A Micro LED Emitting Array Structure and Manufacturing Method for Optical Interconnection

By employing a dual Bragg reflection structure and lens in the Micro LED optical interconnect, the problems of light extraction efficiency and collimation adjustment are solved, achieving efficient light convergence and collimation, which is suitable for mass production applications of high-density arrays.

CN122248886APending Publication Date: 2026-06-19昆山麦沄显示技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
昆山麦沄显示技术有限公司
Filing Date
2026-03-20
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

Existing Micro LED optical interconnect technology cannot simultaneously improve light extraction efficiency, concentrate emitted light into a point light source, and achieve precise collimation calibration, resulting in low coupling efficiency and limited transmission distance, making it difficult to adapt to mass production applications of high-density arrays.

⚗Method used

By employing a synergistic design of a double Bragg reflection structure and a lens, a light confinement cavity structure is formed by integrating a first Bragg reflection structure and a transparent lens within a composite conductive substrate and combining it with flip-chip bonding technology, thereby achieving efficient light convergence and collimation.

🎯Benefits of technology

It significantly improves the light extraction efficiency of Micro LED, reduces back-out light loss, solves the problem of optical crosstalk, and achieves precise collimation of high-brightness point light source through transparent lens, thereby improving fiber coupling efficiency and signal transmission distance.

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Abstract

This application discloses a Micro LED emitting array structure and manufacturing method for optical interconnection. The structure includes a composite conductive substrate, a Micro LED chip, an organic transparent insulating adhesive, a second Bragg reflector structure with through holes, and a transparent lens. The composite conductive substrate integrates a second bonding electrode, an insulating substrate, a first Bragg reflector structure, and a first bonding electrode sequentially from bottom to top. The upper and lower electrodes are interconnected by filling the through holes in the insulating substrate with metal. This invention improves the light extraction efficiency of the Micro LED chip through the first Bragg reflector structure built into the substrate, and concentrates the divergent light into a point light source through the cooperation of the upper and lower double Bragg reflector structures. Finally, the light is collimated by the transparent lens, which greatly improves the collimation of the Micro LED light output and solves the problems of low coupling efficiency and limited transmission distance in optical interconnection scenarios, adapting to the mass production requirements of high-density Micro LED optical interconnection arrays.
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