A testing device for adhesive backing production

Abstract

This invention relates to the field of adhesive backing testing technology and discloses a testing device for adhesive backing production, including a housing. The housing has a cover plate at the top, a shell fixedly connected to the bottom outer wall, and a through groove on the bottom inner wall for communication between the shell and the housing. The top inner wall of the housing has a bonding plate, and one side inner wall of the housing has an adhesive backing board with adhesive applied to it. One side outer wall of the shell has a bonding assembly for attaching the adhesive backing board to the bonding plate, and one side of the bonding plate has a detection assembly for detecting the adhesive backing board bonded to it. This invention not only enables flexible adjustment of the vertical pressure and center of gravity distribution of the adhesive backing board through various insertion methods of multiple counterweights in the counterweight assembly with the first and second dovetail grooves in the cavity, but also allows for the rotation of the bonding plate via a rotating assembly, simulating the bonding conditions of the adhesive backing board on different horizontal planes.

Description

Technical Field

[0001] This invention relates to the field of adhesive testing technology, specifically to a testing device for adhesive production. Background Technology

[0002] Adhesive-backed products, especially double-sided tapes, are widely used in electronics, automotive, construction, and consumer goods industries. Their adhesive properties directly affect the product's performance and reliability. During the production process of adhesive-backed products, adhesive performance testing is typically required to ensure their anti-slip capability in practical applications.

[0003] Currently, the common method for testing adhesive backing is to paste the adhesive sample onto a flat plate and then observe whether the adhesive surface shifts after a period of time. However, flat plates are mostly fixed structures and cannot be adjusted according to the actual weight distribution of the object being pasted. They also cannot simulate the stress state caused by the shift of the center of gravity of different objects after pasting (such as top-heavy, bottom-light, left-heavy, right-light, etc.), resulting in significant deviations between the test results and the actual working conditions. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a testing device for adhesive backing production. The main purpose is to solve the problem that most flat plates are fixed structures, which cannot be adjusted according to the actual weight distribution of the objects being bonded, nor can they simulate the stress state of different objects after bonding due to the shift in the center of gravity, resulting in significant deviations between the test results and the actual working conditions.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A testing device for adhesive backing production includes a box body, a cover plate on the top of the box body, a shell fixedly connected to the bottom outer wall of the box body, a through groove on the bottom inner wall of the box body for communicating with the shell and the box body, an adhesive plate on the top inner wall of the box body, and an adhesive backing plate with adhesive backing on one side inner wall of the box body. One outer wall of the housing is provided with a bonding assembly for attaching the adhesive backing to the bonding plate. One side of the bonding plate is provided with a detection assembly for detecting the adhesive backing attached to the bonding plate. The adhesive backing is provided with a counterweight assembly for adjusting the vertical pressure of the adhesive backing. The bottom inner wall of the housing is provided with a rotating assembly for driving the bonding plate to rotate. One outer wall of the housing is provided with a simulation assembly for simulating the temperature experienced by the adhesive backing during actual use.

[0006] Furthermore, the counterweight assembly includes cavities respectively formed on both sides of the adhesive backing plate, with multiple counterweight blocks disposed within the cavities. Multiple equidistant first dovetail grooves are formed on the inner walls of both sides of the cavities. Each counterweight block has an integrally formed insert on three sides that engages with the first dovetail grooves. A second dovetail groove is formed on the other side of each counterweight block. Two symmetrically arranged slots are formed on both sides of the adhesive backing plate, with a stopper inserted into each slot. The stopper is used to limit the movement of the multiple counterweight blocks. Two indexing pins are threaded to the top and bottom of the adhesive backing plate. Insertion holes are formed on the top and bottom of the stopper, and the indexing pins pass through the adhesive backing plate and engage with the insertion holes.

[0007] Based on the aforementioned solution, the bonding assembly includes a second hydraulic cylinder fixed to the outer wall of one side of the housing. The telescopic end of the second hydraulic cylinder passes through the housing and is fixedly connected to a movable plate. A plurality of evenly distributed limiting blocks are fixedly connected to one side of the movable plate. The top and bottom of the adhesive backing are provided with a plurality of limiting grooves that cooperate with the limiting blocks for insertion. A plurality of telescopic rods are provided on the outer wall of one side of the housing. The telescopic ends of the telescopic rods pass through the housing and are fixed to the movable plate. The plurality of telescopic rods are located at the four corners of the movable plate. An adsorption assembly for fixing the adhesive backing is provided on the side of the movable plate away from the limiting blocks.

[0008] As a further embodiment of the present invention, the detection component includes two symmetrically arranged second distance sensors fixedly connected to the bottom end of one side of the bonding plate, a rotating plate rotatably connected to the top of the bonding plate via a bearing seat, a first distance sensor fixedly connected to the lower surface of the rotating plate, and a magnetic block fixedly connected to one side of the bonding plate, the magnetic block being attracted to the rotating plate.

[0009] Furthermore, the adsorption assembly includes a manifold fixedly connected to one side of the movable plate. The manifold has multiple evenly distributed suction cups on the side near the adhesive backing. The suction cups are in contact with the back of the adhesive backing. A flexible hose is connected to one side of the manifold via a flange, and the other end of the flexible hose passes through the housing.

