Electronic device

Abstract

This application discloses an electronic device, belonging to the field of electronic device technology. The electronic device includes: a housing, a motherboard assembly, a fan, and a decorative ring assembly. The motherboard assembly is located inside the housing, and the fan is located on the side of the motherboard assembly facing the rear cover, and the fan is used to dissipate heat from the motherboard assembly. The housing includes a rear cover, and the decorative ring assembly is connected to the rear cover. The side of the decorative ring assembly facing the motherboard assembly has a mounting cavity, the fan is located inside the mounting cavity, and at least a portion of the decorative ring assembly can be detached to open or close the mounting cavity.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] The main function of built-in fans in electronic devices is to perform active cooling. By forcing airflow, they improve the heat dissipation efficiency of electronic devices, thereby solving the problem of performance degradation caused by overheating of electronic components in high-performance application scenarios.

[0003] Because fans drive airflow, a lot of dust accumulates around them, causing the air ducts near the fan to become dirty. Summary of the Invention

[0004] This application aims to provide an electronic device that solves the problem of dust accumulation around a fan causing dirt to accumulate in the air duct near the fan.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides an electronic device comprising: a housing, a motherboard assembly, a fan, and a decorative ring assembly. The motherboard assembly is located within the housing, and the fan is located on the side of the motherboard assembly facing the rear cover, the fan being used to dissipate heat from the motherboard assembly. The housing includes a rear cover, the decorative ring assembly is connected to the rear cover, the decorative ring assembly has a mounting cavity on the side facing the motherboard assembly, the fan is located within the mounting cavity, and at least a portion of the decorative ring assembly is detachable to open or close the mounting cavity.

[0007] In the embodiments of this application, at least a portion of the decorative ring assembly is designed to be detachable and assembleable. This modular design allows users or maintenance personnel to directly open the mounting cavity, making the fan readily visible. This allows users to easily clean and maintain the fan using simple tools such as a brush or compressed air without disassembling the entire back cover of the electronic device or damaging its internal precision structure. This design not only solves the problem of dirt accumulating in the air duct near the fan, but also significantly improves the fan's operating efficiency by keeping the air duct near the fan unobstructed, reducing the motor load and effectively extending the service life of the fan and even the entire electronic device.

[0008] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0009] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0010] Figure 1This is an exploded view of an electronic device according to an embodiment of the present invention;

[0011] Figure 2 This is a front view of an electronic device according to an embodiment of the present invention;

[0012] Figure 3 This is a rear view of an electronic device according to an embodiment of the present invention;

[0013] Figure 4 This is one of the side views of an electronic device according to an embodiment of the present invention;

[0014] Figure 5 This is a second side view of an electronic device according to an embodiment of the present invention;

[0015] Figure 6 This is a top view of an electronic device according to an embodiment of the present invention;

[0016] Figure 7 This is one of the cross-sectional views of an electronic device according to an embodiment of the present invention;

[0017] Figure 8 This is one of the partial views of an electronic device according to an embodiment of the present invention;

[0018] Figure 9 This is a second partial view of an electronic device according to an embodiment of the present invention;

[0019] Figure 10 This is a schematic diagram of a decorative ring according to an embodiment of the present invention;

[0020] Figure 11 This is a second cross-sectional view of an electronic device according to an embodiment of the present invention;

[0021] Figure 12 This is a third partial view of an electronic device according to an embodiment of the present invention;

[0022] Figure 13 This is a fourth partial view of an electronic device according to an embodiment of the present invention;

[0023] Figure 14 This is a schematic diagram of a shielding member installed on a decorative ring according to an embodiment of the present invention;

[0024] Figure 15 This is a schematic diagram after the shielding component has been removed according to an embodiment of the present invention;

[0025] Figure 16 This is a schematic diagram of a decorative ring and a dustproof component according to an embodiment of the present invention;

[0026] Figure 17 This is a schematic diagram of a buckle structure provided on a decorative ring according to an embodiment of the present invention;

[0027] Figure 18 This is a schematic diagram of a locking member fixing a blocking member according to an embodiment of the present invention;

[0028] Figure 19 This is a partial exploded view of an electronic device according to an embodiment of the present invention;

[0029] Figure 20 This is a fifth partial view of an electronic device according to an embodiment of the present invention;

[0030] Figure 21 yes Figure 20 Cross-sectional view along the AA direction.

