Display device

Abstract

This disclosure provides a display device. An embodiment of the display device according to this disclosure may include: a substrate having a display area and a non-display area surrounding the display area, wherein a plurality of pixels having a plurality of sub-pixels are arranged in the display area; and an organic light-emitting layer disposed on the substrate, wherein each of the plurality of sub-pixels has an organic light-emitting layer, the organic light-emitting layer being arranged to extend from the display area to an end of the substrate, the substrate including an undercut portion in which the organic light-emitting layer is interrupted, and the undercut portion being arranged in the non-display area to surround the display area.

Description

Technical Field

[0001] This disclosure relates to a device, and more specifically, to, for example, but not limited to, a display device. Background Technology

[0002] Unlike liquid crystal displays, organic light-emitting displays (OLEDs) have high response speed and low power consumption, and they emit light themselves without the need for a separate light source, thus eliminating viewing angle issues. Therefore, OLEDs have attracted attention as the next generation of flat panel displays.

[0003] Such a display device displays images by emitting light from a light-emitting layer inserted between pixel electrodes and opposite electrodes.

[0004] Furthermore, because display devices have different applications and uses, they are manufactured in various sizes. To manufacture display devices of various sizes, masks of various sizes are typically used to form the light-emitting layer.

[0005] The descriptions provided in the Background section should not be assumed to be prior art simply because they are mentioned in or associated with that section. The Background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0006] The inventors of this disclosure have recognized that in order to manufacture display devices of various sizes, masks (or EL masks) of various sizes are required, which leads to problems of high manufacturing costs and increased production energy.

[0007] One aspect of this disclosure relates to providing a display device whose manufacturing cost can be reduced even when manufactured in various sizes.

[0008] Furthermore, one aspect of this disclosure relates to providing a display device whose production energy can be reduced.

[0009] Furthermore, one aspect of this disclosure relates to providing a display device in which moisture penetration can be reduced or prevented even when manufactured in various sizes.

[0010] Furthermore, one aspect of this disclosure relates to providing a display device in which dark spot defects in a display area can be improved or prevented.

[0011] Furthermore, one aspect of this disclosure relates to providing a display device in which cathode contact failures in a public power shorting bar can be reduced or prevented.

[0012] The problems to be solved by the examples in this disclosure are not limited to those described above, and other problems not mentioned will be apparent to those skilled in the art to which the technical ideas of this disclosure belong, as described below.

[0013] A display device according to an embodiment of the present disclosure includes: a substrate having a display area and a non-display area surrounding the display area, wherein a plurality of pixels having a plurality of sub-pixels are arranged in the display area; and an organic light-emitting layer disposed on the substrate, wherein each of the plurality of sub-pixels has an organic light-emitting layer, the organic light-emitting layer being arranged to extend from the display area to an end of the substrate, the substrate including an undercut portion in which the organic light-emitting layer is interrupted, and the undercut portion being arranged in the non-display area to surround the display area.

[0014] Other systems, methods, features, and advantages will be apparent or become apparent to those skilled in the art upon reading the following drawings and detailed description. It is intended that all such additional systems, methods, features, and advantages are included in this specification, fall within the scope of this disclosure, and are protected by the appended claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages will be discussed below in conjunction with embodiments of this disclosure. Attached Figure Description

[0015] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and form a part of this application. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0016] Figure 1 This is a schematic plan view of a display device according to one embodiment of the present disclosure.

[0017] Figure 2 It is along Figure 1 A schematic cross-sectional view of line I-I' shown.

[0018] Figure 3 This is a schematic plan view showing the undercut formation region and the cathode formation region in the substrate of a display device according to one embodiment of the present disclosure.

[0019] Figure 4 It is along Figure 3 The schematic cross-sectional view of line Ⅱ-Ⅱ' shown.

[0020] Figure 5 It is along Figure 3 A schematic cross-sectional view of line Ⅲ-Ⅲ' shown in the figure.

[0021] Figure 6 It is along Figure 3A schematic cross-sectional view of line IV-IV' shown.

[0022] Figure 7 It is along Figure 3 A schematic cross-sectional view of line V-V' shown in the figure.

[0023] Throughout the accompanying drawings and detailed embodiments, unless otherwise stated, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, the relative dimensions and depictions of these elements may be exaggerated. Detailed Implementation

[0024] Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Where possible, the same reference numerals will be used throughout the drawings to denote the same or similar parts. In the following description, detailed descriptions of well-known functions will be omitted or provided briefly where such detail would unnecessarily obscure the gist of the inventive concept. The progression of the described processing steps and / or operations is exemplary; however, the order of steps and / or operations is not limited to the order set forth herein and can be varied as is known in the art, except where the steps and / or operations must occur in a particular order. The same reference numerals always denote the same elements. The names of the various elements used in the following description are chosen solely for ease of writing and may therefore differ from the names used in actual products.

[0025] The advantages and features of this disclosure and its implementation methods will be illustrated by the following embodiments described with reference to the accompanying drawings.

[0026] However, this disclosure may be embodied in different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments may be provided to make this disclosure thorough and complete enough to assist those skilled in the art in fully understanding its scope. Furthermore, this disclosure is limited only by the scope of the claims.

[0027] The shapes, dimensions, ratios, angles, and quantities disclosed in the accompanying drawings to describe embodiments of this disclosure are merely examples. Therefore, this disclosure is not limited to the details shown.

[0028] The same reference numerals always refer to the same elements. In the following description, a detailed description of a relevant known function or configuration may be omitted when it is determined that such a description would unnecessarily obscure the focus of this disclosure.

[0029] In the use of “comprising,” “having,” and “including” as described in this disclosure, an additional part may be added unless “only” is used. Unless otherwise stated, singular terms may include plural forms.

[0030] Any implementation described as an "example" in this document is not necessarily to be interpreted as preferred or advantageous over other implementations.

[0031] When interpreting a component, even if not explicitly described, the component is interpreted as including a range of error.

[0032] Furthermore, when referring to any size, relative size, etc., it should be assumed that even without a specific description, the numerical value or corresponding information (e.g., grade, range, etc.) of an element or feature includes the tolerance or error range that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.). In addition, the term "may" fully encompasses all the meanings of the term "can".

[0033] When describing positional relationships, for example, when the positional relationship between two parts is described as such as "above," "over," "below," and "beside," one or more other parts may be located between the two parts, unless words such as "exactly" or "directly" are used. For example, when one element or layer is placed "on" another element or layer, a third element or layer may be inserted in between.

[0034] When describing temporal relationships, such as when time sequence is described as "after", "following", "next", and "before", discontinuous cases can be included unless "exactly" or "directly" is used.

[0035] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0036] The “X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted solely by their geometric relationship of being perpendicular to each other, and the elements of this disclosure can have a wider range of orientations within the scope of their functional effectiveness.

[0037] The term "at least one" should be understood to include any and all combinations of one or more associated listed items. For example, "at least one of the first, second, and third items" means a combination of two or more items from the first, second, and third items, as well as all items derived from the first, second, or third item.

[0038] In describing the elements of this disclosure, terms such as “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used. These terms may be used only to distinguish one element from another, and the nature, sequence, order, or number of the corresponding elements should not be limited by these terms. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0039] Furthermore, when an element or layer is “connected,” “joined,” or “adhered” to another element or layer, unless otherwise specified, this means that the element or layer can not only be directly connected or adhered to the other element or layer, but also indirectly connected or adhered to the other element or layer by means of one or more intermediate elements or layers “set” or “inserted” between these elements or layers. It should be understood that this means the elements can be configured to be in direct contact with each other, or they can be configured not to be in direct contact with each other.

[0040] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent, for example, with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein. For example, the terms “part” or “unit” may be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the described functions, as would be understood by one of ordinary skill in the art.

[0041] Features of the various embodiments of this disclosure may be partially or entirely linked or combined with each other, and may operate differently from each other and be technically driven, as will be fully understood by those skilled in the art. Embodiments of this disclosure may be implemented independently of each other or may be implemented together in an interdependent relationship.

[0042] It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of this disclosure without departing from the technical spirit or scope thereof. Therefore, this disclosure is intended to cover modifications and variations thereof, provided they fall within the scope of the appended claims and their equivalents.

[0043] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0044] Figure 1 This is a schematic plan view of a display device according to one embodiment of the present disclosure. Figure 2 It is along Figure 1A schematic cross-sectional view of line I-I' shown, and Figure 3 This is a schematic plan view showing the undercut formation region and the cathode formation region in the substrate of a display device according to one embodiment of the present disclosure.

[0045] In the following text, the first direction (Y-axis direction) refers to... Figure 1 The vertical direction, the second direction (X-axis direction) represents the direction based on Figure 1 The horizontal direction represents the thickness direction of the display device 100, and the third direction (Z-axis direction) represents the thickness direction of the display device 100. For example, the first direction (Y-axis direction) may be parallel to the data wiring (not shown), and the second direction (X-axis direction) may be parallel to the gate wiring (not shown).

[0046] Reference Figure 1 According to one embodiment of the present disclosure, a display device 100 may include a display panel having a gating driver GD. The display panel may include a substrate 110 bonded to each other and an opposing substrate 200 (e.g., ...). Figure 2 (As shown).

