Display panel, preparation method thereof, and display device

Abstract

This invention discloses a display panel, its manufacturing method, and a display device, relating to the field of display technology. The display panel includes a first substrate, an anode layer, a light-emitting layer, and a cathode layer sequentially stacked on the first substrate. The cathode layer has microchannels internally, each containing cooling fluid. The microchannels have inlets for the cooling fluid to flow into them and outlets for the cooling fluid to flow out. The technical solution provided by this invention can improve the heat dissipation effect of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays have been widely used in high-end televisions, automotive displays, and outdoor commercial displays due to their advantages such as self-illumination, high contrast, low power consumption, and flexibility. However, OLED devices are extremely sensitive to operating temperature. High-temperature environments accelerate the crystallization and aging process of organic light-emitting materials, leading to brightness decay, color shift, and even irreversible burn-in. Therefore, efficient heat dissipation management is crucial for OLED display devices.

[0003] Currently, OLED displays generally use heat sinks or heat dissipation layers for passive heat dissipation. This heat dissipation method has relatively limited heat dissipation effect and is difficult to meet the thermal management requirements of high brightness and high refresh rate application scenarios. Summary of the Invention

[0004] The main objective of this invention is to propose a display panel, its manufacturing method, and a display device, which aims to improve the heat dissipation effect of the display panel to meet the thermal management requirements of high-brightness and high-refresh-rate application scenarios.

[0005] To achieve the above objectives, the present invention proposes a display panel comprising a first substrate, an anode layer, a light-emitting layer, and a cathode layer sequentially stacked on the first substrate, wherein the cathode layer has microchannels disposed inside the cathode layer and the microchannels contain cooling fluid. The microchannel has an inlet for the cooling fluid to flow into and an outlet for the cooling fluid to flow out.

[0006] In one embodiment, the display panel further includes a heat exchange assembly having a heat exchange cavity, a flow inlet and a flow outlet communicating with the heat exchange cavity, the flow outlet being connected to the flow channel inlet via a first connecting pipe, and the flow inlet being connected to the flow channel outlet via a second connecting pipe, to form a closed loop, so that the cooling fluid circulates in the closed loop.

[0007] In one embodiment, the heat exchange assembly includes: The housing has the heat exchange cavity, the flow inlet, and the flow outlet. A refrigeration module has a refrigeration surface that contacts the inner wall of the heat exchange cavity and is located adjacent to the flow inlet for cooling the cooling fluid flowing out of the microchannel; and A drive module is disposed within the heat exchange cavity and adjacent to the flow outlet, for conveying the cooling fluid cooled by the refrigeration module to the microchannel.

[0008] In one embodiment, the display panel further includes: The second substrate is disposed on the side of the cathode layer facing away from the light-emitting layer. The second substrate is provided with a first clearance through hole and a second clearance through hole corresponding to the flow channel inlet and the flow channel outlet, respectively. A motherboard is disposed on the side of the second substrate facing away from the cathode layer, and a power consumption detection component is disposed on the motherboard; and The control module is electrically connected to the power consumption detection component and the drive module, and is used to control the delivery flow of the drive module according to the signal detected by the power consumption detection component.

[0009] In one embodiment, the heat exchange assembly includes a thermoelectric cooler and a heat-conducting element. The thermoelectric cooler has opposing hot and cold ends, and the heat-conducting element is disposed at the cold end. The heat-conducting element has the heat exchange cavity, the flow inlet, and the flow outlet. The flow channel inlet is located near the upper end of the vertically placed display panel, the flow channel outlet is located near the lower end of the vertically placed display panel, and the semiconductor cooler is located near the upper end of the vertically placed display panel.

[0010] In one embodiment, the microchannel includes a plurality of spaced sub-microchannels, each of which is connected at both ends to the channel inlet and the channel outlet, respectively. The display panel has a high-temperature area when it is working, and the high-temperature area is located in the non-edge area of ​​the display panel. The microchannel also includes multiple auxiliary sub-microchannels, which are spaced apart to correspond to the high-temperature region, and both ends of each auxiliary sub-microchannel are connected to the sub-microchannel corresponding to the high-temperature region.

[0011] In one embodiment, the display panel has at least two high-temperature regions when it is in operation. The two high-temperature regions are respectively located at two adjacent edge regions of the display panel. The flow channel inlet and the flow channel outlet are respectively located at two opposite corners of the cathode layer, and the flow channel inlet is located between the two high-temperature regions. The microchannels include: At least two main channels are provided, each corresponding to one of the two high-temperature regions, and one end of each of the two main channels is connected to the channel inlet, while the other end extends along the length of the two adjacent edge regions. Multiple primary branch channels are distributed at intervals along the length of the main channel. Each primary branch channel is connected to the corresponding main channel, and at least one of the primary branch channels is connected to the channel outlet at the end away from the main channel. Multiple secondary branch channels are distributed at intervals along the length of the primary branch channel, and each secondary branch channel is connected to the corresponding primary branch channel.

[0012] This invention also proposes a method for manufacturing a display panel, comprising the following steps: Provide a first substrate and cooling fluid; An anode layer, a light-emitting layer, and a cathode layer are sequentially fabricated on the first substrate; Microchannels with inlets and outlets are fabricated inside the cathode layer, and cooling fluid is introduced into the microchannels.

[0013] In one embodiment, after the step of fabricating a microchannel with a flow channel inlet and a flow channel outlet inside the cathode layer and introducing cooling fluid into the microchannel, the method further includes: The flow outlet of the heat exchange component is connected to the flow channel inlet via a first connecting pipe, and the flow inlet of the heat exchange component is connected to the flow channel outlet via a second connecting pipe to form a closed loop.