[0031] Figure label:

[0032] 100 Electronic device, 101 Mounting cavity, 110 Housing, 111 Rear cover, 112 First through hole, 113 Third through hole, 114 Air duct bracket, 115 Recess, 116 Slot sidewall, 117 First air hole, 118 Second air hole, 119 Power supply contact, 120 Motherboard assembly, 121 Motherboard, 122 Electronic components, 123 Motherboard bracket, 130 Fan, 131 Metal spring, 140 Decorative ring assembly, 141 Air inlet, 142 Air outlet, 143 Decorative ring, 14 4. Covering component, 145. Mounting slot, 146. Removal notch, 147. Second through hole, 150. Dustproof component, 160. Camera module, 161. Rear main camera, 162. Wide-angle camera, 170. Lens, 181. First double-sided adhesive, 182. Second double-sided adhesive, 183. Third double-sided adhesive, 185. Fourth double-sided adhesive, 186. First thermal conductive gel, 187. Second thermal conductive gel, 188. Main upper part, 189. Heat sink, 190. Screen, 191. Locking component, 192. Clip structure, 193. Locking screw. Detailed Implementation

[0033] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0034] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] The following is combined Figures 1-21 An electronic device according to an embodiment of the present invention is described.

[0038] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, according to some embodiments of the present invention, an electronic device 100 includes: a housing 110, a motherboard assembly 120, a fan 130, and a decorative ring assembly 140. The motherboard assembly 120 is located within the housing 110, which includes a rear cover 111. The fan 130 is located on the side of the motherboard assembly 120 facing the rear cover 111 and is used to dissipate heat from the motherboard assembly 120. The decorative ring assembly 140 is connected to the rear cover 111. The side of the decorative ring assembly 140 facing the motherboard assembly 120 has a mounting cavity 101. The fan 130 is located within the mounting cavity 101, and at least a portion of the decorative ring assembly 140 is detachable to open or close the mounting cavity 101.

[0039] The housing 110 forms the framework of the electronic device 100. The housing 110 is used to protect the internal components from external impacts and environmental influences. The housing 110 provides physical support and connection basis for the motherboard assembly 120, the fan 130 and the decorative ring assembly 140.

[0040] The motherboard assembly 120 is located inside the housing 110. The motherboard assembly 120 is the core computing and control center of the electronic device 100. The motherboard assembly 120 is equipped with electronic components such as processors and memory. The motherboard assembly 120 generates a lot of heat when operating under high load. The motherboard assembly 120 is the main heat source inside the electronic device 100.

[0041] The function of fan 130 is to actively cool the motherboard assembly 120. By forcibly driving airflow, fan 130 accelerates the heat exchange process around the motherboard assembly 120, thereby effectively reducing the temperature of the motherboard assembly 120 and preventing performance throttling, stuttering, or hardware damage caused by overheating. The decorative ring assembly 140 forms a mounting cavity 101 on the side facing the motherboard assembly 120, and fan 130 is placed inside the mounting cavity 101. This layout cleverly utilizes the redundant space at the corresponding position of the decorative ring assembly 140, avoiding the fan 130 occupying valuable planar space on the surface of the motherboard 121, which helps to achieve a thinner and lighter design of the device.

[0042] At least a portion of the decorative ring assembly 140 is designed to be detachable and assembleable. This modular design allows users or maintenance personnel to directly open the mounting cavity 101, making the fan 130 readily visible. This allows users to easily clean and maintain the fan 130 using simple tools such as a brush or compressed air without disassembling the entire back cover 111 or damaging the internal precision structure. This design not only solves the problem of dirt accumulating in the air duct near the fan 130, but also significantly improves the operating efficiency of the fan 130 by keeping the air duct near the fan 130 unobstructed, reduces the motor load, and effectively extends the service life of the fan 130 and even the entire electronic device 100.

[0043] Combination Figure 1 , Figure 7 , Figure 8 and Figure 9 As shown, in one possible embodiment, the decorative ring assembly 140 is provided with an air inlet 141 and an air outlet 142, both of which are connected to the mounting cavity 101. Figure 7 The middle arrow is used to indicate the direction of airflow.

