Photocurable encapsulation composition, encapsulation structure, and semiconductor device

Abstract

This invention provides a photocurable encapsulation composition, an encapsulation structure, and a semiconductor device. The photocurable encapsulation composition comprises 50-95 parts of a photocurable cationic monomer and 0.1-10 parts of a cationic photoinitiator; the photocurable cationic monomer with a relative molecular mass greater than 200 and a boiling point greater than 250°C at 1 atm accounts for 90-99.9 wt% of the total mass of the photocurable encapsulation composition; the photocurable cationic monomer comprises one or more (Z... 1 ) a -A 1 -(Z) 2 ) b Monomer; A 1 The total mass percentage of the photocurable cationic monomer containing any one of substituted or unsubstituted arylene and substituted or unsubstituted cycloalkyl groups in the photocurable encapsulation composition is 50–99.9 wt%. Applying the organic layer formed by the above photocurable encapsulation composition to the encapsulation structure helps to improve the heat resistance of the encapsulation structure, thereby helping to extend the service life of semiconductor devices.

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