Dual-sided asymmetric heat conducting far infrared heating module, article and preparation method

By setting a heating layer and a far-infrared emitting coating on the front side and an independent metal heat-conducting layer on the back side of the insulating substrate of the flexible heating element, flexible switching between dual-sided heat conduction experience and intrinsic safety are achieved, solving the problems of electrical safety hazards and complex assembly, and reducing costs and processes.

CN122248577APending Publication Date: 2026-06-19惠州市启晟科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
惠州市启晟科技有限公司
Filing Date
2026-05-20
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing flexible heating elements pose electrical safety hazards when designing the back heat conduction structure, and it is difficult to safely and independently provide front far-infrared radiation heat sensing and back conduction heat sensing on the same module. Furthermore, downstream assembly is complex, increasing costs and processes.

Method used

The device employs an insulating substrate with a heating layer and a far-infrared emitting coating on the front side and an independent metal heat-conducting layer on the back side. It achieves bi-lateral heat conduction through a passive heat conduction method. Structurally, the heat conduction function is isolated from electrical safety. By using a circuitous wiring topology, external connection points are concentrated on one side, simplifying assembly.

Benefits of technology

It enables flexible switching between dual-sided heat conduction experiences, ensuring intrinsic safety, reducing the risk of leakage, simplifying the assembly process and reducing costs, and improving product reliability and service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

A far-infrared heating module, product, and manufacturing method with double-sided asymmetric heat conduction are disclosed. The module includes an insulating substrate. Its first surface has a heating layer, electrodes electrically connected to the heating layer, a far-infrared emitting coating, and positive and negative electrode pads for external connection. The positive electrode pad is electrically connected to the first electrode, and the negative electrode pad is electrically connected to the second electrode. The second surface has an independent metal heat-conducting layer. This heat-conducting layer is physically disconnected and electrically levitated from all electrodes, pads, and all conductive components penetrating the insulating substrate. It passively obtains heat from the heating layer through the insulating substrate, forming a purely physical heat-conducting surface without electrical charge. This invention, through an independent metal heat-conducting layer that is completely electrically levitated on the back, simultaneously and independently achieves both front-side far-infrared radiation heat sensing and safe, uniform contact-type physical conduction heat sensing on the back of a single module, providing users with a dual-sided asymmetric heating experience and fundamentally achieving intrinsic safety without grounding.
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