[0044] The decorative ring assembly 140 is provided with an air inlet 141 and an air outlet 142, which together with the mounting cavity 101 constitute a complete air duct system. The air inlet 141 is the entrance for external cold air to enter the mounting cavity 101, while the air outlet 142 is the outlet for internally heated hot air to exit the electronic device 100. The design of integrating the air inlet 141 and the air outlet 142 into the decorative ring assembly 140 has a significant space utilization advantage compared to the traditional method of opening holes on the side or back of the device. This embodiment makes full use of the three-dimensional space of the decorative ring assembly 140, which was originally only used for appearance decoration or camera protection, and transforms a part of the decorative ring assembly 140 into a functional heat dissipation channel. This not only saves valuable space on the housing 110, but also provides more layout possibilities for other functional modules such as sensors, buttons, or interfaces.

[0045] Combination Figure 1 , Figure 4 , Figure 7 , Figure 8 and Figure 9 As shown, in one possible embodiment, the distance between the decorative ring assembly 140 and the first side of the back cover 111 is L1, and the distance between the decorative ring assembly 140 and the second side of the back cover 111 is L2, where L1 < L2. The first side of the decorative ring assembly 140 is adjacent to the first side of the back cover 111, and the second side of the decorative ring assembly 140 is away from the first side of the back cover 111. An air inlet 141 is located on the second side of the decorative ring assembly 140, and an air outlet 142 is located on the first side of the decorative ring assembly 140. Alternatively, the air inlet 141 and the air outlet 142 are located on adjacent sides of the decorative ring assembly 140.

[0046] The positions of the air inlet and air outlet in the decorative ring assembly can be set according to actual needs, and this application does not make specific limitations on this.

[0047] The first side of the back cover 111 is the top side of the back cover 111, and the second side of the back cover 111 is the bottom side of the back cover 111. Therefore, the decorative ring assembly 140 and the fan 130 are close to the top side of the back cover 111.

[0048] The second side of the decorative ring assembly 140 is away from the top side of the back cover 111, and the air inlet 141 is located on the second side of the decorative ring assembly 140. When the user holds the electronic device 100, the user's hand is usually located between the decorative ring assembly 140 and the bottom side of the back cover 111. The incoming cold air will pass through the user's hand, so that the user can feel the cool air, prevent the user's hands from sweating, and improve the user's comfort.

[0049] The first side of the decorative ring assembly 140 is adjacent to the top side of the back cover 111, and the air outlet 142 is located on the first side of the decorative ring assembly 140. The hot airflow discharged from the mounting cavity 101 will flow to the top side of the back cover 111. The hot airflow is less likely to come into contact with the user's hand, avoiding the discomfort caused by the hot air blowing directly on the hand, thereby avoiding affecting the user's use of the electronic device 100.

[0050] Of course, in addition to the air outlet 142 being located on the first side of the decorative ring assembly 140, the air inlet 141 and the air outlet 142 can also be located on adjacent sides of the decorative ring assembly 140, which can also prevent hot airflow from contacting the user's hands.

[0051] Combination Figure 1 , Figure 7 , Figure 10 , Figure 12 and Figure 13 As shown, in one possible embodiment, the electronic device 100 further includes a duct support 114 located within the housing 110. The fan 130 is connected to the duct support 114, and a mounting cavity 101 is formed between the duct support 114 and the decorative ring assembly 140. The duct support 114 is located between the motherboard assembly 120 and the fan 130, and the decorative ring assembly 140 is located on the side of the duct support 114 facing away from the motherboard assembly 120.

[0052] The air duct bracket 114 is located inside the housing 110. As an independent structural component, the air duct bracket 114 eliminates the need to install the fan 130 mounting structure on the rear cover 111 and the main upper part 188, thus reducing the difficulty of improving the rear cover 111 and the main upper part 188.

[0053] The motherboard assembly 120 includes a motherboard 121 and electronic components 122. Electronic components 122 are disposed on the side of the motherboard 121 closest to the air duct support 114. Alternatively, electronic components 122 can be disposed on the side of the motherboard 121 away from the air duct support 114, along the thickness direction of the motherboard 121. Figure 11 (The arrow at point W points to) At least a portion of the electronic component 122 is positioned opposite the fan 130.

