386] Experiment 1 A series of samples were fabricated by vacuum deposition of a nucleating modification material layer approximately 30 nm thick over a glass substrate 10. The nucleating modification material varied between samples. For each sample, an open-mask deposition of a deposition material 531 containing Yb:LiF (1:1 (volume:volume)) was then performed on the exposed surface 11 of the thus formed nucleating modification coating at a rate of approximately 1 Å / s until a reference thickness of approximately 1.5 nm was achieved, followed by an open-mask deposition of a deposition material containing MgAg (Mg:Ag = 1:9 (volume:volume)) until a reference thickness of approximately 15 nm was achieved. Once the samples were fabricated, EM transmittance measurements were performed to determine the relative amounts of deposited material deposited on the exposed surface 11 of the patterned coating 110. Those skilled in the art will understand that samples with little or no metal present can be substantially transparent, while samples with metal deposited on them (especially as a sealing coating) can typically exhibit substantially low transmittance.

[0387] The transmittance at wavelengths of 450 nm, 520 nm, and 850 nm was measured after each sample was subjected to an evaporation flux of 532 for Yb:LiF and MgAg, and the results are summarized in Table 3. Table 3

[0388] The reduction in EM transmittance at wavelengths of 450 nm, 520 nm, and 850 nm after each sample was subjected to an evaporation flux of 532 for Yb:LiF and MgAg is summarized in Table 4. The reduction in EM transmittance was determined by measuring the EM transmittance through each sample and comparing that transmittance with that of a reference sample in which no Yb:LiF and MgAg exposure to the evaporation flux of 532 occurred.

[0389] Table 4

[0390] As can be seen from the results in Tables 3 and 4, it has been found that, in some non-limiting examples, nucleating modified materials comprising a first cyclophosphamide moiety, a second cyclophosphamide moiety, and a linker portion bonded to the first and second cyclophosphamide moiety can exhibit different EM transmittance characteristics. In some non-limiting examples, nucleating modified materials comprising a first cyclophosphamide moiety, a second cyclophosphamide moiety, and a linker portion bonded to the first and second cyclophosphamide moiety (including, but not limited to, EM-20 to EM-24, EM-25 to EM-28, EM-44, EM-46 to EM-55, and EM-57 to EM-62) can exhibit EM transmittance characteristics at least equal to those of nucleating modified materials (including, but not limited to, EM-11) that substantially lack at least one of the first cyclophosphamide moiety, the second cyclophosphamide moiety, and the linker portion.

[0391] As can be seen from the results in Tables 3 and 4, it has now been found that, in some non-limiting examples, nucleating modified materials comprising a core portion, a first ligand portion, and a second ligand portion can exhibit different EM transmittance characteristics. In some non-limiting examples, nucleating modified materials comprising a core portion, a first ligand portion, and a second ligand portion (including but not limited to EM-18, EM-75 to EM-79, and EM-81 to EM-83) can exhibit EM transmittance characteristics at at least one of wavelengths of about 450 nm, 520 nm, and 850 nm, which are at least substantially free of the EM transmittance characteristics of nucleating modified materials containing at least one of the following: a core portion, a first ligand portion, and a second ligand portion, including but not limited to EM-4, EM-11, and EM-12. In some non-limiting examples, it has been found that the transmittance of the patterned coating 110 formed by EM-23 is substantially similar to that of EM-11 at at least one of wavelengths of about 450 nm, 520 nm, and 850 nm, and it has been found that the transmittance of the patterned coating 110 formed by one of EM-20, EM-21, EM-22, EM-25, EM-26, EM-27, EM-28, EM-44, EM-46 to EM-55, and EM-57 to EM-62 is at least the transmittance of EM-11 at at least one of wavelengths of about 450 nm, 520 nm, and 850 nm. In some non-limiting examples, it has been found that these samples exhibit a significantly increased transmittance at a wavelength of about 850 nm compared to the transmittance at a wavelength of about 450 nm. Without wishing to be bound by any particular theory, it can be assumed that nucleating modified materials containing a first cyclophosphonitrile moiety and a second cyclophosphonitrile moiety are applicable in at least some scenarios requiring substantially high transmittance.

[0392] Experiment 2 A series of samples were fabricated by vacuum deposition of a nucleating modification material layer approximately 30 nm thick over a glass substrate. The nucleating modification material varied between samples. For each sample, an open-mask deposition of a deposition material 531 containing Ag was then performed on the exposed surface 11 of the thus formed nucleating modification coating at a rate of approximately 1 Å / s until a reference thickness of approximately 15 nm was obtained. Once the samples were fabricated, EM transmittance measurements were performed to determine the relative amount of deposited material deposited on the exposed surface 11 of the patterned coating 110. Those skilled in the art will understand that samples with little or no metal present can be substantially transparent, while samples with metal deposited on them (especially as a sealing coating) can generally exhibit substantially low transmittance.

[0393] Table 5 below shows the measured transmittance at wavelengths of 450 nm, 520 nm, and 850 nm after each sample was subjected to an evaporation flux of 532 Ag.

[0394] Table 5

[0395] As can be seen from the results in Table 5, it has now been found that, in some non-limiting examples, nucleating modified materials comprising a core portion, a first ligand portion, and a second ligand portion can exhibit different EM transmittance characteristics. In some non-limiting examples, nucleating modified materials comprising a core portion, a first ligand portion, and a second ligand portion (including but not limited to EM-19 and EM-64 to EM-74) can exhibit EM transmittance characteristics at at least one of wavelengths of about 450 nm, 520 nm, and 850 nm, which are at least substantially free of the EM transmittance characteristics of nucleating modified materials containing at least one of the following: a core portion, a first ligand portion, and a second ligand portion, including but not limited to EM-13.

[0396] Synthesis Examples Synthesis of EM-11 In a 2.0 L round-bottom flask equipped with a stir bar, 12.8 g of NaOH was placed in 20 mL of deionized (DI) water and suspended in 500 mL of toluene. 145.1 g of 1H,1H,9H-hexadecylfluoro-1-nonanol was added, and the suspension was heated at 95 °C under a continuous nitrogen (N2) stream for a total of 4 hours. During this period, the solid broke apart.

[0397] The temperature was adjusted to 85°C, and a water condenser was attached to the flask under a N2 atmosphere. 13.92 g of hexachlorocyclotriphosphazene dissolved in 100 mL of anhydrous tetrahydrofuran (THF) under N2 was added to the reaction mixture via a tubing. The reaction mixture was stirred at 85°C for 2 hours, and then stirred at room temperature for 48 hours.

[0398] The reaction was quenched by adding 200 mL of water and filtered under vacuum through a filter funnel (pore size: approximately 10–20 μm). The collected solid was washed with water (3 × 1 L), isopropanol (1 L), and dichloromethane (DCM, 1 L). 95.2 g of white solid was collected and identified as sample EM-11. Sample EM-11 was further purified by vacuum sublimation.

[0399] Synthesis of EM-19 1H,1H,11H-perfluoroundecane-1-ol (40 mmol, 21.28 g) and 1H,1H,9H-hexadecfluoro-1-nonanol (40 mmol, 17.28 g) were placed in a 1.0 L round-bottom flask equipped with a stir bar. 500 mL of anhydrous THF was then added to form a mixture, which was purged under argon. Subsequently, NaH (1.8 g, 75 mmol) was added to the reaction at room temperature, and the reaction was stirred for 3 hours.

[0400] Octachlorocyclotriphosphazene (8.9 mmol, 4.1 g) was added to the reaction at room temperature, and the reaction was stirred for approximately 36 hours. The mixture was filtered, and the solvent was evaporated using a rotary evaporator. The remaining solid was dissolved in acetone (approximately 20 mL), and water (approximately 500 mL) was added to the solution to precipitate the solid. The mixture was filtered directly to obtain the solid, which was then washed with water (2 x 300 mL), isopropanol (1 x 300 mL), and DCM (2 x 300 mL). The dried solid was then sublimated under vacuum to give the product.

[0401] Synthesis of EM-20 Sample EM-20 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0402] I. IM-11-OH The formation In a 1.0 L round-bottom flask equipped with a stir bar and a water condenser, 50 g of EM-11 was dissolved in 250 mL of acetone. Then, 25 mL of DI water was added to the flask, yielding a clear solution. The reaction mixture was heated to 80 °C, and then NaOH was added. The reaction mixture was stirred continuously for 48 hours, and then 300 mL of water was added to the reaction mixture. Acetone was removed from the mixture using a rotary evaporator. The mixture was then acidified with concentrated HCl and stirred for 2 hours. A brown solid was obtained by filtering the mixture through a Buchner funnel. The solid was washed with acetone / DCM (1:1, 3 × 100 mL / 100 mL) and then dried to give IM-11-OH.

[0403] II. IM-11-Cl The formation 26 g of IM-11-OH suspended in 200 mL of toluene was placed in a 1.0 L round-bottom flask equipped with a stir bar and a water condenser. 10 mL of SOCl2 was added, and 50 μL of N,N-dimethylformamide (DMF) was slowly added to the round-bottom flask. The suspension was then heated at 110 °C and stirred for 18 hours. The product obtained upon solvent evaporation was IM-11-Cl(2-chloro-2,4,4,6,6-pentapenta((2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9-hexadecylfluorononyl)oxy)-2λ 5 ,4λ 5 ,6λ 5 -triazine triphosphine).

[0404] III. EM-20 The formation A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous argon (Ar) stream. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 250 mL, added via a plastic syringe with an oven-dried 12' needle), hydroquinone (946.0 mg, 8.6 mmol, 0.5 equivalent), and IM-11-Cl (40.0 g, 17.2 mmol, 1.0 equivalent) were added to the round-bottom flask to form a suspension. The round-bottom flask was sealed with a diaphragm and placed in an oil bath (60 °C), and the suspension was stirred at 60 °C under Ar for 5 minutes. The diaphragm was briefly removed from the flask to introduce K₂CO₃ (anhydrous, 2.6 g, 18.9 mmol, 1.1 equivalent). The suspension was stirred overnight under Ar at 60 °C, and the reaction was monitored by NMR. After the reaction was complete, the suspension was filtered through a glass filter, which was then washed with acetone (2 × 200 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure to obtain an oil. This oil was milled overnight at room temperature in a 1:1 (v / v) mixture of 2-propanol (250 mL) and DCM (250 mL) to form a suspension. The next day, the suspension was filtered through a glass filter. The obtained solid was washed with DCM (2 × 200 mL) and air-dried to give a white solid. Yield: 23.5 g, 58%. The solid was further purified by sublimation.

[0405] 1 H NMR (400.2MHz, THF-d8): δ 7.31 (s, 4H), 6.84 (t, J HF = 51.5Hz, 10H), 4.71 – 4.58 (m, 12H), 4.43 – 4.31 (m, 8H). 19 F NMR (376.5MHz, THF-d8): δ -121.23 (s), -122.74 (s), -123.78 (s), -124.13 (s), -130.28 (s), -130.36 (s), -139.18 (d, J FH = 52.7Hz). 31 P NMR (162.0MHz, THF-d8): δ 17.06 (d, J PP = 91.9Hz), 13.30 (t, J PP = 91.9Hz). ESI-MS: m / z Measured value: 4688.8; Calculated value (C)96 H 34 F 160 N6O 12 P6+H): 4688.8.

[0406] Synthesis of EM-21 Sample EM-21 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0407] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0408] Synthesized according to the above procedure.