[0014] The present invention also proposes a display device, comprising a display panel as described above, or a display panel prepared using the above-described method for preparing a display panel.

[0015] The display panel provided by this invention features microchannels within the cathode layer. These microchannels contain cooling fluid and have an inlet and an outlet. The cooling fluid flows in through the inlet, traverses the entire microchannel, and exits through the outlet, forming a continuous cooling cycle. During its flow through the microchannels, the cooling fluid directly and efficiently exchanges heat generated by the light-emitting layer, rapidly removing heat and effectively reducing the operating temperature of the display panel. This heat dissipation method, by directly integrating the microchannels within the cathode layer, achieves rapid heat conduction and dissipation, significantly improving heat dissipation efficiency and meeting the thermal management requirements of high-brightness, high-refresh-rate applications. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a cross-sectional structural schematic diagram of an embodiment of the display device provided by the present invention; Figure 2 This is a cross-sectional structural schematic diagram of another embodiment of the display device provided by the present invention; Figure 3 A cross-sectional structural schematic diagram of another embodiment of the display device provided by the present invention; Figure 4 for Figure 3 A cross-sectional view of the heat exchange component from another perspective; Figure 5 for Figure 3 A cross-sectional structural schematic diagram of another embodiment of the heat exchange component from another perspective; Figure 6 This is a schematic diagram showing the distribution of microchannels inside the cathode layer in an embodiment of the display panel provided by the present invention. Figure 7 This is a schematic diagram showing the distribution of microchannels inside the cathode layer in a display panel provided by the present invention. Figure 8 This is a schematic diagram showing the distribution of microchannels inside the cathode layer in a display panel provided by the present invention.

[0018] Explanation of icon numbers: 1000, Display device; 100, Display panel; 100a, High-temperature area; 10, First substrate; 21, Anode layer; 22, Light-emitting layer; 23, Cathode layer; 231, Microchannel; 2311, Sub-microchannel; 2312, Auxiliary sub-microchannel; 2313, Main channel; 2314, Primary branch channel; 2315, Secondary branch channel; 232, Channel inlet; 233, Channel outlet; 31, Heat exchange assembly; 311, Integrated refrigeration circulation pump; 312, Semiconductor cooler; 313, Heat-conducting component; 313a, Integrated heat pipe; 313b, Heat spreader; 32, First connecting pipe; 33, Second connecting pipe; 40, Second substrate; 41, First clearance through-hole; 42, Second clearance through-hole; 50, Main board; 60, Control module; 200, Back cover.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] Organic light-emitting diode (OLED) displays have been widely used in high-end televisions, automotive displays, and outdoor commercial displays due to their advantages such as self-illumination, high contrast, low power consumption, and flexibility. However, OLED devices are extremely sensitive to operating temperature. High-temperature environments accelerate the crystallization and aging process of organic light-emitting materials, leading to decreased display brightness, color shift, and even irreversible burn-in. Therefore, efficient heat dissipation management is crucial for OLED display devices.

[0024] Currently, OLED displays generally use heat sinks or heat dissipation layers for passive heat dissipation. This heat dissipation method has relatively limited heat dissipation effect and is difficult to meet the thermal management requirements of high brightness and high refresh rate application scenarios.

[0025] To address the aforementioned issues, this invention proposes a display panel designed to improve heat dissipation and meet the thermal management requirements of high-brightness, high-refresh-rate application scenarios.

[0026] It should be noted that when a display panel is working, the light-emitting layer generates a large amount of Joule heat due to non-radiative transitions and carrier transport resistance. Simultaneously, the driving circuitry at high refresh rates also generates significant heat. Since OLED display panels typically use glass or flexible substrates, these materials have low thermal conductivity, causing heat to easily accumulate inside the device, forming localized high temperatures (hot spots). This high temperature not only leads to a decrease in luminous efficiency (thermal quenching) but also accelerates the aging of organic light-emitting materials, causing brightness decay, color shift, and even irreversible burn-in.

[0027] Please see Figure 1 In one embodiment of the present invention, the display panel 100 includes a first substrate 10, an anode layer 21, a light-emitting layer 22 and a cathode layer 23 sequentially stacked on the first substrate 10. The cathode layer 23 has a microchannel 231 inside, and the microchannel 231 contains cooling fluid. The microchannel 231 has a channel inlet 232 for the cooling fluid to flow in and a channel outlet 233 for the cooling fluid to flow out.

[0028] The first substrate 10 can be a glass substrate or a flexible substrate, wherein the material of the flexible substrate includes, but is not limited to, polyimide. The first substrate 10 provides a basic support and bearing platform for the anode layer 21, the light-emitting layer 22 and the cathode layer 23.

[0029] The specific materials of the anode layer 21, the light-emitting layer 22, and the cathode layer 23 are all existing technologies and will not be described in detail here.

[0030] The cathode layer 23 may be supported by a conductive metal material to provide a sealed, heat-conducting wall surface for the internal microchannels 231 while enabling electron injection. The microchannels 231 can be fabricated inside the cathode layer 23 using 3D printing technology (such as laser bed fusion (LPBF)). The specific shape and size of the microchannels 231 are not limited here. The microchannels 231 have a flow inlet 232 for the inflow of cooling fluid and a flow outlet 233 for the outflow of cooling fluid. Optionally, the flow inlet 232 and the flow outlet 233 are located at opposite ends of the cathode layer 23 and both penetrate the cathode layer 23 on the side facing away from the light-emitting layer 22. This arrangement allows the cooling fluid to form a through-flow path inside the cathode layer 23, significantly increasing the contact area between the cooling fluid and the cathode layer 23, thus effectively increasing the heat exchange area and improving heat dissipation efficiency.