[0054] The motherboard 121 serves as the carrier for electronic components 122. It integrates core circuits such as the central processing unit, graphics processor, memory, and power management electronic components 122. These electronic components 122 are the primary heat source, especially during high-load tasks, where their temperature rises rapidly. Positioning the fan 130 opposite to the electronic components 122 minimizes the heat transfer path, allowing the fan 130 to efficiently dissipate heat from the electronic components 122, thus improving heat dissipation efficiency.

[0055] In one possible embodiment, the back cover 111 is provided with a first through hole 112 through which a portion of the fan 130 extends out of the back cover 111 and into the interior of the decorative ring assembly 140.

[0056] The back cover 111 is provided with a first through hole 112, which is a channel connecting the external decorative ring assembly 140 and the internal mounting cavity 101. The first through hole 112 breaks the sealing of the back cover 111 and provides an entry and exit path for the airflow driven by the fan 130.

[0057] By extending a portion of the fan 130 to the outside of the back cover 111, the fan 130 can draw in outside air more directly from the air inlet 141 of the decorative ring assembly 140, greatly shortening the air intake path and reducing energy loss and turbulence interference of the airflow before entering the fan 130, thereby significantly improving the air intake efficiency of the fan 130.

[0058] The solution in this embodiment makes full use of the vertical space below the decorative ring assembly 140, which may have been idle or only used for wiring, to partially embed the relatively thick component 130. This helps to integrate the fan 130 without increasing the overall thickness of the device, and has high practical value for electronic devices 100 that pursue extreme thinness and lightness.

[0059] Combination Figure 7 , Figure 8 , Figure 9 and Figure 16 As shown, in one possible embodiment, the air duct bracket 114 has a groove 115 on the side facing the decorative ring assembly 140, and the fan 130 is accommodated in the groove 115.

[0060] The recess 115 can accommodate the fan 130. The first through hole 112 is spatially connected to the recess 115, allowing airflow to pass smoothly through the back cover 111.

[0061] Combination Figure 12 and Figure 13 As shown, in one possible embodiment, the fan 130 is spaced apart from the groove sidewall 116 of the groove 115.

[0062] The fan 130 maintains a certain distance from the side wall 116 of the recess 115. During the high-speed rotation of the fan 130 to generate airflow, the fan 130 itself also generates heat due to the motor's heating. If the fan 130 were in direct contact with the side wall 116, its heat would easily be conducted directly to the airflow support 114, causing localized heat accumulation and affecting the overall heat dissipation effect. Maintaining a certain distance between the fan 130 and the side wall 116 of the recess 115 effectively creates a small air insulation layer between the fan 130 and the airflow support 114, preventing the fan 130's own heat from interfering with the temperature control environment of the motherboard component 120.

[0063] The space between the fan 130 and the air duct support 114 can serve as a buffer zone for airflow. The high-pressure airflow discharged by the fan 130 or the airflow drawn in can partially flow through this space, reducing eddies and noise caused by abrupt changes in the airflow path.

[0064] Moreover, the appropriate gap between the fan 130 and the air duct bracket 114 provides tolerance space for the automated assembly of the fan 130, avoiding the fan 130 from being unable to be smoothly placed into the groove 115 or from interfering with the groove wall due to the accumulation of component size tolerances, thereby reducing the assembly difficulty and improving the production yield.

[0065] Dust tends to accumulate around the fan 130. By spacing the fan 130 from the side wall 116 of the groove 115, it is easier for users to clean the area around the fan 130 and avoid cleaning dead spots around the fan 130.

[0066] Combination Figure 11 , Figure 20 and Figure 21 As shown, in one possible embodiment, the air duct bracket 114 is provided with a power supply contact 119, and the fan 130 is provided with a metal spring 131, which makes elastic contact with the power supply contact 119.

[0067] The air duct bracket 114 is equipped with power supply contacts 119, while the fan 130 has corresponding metal spring contacts 131. The two maintain elastic contact after assembly. This connection method eliminates the need for traditional wire soldering or connector connections. Given the highly integrated internal structure of the electronic device 100 and the extremely limited space, eliminating connectors and wiring harnesses not only saves valuable internal space but also helps reduce the overall weight and eliminates the risk of wire harness tangling, knotting, or damage from compression.

