Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer; an outer electrode disposed on the body and connected to the inner electrode; and an organic layer disposed on at least a portion of the outer surface of the body and at least a portion of the outer surface of the outer electrode, comprising an organosilicon compound, and wherein, in at least a portion of the region of the organic layer disposed on the body, the Si element content, measured by X-ray photoelectron spectroscopy (XPS), is greater than or equal to 2.2 at% and less than or equal to 5.8 at% relative to the total elemental content of the organic layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0190301, filed on December 18, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards in various types of electronic products, such as image display devices (e.g., liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones and mobile phones, and on-board chargers (OBCs) and DC-DC converters for electric vehicles, serving a charging or discharging function. These multilayer ceramic capacitors are small in size, achieve high capacitance, and are easy to install, thus making them suitable as components in a wide variety of electronic devices.

[0004] In the use of high-voltage multilayer ceramic capacitors in electronic products, there is a concern that arcing may occur, where current flows between external electrodes of different polarities across the surface of the multilayer ceramic capacitor. As a method to suppress arcing in multilayer ceramic capacitors, coating the surface with a waterproofing agent can be considered. Silane coupling agents can be used as waterproofing agents for coating multilayer ceramic capacitors, but it is necessary to suppress the side effects caused by the waterproof coating.

[0005] [References] [Patent Literature] Patent document 1: Japanese Patent Publication No. 2017-135239. Summary of the Invention

[0006] One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0007] However, the aspects of this disclosure are not limited to the foregoing and can be more readily understood in the process of describing specific embodiments of this disclosure.

[0008] A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and an inner electrode alternately disposed with respect to the dielectric layer; an outer electrode disposed on the body and connected to the inner electrode; and an organic layer disposed on at least a portion of the outer surface of the body and at least a portion of the outer surface of the outer electrode, and comprising an organosilicon compound, wherein, in at least a portion of the region of the organic layer disposed on the body, the Si element content, as measured by X-ray photoelectron spectroscopy (XPS), is greater than or equal to 2.2 at% and less than or equal to 5.8 at% relative to the total elemental content of the organic layer.

[0009] As an effect of this disclosure, a multilayer electronic component with excellent reliability can be provided. Attached Figure Description

[0010] The above and other aspects, features, and advantages of this disclosure will become more clearly understood from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an exemplary embodiment of the present disclosure; Figure 2 This is a perspective view schematically showing the appearance of the main body and the outer electrodes, wherein from Figure 1 The organic layer has been removed; Figure 3 It is a schematic diagram showing along Figure 1 A cross-sectional view of the section intercepted by line I-I'; Figure 4 It is a schematic diagram showing along Figure 1 A cross-sectional view of the section intercepted by line II-II'; Figure 5 It is shown schematically. Figure 3 A magnified view of the K1 region; Figure 6 It is shown schematically. Figure 3 A magnified view of the K2 region; and Figure 7 This is a schematic diagram illustrating the process of forming an organic layer. Detailed Implementation

[0011] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to specific example embodiments and accompanying drawings. However, exemplary embodiments of the present disclosure may be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Furthermore, the exemplary embodiments disclosed herein are provided to enable those skilled in the art to interpret the disclosure more fully. Therefore, in the drawings, the shape and size of elements may be exaggerated for clarity, and the same reference numerals will always be used to indicate the same elements.

[0012] Furthermore, for the sake of clarity in the accompanying drawings, details irrelevant to the description have been omitted, and the dimensions and thicknesses of each component shown in the drawings are arbitrarily illustrated for ease of description, but the disclosure is not limited thereto. Additionally, the same reference numerals are used to describe components having the same function within the same conceptual scope. Throughout the specification, when a particular part “comprises” or “includes” a particular component, unless otherwise stated, this indicates that other components are not excluded and may be further included.

[0013] In the accompanying drawings, the first direction (X direction) can be defined as the thickness direction, the second direction (Y direction) can be defined as the length direction, and the third direction (Z direction) can be defined as the width direction.

[0014] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an exemplary embodiment of the present disclosure.

[0015] Figure 2 This is a perspective view schematically showing the appearance of the main body and the outer electrodes, wherein from Figure 1 The organic layer has been removed.