[0010] Based on the aforementioned scheme, the rotating assembly includes a first hydraulic cylinder rotatably connected to the inner wall of the bottom of the housing via a bearing seat. The telescopic end of the first hydraulic cylinder is rotatably connected to the bonding plate. Two fixing blocks are fixedly connected to the inner wall of the bottom of the housing. The two fixing blocks are rotatably connected to the bottom of the bonding plate. A photoelectric rotary encoder is fixedly connected to the inner wall of the bottom of the housing. The detection end of the photoelectric rotary encoder is fixed to the rotation shaft of the bonding plate. A clamping assembly for fixing the bonding plate is provided on the inner wall of the bottom of the housing.

[0011] As a further embodiment of the present invention, the clamping assembly includes a fixing plate fixedly connected to the inner wall of the bottom of the box, a third hydraulic cylinder fixedly connected to one side of the fixing plate, the telescopic end of the third hydraulic cylinder passing through the fixing plate and fixedly connected to a pressure block, the pressure block having an arc-shaped structure, and a protrusion for cooperating with the pressure block fixedly connected to the side of the bonding plate near the pressure block.

[0012] Furthermore, the simulation component includes a circulation pump fixedly connected to the inner wall of one side of the housing. The air inlet of the circulation pump is connected to a first connecting pipe via a flange, and the other end of the first connecting pipe is connected to the housing. The air outlet of the circulation pump is connected to a second connecting pipe via a flange, and the other end of the second connecting pipe is connected to two branch pipes via a tee connector. The ends of the two branch pipes are respectively equipped with a heating component and a cooling component. The bottom outer wall of the housing is equipped with a second air guide pipe. The outer side of the second air guide pipe is connected to two first air guide pipes via an electric tee ball valve. The two first air guide pipes are respectively connected to the heating component and the cooling component. The outer side of the second air guide pipe is fixedly connected to multiple equidistantly distributed air outlet pipes, which are connected to the housing. The branch pipes are equipped with check valves. The bottom outer wall of the housing is fixedly connected to two symmetrically distributed fixing brackets.

[0013] Based on the aforementioned scheme, the heating assembly includes a heating shell fixedly connected to the upper surface of one of the fixing frames. The heating shell is connected to the corresponding first air guide pipe and branch pipe, and a heating wire is provided inside the heating shell.

[0014] As a further embodiment of the present invention, the cooling assembly includes a cooling shell fixedly connected to the upper surface of another fixed frame. The cooling shell is connected to the corresponding first air duct and branch pipe. A semiconductor cooling plate is provided inside the cooling shell. Multiple first heat-conducting plates are fixedly connected to the cold side of the semiconductor cooling plate, and multiple second heat-conducting plates are fixedly connected to the hot side of the semiconductor cooling plate. The second heat-conducting plates pass through the cooling shell. A heat dissipation fan is fixedly connected to the bottom outer wall of the cooling shell. The heat dissipation fan is used to accelerate the heat dissipation of the second heat-conducting plates.

[0015] Compared with the prior art, the present invention provides a testing device for adhesive backing production, which has the following beneficial effects: 1. This invention achieves flexible adjustment of the vertical pressure and center of gravity distribution of the backing board by using multiple insertion methods of multiple counterweight blocks in the counterweight assembly and the first and second dovetail grooves in the cavity, thus solving the problem that existing detection methods cannot simulate complex stress conditions due to the fixed plate.

[0016] 2. This invention drives the bonding plate to rotate by a rotating component, which can not only simulate the bonding conditions of the adhesive on different horizontal planes, but also provide space for the placement and removal of the adhesive plate before and after testing, significantly improving the diversity of testing and the convenience of operation.

[0017] 3. This invention achieves precise control of the ambient temperature inside the chamber and switching between hot and cold by simulating the coordinated operation of the circulating pump, electric three-way ball valve, heating component and cooling component in the simulation component.

[0018] 4. This invention achieves precise bonding between the adhesive backing board and the bonding board through the bonding component, ensuring that the adhesive backing board remains horizontal and does not shift laterally during the bonding process, thus guaranteeing the horizontal advancement of the moving board and effectively avoiding detection errors caused by poor bonding or uneven force.

[0019] 5. This invention, through a heating component, a cooling component, a rotating component, a backing plate with a counterweight component, and first and second ranging sensors, can perform multiple detection methods individually or in combination according to actual needs, thereby achieving comprehensive detection of the anti-slip capability of the backing adhesive under various complex working conditions. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a testing device for adhesive production proposed in this invention; Figure 2 This invention provides a testing device for adhesive backing production. Figure 1 A partial sectional view of the structure; Figure 3 This is a schematic cross-sectional view of the housing structure of a testing equipment for adhesive production proposed in this invention. Figure 4 This is a schematic diagram of the exploded structure of the moving plate of a testing device for adhesive production proposed in this invention. Figure 5 This is a schematic diagram of the adsorption component and bonding component of a testing device for adhesive production proposed in this invention; Figure 6 This is a schematic diagram of the exploded structure of the retaining frame of a testing device for adhesive production proposed in this invention; Figure 7 This is a schematic cross-sectional view of the adhesive backing board of a testing device for adhesive backing production proposed in this invention. Figure 8 This is a schematic diagram of the horizontally placed counterweight structure of a testing device for adhesive production proposed in this invention; Figure 9 This is a schematic diagram of the counterweight stacking structure of a testing equipment for adhesive production proposed in this invention; Figure 10 This is a schematic diagram of the detection component and pressing component of a testing device for adhesive production proposed in this invention; Figure 11 This is an enlarged structural diagram of the pressing component of a testing device for adhesive backing production proposed in this invention; Figure 12This is a schematic diagram of a simulated component structure of a testing device for adhesive production proposed in this invention; Figure 13 This is a schematic diagram of the exploded structure of the first air duct of a testing device for adhesive production proposed in this invention. Figure 14 This is a cross-sectional view of the cooling shell structure of a testing device for adhesive production proposed in this invention.

