Substrate processing apparatus and substrate processing method
By using a wavelength conversion layer and a camera unit in a substrate processing apparatus to perform optical characteristic detection on the periphery of the wafer, the problem of insufficient detection accuracy of the periphery of the wafer in the prior art is solved, and precise position alignment and efficient bonding are achieved in the wafer bonding process.
CN122228759APending Publication Date: 2026-06-16TOKYO ELECTRON LTD
Patent Information
- Application Number
- CN202480072995.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-01
- Filing Date
- 2024-11-18
- Publication Date
- 2026-06-16
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Figure CN122228759A_ABST
Abstract
A substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising: a substrate holding section holding the substrate; a light irradiation section irradiating an irradiation light to a peripheral portion of the substrate held by the substrate holding section; a light adjustment layer provided at least at an outer peripheral portion of the substrate holding section for changing a state of the irradiation light; and a light detection section receiving at least one of a reflection light from the substrate held by the substrate holding section and a reflection light from the light adjustment layer.
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Citation Information
Patent Citations
Substrate detecting apparatus, substrate aligning apparatus, substrate bonding apparatus having substrate detecting apparatus and substrate aligning apparatus, wafer outer shape detecting apparatus, wafer aligning apparatus, and wafer bonding apparatus having wafer outer shape detecting apparatus and wafer outer shape detec
WO2008153086A1