[0409] A 200 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous flow of Ar. Under a static Ar atmosphere, a stir bar, 40 mL of anhydrous THF (added via a plastic syringe with an oven-dried 12' needle), and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) were added to the round-bottom flask. The flask was cooled to 0 °C in an ice bath, and the mixture was stirred for 5 minutes. Then, NaH (60%, 95.0 mg, 2.4 mmol, 1.1 equivalent) was added through the neck of the flask, and the mixture was stirred for another 30 minutes. The flask was then fitted with an oven-dried reflux condenser, which was cooled separately under Ar. The reflux condenser was briefly removed, and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) was introduced. The condenser was returned, and the reactants were refluxed at 70 °C under Ar for 1 week. One week later, the obtained yellow emulsion was filtered through a glass filter to obtain a pale yellow solid. This solid was then washed with 2 × 100 mL of 10% MeOH aqueous solution, 1 × 100 mL of 10% MeOH DCM solution, and 1 × 100 mL of DCM. The resulting white solid was dried overnight under high-power vacuum, allowing the product to separate as a white powder. Yield: 8.5 g, 86%. The solid was further purified by sublimation.

[0410] 1 H NMR (400.2MHz, THF-d8): δ 6.81 – 6.41 (t, J HF = 50.0Hz, 10H), 4.80 –4.50 (m, 20H). 19F NMR (376.5MHz, THF-d8): δ -121.19 (s), -122.29 (s) -122.73(s), -122.76 (s), -123.70 (s), -122.78 (s), -124.13 (s), -130.32 (s), -139.15(d, J FF = 52.7Hz). 31 P NMR (162.0MHz, THF-d8): δ 16.2 (d, J PP = 102.1Hz), 13.4 (t, J PP = 102.1Hz). ESI-MS: m / z Measured value: 4596.8; Calculated value (C) 90 H 30 F 160 N6O 11 P6): 4596.8.

[0411] Synthesis of EM-22 Sample EM-22 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0412] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0413] A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous Ar stream. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 38 mL, added via a plastic syringe with an oven-dried 12' needle), 2,3-dimethylhydroquinone (150.0 mg, 1.1 mmol, 0.5 equivalent), and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) were added to the round-bottom flask to form a suspension. The flask was sealed with a diaphragm and placed in an oil bath (60 °C), and the orange suspension was stirred at 60 °C under Ar for 5 minutes. The diaphragm was briefly removed from the flask to introduce K₂CO₃ (anhydrous, 326.0 mg, 2.4 mmol, 1.1 equivalent). The suspension was stirred overnight under Ar at 60 °C. The next day, the suspension was filtered through a glass filter, and the glass filter was then washed with acetone (3 × 25 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure to obtain an orange oil. The orange oil was milled overnight at room temperature in 2-propanol (40 mL) and DCM (80 mL). The next day, the orange suspension was filtered through a glass filter. The resulting white solid was washed with a 2:1 (v / v) solution of DCM:2-propanol (2 × 50 mL) and DCM (2 × 50 mL) and air-dried to obtain a white solid. Yield: 1.2 g, 24%. The solid was further purified by sublimation.

[0414] 1 ¹H NMR (400.2 MHz, acetone-d6): δ 7.25 (s, 2H), 6.84 (t, 2H). J HF = 51.0Hz, 10H), 4.90 – 4.65 (m, 12H), 4.47 – 4.25 (m, 8H), 2.34 (s, 6H). 19 F NMR (376.5 MHz, acetone-d6): δ -121.1 (s), -122.7 (s), -123.6 (s), -124.0 (s), -130.22 (s), -139.2 (d, J FF = 52.7Hz). 31 P NMR (162.0 MHz, acetone-d6): δ 17.0 (d, J PP = 92.3Hz), 13.4 (t, J PP =92.3Hz). ESI-MS: m / z Measured value: 4717.8; Calculated value (C) 98 H38 F 160 N6O 12 P6+H): 4717.9.

[0415] Synthesis of EM-23 Sample EM-23 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0416] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0417] A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous flow of Ar. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 35 mL, added via a plastic syringe with an oven-dried 12' needle), tetrafluorohydroquinone (195.7 mg, 1.1 mmol, 0.5 equivalent), IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent), and K₂CO₃ (anhydrous, 331.0 mg, 2.4 mmol, 1.1 equivalent) were added to the round-bottom flask. The suspension in the flask was stirred overnight at room temperature under Ar. The next day, the suspension was filtered through a glass filter, and the glass filter was then washed with acetone (2 × 100 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure to obtain a solid. The solid was milled for 1 hour at room temperature in a 1:2 (volume / volume) mixture of 2-propanol (100 mL) and DCM (200 mL) to form a suspension, which was then filtered through a glass filter. The obtained solid was washed with DCM (2 × 100 mL) and air-dried to obtain the solid. Yield: 2.7 g, 53%. The solid was further purified by sublimation.

[0418] 1 H NMR (400.2MHz, THF-d8): δ 6.65 (t, J HF = 51.0Hz, 10H), 4.78 (m, 4H), 4.63 (m, 16H). 19 F NMR (376.5MHz, THF-d8): δ -121.23 (s), -121.55 (s), -122.76(s), -123.79 (s), -123.93 (s), -124.13 (s), -130.34 (s), -139.18 (d, J FH=51.2Hz), -154.76 (s). 31 P NMR (162.0MHz, THF-d8): δ 16.75 -14.28 (m). ESI-MS: m / z Measured value: 4760.74; Calculated value (C) 96 H 30 F 164 N6O 12 P6+H): 4760.78.

[0419] Synthesis of EM-25 Sample EM-25 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0420] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0421] A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous flow of Ar. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 38 mL, added via a plastic syringe with an oven-dried 12' needle), 2,5-dichloroquinone (192.0 mg, 1.1 mmol, 0.5 equivalent), and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) were added to the round-bottom flask to form a yellow suspension. The round-bottom flask was sealed with a diaphragm and placed in an oil bath (60 °C), and the suspension was stirred at 60 °C for 5 minutes. The diaphragm was briefly removed from the flask to introduce K₂CO₃ (anhydrous, 327.0 mg, 2.4 mmol, 1.1 equivalent). The suspension was stirred overnight under Ar at 60 °C. The next day, the suspension was filtered through a glass filter, and the glass filter was then washed with acetone (2 × 50 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure to obtain the residue. The residue was milled in 2-propanol (50 mL) at room temperature for 1 hour, and then filtered through a glass filter. The obtained solid was first washed with 2-propanol (2 × 50 mL) and DCM (2 × 50 mL), then milled in a 1:2 (v / v) mixture of 2-propanol (10 mL) and acetone (20 mL), and finally filtered through a glass filter and washed with acetone (2 × 10 mL). The filtrate and washings were reduced under reduced pressure to about 10 mL, and then DCM (10 mL) was added to obtain a mixture. The mixture was filtered through a glass filter, the separated solid was washed with DCM (2 × 20 mL) and dried under high vacuum for 2 hours to give a grayish-white solid product. Yield: 1.5 g, 30%. The solid was further purified by sublimation.

[0422] 1 ¹H NMR (400.2 MHz, acetone-d6): δ 7.68 (s, 2H), 6.84 (t, 2H). J HF = 51.0Hz, 10H), 4.89 (q, J = 12.0Hz, 4H), 4.76 (t, J = 12.0Hz, 8H), 4.62 (t, J = 12.0Hz, 8H). 19 F{ 1 H decoupled NMR (376.5MHz, acetone-d6): δ -121.01 (s), -122.69 (s), -123.61 (s), -123.99 (s), -130.18 (s), -139.21 (s). 31P NMR (162.0 MHz, acetone-d6): δ 16.73 (d, J PP = 94.0Hz), 13.48 (t, J PP = 94.0Hz). ESI-MS: m / z Measured value: 4756.7; Calculated value (C) 96 H 32 Cl2F 160 N6O 12 P6+ H): 4756.7.

[0423] Synthesis of EM-26 Sample EM-26 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0424] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0425] A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous Ar stream. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 38 mL, added via a plastic syringe with an oven-dried 12' needle), resorcinol (118.0 mg, 1.1 mmol, 0.5 equivalent), and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) were added to the round-bottom flask to form a suspension. The round-bottom flask was sealed with a diaphragm and placed in an oil bath (60 °C), and the suspension was stirred at 60 °C under Ar for 5 minutes. The diaphragm was briefly removed from the flask to introduce K₂CO₃ (anhydrous, 327.0 mg, 2.4 mmol, 1.1 equivalent). The suspension was stirred overnight under Ar at 60 °C. The next day, the suspension was filtered through a glass frit filter, and the frit was then washed with acetone (2 × 100 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure to obtain a residue. The residue was milled in 100 mL of 2-propanol at room temperature for 1 hour, and then filtered through a glass filter. The obtained solid was washed with 2-propanol (2 × 50 mL) and DCM (2 × 50 mL), and then air-dried to give the product as a white solid. Yield: 1.9 g, 38%. The white solid was further purified by sublimation.

[0426] 1 ¹H NMR (400.2 MHz, acetone-d6): δ 7.48 (s, 1H), 7.31 (s, 3H), 6.85 (t, 1H).J HF =52.0Hz, 10H), 4.72 (m, 12H), 4.48 (m, 8H). 19 F{ 1 H decoupled NMR (376.5MHz, acetone-d6): δ -121.02 (s), -122.71 (br s), -123.57 (s), -123.64 (s), -123.99 (s), -130.17 (s), -139.21 (s). 31 P NMR (162.0 MHz, acetone-d6): δ 17.03 (d, J PP = 92.3Hz), 13.23 (t, J PP = 92.3Hz). ESI-MS: m / z Measured value: 4688.8, calculated value (C) 96 H 34 F 160 N6O 12 P6+H): 4688.8; 4726.8, calculated value (C) 96 H 34 F 160 N6O 12 P6+ K): 4726.8.

[0427] Synthesis of EM-27 Sample EM-27 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-CL, as outlined in the following scheme:

[0428] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0429] A 150 mL round-bottom flask was dried overnight in an oven at 110 °C and cooled to room temperature under a continuous flow of Ar. Under a static Ar atmosphere, a stir bar, acetonitrile (anhydrous, 38 mL, added via a plastic syringe with an oven-dried 12' needle), catechol (118.0 mg, 1.1 mmol, 0.5 equivalent), and IM-11-Cl (5.0 g, 2.2 mmol, 1.0 equivalent) were added to the round-bottom flask to form a yellow suspension. The round-bottom flask was sealed with a diaphragm and placed in an oil bath (60 °C), and the yellow suspension was stirred at 60 °C for 5 minutes. The diaphragm was briefly removed to introduce K₂CO₃ (anhydrous, 327.0 mg, 2.4 mmol, 1.1 equivalent). The suspension was stirred overnight under Ar at 60 °C. The next day, the suspension was filtered through a glass filter, and the glass filter was then washed with acetone (2 × 100 mL). The filtrate and washings were combined, and the solvent was removed under reduced pressure. The residue was milled in 2-propanol (20 mL) at room temperature for 1 hour. The resulting mixture was filtered through a glass filter. The obtained solid was washed with a 1:1 (v / v) mixture of DCM:2-propanol (2 × 20 mL) and DCM (2 × 20 mL), and then air-dried to give an off-white solid. Yield: 1.6 g, 32%. The solid was further purified by sublimation.

[0430] 1 ¹H NMR (400.2 MHz, acetone-d6): δ 7.53 (s, 2H), 7.33 (s, 2H), 6.81 (t, 2H). J HF =52.0Hz, 10H), 4.90 (brs, 4H), 4.70 (brs, 8H), 4.43 (brs, 8H). 19 F { 1 H decoupled NMR (376.5 MHz, acetone-d6): δ -120.82 (s), -121.00 (s), -121.11 (s), -122.68 (brs), -123.51 (s), 123.69 (s), -123.99 (s), -130.20 (s), -139.20 (s). 31 P NMR (162.0 MHz, acetone-d6): δ 16.95 (d, J PP = 92.3Hz), 13.67 (t, J PP = 91.5Hz). ESI-MS: m / z Measured value: 4688.8, calculated value (C) 96 H34 F 160 N6O 12 P6+H): 4688.8; 4726.8, calculated value (C) 96 H 34 F 160 N6O 12 P6+K): 4726.8.