[0068] The elastic contact between the metal spring 131 and the power supply contact 119 can well adapt to the dimensional tolerances generated during the manufacturing process of the parts and the thermal expansion and contraction deformation during the use of the equipment. The metal spring 131 and the power supply contact 119 always maintain a stable contact pressure, ensuring the continuity and reliability of power transmission and avoiding the fan 130 from stopping due to poor contact.

[0069] In one possible application, the fan 130 is detachably connected to the air duct bracket 114, which facilitates a more thorough cleaning of the fan 130. The elastic contact between the metal spring 131 and the power supply contact 119 facilitates the disassembly and assembly of the fan 130, saving the complicated operation of wiring the fan 130.

[0070] The connection method between the fan 130 and the air duct bracket 114 can be set according to actual needs, and this application does not make specific limitations on this.

[0071] Combination Figure 1 , Figure 2 , Figure 7 , Figure 11 , Figure 14 and Figure 15 As shown, in one possible embodiment, the decorative ring assembly 140 includes a decorative ring 143 and a shield 144. The decorative ring 143 is connected to the rear cover 111. The decorative ring 143 has a second through hole 147 and a mounting groove 145. The mounting groove 145 is located on the side of the second through hole 147 opposite to the motherboard assembly 120. The second through hole 147 is disposed opposite to the fan 130. The shield 144 is detachably connected to the mounting groove 145. The shield 144, the decorative ring 143, and the rear cover 111 enclose a mounting cavity 101. The shield 144 is used to open or close the mounting cavity 101.

[0072] The shield 144 is detachably connected to the side of the decorative ring 143 facing away from the back cover 111. Serving as a "cover" for the mounting cavity 101, the shield 144 opens and closes by its own detachment and reassembly. Under normal use, the shield 144 fits tightly against the decorative ring 143, covering the internal fan 130 and preventing foreign objects from entering. When the user needs to clean the fan 130, simply remove the shield 144 from the decorative ring 143, opening the mounting cavity 101. After cleaning, reassemble the shield 144, closing the mounting cavity 101 and restoring the device to its normal operating state. This design, which breaks down the decorative ring assembly 140 into a fixed part (decorative ring 143) and a movable part (shield 144), ensures the stability of the main structure while providing convenient operation for the user, perfectly achieving a balance between "maintainability" and "integrated appearance."

[0073] A recessed mounting groove 145 is machined on the side of the decorative ring 143 opposite to the back cover 111. The shape and depth of the mounting groove 145 are adapted to the shield 144, which is accommodated and hidden within the mounting groove 145. This design allows the surface of the shield 144 to be substantially flush with or smoothly transition to the surface of the decorative ring 143. The second through hole 147 provides clearance for cleaning the mounting cavity 101, allowing the mounting cavity 101 to be cleaned without removing the decorative ring 143.

[0074] In other embodiments, the decorative ring 143 may be detachably connected to the back cover 111 to open the mounting cavity 101.

[0075] The inner wall of the second through hole 147 is provided with a first air hole 117 and a second air hole 118. The first air hole 117 is connected to the air inlet 141, and the second air hole 118 is connected to the air outlet 142.

[0076] The electronic device 100 also includes a dustproof component 150, which is attached to the inner wall of the second through hole 147 and covers the first vent 117 and the second vent 118.

[0077] The first air vent 117 is connected to the air inlet 141 on the decorative ring assembly 140. The first air vent 117 is responsible for guiding external cold air into the groove 115. The second air vent 118 is connected to the air outlet 142. The second air vent 118 is responsible for exporting the hot air pressurized by the fan 130 to the air outlet 142 of the decorative ring assembly 140.

[0078] The dustproof component 150 is fitted to the inner wall of the second through hole 147 and covers the first air hole 117 and the second air hole 118. The material of the dustproof component 150 is usually a non-woven fabric, sintered metal mesh, or polymer fiber membrane with good air permeability but high dust blocking rate. When external air enters the first air hole 117 through the air inlet 141, large particulate pollutants such as dust, lint, and droplets in the air are effectively intercepted on the outside of the dustproof component 150, thereby protecting the fan 130 from dust contamination.