[0047] According to one example, the substrate 110 may include a display area DA and a non-display area NDA, wherein a plurality of pixels P having a plurality of sub-pixels SP are arranged in the display area DA, and the non-display area NDA surrounds the display area DA.

[0048] According to one embodiment of the present disclosure, the display device 100 may further include an organic light-emitting layer 116 disposed on the substrate 110 and on each of the plurality of sub-pixels SP. The organic light-emitting layer 116 may be arranged to extend from the display area DA to the end of the substrate 110.

[0049] For example, such as Figure 1 As shown, the organic light-emitting layer 116 can be arranged as an end 110a (or first end 110a) extending from the display area DA to the substrate 110 in the first non-display area NDA1 of the non-display area NDA. Additionally, the organic light-emitting layer 116 can be arranged as an end 110b (or second end 110b) extending from the display area DA to the substrate 110 in the second non-display area NDA2 of the non-display area NDA. Furthermore, the organic light-emitting layer 116 can be arranged as an end 110c (or third end 110c) extending from the display area DA to the substrate 110 in the third non-display area NDA3 of the non-display area NDA. Moreover, the organic light-emitting layer 116 can be arranged as an end 110d (or fourth end 110d) extending from the display area DA to the substrate 110 in the fourth non-display area NDA4 of the non-display area NDA. Therefore, the organic light-emitting layer 116 can be arranged in both the display area DA and the non-display area NDA.

[0050] Therefore, a display device 100 according to one embodiment of the present disclosure may have a structural feature in which an organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110.

[0051] In the case of general-purpose display devices, various sizes of masks (or EL masks) are required because various sizes of masks (or EL masks) are typically used to form the light-emitting layer to manufacture display devices of various sizes. Consequently, general-purpose display devices are limited by high manufacturing costs and increased production capacity.

[0052] However, since the display device 100 according to one embodiment of the present disclosure is configured such that the organic light-emitting layer 116 extends from the display area DA to the end of the substrate 110, masks (or EL masks) of various sizes are not required, thereby reducing manufacturing costs even if it is manufactured in various sizes.

[0053] Furthermore, as mentioned above, in the case of general-purpose display devices, masks (or EL masks) of various sizes are typically used to form the light-emitting layer. In general-purpose display devices, the mask (or the opening of the mask) is set to be smaller than the size of the substrate so that the light-emitting layer is not placed at the end of the substrate. When the light-emitting layer is placed at the end of the substrate, the light-emitting layer is exposed to the outside at the end of the substrate, which may lead to defects due to moisture and oxygen penetration (or permeation). Therefore, in the case of general-purpose display devices, a mask (or EL mask) for forming the light-emitting layer is necessary, and the size of the mask (or the opening of the mask) is set to be smaller than the size of the substrate.

[0054] In contrast, a display device 100 according to one embodiment of the present disclosure may be provided such that the substrate 110 includes an undercut portion UCP. According to one example, the undercut portion UCP is used to disconnect the organic light-emitting layer 116. Figure 1 As shown, the undercut portion UCP can be arranged in the non-display area NDA to surround the display area DA. The undercut portion UCP may include a first undercut UC1, a second undercut UC2, a third undercut UC3, and a fourth undercut UC4.

[0055] Therefore, in a display device 100 according to one embodiment of the present disclosure, the undercut portion UCP is arranged around the display area DA, such that even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110, the undercut portion UCP can reduce or prevent moisture and oxygen penetration (or permeation) through the organic light-emitting layer 116. In other words, in a display device 100 according to one embodiment of the present disclosure, moisture penetration can be reduced or prevented by arranging an undercut portion UCP in which the organic light-emitting layer 116 is interrupted around the display area DA. Therefore, since the display device 100 according to one embodiment of the present disclosure does not require a mask (or EL mask) for forming the organic light-emitting layer 116, manufacturing costs can be reduced even when manufactured in various sizes.

[0056] Furthermore, since the display device 100 according to one embodiment of this disclosure can be manufactured in various sizes without the use of masks (or EL masks) of various sizes, the process can be optimized compared to general display devices manufactured using masks (or EL masks) of various sizes, thereby reducing production energy.

[0057] Reference Figure 1 According to one embodiment of the present disclosure, the display device 100 may include a source driver integrated circuit (hereinafter referred to as "IC") 120, a flexible film 130, a circuit board 140, and a timing control section 150.

[0058] The substrate 110 may include thin-film transistors and may be a transistor array substrate, a lower substrate, a base substrate, or a first substrate. The substrate 110 may be a transparent glass substrate or a transparent plastic substrate.

[0059] The opposing substrate 200 can be bonded to the substrate 110 via an adhesive member. For example, the opposing substrate 200 has a smaller size than the substrate 110 and can be bonded to the remaining portion of the substrate 110 except for the pad portion PA. The opposing substrate 200 can be an upper substrate, a second substrate, or a package substrate.

[0060] The gating driver GD provides a gating signal to the gating line according to the gating control signal input from the timing control section 150. When the source driver IC 120 is manufactured as a driver chip, the source driver IC 120 can be packaged in a flexible film 130 using the chip-on-film (COF) method or the chip-on-plastic (COP) method.

[0061] Pads, such as data pads, can be formed in the non-display areas of the display panel. Lines connecting the pads to the source driver IC 120 and lines connecting the pads to the circuit board 140 can be formed in the flexible film 130. The flexible film 130 can be attached to the pads using an anisotropic conductive film, thereby allowing the pads to be connected to the lines of the flexible film 130.

[0062] Reference Figure 1 According to one example, substrate 110 may include a display area DA and a non-display area NDA.

[0063] The display area DA is the area where an image is displayed, and it can be a pixel array area, an active area, a pixel array unit, a display unit, or a screen. For example, the display area DA can be located in the central part of the display panel.

[0064] A display area DA, as shown in an example, may include gating wiring, data wiring, pixel power wiring, and multiple pixels P. Each pixel P may include multiple subpixels SP, which can be defined by the gating wiring and data wiring. Each subpixel SP can be defined as the smallest unit area that actually emits light.

[0065] According to one example, at least four sub-pixels SP arranged adjacent to each other and configured to emit light of different colors constitute a unit pixel P. A unit pixel may include, but is not limited to, red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels.

[0066] Each of the multiple sub-pixels SP may include a thin-film transistor and an organic light-emitting element connected to the thin-film transistor. The sub-pixel may include an organic light-emitting layer (or light-emitting layer) interposed between a first electrode and a second electrode.

[0067] The organic light-emitting layers in each of the multiple sub-pixels SP can individually emit different colors of light or collectively emit white light. For example, when the organic light-emitting layers of each of the multiple sub-pixels SP collectively emit white light, each of the red, green, and blue sub-pixels may include a color filter CF (or wavelength conversion component CF) that converts white light into different colors of light. In this case, the white sub-pixel, according to one example, may not have a color filter. The color filter CF, according to one example, may include a red color filter, a green color filter, and a blue color filter.

[0068] In a display device 100 according to one embodiment of the present disclosure, the area provided with a red color filter may be a red sub-pixel SP1, the area provided with a green color filter may be a green sub-pixel SP3, the area provided with a blue color filter may be a blue sub-pixel SP4, and the area without a color filter may be a white sub-pixel SP2. In this disclosure, red sub-pixel SP1 may represent a first sub-pixel configured to emit red light, green sub-pixel SP3 may represent a third sub-pixel configured to emit green light, blue sub-pixel SP4 may represent a fourth sub-pixel configured to emit blue light, and white sub-pixel SP2 may represent a second sub-pixel configured to emit white light.

[0069] When a gating signal is input from the gating line using a thin-film transistor, each sub-pixel SP in the sub-pixel SP supplies a predetermined current to the organic light-emitting element according to the data voltage of the data wiring. Therefore, the light-emitting layer of each sub-pixel can emit light with a predetermined brightness according to the predetermined current.

[0070] like Figure 2 As shown, the display area DA can include a light-emitting area EA and a non-light-emitting area NEA. The light-emitting area EA is the area where light is emitted by the organic light-emitting element layer E. The non-light-emitting area NEA is the area that does not transmit most of the light incident from the outside.

[0071] For example, the non-emitting region NEA can be a region that does not include the emitting region EA. In one example, the non-emitting region NEA may include a circuit region CA. Additionally, within the non-emitting region NEA, multiple pixels P and multiple lines for driving each of the multiple pixels P can be provided. According to one example, the multiple lines may include multiple first signal lines and multiple second signal lines.

[0072] Multiple first signal lines may extend in a second direction (X-axis direction). Each of the multiple first signal lines may include at least one gating line (or scan line). According to an example, the gating line may be electrically connected to the gating driver GD.

[0073] Multiple second signal lines may extend in a first direction (Y-axis direction). These multiple second signal lines may intersect with multiple first signal lines. Each of the multiple second signal lines may include a pixel power line, multiple data lines, and a reference line. The multiple data lines may include a first data line for driving a first sub-pixel SP1, a second data line for driving a second sub-pixel SP2, a third data line for driving a third sub-pixel SP3, and a fourth data line for driving a fourth sub-pixel SP4.

[0074] Return to reference Figure 1A non-display area NDA is an area on which no image is displayed, and can be a peripheral circuit area, a signal supply area, a passive area, or a border area. The non-display area NDA can be configured to be near the display area DA. That is, the non-display area NDA can be configured to surround the display area DA. In other words, the non-display area NDA can be arranged to surround the display area DA. According to one example, the non-display area NDA may include a first non-display area NDA1, a second non-display area NDA2, a third non-display area NDA3, and a fourth non-display area NDA4.