[0431] Synthesis of EM-28 Sample EM-28 was synthesized from sample EM-11 via a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0432] IM-11-OH and IM-11-Cl were synthesized according to the above procedure.

[0433] 1,4-Dihydroxynaphthalene (0.66 g, 4.12 mmol, 1.0 equivalent) and IM-11-Cl (10 g, 4.4 mmol, 1.0 equivalent) were added to a 500 mL round-bottom flask equipped with a stir bar and placed under Ar. Then, anhydrous acetonitrile (120 mL) was added under Ar using a metal syringe. The mixture was heated at 60 °C, and then K₂CO₃ (1.2 g, 8.6 mmol, 2.0 equivalent) was added to the reaction mixture. The reaction mixture was heated under Ar at 60 °C overnight. Approximately 300 mL of water was added to the reaction mixture, and then the mixture was filtered. The collected solids were washed with water, IPA, and subsequently with DCM to give the product.

[0434] Synthesis of EM-18, EM-70, EM-71, EM-72, EM-75, EM-77 and EM-78 Each of these compounds was synthesized from sample EM-11 using a three-step process involving the formation of two reaction intermediates: IM-11-OH and IM-11-Cl, as outlined in the following scheme:

[0435] I. Synthesized from hexachlorocyclic triphosphazene EM-11 In a 2.0 L round-bottom flask equipped with a stir bar, 12.8 g of NaOH was placed in 20 mL of deionized (DI) water and suspended in 500 mL of toluene. 145.1 g of 1H,1H,9H-hexadecylfluoro-1-nonanol was added, and the suspension was heated at 95 °C under a continuous nitrogen (N2) stream for a total of 4 hours. During this period, the solid broke apart.

[0436] The temperature was adjusted to 85°C, and a water condenser was attached to the flask under a nitrogen atmosphere. 13.92 g of hexachlorocyclotriphosphazene dissolved in 100 mL of anhydrous tetrahydrofuran (THF) under nitrogen was added to the reaction mixture via a tubing. The reaction mixture was stirred at 85°C for 2 hours, and then stirred at room temperature for 48 hours.

[0437] The reaction was quenched by adding 200 mL of water and filtered under vacuum through a filter funnel (pore size: approximately 10–20 μm). The collected solid was washed with water (3 × 1 L), isopropanol (1 L), and dichloromethane (DCM, 1 L). 95.2 g of white solid was collected and identified as sample EM-11. Sample EM-11 was further purified by vacuum sublimation.

[0438] II. IM-11-OH The formation In a 1.0 L round-bottom flask equipped with a stir bar and a water condenser, 50 g of EM-11 was dissolved in 250 mL of acetone. Then, 25 mL of DI water was added to the flask, yielding a clear solution. The reaction mixture was heated to 80 °C, and then NaOH was added. The reaction mixture was stirred continuously for 48 hours, and then 300 mL of water was added to the reaction mixture. Acetone was removed from the mixture using a rotary evaporator. The mixture was then acidified with concentrated HCl and stirred for 2 hours. The mixture was filtered under vacuum using a medium filter to obtain a brown solid. The solid was washed with acetone / DCM (1:1, 3 × 100 mL / 100 mL) and then dried to give IM-11-OH.

[0439] II. IM-11-Cl The formation 26 g of IM-11-OH suspended in 200 mL of toluene was placed in a 1.0 L round-bottom flask equipped with a stir bar and a water condenser. 10 mL of SOCl2 was added, and 50 μL of N,N-dimethylformamide (DMF) was slowly added to the round-bottom flask. The suspension was then heated at 110 °C and stirred for 18 hours. The product obtained after evaporating the solvent was IM-11-Cl.

[0440] III. Formation of the final product Using a syringe, add the solvent and R2-OH to a dry 250 mL round-bottom flask equipped with a stir bar, argon balloon, and diaphragm. Cool the reaction flask to 0°C in an ice bath and add the base. Stir the mixture overnight or until gas escape stops. Then add IM-11-Cl to the mixture while maintaining the reaction temperature at 0°C. Stir the reaction overnight or until the reaction is complete.

[0441] The solvent is then removed by rotary evaporation to concentrate the solution and form a suspension. The resulting suspension is then filtered from the mixture. The solids recovered from the filtration are optionally washed with water, MeOH, DCM, and isopropanol to obtain the final compound.

[0442] The reactants and solvents involved in step III are summarized in Table 6.

[0443] Table 6

[0444] temperature Melting point In some non-limiting examples, materials with substantially low intermolecular forces (including, but not limited to, patterned material 411) may tend to exhibit substantially low melting points.

[0445] In some non-limiting examples, materials with substantially low melting points (including, but not limited to, patterned material 411) may have reduced applicability in some scenarios where significant temperature reliability is required for temperatures not exceeding one of about 50°C, 60°C, 70°C, 80°C, and 100°C, in some non-limiting examples, because of the change in the physical properties of such materials at operating temperatures close to their melting points.

[0446] In some non-limiting examples, materials with a melting point of about 120°C may be suitable for some scenarios that require substantially high temperature reliability (including, but not limited to, at least about 100°C).

[0447] In some non-limiting examples, materials with substantially high melting points (including, but not limited to, patterned material 411) may be suitable for some scenarios requiring substantially high temperature reliability.

[0448] In some non-limiting examples, at least one of the patterned coating 110 and its compounds may have a melting temperature of at least one of about 90°C, 100°C, 110°C, 120°C, 140°C, 150°C and 180°C.

[0449] In some non-limiting examples, the thermal properties of selected example materials were measured using DSC. Specifically, the temperatures of the endothermic and exothermic peaks for each sample were determined during a second heating cycle at a specific heating rate and within a temperature range of approximately 0°C to approximately 200°C. The results are summarized in Table 7 below: Table 7

[0450] As can be seen from Table 7, in some non-limiting examples, EM-18, EM-22 and EM-26 undergo a solid-solid phase transition between about 0°C and 200°C: after initial melting in the form of the first polymorph (indicated by the first endothermic peak), a crystallization event occurs, resulting in the formation of the second polymorph (indicated by the exothermic peak), followed by melting at a higher temperature (indicated by the second endothermic peak).

[0451] Based on the transmittance measurements summarized in Table 3 and the DSC data summarized in Table 7, it can be seen that after the patterned coating 110 formed from materials exhibiting solid-solid phase transitions (including but not limited to EM-18, EM-22, and EM-26) undergoes an evaporation flux of Yb:LiF and MgAg 532, this material can exhibit substantially high transmittance at wavelengths of 450 nm, 520 nm, and 850 nm, including but not limited to at least about 70%. In some non-limiting examples, this material can be a mixed ligand compound, including but not limited to EM-18. In some non-limiting examples, this material can be a linked cyclophosphamide compound, including but not limited to EM-20 and EM-26. It can also be seen that materials not exhibiting solid-solid transitions (including but not limited to EM-11 and EM-20) can exhibit lower transmittance compared to materials exhibiting solid-solid phase transitions (including but not limited to EM-18, EM-22, and EM-26).

[0452] In some non-limiting examples, the overall melting point of various materials was measured, and the physical state of these materials was visually observed at room temperature and pressure (including but not limited to approximately 20°C and 1 atm). The results are summarized in Table 8: Table 8

[0453] Based on the overall melting point measurements summarized in Tables 7 and 8, it can be seen that EM-11, EM-21, EM-23, EM-48, and EM-55 exhibit substantially high overall melting points of at least 100 °C. In some non-limiting examples, compounds exhibiting melting points of at least about 70 °C (including, but not limited to, EM-11, EM-21 to EM-23, EM-25 to EM-28, EM-43 to EM-46, EM-48 to EM-56, EM-58, and EM-63) may be suitable in some scenarios requiring substantially high thermal stability, especially when incorporated into devices in the form of at least one of thin films, coatings, and layers, including but not limited to devices. In some non-limiting examples, compounds exhibiting an overall melting point of not less than about 80°C (including, but not limited to, EM-11, EM-21 to EM-26, EM-28, EM-43, EM-44, EM-46, EM-48, EM-49, EM-50, EM-54, EM-55, EM-56, EM-58 and EM-63) may be suitable in some scenarios where substantially high thermal stability is required, especially when incorporated into a device in the form of at least one of thin films, coatings and layers, including but not limited to, devices.

[0454] Glass transition temperature In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a glass transition temperature of at least one of about 300°C, 150°C and 130°C, and not exceeding one of about 30°C, 0°C, -30°C and -50°C.

[0455] Sublimation temperature In some non-limiting examples, materials with substantially low intermolecular forces (including, but not limited to, patterned material 411) may tend to exhibit substantially low sublimation temperatures.

[0456] In some non-limiting examples, materials with substantially low sublimation temperatures (including, but not limited to, patterned material 411) may have reduced applicability for manufacturing processes that may require substantially precise control of the average layer thickness of the deposited material film.

[0457] In some non-limiting examples, materials with sublimation temperatures not exceeding one of about 140°C, 120°C, 110°C, 100°C, and 90°C (including but not limited to patterned material 411) may tend to encounter constraints on at least one of the deposition rate and average layer thickness of the film, which includes such materials that can be deposited using known deposition methods (including but not limited to vacuum thermal evaporation).

[0458] In some non-limiting examples, materials with substantially high sublimation temperatures (including, but not limited to, patterned material 411) may be suitable for some scenarios where substantially high precision is required in controlling the average layer thickness of films comprising such materials.

[0459] In some non-limiting examples, the patterning material may have a sublimation temperature between about 100°C-320°C, 120°C-300°C, 140°C-280°C, and 150°C-250°C. In some non-limiting examples, such a sublimation temperature may allow the patterning material 411 to be deposited substantially easily as a coating using PVD.

[0460] In some non-limiting examples, materials with substantially low intermolecular forces may exhibit substantially low sublimation temperatures.

[0461] In some non-limiting examples, materials with substantially low sublimation temperatures (including, but not limited to, patterned material 411) may have reduced applicability to manufacturing processes that may require substantially precise control of the average layer thickness of the closed coating 140 of the material.

[0462] In some non-limiting examples, materials with sublimation temperatures not exceeding one of about 140°C, 120°C, 110°C, 100°C, and 90°C (including but not limited to patterned material 411) may tend to encounter constraints on at least one of the deposition rate and average layer thickness of the film, which includes such materials that can be deposited using known deposition methods (including but not limited to vacuum thermal evaporation).

[0463] In some non-limiting examples, materials with substantially high sublimation temperatures (including, but not limited to, patterned material 411) may be suitable for some scenarios where substantially high precision is required in controlling the average layer thickness of films comprising such materials.

[0464] The sublimation temperature of a material (including, but not limited to, patterned material 411) can be determined using a variety of methods readily apparent to those skilled in the art, including, but not limited to, by sublimation in an evaporation source under substantially high vacuum (in some non-limiting examples, at approximately 10 °C). -4 Heating material in a crucible (including, but not limited to, a container) and by determining the achievable temperature, to perform at least one of the following: • Observe when the material begins to deposit onto the exposed layer surface 11 on the QCM mounted at a fixed distance from the crucible; • Observe a specific deposition rate on the exposed layer surface 11 of a QCM mounted at a fixed distance from the crucible; in some non-limiting examples, it is 0.1 Å / s; and • The threshold vapor pressure of the material is reached, which in some non-limiting examples is about 10. -4 To and 10 -5 One of the entrusted ones.

