A method for improving reliability of LED lamp beads

Abstract

This invention provides a method for improving the reliability of LED chips, comprising the following steps: S1, preparing a composite unit of a conductor electrode plate and an LED chip; S2, die bonding and dispensing the composite unit; S3, constructing an auxiliary conductive path; S4, eliminating the use of traditional flux; S5, optimizing heat dissipation using the conductor electrode plate. This invention provides a method for improving the reliability of LED chips by preparing the composite unit through a eutectic hot pressing process, combined with conductive adhesive and wire bonding, eliminating traditional flux and fundamentally solving the light decay problem caused by flux. The conductor electrode plate increases the thickness of the heat dissipation layer at the bottom of the chip, optimizing heat conduction efficiency. The strong bonding of the eutectic hot pressing avoids the risks of secondary solder melting and thermal stress peeling. The auxiliary conductive path enhances the stability of electrical connections. These multiple aspects synergistically improve the reliability of LED chips, extend their service life, and meet the high requirements of end customers for LED packaging.

Description

Technical Field

[0001] This invention relates to the field of LED chips, and more particularly to a method for improving the reliability of LED chips. Background Technology

[0002] LEDs are widely used in various industries due to their advantages such as small size, high luminous efficiency, energy saving and environmental protection. Flip-chip packaging technology has become an important direction for LED companies to optimize packaging form, improve production efficiency and control costs because of its significant competitive advantages.

[0003] However, in existing flip-chip LED packaging processes, the flip-chip bonding technology, which typically uses solder paste and flux, requires a first high-temperature reflow after die bonding and a second high-temperature reflow during the SMT stage. Repeated high temperatures can easily lead to secondary solder melting and increased voids at the bottom of the chip, affecting heat dissipation performance. Furthermore, thermal stress may cause the chip to peel off from the LED carrier, resulting in dead LED failure. At the same time, the flux is prone to yellowing and carbonization when heated during long-term LED operation, accelerating product light decay and shortening lifespan, making it difficult to meet the high requirements of end customers for LED packaging power, luminous efficiency, and reliability.

[0004] Therefore, it is necessary to provide a method to improve the reliability of LED chips and solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a method to improve the reliability of LED chips, solving the problems of secondary solder melting, chip-to-support separation, and flux-induced light decay caused by repeated high-temperature reflow in existing flip-chip LED packaging processes.

[0006] To address the aforementioned technical problems, this invention provides a method for improving the reliability of LED chips, comprising the following steps:

[0007] S1. Preparation of composite unit of conductor electrode plate and LED chip: Using eutectic hot pressing process, LED flip chip is pre-bonded onto conductor electrode plate, which is composed of positive and negative metal electrode plates and intermediate insulating strip; cleaving process is performed along the cutting line of conductor electrode plate to form composite unit of LED chip and conductor electrode plate, and the cleaved composite unit is arranged on the blue film of chip according to a predetermined pattern for later use.

[0008] S2. Die bonding and adhesive bonding of composite units: In the die bonding and adhesive bonding process, conductive adhesive is used to bond the composite units on the blue film of the wafer one by one to the center of the LED bracket, thus completing the initial fixation of the composite units and the LED bracket.

[0009] S3. Constructing an auxiliary conductive path: Implementing a crystal wire bonding process on both sides of the conductor electrode plate from which the LED chip is epitaxial to establish an auxiliary conductive path between the LED chip and the LED support through the crystal wire, thereby enhancing the electrical connection stability between the LED chip and the LED support.

[0010] S4. Abandon the use of traditional flux: The use of traditional solder paste flux is abandoned throughout the entire process to avoid yellowing and carbonization of the flux when heated, thus solving the product light decay problem caused by flux issues at the root.