[0016] Figure 3 It is a schematic diagram showing along Figure 1 A cross-sectional view of the section intercepted by line I-I'.

[0017] Figure 4 It is a schematic diagram showing along Figure 1 A cross-sectional view of the section cut by line II-II'.

[0018] Figure 5 It is shown schematically. Figure 3 A magnified view of the K1 region.

[0019] Figure 6 It is shown schematically. Figure 3 A magnified view of the K2 region.

[0020] Figure 7 This is a schematic diagram illustrating the process of forming an organic layer.

[0021] In the following text, reference will be made to Figures 1 to 7 A multilayer electronic assembly 100 according to embodiments of the present disclosure is described in detail. Furthermore, a multilayer ceramic capacitor will be described as an example of a multilayer electronic assembly, but the present disclosure is not limited thereto and can be applied to various multilayer electronic assemblies, such as inductors, piezoelectric elements, rheostats, or thermistors.

[0022] According to an embodiment of the present disclosure, the multi-layer electronic component 100 may include a main body 110, external electrodes 131 and 132, and an organic layer 140. The main body 110 includes a dielectric layer 111 and internal electrodes 121 and 122.

[0023] There is no particular limitation on the specific shape of the main body 110, but as Figure 2 shown, the main body 110 may be formed in a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder particles included in the main body 110 during the sintering process or the polishing process of the corners of the main body 110, the main body 110 does not have a perfect straight hexahedron shape, but may have a substantially hexahedron shape.

[0024] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0025] The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 that are alternately arranged with the dielectric layer 111. The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated such that it is difficult to identify the boundary therebetween without using a scanning electron microscope (SEM).

[0026] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite compound represented by ABO3 may include, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5), or one or more of them.

[0027] There is no particular limitation on the average thickness td of the dielectric layer 111. The average thickness td of the dielectric layer 111 can be, for example, 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm or 0.1 μm to 0.4 μm.

[0028] The inner electrodes 121 and 122 may include, for example, a first inner electrode 121 and a second inner electrode 122 alternately arranged in a first direction, and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122. As a pair of electrodes with different polarities, the first inner electrode 121 and the second inner electrode 122 may be configured to face each other, and the dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122.

[0029] The first inner electrode 121 is spaced apart from the fourth surface 4 and connected to the first outer electrode 131 on the third surface 3. The second inner electrode 122 is spaced apart from the third surface 3 and connected to the second outer electrode 132 on the fourth surface 4.

[0030] The conductive metal included in the inner electrodes 121 and 122 may be at least one selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof, and may more preferably include Ni, but this disclosure is not limited thereto.

[0031] There is no particular limitation on the average thickness te of the inner electrodes 121 and 122. The average thickness te of the inner electrodes 121 and 122 can be, for example, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0032] The average thickness td of dielectric layer 111 and the average thickness te of inner electrodes 121 and 122 represent the average thicknesses of dielectric layer 111 and inner electrodes 121 and 122 in the first direction, respectively. The average thickness td of dielectric layer 111 and the average thickness te of inner electrodes 121 and 122 can be measured by scanning cross-sections of the body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of dielectric layer 111 can be measured by averaging the thicknesses at multiple points of dielectric layer 111 (e.g., five points equally spaced apart in the second direction). Similarly, the average thickness te of inner electrode 121 or 122 can be measured by averaging the thicknesses at multiple points of inner electrode 121 or 122 (e.g., five points equally spaced apart in the second direction). The five equally spaced points can be specified in the capacitor forming section Ac. Furthermore, when an average value measurement is performed on each of the 10 dielectric layers 111 and the 10 inner electrodes 121 and 122, and then their average values ​​are calculated, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be further generalized.

[0033] The main body 110 may include a capacitor forming portion Ac and cover portions 112 and 113. The capacitor forming portion Ac is disposed within the main body 110 and a capacitor is formed therein by including an alternately arranged first inner electrode 121 and a second inner electrode 122, with a dielectric layer 111 between the first inner electrode 121 and the second inner electrode 122. The cover portions 112 and 113 are disposed on two surfaces of the capacitor forming portion Ac that are opposite to each other in a first direction. The cover portions 112 and 113 do not include inner electrodes and may have a structure similar to that of the dielectric layer 111.

