Light emitting device, method of manufacturing the same, and display apparatus

Abstract

This application relates to a light-emitting device, its fabrication method, and a display device. The light-emitting device of this application includes: a driving substrate, a light-emitting element, an adhesive film layer, and a texture layer. The light-emitting element is located on the surface of the driving substrate. The adhesive film layer is disposed on the surface of the driving substrate and covers the light-emitting element. The adhesive film layer is black. The adhesive film layer is transparent. The adhesive film layer includes a substrate and diffusion particles dispersed within the substrate. The texture layer is made of reflective ink, and the reflective ink forms a textured pattern on the surface of the adhesive film layer away from the driving substrate. In the light-emitting device of this application, the ink color difference of the driving substrate is small, the light-emitting device has high light emission uniformity, and the influence of the textured pattern on the display image can be reduced.

Description

Technical Field

[0001] This application relates to the field of light-emitting device technology, and in particular to a light-emitting device, its fabrication method, and a display device. Background Technology

[0002] A new type of display screen that can display natural textures such as wood grain and stone grain or special appearance textures when the screen is off, and can display normally when the screen is on, is gradually being used in automotive displays, commercial displays, and home displays. The main principle of the always-on texture display screen is to superimpose a semi-transparent plastic shell or film on the surface of the display screen, and print semi-transparent colored ink on the surface of the semi-transparent plastic shell or film to form corresponding patterns. The colored texture pattern is presented by the reflection of external ambient light through the ink.

[0003] In traditional textured displays, the texture pattern is typically placed in areas outside the LED chips to create the effect of displaying a pattern when the screen is off and showing the image when the screen is on. While the textured display uses the high brightness of the LED chips to cover the pattern in the non-illuminated areas when the screen is on, the texture pattern in the areas between the LED chips can affect the clarity of the displayed image when displaying low grayscale images. This results in noticeable off-screen patterns in dark or black areas, significantly impacting the display quality. Summary of the Invention

[0004] Therefore, it is necessary to provide a light-emitting device, its fabrication method, and a display device. In the light-emitting device of this application, the ink color difference of the driving substrate is small, the light-emitting device has high light emission uniformity, and the influence of texture patterns on the display image can be reduced.

[0005] In a first aspect, this application provides a light-emitting device, comprising: a driving substrate, a light-emitting element, an adhesive film layer, and a textured layer;

[0006] The light-emitting element is located on the surface of the driving substrate;

[0007] The adhesive film layer is disposed on the surface of the driving substrate and covers the light-emitting element; the adhesive film layer is black; the adhesive film layer is transparent; the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate;

[0008] The textured layer is made of reflective ink, which forms a textured pattern on the surface of the film layer away from the driving substrate.

[0009] In some embodiments, the film layer comprises the following components in parts by weight: 60 to 100 parts epoxy resin, 6 to 10 parts UV resin, 0.5 to 2 parts photoinitiator, 1 to 10 parts pigment carbon black, 1 to 10 parts diffusion particles, 20 to 100 parts first curing agent, 6 to 20 parts diluent, and 1 to 10 parts first filler.

[0010] In some embodiments, the light transmittance of the film layer is 40% to 80%.

[0011] In some embodiments, the thickness of the adhesive film layer is 120 μm to 200 μm.

[0012] In some embodiments, the particle size of the diffusion particles is 1 μm to 10 μm.

[0013] In some embodiments, the diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0014] In some embodiments, the reflective ink comprises the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of silicone micropowder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

[0015] In some embodiments, the reflective ink further includes a dispersant in the form of 0.1 to 1 part by weight.

[0016] In some embodiments, the reflective ink further includes a leveling agent in the form of 0.1 to 1 parts by weight.

[0017] In some embodiments, the reflective ink further includes 0.1 to 1 part by weight of an antifoaming agent.

[0018] In some embodiments, the reflective ink further includes an adhesion agent in the form of 0.1 to 1 parts by weight.

[0019] In some embodiments, the particle size of the diffusion particles is 1 μm to 10 μm.

[0020] In some embodiments, the diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0021] In some embodiments, the light-emitting device further includes a protective layer disposed on the surface of the adhesive film layer away from the driving substrate, the protective layer entirely covering the texture layer.

[0022] In some embodiments, the protective layer comprises a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

[0023] In some embodiments, the protective layer comprises the following components in parts by weight: 80 to 100 parts of resin substrate, 40 to 100 parts of second curing agent, 0.1 to 1 part of silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of antireflective particles.