[0011] S5. Optimize heat dissipation using conductor electrode plates: By utilizing the structural design of conductor electrode plates, the thickness of the heat dissipation layer at the bottom of the LED chip is increased, optimizing the heat conduction efficiency between the chip and the bracket. At the same time, through the bonding effect of the eutectic hot pressing process, the risk of secondary solder melting at the bottom of the chip caused by high temperature in subsequent processes, as well as the chip and bracket peeling problem caused by thermal stress, are avoided.

[0012] Preferably, the die bonding and dispensing process in S2 uses a die bonding and dispensing machine. The die bonding and dispensing machine includes an operating table, a mounting frame, an adjusting frame, a dispensing head, a moving component, an operating plate, a connecting component, and two limiting components. The mounting frame is installed on one side of the operating table, the adjusting frame is located on one side of the mounting frame, the dispensing head is located on one side of the adjusting frame, the moving component is located at the center of the surface of the operating table, the operating plate is located on the moving component, the connecting component is located on the surface of the operating plate, and the two limiting components are symmetrically arranged on one side of the connecting component.

[0013] Preferably, the moving component includes a moving rail and a moving sleeve. The moving rail is connected to the center position of the operating table surface, the moving sleeve is fitted onto the surface of the moving rail, and a limit bolt is provided between the moving rail and the moving sleeve.

[0014] Preferably, the connecting assembly includes a connecting plate, an external threaded block, and a threaded sleeve, wherein the external threaded block is connected to the bottom of the connecting plate, and the threaded sleeve is threadedly connected to the surface of the external threaded block.

[0015] Preferably, the limiting component includes a limiting groove, a limiting block, a limiting plate, a rubber pad, and a bolt. The limiting groove is formed on the surface of the connecting plate, and the limiting block is slidably connected to the inside of the limiting groove.

[0016] Preferably, the limiting plate is connected to the surface of the limiting block, and the rubber pad is adhered to one side of the limiting plate.

[0017] Preferably, the bolt is disposed between the limiting block and the connecting plate.

[0018] Preferably, the surface of the operating table is provided with a disassembly assembly, which includes a groove, a disassembly plate, two positioning blocks and two positioning slots. The groove is formed on the surface of the operating table, and the disassembly plate is disposed inside the groove.

[0019] Preferably, the two positioning blocks are respectively connected to both ends of the disassembly plate.

[0020] Preferably, the two positioning grooves are respectively formed on both sides of the inner wall of the groove.

[0021] Compared with related technologies, the method for improving the reliability of LED chips provided by this invention has the following beneficial effects:

[0022] This invention provides a method for improving the reliability of LED chips. It utilizes a eutectic hot-pressing process to prepare composite units, combined with conductive adhesive and wire bonding, eliminating the need for traditional flux and fundamentally solving the problem of light decay caused by flux. The conductor electrode plate increases the thickness of the heat dissipation layer at the bottom of the chip, optimizing heat conduction efficiency. The robust bonding of the eutectic hot-pressing process avoids the risks of secondary solder melting and thermal stress peeling. The auxiliary conductive path enhances the stability of the electrical connection. These multiple aspects synergistically improve the reliability of the LED chips, extend their service life, and meet the high requirements of end customers for LED packaging. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a first embodiment of a method for improving the reliability of LED beads provided by the present invention;

[0024] Figure 2 for Figure 1 The side view of the LED beads shown;

[0025] Figure 3 for Figure 2 The enlarged schematic diagram of part A shown below;

[0026] Figure 4 for Figure 1 The diagram shows the structure of the LED beads being assembled.

[0027] Figure 5 This is a schematic diagram of a second embodiment of a method for improving the reliability of LED beads provided by the present invention;

[0028] Figure 6 for Figure 5 The enlarged schematic diagram of section B is shown below;

[0029] Figure 7 for Figure 5 The enlarged schematic diagram of section C is shown below;

[0030] Figure 8 for Figure 5 The diagram shows a three-dimensional structure of the die bonder dispensing machine.