[0034] There is no particular limitation on the average thickness tc of the cover portions 112 and 113. The average thickness of the cover portions 112 and 113 can be, for example, 150 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness tc of the cover portions 112 and 113 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness tc of the cover portions 112 and 113 refers to the average thickness of each of the first cover portion 112 and the second cover portion 113.

[0035] The average thickness tc of the cover portions 112 and 113 may refer to the average thickness of the cover portions 112 and 113 in the first direction, and may be the average thickness in the first direction measured at five points that are equally spaced from each other in the first and second direction sections of the body 110.

[0036] The body 110 may include edge portions 114 and 115, which are disposed on two opposing surfaces of the capacitor forming portion Ac in the third direction. Edge portions 114 and 115 may refer to the regions between the ends of the inner electrodes 121 and 122 and the corresponding boundary surfaces of the body 110 in a cross-section obtained by cutting the body 110 in the first and third directions. Edge portions 114 and 115 do not include the inner electrodes 121 and 122 and may have a structure similar to that of the dielectric layer 111.

[0037] The average thickness of edge portions 114 and 115 is not particularly limited. The average thickness wm of edge portions 114 and 115 can be, for example, 150 μm or less, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness wm of edge portions 114 and 115 can be, for example, 5 μm or more, 10 μm or more, or 30 μm or more. Here, the average thickness wm of edge portions 114 and 115 refers to the average thickness of each of the first edge portion 114 and the second edge portion 115.

[0038] The average thickness wm of the edges 114 and 115 can refer to the average thickness of the edges 114 and 115 in the third direction, and can be a value obtained by averaging the thickness in the third direction measured at five points that are equally spaced from each other in the first direction and the third direction section of the body 110.

[0039] External electrodes 131 and 132 may be disposed on the main body 110 and connected to internal electrodes 121 and 122, respectively. External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the main body 110, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. The first external electrode 131 may be disposed on the third surface 3, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6. The second external electrode 132 may be disposed on the fourth surface 4, and may extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and a portion of the sixth surface 6.

[0040] The region of the first external electrode 131 disposed on the third surface 3 can be defined as the first connecting portion CP1, and the region extending from the first connecting portion CP1 to a portion of the first surface 1 and a portion of the second surface 2 can be defined as the first strip portion BP1. The region of the second external electrode 132 disposed on the fourth surface 4 can be defined as the second connecting portion CP2, and the region extending from the second connecting portion CP2 to a portion of the first surface 1 and a portion of the second surface 2 can be defined as the second strip portion BP2.

[0041] There are no particular limitations on the type or shape of the outer electrodes 131 and 132, and they may have a multilayer structure. For example, the outer electrodes 131 and 132 may include substrate electrode layers 131a and 132a connected to the inner electrodes 121 and 122, and plating layers 131b and 132b disposed on the substrate electrode layers 131a and 132a. The plating layers 131b and 132b may be configured to contact the organic layer 140.

[0042] The substrate electrode layers 131a and 132a may be sintered electrode layers comprising metal and glass. The metal included in the substrate electrode layers 131a and 132a may include at least one selected from, for example, the group consisting of Cu, Ni, Pd, Pt, Au, Ag, Pb and alloys thereof. The glass included in the substrate electrode layers 131a and 132a may include, for example, oxides of one or more elements selected from, for example, the group consisting of Ba, Ca, Zn, Al, B, and Si.

[0043] In addition, the substrate electrode layers 131a and 132a may only include sintered electrode layers, but this disclosure is not limited thereto. Furthermore, the substrate electrode layers 131a and 132a may include sintered electrode layers and resin electrode layers. The sintered electrode layers include metal and glass, and the resin electrode layers are disposed on the sintered electrode layers and include metal particles and resin.

[0044] The metal particles included in the resin electrode layer may include at least one of spherical particles and sheet-shaped particles. The metal particles included in the resin electrode layer may include at least one selected from, for example, the group consisting of Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and alloys thereof. The resin included in the resin electrode layer may include at least one of, for example, epoxy resin, acrylic resin, and ethyl cellulose.