[0075] A display device 100 according to one embodiment of the present disclosure may include a pad portion PA disposed in a non-display area NDA. The pad portion PA can be used to drive a plurality of pixels P. For example, the pad portion PA can supply power and / or signals to a plurality of pixels P disposed in the display area DA to output an image. According to one example, based on Figure 1 The pad portion PA can be placed in the first non-display area NDA1 below the display area DA. For example... Figure 1 As shown, the first non-display area NDA1 can be adjacent to the first side DAL1 of the display area DA. The first side DAL1 of the display area DA can be the side of the display area DA parallel to the second direction (X-axis direction). A first undercut UC1 including the undercut portion UCP can be formed in the first non-display area NDA1.

[0076] The gating driver GD provides gating signals to the gating lines based on the gating control signal input from the timing control section 150. In such cases... Figure 1 In the panel GIP method shown, the gating driver GD can be formed on one side of the display area DA of the display panel or on the non-display area NDA outside the two sides of the display area DA.

[0077] Multiple gating drivers GD can be respectively positioned on the left side (i.e., the second non-display area) and the right side (i.e., the third non-display area) of the display area DA. According to one example, the multiple gating drivers GD can be connected to multiple pixels P and multiple first signal lines for supplying signals to the multiple pixels P. The multiple first signal lines may include at least one signal line for supplying signals for driving the pixels P.

[0078] Furthermore, the second non-display area NDA2 can be connected to the first non-display area NDA1. Additionally, the third non-display area NDA3 can also be connected to the first non-display area NDA1, and the fourth non-display area NDA4 can be connected to the first non-display area NDA1 via the second non-display area NDA2 and the third non-display area NDA3. Therefore, the first to fourth non-display areas NDA1, NDA2, NDA3, and NDA4 can be provided to surround the display area DA.

[0079] like Figure 1 As shown, the second non-display area NDA2 can be adjacent to the second side DAL2 of the display area DA. The second side DAL2 of the display area DA can be the side of the display area DA parallel to the first direction (Y-axis direction). A second undercut UC2, including the undercut portion UCP, can be formed in the second non-display area NDA2.

[0080] The third non-display area NDA3 can be configured to be spaced apart from the second non-display area NDA2, with a display area DA between the third non-display area NDA3 and the second non-display area NDA2. A third undercut UC3, including an undercut portion UCP, can be formed in the third non-display area NDA3.

[0081] Multiple second signal lines may extend in a first direction (Y-axis direction). These multiple second signal lines may include pixel power lines and at least one data line to supply data voltage to pixel P. Each of the multiple second signal lines may be connected to at least one of multiple pads, pixel power jumpers, and common power jumpers (EVSB). The pixel power jumpers and common power jumpers (EVSB) may be arranged in a fourth non-display area NDA4, based on the display area DA facing the pad portion PA. According to one example, the fourth non-display area NDA4 may be configured to be spaced apart from a first non-display area NDA1, with the display area DA between the fourth non-display area NDA4 and the first non-display area NDA1. A fourth undercut UC4, including an undercut portion UCP, may be formed in the fourth non-display area NDA4.

[0082] like Figure 1 As shown, the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4 can all be connected. Therefore, the display device 100 according to one embodiment of the present disclosure can reduce or prevent moisture penetration through the organic light-emitting layer 116 by arranging the first to fourth undercut UC1, UC2, UC3, and UC4 in the non-display area NDA to surround the display area DA, thereby achieving improved reliability.

[0083] Pixel P is configured to overlap with at least one of a first signal line or a second signal line, and emits predetermined light to display an image. The luminous area EA may correspond to the luminous area within pixel P.

[0084] Reference Figure 2 The non-emitting area (NEA) can refer to the area set in the display area (DA) that does not emit light, and can be expressed as a dead zone because it does not emit light. According to one example, a dead zone can be an area in which a black matrix and / or embankment is provided, but is not limited to this, and can refer to an area in which no light is emitted.

[0085] In the following text, refer to Figure 2 and Figure 3 The structure of each sub-pixel SP in the multiple sub-pixel SPs will be described in detail.

[0086] A display device 100 according to one embodiment of the present disclosure may include a buffer layer BL, a plurality of inorganic films 111, a thin-film transistor 112, a color filter CF, a planarization layer 113, a pixel electrode 114, a diaphragm 115, an organic light-emitting layer 116, a first cathode electrode 117, and a second cathode electrode 117'. Figure 3 As shown in the diagram), the encapsulation layer 118 and the filling layer 119.

[0087] Each sub-pixel in a sub-pixel SP according to one embodiment may include a plurality of inorganic films 111 disposed on the upper surface of a buffer layer BL, including a gate insulating layer 111a, an interlayer insulating layer 111b, a first passivation layer 111c, and a second passivation layer 111d.

[0088] Furthermore, each sub-pixel in the sub-pixel SP may include a color filter CF disposed on a plurality of inorganic films 111 and a planarization layer 113 disposed on the color filter CF. A pixel electrode 114 may be disposed on the planarization layer 113.

[0089] Each sub-pixel in the sub-pixel SP may further include a dam 115 covering one edge of the pixel electrode 114, an organic light-emitting layer 116 on the pixel electrode 114 and the dam 115, and a first cathode electrode 117 on the organic light-emitting layer 116. An encapsulation layer 118 may be placed on the first cathode electrode 117, and a fill layer 119 may be placed on the encapsulation layer 118.

[0090] Multiple inorganic films 111 can be disposed between the substrate 110 and the organic light-emitting layer 116. Thin-film transistors 112 for driving sub-pixels SP can be arranged on the multiple inorganic films 111. The multiple inorganic films 111 can also be expressed using the term circuit element layer.

[0091] The buffer layer BL may be included in a plurality of inorganic films 111 together with the gate insulating layer 111a, the interlayer insulating layer 111b, the first passivation layer 111c, and the second passivation layer 111d. The pixel electrode 114, the organic light-emitting layer 116, and the cathode electrode 117 may be included in the light-emitting element layer E.

[0092] A buffer layer BL may be formed between the substrate 110 and the gate insulating layer 111a to protect the thin-film transistor 112. The buffer layer BL may be disposed on the entire surface (or front surface) of the substrate 110. The buffer layer BL may be used to prevent material contained in the substrate 110 from diffusing into the transistor layer during the high-temperature process of manufacturing the thin-film transistor 112.

[0093] According to one example, a thin-film transistor 112 (or driving transistor) may include an active layer 112a, a gate electrode 112b, a source electrode 112c, and a drain electrode 112d.

[0094] The active layer 112a may include a channel region, a drain region, and a source region in the thin-film transistor region of the circuit region CA of the sub-pixel SP. The drain region and the source region may be spaced apart from each other, with the channel region interposed therebetween.

[0095] The active layer 112a can be formed from a semiconductor material based on any one of amorphous silicon, polycrystalline silicon, oxide and organic materials.

[0096] The gate insulating layer 111a may be formed on the channel region of the active layer 112a. As an example, the gate insulating layer 111a may be formed in an island shape only on the channel region of the active layer 112a, or it may be formed on the entire front surface of the substrate 110 or the buffer layer BL that includes the active layer 112a.

[0097] The gate electrode 112b can be formed on the gate insulating layer 111a to overlap with the channel region of the active layer 112a.

[0098] The interlayer insulating layer 111b can be formed to partially overlap with the gate electrode 112b and the drain and source regions of the active layer 112a. For example, in... Figure 3 In this process, the interlayer insulating layer 111b can be formed over the entire light-emitting area of ​​the circuit region CA and the sub-pixel SP.

[0099] The source electrode 112c can be electrically connected to the source region of the active layer 112a through a source contact hole disposed in an interlayer insulating layer overlapping the source region of the active layer 112a.

[0100] The drain electrode 112d can be electrically connected to the drain region of the active layer 112a through a drain contact hole provided in the interlayer insulating layer that overlaps with the drain region of the active layer 112a.

[0101] The drain electrode 112d and the source electrode 112c can be made of the same or substantially the same metallic material. For example, each of the drain electrode 112d and the source electrode 112c can be made of a single metal layer, a single alloy layer, or a multilayer of two or more layers, and the material may be the same as or different from that of the gate electrode 112b.

[0102] Additionally, the thin-film transistors disposed in the pixel region may have a threshold voltage that is shifted by light. To reduce or prevent this, the display panel or substrate 110 may further include a light-shielding layer (not shown) disposed below the active layer 112a of at least one of the thin-film transistors 112, the first switching thin-film transistor, and the second switching thin-film transistor. The light-shielding layer is disposed between the substrate 110 and the active layer 112a to block light from passing through the substrate 110 and incident on the active layer 112a, thereby reducing or minimizing the threshold voltage change of the transistor caused by external light. Furthermore, the light-shielding layer may be disposed between the substrate 110 and the active layer 112a to reduce or prevent the thin-film transistors from being visible to the user.

[0103] The first passivation layer 111c can be disposed on the substrate 110 to cover the pixel area. The first passivation layer 111c covers the drain electrode 112d, source electrode 112c, and gate electrode 112b of the thin film transistor 112, as well as the buffer layer BL.