[0031] Figure 9 for Figure 8 The enlarged schematic diagram of part D is shown below;

[0032] Figure 10 A schematic diagram of the structure of a third embodiment of a method for improving the reliability of LED beads provided by the present invention;

[0033] Figure 11 for Figure 10 The enlarged schematic diagram of part E is shown.

[0034] The diagram is labeled as follows: 1. LED support, 2. Conductor electrode plate, 3. LED flip chip, 4. Conductive adhesive, 5. Crystal wire.

[0035] 6. Control panel; 7. Mounting bracket; 8. Adjustment bracket; 9. Dispensing head.

[0036] 10. Moving component; 101. Moving rail; 102. Moving sleeve; 103. Limit bolt.

[0037] 11. Control panel

[0038] 12. Connecting assembly; 121. Connecting plate; 122. External threaded block; 123. Threaded sleeve.

[0039] 13. Limiting assembly; 131. Limiting groove; 132. Limiting block; 133. Limiting plate; 134. Rubber pad; 135. Bolt.

[0040] 14. Disassembly components; 141. Groove; 142. Disassembly plate; 143. Positioning block; 144. Positioning slot. Detailed Implementation

[0041] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0044] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0045] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0048] First Embodiment

[0049] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in, Figure 1 This is a schematic diagram of the structure of a first embodiment of a method for improving the reliability of LED beads provided by the present invention; Figure 2 for Figure 1 The side view of the LED beads shown; Figure 3 for Figure 2 The enlarged schematic diagram of part A shown below; Figure 4 for Figure 1The diagram shows a structural schematic of LED chip assembly. A method for improving the reliability of LED chips includes the following steps:

[0050] S1. Preparation of composite unit of conductor electrode plate 2 and LED chip: Using eutectic hot pressing process, LED flip chip 3 is pre-bonded onto conductor electrode plate 2. The conductor electrode plate 2 is composed of positive and negative metal electrode plates and intermediate insulating strip. The conductor electrode plate is split along the cutting line to form composite unit of LED chip and conductor electrode plate 2. The split composite unit is arranged on the blue film of the chip according to a predetermined pattern for later use.

[0051] S2. Die bonding and adhesive bonding of composite units: In the die bonding and adhesive bonding process, conductive adhesive 4 is used to bond the composite units on the blue film of the wafer to the center of the LED bracket 1 one by one, thus completing the initial fixation of the composite units and the LED bracket 1.

[0052] S3. Constructing an auxiliary conductive path: Implementing a crystal wire bonding process on both sides of the conductor electrode plate 2 from which the LED chip is epitaxial to establish an auxiliary conductive path between the LED chip and the LED support 1 through the crystal wire, thereby enhancing the electrical connection stability between the LED chip and the LED support 1.

[0053] S4. Abandon the use of traditional flux: The use of traditional solder paste flux is abandoned throughout the entire process to avoid yellowing and carbonization of the flux when heated, thus solving the product light decay problem caused by flux issues at the root.

[0054] S5. Optimize heat dissipation using conductor electrode plates: By utilizing the structural design of conductor electrode plate 2, the thickness of the heat dissipation layer at the bottom of the LED chip is increased, optimizing the heat conduction efficiency between the chip and the bracket. At the same time, through the bonding effect of the eutectic hot pressing process, the risk of secondary tin melting at the bottom of the chip caused by high temperature in subsequent processes, as well as the chip and bracket peeling problem caused by thermal stress, are avoided.

[0055] The working principle of the method for improving the reliability of LED chips provided by this invention is as follows:

[0056] In use, the composite unit is prepared by eutectic hot pressing process to achieve a firm bond between the LED flip chip and the conductor electrode plate; the composite unit is initially fixed to the LED bracket by conductive adhesive, and then auxiliary conductive path is constructed by crystal wire bonding to ensure stable electrical connection; flux is eliminated to avoid light decay problem, and the conductor electrode plate not only enhances heat dissipation, but also prevents secondary solder melting and chip peeling. Multiple links work together to improve the reliability and service life of LED beads.