[0465] In some non-limiting examples, in order to determine the sublimation temperature, the QCM can be installed at a distance of approximately 65 cm from the crucible.

[0466] In some non-limiting examples, the patterned material 411 may have a sublimation temperature between about 100°C-320°C, 100°C-300°C, 120°C-300°C, 100°C-250°C, 140°C-280°C, 120°C-230°C, 130°C-220°C, 140°C-210°C, 140°C-200°C, 150°C-250°C, and 140°C-190°C.

[0467] In some non-limiting examples, the sublimation temperature of the patterned material 411 (including but not limited to the linked cyclophosphonitrile compound) may be no more than one of about 350°C, 330°C, 300°C, 280°C, 250°C, 230°C and 210°C.

[0468] In some non-limiting examples, the sublimation temperature of the patterned material 411 (including but not limited to the linked cyclophosphonitrile compound) may be at least one of about 110°C, 130°C, 150°C, 160°C, 170°C, 180°C and 200°C.

[0469] In some non-limiting examples, the patterned material 411 (including, but not limited to, the linked cyclophosphonitrile compound) may have a melting point of at least one of about 70°C, 80°C, 85°C, 90°C, 100°C, 110°C and 120°C and an evaporation temperature between about 110°C and 300°C.

[0470] It has been found that materials with substantially high sublimation temperatures (including, but not limited to, patterned material 411) may have reduced applicability in scenarios requiring substantially high thermal stability for long-term thermal evaporation processes. Without wishing to be bound by any particular theory, the inventors may assume that materials exhibiting sublimation temperatures close to their decomposition temperatures may have reduced applicability in such scenarios due to the increased likelihood of such materials decomposing during long-term thermal evaporation processes. In some non-limiting examples, the decomposition temperature of the material may correspond to at least one of the following: the initial temperature, the temperature at 0.1% weight loss, the temperature at 1% weight loss, and the temperature at 5% weight loss, which can be measured using thermogravimetric analysis (TGA). In some non-limiting examples, materials exhibiting a difference between their sublimation temperature and decomposition temperature not exceeding one of about 30°C, 40°C, 50°C, 60°C, 70°C, and 90°C may have reduced applicability in some scenarios. In some non-limiting examples, materials exhibiting a difference between their sublimation temperature and decomposition temperature of at least about 60°C, 70°C, 90°C, 100°C, 110°C, 130°C, and 150°C may have increased applicability in some scenarios.

[0471] Table 9

[0472] Deposition contrast In some non-limiting examples, when deposited on substrate 10, the material (including but not limited to patterned material 411) that can be used as a given at least one of metals and alloys (including but not limited to at least one of Mg, Ag and MgAg) can have substantially high deposition contrast.

[0473] In some non-limiting examples, if substrate 10 tends to act as nucleation promoting coating (NPC) 720 and a portion thereof is coated with a material (including but not limited to patterned material 411) that may tend to act as a NIC to prevent the deposition of deposited material 531, the deposited material including but not limited to at least one of metals and alloys (including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg), then the coated portion (first portion 101) and the uncoated portion (second portion 102) may tend to have at least one of different initial adhesion probabilities and nucleation rates, such that the deposited material 531 deposited thereon may tend to have different average film thicknesses.

[0474] As used herein, in this scenario, the quotient of the average film thickness of the deposited material 531 in the second portion 102 divided by the average film thickness of the deposited material in the first portion 101 is generally referred to as the deposition contrast. Therefore, if the deposition contrast is substantially high, the average film thickness of the deposited material 531 in the second portion 102 can be substantially greater than the average film thickness of the deposited material 531 in the first portion 101.

[0475] In some non-limiting examples, when deposited on substrate 10, the material of the NIC that can be used as a given deposition material 531 (including, but not limited to, patterning material 411) may have substantially high deposition contrast.

[0476] In some non-limiting examples, there may be a negative correlation between the initial adhesion probability of the deposition of the deposition material 531 and its deposition contrast of at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100), i.e., a low initial adhesion probability may be highly correlated with a high deposition contrast.

[0477] In some non-limiting examples, if the deposition contrast is substantially high, then little or no deposition of material 531 may be deposited in the first part 101 when the deposition of material 531 is sufficient to form its sealing coating 140 in the second part 102.

[0478] In some non-limiting examples, if the deposition contrast is substantially low, a discontinuous layer 160 of at least one particulate structure 150 of the deposition material 531 deposited in the first portion 101 may be present when the deposition of the deposition material 531 is sufficient to form a closed coating 140 in the second portion 102.

[0479] In some non-limiting examples, when the average layer thickness of the sealing coating 140 of the deposited material 531 in the second portion 102 is substantially small (including but not limited to not exceeding one of about 100 nm, 50 nm, 25 nm and 15 nm, including but not limited to forming nanoparticles (NPs) in the first portion 101), there may be scenarios where it is necessary to form at least one discontinuous layer 160 of at least one particulate structure 150 of the deposited material 531 in the first portion 101, wherein such NPs are required to absorb EM radiation, including but not limited to protecting the underlying layer 710 from EM radiation with a wavelength not exceeding about 460 nm.

[0480] In some non-limiting examples, in such scenarios, a deposition contrast of approximately 2-100, 4-50, 5-20, and 10-15 may be applicable.

[0481] In some non-limiting examples, materials with substantially low deposition contrast relative to the deposition of deposition material 531 (including, but not limited to, patterned material 411) may have reduced applicability in some scenarios where substantially high deposition contrast is required, including, but not limited to, scenarios where the average layer thickness of deposition material 531 in the first part 101 is large, including, but not limited to, at least one of about 95 nm, 45 nm, 20 nm, 10 nm and 8 nm.

[0482] In some non-limiting examples, materials with substantially low deposition contrast relative to the deposition of deposition material 531 (including, but not limited to, patterned material 411) may have reduced applicability in some scenarios where substantially high deposition contrast is required (including, but not limited to, scenarios where at least one of the closed coating 140 and high-density particulate structure 150 is substantially absent in the first part 101, including, but not limited to, scenarios where the average layer thickness of deposition material 531 in the second part 102 is large (including, but not limited to, at least one of about 95 nm, 45 nm, 20 nm, 10 nm and 8 nm), including, but not limited to, scenarios where substantially no absorption of EM radiation is required in at least one of the visible spectrum and NIR spectrum (including, but not limited to, scenarios where increased transparency to EM radiation with a wavelength of at least about 460 nm is required).

[0483] In some non-limiting examples, when the average layer thickness of the sealing coating 140 of the deposited material 531 in the second part 102 is substantially high (including, but not limited to, at least one of about 95 nm, 45 nm, 20 nm, 10 nm, and 8 nm), materials with substantially low deposition contrast relative to the deposition of the deposited material 531 (including, but not limited to, patterned material 411) may be suitable in some scenarios where at least one of the discontinuous layer 160 of the granular structure 150 of the deposited material 531 in the first part 101 and a low-density granular structure is required. In some non-limiting examples, when the average layer thickness of the deposited material 531 in the second part 102 is substantially high, including, but not limited to, at least one of about 95 nm, 45 nm, 20 nm, 10 nm, and 8 nm, in some scenarios, a deposition contrast between about 2-100, 4-50, 5-20, and 10-15 may be suitable.

[0484] In some non-limiting examples, if a material (including but not limited to patterned material 411) has a substantially high initial adhesion probability to the deposition of at least one of metals and alloys (including but not limited to at least one of Mg, Ag and MgAg), such a material may tend to have a substantially low deposition contrast.

[0485] Surface energy In some non-limiting examples, such as those relating to the materials used herein, characteristic surface energy may generally refer to the surface energy measured from such material.

[0486] In some non-limiting examples, characteristic surface energy can be measured from a surface formed by a material deposited (coated) in the form of a thin film.

[0487] Various methods and theories for determining the surface energy of solids are known.

[0488] In some non-limiting examples, the surface energy can be calculated (derived) based on a series of contact angle measurements, wherein various liquids can be brought into contact with a solid surface to measure the contact angle between the liquid-gas interface and the surface. In some non-limiting examples, the surface energy of the solid surface can be equal to the surface tension of the liquid having the highest surface tension that fully wets the surface.

[0489] In some non-limiting examples, the critical surface tension of the surface can be determined according to the Zissmann method, such as in WAZisman. Advances in Chemistry Further details can be found in 43 (1964), pages 1-51.

[0490] In some non-limiting examples, the characteristic surface energy of the material (including but not limited to patterned material 411) in the coating (including but not limited to patterned coating 110) can be determined by depositing the material as a substantially pure coating (e.g., a coating formed of substantially pure material) on the substrate 10 and measuring its contact angle with a suitable series of probe liquids.

[0491] In some non-limiting examples, the Zissman diagram can be used to determine what will result in complete wetting of the surface (i.e., a contact angle of 0°). θ c The highest surface tension value.

[0492] The materials suitable for providing the patterned coating 110 typically have low surface energy when deposited as a thin film (coating) on ​​a surface. In some non-limiting examples, materials with low surface energy may exhibit low intermolecular forces.

[0493] Without wishing to be bound by any particular theory, it is now assumed that materials with substantially high surface energy are applicable, at least in some applications requiring high-temperature reliability.

[0494] Without wishing to be bound by any particular theory, the inventors have now discovered that a patterned coating 110 comprising a material that exhibits substantially high surface energy when deposited as a thin film can, in some non-limiting examples, form a discontinuous layer 160 of at least one particulate structure 150 of the deposited material 531 in a first portion 101 and a closed coating 140 of the deposited material 531 in a second portion 102, including but not limited to cases where the thickness of the closed coating (as a non-limiting example) is no more than one of about 100 nm, 75 nm, 50 nm, 25 nm, and 15 nm.

[0495] In some non-limiting examples, a series of samples were fabricated to measure the critical surface tension of surfaces formed from various materials. The measurement results are summarized in Table 10: Table 10

[0496] Based on the aforementioned measurements of the critical surface tension in Table 10 and previous observations regarding one of the substantially closed coatings 140 containing and without Ag in the form of deposited material 531, it has been found that materials forming substantially low surface energy surfaces (in some non-limiting examples, materials with a critical surface tension between about 13 dynes / cm and 20 dynes / cm and between 13 dynes / cm and 19 dynes / cm) when deposited as coatings (including but not limited to patterned coating 110) are suitable for forming patterned coating 110 to inhibit the deposition of deposited material 531 (including but not limited to at least one of Yb, Ag, Mg, and Ag-containing materials (including but not limited to MgAg) thereon).

[0497] Without wishing to be bound by any particular theory, it can be assumed that materials forming surfaces with a surface energy of less than (as a non-limiting example) about 13 dynes / cm may be less suitable as patterning materials in some scenarios 411, because such materials may exhibit at least one of substantially poor adhesion to layers surrounding such materials, low melting point, and low sublimation temperature.

[0498] In some non-limiting examples, when deposited as a thin film (coating) on ​​the exposed layer surface 11, the material (including, but not limited to, patterned material 411, which may tend to act as deposited material 531 (including, but not limited to, at least one of metals and alloys, including, but not limited to, Mg, Ag and Ag-containing materials (including, but not limited to, MgAg)) may tend to exhibit substantially low surface energy)

[0499] In some non-limiting examples, when deposited as a thin film (coating) on ​​the exposed layer surface 11, the material (including, but not limited to, patterned material 411) may tend to exhibit substantially low surface energy.

[0500] In some non-limiting examples, materials with substantially low surface energy (including but not limited to patterned material 411) may tend to exhibit substantially low intermolecular forces.

