Electronic device, housing plate body of electronic device, and manufacturing method thereof

By forming light-transmitting holes on the substrate and filling them with transparent light-curing adhesive, the problem of dust accumulation on the patterns of electronic device casings is solved, achieving a smooth casing surface and clear pattern display.

CN122232005APending Publication Date: 2026-06-19GIGA BYTE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GIGA BYTE TECH CO LTD
Filing Date
2024-12-18
Publication Date
2026-06-19

Smart Images

  • Figure CN122232005A_ABST
    Figure CN122232005A_ABST
Patent Text Reader

Abstract

An electronic device, a housing plate of the electronic device, and a method for manufacturing the same are disclosed. The method for manufacturing the housing plate includes the following steps: preparing a substrate; forming a plurality of light-transmitting holes in a local area of ​​the substrate, each light-transmitting hole penetrating the outer surface and inner surface of the substrate, and the plurality of light-transmitting holes being arranged in a pattern; filling each light-transmitting hole with a transparent light-curing adhesive, the transparent light-curing adhesive being in an uncured state; and emitting light to irradiate the transparent light-curing adhesive in each light-transmitting hole, causing the transparent light-curing adhesive to react from an uncured state to a cured state.
Need to check novelty before this filing date? Find Prior Art