[0021] In the diagram: 1. Rotating assembly; 2. Detection assembly; 3. Counterweight assembly; 4. Simulation assembly; 5. Adsorption assembly; 6. Bonding assembly; 7. Pressing assembly; 8. Heating assembly; 9. Cooling assembly; 10. Cover plate; 11. Box body; 12. Shell; 13. Through groove; 14. Bonding plate; 15. Adhesive backing plate; 101. First hydraulic cylinder; 102. Fixing block; 103. Photoelectric rotary encoder; 201. Rotating plate; 202. First ranging sensor; 203. Magnetic block; 204. Second ranging sensor; 301. Indexing pin; 302. Slot; 303. Insertion hole; 304. Stop; 305. Cavity; 306. First dovetail groove; 307. Counterweight block; 308. Second dovetail groove; 309. Insertion block; 40 1. First connecting pipe; 402. Second connecting pipe; 403. Circulating pump; 404. Branch pipe; 405. Check valve; 406. First air guide pipe; 407. Electric three-way ball valve; 408. Second air guide pipe; 409. Air outlet pipe; 410. Fixing frame; 501. Hose; 502. Manifold; 503. Suction cup; 601. Second hydraulic cylinder; 602. Telescopic rod; 603. Moving plate; 604. Limiting block; 605. Limiting groove; 701. Fixing plate; 702. Pressing block; 703. Protrusion; 704. Third hydraulic cylinder; 801. Heating shell; 802. Heating wire; 901. Cooling shell; 902. First heat conduction plate; 903. Semiconductor cooling plate; 904. Second heat conduction plate; 905. Cooling fan. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0023] The component designations used in this document, such as "first" and "second," are merely for distinguishing the described objects and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] Please see Figures 1-14 As shown, a testing device for adhesive production includes a box 11, a cover plate 10 on the top of the box 11, the cover plate 10 and the box 11 are fixed together by a lock, a shell 12 is welded to the bottom outer wall of the box 11, and an adhesive board 15 with adhesive on one side inner wall of the box 11 is provided. Before testing, the adhesive to be tested is pasted onto the adhesive board 15. The backing board 15 is provided with a counterweight assembly 3. The counterweight assembly 3 is used to adjust the vertical pressure of the backing board 15. The counterweight assembly 3 includes cavities 305 respectively opened on both sides of the backing board 15. Multiple counterweight blocks 307 are provided in the cavity 305. Multiple first dovetail grooves 306 are opened on both sides of the inner wall of the cavity 305. The counterweight block 307 has an insert block 309 integrally formed on three sides that is inserted into the first dovetail groove 306. A second dovetail groove 308 is opened on the other side of the counterweight block 307. The method for installing the counterweight 307 on the adhesive backing board 15 is as follows: Method 1: Place the counterweight 307 vertically. Insert one insert 309 located on the side of the counterweight 307 into the first dovetail groove 306 on one side. Then, insert the remaining inserts 309 into the corresponding first dovetail grooves 306 on their respective sides. Install the counterweight 307 in the other cavity 305 in the same manner until all counterweights 307 are fully embedded, ensuring all counterweights 307 are on the same horizontal plane. At this point, the weight of the counterweight is relatively even (e.g., ...). Figure 6 (as shown) Method 2: After rotating the counterweight 307 horizontally by 90°, insert it so that the inserts 309 on both sides of the counterweight 307 are respectively inserted into the adjacent first dovetail grooves 306. At this time, the counterweights 307 are in a longitudinally stacked state. By adjusting the number of counterweights 307 in the cavities 305 on both sides or the stacking height, the backing plate 15 can be made to form a center of gravity distribution that is heavy at the top and light at the bottom or heavy on the left and light on the right (e.g., Figure 8 (as shown) Method 3: Insert only one of the counterweights 307 into one of the cavities 305, leaving the other cavity 305 empty; or insert a small number of counterweights 307 into one cavity 305 and a large number of counterweights 307 into the other cavity 305, so that the adhesive backing 15 is in a state of being unbalanced on one side. Method 4: Insert one insert 309 located on the side of the counterweight 307 into the first dovetail groove 306 on one side, and insert the other insert 309 on the side of the counterweight 307 into the second dovetail groove 308 on the other side of the counterweight 307, stacking them (e.g., ...). Figure 9 (as shown) By flexibly connecting multiple counterweights 307, the vertical pressure and center of gravity distribution of the adhesive backing 15 can be adjusted to simulate the actual weight distribution of different objects after pasting. This solves the problem that the existing detection method, which uses a fixed flat plate, cannot simulate the weight distribution and center of gravity shift of different objects.

