Multilayer capacitor and method of manufacturing the same
By using a multilayer capacitor structure of polymer dielectric materials and intermetallic compounds, the cracking and fracture problems caused by ceramic dielectric materials have been solved, realizing a multilayer capacitor with high flexibility, high durability and low electrical noise, and excellent thermal stability and high dielectric constant.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-06-19
AI Technical Summary
Existing multilayer ceramic capacitors, due to the use of ceramic materials as dielectric materials, suffer from low bulk strength leading to cracks and fractures, exhibiting chronic defects, especially in harsh operating environments. Furthermore, it is difficult to achieve high capacitance with the same area and volume, and there is electrical noise caused by piezoelectric effect.
A multilayer capacitor is formed by using a composite dielectric material of polyvinylidene fluoride (PVDF) and carbon-based materials, combined with an external electrode of intermetallic compound (IMC) and thermosetting epoxy resin. The interface resistance is reduced by forming a self-assembled monolayer on the dielectric layer, and the intermetallic compound is formed at high temperature to increase connectivity.
It achieves high flexibility, durability, processability and reliability of multilayer capacitors, reduces electrical noise caused by piezoelectric effect, and has excellent thermal stability and high dielectric constant.