[0024] In some embodiments, the hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles.

[0025] In some embodiments, the particle size of the hardening particles is 2 μm to 10 μm.

[0026] In some embodiments, the antireflective particles comprise hollow silica particles.

[0027] In some embodiments, the antireflective particles have a particle size of 20 nm to 100 nm.

[0028] In some embodiments, the resin substrate includes at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

[0029] In some embodiments, the hardening particles are fluorosilane-modified hardening particles.

[0030] In some embodiments, the antireflective particles are antireflective particles with fluorosilane surface modification.

[0031] Secondly, this application provides a method for fabricating a light-emitting device, comprising the following steps:

[0032] A substrate is provided, the substrate including a driving substrate and a light-emitting element disposed on the surface of the driving substrate;

[0033] An adhesive film layer is formed on the surface of the driving substrate, the adhesive film layer covering the light-emitting element; the adhesive film layer is black; the adhesive film layer is transparent; the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate;

[0034] A textured layer is formed on the surface of the adhesive film layer away from the driving substrate. The material of the textured layer includes reflective ink, and the reflective ink forms a textured pattern on the surface of the adhesive film layer away from the driving substrate.

[0035] Thirdly, this application provides a display device comprising the light-emitting device described in any one of the above claims or the light-emitting device prepared by the above-described method for preparing the light-emitting device.

[0036] In the aforementioned light-emitting device, covering the light-emitting element with a transparent black adhesive film layer disposed on the surface of the driving substrate can reduce the ink color difference of the driving substrate. Simultaneously, the diffusion particles dispersed within the substrate can scatter the light emitted by the light-emitting element, thereby improving the light emission uniformity of the light-emitting device. Furthermore, forming a textured pattern directly on the surface of the adhesive film layer away from the driving substrate using reflective ink can also reduce the impact of ink color difference on the driving substrate. The light-emitting device of this application achieves a textured display effect when the screen is off, while also reducing the impact of the textured pattern on the displayed image. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of a light-emitting device provided in one embodiment of this application;

[0038] Figure 2 This is a sample diagram of the light-emitting device provided in Embodiment 1 of this application.

[0039] 10. Driving substrate; 20. Light-emitting element; 30. Adhesive film layer; 40. Texture layer; 50. Protective layer. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0045] Reference Figure 1 As shown, one embodiment of this application provides a light-emitting device, including: a driving substrate 10, a light-emitting element 20, an adhesive film layer 30, and a textured layer 40. The light-emitting element 20 is located on the surface of the driving substrate 10. The adhesive film layer 30 is disposed on the surface of the driving substrate 10 and covers the light-emitting element 20. The adhesive film layer 30 is black. The adhesive film layer 30 is transparent. The adhesive film layer 30 includes a substrate and diffusion particles dispersed within the substrate. The textured layer 40 is made of reflective ink, and the reflective ink forms a textured pattern on the surface of the adhesive film layer 30 away from the driving substrate 10.

[0046] In the aforementioned light-emitting device, by covering the light-emitting element 20 with a light-transmitting black adhesive film layer 30 disposed on the surface of the driving substrate 10, the ink color difference of the driving substrate 10 can be reduced. Simultaneously, the light emitted by the light-emitting element 20 can be scattered by the diffusion particles dispersed within the substrate, thereby improving the light emission uniformity of the light-emitting device. Furthermore, forming a textured pattern directly on the surface of the adhesive film layer 30 away from the driving substrate 10 using reflective ink can also reduce the impact of ink color difference on the driving substrate 10. The light-emitting device of this application achieves a textured display effect when the screen is off, while also reducing the impact of the textured pattern on the displayed image.

[0047] In some embodiments, a plurality of light-emitting elements 20 are spaced apart on the surface of the driving substrate 10.

[0048] In some of these embodiments, the light-emitting element 20 includes an LED chip.

[0049] In some embodiments, the light-emitting element 20 includes a MIP (Mini / Micro LED in Package) lamp bead.

[0050] In some embodiments, the light-emitting element 20 includes SMT (discrete surface mount) LEDs.

[0051] It is understandable that by forming textured patterns with reflective ink, light-emitting devices can present different natural textures. For example, natural textures can be text, icons, wood grain, marble patterns, floor tile patterns, water ripples, speckled patterns, and other decorative textures.