[0045] Plating layers 131b and 132b may include at least one selected from the group consisting of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers. Plating layers 131b and 132b may be, for example, Ni plating layers or Sn plating layers, and may include Ni plating layers disposed on substrate electrode layers 131a and 132a and Sn plating layers disposed on Ni plating layers. Plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0046] The accompanying drawings depict a multilayer electronic assembly 100 having two external electrodes 131 and 132, but this disclosure is not limited thereto, and the number or shape of the external electrodes may be changed depending on the shape of the internal electrodes or for other purposes.

[0047] The organic layer 140 may be disposed on at least a portion of the outer surface of the body 110 and at least a portion of the outer surfaces of the external electrodes 131 and 132. The organic layer 140 may include a first organic layer 141 disposed on the body 110 and second organic layers 142 and 143 disposed on the external electrodes 131 and 132.

[0048] The first organic layer 141 may be configured to contact at least a portion of the outer surface of the contact body 110. The first organic layer 141 may be configured to contact at least one of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first organic layer 141 may be configured to contact each of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6.

[0049] The second organic layers 142 and 143 may be configured to contact at least a portion of the outer surfaces of the external electrodes 131 and 132. More specifically, the second organic layers 142 and 143 may be configured to contact at least a portion of the outer surfaces of the plating layers 131b and 132b. The second organic layers 142 and 143 may be configured to contact the connecting portions CP1 and CP2 and / or the strip portions BP1 and BP2.

[0050] The organic layer 140 may include an organosilicon compound. In this disclosure, the term "organosilicon compound" may refer to an organic compound having at least one silicon (Si) atom in its molecular structure. The organic layer 140 substantially prevents external moisture from penetrating into the surface of the body 110, thereby suppressing arc discharge phenomena in the multilayer electronic assembly 100 caused by external moisture.

[0051] The organosilicon compound included in the organic layer 140 may contain repeating units, for example, derived from alkoxysilanes represented by the following chemical formula 1. Repeating units derived from alkoxysilanes may refer to repeating units having structures obtained through hydrolysis and dehydration condensation reactions of alkoxysilanes. Alkoxysilanes may be, for example, alkyltrialkoxysilanes.

[0052] [Chemical Formula 1] R-Si(OR')3 (where R is a C1 to C20 alkyl group and R' is a C1 to C6 alkyl group) The organosilicon compound may have siloxane bonds (Si-O-Si) formed, for example, through the hydrolysis and dehydration condensation of alkoxysilanes. The organosilicon compound may have C1 to C20 alkyl groups, for example, derived from alkoxysilanes. In an example embodiment, the organosilicon compound may have C3 to C10 alkyl groups. The alkyl groups of the organosilicon compound can be used to impart hydrophobicity to the outer surfaces of the body 110 and / or the external electrodes 131 and 132 to improve the moisture resistance reliability of the multilayer electronic assembly 100.

[0053] According to an example embodiment of this disclosure, at least a portion of the region of the organic layer 140 disposed on the body 110 (hereinafter referred to as the first region), as measured by X-ray photoelectron spectroscopy (XPS), may have a Si content greater than or equal to 2.2 at% and less than or equal to 5.8 at% relative to the total elemental composition of the organic layer 140. For example, as measured by XPS, the first organic layer 141 may have a Si content greater than or equal to 2.2 at% and less than or equal to 5.8 at% relative to the total elemental composition of the organic layer 140. When the above numerical range is met, arc discharge of the multilayer electronic component 100 can be effectively prevented. When the Si content is less than 2.2 at%, the coverage of the organic layer 140 on the body 110 may be insufficient, resulting in minimal arc discharge suppression effect of this disclosure. When the Si content exceeds 5.8 at%, the coverage of the organic layer 140 on the body 110 may be excessive, potentially causing static electricity due to surface adhesion of the organic layer 140. Therefore, there may be a problem that the multilayer electronic component 100 may not be able to be stably mounted on the printed circuit board (PCB).

[0054] In the example embodiment, the atomic ratio (Si / Ba) of the Si content to the Ba content in the first region, as measured by XPS, can be greater than or equal to 0.16 and less than or equal to 1.8. When this range is met, arc discharge in the multilayer electronic component 100 can be prevented more effectively.