[0104] The second passivation layer 111d can be disposed on the substrate 110 to cover the first passivation layer 111c. The second passivation layer 111d can be partially disposed between the first passivation layer 111c and the color filter CF.

[0105] A color filter CF can be placed on the second passivation layer 111d. For example, the color filter CF can be placed between multiple inorganic films 111 and planarization layer 113. The color filter CF may include a red color filter arranged in the red sub-pixel SP1, a green color filter arranged in the green sub-pixel SP3, and a blue color filter arranged in the blue sub-pixel SP4. Since the white sub-pixel SP2 is set to emit white light, it may not include a color filter.

[0106] A planarization layer 113 can be disposed on the substrate 110 to cover the second passivation layer 111d and the color filter CF. According to one example, the planarization layer 113 can be placed between a plurality of inorganic films 111 and an organic light-emitting layer 116. The planarization layer 113 can be formed in the entire circuit region CA and the entire light-emitting region EA in which the thin-film transistor 112 is disposed. Alternatively, the planarization layer 113 can be formed in another non-display region NDA, excluding the pad portion PA of the non-display region NDA and the entire display region DA. For example, the planarization layer 113 may include an extension (or extension) extending or expanding from the display region DA into another non-display region NDA excluding the pad portion PA. Therefore, the planarization layer 113 can have a relatively wider dimension than the display region DA.

[0107] According to one example, the planarization layer 113 can be formed to have a relatively thick thickness, thereby providing a flat surface on the display area DA and the non-display area NDA. For example, the planarization layer 113 can be made of organic materials such as photoacryloyl, benzocyclobutene, polyimide, and fluoropolymer.

[0108] Furthermore, the upper surface of the planarization layer 113 can be made flat. Therefore, the pixel electrode 114 on the planarization layer 113 can also be made flat, and the organic light-emitting layer 116 and the first cathode electrode 117 formed thereon can also be arranged in a flat manner. Since the pixel electrode 114, the organic light-emitting layer 116, and the first cathode electrode 117 (i.e., the organic light-emitting element layer E) are flatly disposed in the light-emitting region EA, the thicknesses of the pixel electrode 114, the organic light-emitting layer 116, and the first cathode electrode 117 can be uniformly formed within the light-emitting region EA. Therefore, the organic light-emitting layer 116 can emit light uniformly within the light-emitting region EA without deviation.

[0109] Pixel electrode 114 can be formed on planarization layer 113. Pixel electrode 114 can be connected to the drain or source electrode of thin-film transistor through contact holes penetrating planarization layer 113, second passivation layer 111d, and first passivation layer 111c. Edge portions on both sides of pixel electrode 114 can be covered by dike portion 115. Pixel electrode 114 can be made of at least one of transparent metal material or semi-transparent metal material.

[0110] Because the display device 100 according to the embodiments of this disclosure is configured as a bottom-emitting type, the pixel electrode 114 can be formed of a transparent conductive material (or TCO) (such as indium tin oxide (ITO) or indium zinc oxide (IZO) that can transmit light) or a semi-transparent conductive material (such as magnesium (Mg), silver (Ag) or an alloy of Mg and Ag).

[0111] Furthermore, the material constituting the pixel electrode 114 may include MoTi. The pixel electrode 114 may be a first electrode or an anode electrode.

[0112] The dam 115 can be a non-light-emitting area and can be placed adjacent to the light-emitting area EA of each of the plurality of sub-pixels SP. For example, the dam 115 can be disposed in the non-light-emitting area NEA. The dam 115 can be formed to cover the portion where the edge of the pixel electrode 114 is located. Therefore, the dam 115 can prevent the pixel electrode 114 and the cathode electrode 117 from being located in the edge of the pixel electrode 114. The exposed portion of the pixel electrode 114 not covered by the dam 115 can be included in the light-emitting portion (or light-emitting area EA).

[0113] After forming the dam 115, an organic light-emitting layer 116 can be formed to cover the pixel electrode 114 and the dam 115. Therefore, the dam 115 can be partially disposed between the pixel electrode 114 and the organic light-emitting layer 116. The dam 115 can be expressed using the term pixel-defining film. According to one example, the dam 115 may comprise organic and / or inorganic materials.

[0114] An organic light-emitting layer 116 can be formed on the pixel electrode 114 and the embankment 115. The organic light-emitting layer 116 can be placed below the first cathode electrode 117. According to one example, the organic light-emitting layer 116 can be disposed in the light-emitting region EA and the non-light-emitting region NEA. The organic light-emitting layer 116 can be disposed between the pixel electrode 114 and the first cathode electrode 117. Therefore, when a voltage is applied to each of the pixel electrode 114 and the first cathode electrode 117, an electric field is formed between the pixel electrode 114 and the first cathode electrode 117. Therefore, the organic light-emitting layer 116 can emit light. The organic light-emitting layer 116 can be formed from a plurality of sub-pixels SP and a common layer disposed on the embankment 115.

[0115] The organic light-emitting layer 116 according to one embodiment can be configured to emit white light. The organic light-emitting layer 116 may include multiple stacks that emit light of different colors. For example, the organic light-emitting layer 116 may include a first stack, a second stack, and a charge-generating layer (CGL) disposed between the first and second stacks. Since the light-emitting layer can be configured to emit white light, each of the multiple sub-pixels SP may include a color filter CF suitable for the corresponding color.

[0116] The first stack can be disposed on the pixel electrode 114 and can be implemented as a structure in which the hole injection layer (HIL), hole transport layer (HTL), emitter layer (EML(B)) and electron transport layer (ETL) are stacked in sequence.

[0117] The charge generation layer can supply charge to both the first and second stacks. The charge generation layer may include an N-type charge generation layer for supplying electrons to the first stack and a P-type charge generation layer for supplying holes to the second stack. The N-type charge generation layer may include a metallic material as a dopant.

[0118] The second stack can be disposed on the first stack and can be implemented in a structure in which the hole transport layer (HTL), the yellow-green (YG) emitter layer (EML(YG)) and the electron injection layer (EIL) are stacked sequentially.

[0119] In the display device 100 according to an embodiment of the present disclosure, since the organic light-emitting layer 116 is set as a common layer, the first stack, the charge-generating layer, and the second stack can all be arranged above the plurality of sub-pixels SP. According to another example, depending on the number of stacks, the organic light-emitting layer 116 can be arranged in a triple-stack structure or a quad-stack structure.

[0120] Furthermore, in a display device 100 according to one embodiment of the present disclosure, since the organic light-emitting layer 116 is disconnected by the undercut portion UCP around the display area DA, moisture penetration can be reduced or prevented even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110.

[0121] The first cathode electrode 117 can be formed on the organic light-emitting layer 116. The first cathode electrode 117 can overlap (or be arranged) in the non-display area NDA (or a portion of the non-display area NDA) and the display area DA. In the display area DA, the first cathode electrode 117 can be arranged in the light-emitting area EA and the non-light-emitting area NEA. That is, the first cathode electrode 117 can be configured to cover the entire display area DA. As a result, the first cathode electrode 117 can be configured to have a size larger than the display area DA and smaller than the substrate 110, so that it can be arranged in the non-display area NDA (or a portion of the non-display area NDA) and the display area DA. The first cathode electrode 117 can be formed before the second cathode electrode 117'.

[0122] As described above, the first cathode electrode 117 can be arranged in the non-display area NDA (or a portion of the non-display area NDA) and the entire display area DA. Therefore, in a display device 100 according to one embodiment of the present disclosure, the attachment of foreign matter to the organic light-emitting layer 116 of the display area DA that may occur during the process for forming the second cathode electrode 117' can be reduced or prevented, thereby reducing the defect rate of the display device. That is, in a display device 100 according to one embodiment of the present disclosure, the first cathode electrode 117 is formed before the second cathode electrode 117' to cover the entire non-display area NDA (or a portion of the non-display area NDA) and the display area DA, thereby reducing the impact of foreign matter deposition on the display area DA that may occur during the moving process for forming the second cathode electrode 117'.

[0123] According to one example, the first cathode electrode 117 may comprise a metallic material. The first cathode electrode 117 can reflect light emitted from the organic light-emitting layer 116 in the plurality of sub-pixels SP toward the lower surface of the substrate 110. Therefore, the display device 100 according to an embodiment of the present disclosure can be implemented as a bottom-emitting display device.

[0124] According to one embodiment of the present disclosure, the display device 100 is a bottom-emitting type and must reflect light emitted from the light-emitting layer 116 toward the substrate 110, and therefore the first cathode electrode 117 can be made of a metallic material with high reflectivity. According to one example, the first cathode electrode 117 can be formed of an opaque metallic material. For example, the opaque metallic material can be a metallic material with high reflectivity, such as silver (Ag), aluminum (Al), a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), Ag alloys, and a stacked structure of Ag alloys and ITO (ITO / Ag alloy / ITO). Ag alloys can be alloys such as silver (Ag), palladium (Pd), and copper (Cu). The first cathode electrode 117 can be expressed using terms such as second electrode, counter electrode, and reflective electrode.