[0057] Compared with related technologies, the method for improving the reliability of LED chips provided by this invention has the following beneficial effects:

[0058] This invention provides a method for improving the reliability of LED chips. It utilizes a eutectic hot-pressing process to prepare composite units, combined with conductive adhesive and wire bonding, eliminating the need for traditional flux and fundamentally solving the problem of light decay caused by flux. The conductor electrode plate increases the thickness of the heat dissipation layer at the bottom of the chip, optimizing heat conduction efficiency. The robust bonding of the eutectic hot-pressing process avoids the risks of secondary solder melting and thermal stress peeling. The auxiliary conductive path enhances the stability of the electrical connection. These multiple aspects synergistically improve the reliability of the LED chips, extend their service life, and meet the high requirements of end customers for LED packaging.

[0059] Second Embodiment

[0060] Please refer to the following: Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 Based on the method for improving the reliability of LED chips provided in the first embodiment of this application, the second embodiment of this application proposes another method for improving the reliability of LED chips. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0061] Specifically, the second embodiment of this application provides a method for improving the reliability of LED beads, which differs in that the die bonding and dispensing process in S2 uses a die bonding and dispensing machine. The die bonding and dispensing machine includes an operating table 6, a mounting frame 7, an adjusting frame 8, a dispensing head 9, a moving component 10, an operating plate 11, a connecting component 12, and two limiting components 13. The mounting frame 7 is installed on one side of the operating table 6, the adjusting frame 8 is located on one side of the mounting frame 7, the dispensing head 9 is located on one side of the adjusting frame 8, the moving component 10 is located at the center of the surface of the operating table 6, the operating plate 11 is located on the moving component 10, the connecting component 12 is located on the surface of the operating plate 11, and the two limiting components 13 are symmetrically arranged on one side of the connecting component 12.

[0062] The moving component 10 includes a moving rail 101 and a moving sleeve 102. The moving rail 101 is connected to the center position of the surface of the operating table 6, and the moving sleeve 102 is fitted onto the surface of the moving rail 101. A limit bolt 103 is provided between the moving rail 101 and the moving sleeve 102.

[0063] The connecting assembly 12 includes a connecting plate 121, an external threaded block 122, and a threaded sleeve 123. The external threaded block 122 is connected to the bottom of the connecting plate 121, and the threaded sleeve 123 is threadedly connected to the surface of the external threaded block 122.

[0064] The limiting component 13 includes a limiting groove 131, a limiting block 132, a limiting plate 133, a rubber pad 134, and a bolt 135. The limiting groove 131 is formed on the surface of the connecting plate 121, and the limiting block 132 is slidably connected to the inside of the limiting groove 131.

[0065] The limiting plate 133 is connected to the surface of the limiting block 132, and the rubber pad 134 is adhered to one side of the limiting plate 133.

[0066] The bolt 135 is disposed between the limiting block 132 and the connecting plate 121.

[0067] The moving rail 101 is fixedly connected to the surface of the operating table 6, and the moving sleeve 102 is movably sleeved on the surface of the moving rail 101 and can slide along the moving rail 101. A limit bolt 103 is provided between the moving rail 101 and the moving sleeve 102 to lock the position of the moving sleeve 102.

[0068] The limiting block 132 is slidably connected to the inside of the limiting groove 131, the limiting plate 133 is welded to the surface of the limiting block 132, the rubber pad 134 is adhered to one side of the limiting plate 133 to avoid damaging the LED bracket 1, and the bolt 135 is threaded between the limiting block 132 and the connecting plate 121 to lock the position of the limiting block 132.

[0069] The movable sleeve 102 is movably fitted onto the surface of the movable rail 101 and can slide along the movable rail 101. A limit bolt 103 is provided between the movable rail 101 and the movable sleeve 102 to lock the position of the movable sleeve 102.