[0031] Meanwhile, since the heat generated by the display panel 100 mainly comes from the light-emitting layer 22, the present invention directly integrates the microchannel 231 inside the cathode layer 23 where the heat source is located, effectively shortening the heat transfer path from the light-emitting material to the cooling medium, eliminating the thermal resistance caused by the multi-layer interface in the traditional heat dissipation method, and significantly improving the heat dissipation efficiency.

[0032] The display panel 100 provided by this invention has a microchannel 231 disposed inside the cathode layer 23. The microchannel 231 contains cooling fluid and has a channel inlet 232 and a channel outlet 233. The cooling fluid flows in from the channel inlet 232, flows through the entire microchannel 231, and flows out from the channel outlet 233, forming a continuous cooling cycle. During the flow of the cooling fluid through the microchannel 231, it can directly and efficiently exchange heat generated by the light-emitting layer 22, quickly removing heat and effectively reducing the operating temperature of the display panel 100. This heat dissipation method, by directly integrating the microchannel 231 inside the cathode layer 23, achieves rapid heat conduction and dissipation, significantly improving heat dissipation efficiency and meeting the thermal management requirements of high brightness and high refresh rate application scenarios.

[0033] Refer again Figure 1 In some embodiments, the display panel 100 further includes a heat exchange assembly 31, which has a heat exchange cavity, a flow inlet and a flow outlet communicating with the heat exchange cavity. The flow outlet is connected to the flow channel inlet 232 by a first connecting pipe 32, and the flow inlet is connected to the flow channel outlet 233 by a second connecting pipe 33, so as to form a closed loop, so that the cooling fluid circulates in the closed loop.

[0034] Specifically, the heat exchange component 31 is disposed on the side of the cathode layer 23 facing away from the light-emitting layer 22. It has a heat exchange cavity inside and is provided with a flow inlet and a flow outlet that connect the heat exchange cavity. The flow outlet is connected to the flow channel inlet 232 through the first connecting pipe 32, and the flow inlet is connected to the flow channel outlet 233 through the second connecting pipe 33, thereby forming a closed loop between the heat exchange cavity, the first connecting pipe 32, the microchannel 231, and the second connecting pipe 33.

[0035] The cooling fluid continuously circulates in a closed loop: within the microchannel 231, the cooling fluid exchanges heat with the heat generated when the display panel 100 is working. After absorbing heat, the temperature of the cooling liquid rises to form a high-temperature fluid. The high-temperature fluid flows back to the heat exchange chamber through the second connecting pipe 33, where it releases heat and is cooled back to a low-temperature cooling fluid. The cooling fluid then re-enters the microchannel 231 through the first connecting pipe 32. This cycle repeats continuously, enabling the continuous and efficient removal of heat from the display panel 100.

[0036] This invention upgrades the traditional passive heat dissipation method to an active internal circulation heat dissipation method by integrating microchannels 231 in the cathode layer 23 and forming a closed loop for cooling fluid circulation with the heat exchange component 31, the first connecting pipe 32 and the second connecting pipe 33. This method can directly and efficiently exchange the heat generated by the light-emitting layer 22, significantly improving heat dissipation efficiency and meeting the thermal management requirements of high brightness and high refresh rate application scenarios.

[0037] In some embodiments, the heat exchange assembly 31 includes a housing, a refrigeration module, and a drive module. The housing has a heat exchange cavity, a flow inlet, and a flow outlet. The refrigeration module has a refrigeration surface that contacts the inner wall of the heat exchange cavity and is disposed adjacent to the flow inlet for cooling the cooling fluid flowing out of the microchannel 231. The drive module is disposed in the heat exchange cavity and adjacent to the flow outlet for conveying the cooling fluid cooled by the refrigeration module into the microchannel 231.

[0038] The shell is a sealed structure with a heat exchange cavity inside. A flow inlet and a flow outlet communicating with the heat exchange cavity are respectively opened on the opposite side walls of the shell. The flow inlet is connected to the second connecting pipe 33, and the flow outlet is connected to the first connecting pipe 32.

[0039] The cooling module can be a semiconductor cooler 312 (TEC), which has a cooling surface that contacts the inner wall of the heat exchange cavity, and the cooling module is located near the flow inlet. When the cooling fluid (i.e., high-temperature fluid) flowing out of the microchannel 231 enters the heat exchange cavity through the flow inlet, the cooling surface of the cooling module cools the high-temperature fluid through heat conduction, causing its temperature to drop and transform it into a low-temperature fluid.

[0040] The drive module can be a micro pump, which is installed in the heat exchange chamber and near the flow outlet. It is used to pressurize the cooled cryogenic fluid so that it can overcome the pipeline resistance of the first connecting pipe 32 and be stably delivered to the microchannel 231, thereby maintaining the continuous and efficient operation of the entire closed loop.

[0041] In an optional embodiment, the heat exchange component 31 is an integrated refrigeration circulation pump 311, which integrates the housing, refrigeration module (such as TEC) and drive module (such as micro pump) into one unit. The integrated refrigeration circulation pump 311 has the dual functions of driving and refrigeration.

[0042] Please refer to Figure 2In some embodiments, the display panel 100 further includes a second substrate 40, a main board 50, and a control module 60. The second substrate 40 is disposed on the side of the cathode layer 23 facing away from the light-emitting layer 22. The second substrate 40 is provided with a first clearance through hole 41 and a second clearance through hole 42 corresponding to the flow channel inlet 232 and the flow channel outlet 233, respectively. The main board 50 is disposed on the side of the second substrate 40 facing away from the cathode layer 23. A power consumption detection component is disposed on the main board 50. The control module 60 is electrically connected to the power consumption detection component and the drive module, and is used to control the delivery flow of the drive module according to the signal detected by the power consumption detection component.

