Reactive hot melt resin composition, and hardened product, sealing material, insulating material, and laminate using the resin composition
CN122234346APending Publication Date: 2026-06-19DIC CORP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DIC CORP
- Filing Date
- 2025-12-12
- Publication Date
- 2026-06-19
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Abstract
This invention provides a reactive hot melt resin composition capable of forming a hardened film with excellent flexibility, insulation, moisture resistance, and resistance to damp heat, as well as a hardened product, sealant, insulating material, and laminate using said resin composition. A reactive hot melt resin composition contains at least a urethane (meth)acrylate, said urethane (meth)acrylate being a reaction product using a polyol (A), a polyisocyanate (B), and a (meth)acrylate (C) containing an active hydrogen group as essential raw materials. The polyol (A) comprises: an alicyclic polyester polyol (A1) having structural units derived from an alicyclic polycarboxylic acid or its anhydride and structural units derived from a linear polyol; and an alicyclic polyester polyol (A2) having structural units derived from an alicyclic polycarboxylic acid or its anhydride and structural units derived from a side-chain polyol.
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Citation Information
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