[0501] In some non-limiting examples, there may be scenarios where patterned materials 411 with substantially low surface energy that are not excessively low are required.

[0502] In some non-limiting examples, materials with substantially high surface energy (including but not limited to patterned material 411) may be suitable for some scenarios where optical techniques are used to detect films of such materials.

[0503] Without wishing to be bound by any particular theory, it may be assumed that, in some non-limiting examples, materials with substantially high surface energy (including, but not limited to, patterned material 411) may be suitable for some scenarios requiring substantially high temperature reliability.

[0504] In some non-limiting examples, when the average layer thickness of the continuous coating 140 of at least one of the metals and alloys in the second part 102 is substantially low (including but not limited to not exceeding one of about 100 nm, 50 nm, 25 nm and 15 nm), a material with substantially high surface energy (including but not limited to patterned material 411) that can be used as a NIC of at least one of the metals and alloys (including but not limited to Mg, Ag and Ag-containing materials (including but not limited to MgAg)) may be suitable in some scenarios where a discontinuous layer 160 of the particulate structure 150 of at least one of the metals and alloys in the first part 101 is required.

[0505] In some non-limiting examples, when the average layer thickness of the closed coating 140 of the deposited material 531 in the second part 102 is substantially high (including but not limited to at least one of about 95 nm, 45 nm, 20 nm, 10 nm and 8 nm), a material with substantially low surface energy (which can be used as a NIC of the deposited material 531, including but not limited to patterned material 411, the deposited material including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)) may be suitable in some scenarios where one of the discontinuous layer 160 of the granular structure 150 of the deposited material 531 in the first part 101 and a low-density granular structure is required.

[0506] In some non-limiting examples, the surface of at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within a device 100 containing the compound described herein) may exhibit a surface energy not exceeding one of about 24 dynes / cm, 22 dynes / cm, 20 dynes / cm, 18 dynes / cm, 16 dynes / cm, 15 dynes / cm, 13 dynes / cm, 12 dynes / cm and 11 dynes / cm.

[0507] In some non-limiting examples, and in various non-limiting examples, the surface energy values ​​described herein may correspond to such values ​​measured at approximately normal temperature and pressure (NTP), which may correspond to a temperature of 20°C and an absolute pressure of 1 atm.

[0508] In some non-limiting examples, the surface energy may be at least one of about 6 dynes / cm, 7 dynes / cm and 8 dynes / cm.

[0509] In some non-limiting examples, the surface energy may be one of about 10 dynes / cm to 20 dynes / cm and 13 dynes / cm to 19 dynes / cm.

[0510] Cohesive energy According to Young's equation (Equation 13), the cohesive energy (fracture toughness / cohesive strength) of a material tends to be proportional to its surface energy (see Young, Thomas (1805) "An essay on the cohesion of fluids"). Philosophical Transactions of the Royal Society of London , 95: 65-87).

[0511] According to Lindemann's criteria, the cohesive energy of a material may tend to be proportional to its melting temperature (see Nanda, KK, Sahu, SN, and Behera, SN (2002), "Liquid-drop model for the size-dependent melting of low-dimensional systems"). Phys.Rev. A. 66 (1): 013208).

[0512] In some non-limiting examples, materials with substantially low intermolecular forces (including, but not limited to, patterned material 411) may tend to exhibit substantially low cohesive energy.

[0513] In some non-limiting examples, materials with substantially low cohesive energy (including, but not limited to, patterned material 411) may have reduced suitability in some scenarios requiring significant fracture toughness (including, but not limited to, devices 100 that may tend to withstand at least one of shear and bending stresses during at least one of manufacturing and use), because such materials may tend to crack (fracture) in such scenarios. In some non-limiting examples, materials with a cohesive energy of no more than about 30 dynes / cm (including, but not limited to, patterned material 411) may have reduced suitability in some scenarios of devices 100 fabricated on flexible substrate 10.

[0514] In some non-limiting examples, materials with substantially high cohesive energy (including but not limited to patterned material 411) may be suitable for some scenarios where substantially high reliability is required under at least one of shear stress and bending stress, including but not limited to devices 100 fabricated on flexible substrate 10.

[0515] In some non-limiting examples, materials with substantially low but not excessively low surface energy (including, but not limited to, patterned material 411) may be suitable for some scenarios where significant reliability is required under at least one of shear and bending stresses, including, but not limited to, devices 100 fabricated on flexible substrate 10.

[0516] In some non-limiting examples, materials with substantially high cohesive energy (including but not limited to patterned material 411) may be suitable for some scenarios where substantially high reliability is required under at least one of shear stress and bending stress, including but not limited to devices 100 fabricated on flexible substrate 10.

[0517] In some non-limiting examples, materials with substantially low but not excessively low surface energy (including, but not limited to, patterned material 411) may be suitable for some scenarios where significant reliability is required under at least one of shear and bending stresses, including, but not limited to, devices 100 fabricated on flexible substrate 10.

[0518] Example In some non-limiting examples, a series of samples were fabricated to determine the point of failure upon peeling or delamination. Specifically, each sample was fabricated by depositing an example material layer of approximately 50 nm thickness as a patterned coating 110 on a glass substrate 10, followed by a layer of approximately 50 nm thickness of an organic material typically used as a capping layer (CPL). Adhesive tape was then applied to the exposed surface 11 of the CPL of each sample. The tape was peeled off to induce delamination (cohesive failure) in each sample, and the peeled tape and the delaminated samples were analyzed to determine at which layer (including, but not limited to, the interface with adjacent layers) the failure occurred. Samples with failure within the patterned coating 110 (including, but not limited to, at the interface between the patterned coating 110 and adjacent layers) were identified as failing the delamination test, and samples with failure within the CPL (i.e., cohesive failure within the CPL) were identified as passing the delamination test. Table 11 summarizes the results of this analysis.

[0519] Table 11

[0520] Based on the aforementioned analysis of the layered test and previous observations regarding the melting point and critical surface tension of the exemplary materials, it was found that samples manufactured with a patterned coating 110 including EM-8 as patterning material 411 (which exhibits at least the melting point and critical surface tension of both EM-10 and EM-11) showed destruction within the CPL as the CPL separated to form a new surface, while samples manufactured with patterned coatings 110 including EM-10 and EM-11 as patterning materials 411 respectively showed destruction within the patterned coating 110 as the patterned coating 110 separated to form a new surface.

[0521] Without being bound by any particular theory, it can be assumed that this is because when the patterned material 411 includes EM-8, the cohesive energy of the CPL does not exceed the cohesive energy of the patterned coating 110 and the adhesive energy at the interface between the patterned coating 110 and the CPL. Conversely, for such samples, each patterned coating 110 formed from a patterned material 411 including one of EM-4, EM-10, EM-11, EM-12, EM-13, and EM-14 exhibits a cohesive energy not exceeding both the cohesive energy of the CPL and the adhesive energy at the interface between the patterned coating 110 and the CPL, such that delamination caused by cohesive failure occurs in the two samples within the patterned coating 110.

[0522] Optical / bandgap In this disclosure, semiconductor materials can be described as materials that typically exhibit a band gap. In some non-limiting examples, the band gap may be formed between the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) of the semiconductor material. Semiconductor materials may therefore tend to exhibit conductivity substantially no greater than that of conductive materials (including, but not limited to, at least one of metals and alloys), but substantially at least as large as that of insulating materials (including, but not limited to, glass). In some non-limiting examples, the semiconductor material may include organic semiconductor materials. In some non-limiting examples, the semiconductor material may include inorganic semiconductor materials.

[0523] In some non-limiting examples, including but not limited to the optical bandgap of patterned material 411, the optical bandgap may tend to correspond to the HOMO-LUMO bandgap of that material.

[0524] In some non-limiting examples, materials with substantially large / wide optical (HOMO-LUMO bandgap) (including but not limited to patterned material 411) may tend to exhibit substantially weak, including but not limited to, photoluminescence in at least one of the deep B (blue) region of the visible spectrum, the near-UV spectrum, the visible spectrum, and the NIR spectrum.

[0525] In some non-limiting examples, materials with substantially small HOMO-LUMO band gaps may be applicable in some scenarios where optical techniques are used to detect films of materials.

[0526] In some non-limiting examples, the optical bandgap of the patterned material 411 may be wider than the photon energy of the EM radiation emitted by the source, so that the patterned material 411 does not undergo photoexcitation when subjected to such EM radiation.

[0527] Refractive index and extinction coefficient In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a low refractive index.

[0528] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a refractive index of no more than one of about 1.55, 1.5, 1.45, 1.43, 1.4, 1.39, 1.37, 1.35, 1.32 and 1.3 for EM radiation at a wavelength of 550 nm.

[0529] In some non-limiting examples, the refractive index of the patterned coating 110 may not exceed about 1.7. In some non-limiting examples, the refractive index of the patterned coating 110 may not exceed one of about 1.6, 1.5, 1.4, and 1.3. In some non-limiting examples, the refractive index of the patterned coating 110 may be one of about 1.2-1.6, 1.2-1.5, and 1.25-1.45. As further described in the various non-limiting examples above, the patterned coating 110 exhibiting a substantially low refractive index may be suitable in some scenarios for enhancing (including but not limited to) at least one of the optical properties and performance of the device 100 by enhancing external coupling of EM radiation emitted by the optoelectronic device 200.

[0530] Without being bound by any particular theory, it has been observed that providing a patterned coating 110 with a substantially low refractive index can (at least in some devices 100) increase the transmittance of external EM radiation through its second portion 102. In some non-limiting examples, when the patterned coating 110 has a substantially low refractive index relative to a similarly constructed device 100 in which such a low-refractive-index patterned coating 110 is not provided, a device 100 including an air gap that can be arranged near the patterned coating 110 can exhibit substantially high transmittance.

[0531] In some non-limiting examples, a series of samples were fabricated to measure the refractive index of coatings formed from some of the various example materials at a wavelength of 550 nm. The measurement results are summarized in Table 12 below: Table 12

[0532] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a low refractive index.

[0533] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have a refractive index of no more than one of about 1.55, 1.5, 1.45, 1.43, 1.4, 1.39, 1.37, 1.35, 1.32 and 1.3 for EM radiation at a wavelength of 550 nm.

[0534] In some non-limiting examples, the patterned coating 110 may be at least one of being substantially transparent and EM radiation transmissive.

[0535] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an extinction coefficient of no more than about 0.01 for photons at wavelengths of at least about 600 nm, 500 nm, 460 nm, 420 nm and 410 nm.

[0536] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may have an extinction coefficient of at least about 0.05, 0.1, 0.2 and 0.5 for EM radiation at wavelengths not exceeding one of about 400 nm, 390 nm, 380 nm and 370 nm.

[0537] In this way, at least one of the patterned coating 110 and the patterned material 411 (when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) can absorb EM radiation in the UVA spectrum incident on the device 100, thereby reducing the possibility that EM radiation in the UVA spectrum may impose constraints on at least one of device performance, device stability, device reliability, and device lifetime.

[0538] In some non-limiting examples, the patterned coating 110 may exhibit an extinction coefficient of no more than one of about 0.1, 0.08, 0.05, 0.03 and 0.01 in the visible spectrum.

[0539] Photoluminescence, absorption and other optical effects In some non-limiting examples, photoluminescence of at least one of the coating and material can be observed via a photoexcitation process. During photoexcitation, at least one of the coating and material can be subjected to EM radiation emitted by a light source (including but not limited to a UV lamp).

[0540] When the emitted EM radiation is absorbed by at least one of the coating and the material, electrons in the at least one of the coating and the material can be temporarily excited. After excitation, one or more relaxation processes may occur, including but not limited to at least one of fluorescence and phosphorescence, wherein the EM radiation may be emitted from at least one of the coating and the material.