[0043] The second substrate 40 can be a glass substrate or a flexible substrate, and is disposed on the side of the cathode layer 23 facing away from the light-emitting layer 22. A first clearance through hole 41 and a second clearance through hole 42 are respectively provided for the flow channel inlet 232 and the flow channel outlet 233. Thus, the cooling fluid can enter the microchannel 231 through the first clearance through hole 41 and the flow channel inlet 232, and can flow out of the microchannel 231 through the flow channel outlet 233 and the second clearance through hole 42.

[0044] In a specific embodiment, the second substrate 40 is provided with a first connection interface at the first clearance through hole 41, and the first connection interface is connected to the first connection pipe 32; the second substrate 40 is provided with a second connection interface at the second clearance through hole 42, and the second connection interface is connected to the second connection pipe 33.

[0045] The main board 50 is disposed on the side of the second substrate 40 facing away from the cathode layer 23. The anode layer 21, the light-emitting layer 22, and the cathode layer 23 are all electrically connected to the main board 50. The main board 50 is provided with a power consumption detection component, which includes at least one of a current sensor, a voltage sensor, and a power sensor, for real-time detection of the operating current, operating voltage, or real-time power of the display panel 100, and outputting the corresponding power consumption signal.

[0046] The control module 60 can be an intelligent control module based on artificial intelligence algorithms (i.e., an AI control module), located on the side of the second substrate 40 facing away from the cathode layer 23, and electrically connected to the power consumption detection component and the drive module. The intelligent control module is configured to execute the following control logic: receive the power consumption signal detected in real time by the power consumption detection component; query the pre-stored power consumption-flow rate mapping table according to the power consumption signal, the power consumption-flow rate mapping table stores the target flow rate corresponding to different power consumption ranges; determine the target flow rate that matches the current power consumption signal based on the query result; generate a flow control command and send it to the drive module to control the drive module to deliver cooling fluid according to the target flow rate, so as to achieve precise temperature control of the display panel 100.

[0047] In this embodiment of the invention, an intelligent control module and a power consumption detection component are added to the display panel 100. Based on the power consumption signal fed back by the power consumption detection component, the delivery flow of the drive module is dynamically adjusted to achieve synergistic optimization of efficient heat dissipation and overall energy-saving control.

[0048] In some embodiments, the control module 60 is integrated on the motherboard 50, simplifying the overall structural design and facilitating the ultra-thin design of the display panel 100. Of course, in other embodiments, the control module 60 and the motherboard 50 can also be designed separately, with the control module 60 independently set up and electrically connected to the motherboard 50. This design facilitates the individual maintenance, upgrade, or replacement of the control module 60.

[0049] Please refer to Figure 3 In some embodiments, the heat exchange assembly 31 includes a thermoelectric cooler 312 and a heat conductor 313. The thermoelectric cooler 312 has a hot end and a cold end, and the heat conductor 313 is disposed at the cold end. The heat conductor 313 has a heat exchange cavity, a flow inlet, and a flow outlet. The flow channel inlet 232 is adjacent to the upper end of the vertically placed display panel 100, and the flow channel outlet 233 is adjacent to the lower end of the vertically placed display panel 100. The thermoelectric cooler 312 is disposed at the upper end of the vertically placed display panel 100.

[0050] The thermoelectric cooler 312 is a thermoelectric cooling device based on the Peltier effect, having a hot end and a cold end positioned opposite each other. The cold end cools, and the hot end dissipates heat, providing precise temperature control, high reliability, and no noise. The cold end faces the display panel 100 to generate a cooling effect. The heat-conducting element 313 is made of a high thermal conductivity material (such as copper or aluminum) and is positioned at the cold end. Specifically, the heat-conducting element 313 can be positioned such that the cold end of the thermoelectric cooler 312 has a through-hole mounting groove, and the heat-conducting element 313 is positioned within the mounting groove, with at least two opposite sides of the heat-conducting element 313 exposed outside the thermoelectric cooler 312. Of course, other reasonable configurations of the heat-conducting element 313 are also possible and are not limited here. The interior of the heat-conducting element 313 forms a heat exchange cavity. On opposite sides of the heat-conducting element 313 are respectively provided a flow inlet and a flow outlet communicating with the heat exchange cavity. The flow outlet is connected to the flow channel inlet 232 via a first connecting pipe 32, and the flow inlet is connected to the flow channel outlet 233 via a second connecting pipe 33.

[0051] When the display panel 100 is in a vertical position, the flow channel inlet 232 is located near the upper end of the display panel 100 (i.e., the left end in the figure), and the flow channel outlet 233 is located near the lower end of the display panel 100 (i.e., the right end in the figure); the semiconductor cooler 312 is located near the upper end of the display panel 100. Optionally, when the display panel 100 is in a vertical position, the flow channel inlet 232 and the flow outlet of the heat-conducting component 313 are at the same height, that is, the flow channel inlet and the flow outlet are flush, and the first connecting pipe 32 extends in the horizontal direction.