[0079] In one possible application, the dustproof component 150 is replaceable or can be cleaned along with the lens 170. This design greatly reduces the risk of dust accumulation inside the air duct, extends the maintenance-free cycle of the fan 130, and also ensures the unobstructed flow of the air vents during long-term operation, preventing reduced airflow or abnormal noise from the fan 130 due to pore blockage, and effectively ensuring the long-term stable operation of the heat dissipation system.

[0080] Combination Figure 1 , Figure 2 , Figure 7 , Figure 11 , Figure 14 and Figure 15As shown, in one possible embodiment, the decorative ring 143 has a disassembly notch 146 on the side opposite to the back cover 111. The disassembly notch 146 communicates with the mounting groove 145 and is located at the edge of the mounting groove 145.

[0081] A disassembly notch 146 communicating with the outside is provided at the edge of the mounting groove 145. The disassembly notch 146 is connected to the internal space of the mounting groove 145. When disassembling the cover 144, the user can use a fingernail, tweezers or other flat tools to insert through the disassembly notch 146 and use the lever principle to pry the edge of the cover 144, so that the cover 144 is loosened and removed from the mounting groove 145.

[0082] The disassembly notch 146 and the shield 144 are misaligned. The tool operates from a position outside the area covered by the shield 144. The disassembly notch 146 provides the user with a clear point of force application, making it easier for the user to operate.

[0083] In one possible embodiment, the blocking member 144 is a light-transmitting member.

[0084] The shield 144 can be made of high-transmittance glass or optical-grade transparent plastic. This light-transmitting component not only protects the internal fan 130 from dust and external damage like a regular cover, but also allows light to pass through. In practical use, users can directly observe the shape of the fan blades, their rotation status, and any possible lighting effects through the light-transmitting component. This visual design adds a dynamic, technological touch to the cooling system that was originally hidden inside the chassis. Especially when the fan 130 rotates at high speed, the visual afterimages created by the blades or the flow of light provide users with an intuitive visual experience.

[0085] The transparent shield 144 makes it easier for users to observe the dust accumulation inside the mounting cavity 101, allowing users to determine whether cleaning is necessary.

[0086] In one possible embodiment, the shielding member 144 is attached to the decorative ring 143 by adhesive, or the shielding member 144 is locked to the decorative ring 143 by locking member 191, or the shielding member 144 is fastened to the decorative ring 143 by snap-fit ​​structure 192.

[0087] like Figure 1 As shown, the shielding part 144 can be glued with adhesive, for example, by using double-sided tape to glue the shielding part 144 to the decorative ring 143. This method has a simple structure, low cost, good sealing performance, and a certain degree of dustproof and waterproof capability.

[0088] Combination Figure 1 , Figure 18 and Figure 19As shown, the shielding part 144 can also be fixed by locking the locking part 191, that is, by using screws or pins to fix the shielding part 144 to the decorative ring 143. This method of connection is reliable and has strong vibration resistance.

[0089] Combination Figure 1 and Figure 17 As shown, the shield 144 can also be fastened by the snap-fit ​​structure 192. For example, a corrugated frame is set in the decorative ring 143, and the shield 144 can be quickly snapped in and unlocked by utilizing the elastic deformation of the material. This method takes into account both the convenience and stability of the connection, and the user can disassemble and assemble it by hand without tools.

[0090] Combination Figure 1 , Figure 7 , Figure 8 , Figure 9 and Figure 11 As shown, in one possible embodiment, the electronic device 100 further includes a camera module 160 and a lens 170. The camera module 160 is connected to the motherboard assembly 120. The rear cover 111 is also provided with a third through hole 113, which is used to avoid the camera module 160. The lens 170 is connected to the side of the decorative ring assembly 140 opposite to the rear cover 111, and the lens 170 is disposed opposite to the third through hole 113.

[0091] The third through-hole 113 avoids the camera module 160, providing an unobstructed light path for the camera module 160. The lens 170 is connected to the decorative ring assembly 140 on the side opposite to the back cover 111. The lens 170 typically covers the top of the camera module 160 and can protect the lens, filter out stray light, or enhance light transmittance.

[0092] In this embodiment, the decorative ring assembly 140 provides a mounting base and protective frame for the camera module 160 on the one hand, and a mounting cavity 101 and air duct for the fan 130 on the other hand. This highly integrated design greatly improves space utilization and avoids the waste and conflict caused by opening up separate areas for the camera module 160 and the fan 130.