[0541] During this process, EM radiation emitted from at least one of the coating and the material can be detected, for example, by a photodetector to characterize the photoluminescence properties of at least one of the coating and the material.

[0542] As used herein, the wavelength of photoluminescence associated with at least one of the coatings and materials can generally refer to the wavelength of EM radiation emitted by at least one of such coatings and materials due to the relaxation of electrons from an excited state. As will be understood by those skilled in the art, the wavelength of light emitted by at least one of the coatings and materials due to a photoexcitation process may, in some non-limiting examples, be longer than the wavelength of the radiation used to induce photoexcitation. Various techniques known in the art can be used to detect photoluminescence, including but not limited to fluorescence microscopy.

[0543] In some non-limiting examples, the optical bandgap of various coatings / materials may correspond to the bandgap of the coating / material from which one of the EM radiation is absorbed and emitted during the photoexcitation process.

[0544] In some non-limiting examples, photoluminescence can be detected by subjecting the coating / material to EM radiation with a wavelength corresponding to the UV spectrum (in some non-limiting examples, such as one of UVA and UVB). In some non-limiting examples, the EM radiation used to induce photoexcitation may have a wavelength of about 365 nm.

[0545] In some non-limiting examples, the patterned material 411 may not exhibit photoluminescence at any wavelength corresponding to the visible spectrum.

[0546] In some non-limiting examples, the patterned material 411 may not exhibit photoluminescence when subjected to EM radiation having a wavelength of at least about 300 nm, 320 nm, 350 nm and 365 nm.

[0547] As used herein, at least one of the photoluminescent coatings and materials may be at least one of the coatings and materials that exhibit photoluminescence at a certain wavelength when irradiated with excitation radiation of a certain wavelength. In some non-limiting examples, at least one of the photoluminescent coatings and materials may exhibit photoluminescence at wavelengths exceeding about 365 nm when irradiated with excitation radiation of a wavelength of 365 nm, which is the wavelength of radiation sources commonly used in fluorescence microscopy.

[0548] At least one of the photoluminescent coatings and materials can be detected on the substrate 10 using standard optical techniques (including, but not limited to, fluorescence microscopy), which can determine the presence of at least one of the coatings and materials.

[0549] In some non-limiting examples, the coating (including, but not limited to, patterned coating 110) may exhibit photoluminescence by including materials that exhibit photoluminescence.

[0550] In some non-limiting examples, when depositing the patterned coating 110, conventional characterization techniques such as fluorescence microscopy can be used to detect (observe) the presence of the patterned coating 110.

[0551] In some non-limiting examples, the coating (including, but not limited to, patterned coating 110) may exhibit photoluminescence at wavelengths corresponding to at least one of the UV spectrum and the visible spectrum, including, but not limited to, by comprising a material exhibiting photoluminescence. In some non-limiting examples, photoluminescence may occur at wavelengths (ranges) corresponding to the UV spectrum (including, but not limited to, one of the UVA spectrum and the UVB spectrum). In some non-limiting examples, photoluminescence may occur at wavelengths (ranges) corresponding to the visible spectrum. In some non-limiting examples, photoluminescence may occur at wavelengths (ranges) corresponding to one of deep blue and near-UV.

[0552] In some non-limiting examples, the material of the patterned coating 110 may exhibit photoluminescence in at least one of the following: conjugated bonds, aryl moieties, electron-donating / electron-withdrawing groups, and heavy metal complexes.

[0553] In some non-limiting examples, a coating (including but not limited to patterned coating 110) consisting of a material (including but not limited to patterned material 411) having substantially weak to no photoluminescence (absorption) in a wavelength range of at least about 365 nm and 460 nm may tend not to act as either a photoluminescent coating or an absorbing coating, and may be suitable for some scenarios where substantially high transparency is required in at least one of the visible spectrum and the NIR spectrum.

[0554] In some non-limiting examples, this material may tend to exhibit substantially low photoluminescence when subjected to EM radiation with a wavelength of approximately 365 nm, which is the wavelength of radiation sources commonly used in fluorescence microscopy. The presence of this material (including, but not limited to, patterned material 411), particularly when deposited as a thin film in some non-limiting examples, may have reduced applicability in some scenarios requiring typical optical detection techniques (including, but not limited to, fluorescence microscopy). This may impose constraints on some scenarios where such materials can be selectively deposited, for example, on portions of substrate 10 via an FMM, as there may be scenarios where the presence of such material needs to be determined after material deposition.

[0555] In some non-limiting examples, materials having substantially low to no absorption at wavelengths of at least about 365 nm and 460 nm may be suitable for some scenarios where substantially high transparency is required in at least one of the visible and NIR spectra.

[0556] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (in some non-limiting examples, when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may not substantially attenuate the EM radiation passing through it in at least the visible spectrum.

[0557] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 (when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) may substantially not attenuate the EM radiation passing through it in at least one of the IR and NIR spectra.

[0558] In this way, at least one of the patterned coating 110 and the patterned material 411 (when deposited as at least one of some form of film and coating and under conditions similar to the deposition of the patterned coating 110 within the device 100) can absorb EM radiation in the UVA spectrum incident on the device 100, thereby reducing the possibility that EM radiation in the UVA spectrum may impose constraints on at least one of device performance, device stability, device reliability, and device lifetime.

[0559] In some non-limiting examples, the patterned coating 110 may serve as an optical coating.

[0560] In some non-limiting examples, the patterned coating 110 may modify at least one of at least one property and at least one characteristic of the EM radiation (including, but not limited to, photon forms) emitted by the device 100. In some non-limiting examples, the patterned coating 110 may exhibit a degree of haze, resulting in the scattering of the emitted EM radiation. In some non-limiting examples, the patterned coating 110 may include a crystalline material for scattering EM radiation transmitted through it. In some non-limiting examples, such scattering of EM radiation may be beneficial for enhancing external coupling of EM radiation from the device 100. In some non-limiting examples, the patterned coating 110 may initially be deposited as a substantially amorphous (including, but not limited to, substantially amorphous) coating, and subsequently, after its deposition, the patterned coating 110 may become crystalline and subsequently used for optical coupling.

[0561] In some non-limiting examples, the patterned material 411 may exhibit insignificant, including but not limited to, no, absorption when subjected to EM radiation having a wavelength of at least about 300 nm, 320 nm, 350 nm and 365 nm.

[0562] In some non-limiting examples, the patterned coating 110 may not exhibit any significant EM radiation absorption at any wavelength corresponding to the visible spectrum.

[0563] Average layer thickness In some non-limiting examples, the average layer thickness of the patterned coating 110 may be no more than one of about 10 nm, 8 nm, 7 nm, 6 nm and 5 nm.

[0564] weight Without being bound by any particular theory, it can be assumed that for compounds suitable for forming surfaces with substantially low surface energy, there may be scenarios where, in at least some applications, such compounds have a molecular weight between approximately 800 g / mol-3,000 g / mol, 900 g / mol-2,000 g / mol, 900 g / mol-1,800 g / mol, and 900 g / mol-1,600 g / mol.

[0565] In some non-limiting examples, the molecular weight of at least one patterning material 411 compound may not exceed about 5,000 g / mol. In some non-limiting examples, the molecular weight of the compound may not exceed one of about 4,500 g / mol, 4,000 g / mol, 3,800 g / mol, and 3,500 g / mol.

[0566] In some non-limiting examples, the molecular weight of at least one patterning material 411 compound may be at least about 800 g / mol. In some non-limiting examples, the molecular weight of the compound may be at least one of at least about 1,500 g / mol, 1,700 g / mol, 2,000 g / mol, 2,200 g / mol, and 2,500 g / mol.

[0567] In some non-limiting examples, the molecular weight of at least one of the patterning material 411 compounds may be one of about 800 g / mol-3,000 g / mol, 900 g / mol-2,000 g / mol, 900 g / mol-1,800 g / mol, and 900 g / mol-1,600 g / mol.

[0568] In some non-limiting examples, the percentage of molar weight of such a compound (including but not limited to) of at least one patterned material 411 attributable to the presence of F atoms may be one of about 40%-90%, 45%-85%, 50%-80%, 55%-75%, and 60%-75%. In some non-limiting examples, F atoms may constitute the majority of the molar weight of such a compound.

[0569] Interrelationships between patterned coating properties Without being bound by any particular theory, it may be assumed that the exposed layer surface 11 exhibiting a low initial adhesion probability relative to the deposited material 531 (including, but not limited to, at least one of metals and alloys, including but not limited to, Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)) may exhibit high transmittance. Without being bound by any particular theory, it may be assumed that the exposed layer surface 11 exhibiting a high adhesion probability relative to the deposited material 531 (including, but not limited to, at least one of metals and alloys, including but not limited to, Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg)) may exhibit low transmittance.

[0570] In some non-limiting examples, if the material has substantially high surface energy, the material including but not limited to patterned material 411 may tend to have substantially high initial adhesion probability relative to the deposition of the deposited material, including but not limited to at least one of metals and alloys, including but not limited to at least one of Yb, Ag, Mg and Ag-containing materials (including but not limited to MgAg).

[0571] In some non-limiting examples, patterned material 411 having substantially low surface tension that is not excessively low may be suitable for some scenarios requiring substantially high melting points, including but not limited to about 15 dynes / cm to 22 dynes / cm.

[0572] In some non-limiting examples, materials with substantially low but not excessively low surface tension (including, but not limited to, patterned material 411) may be suitable for some scenarios that require substantially high sublimation temperatures.

[0573] In some non-limiting examples, coatings (including, but not limited to, patterned coating 110, which consists of materials (including, but not limited to, patterned material 411)) with substantially low surface energy and substantially high sublimation temperature) may be suitable in some scenarios where substantially high precision is required in controlling the average layer thickness of films including such materials.

[0574] Without wishing to be bound by any particular theory, it may be assumed that a material forming an exposed layer surface 11 with a surface energy not exceeding (in some non-limiting examples) about 13 dynes / cm may not be suitable as a patterning material 411 in some scenarios because such a material may exhibit at least one of substantially low adhesion to layers surrounding it, substantially low melting point, and substantially low sublimation temperature.

[0575] In some non-limiting examples, the patterned coating 110, having substantially low surface energy and substantially high melting point, may be suitable for some scenarios requiring high temperature reliability. In some non-limiting examples, considering that a single material with low surface energy may tend to exhibit a low melting point, achieving this combination from a single material may be challenging.

[0576] Without wishing to be bound by any particular theory, it may be assumed that such a compound (including, but not limited to, at least one patterning material 411) may exhibit at least one property that may, in some cases, be suitable for forming at least one of coatings and layers having at least one of the following: substantially high melting point, in some non-limiting examples, at least 100°C; substantially low surface energy; and substantially amorphous structure, in some non-limiting examples, when deposited using a vacuum-based thermal evaporation process.

[0577] In some non-limiting examples, coatings (including, but not limited to, patterned coating 110) having substantially low surface energy, substantially high cohesive energy, and substantially high melting point may be suitable for scenarios requiring substantially high reliability under various conditions. In some non-limiting examples, considering that a single material with substantially low surface energy may tend to exhibit substantially low cohesive energy and substantially low melting point, achieving such a combination from a single material may be challenging.

[0578] In some non-limiting examples, materials with substantially low surface energy and substantially high cohesive energy (including, but not limited to, patterned material 411) may be suitable for scenarios requiring substantially high reliability under at least one of shear stress and bending stress. In some non-limiting examples, considering that films formed substantially from a single material with substantially low surface energy may tend to exhibit substantially low cohesive energy, achieving such a combination from a single material may be challenging.