[0052] When the display panel 100 is working normally, the heat exchange component 31 operates as follows: First, the semiconductor cooler 312 is powered on, and based on the Peltier effect, the temperature of the cold end drops to a preset temperature. Second, the cold energy at the cold end is conducted to the high-temperature fluid in the heat exchange chamber through the heat conductor 313, causing the temperature of the high-temperature fluid to decrease and form a low-temperature cooling fluid. Due to the decrease in temperature, the density of the low-temperature cooling fluid increases. Since the semiconductor cooler 312 and the flow channel inlet 232 are both located near the upper end of the display panel 100, the low-temperature cooling fluid flows into the microchannel 231 in sequence through the flow outlet, the first connecting pipe 32, and the flow channel inlet 232 under the action of gravity, and flows from top to bottom through the entire microchannel 231 under the action of gravity. In the microchannel 231, the low-temperature cooling fluid exchanges heat with the display panel 100, absorbing the heat generated by the display panel 100, and the temperature rises to form a high-temperature fluid. As the temperature rises, the density of the high-temperature fluid decreases. Under the action of buoyancy, the high-temperature fluid flows back into the heat exchange chamber from bottom to top through the flow channel outlet 233, the second connecting pipe 33, and the flow inlet. Finally, the high-temperature fluid returning to the heat exchange chamber is cooled again by the cold end of the semiconductor cooler 312, forming a continuous natural circulation loop to achieve continuous and efficient heat dissipation for the display panel 100.

[0053] The above design in this embodiment is based on the thermosiphon effect, which eliminates the need for a drive module, saves power consumption, and eliminates noise. It is suitable for noise-sensitive application scenarios, and the structure is relatively simple, resulting in relatively lower manufacturing costs.

[0054] Reference Figure 4In some embodiments, the heat-conducting element 313 is an integrated heat pipe 313a, which is disposed at the cold end of the semiconductor cooler 312. The integrated heat pipe 313a and the cold end of the semiconductor cooler 312 can be connected by welding or other reasonable means. The integrated heat pipe 313a forms a heat exchange cavity inside, and its opposite ends are respectively provided with a flow inlet and a flow outlet. Specifically, the integrated heat pipe 313a includes a main body and two connecting parts respectively disposed on both sides of the main body. The main body adopts a multi-heat pipe integrated design, and its specific structure is not limited. The heat exchange cavity is formed inside the main body. Both connecting parts are connecting pipes. One end of one connecting pipe is connected to one side of the main body and communicates with the heat exchange cavity. The other end of the connecting pipe forms a flow outlet and is connected to the first connecting pipe 32. One end of the other connecting pipe is connected to the other side of the main body and communicates with the heat exchange cavity. The other end of the connecting pipe forms a flow inlet and is connected to the second connecting pipe 33.

[0055] During the cooling process, the high-temperature fluid enters the heat exchange chamber of the integrated heat pipe 313a through the flow inlet, and the resulting low-temperature cooling fluid flows out through the flow outlet. Figure 4 The flow direction indicated by the middle arrow enables an efficient heat exchange process.

[0056] Reference Figure 5 In some embodiments, the heat-conducting element 313 is a heat spreader 313b, which is disposed at the cold end of the semiconductor cooler 312. The heat spreader 313b includes a main plate and two flow pipes. The main plate is a flat sealed cavity structure, which forms a heat exchange cavity inside. One end of one flow pipe is connected to one side of the main plate and communicates with the heat exchange cavity. The other end of the flow pipe forms a flow outlet and is connected to the first connecting pipe 32. One end of the other flow pipe is connected to the other side of the main plate and communicates with the heat exchange cavity. The other end of the flow pipe forms a flow inlet and is connected to the second connecting pipe 33.

[0057] During the cooling process, the high-temperature fluid enters the heat exchange chamber of the heat spreader 313b through the flow inlet, and the resulting low-temperature cooling fluid flows out through the flow outlet. Figure 5 The flow direction indicated by the middle arrow enables an efficient heat exchange process.

[0058] Reference Figure 6 In some embodiments, the microchannel 231 includes a plurality of spaced sub-microchannels 2311, each sub-microchannel 2311 having its two ends connected to a channel inlet 232 and a channel outlet 233, respectively.

[0059] The microchannel 231 adopts a multi-channel parallel design, including spaced sub-microchannels 2311. Each sub-microchannel 2311 is connected to a channel inlet 232 and a channel outlet 233 at both ends, forming a parallel flow path. Specifically, the channel inlet 232 and channel outlet 233 are located at the middle of opposite ends of the cathode layer 23, ensuring uniform distribution and collection of the cooling fluid. Each sub-microchannel 2311 includes a first channel segment, a second channel segment, and a third channel segment connected together. The first and third channel segments are inclined channel segments, and the second channel segment is a straight-flow channel segment. The end of the first channel segment furthest from the second channel segment is connected to the channel inlet 232, and the end of the second channel segment furthest from the third channel segment is connected to the channel outlet 233. The second channel segments of the multiple microchannels 231 are spaced apart and arranged in parallel. This configuration enables the formation of uniformly distributed microchannels 231, achieving efficient and uniform heat exchange of the cooling fluid, so as to efficiently and uniformly remove the heat generated by the display panel 100 during operation.

[0060] Reference Figure 7 In some embodiments, the display panel 100 has a high-temperature region 100a when it is working, and the high-temperature region 100a is located in the non-edge region of the display panel 100; the microchannel 231 also includes a plurality of auxiliary sub-microchannels 2312, which are spaced apart corresponding to the high-temperature region 100a, and both ends of each auxiliary sub-microchannel 2312 are connected to the sub-microchannel 2311 of the corresponding high-temperature region 100a.

[0061] During operation, the display panel 100 generates uneven heat distribution, including at least one high-temperature region 100a. This high-temperature region 100a is located in a non-edge area of ​​the display panel 100, i.e., the central area or a localized area. To specifically enhance the cooling effect of the high-temperature region 100a, the microchannel 231 further includes multiple auxiliary sub-microchannels 2312. These auxiliary sub-microchannels 2312 are spaced apart corresponding to the high-temperature region 100a, and both ends of each auxiliary sub-microchannel 2312 are connected to the corresponding sub-microchannel 2311 of the high-temperature region 100a, thereby forming a locally enhanced cooling network for the high-temperature region 100a. The specific shape of the auxiliary sub-microchannels 2312 is the same as that of the sub-microchannels 2311. The length and number of the auxiliary sub-microchannels 2312 are determined based on the area of ​​the high-temperature region 100a. Optionally, multiple auxiliary sub-microchannels 2312 may cover the entire high-temperature region 100a. This can increase the cooling fluid flow rate and heat exchange area in the high-temperature region 100a, thereby effectively reducing the temperature of the high-temperature region 100a.