[0125] The second cathode electrode 117' can be disposed on the first cathode electrode 117. The second cathode electrode 117' can be formed later than the first cathode electrode 117, and therefore can be disposed on the first cathode electrode 117. Thus, the second cathode electrode 117' can also be formed on the organic light-emitting layer 116. (Refer to...) Figure 3 The second cathode electrode 117' can overlap (or be arranged) in the first non-display area NDA1. For example, as Figure 3As shown, the second cathode electrode 117' can be arranged to extend (or expand) from the end 110a of the substrate 110 in the first non-display area NDA1 to the area between the display area DA and the common power shorting strip EVSB. Therefore, as Figure 3 As shown, the second cathode electrode 117' may partially overlap with the first cathode electrode 117. According to one example, the second cathode electrode 117' may partially contact the upper surface of the first cathode electrode 117. Therefore, the second cathode electrode 117' may be electrically connected to the first cathode electrode 117, and thus may receive the same or substantially the same common power from the pad portion PA.

[0126] The second cathode electrode 117' can be formed from at least one of an opaque metallic material, a transparent metallic material, and a translucent metallic material. For example, the second cathode electrode 117' can be formed from an opaque metallic material, such as silver (Ag), aluminum (Al), a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, and a laminated structure of Ag alloy and ITO (ITO / Ag alloy / ITO). In this case, since the second cathode electrode 117' has low resistance, the common power drop can be reduced or prevented. As another example, the second cathode electrode 117' can be formed from a transparent metallic material or a translucent metallic material such as ITO or IZO. As described above, since the second cathode electrode 117' is arranged in the first non-display area NDA1, it can be prevented from being formed to reflect light emitted from the organic light-emitting layer 116 toward the substrate 110. Therefore, a display device 100 according to one embodiment of the present disclosure may have a second cathode electrode 117' formed of at least one of an opaque metal material, a transparent metal material, and a translucent metal material.

[0127] In a display device 100 according to one embodiment of the present disclosure, a substrate 110 may include a first region A1, a second region A2, and a third region A3. The first region A1 may be a region in which a first cathode electrode 117 is disposed. The second region A2 may be a region in which a second cathode electrode 117' is disposed. The third region A3 may be a region in which the first cathode electrode 117 and the second cathode electrode 117' overlap. For example, the first region A1 may be a region in which the first cathode electrode 117 is disposed in a first direction (Y-axis direction). The second region A2 may be a region in which the second cathode electrode 117' is disposed in the first direction (Y-axis direction). The third region A3 may be a region in which the first cathode electrode 117 and the second cathode electrode 117' overlap in the first direction (Y-axis direction). Figure 3As shown, the first region A1, the second region A2, and the third region A3 can be arranged in a row in the first direction (Y-axis direction), and the third region A3 can be arranged between the first region A1 and the second region A2 in the first direction (Y-axis direction). The combined length of the first region A1 and the second region A2 in the first direction (Y-axis direction) can be equal to or similar to the length of the substrate 110 in the first direction (Y-axis direction).

[0128] Refer again Figure 2 An encapsulation layer 118 is formed on the first cathode electrode 117 and / or the second cathode electrode 117'. The encapsulation layer 118 is used to reduce or prevent oxygen or moisture from penetrating into the organic light-emitting layer 116, the first cathode electrode 117, and the second cathode electrode 117'. The encapsulation layer 118 may be provided with multiple layers including at least one inorganic film and at least one organic film.

[0129] In addition, such as Figure 2 As shown, the encapsulation layer 118 can be arranged not only in the light-emitting region EA, but also in the non-light-emitting region NEA. Figure 2 In the first non-display area NDA1, the encapsulation layer 118 may be disposed between the first cathode electrode 117 and the opposing substrate 200. However, in the first non-display area NDA1 where the second cathode electrode 117' is disposed, the encapsulation layer 118 may be disposed between the second cathode electrode 117' and the opposing substrate 200.

[0130] The filler layer 119 is disposed between the organic light-emitting layer 116 formed on the substrate 110 and the opposing substrate 200, thereby reducing or preventing external moisture and / or oxygen that permeates through the opposing substrate 200 from reaching the organic light-emitting layer 116. In other words, the filler layer 119 may have a barrier function to reduce or prevent moisture penetration. The filler layer 119 may also contain an absorbent material for absorbing moisture or oxygen to enhance the moisture reduction or prevention effect. For example, the absorbent material may be a getter.

[0131] Furthermore, the filler layer 119 may include at least one of a pressure-sensitive transparent adhesive and a thermosetting transparent adhesive. In this case, the filler layer 119 can be used to bond the substrate 110 and the opposing substrate 200. Therefore, the bonding strength between the substrate 110 and the opposing substrate 200 can be further improved by the filler layer 119.

[0132] Reference Figure 3In a display device 100 according to one embodiment of the present disclosure, the common power shorting strip EVSB can be configured as a strip or a square shape. For example, the common power shorting strip EVSB can be placed in a second region A2 that does not overlap with the third region A3. The common power shorting strip EVSB can be configured to extend along the first side DAL1 of the display region DA in the second region A2. In one example, the length of the common power shorting strip EVSB in the second direction (X-axis direction) can be equal to or similar to the length of the display region DA in the second direction (X-axis direction).

[0133] In the case of general-purpose display devices, the common power shorting strip is configured in a triangular (or squid) shape. In general-purpose display devices, since the organic light-emitting layer is not disposed at the end of the substrate, the entire common power shorting strip can be used as the contact portion for applying common power to the cathode electrode. Therefore, in general-purpose display devices, because the common power shorting strip is configured in a triangular (or squid) shape, the contact area between the common power shorting strip and the cathode electrode can be configured to be relatively wide.

[0134] In contrast, a display device 100 according to one embodiment of the present disclosure can be arranged such that an organic light-emitting layer 116 extends from the display area DA to the end of the substrate 110 in the non-display area NDA. That is, the organic light-emitting layer 116 can be disposed across the entire display area DA and the non-display area NDA. According to one embodiment of the present disclosure, the display device 100 can contact the common power shorting bar EVSB and the cathode electrode (or the second cathode electrode 117') via multiple undercuts (or multiple common power contact undercuts EUC). Therefore, if the common power shorting bar is configured in a triangular shape (or a squid shape), the contact area may be small, making the common power application potentially uneven and generating heat in the contact area, which may reduce reliability.

[0135] Therefore, since the display device 100 according to one embodiment of the present disclosure has a strip-shaped or square common power shorting bar EVSB, the contact area between the common power shorting bar EVSB and the cathode electrode (or the second cathode electrode 117') can be increased compared to the case where the common power shorting bar is set in a triangular shape (or squid shape), thereby allowing the common power supply to be applied smoothly, and the heat generation in the contact area where the common power shorting bar EVSB contacts the cathode electrode (or the second cathode electrode 117') can also be reduced, thereby improving reliability.

[0136] Figure 4 It is along Figure 3 The schematic cross-sectional view of line Ⅱ-Ⅱ' shown.

[0137] Reference Figure 4In a display device 100 according to one embodiment of the present disclosure, a second undercut UC2 can be formed by removing a portion of a plurality of inorganic films 111 and a portion of a planarization layer 113. According to one example, the second undercut UC2 can be formed by partially removing each of the buffer layer BL, the interlayer insulating layer 111b, the first passivation layer 111c, the second passivation layer 111d, and the planarization layer 113. Therefore, as... Figure 4 As shown, the plurality of inorganic membranes 111 may include island-shaped inorganic membranes 111' interrupted by a plurality of second undercuts UC2. Furthermore, the planarization layer 113 may include island-shaped planarization layers 113' disposed on the island-shaped inorganic membranes 111'.

[0138] Furthermore, multiple second undercut UC2s can be disposed on both sides of each of the island-shaped inorganic membrane 111' and the island-shaped planarization layer 113'. For example, as Figure 4 As shown, two second undercut UC2s can be provided on both sides of the island-shaped inorganic film 111' and the island-shaped planarization layer 113'. Each of the two second undercut UC2s provided on both sides of the island-shaped inorganic film 111' and the island-shaped planarization layer 113' can be formed by the same or substantially the same etching process (or patterning process). Therefore, a display device 100 according to one embodiment of the present disclosure can have a structural feature in which a plurality of second undercut UC2s (or two second undercut UC2s) are arranged in a symmetrical shape with respect to the island-shaped inorganic film 111' and the island-shaped planarization layer 113'. Thus, it can also have a structural feature in which the centers of the island-shaped inorganic film 111' and the island-shaped planarization layer 113' are arranged in a row in a third direction (Z-axis direction). Figure 4 As shown, since two second undercuts UC2 are provided on both sides of each of the island-shaped inorganic membrane 111' and the island-shaped planarization layer 113', it can be expressed by the terms bilateral undercut or bilateral symmetrical undercut.

[0139] In addition, such as Figure 4 As shown, since the display device 100 according to one embodiment of the present disclosure does not require a mask (or EL mask), the organic light-emitting layer 116 can be arranged to extend to the end 110b of the substrate 110 in the second non-display area NDA2. According to one embodiment of the present disclosure, even if the organic light-emitting layer 116 extends to the end 110b of the substrate 110 in the second non-display area NDA2, the display device 100 can reduce or prevent moisture penetration through the organic light-emitting layer 116 by allowing the organic light-emitting layer 116 to be disconnected by the second undercut UC2. Additionally, as... Figure 4 As shown, in a display device 100 according to one embodiment of the present disclosure, the planarization layer 113 made of organic material can also be disconnected by the second undercut UC2, thereby improving or maximizing the reduction or prevention of moisture penetration.