[0052] In some embodiments, the film layer 30 comprises the following components in parts by weight: 60 to 100 parts of epoxy resin, 6 to 10 parts of UV resin, 0.5 to 2 parts of photoinitiator, 1 to 10 parts of pigment carbon black, 1 to 10 parts of diffusion particles, 20 to 100 parts of first curing agent, 6 to 20 parts of diluent, and 1 to 10 parts of first filler.

[0053] Optionally, the mass fraction of epoxy resin in the film layer 30 is 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, or 100 parts, or the mass fraction of epoxy resin in the film layer 30 may be within the range of any two of the above mass fractions.

[0054] Optionally, the mass fraction of UV resin in the film layer 30 is 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5 parts, or 10 parts, or the mass fraction of UV resin in the film layer 30 may be within the range of any two of the above mass fractions.

[0055] Optionally, the mass fraction of the photoinitiator in the film layer 30 is 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of the photoinitiator in the film layer 30 may be within the range of any two of the above mass fractions.

[0056] Optionally, the mass fraction of the pigment carbon black in the film layer 30 is 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the pigment carbon black in the film layer 30 can be within the range of any two of the above mass fractions.

[0057] Optionally, the mass fraction of the diffusing particles in the film layer 30 is 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the diffusing particles in the film layer 30 can be within the range of any two of the above mass fractions.

[0058] Optionally, the mass fraction of the first curing agent in the adhesive film layer 30 is 20 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, or 100 parts, or the mass fraction of the first curing agent in the adhesive film layer 30 may be within the range of any two of the above mass fractions.

[0059] Optionally, the mass fraction of the diluent in the film layer 30 is 6 parts, 8 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, or 20 parts, or the mass fraction of the diluent in the film layer 30 may be within the range of any two of the above mass fractions.

[0060] Optionally, the mass fraction of the first filler in the film layer 30 is 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the first filler in the film layer 30 may be within the range of any two of the above mass fractions.

[0061] In some embodiments, the epoxy resin includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, phenolic epoxy resin, and alicyclic epoxy resin.

[0062] In some embodiments, the UV resin includes at least one of polyether acrylate resin, polypropylene acrylate, unsaturated polyester resin, polyurethane acrylate resin, and polyester acrylate resin.

[0063] In some embodiments, the photoinitiator includes at least one selected from phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxycyclohexylphenyl ketone, 2,2-diethoxy-2-phenylacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,4-diethylthiazolidon, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, benzoin alkyl ether, and aminoacetophenone.

[0064] In some embodiments, the first curing agent includes an acid anhydride and a thermosetting accelerator.

[0065] In some embodiments, the thermosetting accelerator includes at least one of dicyandiamide and its modified compounds, imidazole compounds, modified imidazole compounds, organic amine compounds, phenylguanidine, guanidine resins, thiol compounds, and amino resins.

[0066] In some embodiments, the diluent includes at least one of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethyl acetate, and butyl acetate.

[0067] In some embodiments, the second filler includes at least one of magnesium carbonate, calcium carbonate, kaolin, silica, barium sulfate, talc, clay, and alumina powder.

[0068] In some embodiments, the light transmittance of the film layer 30 is 40% to 80%.

[0069] Optionally, the light transmittance of the film layer 30 is 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80%, or the light transmittance of the film layer 30 may be within the range of any two of the above light transmittances.

[0070] In some embodiments, the thickness of the adhesive film layer 30 is 120 μm to 200 μm.

[0071] Optionally, the thickness of the adhesive film layer 30 is 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm or 200μm, or the thickness of the adhesive film layer 30 may be within the range of the above thicknesses.

[0072] In some embodiments, the thickness of the texture layer 40 is 4 μm to 8 μm.

[0073] Optionally, the thickness of the texture layer 40 is 4μm, 4.5μm, 5μm, 5.5μm, 6μm, 6.5μm, 7μm, 7.5μm or 8μm, or the thickness of the texture layer 40 may be within any two of the above thicknesses.

[0074] In some embodiments, the reflective ink comprises the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of silicone micropowder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

[0075] Optionally, the mass fraction of acrylic resin in the reflective ink is 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, or 60 parts, or the mass fraction of acrylic resin in the reflective ink may be within any two of the above-mentioned mass fractions.