[0062] When there are multiple high-temperature areas 100a in the non-edge area of ​​the display panel 100, multiple auxiliary sub-microchannels 2312 connected in parallel with the sub-microchannels 2311 are set at intervals for each high-temperature area 100a to achieve efficient heat dissipation for the multiple high-temperature areas 100a.

[0063] Reference Figure 8 In some embodiments, the display panel 100 has at least two high-temperature regions 100a when it is in operation. The two high-temperature regions 100a are respectively located at two adjacent edge regions of the display panel 100. The flow channel inlet 232 and the flow channel outlet 233 are respectively located at two opposite corners of the cathode layer 23, and the flow channel inlet 232 is located between the two high-temperature regions 100a. The microchannel 231 includes at least two main flow channels 2313, a plurality of primary branch flow channels 2314 and a plurality of secondary branch flow channels 2315. The two main flow channels 2313 are arranged corresponding to the two high-temperature regions 100a, and the two main flow channels are located at opposite corners of the cathode layer 23. One end of each channel 2313 is connected to the channel inlet 232, and the other end extends along two adjacent edge regions respectively; multiple primary branch channels 2314 are distributed at intervals along the length direction of the main channel 2313, each primary branch channel 2314 is connected to the corresponding main channel 2313, and at least one primary branch channel 2314 is connected to the channel outlet 233 at the end away from the main channel 2313; multiple secondary branch channels 2315 are distributed at intervals along the length direction of the primary branch channels 2314, and each secondary branch channel 2315 is connected to the corresponding primary branch channel 2314.

[0064] When the display panel 100 is working, there are at least two high-temperature areas 100a. The two high-temperature areas 100a are located in the high-temperature areas 100a of the display panel 100. Specifically, the two high-temperature areas 100a are a first high-temperature area 100a and a second high-temperature area 100a. The first high-temperature area 100a is located at the left edge of the display panel 100, and the second high-temperature area 100a is located at the lower edge of the display panel 100. Both the first high-temperature area 100a and the second high-temperature area 100a are roughly elongated and extend along the corresponding edge length direction.

[0065] In this embodiment, the flow channel inlet 232 and the flow channel outlet 233 are located at opposite corners of the cathode layer 23, specifically the lower left corner and the upper right corner. The flow channel inlet 232 is located in the transition zone between the first high temperature region 100a and the second high temperature region 100a, which allows the cooling fluid to be preferentially diverted to the two high temperature regions 100a for targeted cooling.

[0066] The microchannels 231 are arranged in a biomimetic leaf-like ribbed pattern, including at least two main channels 2313, multiple primary branch channels 2314, and multiple secondary branch channels 2315. The number of main channels 2313 is the same as the number of high-temperature regions 100a, with one main channel 2313 corresponding to one high-temperature region 100a. When the first high-temperature region 100a and the second high-temperature region 100a are located at the left and lower edges of the display panel 100, respectively, the two main channels 2313 are located at the left and right edges, respectively. One end of each main channel 2313 is connected to the channel inlet 232, and the other end extends along the length of the corresponding edge region, forming a Y-shaped flow distribution structure to ensure that the cooling fluid preferentially flows to the high-temperature region 100a.

[0067] Multiple primary branch channels 2314 are distributed at intervals along the length of the main channel 2313, and each primary branch channel 2314 is connected to its corresponding main channel 2313. Two primary branch channels 2314 extend along the length of two other edge regions, that is, they extend along the length of the upper and lower edge regions respectively, and the ends of these two primary branch channels 2314 furthest from the main channel 2313 are connected to the channel outlet 233, forming edge return channels. The remaining primary branch channels 2314 are all inclined and distributed parallel to each other at intervals. One end of each of the remaining primary branch channels 2314 is connected to its corresponding main channel 2313, and the other end is connected to a primary branch channel 2314 located in the edge region or to the channel outlet 233, forming an obliquely continuous channel network.

[0068] Multiple secondary branch channels 2315 are distributed at intervals along the length of the primary branch channel 2314, and each secondary branch channel 2315 connects to at least one corresponding primary branch channel 2314. Optionally, the two ends of a secondary branch channel 2315 are respectively connected to two adjacent primary branch channels 2314 to form a bridging structure; multiple secondary branch channels 2315 connecting the same primary branch channel 2314 are roughly distributed in a sawtooth shape to enhance the local heat transfer area.

[0069] Among them, the radial dimension of the main flow channel 2313 is larger than the radial dimension of the first-level branch flow channel 2314, and the radial dimension of the first-level branch flow channel 2314 is larger than the radial dimension of the second-level branch flow channel 2315. This size gradient design ensures that the flow rate of cooling fluid is reasonably distributed in each level of the flow channel.

[0070] The above structural design ensures that the cooling fluid flows preferentially to the main channel 2313 of the corresponding high-temperature region 100a, thereby achieving efficient heat dissipation in the high-temperature region 100a.

[0071] The present invention also proposes a method for preparing a display panel 100, which is used to prepare the above-mentioned display panel 100.

[0072] In some embodiments, the method for manufacturing the display panel 100 includes the following steps: (1) Provide a first substrate 10 and a cooling fluid; (2) An anode layer 21, a light-emitting layer 22 and a cathode layer 23 are sequentially fabricated on the first substrate 10; (3) A microchannel 231 with a flow channel inlet and a flow channel outlet is made inside the cathode layer 23, and cooling fluid is introduced into the microchannel 231.