[0140] Furthermore, in a display device 100 according to one embodiment of the present disclosure, since each of the disconnected organic light-emitting layer 116 and the disconnected planarization layer 113 is covered by the first cathode electrode 117 and the encapsulation layer 118, the reduction or prevention of moisture penetration through the organic light-emitting layer 116 and the planarization layer 113 can be further improved or maximized.

[0141] In addition, such as Figure 4 As shown, a display device 100 according to one embodiment of the present disclosure may have a structural feature in which the organic light-emitting layer 116 and the planarization layer 113 are disconnected by a second undercut UC2 and thus the first cathode electrode 117 formed in a subsequent process contacts the upper surface 110' of the substrate 110 in the second undercut UC2.

[0142] Figure 5 It is along Figure 3 A schematic cross-sectional view of line Ⅲ-Ⅲ' shown in the figure.

[0143] Reference Figure 5 Since the display device 100 according to one embodiment of this disclosure does not require a mask (or EL mask), the organic light-emitting layer 116 can be arranged to extend to the end 110a of the substrate 110 in the first non-display area NDA1. Figure 5 As shown, in a display device 100 according to one embodiment of the present disclosure, even if the organic light-emitting layer 116 extends to the end 110a of the substrate 110 in the first non-display area NDA1, the organic light-emitting layer 116 can be disconnected by the first undercut UC1. Therefore, in the display device 100 according to one embodiment of the present disclosure, since the organic light-emitting layer 116 extending to the first non-display area NDA1 can be disconnected by the first undercut UC1 in the second area A2, moisture penetration through the organic light-emitting layer 116 can be reduced or prevented.

[0144] According to one example, the first undercut UC1 can be formed by removing a portion of a plurality of inorganic films 111 and a portion of planarization layer 113 in the second region A2. For example, the first undercut UC1 can be formed by removing a portion of the second passivation layer 111d and a portion of the planarization layer 113 among the plurality of inorganic films 111. Therefore, the organic light-emitting layer 116 extending to the first non-display region NDA1 can be disconnected by the first undercut UC1.

[0145] Furthermore, since the first non-display area NDA1 is provided with a pad portion PA (or a pad bonding portion TBP (e.g., ...) that bonds to the patch, ... Figure 3As shown), the planarization layer 113 at the outer edge of the first non-display area NDA1 (or the area where the pad portion PA is provided) can be removed by an etching process (or a patterning process). Therefore, as Figure 5 As shown, the planarization layer 113 may not be disposed on the left side relative to the first undercut UC1, and may be disposed only on the right side. Therefore, a display device 100 according to one embodiment of the present disclosure may have a structural feature in which both sides are asymmetrically disposed relative to the first undercut UC1.

[0146] As a result, in a display device 100 according to one embodiment of the present disclosure, the second undercut UC2 is symmetrically arranged with respect to the island-shaped inorganic film 111' and the island-shaped planarization layer 113', and the left and right structures are asymmetrically arranged with respect to the first undercut UC1, so that the second undercut UC2 and the first undercut UC1 can be arranged with different structures. That is, in a display device 100 according to one embodiment of the present disclosure, the second undercut UC2 can be arranged to have a shape different from that of the first undercut UC1.

[0147] Furthermore, since no pad portion PA is provided in either the third non-display area NDA3 or the fourth non-display area NDA4, the third undercut UC3 in the third non-display area NDA3 and the fourth undercut UC4 in the fourth non-display area NDA4 can be configured to have the same or substantially the same shape as the second undercut UC2. Therefore, like the second undercut UC2, the third undercut UC3 and the fourth undercut UC4 can be symmetrically arranged with respect to the island-shaped inorganic film 111' and the island-shaped planarization layer 113'. Therefore, the organic light-emitting layer 116 extending to the end 110c of the substrate 110 in the third non-display area NDA3 can be disconnected by the third undercut UC3. And, the organic light-emitting layer 116 extending to the end 110d of the substrate 110 in the fourth non-display area NDA4 can be disconnected by the fourth undercut UC4.

[0148] As a result, in a display device 100 according to one embodiment of the present disclosure, the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4 are arranged to surround the display area DA, such that even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110, the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4 can reduce or prevent the penetration (or infiltration) of moisture and oxygen through the organic light-emitting layer 116. Therefore, the display device 100 according to one embodiment of the present disclosure can have improved reliability and thus its lifespan can be increased.

[0149] Reference Figure 5The common power shorting strip EVSB, disposed in the second region A2, is electrically connected to the LS layer LS and the connection electrode CE, which are sequentially stacked on the upper surface of the substrate 110. The LS layer LS is connected to the pad portion PA and can apply the common power applied from the pad portion PA to the connection electrode CE. The connection electrode CE can apply the common power applied from the LS layer LS to the common power shorting strip EVSB. Therefore, the common power shorting strip EVSB can receive common power from the pad portion PA.

[0150] Reference Figure 5 In a display device 100 according to one embodiment of the present disclosure, the second cathode electrode 117' may partially contact the upper surface of the first cathode electrode 117 in the third region A3. Therefore, the second cathode electrode 117' may be electrically connected to the first cathode electrode 117.

[0151] Furthermore, the first undercut UC1 can be formed by removing a portion of the second passivation layer 111d. Conversely, the second undercut UC2 can be formed by partially removing each of the buffer layer BL, the interlayer insulating layer 111b, the first passivation layer 111c, the second passivation layer 111d, and the planarization layer 113. Therefore, the depth D1 of the first undercut UC1 can be less than the depth D2 of the second undercut UC2. Figure 5 As shown, in the first undercut UC1, the second cathode electrode 117' can contact the barrier metal SM. The barrier metal SM can be an etch-resistant film that prevents the first passivation layer 111c from being etched. According to one example, the barrier metal SM can be disposed on the same or substantially the same layer as the common power shorting bar EVSB, and can be disposed on the same or substantially the same material.

[0152] Figure 6 It is along Figure 3 A schematic cross-sectional view of line IV-IV' shown.

[0153] Please refer to Figure 6 According to one embodiment of the present disclosure, the display device 100 may further include a plurality of common power contact undercut ECUCs. Each of the plurality of common power contact undercut ECUCs is used to disconnect the organic light-emitting layer 116 so that the common power shorting strip EVSB and the cathode electrode (or the second cathode electrode 117') are connected.

[0154] Since the display device 100 according to one embodiment of the present disclosure does not require a mask (or EL mask), the organic light-emitting layer 116 can be arranged to extend to the end 110a of the substrate 110 in the first non-display area NDA1. Therefore, in order for the cathode electrode (or the second cathode electrode 117') to receive common power from the common power shorting bar EVSB, the organic light-emitting layer 116 arranged on the common power shorting bar EVSB is typically disconnected.

[0155] In a display device 100 according to one embodiment of the present disclosure, each of the plurality of common power contact undercut ECUs can disconnect the organic light-emitting layer 116 disposed on the common power shorting bar EVSB. For example, each of the plurality of common power contact undercut ECUs can be formed by partially removing the second passivation layer 111d disposed on the common power shorting bar EVSB (or the second region A2) and the planarization layer 113 disposed on the second passivation layer 111d.

[0156] In the second region A2, after forming multiple common power contact undercut ECUCs, an organic light-emitting layer 116, a second cathode electrode 117', and an encapsulation layer 118' can be formed sequentially. Therefore, as... Figure 6 As shown, the organic light-emitting layer 116 on the common power shorting bar EVSB can be disconnected through each of the plurality of common power contact undercut ECUs. Furthermore, the second cathode electrode 117' can contact the common power shorting bar EVSB in each of the plurality of common power contact undercut ECUs. Therefore, the display device 100 according to one embodiment of this disclosure can smoothly receive common power from the common power shorting bar EVSB by increasing the contact area by making the second cathode electrode 117' contact the common power shorting bar EVSB in each of the plurality of common power contact undercut ECUs. As described above, since the second cathode electrode 117' is electrically connected to the first cathode electrode 117 in the third region A3, the common power applied to the second cathode electrode 117' can be applied to the first cathode electrode 117.

[0157] Furthermore, since each of the plurality of common power contact undercut ECUs is formed by partially removing each of the second passivation layer 111d and the planarization layer 113, the depth D1 (or the first depth D1) of each of the common power contact undercut ECUs can be compared with... Figure 5 The depth D1 (or first depth D1) of the first undercut UC1 shown is the same or substantially the same.

[0158] Since the depth D1 (or first depth D1) of the first undercut UC1 is less than the depth D2 (or second depth D2) of the second undercut UC2, the depth D1 (or first depth D1) of each of the common power contact undercut ECUs can also be less than the depth D2 (or second depth D2) of the second undercut UC2. Because the depth D1 (or first depth D1) of each of the common power contact undercut ECUs is less than the depth D2 (or second depth D2) of the second undercut UC2, the second cathode electrode 117' may have difficulty contacting the common power shorting bar EVSB in each of the common power contact undercut ECUs. Therefore, in a display device 100 according to one embodiment of this disclosure, the first cathode electrode 117 disposed in the second undercut UC2 can be formed by a chemical vapor deposition process, and the second cathode electrode 117' disposed in the common power contact undercut ECU (or first undercut UC1) can be formed by a sputtering process.