[0093] This application provides a design for a detachable and cleanable fan 130. The fan 130 is cleanable via a detachable shield 144, addressing the problem of dirty air ducts in the electronic device 100. The detachable shield 144 enables cleaning; after cleaning the electronic device 100, the fan 130 can operate normally. The shield 144 can be transparent, allowing users to experience the rotation of the fan 130 during use, showcasing a sense of technology.

[0094] Electronic device 100 includes: lens 170, shield 144, first double-sided adhesive 181, second double-sided adhesive 182, decorative ring 143, third double-sided adhesive 183, back cover 111, fourth double-sided adhesive 185, motherboard bracket 123, air duct bracket 114, camera module 160 (rear main camera 161, wide-angle camera 162), fan 130, first thermal conductive gel 186, second thermal conductive gel 187, motherboard 121, main upper part 188, heat spreader 189, screen 190, and locking screw 193.

[0095] Lens 170 is a transparent optical component used by electronic device 100 for taking pictures. The shield 144 primarily covers the fan 130 and also allows for detachment for easy cleaning. First double-sided adhesive 181 bonds lens 170 and decorative ring 143, achieving an IP68 sealing function.

[0096] The second double-sided adhesive 182 is a removable double-sided adhesive. The second double-sided adhesive 182 adheres to the shielding part 144 and the decorative ring 143 to achieve a local sealing function. The second double-sided adhesive 182 can be an auxiliary material with sealing and support functions, such as foam or polyethylene terephthalate.

[0097] The decorative ring 143 supports the lens 170 and provides sufficient space for the camera module 160 to take pictures.

[0098] The third double-sided adhesive 183 bonds the decorative ring 143 and the back cover 111, achieving an IP68 sealing function. The back cover 111 is a key feature of the overall appearance. The fourth double-sided adhesive 185 bonds the back cover 111 and the air duct bracket 114, achieving an IP68 sealing function. The motherboard bracket 123 protects the motherboard 121. The air duct bracket 114 supports the fan 130 and protects the motherboard 121. The rear main camera 161 and wide-angle camera 162 enable photo taking. The fan 130 is the source of airflow for the entire device and also provides technical convenience for tech-savvy users.

[0099] The first thermal conductive gel 186 and the second thermal conductive gel 187 achieve the heat transfer of the whole machine, conduct the heat of electronic components 122 to the bottom of fan 130, and finally dissipate heat by fan 130.

[0100] The motherboard 121 houses the electronic components and most of the phone's functions. The upper part 188 ensures the overall strength and rigidity of the device.

[0101] The heat spreader 189 distributes most of the heat from the entire unit evenly throughout the interior, achieving balanced heat distribution. The screen 190 provides the display function.

[0102] The fan 130 is designed on the decorative ring 143, so that the user will not be disturbed during use.

[0103] The air inlet 141 is located near the battery area of ​​the entire unit, and the air outlet 142 is located at the top of the entire unit. The decorative ring 143 can save space in other parts of the electronic device 100, providing multiple options for the manufacturability of the electronic device 100. The placement of the air outlet 142 and the air inlet 141 does not affect the strength and performance of the entire unit.

[0104] The air enters through the air inlet 141 of the decorative ring 143, passes through the dust filter and reaches the fan 130, and then exits through the dust filter near the air outlet 142 and from the top of the decorative ring 143.

[0105] The fan 130 is positioned between the decorative ring 143 and the motherboard 121, making good use of the phone's space and reducing the overall thickness. The fan 130 is located at the hottest spot on the entire device, and the heat from the electronic components 122 is directly conducted to the fan 130, which then rotates to carry the heat out of the device.

[0106] By disassembling the notch 146, the user can pry open the cover 144 and remove it, revealing the cleanable area of ​​the entire machine. The area around the fan 130 is the main location for dust accumulation. Consumers can remove the dust with a brush or similar tool, which facilitates immediate cleaning of the fan 130. Compared to conventional fan cleaning, which requires removing the back cover and opening the air duct assembly to clean the fan and air duct, the solution involved in this application is convenient and quick.

