A desktop rapid evaporation device

By combining the dual vapor deposition sources and the angle tilting mechanism of the benchtop rapid vapor deposition equipment, the uniformity and safety issues existing in the coating of complex curved surface samples are solved, achieving efficient and safe coating results for complex curved surfaces.

CN122235643APending Publication Date: 2026-06-19NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
Filing Date
2026-03-24
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing vapor deposition equipment has shortcomings in structural design and process adaptability, making it difficult to achieve full coverage of complex curved surface samples. Furthermore, it is cumbersome to operate, has poor safety, and cannot meet the requirements for high uniformity and consistency in coating.

Method used

A benchtop rapid vapor deposition equipment is used, equipped with a detachable dual vapor deposition source, an angle tilting mechanism, and a film thickness measurement system to achieve dynamic adjustment and real-time monitoring. The dual vapor deposition source improves vapor deposition efficiency, eliminates vapor deposition dead zones, and the angle tilting mechanism adjusts the sample posture in real time to avoid shadow effects.

Benefits of technology

It improves the efficiency and safety of vapor deposition, enables high-quality and high-efficiency coating of complex curved surface samples, ensures film uniformity and consistency, and simplifies the operation process.

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Abstract

This invention discloses a benchtop rapid vapor deposition device for coating samples, comprising: an evaporation system, a vacuum system, and a film thickness measurement system; a top cover is provided on the top of the vacuum chamber, and a dual vapor deposition source is detachably mounted on the bottom of the top cover; an angle tilting mechanism is provided on the top of the evaporation chamber and located within the vacuum chamber, with the sample fixed on top of the angle tilting mechanism and at the bottom of the dual vapor deposition sources; the film thickness measurement system is located on top of the angle tilting mechanism and is flush with the sample height. This device can simultaneously vapor deposit one or two high-purity coating materials, effectively improving the vapor deposition rate, making the film formation on complex curved sample surfaces more uniform, and eliminating vapor deposition dead zones; it also prevents the coating material from falling off or dropping from the vapor deposition source during handling, ensuring the reliability and operational safety of the device; simultaneously, the vapor deposition direction and angle of the sample can be adjusted in real time to avoid shadowing effects or uneven thickness caused by a fixed angle.
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