[0159] According to one example, chemical vapor deposition (CVD) is a process that deposits the material forming the second cathode electrode 117' on a substrate 110 via a chemical reaction such as thermal decomposition, photodecomposition, or redox reaction. In contrast, sputtering is a process that accelerates a gas, such as ionized argon, in a low vacuum and causes it to collide with the material forming the second cathode electrode 117' to form a film on the substrate 110. Therefore, sputtering may be more suitable for shallow (or low) undercuts than CVD.

[0160] Therefore, a display device 100 according to one embodiment of the present disclosure may have the following process characteristics, wherein a first cathode electrode 117 disposed in a second undercut UC2 having a second depth D2 is formed by a chemical vapor deposition process, and a second cathode electrode 117' disposed in a common power contact undercut ECC (or first undercut UC1) having a first depth D1 is formed by a sputtering process.

[0161] Due to the process characteristics described above, when a foreign object is located on the display area DA (or above the pixel electrode 114), the material forming the first cathode electrode 117 (e.g., Al) cannot penetrate deep beneath the foreign object via chemical vapor deposition, thereby reducing or preventing short circuits between the pixel electrode 114 and the first cathode electrode 117. Conversely, the material forming the second cathode electrode 117' (e.g., IZO) can penetrate deep into the common power contact undercut (ECUC) via sputtering, thereby reducing or preventing cathode contact failures in the common power shorting strip (EVSB).

[0162] Therefore, in a display device 100 according to one embodiment of the present disclosure, since a cathode electrode (or a first cathode electrode 117) disposed in the display area DA is formed by a chemical vapor deposition process, dark spot defects in the display area DA can be improved or prevented.

[0163] Furthermore, since the cathode electrode (or second cathode electrode 117') is formed on the common power shorting bar EVSB of the display device 100 according to one embodiment of the present disclosure by a sputtering process, cathode contact failures in the common power shorting bar EVSB can be reduced or prevented.

[0164] In addition, such as Figure 6 As shown, the second cathode electrode 117', which is in contact with the common power shorting bar EVSB in the common power contact undercut ECC, has the function of applying common power to the display area DA, and can therefore be expressed by the term "cathode for applying common power".

[0165] Reference Figure 6 In a display device 100 according to one embodiment of the present disclosure, each of the plurality of common power contact undercut EUCs may be disposed only on one side of the second passivation layer 111d. For example, based on Figure 6 Each of the multiple public power contact undercut ECCs can be located only on the right side of the second passivation layer 111d.

[0166] When the public power contact undercut ECUC is configured as a double undercut similar to the second undercut UC2, the distance between the planarization layers 113 becomes shorter, making it difficult for the material forming the second cathode electrode 117' to penetrate into the public power contact undercut ECUC.

[0167] Therefore, the display device 100 according to one embodiment of the present disclosure can ensure sufficient distance between the planarization layers 113 by providing each of the plurality of common power contact undercut ECUCs only on one side of the second passivation layer 111d, thereby allowing the material forming the second cathode electrode 117' to penetrate deeply into the common power contact undercut ECUC. Thus, in the display device 100 according to one embodiment of the present disclosure, contact failures between the second cathode electrode 117' and the common power shorting bar EVSB can be reduced or prevented in the plurality of common power contact undercut ECUCs.

[0168] like Figure 6 As shown, the public power contact undercut ECUC is only located on the lower side of one side of the planarization layer 113, so it can be referred to by the terms single-sided undercut or public power single-sided undercut.

[0169] Figure 7 It is along Figure 3A schematic cross-sectional view of line V-V' shown. Specifically, Figure 7 It includes along Figure 3 The diagram shows a schematic cross-sectional view of line V-V' and schematically illustrates the attachment process of the tab joint portion TBP and the plurality of tabs 130a.

[0170] Reference Figure 7 According to one embodiment of the present disclosure, the display device 100 may further include a plurality of tab bonding portions (TBPs).

[0171] Multiple tab bonding portions (TBPs) are provided for attaching multiple tabs 130a disposed on the flexible film 130. According to one example, multiple tab bonding portions (TBPs) may be provided in a first non-display area NDA1. Figure 3 As shown, each of the multiple patch bonding portions TBP may include multiple pads partially contacting the undercut PCUC, wherein the organic light-emitting layer 116 is disconnected.

[0172] Multiple pads partially contact each of the undercut PCUCs and can be connected to the first undercut UC1. For example, as... Figure 3 As shown, a plurality of pad-partially-contact undercut PCUCs can be connected to a first undercut UC1 arranged to extend in a second direction (X-axis direction). Each of the plurality of pad-partially-contact undercut PCUCs can be arranged to extend in a first direction (Y-axis direction). Therefore, the organic light-emitting layer 116 in the first non-display area NDA1 can be disconnected by the first undercut UC1 arranged to extend in the second direction (X-axis direction). Furthermore, the organic light-emitting layer 116 in the plurality of patch bonding portions TBPs can be disconnected by the plurality of pad-partially-contact undercut PCUCs arranged to extend in the first direction (Y-axis direction). Therefore, in the display device 100 according to one embodiment of the present disclosure, due to the connection structure of the first undercut UC1 and the plurality of pad-partially-contact undercut PCUCs, the influence of moisture penetration on the first non-display area NDA1 can be more effectively reduced or prevented, as the first non-display area NDA1 is relatively susceptible to moisture penetration due to the pad portions PA.

[0173] Reference Figure 7 According to one example, each of the plurality of patch terminals TBP may include a gate insulating layer 111a, a pad electrode PE, a first passivation layer 111c, and an undercut metal UM. The gate insulating layer 111a may be disposed on a substrate 110. The pad electrode PE may be disposed on the gate insulating layer 111a. According to one example, the pad electrode PE may be disposed on the patch terminal 110. Figure 5 The connecting electrode CE is on the same or substantially the same layer as the layer, and can be connected with... Figure 5The connecting electrodes CE are made of the same or substantially the same material. A first passivation layer 111c may be provided on the pad electrode PE. For example, a first passivation layer 111c may be provided to partially contact each of two pad electrodes PE that are spaced apart from each other.

[0174] The undercut metal UM can be disposed on the first passivation layer 111c. According to one example, the undercut metal UM can be formed on a layer that is the same as or substantially the same as the layer of the common power shorting strip EVSB, and can be made of the same or substantially the same material as the common power shorting strip EVSB. For example, the undercut metal UM can be disposed of as a metallic material. Because the undercut metal UM is disposed of as a metallic material, deformation caused by heat generated during the ACF bonding process for bonding the plurality of tabs 130a and the second cathode electrode 117' can be reduced or minimized. The ACF bonding process can refer to a process used to bond two materials using heat.

[0175] Refer again Figure 7 The undercut metal UM is used to form the pad partial contact undercut PCUC. For example, by setting the undercut metal UM to protrude towards one side of the first passivation layer 111c, the pad partial contact undercut PCUC can be formed under the undercut metal UM. Therefore, as Figure 7 As shown, multiple pads partially contacting each of the undercut PCUCs can be positioned on the underside of one side of the undercut metal UM. For example, based on Figure 7 Multiple pads can be partially contacted on the undercut PCUC, each of which can be set on the lower right side of the undercut metal UM.

[0176] When the pad partial contact undercut PCUC is set to a double undercut similar to the second undercut UC2, the distance between the undercut metals UM becomes shorter, making it difficult for the material forming the second cathode electrode 117' to penetrate into the pad partial contact undercut PCUC.

[0177] Therefore, the display device 100 according to one embodiment of the present disclosure can ensure sufficient distance between the undercut metals UM by providing a plurality of pads partially contacting each of the undercut PCUCs only on one side of the first passivation layer 111c, so that the material forming the second cathode electrode 117' can penetrate deeply into the pads partially contacting the undercut PCUCs, thereby reducing or preventing contact failures between the second cathode electrode 117' and the pad electrode PE.

[0178] like Figure 7 As shown, each of the multiple pads partially contacts the undercut PCUC only on the underside of one side of the undercut metal UM, so it can be expressed by the terms single-sided undercut or pad single-sided undercut.

[0179] Furthermore, the second cathode electrode 117', which is in contact with the pad electrode PE in the undercut PCUC of the pad portion, has the function of applying data power, reference power, pixel power and common power from the pad portion PA to the display area DA, and can therefore be expressed in terms of cathode electrode for applying pad power or cathode electrode for applying pad portion signal.

[0180] Reference Figure 7 Multiple pads partially contact the undercut PCUC and are disposed on each of the multiple patch bonding portions TBP, such that the organic light-emitting layer 116 can be disconnected at each of the multiple pads partially contacting the undercut PCUC. Additionally, the second cathode electrode 117' can contact the pad electrode PE in each of the multiple pads partially contacting the undercut PCUC. Therefore, since the second cathode electrode 117' and the pad electrode PE are in contact within the patch bonding portion TBP, the second cathode electrode 117' can be configured as an electrode integrated with the pad electrode PE. Thus, in a display device 100 according to one embodiment of the present disclosure, each of the multiple patches 130a disposed on the flexible film 130 can be easily bonded to each of the multiple patch bonding portions TBP.