[0055] In an example embodiment, the atomic ratio (C / Si) of the C content to the Si content in the first region, as measured by XPS, can be greater than or equal to 2.5 and less than or equal to 12.0. The C content measured by XPS can be derived from the R group of an alkoxysilane. When this range is met, the moisture resistance reliability of the multilayer electronic component 100 can be effectively improved while preventing arc discharge. More preferably, the atomic ratio (C / Si) of the C content to the Si content in the first region, as measured by XPS, is less than or equal to 5.0.

[0056] The contents of Si, Ba, and C can be measured based on the peak area of ​​Si 2s, Ba 3d5, and C 1s and the sensitivity coefficient of the measuring device. For example, by etching 3 nm to 5 nm of the outer surface of the first organic layer 141 disposed on the first surface 1 or the second surface 2, and then analyzing the cross-section of the exposed first organic layer 141 by XPS (X-ray type: monochromatic Al-Kα) and removing the background signal. From the measured contents of Si, Ba, and C, the atomic ratio of Si to Ba (Si / Ba) and the atomic ratio of C to Si (C / Si) can be calculated.

[0057] The thickness of the organic layer 140 does not need to be particularly limited. However, since the surface of the body 110 not covered by the first external electrode 131 and the second external electrode 132 lacks insulation, arc discharge may occur in the multilayer electronic component 100. Therefore, in the example embodiment, the average thickness of the organic layer 140 disposed on the body 110 may be thicker than the average thickness of the organic layer 140 disposed on the external electrodes 131 and 132. That is, the average thickness of the first organic layer 141 may be thicker than the average thickness of the second organic layers 142 and 143. As a result, arc discharge in the multilayer electronic component 100 can be effectively suppressed.

[0058] An example of measuring the average thickness of the first organic layer 141 will be described. (Refer to...) Figure 3 and Figure 5 The first organic layer 141 disposed on the first surface 1 and the second surface 2 of the body 110 in the first and second direction sections of the multilayer electronic assembly 100 can be analyzed by high-resolution transmission electron microscopy (HRTEM). In the images analyzed by HRTEM, the thickness (t1, t3, t5, t7, ... tn) at five or more points spaced apart from each other in the first organic layer 141 can be measured, and the average value can then be considered as the average thickness of the first organic layer 141.

[0059] An example of measuring the average thickness of the second organic layer 142 will be described. (Refer to...) Figure 3 and Figure 6 The second organic layer 142 disposed on the connector CP1 in the first and second direction sections of the multilayer electronic assembly 100 can be analyzed by HRTEM. In the image analyzed by HRTEM, the thickness (t2, t4, t6, t8, ... tm) at five or more points spaced apart from each other in the second organic layer 142 can be measured, and the average value can be regarded as the average thickness of the second organic layer 142.

[0060] The average thickness of the organic layer 140 disposed on the body 110 (i.e., the average thickness of the first organic layer 141) is not particularly limited, but may be, for example, greater than or equal to 5 nm and less than or equal to 15 nm. When the average thickness of the first organic layer 141 is less than 5 nm, the coverage of the organic layer 140 on the body 110 may be insufficient, and therefore the arc discharge suppression effect of this disclosure may be minimal. When the average thickness of the first organic layer 141 exceeds 15 nm, because the coverage of the organic layer 140 on the body 110 is too large, there may be concerns that the mounting stability of the multilayer electronic assembly 100 may be reduced due to static electricity generated by the organic layer 140.

[0061] Reference Figure 5 and Figure 6The first organic layer 141 may be discontinuously disposed on the body 110, and the second organic layer 142 may be discontinuously disposed on the external electrode 131. In an example embodiment, the coverage of the first organic layer 141 may be greater than the coverage of the second organic layer 142. Therefore, arc discharge phenomena in the multilayer electronic component 100 can be suppressed more effectively.

[0062] The coverage of the first organic layer 141 can be defined as the ratio of the total length of the portion of the surface of the body 110 covered by the first organic layer 141 in a given region to the total length of the surface of the body 110. The coverage of the second organic layer 142 can be defined as the ratio of the total length of the portion of the surfaces of the outer electrodes 131 and 132 covered by the second organic layers 142 and 143 in a given region to the total length of the surfaces of the outer electrodes 131 and 132.