[0073] In step (1), the first substrate 10 can be a glass substrate or a flexible substrate. The materials of the first connecting pipe and the second connecting pipe are not limited. The specific structure of the heat exchange assembly 31 can be referred to the above embodiments, and will not be described in detail here. The cooling fluid includes, but is not limited to, deionized water, ethylene glycol aqueous solution or other cooling media with high thermal conductivity and low viscosity.

[0074] The fabrication steps of the anode layer 21, the light-emitting layer 22 and the cathode layer 23 in step (2) are routine operations, and can be referred to the existing technology for details, which will not be elaborated here.

[0075] Step (3) involves fabricating the microchannel 231 using 3D printing technology, such as laser powder bed fusion (LPBF). The microchannel 231 is fabricated within the cathode layer 23. At opposite ends of the cathode layer 23, inlet 232 and outlet 233 are fabricated to connect the microchannel 231. The specific shape of the microchannel 231 and the positions of the inlet 232 and outlet 233 can be referenced in the above embodiments and will not be repeated here. In step (3), after the microchannel 231 is fabricated, cooling fluid is introduced into the microchannel 231, and air inside the microchannel 231 is expelled to ensure unobstructed flow.

[0076] It should be noted that when there is a high-temperature area 100a when the display panel 100 is working, multiple auxiliary sub-microchannels 2312 or biomimetic leaf veneer-shaped microchannels 231 can be made for the high-temperature area 100a to achieve efficient heat dissipation of the high-temperature area 100a. The specific structure can be referred to the above embodiment, and will not be described in detail here.

[0077] The manufacturing method of the display panel 100 provided by this invention is simple to operate and has a relatively low manufacturing cost. Specifically, a microchannel 231 is provided inside the cathode layer 23. The microchannel 231 contains cooling fluid and has a channel inlet 232 and a channel outlet 233. The cooling fluid flows in from the channel inlet 232, flows through the entire microchannel 231, and flows out from the channel outlet 233, forming a continuous cooling cycle. During the flow of the cooling fluid through the microchannel 231, it can directly and efficiently exchange heat generated by the light-emitting layer 22, rapidly removing heat and effectively reducing the operating temperature of the display panel 100. This heat dissipation method, by directly integrating the microchannel inside the cathode layer 23, achieves rapid heat conduction and dissipation, significantly improving heat dissipation efficiency and meeting the thermal management requirements of high-brightness, high-refresh-rate application scenarios.

[0078] In some embodiments, after step (3), the method further includes: (4) The flow outlet of the heat exchange component 31 is connected to the flow channel inlet 232 through the first connecting pipe 32, and the flow inlet of the heat exchange component 31 is connected to the flow channel outlet 233 through the second connecting pipe 33 to form a closed loop.

[0079] Step (4) involves constructing a closed-loop circuit. Specifically, one end of the first connecting pipe 32 is connected to the flow channel inlet 232, and the other end is connected to the flow outlet of the heat exchange component 31; one end of the second connecting pipe 33 is connected to the flow channel outlet 233, and the other end is connected to the flow inlet of the heat exchange component 31, thus forming a closed-loop circuit. After constructing the closed-loop circuit, the heat exchange component 31 is started, and the sealing performance of the closed-loop circuit is checked to ensure that the cooling fluid circulates stably within the closed-loop circuit.

[0080] This embodiment integrates microchannels 231 into the cathode layer 23 and forms a closed loop for cooling fluid circulation with the heat exchange component 31, the first connecting pipe 32 and the second connecting pipe 33. This upgrades the traditional passive heat dissipation method to an active internal circulation heat dissipation method, which can directly and efficiently exchange the heat generated by the light-emitting layer 22, significantly improving heat dissipation efficiency and meeting the thermal management requirements of high brightness and high refresh rate application scenarios.

[0081] In some embodiments, the heat exchange component 31 is configured to cool the cooling fluid flowing out of the microchannel 231 and to transport the cooled cooling fluid into the microchannel 231. That is, the heat exchange component 31 includes a refrigeration module and a drive module. Its specific structure is as described in the above embodiments and will not be repeated here. Optionally, the heat exchange component 31 is an integrated refrigeration circulation pump 311.

[0082] After step (3) of fabricating the microchannel 231, the following steps are also included: (31) A second substrate 40 is provided on the cathode layer 23, and a first clearance through hole 41 and a second clearance through hole 42 are respectively opened on the second substrate 40 at the positions corresponding to the flow channel inlet 232 and the flow channel outlet 233. (32) A main board 50 and a control module 60 are provided on the side of the second substrate 40 facing away from the cathode layer 23. A power consumption detection component is provided on the main board 50, and the control module 60 is electrically connected to the power consumption detection component and the heat exchange component 31.

[0083] In step (31), the second substrate 40 can be a glass substrate or a flexible substrate. The second substrate 40 is disposed on the cathode layer 23, and a first clearance through hole 41 and a second clearance through hole 42 are respectively opened at the positions of the flow channel inlet 232 and the flow channel outlet 233.

[0084] Furthermore, to facilitate the connection operation, a first connection interface is provided on the second substrate 40 at the first clearance through hole 41, and a second connection interface is provided on the second substrate 40 at the second clearance through hole 42. Accordingly, in step (4), the first connection pipe 32 is connected to the first connection interface, and the second connection pipe 33 is connected to the second connection interface.