[0181] like Figure 7 As shown, the organic light-emitting layer 116 and the second cathode electrode 117' can be sequentially laminated onto the undercut metal UM in each of the plurality of patch bonding portions TBP. Since the organic light-emitting layer 116 is disposed on the flatly disposed undercut metal UM, it can be disposed in a flat manner. Furthermore, since the second cathode electrode 117' is disposed on the flatly disposed organic light-emitting layer 116, the second cathode electrode 117' can also be disposed in a flat manner. As a result, the second cathode electrode 117' laminated on the undercut metal UM can be disposed in a flat manner.

[0182] According to one embodiment of this disclosure, the display device 100 may have a second cathode electrode 117' laminated on the undercut metal UM to form a flat surface. Therefore, according to one embodiment of this disclosure, the display device 100 may have a tab 130a having a flat lower surface that is easier to attach to the second cathode electrode 117'. Additionally, in the display device 100 according to one embodiment of this disclosure, the contact area can be widened compared to when the second cathode electrode is provided with a rough shape, so that power and / or signals from the pad portion PA can be easily applied to the second cathode electrode 117'.

[0183] As a result, the display device 100 according to one embodiment of the present disclosure can prevent moisture penetration through the organic light-emitting layer 116 by applying an undercut structure to each of the non-display area NDA, the area where the common power shorting bar EVSB is provided, and the area where the patch bonding portion TBP is provided. Furthermore, the display device 100 according to one embodiment of the present disclosure may have the following structural features, wherein the organic light-emitting layer 116 is disconnected by an undercut structure in each of the areas where the common power shorting bar EVSB is provided and the area where the patch bonding portion TBP is provided, so that the cathode electrode (or the second cathode electrode 117') and the common power shorting bar EVSB can contact in the area where the common power shorting bar EVSB is provided, and the cathode electrode (or the second cathode electrode 117') and the plurality of patches 130a can contact in the area where the patch bonding portion TBP is provided.

[0184] Embodiments of this disclosure have been described in more detail with reference to the accompanying drawings; however, this disclosure is not necessarily limited to these embodiments and can be implemented with various modifications without departing from the technical spirit of this disclosure. Therefore, the embodiments disclosed herein are intended to illustrate, not limit, the technical spirit of this disclosure, and the scope of the technical spirit of this disclosure is not limited by these embodiments. Thus, the above embodiments are exemplary in all respects and should be understood as non-limiting. The scope of protection of this disclosure should be interpreted by the claims, and all technical ideas within the scope of the claims should be interpreted as being included within the scope of the claims.

[0185] This disclosure allows the organic light-emitting layer to extend from the display area to the end of the substrate. Therefore, even if the display device according to this disclosure is manufactured in various sizes, masks (or EL masks) of various sizes are not required, thus reducing manufacturing costs.

[0186] Furthermore, the display device according to this disclosure can be manufactured in various sizes without requiring masks (or EL masks) of various sizes. Therefore, compared with display devices manufactured using masks (or EL masks) of various sizes, the display device according to this disclosure can optimize the process, thereby reducing production energy.

[0187] Furthermore, the display device according to this disclosure can reduce or prevent moisture penetration by arranging an organic light-emitting layer with a disconnected undercut portion therein around the display area.

[0188] Furthermore, in this disclosure, a cathode electrode (or a first cathode electrode) disposed in the display area can be formed by a chemical vapor deposition process. Therefore, in this disclosure, dark spot defects in the display area can be improved or prevented.

[0189] Furthermore, this disclosure provides a method for forming a cathode electrode (or a second cathode electrode) disposed in a common power shorting bar using a sputtering process. Therefore, this disclosure can reduce or prevent cathode contact failures in common power shorting bars.

[0190] The effects that can be obtained from this disclosure are not limited to those mentioned above, and other effects not mentioned above will be apparent to those skilled in the art based on the above description.

[0191] Although this disclosure has been described above with reference to exemplary drawings, it is not limited to the embodiments and drawings disclosed in the specification, and it will be apparent to those skilled in the art that various modifications can be made within the scope of the technical concept of this disclosure. Furthermore, even if the operational effects of a configuration according to this disclosure are not explicitly described in the description of embodiments of this disclosure, it should be recognized that predictable effects can be achieved through the corresponding configuration.

[0192] Cross-references to related applications

[0193] This application claims priority to Korean Patent Application No. 10-2024-0190329, filed in Korea on December 18, 2024, the entire contents of which are expressly incorporated herein by reference as if fully set forth herein.

Claims

1. A display device, the display device comprising: A substrate having a display area and a non-display area surrounding the display area, wherein a plurality of pixels having a plurality of sub-pixels are arranged in the display area; as well as An organic light-emitting layer is disposed on the substrate, and each of the plurality of sub-pixels has the organic light-emitting layer. The organic light-emitting layer is arranged to extend from the display area to the end of the substrate. The substrate includes an undercut portion in which the organic light-emitting layer is disconnected. The undercut portion is arranged in the non-display area to surround the display area.

2. The display device according to claim 1, wherein, The non-display area includes: A first non-display area, the first non-display area having a pad portion and adjacent to a first side of the display area; and A second non-display area is connected to the first non-display area and is adjacent to a second side of the display area; and The undercut portion includes: The first undercut in the first non-display area; and The second undercut in the second non-display area.

3. The display device according to claim 2, wherein, The second undercut has a shape different from that of the first undercut.

4. The display device according to claim 2, wherein, The non-display area includes: A third non-display area, wherein the third non-display area is spaced apart from the second non-display area, and the display area is located between the third non-display area and the second non-display area; and A fourth non-display area is provided, which is spaced apart from the first non-display area, and the display area is located between the fourth non-display area and the first non-display area. The undercut portion further includes: The third undercut in the third non-display area; and The fourth undercut in the fourth non-display area, The third undercut and the fourth undercut have the same shape as the second undercut.

5. The display device according to claim 2, wherein, The substrate includes: A first cathode electrode, wherein the first cathode electrode is disposed on the organic light-emitting layer and overlaps with a portion of the display area and the first non-display area; and The second cathode electrode partially contacts the upper surface of the first cathode electrode and is disposed in the first non-display area.

6. The display device according to claim 5, wherein, The first cathode electrode is formed by chemical vapor deposition, and the second cathode electrode is formed by sputtering.

7. The display device according to claim 5, wherein, The first cathode electrode is formed of an opaque metal material, and the second cathode electrode is formed of at least one of an opaque metal material, a transparent metal material, and a semi-transparent metal material.

8. The display device according to claim 5, wherein, The substrate includes: A first region, wherein the first cathode electrode is disposed in the first region; A second region, wherein the second cathode electrode is disposed in the second region; and In the third region, the first cathode electrode and the second cathode electrode overlap. The third region is located between the first region and the second region.

9. The display device according to claim 8, wherein, The substrate also includes a common power shorting strip disposed in the second region, and the common power shorting strip is either strip-shaped or square-shaped.

10. The display device according to claim 2, further comprising: Multiple inorganic films are provided between the substrate and the organic light-emitting layer. as well as A planarization layer is provided between the plurality of inorganic films and the organic light-emitting layer. The second undercut is formed by removing a portion of the plurality of inorganic films and a portion of the planarization layer.

11. The display device according to claim 10, wherein, The plurality of inorganic membranes includes island-shaped inorganic membranes, which are cut open by a plurality of second bottom sections. The planarization layer includes island-shaped planarization layers, which are disposed on the island-shaped inorganic membrane. The plurality of second undercuts are arranged in a symmetrical shape based on the island-shaped inorganic membrane and the island-shaped planarization layer.

12. The display device according to claim 8, wherein, The organic light-emitting layer is arranged to extend from the display area to the end of the substrate having the first non-display area, and The organic light-emitting layer extending into the first non-display area is cut through the first bottom in the second area.

13. The display device according to claim 9, in, Multiple public power contact undercuts are installed on the public power shorting bar. The organic light-emitting layer is cut through each of the plurality of common power contact undercuts, and The second cathode electrode contacts the common power shorting bar in each of the plurality of common power contact undercuts.

14. The display device according to claim 13, wherein, Each of the plurality of public power contact undercuts is formed by partially removing each of the passivation layer disposed on the public power shorting bar and the planarization layer disposed on the passivation layer.

15. The display device according to claim 14, wherein, Each of the plurality of public power contact undercuts is disposed only on one side of the passivation layer.

16. The display device according to claim 5, wherein, The substrate includes multiple bonding portions disposed in the first non-display area, and each bonding portion includes multiple pads partially contacting the undercut, wherein the organic light-emitting layer is disconnected in the multiple pads partially contacting the undercut.

17. The display device according to claim 16, wherein, Each of the plurality of pad partial contact undercuts is connected to the first undercut.

18. The display device according to claim 16, in, Each of the plurality of tab joint portions includes: A gate insulating layer, wherein the gate insulating layer is disposed on the substrate; A pad electrode, wherein the pad electrode is disposed on the gate insulating layer; A passivation layer is disposed on the pad electrode; and Undercut metal, the undercut metal being disposed on the passivation layer, and In this configuration, each of the plurality of pads partially contacts the undercut and is disposed on the lower side of one side of the undercut metal.

19. The display device according to claim 18, wherein, The second cathode electrode contacts the pad electrode in each of the plurality of pad partial contact undercuts.

20. The display device according to claim 18, in, The organic light-emitting layer and the second cathode electrode are sequentially laminated on the undercut metal, and the second cathode electrode laminated on the undercut metal is arranged in a flat manner.

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