[0070] The working principle of the method for improving the reliability of LED chips provided by this invention is as follows:

[0071] During operation, the LED bracket 1 is placed on the surface of the connecting plate 121, the sliding limit block 132 drives the limit plate 133 to clamp the LED bracket 1, and the bolt 135 is tightened to fix it. The position of the dispensing head 9 is adjusted by the adjusting frame 8, and the dispensing head 9 accurately applies the conductive adhesive 4 to the center position of the LED bracket 1. Then, the picking and placing mechanism picks up the composite unit from the blue film of the chip and bonds it one by one to the conductive adhesive 4 on the LED bracket 1, completing the initial fixation of the composite unit and the LED bracket 1. The conductive adhesive 4 has both bonding and conductive functions, ensuring a firm connection and electrical conductivity.

[0072] Compared with related technologies, the method for improving the reliability of LED chips provided by this invention has the following beneficial effects:

[0073] The present invention provides a method for improving the reliability of LED beads. By setting a connecting component 12 and two limiting components 13 on the surface of the operation plate 11, different components can be fixed on the side, thereby increasing the practicality of component processing.

[0074] Third Embodiment

[0075] Please refer to the following: Figure 10 and Figure 11 Based on the method for improving the reliability of LED chips provided in the first embodiment of this application, the third embodiment of this application proposes another method for improving the reliability of LED chips. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the separate implementation of the first embodiment.

[0076] Specifically, the third embodiment of this application provides a method for improving the reliability of LED beads, which differs in that it further includes a disassembly assembly 14. The disassembly assembly 14 is disposed on the surface of the operating table 6. The disassembly assembly 14 includes a groove 141, a disassembly plate 142, two positioning blocks 143 and two positioning slots 144. The groove 141 is formed on the surface of the operating table 6, and the disassembly plate 142 is disposed inside the groove 141.

[0077] The two positioning blocks 143 are respectively connected to the two ends of the disassembly plate 142.

[0078] The two positioning grooves 144 are respectively opened on both sides of the inner wall of the groove 141.

[0079] A groove 141 is formed on the surface of the operating table 6 to accommodate a disassembly plate 142. The disassembly plate 142 is disposed inside the groove 141, with its surface flush with the operating table 6, and is used to support the movable component 10. Two positioning blocks 143 are welded to both ends of the disassembly plate 142. Two positioning grooves 144 are formed on both sides of the inner wall of the groove 141 and are adapted to the positioning blocks 143. Through the insertion and removal of the positioning blocks 143 and the positioning grooves 144, the disassembly plate 142 can be quickly positioned and installed.

[0080] The working principle of the method for improving the reliability of LED chips provided by this invention is as follows:

[0081] When it is necessary to maintain the moving component 10 or the surface of the operating table 6, lift the disassembly plate 142 upwards to disengage the positioning block 143 from the positioning groove 144, and then remove the disassembly plate 142 and the moving component 10 and other parts on the surface. After maintenance, align the positioning block 143 with the positioning groove 144 and insert it to place the disassembly plate 142 stably in the groove 141 to complete the assembly.

[0082] Compared with related technologies, the method for improving the reliability of LED chips provided by this invention has the following beneficial effects:

[0083] This invention provides a method for improving the reliability of LED beads. By setting a disassembly component 14 on the die bonding and dispensing machine, the disassembly board 142 and surface components can be quickly disassembled and assembled, which facilitates maintenance and repair, improves the ease of use and maintenance efficiency of the die bonding and dispensing machine, indirectly ensures the continuity and stability of the LED bead packaging process, and further optimizes the overall process for improving the reliability of LED beads.

