A method for dynamic compensation of Mini / Micro LED crystal expansion coordinates and AOI equipment

By establishing a spatiotemporal prediction model and using visual feedback calibration, the coordinate drift of the Mini/Micro LED expanded film is compensated in real time, which solves the problem of crystal picking misalignment caused by crystal position drift, improves production efficiency and yield, and reduces the risk of crystal damage.

CN122244039APending Publication Date: 2026-06-19CHENGDU HONGRUI OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHENGDU HONGRUI OPTOELECTRONICS TECH CO LTD
Filing Date
2026-05-21
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

In the production of Mini/Micro LED displays, the creep of the die-expanding film causes the die position to drift, resulting in an increase in the die-taking misalignment rate. This requires frequent rescanning, which wastes time and increases the risk of die damage. Furthermore, the die-taking accuracy gradually degrades over time.

⚗Method used

By establishing a spatiotemporal prediction model for the deformation of the expanded crystal film, the crystal picking coordinates are dynamically compensated in real time. The model parameters are calibrated online using visual feedback data to achieve real-time compensation for coordinate drift, avoiding rescanning and reducing the number of handling and loading/unloading operations.

🎯Benefits of technology

It effectively reduces the number of rescans, maintains stable crystal picking accuracy, reduces the risk of grain damage, and improves production efficiency and yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the field of LED packaging testing and die bonding technology, specifically to a method for dynamic compensation of die expansion coordinates in Mini / Micro LEDs and AOI equipment. This invention establishes a spatiotemporal prediction model of die expansion film deformation and dynamically compensates for die-taking coordinates in real time, avoiding frequent rescanning and filing. Within an 8-hour production shift, the number of rescans is reduced from 2-4 times to 0-1 times, saving significant effective production time. Furthermore, dynamic compensation ensures stable die-taking accuracy throughout the entire production process, overcoming the problem of gradual degradation of die-taking accuracy over time in existing technologies, maintaining an average offset at a low level. Moreover, through anomaly detection and local recalibration mechanisms, it automatically determines when local updates are needed, ultimately reducing the number of times the wafer ring is repeatedly handled between the AOI equipment and the die bonder, lowering the risk of die damage.
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