[0026] Two symmetrically arranged slots 302 are provided on both sides of the adhesive backing 15. A stop 304 is inserted into the two slots 302. The stop 304 is used to limit the multiple counterweights 307 to prevent the counterweights 307 from shifting under vibration or tilting conditions. The top and bottom of the adhesive backing plate 15 are threaded with two indexing pins 301. The top and bottom of the retainer 304 are provided with insertion holes 303. The indexing pins 301 pass through the adhesive backing plate 15 and are inserted into the insertion holes 303, thereby achieving precise positioning and stable locking of the retainer 304. It should be noted that the indexing pin 301 is existing technology, and those skilled in the art can set it according to actual needs, which will not be elaborated here; After the counterweight 307 is installed, insert the stop 304 into the slot 302, and rotate the indexing pin 301 to make it pass through the adhesive backing plate 15 and then insert it into the insertion hole 303 of the stop 304 to complete the fixing of the stop 304. After the counterweight 307 is inserted into the cavity 305, the end of the counterweight 307 will protrude from one side of the adhesive backing plate 15, making it easy to remove the counterweight 307 from the cavity 305 or adjust its position.

[0027] The top inner wall of the housing 11 is provided with a bonding plate 14, which is used to bond the adhesive backing plate 15. The outer wall of one side of the housing 12 is provided with a bonding assembly 6 for bonding the adhesive backing plate 15 to the bonding plate 14. The bonding assembly 6 includes a second hydraulic cylinder 601 fixed to the outer wall of one side of the housing 12. The telescopic end of the second hydraulic cylinder 601 passes through the housing 12 and is fixed with a moving plate 603 by bolts. The bonding plate 14 is placed on the moving plate 603, and then the second hydraulic cylinder 601 is activated. The telescopic end of the second hydraulic cylinder 601 pushes the moving plate 603 toward the bonding plate 14, so that the bonding plate 14 and the adhesive backing plate 15 are in close contact. Multiple evenly distributed limiting blocks 604 are welded to one side of the movable plate 603. Multiple limiting grooves 605 are provided on the top and bottom of the adhesive backing plate 15 to engage with the limiting blocks 604. Through the precise engagement of the multiple limiting blocks 604 and the limiting grooves 605, not only is the precise positioning of the adhesive backing plate 15 achieved, but it is also ensured that the adhesive backing plate 15 will not shift laterally during the bonding process. Multiple telescopic rods 602 are provided on one outer wall of the housing 12. The telescopic ends of the telescopic rods 602 pass through the housing 12 and are fixed to the moving plate 603. The multiple telescopic rods 602 are located at the four corners of the moving plate 603. Through the synchronous extension and retraction of the multiple telescopic rods 602, the moving plate 603 is kept horizontal during the advancement process, so as to avoid the bonding plate 14 and the backing plate 15 not being firmly bonded due to uneven force.

[0028] The movable plate 603 is provided with an adsorption assembly 5 for fixing the adhesive backing plate 15 on the side away from the limiting block 604. The adsorption assembly 5 includes a manifold 502 fixed to one side of the movable plate 603 by bolts. The manifold 502 is provided with a plurality of evenly distributed suction cups 503 on the side close to the adhesive backing plate 15. The suction cups 503 are in contact with the back of the adhesive backing plate 15. The suction cups 503 are used to adsorb and fix the adhesive backing plate 15 to prevent the adhesive backing plate 15 from shifting during the bonding process. One side of the manifold 502 is connected to a hose 501 via a flange. The other end of the hose 501 passes through the housing 12 and is connected to an external vacuum pump. After the adhesive backing plate 15 is placed on one side of the moving plate 603, the external vacuum pump is started. The negative pressure is transmitted to the manifold 502 through the hose 501 and then evenly distributed to each suction cup 503, so that the adhesive backing plate 15 is firmly adsorbed onto the surface of the moving plate 603.

[0029] A detection component 2 for detecting the adhesive backing 15 bonded to the adhesive backing 15 is provided on one side of the bonding plate 14. The detection component 2 includes two symmetrically arranged second distance sensors 204 fixed to the bottom end of one side of the bonding plate 14 by bolts. By using the two second distance sensors 204 together, not only can the sliding distance of the adhesive backing 15 be detected, but also whether the adhesive backing 15 is tilted. When the adhesive backing 15 slides or tilts due to adhesive failure, the difference in the data measured by the two second distance sensors 204 will appear. The top of the bonding plate 14 is rotatably connected to the rotating plate 201 via a bearing seat. The lower surface of the rotating plate 201 is fixed with a first distance sensor 202 by bolts. A magnetic block 203 is fixed to one side of the bonding plate 14 by bolts. The magnetic block 203 is attracted to the rotating plate 201. The first distance sensor 202 can monitor whether the top of the backing plate 15 is lifted. When the backing plate 15 is lifted, the distance between the first distance sensor 202 and the top of the backing plate 15 will decrease. It should be noted that: In this application, the first ranging sensor 202 and the second ranging sensor 204 are both prior art, and both the first ranging sensor 202 and the second ranging sensor 204 can be selected as model PDC-030-A; the magnetic block 203 adopts neodymium iron boron permanent magnet, while the rotating plate 201 that cooperates with the magnetic block 203 to magnetically attract is made of ferritic stainless steel, so as to achieve magnetic attraction. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0030] When bonding the adhesive backing plate 15, the rotating plate 201 is flipped to separate it from the magnetic block 203, thus creating a clearance for the adhesive backing plate 15. After the adhesive backing plate 15 is bonded to the bonding plate 14, the rotating plate 201 is reset and re-attached to the magnetic block 203. At this time, the first ranging sensor 202 remains flush with one side of the top of the adhesive backing plate 15.