[0063] Microporous MP can exist on the surface of the body 110. The body 110 can have the properties of a sintered body. Therefore, unlike the relatively high-density plating layers 131b and 132b, microporous MP can exist on the surface of the body 110. Since external moisture can penetrate into the body 110 through the microporous MP, the microporous MP can be a factor that degrades the moisture resistance reliability of the multilayer electronic component 100. According to an exemplary embodiment of this disclosure, the organic layer 140 can fill the interior of the microporous MP. That is, the first organic layer 141 can fill the interior of the microporous MP. Therefore, the moisture resistance reliability of the multilayer electronic component 100 can be improved.

[0064] In the example embodiment, when the surface roughness of the surface of the organic layer 140 in contact with the body 110 is defined as R1, and the surface roughness of the surface of the organic layer 140 in contact with the external electrodes 131 and 132 is defined as R2, R1 > R2 can be satisfied. That is, the surface roughness R1 of the surface of the first organic layer 141 in contact with the body 110 can be greater than the surface roughness R2 of the surfaces of the second organic layers 142 and 143 in contact with the external electrodes 131 and 132. Here, surface roughness can refer to the centerline average roughness Ra measured using an atomic force microscope (AFM) device. The outer surface of the body 110, which has the properties of a sintered body, can be rougher than the coatings 131b and 132b. Therefore, R1 > R2 can be satisfied.

[0065] In addition, the size of the multilayer electronic component 100 is not particularly limited. However, when a high voltage is applied to the multilayer electronic component 100, an arc discharge phenomenon may occur in the multilayer electronic component 100. Specifically, when the multilayer electronic component 100 has a size of 1005 size (length: about 1.0 mm, width: about 0.5 mm, thickness: about 0.5 mm) or larger, there is a high risk that an arc discharge phenomenon may occur. Therefore, when the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure is applied to a high-voltage electric field component having a size of 1005 size (length: about 1.0 mm, width: about 0.5 mm, thickness: about 0.5 mm) or larger, the reliability improvement effect can be more significant.

[0066] Hereinafter, an example of a method for forming the multilayer electronic component 100 will be described.

[0067] However, the method for manufacturing the multilayer electronic component 100 is not limited thereto.

[0068] First, ceramic powder particles for forming the dielectric layer 111 are prepared. The ceramic powder particles may include, for example, one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). The BaTiO3 ceramic powder particles can be synthesized, for example, by reacting a titanium raw material (such as titanium dioxide) with a barium raw material (such as barium carbonate). Examples of the method for synthesizing the ceramic powder particles include the solid-state method, the sol-gel method, and the hydrothermal synthesis method, but the present disclosure is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder particles, they are mixed with an organic solvent such as ethanol and a binder such as polyvinyl butyral to prepare a ceramic slurry, and the ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0069] Next, an inner electrode conductive paste including metal powder particles, a binder, and an organic solvent is printed on the ceramic green sheet with a predetermined thickness using a screen printing method or a gravure printing method to form an inner electrode pattern.

[0070] Then, the ceramic green sheet with the internal electrode pattern printed on it is peeled off from the carrier film, and the ceramic green sheet with the internal electrode pattern printed on it is stacked and pressed to form a ceramic laminate with a predetermined number of layers. In order to form the caps 112 and 113 after sintering, ceramic green sheets without the internal electrode pattern can be stacked on the upper and lower parts of the ceramic laminate in a predetermined number of layers. Then, the ceramic laminate can be cut into sheets with a predetermined sheet size, and the cut sheets can be sintered at a temperature of 1000°C or higher and 1400°C or lower to form the body 110.

[0071] Alternatively, the edges 114 and 115 can be formed by not applying the conductive paste for the internal electrodes to the areas on the ceramic green sheet where the edges are to be formed, and then sintering. Optionally, to suppress the step portions caused by the internal electrodes 121 and 122, after cutting the ceramic laminate so that the internal electrode pattern is exposed on the two third-direction surfaces of the cut sheet, the sheet for forming the edges can be attached to the two third-direction surfaces of the cut sheet, and then sintered to form the edges 114 and 115.

