Display device, light emitting device package, and method of manufacturing light emitting device package

Abstract

A display device, a light-emitting device package, and a method for manufacturing the light-emitting device package are disclosed. The light-emitting device package may include a package substrate, a first light-emitting device disposed on the package substrate, a second light-emitting device disposed on the package substrate, a first anchoring member penetrating the package substrate, and a second anchoring member penetrating the package substrate.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0189464, filed on December 18, 2024, which is incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] Embodiments of this disclosure relate to a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package. Background Technology

[0004] With the development of the information society, the demand for display devices for displaying images has increased in various forms. Recently, various display devices such as liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs) devices have been widely used.

[0005] Multiple light-emitting devices can be arranged on a display panel. These devices can be transferred onto a substrate using a stamping process. In this case, the light-emitting devices can be transferred one by one. However, when multiple light-emitting devices are mounted on a single package substrate, a light-emitting device package can be formed, or the package can be transferred onto the substrate. Summary of the Invention

[0006] Embodiments of this disclosure may provide a display device, a light-emitting device package, and a method for manufacturing a light-emitting device package, which can minimize the wiring space in the light-emitting device package by using multiple anchors located on the package substrate.

[0007] Embodiments of this disclosure may provide a display device, a light-emitting device package, and a method for manufacturing a light-emitting device package, which can achieve high-density arrangement of light-emitting devices by minimizing the wiring space in the light-emitting device package.

[0008] Embodiments of this disclosure may provide a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package, which facilitates the lighting inspection of the light-emitting device by manufacturing the light-emitting device package on an inspection wafer.

[0009] The embodiments of this disclosure can provide a display device, a light-emitting device package, and a method for manufacturing a light-emitting device package. Since it can form a high-density light-emitting device package and facilitates the lighting inspection of the light-emitting device, the manufacturing process can be optimized.

[0010] The purposes of implementing the present disclosure are not limited to those mentioned herein, and other purposes not explicitly stated will be clearly understood by those skilled in the art from the following description.

[0011] Embodiments of this disclosure may provide a display device, comprising: a lower substrate; a plurality of connecting electrodes disposed on the lower substrate; an encapsulation substrate disposed on the plurality of connecting electrodes; a first light-emitting device disposed on the encapsulation substrate, the first light-emitting device including a first light-emitting layer and a first electrode and a second electrode located below the first light-emitting layer; a second light-emitting device disposed on the encapsulation substrate, the second light-emitting device including a second light-emitting layer and a third electrode and a fourth electrode located below the second light-emitting layer; a first anchoring member electrically connected to the first electrode and the first connecting electrode among the plurality of connecting electrodes, the first anchoring member penetrating the encapsulation substrate and overlapping the first electrode and the first connecting electrode; a second anchoring member electrically connected to the second electrode and the second connecting electrode among the plurality of connecting electrodes, the second anchoring member penetrating the encapsulation substrate and overlapping the second electrode and the second connecting electrode; a third anchoring member electrically connected to the third electrode and the third connecting electrode among the plurality of connecting electrodes, the third anchoring member penetrating the encapsulation substrate and overlapping the third electrode and the third connecting electrode; and a fourth anchoring member electrically connected to the fourth electrode and the fourth connecting electrode among the plurality of connecting electrodes, the fourth anchoring member penetrating the encapsulation substrate and overlapping the fourth electrode and the fourth connecting electrode.

[0012] Embodiments of this disclosure may provide a light-emitting device package, comprising: a package substrate; a first light-emitting device disposed on the package substrate, the first light-emitting device including a first light-emitting layer, a first electrode electrically connected to the first light-emitting layer, and a second electrode electrically connected to the first light-emitting layer; a second light-emitting device disposed on the package substrate, the second light-emitting device including a second light-emitting layer, a third electrode electrically connected to the second light-emitting layer, and a fourth electrode electrically connected to the second light-emitting layer; a first anchoring member electrically connected to the first electrode, the first anchoring member overlapping with the first electrode and penetrating the package substrate; and a second anchoring member electrically connected to the third electrode, the second anchoring member overlapping with the third electrode and penetrating the package substrate.

[0013] Embodiments of this disclosure may provide a method for manufacturing a light-emitting device package, the method comprising: a filling step of filling conductive paste into a plurality of anchor holes on a package substrate; a light-emitting device placement step of placing a plurality of light-emitting devices on the conductive paste; a thermo-pressing step of applying heat and external force to the plurality of light-emitting devices to transform the conductive paste into a plurality of anchor posts; and a lighting inspection step of supplying power to the plurality of anchor posts through probe electrodes on a wafer substrate and inspecting whether the plurality of light-emitting devices emit light.