[0031] The bottom inner wall of the housing 11 is provided with a through groove 13 for communicating with the housing 12. The bottom inner wall of the housing 12 is provided with a rotating assembly 1 for driving the bonding plate 14 to rotate. The rotating assembly 1 includes a first hydraulic cylinder 101 rotatably connected to the bottom inner wall of the housing 12 through a bearing seat. The telescopic end of the first hydraulic cylinder 101 is rotatably connected to the bonding plate 14. The first hydraulic cylinder 101 is used to drive the bonding plate 14 to rotate. Two fixing blocks 102 are fixed to the bottom inner wall of the box 11 by bolts. The two fixing blocks 102 are rotatably connected to the bottom of the adhesive plate 14. When the extension end of the first hydraulic cylinder 101 is activated, it extends or retracts, causing the adhesive plate 14 to rotate around the fixing blocks 102 as the fulcrum, thereby adjusting the tilt angle of the backing plate 15.

[0032] The function of adjusting the angle of the bonding plate 14 is as follows: Function 1: Before the adhesive backing test, rotating the adhesive backing board 15 to a horizontal position can create a clearance when the adhesive backing board 15 is placed on the moving plate 603, making it easier to place the adhesive backing board 15 on the moving plate 603. Function 2: After the adhesive backing test is completed, rotate the adhesive backing board 15 to a horizontal position to facilitate the removal and removal of the adhesive backing board 15 from the moving plate 603; Function 3: During the adhesive backing test, by adjusting the tilt angle of the bonding plate 14, the actual bonding conditions of the adhesive backing plate 15 on different horizontal planes can be simulated.

[0033] A photoelectric rotary encoder 103 is fixed to the bottom inner wall of the housing 11 by bolts. The detection end of the photoelectric rotary encoder 103 is fixed to the rotation shaft of the bonding plate 14. The real-time rotation angle of the bonding plate 14 is detected by the photoelectric rotary encoder 103. It should be noted that the photoelectric rotary encoder 103 in this application is prior art. The photoelectric rotary encoder 103 can be of model TRD-J1000-RZ. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0034] The bottom inner wall of the housing 11 is provided with a clamping assembly 7 for fixing the bonding plate 14. The clamping assembly 7 includes a fixing plate 701 fixed to the bottom inner wall of the housing 11 by bolts. A third hydraulic cylinder 704 is fixed to one side of the fixing plate 701 by bolts. The telescopic end of the third hydraulic cylinder 704 passes through the fixing plate 701 and is fixed to a pressure block 702 by bolts. The pressure block 702 has an arc-shaped structure. A protrusion 703 that cooperates with the pressure block 702 is fixed to the side of the bonding plate 14 near the pressure block 702 by bolts. When the third hydraulic cylinder 704 is activated, the telescopic end of the third hydraulic cylinder 704 pushes the pressure block 702 towards the protrusion 703 until the pressure block 702 and the protrusion 703 are tightly fitted, thereby fixing the bonding plate 14 at the current tilt angle and preventing the angle of the bonding plate 14 from changing due to vibration or other external forces during the testing process, which would affect the accuracy of the test data.

[0035] It should be noted that the first hydraulic cylinder 101, the second hydraulic cylinder 601 and the third hydraulic cylinder 704 in this application are all actuators in the hydraulic system. They achieve the telescopic function by cooperating with the hydraulic system, and achieve precise control of the telescopic displacement of the hydraulic cylinder piston rod by cooperating with magnetic switches, proximity switches or photoelectric switches. Those skilled in the art can set them according to actual needs, which will not be elaborated here.