[0085] In step (32), the power consumption detection component includes at least one of a current sensor, a voltage sensor, and a power sensor, used to detect the operating current, operating voltage, or real-time power of the display panel 100 in real time, and output the corresponding power consumption signal. The control module 60 can be an intelligent control module based on artificial intelligence algorithms (i.e., an AI control module), which is electrically connected to the power consumption detection component and the drive module of the heat exchange component 31. The control logic of the control module 60 refers to the above embodiment, and will not be described in detail here.

[0086] In this embodiment, a control module 60 and a power consumption detection component are added. The power consumption signal fed back by the power consumption detection component can be used to dynamically adjust the transmission flow of the drive module, thereby achieving synergistic optimization of efficient heat dissipation and overall energy-saving control.

[0087] The present invention also proposes a display device 1000, which includes a back shell 200 and a display panel 100. The specific structure of the display panel 100 is as described in the above embodiments. Since the display device 1000 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0088] The back cover 200 is connected to the edge of the display panel 100, and the connection method can be adhesive bonding, snap-fit, threaded connection, or other reasonable connection methods, which are not limited here. The back cover 200 and the second substrate 40 of the display panel 100 enclose a cavity, and the first connecting pipe 32, the second connecting pipe 33, the heat exchange assembly 31, and the control module 60 are all fixed within the cavity, and the fixing method is not limited here. This allows for a compact overall structural design.

[0089] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A display panel, characterized by, The device includes a first substrate, an anode layer, a light-emitting layer, and a cathode layer sequentially stacked on the first substrate, wherein the cathode layer has microchannels inside and the microchannels contain cooling fluid. The microchannel has an inlet for the cooling fluid to flow into and an outlet for the cooling fluid to flow out.

2. The display panel of claim 1, wherein, The display panel further includes a heat exchange assembly, which has a heat exchange cavity, a flow inlet and a flow outlet connected to the heat exchange cavity. The flow outlet is connected to the flow channel inlet through a first connecting pipe, and the flow inlet is connected to the flow channel outlet through a second connecting pipe to form a closed loop, so that the cooling fluid circulates in the closed loop.

3. The display panel of claim 2, wherein, The heat exchange assembly includes: The housing has the heat exchange cavity, the flow inlet, and the flow outlet. A refrigeration module has a refrigeration surface that contacts the inner wall of the heat exchange cavity and is located adjacent to the flow inlet for cooling the cooling fluid flowing out of the microchannel; and A drive module is disposed within the heat exchange cavity and adjacent to the flow outlet, for conveying the cooling fluid cooled by the refrigeration module to the microchannel.

4. The display panel of claim 3, wherein, The display panel also includes: The second substrate is disposed on the side of the cathode layer facing away from the light-emitting layer. The second substrate is provided with a first clearance through hole and a second clearance through hole corresponding to the flow channel inlet and the flow channel outlet, respectively. A motherboard is disposed on the side of the second substrate facing away from the cathode layer, and a power consumption detection component is disposed on the motherboard; and The control module is electrically connected to the power consumption detection component and the drive module, and is used to control the delivery flow of the drive module according to the signal detected by the power consumption detection component.

5. The display panel of claim 2, wherein, The heat exchange assembly includes a semiconductor cooler and a heat-conducting element. The semiconductor cooler has a hot end and a cold end, and the heat-conducting element is disposed at the cold end. The heat-conducting element has the heat exchange cavity, the flow inlet, and the flow outlet. The flow channel inlet is located near the upper end of the vertically placed display panel, the flow channel outlet is located near the lower end of the vertically placed display panel, and the semiconductor cooler is located near the upper end of the vertically placed display panel.

6. The display panel of any one of claims 1 to 5, wherein, The microchannel includes multiple spaced sub-microchannels, and each sub-microchannel is connected to the channel inlet and the channel outlet at both ends, respectively. The display panel has a high-temperature area when it is working, and the high-temperature area is located in the non-edge area of ​​the display panel. The microchannel also includes multiple auxiliary sub-microchannels, which are spaced apart to correspond to the high-temperature region, and both ends of each auxiliary sub-microchannel are connected to the sub-microchannel corresponding to the high-temperature region.

7. The display panel of any one of claims 1 to 5, wherein, The display panel has at least two high-temperature areas when it is in operation. The two high-temperature areas are respectively located on two adjacent edge areas of the display panel. The flow channel inlet and the flow channel outlet are respectively located at two opposite corners of the cathode layer, and the flow channel inlet is located between the two high-temperature areas. The microchannels include: At least two main channels are provided, each corresponding to one of the two high-temperature regions, and one end of each of the two main channels is connected to the channel inlet, while the other end extends along the length of the two adjacent edge regions. Multiple primary branch channels are distributed at intervals along the length of the main channel. Each primary branch channel is connected to the corresponding main channel, and at least one of the primary branch channels is connected to the channel outlet at the end away from the main channel. Multiple secondary branch channels are distributed at intervals along the length of the primary branch channel, and each secondary branch channel is connected to the corresponding primary branch channel.

8. A method for manufacturing a display panel, characterized by, Includes the following steps: Provide a first substrate and cooling fluid; An anode layer, a light-emitting layer, and a cathode layer are sequentially fabricated on the first substrate; Microchannels with inlets and outlets are fabricated inside the cathode layer, and cooling fluid is introduced into the microchannels.

9. The method of producing a display panel according to claim 8, wherein After the step of fabricating microchannels with flow inlets and flow outlets inside the cathode layer and introducing cooling fluid into the microchannels, the method further includes: The flow outlet of the heat exchange component is connected to the flow channel inlet via a first connecting pipe, and the flow inlet of the heat exchange component is connected to the flow channel outlet via a second connecting pipe to form a closed loop.

10. A display device, characterized by comprising: It includes a display panel as described in any one of claims 1 to 7, or a display panel prepared using the method for preparing a display panel as described in any one of claims 8 to 9.

Images