Optical module high-low temperature testing device

The high and low temperature testing device for optical modules with an integrated structural design solves the problems of low integration and low temperature control accuracy of existing equipment. It enables rapid temperature switching and precise temperature control of optical modules in high and low temperature environments, thereby improving testing efficiency and the stability of results.

CN122237894APending Publication Date: 2026-06-19SHENZHEN WEIDU TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN WEIDU TECHNOLOGY CO LTD
Filing Date
2026-05-19
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing high and low temperature testing equipment for optical modules suffers from low integration and low temperature control accuracy, resulting in insufficient testing efficiency and reliability.

Method used

The high and low temperature testing device for optical modules adopts an integrated structural design, including a testing module, a temperature control module, and a heat dissipation module. The test channel is formed by the embedded substrate, and bidirectional heat transfer is achieved by using temperature control and contact heat-conducting components. Combined with liquid cooling and air cooling, the integration and accuracy of temperature regulation are improved.

Benefits of technology

It enables rapid temperature switching and precise temperature control of optical modules in high and low temperature environments, improving testing efficiency and result stability, and enhancing the overall integration and ease of use of the equipment.

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Abstract

This invention discloses a high and low temperature testing device for optical modules, comprising a testing module, a temperature control module, and a heat dissipation module. The testing module includes a first base and a second base interlocked together, forming a testing channel between them for establishing a test connection between the optical module under test. Both the first and second bases have temperature transfer ports communicating with the testing channel. The temperature control module is configured on both the first and second bases, each including a temperature control element and a heat-conducting contact element. The temperature control element forms a heat transfer path with the testing channel through the temperature transfer port and provides bidirectional heat transfer to the testing channel. The heat-conducting contact element is located at the temperature transfer port and extends at least partially to the boundary of the testing channel. The heat dissipation module is coupled to the temperature control element for contact heat exchange. This improves the response speed and control accuracy of temperature regulation, facilitating the acquisition of more stable and reliable test results.
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