[0036] A simulation component 4 is provided on one side of the outer wall of the housing 12. The simulation component 4 is used to simulate the temperature that the adhesive is subjected to in actual use. The simulation component 4 includes a circulation pump 403 that is fixed to the inner wall of one side of the housing 12 by bolts. The circulation pump 403 is used to circulate the gas in the box 11. The air inlet of the circulating pump 403 is connected to a first connecting pipe 401 via a flange. The other end of the first connecting pipe 401 is connected to the housing 11. The air outlet of the circulating pump 403 is connected to a second connecting pipe 402 via a flange. The other end of the second connecting pipe 402 is connected to two branch pipes 404 via a three-way connector. The ends of the two branch pipes 404 are respectively provided with a heating component 8 and a cooling component 9. The bottom outer wall of the housing 11 is provided with a second air guide pipe 408. The outside of the second air guide pipe 408 is connected to two first air guide pipes 406 via an electric three-way ball valve 407. The two first air guide pipes 406 are respectively connected to the heating component 8 and the cooling component 9. Multiple equally spaced air outlet pipes 409 are welded to the outside of the second air guide pipe 408. The air outlet pipes 409 are connected to the housing 11. It should be noted that the electric three-way ball valve 407 in this application is prior art. The electric three-way ball valve 407 can be of model Q914F-16P. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0037] The airflow path can be switched by the electric three-way ball valve 407, so that the gas in the chamber 11 passes through the heating component 8 or the cooling component 9. When the electric three-way ball valve 407 is switched to the heating channel, the heating component 8 is started, and then the circulation pump 403 is started. The gas in the box 11 enters the circulation pump 403 through the first connecting pipe 401. The gas enters the second connecting pipe 402 through the circulation pump 403, and then enters the heating component 8 through the branch pipe 404. The gas heated by the heating component 8 passes through the corresponding first air guide pipe 406, electric three-way ball valve 407, and second air guide pipe 408 in sequence, and is evenly discharged into the box 11 from the air outlet pipe 409, thereby increasing the internal ambient temperature of the box 11 and simulating the use state of the adhesive in a high-temperature environment. When the electric three-way ball valve 407 is switched to the cooling channel, the cooling component 9 is started. The circulation pump 403 draws the gas in the box 11 into the first connecting pipe 401, and then sends it into the cooling component 9 through the second connecting pipe 402 and the branch pipe 404. After being cooled, the gas passes through the corresponding first air guide pipe 406, electric three-way ball valve 407, and second air guide pipe 408 in sequence, and finally diffuses into the inside of the box 11 from the air outlet pipe 409, thereby reducing the ambient temperature inside the box 11 and simulating the use conditions of the adhesive in a low-temperature environment. When switching between hot and cold environments, it is necessary to wait for the temperature inside the chamber 11 to return to normal before the next temperature change cycle can be executed, in order to avoid damage to the circulation pump 403 or pipelines due to thermal expansion and contraction caused by sudden temperature changes.

[0038] A check valve 405 is provided on the branch pipe 404. The check valve 405 ensures that the gas flows in one direction and prevents the heated or cooled gas from flowing back into the other component.

[0039] The bottom outer wall of the housing 11 is fixed with two symmetrically distributed fixing frames 410 by bolts. The two fixing frames 410 are used to provide stable support for the heating component 8 and the cooling component 9 respectively. The heating component 8 includes a heating shell 801 fixed to the upper surface of one of the fixing frames 410 by bolts. The heating shell 801 is connected to the corresponding first gas guide pipe 406 and branch pipe 404. A heating wire 802 is provided inside the heating shell 801. After the gas enters the heating shell 801 through one of the branch pipes 404, the heating wire 802 is energized and heats up to heat the gas evenly. The heated gas is discharged through the corresponding first gas guide pipe 406. It should be noted that heating wire 802 is existing technology, and those skilled in the art can set it according to actual needs, which will not be elaborated here; The cooling assembly 9 includes a cooling shell 901 that is bolted to the upper surface of another mounting bracket 410. The cooling shell 901 is connected to the corresponding first gas guide pipe 406 and branch pipe 404. The interior of the cooling shell 901 is provided with a semiconductor cooling plate 903. Multiple first heat conduction plates 902 are bonded to the cold side of the semiconductor cooling plate 903. Gas enters the cooling shell 901 through another branch pipe 404, and then the semiconductor cooling plate 903 is activated. Its cold side absorbs heat from the gas through the first heat conduction plates 902, thereby lowering the gas temperature. The cooled gas is then discharged through the corresponding first gas guide pipe 406. It should be noted that the semiconductor cooling pad 903 in this application is prior art. The semiconductor cooling pad 903 can be of model TEC1-1270603. Those skilled in the art can set it according to actual needs, which will not be elaborated here.

[0040] Multiple second heat-conducting plates 904 are bonded to the hot side of the semiconductor cooling plate 903. The second heat-conducting plates 904 pass through the cooling shell 901, and the heat generated by the hot side of the semiconductor cooling plate 903 is quickly transferred to the outside through the second heat-conducting plates 904, so as to avoid the cooling efficiency from decreasing due to heat accumulation inside the cooling shell 901. A cooling fan 905 is fixed to the bottom outer wall of the cooling shell 901 by bolts. The cooling fan 905 is used to accelerate the heat dissipation of the second heat conduction plate 904 and further improve the continuous working stability of the semiconductor cooling plate 903.

[0041] The following testing methods can be used when testing the adhesive backing: Method 1: The adhesive backing board 15 is kept vertical and the adhesive backing hangs down naturally with the help of gravity. The heating component 8 and the cooling component 9 work alternately to test the anti-slip ability of the adhesive backing on one side of the adhesive backing board 15 during temperature change cycle. Method 2: The adhesive backing board 15 is kept vertical and the adhesive backing hangs down naturally with the help of gravity. With the help of the heating component 8 or the cooling component 9, the long-term adhesion performance of the adhesive backing on one side of the adhesive backing board 15 is tested under a single extreme temperature environment. Method 3: Adjust the backing board 15 to a set tilt angle by rotating component 1, and cooperate with heating component 8 and cooling component 9 to test the bonding stability of backing board 15 under specific tilt angle and temperature change conditions. Method 4: The adhesive backing board 15 is kept vertical, and different weight loads are applied to the adhesive backing board 15 through the counterweight component 3 to simulate the working condition of the adhesive backing board bearing vertical pressure in actual use. Method 5: Adjust the backing board 15 to the set tilt angle by rotating component 1, and apply a controllable load in conjunction with counterweight component 3. Simultaneously start heating component 8 and cooling component 9 to perform temperature cycling, thereby comprehensively simulating the composite performance of the backing adhesive under tilting stress and alternating temperature conditions. The adhesive backing plate 15 can be tested individually using the heating component 8, cooling component 9, rotating component 1, and adhesive backing plate 15 with and without counterweight component 3. Alternatively, it can be tested in pairs or in multiple combinations to conduct multi-dimensional collaborative testing. Different testing combination schemes can be selected according to actual needs to comprehensively test the anti-slip ability of the adhesive backing plate under various working conditions.

