A multi-degree of freedom probe for wafer level testing and a test machine cooperative positioning device

Abstract

This invention relates to the field of smart sensor wafer testing technology, specifically including a test bench. The test bench has a mounting opening on its top outer wall, and the inner wall of the mounting opening is equipped with a positioning mechanism for providing multi-degree-of-freedom precise alignment for smart sensor wafer material testing. A probe mechanism for smart sensor wafer testing is installed at the edge of the top outer wall of the test bench, and the probe mechanism is located above the positioning mechanism. A display integrating a smart sensor wafer material property analysis module is fixedly connected to one side outer wall of the test bench. This invention, by setting up a probe mechanism and a positioning mechanism in cooperation on the test bench, facilitates rapid wafer positioning. The positioning probe in the probe mechanism facilitates optical positioning of the wafer. Once the wafer position is determined by the positioning probe, the positioning mechanism is activated to fix the wafer, solving the problem of inconvenient wafer positioning in existing testing machines.

Images