[0076] Ethylene glycol diacetate, as a solvent and diluent, can effectively adjust the viscosity and drying speed of reflective inks, improve their leveling and drying properties, thereby enhancing the quality of printed materials. Its excellent solubility allows it to dissolve various resins, paints, and ink components. Optionally, the mass fraction of ethylene glycol diacetate in the reflective ink is 30, 32, 34, 46, 38, 40, 42, 44, 46, 48, or 50 parts, or the mass fraction of ethylene glycol diacetate in the reflective ink can fall within any two of the aforementioned mass fractions.

[0077] Optionally, the mass fraction of pigment in the reflective ink is 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts, or the mass fraction of pigment in the reflective ink may be within the range of any two of the above mass fractions.

[0078] In some embodiments, the color of the pigment in the reflective ink includes at least one of black, white, transparent red, transparent yellow, transparent blue, transparent purple, and transparent green.

[0079] Optionally, the mass fraction of organosilicon powder in the reflective ink is 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, or 5 parts, or the mass fraction of organosilicon powder in the reflective ink can be within any two of the above mass fractions.

[0080] Optionally, the mass fraction of the second filler in the reflective ink is 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the second filler in the reflective ink may be within the range of any two of the above mass fractions.

[0081] Optionally, the mass fraction of the thinner in the reflective ink is 5, 7, 9, 10, 11, 13, 15, 17, 19, or 20 parts, or the mass fraction of the thinner in the reflective ink can be within any two of the above mass fractions.

[0082] In some embodiments, the reflective ink also includes a dispersant in the form of 0.1 to 1 part by weight.

[0083] Optionally, the mass fraction of the dispersant in the reflective ink is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the dispersant in the reflective ink may be within the range of any two of the above mass fractions.

[0084] In some embodiments, the reflective ink further includes 0.1 to 1 part by weight of a leveling agent.

[0085] Optionally, the mass fraction of the leveling agent in the reflective ink is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the leveling agent in the reflective ink may be within the range of any two of the above mass fractions.

[0086] In some embodiments, the leveling agent includes at least one of acrylate leveling agents.

[0087] In some embodiments, the reflective ink also includes 0.1 to 1 part by weight of an antifoaming agent.

[0088] Optionally, the mass fraction of the defoamer in the reflective ink is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the defoamer in the reflective ink may be within the range of any two of the above mass fractions.

[0089] In some embodiments, the defoamer includes at least one of silicone defoamers.

[0090] In some embodiments, the reflective ink further includes 0.1 to 1 part by weight of an adhesion agent.

[0091] Optionally, the mass fraction of the adhesive in the reflective ink is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.8 parts, or 1 part, or the mass fraction of the adhesive in the reflective ink may be within the range of any two of the above mass fractions.

[0092] In some embodiments, the adhesive includes at least one of polyester adhesives.

[0093] Understandably, thinner is a solvent used to dilute ink, primarily for adjusting its viscosity. Optionally, the mass fraction of thinner in reflective ink may be 5, 7, 9, 11, 13, 15, 17, 19, or 20 parts, or the mass fraction of thinner in reflective ink may fall within any two of the aforementioned mass fractions.

[0094] In some embodiments, the particle size of the diffusion particles is 1 μm to 10 μm.

[0095] Within the aforementioned particle size range of the diffusing particles, the adhesive film layer 30 can achieve a good light diffusion effect, thereby enabling the light-emitting device to have good light emission uniformity. Optionally, the particle size of the diffusing particles is 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, or 10μm, or the particle size of the diffusing particles can be within the range of any two of the aforementioned particle sizes.

[0096] In some embodiments, the diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

[0097] Textured displays using film or mask technology may not be suitable for long-term use in semi-outdoor and outdoor scenarios due to risks such as film warping and mask bulging. In such cases, a more reliable optical functional layer combination solution is needed to improve the protective performance of the textured screen surface structure, including functions such as no warping, scratch resistance, impact resistance, water resistance, dust resistance, and fingerprint resistance.

[0098] In some embodiments, the light-emitting device further includes a protective layer 50 disposed on the surface of the adhesive film layer 30 away from the driving substrate 10, and the protective layer 50 completely covers the texture layer 40.

[0099] By covering the texture layer 40 entirely with the protective layer 50, the texture layer 40 can be protected. At the same time, the surface protection performance of the light-emitting device is improved.

[0100] In some embodiments, the protective layer 50 includes a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

[0101] Hardening particles can increase the protective performance of protective layer 50. Anti-reflective particles can improve the anti-reflective capability of protective layer 50.