[0579] In some non-limiting examples, materials with substantially low surface energy (including, but not limited to, patterned material 411) may tend to exhibit at least one of substantially large optical band gap and substantially wide optical band gap. In some non-limiting examples, the optical band gap of materials including, but not limited to, patterned material 411 may tend to correspond to the HOMO-LUMO band gap of that material.

[0580] Typically, materials with low surface energy can exhibit an optical bandgap that is large or wide, which, as a non-limiting example, may correspond to the HOMO-LUMO bandgap of the material.

[0581] It has now been found that patterned coatings 110 formed from compounds exhibiting substantially low surface energy can also exhibit substantially low refractive index.

[0582] In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may exhibit a surface energy of no more than about 25 dynes / cm and a refractive index of no more than about 1.45. In some non-limiting examples, at least one of the patterned coating 110 and the patterned material 411 may comprise a material exhibiting a surface energy of no more than about 20 dynes / cm and a refractive index of no more than about 1.4.

[0583] In some non-limiting examples, materials with substantially low surface energy (including, but not limited to, patterned material 411) may be suitable for some scenarios where substantially weak to no photoluminescence and absorption are required in a wavelength range of at least about 365 nm and 460 nm.

[0584] In some non-limiting examples, materials (including, but not limited to, patterned material 411) having at least one of a substantially large optical band gap (and HOMO-LUMO band gap) and a substantially wide optical band gap (and HOMO-LUMO band gap) may tend to exhibit substantially weak to no photoluminescence in at least one of the deep B (blue) region of the visible spectrum, the near-UV spectrum, the visible spectrum, and the NIR spectrum.

[0585] Without wishing to be bound by any particular theory, it can be assumed that for compounds suitable for forming surfaces with substantially low surface energy, there may be targets where, in at least some applications, such compounds have a molecular weight of one of about 1,500 g / mol-5,000 g / mol, 1,500 g / mol-4,500 g / mol, 1,700 g / mol-4,500 g / mol, 2,000 g / mol-4,000 g / mol, 2,200 g / mol-4,000 g / mol, and 2,500 g / mol-3,800 g / mol.

[0586] At least some materials having at least one of a large and a wide optical bandgap and a HOMO-LUMO bandgap may exhibit substantially weak to no photoluminescence in at least one of the visible spectrum, its deep B (blue) region, and the near-UV spectrum. In some non-limiting examples, materials having a substantially small HOMO-LUMO bandgap may be suitable for applications using optical techniques to detect films of materials. In some non-limiting examples, materials with higher surface energy may be suitable for applications using optical techniques to detect films of materials.

[0587] In some non-limiting examples, materials with substantially large HOMO-LUMO band gaps may be suitable for some scenarios where weak to no photoluminescence or absorption is required in the wavelength range of at least about 365 nm and 460 nm.

[0588] Doping In some non-limiting examples, the patterned coating 110 may exhibit (including, but not limited to) at least one nucleation site for the deposited material 531 due to at least one of the patterned material 411 used and the deposition environment.

[0589] In some non-limiting examples, the patterned coating 110 may be doped (including, but not limited to, with at least one of an additional material that serves as a seed or heterogeneous element to act as such nucleation sites for the deposited material 531. In some non-limiting examples, such additional material may include NPC 720 material. In some non-limiting examples, such additional material may include organic materials (in some non-limiting examples, polycyclic aromatic compounds) and materials containing at least one of non-metallic elements (including, but not limited to, at least one of O, S, N, and C, which may be contaminants in at least one of the source material, the equipment used for deposition, and the vacuum chamber environment). In some non-limiting examples, such additional material may be deposited as a single layer of a fraction of its thickness to avoid forming its sealing coating 140. Instead, the monomers of such additional material may tend to be spaced apart in a laterally oriented manner to form discrete nucleation sites for the deposited material.

[0590] Various patterned materials In some non-limiting examples, a patterned coating 110 of a single patterned material 411 is formed relative to the deposition of a deposited material 531, which includes, but is not limited to, at least one of a given metal and a given alloy, including, but not limited to, Yb, Ag, Mg and Ag-containing materials (including, but not limited to, MgAg), satisfying constraints of at least one material property selected from at least one of the following: initial adhesion probability, transmittance, deposition contrast, surface energy, glass transition temperature, melting point, sublimation temperature, evaporation temperature, cohesive energy, optical band gap, photoluminescence, refractive index, extinction coefficient, absorption, other optical effects, average layer thickness, molecular weight, and composition. For a given scenario, the substantially complex interrelationships between these various material properties may present challenges.

[0591] In some non-limiting examples, the patterned coating 110 may include a variety of materials. In some non-limiting examples, the patterned coating 110 may include a first material and a second material.

[0592] In some non-limiting examples, when deposited as a thin film, at least one of a variety of materials of the patterned coating 110 can be used as the NIC.

[0593] In some non-limiting examples, at least one of the various materials of the patterned coating 110 can be used as a NIC when deposited as a thin film, and another material of the patterned coating forms an NPC 720 when deposited as a thin film. In some non-limiting examples, a first material can form an NPC 720 when deposited as a thin film, and a second material can form a NIC when deposited as a thin film. In some non-limiting examples, the presence of the first material in the patterned coating 110 can lead to an increased initial adhesion probability of the patterned coating compared to a case where the patterned coating 110 is formed by the second material and substantially without the first material.

[0594] In some non-limiting examples, at least one of the materials of the patterned coating 110 may be adapted to form a surface with low surface energy when deposited as a thin film. In some non-limiting examples, when deposited as a thin film, the first material may be adapted to form a surface with a lower surface energy than that provided by a thin film including the second material.

[0595] In some non-limiting examples, the patterned coating 110 may exhibit photoluminescence by including, but not limited to, a material that exhibits photoluminescence.

[0596] In some non-limiting examples, the first material may exhibit photoluminescence at wavelengths corresponding to the visible spectrum, and the second material may not exhibit significant photoluminescence at wavelengths corresponding to the visible spectrum.

[0597] In some non-limiting examples, the second material may exhibit substantially no photoluminescence at any wavelength corresponding to the visible spectrum. In some non-limiting examples, the second material may not exhibit photoluminescence when subjected to EM radiation having a wavelength of at least one of about 300 nm, 320 nm, 350 nm, and 365 nm. In some non-limiting examples, the second material may exhibit minimal to undetectable absorption when subjected to such EM radiation.

[0598] In some non-limiting examples, the second optical bandgap of the second material may be wider than the photon energy of the EM radiation emitted by the source, such that the second material does not undergo photoexcitation when subjected to such EM radiation. However, in some non-limiting examples, the patterned coating 110 containing such a second material may still exhibit photoluminescence when subjected to EM radiation due to the photoluminescence exhibited by the first material. In some non-limiting examples, the presence of the patterned coating 110 can be detected using conventional characterization techniques such as fluorescence microscopy when depositing the patterned coating 110.

[0599] In some non-limiting examples, the first material may have a first optical bandgap, and the second material may have a second optical bandgap. In some non-limiting examples, the second optical bandgap may exceed the first optical bandgap. In some non-limiting examples, the difference between the first and second optical bandgap may exceed one of about 0.3 eV, 0.5 eV, 0.7 eV, 1 eV, 1.3 eV, 1.5 eV, 1.7 eV, 2 eV, 2.5 eV, and 3 eV.

[0600] In some non-limiting examples, the first optical bandgap may be no more than one of about 4.1 eV, 3.5 eV, and 3.4 eV. In some non-limiting examples, the second optical bandgap may exceed one of about 3.4 eV, 3.5 eV, 4.1 eV, 5 eV, and 6.2 eV.

[0601] In some non-limiting examples, at least one of the first optical bandgap and the second optical bandgap may correspond to the HOMO-LUMO bandgap.

[0602] In some non-limiting examples, the optical bandgap of at least one of various coatings and materials (including, but not limited to, at least one of a first optical bandgap and a second optical bandgap) may correspond to the bandgap of at least one of the coatings and materials from which EM radiation is absorbed and emitted during the photoexcitation process.

[0603] In some non-limiting examples, the concentration (including but not limited to weight) of the first material in the patterned coating 110 may not exceed the concentration of the second material in the patterned coating 110. In some non-limiting examples, the patterned coating 110 may include at least about 0.1 wt%, 0.2 wt%, 0.5 wt%, 0.8 wt%, 1 wt%, 3 wt%, 5 wt%, 8 wt%, 10 wt%, 15 wt%, and 20 wt% of the first material. In some non-limiting examples, the patterned coating 110 may include no more than about 50 wt%, 40 wt%, 30 wt%, 25 wt%, 20 wt%, 15 wt%, 10 wt%, 8 wt%, 5 wt%, 3 wt%, and 1 wt% of the first material. In some non-limiting examples, the remainder of the patterned coating 110 may consist substantially of the second material. In some non-limiting examples, the patterned coating 110 may include additional materials, including but not limited to at least one of a third and a fourth material.

[0604] In some non-limiting examples, at least one of the materials of the patterned coating 110 (including, but not limited to, the first material and the second material) may include at least one of F and Si. As a non-limiting example, at least one of the first material and the second material may include at least one of F and Si. In some non-limiting examples, the first material may include at least one of F and Si, and the second material may include at least one of F and Si. In some non-limiting examples, both the first material and the second material may include F. In some non-limiting examples, both the first material and the second material may include Si. In some non-limiting examples, each of the first material and the second material may include at least one of F and Si.

[0605] In some non-limiting examples, at least one of the first and second materials may include both F and Si. In some non-limiting examples, one of the first and second materials may not include at least one of F and Si. In some non-limiting examples, the second material may include at least one of F and Si, and the first material may not include at least one of F and Si.

[0606] In some non-limiting examples, at least one of the materials of the patterned coating 110 (which may be, for example, at least one of a first material and a second material) may include F, and at least one of the other materials of the patterned coating 110 may include sp. 2 Carbon. In some non-limiting examples, at least one of the materials of the patterned coating 110 (including, but not limited to, at least one of the first and second materials) may include F, and at least one of the other materials of the patterned coating 110 may include sp. 3Carbon. In some non-limiting examples, at least one of the materials of the patterned coating 110 (including, but not limited to, at least one of the first and second materials) may include F and sp. 3 Carbon, and at least one of the other materials in the patterned coating 110 may include sp 2 Carbon. In some non-limiting examples, at least one of the materials of the patterned coating 110 (including, but not limited to, at least one of the first and second materials) may include F and sp. 3 Carbon, in which all F atoms bonded to C can be bonded to sp. 3 Carbon, and at least one of the other materials in the patterned coating 110 may include sp 2 Carbon. In some non-limiting examples, at least one of the materials of the patterned coating 110, including but not limited to at least one of the first and second materials, may include F and sp. 3 Carbon, in which all F atoms bonded to C can be bonded to sp. 3 Carbon, and at least one of the other materials in the patterned coating 110 may include sp 2 Carbon and may not include F. As a non-limiting example, in any of the foregoing non-limiting examples, "at least one of the materials of the patterned coating 110" may correspond to the second material, and "at least one of the other materials of the patterned coating 110" may correspond to the first material.

[0607] As will be understood by those skilled in the art, including F, sp 2 Carbon, sp 3 The presence of materials in a coating containing at least one of carbon, aromatic hydrocarbon moieties, other functional groups, and other moieties can be detected using a variety of methods known in the art, including, as a non-limiting example, X-ray photoelectron spectroscopy (XPS).

[0608] In some non-limiting examples, at least one of the materials of the patterned coating 110 (which, as a non-limiting example, may be at least one of a first material and a second material) may include F, and at least one of the other materials of the patterned coating 110 may include an aromatic hydrocarbon portion. In some non-limiting examples, at least one of the materials of the patterned coating 110 (including, but not limited to, at least one of a first material and a second material) may include F, and at least one of the materials of the patterned coating 110 may not include an aromatic hydrocarbon portion. In some non-limiting examples, at least one of the materials of the pa...

