Ceramic substrate and method for manufacturing the same
By adding silica, zirconium oxide, and magnesium oxide whiskers to the alumina ceramic formulation and optimizing the ball milling and sintering processes, the problem of insufficient thermal shock resistance of alumina ceramic substrates was solved, resulting in high-strength ceramic substrates with low expansion coefficients, suitable for high-temperature alternating environments.
CN122233809APending Publication Date: 2026-06-19SHANDONG ZHONGWEI ELECTRONIC TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANDONG ZHONGWEI ELECTRONIC TECH CO LTD
- Filing Date
- 2026-04-03
- Publication Date
- 2026-06-19
Smart Images
Figure SMS_4
Abstract
This invention relates to a ceramic substrate and its preparation method, belonging to the technical field of ceramic materials. The ceramic substrate comprises the following components by mass percentage: 96%~98% alumina, 0.75%~1.5% zirconium oxide, 1%~2% magnesium oxide whiskers, and 0.75%~1.5% silicon dioxide; wherein the total of alumina, zirconium oxide, magnesium oxide whiskers, and silicon dioxide is 100%. This invention also provides a method for preparing the ceramic substrate. The ceramic substrate of this invention balances thermal shock resistance, mechanical strength, and structural stability, solving the technical problems of traditional ceramic substrates being prone to cracking and lacking strength under high-temperature alternating environments. It can be widely applied in high-power electronic device packaging, semiconductor heat dissipation, and other fields, possessing significant practical value and promotion potential.
Need to check novelty before this filing date? Find Prior Art