[0102] In some embodiments, the thickness of the protective layer 50 is 5 μm to 10 μm.

[0103] Optionally, the thickness of the protective layer 50 is 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, or the thickness of the protective layer 50 may be within any two of the above thicknesses.

[0104] It is understandable that the hardness particles and anti-reflective particles in the protective layer 50 may be completely located inside the resin substrate, or may be partially exposed to the resin substrate.

[0105] In some embodiments, the protective layer 50 comprises the following components in parts by weight: 80 to 100 parts of resin substrate, 40 to 100 parts of second curing agent, 0.1 to 1 part of silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of anti-reflective particles.

[0106] Understandably, polydimethylsiloxane can reduce the surface energy of the protective layer and improve its lubrication effect, which is beneficial for the spread of the protective layer during the preparation process. Cellulose acetate can provide toughening effect.

[0107] Optionally, the mass fraction of the resin substrate in the protective layer 50 is 80 parts, 82 parts, 84 parts, 86 parts, 88 parts, 90 parts, 92 parts, 94 parts, 96 parts, 98 parts, or 100 parts, or the mass fraction of the resin substrate in the protective layer 50 may be within the range of any two of the above mass fractions.

[0108] Optionally, the mass fraction of the second curing agent in the protective layer 50 is 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, or 100 parts, or the mass fraction of the second curing agent in the protective layer 50 may be within the range of any two of the above mass fractions.

[0109] Optionally, the mass fraction of the silane coupling agent in the protective layer 50 is 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, or 1 part, or the mass fraction of the silane coupling agent in the protective layer 50 may be within the range of any two of the above mass fractions.

[0110] In some embodiments, the silane coupling agent includes at least one of KH550, KH560, and KH570.

[0111] Optionally, the mass fraction of polydimethylsiloxane in the protective layer 50 is 0.4 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of polydimethylsiloxane in the protective layer 50 may be within any two of the above-mentioned mass fractions.

[0112] Optionally, the mass fraction of cellulose acetate propionate in the protective layer 50 is 0.4 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.4 parts, 1.6 parts, 1.8 parts, or 2 parts, or the mass fraction of cellulose acetate propionate in the protective layer 50 may be within the range of any two of the above mass fractions.

[0113] Optionally, the mass fraction of the hard particles in the protective layer 50 is 8 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, or 20 parts, or the mass fraction of the hard particles in the protective layer 50 may be within the range of any two of the above mass fractions.

[0114] Optionally, the mass fraction of the anti-reflective particles in the protective layer 50 is 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or the mass fraction of the anti-reflective particles in the protective layer 50 may be within the range of any two of the above mass fractions.

[0115] In some embodiments, the hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles.

[0116] In some embodiments, the particle size of the hardening particles is 2 μm to 10 μm.

[0117] Optionally, the particle size of the hardening particles is 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, or the particle size of the hardening particles may be within the range of any two of the above particle sizes.

[0118] In some embodiments, the anti-reflection particles include hollow silica particles.

[0119] Understandably, hollow silica particles have a unique hollow structure that can reduce light scattering and reflection and increase light transmission during light propagation.

[0120] In some embodiments, the antireflective particles have a particle size of 20 nm to 100 nm.

[0121] Optionally, the particle size of the anti-reflection particles is 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm or 100nm, or the particle size of the anti-reflection particles can be within the range of any two of the above particle sizes.

[0122] In some embodiments, the resin substrate includes at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

[0123] In some embodiments, the hardening particles are fluorosilane-modified hardening particles.

[0124] In some embodiments, the antireflective particles are antireflective particles with fluorosilane surface modification.

[0125] Hardening particles modified with fluorosilane and / or antireflective particles modified with fluorosilane can enhance the antifouling and antifingerprint capabilities of the protective layer 50.

[0126] Another embodiment of this application provides a method for fabricating a light-emitting device, comprising the following steps:

[0127] A substrate is provided, the substrate including a driving substrate 10 and a light-emitting element 20 disposed on the surface of the driving substrate 10;

[0128] An adhesive film layer 30 is formed on the surface of the driving substrate 10, and the adhesive film layer 30 covers the light-emitting element 20; the adhesive film layer 30 is black; the adhesive film layer 30 is transparent; the adhesive film layer 30 includes a substrate and diffusion particles dispersed inside the substrate.

[0129] A textured layer 40 is formed on the surface of the adhesive film layer 30 away from the driving substrate 10. The material of the textured layer 40 includes reflective ink, and the reflective ink forms a textured pattern on the surface of the adhesive film layer 30 away from the driving substrate 10.