[0107] The fan 130 is mainly located in the area of ​​the machine with the highest heat output. The area with the highest heat output is the electronic component 122. Both the heat spreader 189 and the fan 130 can quickly dissipate the heat generated by the electronic component 122, thereby achieving overall cooling. The internal structure of the casing 110 is stacked as follows: electronic component 122 - motherboard 121 - air duct bracket 114 - fan 130 - shield 144. The fan 130 is completely placed inside the decorative ring 143, making reasonable use of the internal space of the decorative ring 143 and avoiding waste.

[0108] Users can clean the area around fan 130 by using tools such as a brush to clean the dust-collecting area. Opening the cover 144 makes fan 130 clearly visible, allowing for quick identification of dust and dirt, enabling fan 130 cleaning, and reducing problems such as abnormal noise, jamming, and slow speed of fan 130.

[0109] To further reduce dust accumulation in the fan 130, a dustproof mesh is attached to the decorative ring 143 for initial dust prevention. The dustproof mesh consists of double-sided adhesive, a polyethylene terephthalate layer, and the dustproof mesh itself.

[0110] The decorative ring 143 is provided with a bob for holding the cover 144. The bob is easy to move and does not easily damage the cover 144. The cover 144 can be made of transparent or opaque material.

[0111] The fan 130 is assembled on the air duct bracket 114 and sealed with adhesive to achieve IP68 protection. The circuit board of the fan 130 can be powered by contact springs.

[0112] In other embodiments, the shield 144 can be locked with screws. After loosening the screws, the shield 144 can be removed through the disassembly notch 146, thereby achieving dust removal of the fan 130.

[0113] In this embodiment, the electronic device 100 can be a mobile phone, or it can be a laptop, tablet computer, or other electronic products.

[0114] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0115] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: A housing, the housing including a rear cover; The motherboard assembly is located within the housing; A fan is located on the side of the motherboard assembly facing the rear cover, and the fan is used to dissipate heat from the motherboard assembly; A decorative ring assembly is connected to the rear cover. The decorative ring assembly has a mounting cavity on the side facing the motherboard assembly. The fan is located in the mounting cavity, and at least a portion of the decorative ring assembly can be detached to open or close the mounting cavity.

2. The electronic device according to claim 1, characterized in that, The electronic device also includes: An air duct bracket is located inside the housing. The fan is connected to the air duct bracket. The mounting cavity is formed between the air duct bracket and the decorative ring assembly. The air duct bracket is located between the motherboard assembly and the fan. The decorative ring assembly is located on the side of the air duct bracket away from the motherboard assembly.

3. The electronic device according to claim 2, characterized in that, The motherboard assembly includes a motherboard and electronic components, and at least a portion of the electronic components are disposed opposite to the fan along the thickness direction of the motherboard.

4. The electronic device according to claim 1, characterized in that, The rear cover has a first through hole, through which a portion of the fan extends out of the rear cover and into the interior of the decorative ring assembly.

5. The electronic device according to claim 1, characterized in that, The decorative ring assembly is provided with an air inlet and an air outlet, both of which are connected to the mounting cavity.

6. The electronic device according to claim 5, characterized in that, The distance between the decorative ring assembly and the first side of the back cover is L1, and the distance between the decorative ring assembly and the second side of the back cover is L2, where L1 < L2. The first side of the decorative ring assembly is adjacent to the first side of the back cover, the second side of the decorative ring assembly is away from the first side of the back cover, the air inlet is located on the second side of the decorative ring assembly, and the air outlet is located on the first side of the decorative ring assembly; or, the air inlet and the air outlet are located on adjacent sides of the decorative ring assembly.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The decorative ring assembly includes: A decorative ring is connected to the back cover. The decorative ring has a second through hole and a mounting groove. The mounting groove is located on the side of the second through hole away from the motherboard assembly. The second through hole is positioned opposite to the fan. The shielding element is detachably connected to the mounting slot.

8. The electronic device according to claim 7, characterized in that, The decorative ring has a disassembly notch on the side opposite to the back cover, and the disassembly notch is located at the edge of the mounting groove.

9. The electronic device according to claim 7, characterized in that, The shielding element is a light-transmitting element.

10. The electronic device according to any one of claims 1 to 6, characterized in that, The electronic device also includes: A camera module is connected to the motherboard assembly. The rear cover is also provided with a third through hole, which is used to avoid the camera module. A lens is attached to the side of the decorative ring assembly opposite to the back cover, and the lens is positioned opposite to the third through hole.

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