A synchronous bonding device for multiple rubberized parts

By combining a lifting displacement mechanism, mounting base, bonding unit, and controller, and utilizing pressure sensors to detect and form a closed-loop control, the problem of pressure consistency and controllability during the synchronous bonding of multiple glued parts is solved, achieving efficient and precise multi-station bonding results.

CN122236718APending Publication Date: 2026-06-19SHUNYI TECHNOLOGY (SHANDONG) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHUNYI TECHNOLOGY (SHANDONG) CO LTD
Filing Date
2026-03-30
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve consistent and controllable pressure when bonding multiple glued parts simultaneously. This is especially true when there are differences in part dimensional tolerances, assembly heights, or glue thickness, which can easily lead to inconsistent glue layer thickness, part positional shifts, and decreased bonding reliability.

Method used

The system employs a combination of a lifting displacement mechanism, mounting base, bonding unit, and controller. It uses a pressure sensor to detect bonding pressure and form a closed-loop control. By utilizing the elastic deformation of floating and elastic components upon contact, it achieves synchronous bonding and precise control of multiple glued parts.

Benefits of technology

It improves the pressure consistency and bonding quality stability when bonding multiple glued parts simultaneously, ensuring the efficiency and accuracy of multi-station simultaneous bonding, and reducing the problem of uneven force due to size differences.

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Abstract

This application provides a device for synchronously bonding multiple glued parts, relating to the field of precision assembly and automated bonding technology. The device includes a lifting and displacement mechanism, a mounting base, at least two bonding units, and a controller. The mounting base is connected to the lifting and displacement mechanism, and the bonding units are mounted on the mounting base. Each bonding unit includes a support member, a floating member, an elastic member, and a pressure sensor. The support member is connected to the floating member. The elastic member is configured to elastically deform after the glued part contacts the part to be bonded, due to the lifting and displacement mechanism continuing to drive the mounting base to move along the bonding direction, thereby applying bonding pressure to the glued part. The pressure sensor detects the bonding pressure and / or the force signal corresponding to the bonding pressure and outputs the detection signal to the controller. The controller performs closed-loop control of the lifting and displacement mechanism based on the detection signal. This device can achieve precise control of the coating and bonding of multiple glued parts and the bonding pressure.
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