[0130] In some embodiments, the method for preparing the adhesive film layer 30 includes the following steps:

[0131] Prepare the raw materials for the adhesive film;

[0132] The adhesive film material is filled into the surface of a release film with surrounding dams, and then cured by UV to obtain the adhesive film.

[0133] The adhesive film is adhered to the surface of the driving substrate 10 on which the light-emitting element 20 is disposed, and vacuum heated until the adhesive film is completely cured.

[0134] In some of these embodiments, the vacuum heating time is 2 to 4 hours.

[0135] Optionally, the vacuum heating time is 2h, 2.2h, 2.4h, 2.6h, 2.8h, 3h, 3.2h, 3.4h, 3.6h, 3.8h or 4h, or the vacuum heating time can be within any two of the above times.

[0136] In some of these embodiments, the vacuum heating temperature is 120°C to 150°C.

[0137] Optionally, the vacuum heating temperature is 120°C, 125°C, 130°C, 135°C, 140°C, or 150°C, or the vacuum heating temperature can be within any two of the above temperatures.

[0138] In some embodiments, the method for preparing the texture layer 40 includes the following steps:

[0139] Configure reflective ink;

[0140] Reflective ink is applied to the surface of the adhesive film layer 30 to form a textured pattern;

[0141] Curing the reflective ink yields texture layer 40.

[0142] In some embodiments, the reflective ink is applied to the surface of the film layer 30 by at least one of screen printing, gravure printing, and inkjet printing.

[0143] In some embodiments, the mesh count of the screen printing is 200 to 400 mesh.

[0144] Optionally, the mesh count of the screen printing can be 200, 220, 240, 260, 280, 300, 320, 340, 360, 380 or 400 mesh, or the mesh count of the screen printing can be within any two of the above mesh counts.

[0145] In some embodiments, the curing temperature of the reflective ink is 40°C to 80°C.

[0146] Optionally, the curing temperature of the reflective ink is 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, or 80°C, or the curing temperature of the reflective ink may be within the range of any two of the above temperatures.

[0147] In some embodiments, the curing time of the reflective ink is 5 to 10 minutes.

[0148] Optionally, the curing time of the reflective ink is 5 min, 6 min, 7 min, 8 min, 9 min or 10 min, or the curing time of the reflective ink can be within any two of the above times.

[0149] In some embodiments, after forming the textured layer 40 on the surface of the adhesive film layer 30 away from the driving substrate 10, the following steps are further included:

[0150] A protective layer 50 is formed on the surface of the adhesive film layer 30 away from the driving substrate 10, and the protective layer 50 completely covers the texture layer 40.

[0151] In some embodiments, the method for preparing the protective layer 50 includes the following steps:

[0152] Configure the protective layer raw materials;

[0153] The protective layer material is disposed on the surface of the adhesive film layer 30 away from the driving substrate 10;

[0154] The curing protective layer material forms a protective layer 50.

[0155] In some embodiments, the curing of the protective layer material to form the protective layer 50 includes the following steps:

[0156] After the protective layer material is heat-cured at 80℃~120℃ for 20min~40min, it is left to stand at room temperature for 24h~72h until it is completely cured.

[0157] In some embodiments, the protective layer material also includes 50 to 100 parts by weight of an organic solvent.

[0158] Optionally, the mass fraction of the organic solvent in the protective layer material is 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, or 100 parts, or the mass fraction of the organic solvent in the protective layer material may be within the range of any two of the above mass fractions.

[0159] In some embodiments, the organic solvent includes at least one of ethanol, acetone, and isopropanol.

[0160] In some embodiments, the method for preparing the protective layer material includes the following steps:

[0161] Mix the raw materials except for the second curing agent and stir at 60℃~80℃ for 30min~60min to obtain the mixed raw materials;

[0162] The second curing agent is added to the mixed raw materials and degassing is performed.

[0163] In some embodiments, the protective layer material is disposed on the surface of the adhesive film layer 30 away from the driving substrate 10 by atomization spraying.

[0164] In some embodiments, the preparation methods of fluorosilane-modified hardening particles and fluorosilane-modified antireflective particles include the following steps:

[0165] Mix 1 to 10 parts by weight of hardening particles, 1 to 10 parts by weight of antireflective particles, 0.1 to 1 part by weight of fluorosilane with 100 parts by weight of organic solvent and then disperse by ultrasonication.