[0042] During detection, the present invention: First, attach the adhesive to be tested onto the adhesive backing plate 15. Then, open the cover plate 10 on the top of the box 11. Then, start the extension end of the first hydraulic cylinder 101 to retract, causing the bonding plate 14 to rotate to a horizontal state with the fixed block 102 as the fulcrum. Then place the adhesive backing board 15 on one side of the movable plate 603, so that the limiting groove 605 of the adhesive backing board 15 aligns with the limiting block 604 on the movable plate 603. Then, the external vacuum pump is started, and the negative pressure is transmitted to the manifold 502 through the hose 501 and then evenly distributed to each suction cup 503, so that the adhesive backing 15 is firmly adsorbed onto the surface of the moving plate 603. Then, the extension end of the first hydraulic cylinder 101 is activated to drive the bonding plate 14 to rotate to a vertical state with the fixed block 102 as the fulcrum. Then, the rotating plate 201 is flipped to separate it from the magnetic block 203, thus creating a clearance for the backing plate 15. Then, the second hydraulic cylinder 601 is activated. The telescopic end of the second hydraulic cylinder 601 pushes the moving plate 603 toward the bonding plate 14, so that the bonding plate 14 and the adhesive on the backing plate 15 are in close contact. After bonding is completed, the vacuum pump is turned off and the adsorption is stopped. Then the second hydraulic cylinder 601 is activated. The extension end of the second hydraulic cylinder 601 drives the moving plate 603 to reset, so that the adhesive backing plate 15 is separated from the moving plate 603. Then the rotating plate 201 is reset and re-attached to the magnetic block 203. At this time, the first ranging sensor 202 is flush with the top side of the adhesive backing plate 15. Then close the cover plate 10, and then start the third hydraulic cylinder 704. The telescopic end of the third hydraulic cylinder 704 pushes the pressure block 702 to fit tightly against the protrusion 703, fixing the bonding plate 14 in the current vertical state. Then, the circulation pump 403 is started, and the electric three-way ball valve 407 is used to switch to the heating channel or cooling channel according to the detection plan. At the same time, the corresponding heating wire 802 or semiconductor cooling plate 903 is started. The gas enters the circulation pump 403 from the first connecting pipe 401, and enters the heating shell 801 or cooling shell 901 through the second connecting pipe 402 and the branch pipe 404. After being heated or cooled, the gas passes through the first gas guide pipe 406, the electric three-way ball valve 407, and the second gas guide pipe 408 in sequence, and is evenly discharged into the chamber 11 from the gas outlet pipe 409, so that the internal temperature of the chamber 11 reaches the set value. Then, the state changes of the adhesive backing 15 are monitored in real time by the first ranging sensor 202 and the second ranging sensor 204.

[0043] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A testing device for adhesive backing production, comprising a housing (11), characterized in that, The top of the box (11) is provided with a cover plate (10), the bottom outer wall of the box (11) is fixedly connected with a shell (12), the bottom inner wall of the box (11) is provided with a through groove (13), the through groove (13) is used to communicate between the shell (12) and the box (11), the top inner wall of the box (11) is provided with a bonding plate (14), and one side inner wall of the box (11) is provided with a backing board (15) with adhesive backing. The outer wall of one side of the housing (12) is provided with a bonding component (6) for attaching the backing board (15) to the bonding plate (14). The bonding plate (14) is provided with a detection component (2) for detecting the backing board (15) attached to the bonding plate (14). The backing board (15) is provided with a counterweight component (3) for adjusting the vertical pressure of the backing board (15). The counterweight assembly (3) includes cavities (305) respectively opened on both sides of the backing plate (15). Multiple counterweight blocks (307) are provided inside the cavities (305). Multiple equidistant first dovetail grooves (306) are opened on the inner walls of both sides of the cavity (305). Each counterweight block (307) has an integrally formed insert (309) on three sides that engages with the first dovetail grooves (306). A second dovetail groove (308) is opened on the other side of the counterweight block (307). Two symmetrically arranged slots (302) are provided on both sides of the adhesive plate (15). A stop (304) is inserted into the two slots (302). The stop (304) is used to limit the movement of multiple counterweights (307). Two indexing pins (301) are threaded to the top and bottom of the adhesive plate (15). The top and bottom of the stop (304) are provided with insertion holes (303). The indexing pins (301) pass through the adhesive plate (15) and are inserted into the insertion holes (303). The bottom inner wall of the housing (12) is provided with a rotating assembly (1) for driving the adhesive plate (14) to rotate, and a simulation assembly (4) is provided on one side outer wall of the housing (12). The simulation assembly (4) is used to simulate the temperature of the adhesive backing in actual use.