[0072] Next, external electrodes 131 and 132 are formed. For example, when the substrate electrode layers 131a and 132a include sintered electrode layers, the body 110 can be immersed in a conductive paste for external electrodes comprising metal powder particles, glass frit, binder and organic solvent, and then the conductive paste for external electrodes can be sintered at a temperature of 500°C to 900°C to form sintered electrode layers.

[0073] For example, when the substrate electrode layers 131a and 132a include a resin electrode layer, the substrate can be immersed in a conductive resin composition including metal powder particles, resin, binder and organic solvent, and then the substrate can be cured and heat-treated at a temperature of 250°C to 550°C to form a resin electrode layer.

[0074] Alternatively, electroplating and / or electroless plating methods may be performed to form plating layers 131b and 132b on the substrate electrode layers 131a and 132a.

[0075] Next, an organic coating solution can be applied to cover the surface of the body 110 and the surfaces of the external electrodes 131 and 132, or the body 110 on which the external electrodes 131 and 132 are formed can be immersed in the organic coating solution. Then, the body 110 on which the external electrodes 131 and 132 are formed can be dried to form an organic layer 140. The drying temperature is not particularly limited, but can be, for example, 100°C to 200°C.

[0076] The organic coating solution may include an alkoxysilane represented by R-Si(OR')3 (where R is a C1 to C20 alkyl group and R' is a C1 to C6 alkyl group) and a solvent (e.g., ethanol). The weight of the alkoxysilane in the total weight of the organic coating solution may be greater than or equal to 1 wt% and less than or equal to 15 wt%, but this disclosure is not limited thereto.

[0077] Reference Figure 7 The process for forming the organic layer is described in detail below. First, an alkoxysilane can be dissolved in a solvent such as ethanol to form an organic coating solution (S1). In this process, the alkoxy group (-Si-OR') of the alkoxysilane can be hydrolyzed to convert into a silanol group (-Si-OH), and a siloxane bond (-Si-O-Si-) can be formed (S2). When the organic coating solution is coated onto the surface of the multilayer electronic component 100 or the multilayer electronic component 100 is immersed in the organic coating solution, the hydroxyl groups (-OH) and silanol groups (-Si-OH) present on the surface of the multilayer electronic component 100 can form hydrogen bonds (S3). Then, a covalent bond can be formed between the organosilicon compound and the multilayer electronic component 100 through a dehydration condensation reaction caused by heating and drying, thereby forming an organic layer (S4).

[0078] Furthermore, to control the average thickness of the first organic layer 141 and the average thickness of the second organic layers 142 and 143, the first organic layer 141 and the second organic layers 142 and 143 can be formed separately. For example, a mask or similar device can be used to coat and dry the first organic coating solution only on the outer surface of the body 110 to form the first organic layer 141, and then a mask or similar device can be used to coat and dry the second organic coating solution only on the outer surfaces of the outer electrodes 131 and 132 to form the second organic layers 142 and 143. For example, the weight ratio of alkoxysilane in the total weight of the first organic coating solution can be greater than the weight ratio of alkoxysilane in the total weight of the second organic coating solution. Therefore, the average thickness of the first organic layer 141 can be made thicker than the average thickness of the second organic layers 142 and 143.

[0079] (Example of an invention) After preparing a sample sheet of size 1005 (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm), moisture resistance reliability was evaluated based on the presence or absence of an organic layer. In the example of the invention, the average thickness of the first organic layer was 10 nm. In the comparative example, no organic layer was formed. The average thickness of the first organic layer was calculated by using HRTEM analysis and measuring the thickness of the sample sheet polished to the central portion in the third direction at five points spaced apart from each other in the first and second direction cross-sections, and then averaging these measurements.

[0080] First, for each of the 20 samples in the inventive and comparative examples, the voltage when the current value becomes 10mA under the boost conditions of 25°C and 400V / s is measured as the breakdown voltage (BDV), and the average value is recorded in Table 1 below.

[0081] Forty samples of each of the Invention Examples and Comparative Examples were evaluated for moisture resistance reliability, and samples whose insulation resistance decreased by 1 / 10 or less compared to the initial value when a reference voltage (1V) was applied for 24 hours at a temperature of 85°C and a relative humidity of 85% were identified as defective and are listed in Table 1 below.