[0166] The dispersed mixture is dried by solvent evaporation.

[0167] In some embodiments, the ultrasonic dispersion time is 30 min to 60 min.

[0168] In some embodiments, the temperature for solvent evaporation and drying of the dispersed mixture is 60°C to 100°C.

[0169] Another embodiment of this application provides a display device, including the light-emitting device of any of the above claims or the light-emitting device prepared by the above-described method.

[0170] The following are specific embodiments.

[0171] Example 1

[0172] Methods for fabricating light-emitting devices:

[0173] (1) Preparation of adhesive film: 100 parts of bisphenol A epoxy resin, 10 parts of organosilicon modified acrylic resin, 10 parts of pigment carbon black, 10 parts of silica particles with a particle size of 5μm, 10 parts of ethylene glycol monoethyl ether, 5 parts of ethylene glycol dimethyl ester, 5 parts of barium sulfate and 5 parts of calcium carbonate are provided. After mechanical dispersion for 30 minutes using a high-speed mixer, 90 parts of acid anhydride, 10 parts of dicyandiamide and 0.05 parts of phenyl bis(2,4,6-trimethylbenzoyl)phosphine oxide are added. After planetary degassing and stirring for 10 minutes, the required adhesive solution is obtained. The adhesive solution is poured onto the surface of a release film with four-sided dams. The dam height is 150μm. The adhesive solution is filled into the dam and then covered with a release film. The film is placed in a vacuum chamber for degassing treatment. After curing by ultraviolet light, the film is demolded and the edges are trimmed.

[0174] (2) Texture setting: Provide 50 parts acrylic resin, 30 parts ethylene glycol diacetate, 10 parts thinner, 5 parts silicone micro powder, 3 parts talc powder, 3 parts carbon black, 2 parts yellow pigment, 1 part silicone defoamer, 1 part acrylic leveling agent, and 1 part polyester adhesion promoter. Mechanically mix and stir for 10 minutes, then grind three times using a three-roll mill to obtain texture ink. Screen print the texture ink onto the aforementioned film surface using a polyester 200-mesh screen with a screen printing thickness of 10 μm, and heat to 75°C for 5 minutes to cure.

[0175] (3) Adhesive film bonding: Provide an MLED light board with process edge, perform plasma cleaning treatment on the surface for 10 minutes, use roller pressing process to bond the aforementioned textured adhesive film to the surface of the light board, and then place it in a vacuum oven to degas and heat, with a maximum heating temperature of 120°C and a heating time of 3 hours until the adhesive film is completely cured.

[0176] (4) Preparation of hydrophobic nanoparticles: 1 part perfluorooctyltriethoxysilane, 3 parts silica particles with a particle size of 5 μm, 5 parts hollow silica particles with a particle size of 100 nm, and 100 parts anhydrous ethanol are provided. After being mixed evenly, the mixture is ultrasonically dispersed for 40 minutes and then placed in a drying oven at 100°C for solvent evaporation and drying. The fluorosilane and nanoparticles undergo a dehydration condensation reaction to generate hydrophobic nanoparticles.

[0177] (5) Preparation of coating solution: Provide 100 parts of silicone-modified epoxy resin, 50 parts of acid anhydride curing agent, 5 parts of hydrophobic nanoparticles, 2 parts of alumina particles, 0.5 parts of KH570 silane coupling agent, 0.5 parts of polydimethylsiloxane, 1 part of cellulose acetate propionate and 50 parts of anhydrous ethanol solvent. Mix the above materials except the curing agent evenly and heat them in a 60°C water bath with magnetic stirring for 30 minutes. Then mix them with the curing agent in proportion, stir evenly and degas under vacuum for 5 minutes.

[0178] (6) Coating: The process edge of the LED lamp board is cut off by a dicing machine, and the lamp surface is subjected to plasma activation treatment for 10 minutes. The coating liquid is sprayed onto the surface of the lamp board using atomizing spraying equipment with a coating thickness of 10μm. Then, it is heated at 80℃ for 30 minutes and left to stand at room temperature for 24 hours until it is completely cured.

[0179] Reference Figure 2 As shown, Figure 2 This is a sample image of the light-emitting device provided in Example 1. It can be seen that the light-emitting device in Example 1 has a good screen-off texture effect. Furthermore, the ink color difference of the driving substrate in the light-emitting device is small, and the light-emitting device has high light emission uniformity, which can reduce the impact of the texture pattern on the displayed image.