[0084] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for improving the reliability of LED chips, characterized in that, Includes the following steps: S1. Preparation of composite unit of conductor electrode plate and LED chip: Using eutectic hot pressing process, LED flip chip is pre-bonded onto conductor electrode plate, which is composed of positive and negative metal electrode plates and intermediate insulating strip; cleaving process is performed along the cutting line of conductor electrode plate to form composite unit of LED chip and conductor electrode plate, and the cleaved composite unit is arranged on the blue film of chip according to a predetermined pattern for later use. S2. Die bonding and adhesive bonding of composite units: In the die bonding and adhesive bonding process, conductive adhesive is used to bond the composite units on the blue film of the wafer one by one to the center of the LED bracket, thus completing the initial fixation of the composite units and the LED bracket. S3. Constructing an auxiliary conductive path: Implementing a crystal wire bonding process on both sides of the conductor electrode plate from which the LED chip is epitaxial to establish an auxiliary conductive path between the LED chip and the LED support through the crystal wire, thereby enhancing the electrical connection stability between the LED chip and the LED support. S4. Abandon the use of traditional flux: The use of traditional solder paste flux is abandoned throughout the entire process to avoid yellowing and carbonization of the flux when heated, thus solving the product light decay problem caused by flux issues at the root. S5. Optimize heat dissipation using conductor electrode plates: By utilizing the structural design of conductor electrode plates, the thickness of the heat dissipation layer at the bottom of the LED chip is increased, optimizing the heat conduction efficiency between the chip and the bracket. At the same time, through the bonding effect of the eutectic hot pressing process, the risk of secondary solder melting at the bottom of the chip caused by high temperature in subsequent processes, as well as the chip and bracket peeling problem caused by thermal stress, are avoided.

2. The method for improving the reliability of LED chips according to claim 1, characterized in that, The die bonding and dispensing process in S2 uses a die bonding and dispensing machine. The die bonding and dispensing machine includes an operating table, a mounting frame, an adjusting frame, a dispensing head, a moving component, an operating plate, a connecting component, and two limiting components. The mounting frame is installed on one side of the operating table, the adjusting frame is located on one side of the mounting frame, the dispensing head is located on one side of the adjusting frame, the moving component is located at the center of the operating table surface, the operating plate is located on the moving component, the connecting component is located on the surface of the operating plate, and the two limiting components are symmetrically arranged on one side of the connecting component.

3. The method for improving the reliability of LED chips according to claim 2, characterized in that, The moving component includes a moving rail and a moving sleeve. The moving rail is connected to the center of the operating table surface, and the moving sleeve is fitted onto the surface of the moving rail. A limit bolt is provided between the moving rail and the moving sleeve.

4. The method for improving the reliability of LED chips according to claim 2, characterized in that, The connecting assembly includes a connecting plate, an external threaded block, and a threaded sleeve. The external threaded block is connected to the bottom of the connecting plate, and the threaded sleeve is threadedly connected to the surface of the external threaded block.

5. The method for improving the reliability of LED beads according to claim 4, characterized in that, The limiting component includes a limiting groove, a limiting block, a limiting plate, a rubber pad, and a bolt. The limiting groove is formed on the surface of the connecting plate, and the limiting block is slidably connected to the inside of the limiting groove.

6. The method for improving the reliability of LED chips according to claim 5, characterized in that, The limiting plate is connected to the surface of the limiting block, and the rubber pad is adhered to one side of the limiting plate.

7. The method for improving the reliability of LED chips according to claim 5, characterized in that, The bolt is positioned between the limiting block and the connecting plate.

8. The method for improving the reliability of LED chips according to claim 2, characterized in that, The surface of the operating table is provided with a disassembly assembly, which includes a groove, a disassembly plate, two positioning blocks and two positioning slots. The groove is formed on the surface of the operating table, and the disassembly plate is disposed inside the groove.

9. The method for improving the reliability of LED chips according to claim 8, characterized in that, The two positioning blocks are respectively connected to both ends of the disassembly plate.

10. The method for improving the reliability of LED chips according to claim 8, characterized in that, The two positioning grooves are respectively formed on both sides of the inner wall of the groove.

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