Claims

1. A solid-solid phase change material (PCM) used as a patterned coating, the patterned coating being adapted to influence the tendency of the evaporation flux of a deposited material to be deposited thereon, the patterned coating being used to be disposed on the surface of a first layer of a lower layer in a laterally oriented first portion of an optoelectronic device, such that a deposited layer containing the deposited material is deposited on the laterally oriented second portion, while the first portion is substantially free of a sealing coating of the deposited material.

2. The material according to claim 1, wherein the solid-solid PCM exhibits a solid-solid phase transition in a temperature range of about 0°C-200°C, 10°C-180°C, 15°C-140°C, 20°C-100°C, and 27°C-90°C.

3. The material according to claim 2, wherein the solid-solid phase transition occurs at atmospheric pressure.

4. The material according to claim 2, wherein the solid-solid phase transition occurs under reduced pressure.

5. The material according to claim 4, wherein the pressure reduction is no more than about 1 × 10⁻⁶. -7 Pa and 1×10 -6 One of Pa.

6. The material according to any one of claims 1 to 5, wherein the solid-solid PCM undergoes a solid-solid phase transition when exposed to the evaporation flux of the deposited material.

7. The material according to claim 2, wherein the overall melting point of the solid-solid PCM is at least within the temperature range in which the solid-solid phase transition occurs.

8. The material according to any one of claims 1 to 7, wherein the solid-solid PCM exhibits a differential scanning calorimetry (DSC) thermogram containing at least two endothermic peaks in a single thermal cycle.

9. The material according to claim 8, wherein the DSC thermogram contains at least one exothermic peak.

10. The material according to claim 8, wherein the DSC thermogram includes a first endothermic peak, a second endothermic peak, and an exothermic peak, and the peak temperature of the first endothermic peak does not exceed the peak temperature of the second endothermic peak.

11. The material according to claim 10, wherein the peak temperature of the exothermic peak is at least the peak temperature of the first endothermic peak.

12. The material according to claim 10 or 11, wherein the patterned coating is in the solid phase during each of the first endothermic peak and the exothermic peak.

13. The material according to any one of claims 10 to 12, wherein the peak temperature difference between the first endothermic peak and the second endothermic peak is at least one of about 5°C, 10°C, 15°C, 20°C, 25°C, 30°C, 35°C, 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, and 75°C.

14. The material according to any one of claims 10 to 12, wherein the peak temperature difference between the first endothermic peak and the exothermic peak is not more than one of about 60°C, 50°C, 45°C, 40°C, 35°C, 30°C, 25°C, 20°C and 15°C.

15. The material according to any one of claims 8 to 14, wherein the DSC thermogram is measured at a constant heating and cooling rate between about 5°C / min and 20°C / min.

16. The material according to any one of claims 8 to 15, wherein the DSC thermogram is measured at a constant heating and cooling rate of about 5°C / min, 10°C / min, 15°C / min and 20°C / min.

17. The material according to any one of claims 1 to 16, wherein the solid-solid PCM comprises a core portion, a first ligand portion, and a second ligand portion, wherein the first ligand portion and the second ligand portion are each bonded to the core portion.

18. The material of claim 17, wherein each of the first ligand portion and the second ligand portion independently comprises at least one of: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, etc. Substituted fluoroaryloxy groups, unsubstituted fluoroaryloxy groups, substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups.

19. The material according to claim 17, wherein the first ligand portion is represented by the chemical formula (FCM-1): (FCM-1) in: t It is an integer between 1 and 3; u It is an integer between 5 and 12; and Z It represents one of the following: H, D, and F.

20. The material according to claim 17, wherein the second ligand portion is represented by the chemical formula (FCM-2): (FCM-2) in: v It is an integer between 1 and 3; w It is an integer between 3 and 15; and Z It represents one of the following: H, D, and F.

21. The material according to any one of claims 17 to 20, wherein the number of F atoms in the first ligand portion and the second ligand portion differs by no more than one of about 2, 4, 6, 8, 9, 11, 13, 15, 16, 18, 20, 24 and 48.

22. The material of claim 17, wherein the core portion is a phosphononitrile portion.

23. The material according to any one of claims 1 to 22, wherein the solid-solid PCM comprises: Multiple cyclophosphonitrile moieties, each cyclophosphonitrile moiety being bonded to at least one other cyclophosphonitrile moieties via at least one linker moiety; and A plurality of cyclophosphonitrile moiety functional groups are bonded to the plurality of cyclophosphonitrile moiety functional groups, wherein at least one of the cyclophosphonitrile moiety functional groups contains an F-containing moiety.

24. The material of claim 23, wherein the plurality of cyclophosphonitrile portions comprises a first cyclophosphonitrile portion and a second cyclophosphonitrile portion; wherein a first linker portion bonds the first cyclophosphonitrile portion to the second cyclophosphonitrile portion.

25. The material according to claim 23, wherein the molecular structure of the solid-solid PCM is represented by the chemical formula (LPH-1): (LPH-1) in: L c The linker portion represents the linker portion, which includes at least one of the following: a single bond, C, CH, CH2, C R 1 C( R 1 )2, CHF, CF2, N, NH, N R 1 S, O, ether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene, substituted heteroalkylene, substituted adamantane moiety, unsubstituted adamantane moiety, substituted diamond-like moiety and unsubstituted diamond-like moiety; R Each of the cyclophosphonitrile functional groups represents a specific functional group. R Independently comprising at least one of the following: F, chlorine (Cl), hydroxyl group, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, substituted cycloalkyl group, unsubstituted cycloalkyl group, substituted fluorocycloalkyl group, unsubstituted fluorocycloalkyl group, substituted heterocyclic alkyl group, unsubstituted heterocyclic alkyl group, substituted fluoroheterocyclic alkyl group, unsubstituted fluorocyclic alkyl group, unsubstituted fluorocyclic alkyl group, substituted alkoxy group, unsubstituted alkoxy group, substituted fluoroalkoxy group, unsubstituted fluoroalkoxy group, substituted aryloxy group, unsubstituted aryloxy group, substituted fluoroaryloxy group, unsubstituted fluoroaryloxy group. Substituted heteroaryloxy groups, unsubstituted heteroaryloxy groups, substituted fluoroheteroaryloxy groups, unsubstituted fluoroheteroaryloxy groups, substituted aryl groups, unsubstituted aryl groups, substituted fluoroaryl groups, unsubstituted fluoroaryl groups, substituted alkylsilyl groups, unsubstituted alkylsilyl groups, substituted alkylsiloxy groups, unsubstituted alkylsiloxy groups, amino groups, amine groups, alkylamine groups, arylamine groups, nitrile groups, azophosphatidyl groups, thioalkyl groups, pentafluorothioalkyl groups, thioether groups, sulfonyl groups, thiol groups, alkylthioyl groups, trifluoromethylthioyl groups, carbonyl groups, siloxane groups, silyl groups, and organosilicon groups; m and n Each is an integer between 2 and 4; and Each R 1 Independently, it is at least one of the following: hydrogen (H), deuterium (D), F, substituted alkyl group, unsubstituted alkyl group, substituted fluoroalkyl group, unsubstituted fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

26. The material according to claim 23, wherein the molecular structure of said compound is represented by one of chemical formulas (LPH-5) and (LPH-6): (LPH-5) (LPH-6) in: Each Ar Independently representing the aromatic group; L B The bridging portion represents a portion comprising at least one of the following: a single bond, C, CH, CH2, CH3, or C. R 2 C( R 2 )2, CHF, CF2, CF3, CF2N, NH, N R 2 S, O, CO, SO2, ether, thioether, dithioether, substituted amine, unsubstituted amine, substituted alkylene, unsubstituted alkylene, substituted fluoroalkylene, unsubstituted fluoroalkylene, substituted arylene, unsubstituted arylene, substituted fluoroarylene, unsubstituted fluoroarylene, substituted heteroarylene, unsubstituted heteroarylene, substituted cycloalkylene, unsubstituted cycloalkylene, substituted heteroalkylene, unsubstituted heteroalkylene, substituted heteroalkylene and unsubstituted heteroalkylene; Each R f Independently comprising at least one of the following: C, F, CF2 moiety, CF2H moiety, CF3 moiety, SCF3 moiety, SF3 moiety, SF5 moiety, substituted fluoroaryl group, unsubstituted fluoroaryl group, branched fluoroalkyl group containing 2-15 C atoms, and non-branched fluoroalkyl group containing 2-15 C atoms; and Each R 2 Independently, it is at least one of the following: H, D, F, alkyl group, fluoroalkyl group, cycloalkyl group, alkoxy group, haloalkoxy group, fluoroalkoxy group, aryl group, haloaryl group, heteroaryl group, fluoroaryl group, carbonyl group, nitro group, thioether group, sulfonyl group, alkenyl group, and alkynyl group.

27. The material according to any one of claims 1 to 26, wherein the deposited material is at least one of the following: metal, metal alloy, metal oxide and metal fluoride.

28. The material according to any one of claims 1 to 27, wherein the deposited material comprises at least one of the following: potassium (K), sodium (Na), lithium (Li), barium (Ba), cesium (Cs), ytterbium (Yb), silver (Ag), gold (Au), copper (Cu), aluminum (Al), magnesium (Mg), zinc (Zn), cadmium (Cd), tin (Sn), nickel (Ni), yttrium (Y), Mg:Ag alloy, Yb:Ag alloy, Mg:Yb alloy, Ag:Mg:Yb alloy, and LiF.

29. An optoelectronic device, the optoelectronic device comprising: A patterned coating comprising a solid-solid PCM, the patterned coating being disposed on the surface of the first layer of the lower layer in the laterally oriented first portion of the optoelectronic device; as well as A deposition layer containing deposition material is disposed on the second portion; The first part is essentially free of the sealing coating of the deposited material.

30. The device of claim 29, wherein the patterned coating is adapted to reduce the initial adhesion probability in response to the evaporation flux of the deposited material.

31. The device of claim 30, wherein the solid-solid PCM undergoes a solid-solid phase transition when exposed to the evaporation flux of the deposited material.

32. The device according to any one of claims 29 to 31, the device further comprising a transmitting region, the transmitting region comprising: substrate; First electrode and second electrode; as well as At least one semiconductive layer is disposed between the first electrode and the second electrode; The first electrode is disposed between the substrate and the at least one semiconducting layer.

33. The device of claim 32, wherein the first portion does not include the lateral orientation of the transmitting region.

34. The device of claim 32, wherein the second electrode comprises at least a portion of the deposited layer as a layer thereof.

35. The device of claim 32, wherein the first portion includes the lateral orientation of the transmitting region.

36. The device according to any one of claims 29 to 35, the device further comprising an auxiliary electrode, the auxiliary electrode comprising the deposited layer as a layer thereof.

37. The device according to any one of claims 29 to 36, wherein the deposited material is at least one of the following: metal, metal alloy, metal oxide and metal fluoride.

38. The device according to any one of claims 29 to 37, wherein the deposited material comprises at least one of the following: potassium (K), sodium (Na), lithium (Li), barium (Ba), cesium (Cs), ytterbium (Yb), silver (Ag), gold (Au), copper (Cu), aluminum (Al), magnesium (Mg), zinc (Zn), cadmium (Cd), tin (Sn), nickel (Ni), yttrium (Y), Mg:Ag alloy, Yb:Ag alloy, Mg:Yb alloy, Ag:Mg:Yb alloy, and LiF.

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