[0180] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0181] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A light-emitting device, characterized in that, include: Driving substrate, light-emitting element, adhesive film layer, and textured layer; The light-emitting element is located on the surface of the driving substrate; The adhesive film layer is disposed on the surface of the driving substrate and covers the light-emitting element; the adhesive film layer is black; the adhesive film layer is transparent; the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate; The textured layer is made of reflective ink, which forms a textured pattern on the surface of the film layer away from the driving substrate.

2. The light-emitting device according to claim 1, characterized in that, The adhesive film layer comprises the following components in parts by weight: 60 to 100 parts epoxy resin, 6 to 10 parts UV resin, 0.5 to 2 parts photoinitiator, 1 to 10 parts pigment carbon black, 1 to 10 parts diffusion particles, 20 to 100 parts first curing agent, 6 to 20 parts diluent, and 1 to 10 parts first filler.

3. The light-emitting device according to claim 1, characterized in that, The light transmittance of the adhesive film layer is 40%~80%; and / or, The thickness of the adhesive film layer is 120μm~200μm.

4. The light-emitting device according to claim 1, characterized in that, The particle size of the diffused particles is 1 μm to 10 μm; and / or, The diffusion particles include at least one of silicon dioxide, titanium dioxide, aluminum oxide, calcium carbonate, magnesium oxide, and aluminum hydroxide.

5. The light-emitting device according to claim 1, characterized in that, The reflective ink comprises the following components in parts by weight: 30 to 60 parts of acrylic resin, 30 to 50 parts of ethylene glycol diacetate, 1 to 5 parts of pigment, 1 to 5 parts of organosilicon micro powder, 5 to 10 parts of a second filler, and 5 to 20 parts of thinner.

6. The light-emitting device according to claim 5, characterized in that, The reflective ink further includes, by weight, 0.1 to 1 part of a dispersant; and / or, 0.1 to 1 part of a leveling agent; And / or, 0.1 to 1 part of defoamer; And / or, 0.1 to 1 part of an adhesive.

7. The light-emitting device according to any one of claims 1 to 6, characterized in that, The light-emitting device further includes a protective layer disposed on the surface of the adhesive film layer away from the driving substrate, and the protective layer completely covers the texture layer.

8. The light-emitting device according to claim 7, characterized in that, The protective layer includes a resin substrate and hardening particles and anti-reflective particles dispersed in the resin substrate.

9. The light-emitting device according to claim 7, characterized in that, The protective layer comprises the following components in parts by weight: 80 to 100 parts of resin substrate, 40 to 100 parts of second curing agent, 0.1 to 1 part of silane coupling agent, 0.4 to 2 parts of polydimethylsiloxane, 0.4 to 2 parts of cellulose acetate propionate, 8 to 20 parts of hardening particles, and 1 to 10 parts of anti-reflective particles.

10. The light-emitting device according to claim 9, characterized in that, The hardening particles include at least one of silica particles, titanium dioxide particles, zirconium dioxide particles, and alumina particles; and / or, The particle size of the hardening particles is 2μm~10μm; and / or, The antireflective particles include hollow silica particles; and / or, The antireflective particles have a particle size of 20 nm to 100 nm; and / or, The resin substrate includes at least one of polyester-modified epoxy resin, silicone-modified epoxy resin, polysilazane, and polysiloxane.

11. The light-emitting device according to claim 9, characterized in that, The hardening particles are fluorosilane-modified hardening particles; and / or, The antireflective particles are fluorosilane-modified antireflective particles.

12. A method for fabricating a light-emitting device, characterized in that, Includes the following steps: A substrate is provided, the substrate including a driving substrate and a light-emitting element disposed on the surface of the driving substrate; An adhesive film layer is formed on the surface of the driving substrate, the adhesive film layer covering the light-emitting element; the adhesive film layer is black; the adhesive film layer is transparent; the adhesive film layer includes a substrate and diffusion particles dispersed inside the substrate; A textured layer is formed on the surface of the adhesive film layer away from the driving substrate. The material of the textured layer includes reflective ink, and the reflective ink forms a textured pattern on the surface of the adhesive film layer away from the driving substrate.

13. A display device, characterized in that, The light-emitting device includes the light-emitting device according to any one of claims 1 to 11 or the light-emitting device prepared by the method of claim 12.

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