[0082] Table 1:

[0083] Referring to Table 1 above, it can be confirmed that the breakdown voltage (BDV) and moisture resistance reliability of multilayer electronic components are improved when an organic layer is formed.

[0084] Although exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or alterations without departing from the technical concept of the present disclosure as defined by the appended claims, and such substitutions, modifications, or alterations should be construed as being included in the technical concept of the present disclosure.

[0085] Furthermore, the expression "example embodiment" as used in this disclosure does not imply the same embodiment and is provided to emphasize and explain different unique features. However, the example embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, although matters described in a particular example embodiment are not described in another example embodiment, these matters may be understood as descriptions relating to the other example embodiment unless there is a description to the contrary or contradictory in another example embodiment.

[0086] In this disclosure, the term "connection" encompasses not only direct connections but also indirect connections such as those via adhesive layers. Furthermore, the term "electrical connection" includes both physical and non-physical connections. Additionally, expressions such as "first" and "second" are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, without departing from the scope of the claims, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component.

Claims

1. A multilayer electronic component, comprising: The main body includes a dielectric layer and internal electrodes alternately disposed with the dielectric layer; An outer electrode is disposed on the main body and connected to the inner electrode; as well as An organic layer is disposed on at least a portion of the outer surface of the body and at least a portion of the outer surface of the external electrode, and comprises an organosilicon compound. Wherein, in at least a portion of the region where the organic layer is disposed on the main body, the Si element content measured by X-ray photoelectron spectroscopy is greater than or equal to 2.2 at% and less than or equal to 5.8 at% relative to the total elements of the organic layer.

2. The multilayer electronic assembly of claim 1, wherein, In the region, the atomic ratio of Si content to Ba content, as measured by the X-ray photoelectron spectrometer, is greater than or equal to 0.16 and less than or equal to 1.

8.

3. The multilayer electronic assembly of claim 1 or 2, wherein, In the region, the atomic ratio of the C element content to the Si element content, as measured by the X-ray photoelectron spectrometer, is greater than or equal to 2.5 and less than or equal to 12.

0.

4. The multilayer electronic assembly of claim 3, wherein, In the region, the atomic ratio of the C element content to the Si element content, as measured by the X-ray photoelectron spectrometer, is less than or equal to 5.

0.

5. The multilayer electronic assembly of claim 1, wherein, The organosilicon compound has siloxane bonds.

6. The multilayer electronic assembly of claim 1, wherein, The organosilicon compound has alkyl groups from C1 to C20.

7. The multilayer electronic assembly according to claim 1, wherein, The average thickness of the organic layer disposed on the main body is greater than the average thickness of the organic layer disposed on the external electrode.

8. The multilayer electronic component according to claim 1, wherein, The average thickness of the organic layer disposed on the main body is greater than or equal to 5 nm and less than or equal to 15 nm.

9. The multilayer electronic component according to claim 1, wherein, Micropores exist on the surface of the main body, and The organic layer fills the interior of the micropores.

10. The multilayer electronic assembly according to claim 1, wherein, When the surface roughness of the organic layer surface in contact with the main body is defined as R1 and the surface roughness of the organic layer surface in contact with the external electrode is defined as R2, The condition R1 > R2 is satisfied.

11. The multilayer electronic assembly according to claim 1, wherein, The organic layer includes a first organic layer discontinuously disposed on the body and a second organic layer discontinuously disposed on the external electrode.

12. The multilayer electronic assembly according to claim 1, wherein, The outer electrode includes: a substrate electrode layer connected to the inner electrode; and a plating layer disposed on the substrate electrode layer and configured to contact the organic layer.

13. The multilayer electronic assembly according to claim 12, wherein, The coating includes a Ni coating disposed on the substrate electrode layer and a Sn coating disposed on the Ni coating.

14. The multilayer electronic assembly according to claim 1, wherein, The organosilicon compound comprises repeating units derived from alkoxysilanes represented by the following chemical formula 1: [Chemical Formula 1] R-Si(OR')3 In chemical formula 1, R is a C1 to C20 alkyl group, and R' is a C1 to C6 alkyl group.

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