2. The testing equipment for adhesive backing production according to claim 1, characterized in that, The bonding component (6) includes a second hydraulic cylinder (601) fixed to the outer wall of one side of the housing (12). The telescopic end of the second hydraulic cylinder (601) passes through the housing (12) and is fixedly connected to a moving plate (603). A plurality of evenly distributed limiting blocks (604) are fixedly connected to one side of the moving plate (603). The top and bottom of the adhesive backing board (15) are provided with a plurality of limiting grooves (605) that are inserted into the limiting blocks (604). A plurality of telescopic rods (602) are provided on one side of the outer wall of the housing (12). The telescopic ends of the telescopic rods (602) pass through the housing (12) and are fixed to the moving plate (603). The plurality of telescopic rods (602) are located at the four corners of the moving plate (603). An adsorption component (5) for fixing the adhesive backing board (15) is provided on the side of the moving plate (603) away from the limiting blocks (604).

3. The testing equipment for adhesive backing production according to claim 1, characterized in that, The detection component (2) includes two symmetrically arranged second distance sensors (204) fixedly connected to the bottom of one side of the bonding plate (14). The top of the bonding plate (14) is rotatably connected to a rotating plate (201) via a bearing seat. The lower surface of the rotating plate (201) is fixedly connected to a first distance sensor (202). A magnetic block (203) is fixedly connected to one side of the bonding plate (14). The magnetic block (203) is attracted to the rotating plate (201).

4. The testing equipment for adhesive backing production according to claim 2, characterized in that, The adsorption assembly (5) includes a manifold (502) fixedly connected to one side of the movable plate (603). The manifold (502) has a plurality of evenly distributed suction cups (503) on the side near the adhesive backing plate (15). The suction cups (503) are in contact with the back of the adhesive backing plate (15). A hose (501) is connected to one side of the manifold (502) through a flange. The other end of the hose (501) passes through the housing (12).

5. The testing equipment for adhesive backing production according to claim 1, characterized in that, The rotating assembly (1) includes a first hydraulic cylinder (101) rotatably connected to the bottom inner wall of the housing (12) via a bearing seat. The telescopic end of the first hydraulic cylinder (101) is rotatably connected to the bonding plate (14). Two fixing blocks (102) are fixedly connected to the bottom inner wall of the box (11). The two fixing blocks (102) are rotatably connected to the bottom of the bonding plate (14). A photoelectric rotary encoder (103) is fixedly connected to the bottom inner wall of the box (11). The detection end of the photoelectric rotary encoder (103) is fixed to the rotation shaft of the bonding plate (14). A clamping assembly (7) for fixing the bonding plate (14) is provided on the bottom inner wall of the box (11).

6. The testing equipment for adhesive backing production according to claim 5, characterized in that, The pressing assembly (7) includes a fixing plate (701) fixedly connected to the inner wall of the bottom of the housing (11). A third hydraulic cylinder (704) is fixedly connected to one side of the fixing plate (701). The telescopic end of the third hydraulic cylinder (704) passes through the fixing plate (701) and is fixedly connected to a pressure block (702). The pressure block (702) has an arc-shaped structure. A protrusion (703) that works with the pressure block (702) is fixedly connected to the side of the bonding plate (14) close to the pressure block (702).

7. The testing equipment for adhesive backing production according to claim 1, characterized in that, The simulation component (4) includes a circulation pump (403) fixedly connected to the inner wall of one side of the housing (12). The air inlet of the circulation pump (403) is connected to a first connecting pipe (401) via a flange. The other end of the first connecting pipe (401) is connected to the housing (11). The air outlet of the circulation pump (403) is connected to a second connecting pipe (402) via a flange. The other end of the second connecting pipe (402) is connected to two branch pipes (404) via a tee connector. The ends of the two branch pipes (404) are respectively provided with a heating component (8) and a cooling component (9). The bottom outer wall of the housing (11) is provided with There is a second air guide pipe (408), and the outside of the second air guide pipe (408) is connected to two first air guide pipes (406) through an electric three-way ball valve (407). The two first air guide pipes (406) are respectively connected to the heating component (8) and the cooling component (9). Multiple equally spaced air outlet pipes (409) are fixedly connected to the outside of the second air guide pipe (408). The air outlet pipes (409) are connected to the housing (11). A check valve (405) is provided on the branch pipe (404). Two symmetrically distributed fixing brackets (410) are fixedly connected to the bottom outer wall of the housing (11).

8. The testing equipment for adhesive backing production according to claim 7, characterized in that, The heating assembly (8) includes a heating shell (801) fixedly connected to the upper surface of one of the fixing frames (410). The heating shell (801) is connected to the corresponding first air guide pipe (406) and branch pipe (404). A heating wire (802) is provided inside the heating shell (801).

9. The testing equipment for adhesive backing production according to claim 7, characterized in that, The cooling assembly (9) includes a cooling shell (901) fixedly connected to the upper surface of another fixing frame (410). The cooling shell (901) is connected to the corresponding first air duct (406) and branch pipe (404). The interior of the cooling shell (901) is provided with a semiconductor cooling plate (903). Multiple first heat-conducting plates (902) are fixedly connected to the cold side of the semiconductor cooling plate (903). Multiple second heat-conducting plates (904) are fixedly connected to the hot side of the semiconductor cooling plate (903). The second heat-conducting plates (904) pass through the cooling shell (901). A heat dissipation fan (905) is fixedly connected to the bottom outer wall of the cooling shell (901). The heat dissipation fan (905) is used to accelerate the heat dissipation of the second heat-conducting plates (904).

Images