[0014] According to embodiments of the present disclosure, a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package can be provided, which can minimize the wiring space in the light-emitting device package by using multiple anchors located on the package substrate.

[0015] According to embodiments of the present disclosure, a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package can be provided, which can achieve high-density arrangement of light-emitting devices by minimizing the wiring space in the light-emitting device package.

[0016] According to embodiments of the present disclosure, a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package can be provided, which facilitates the lighting inspection of the light-emitting device by manufacturing the light-emitting device package on an inspection wafer.

[0017] According to embodiments of the present disclosure, a display device, a light-emitting device package, and a method for manufacturing the light-emitting device package can be provided. Since a high-density light-emitting device package can be formed, and the lighting inspection of the light-emitting device is also facilitated, the manufacturing process can be optimized.

[0018] The effects of the embodiments of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other effects not explicitly stated in the claims. Attached Figure Description

[0019] This disclosure will be more fully understood in light of the following detailed description and accompanying drawings. The detailed description and accompanying drawings are provided for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0020] Figure 1 This is a system configuration diagram of a display device according to an embodiment of the present disclosure.

[0021] Figure 2 This is a view showing subpixels according to an embodiment of the present disclosure.

[0022] Figure 3 This is a view of a plurality of light-emitting device packages arranged on a display panel according to an embodiment of the present disclosure.

[0023] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of region AB of the light-emitting device package.

[0024] Figures 5 to 8 This is a view illustrating the process of transferring a light-emitting device package onto a lower substrate according to an embodiment of the present disclosure.

[0025] Figure 9 and Figure 10 This is a view illustrating the process of transferring a light-emitting device package onto a lower substrate according to an embodiment of the present disclosure.

[0026] Figure 11 and Figure 12 This is a view illustrating the process of transferring a light-emitting device package onto a lower substrate according to an embodiment of the present disclosure.

[0027] Figures 13 to 16 This is a view illustrating the process of transferring a light-emitting device package onto a lower substrate according to an embodiment of the present disclosure.

[0028] Figure 17 This is a flowchart of a method for manufacturing a light-emitting device package according to an embodiment of the present disclosure. Detailed Implementation

[0029] In the following description of embodiments or implementations of the invention, reference will be made to the accompanying drawings, which illustrate specific embodiments or implementations by way of example. The same reference numerals and symbols may be used in the drawings to refer to the same or similar components, even if they are shown in different drawings. Furthermore, in the following description of embodiments or implementations of the invention, detailed descriptions of known functions and components incorporated herein will be omitted where such detailed descriptions would obscure the subject matter of some embodiments of the invention. Terms such as “comprising,” “having,” “including,” “constituting,” “made of,” “composed of,” and “formed from” as used herein are generally intended to allow for the addition of other components, unless the term “only” is used with respect to these terms. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0030] The elements of the present invention may be described herein using terms such as “first,” “second,” “A,” “B,” “(A),” or “(B).” Each of these terms is not used to define the nature, order, sequence, or number of the elements, but is only used to distinguish the corresponding element from other elements.

[0031] When referring to the first element and the second element as "connected or combined," "in contact or overlapping," etc., it should be interpreted as meaning that the first element can not only be "directly connected or combined" or "directly contact or overlap" with the second element, but also that a third element can be "inserted" between the first element and the second element, or that the first element and the second element can be "connected or combined," "in contact or overlapping," etc., with each other via a fourth element. Here, the second element may be included in at least one of two or more elements that are "connected or combined," "in contact or overlapping," etc., with each other.

[0032] When using time-relative terms such as “after,” “following,” “next,” or “before,” to describe the process or operation of an element or structure, or the flow and steps in an operating method, processing method, or manufacturing method, these terms may be used to describe discontinuous or non-sequential processes or operations, unless the terms “directly” or “immediately following” are used together.

[0033] Furthermore, when referring to any scale, relative size, etc., even without a specific description, it should be assumed that the numerical values ​​(e.g., levels, ranges, etc.) of the component or feature or related information include the range of tolerances or errors that can be caused by various factors (e.g., process factors, internal or external shocks, noise, etc.). In addition, the term "may" fully encompasses all the meanings of the term "can".

[0034] Various embodiments of this disclosure will be described in detail with reference to the accompanying drawings. All components of each display device and each light-emitting device package according to all embodiments of this disclosure are operatively combined and configured.

[0035] The following will describe a display device according to an embodiment of the present disclosure.

[0036] Figure 1 This is a system configuration diagram of a display device 100 according to an embodiment of the present disclosure.

[0037] Reference Figure 1 The display device 100 according to embodiments of the present disclosure may include a display panel 110 as a component for image display and a display driving circuit. The display driving circuit may include a data driver circuit 120, a gate driver circuit 130, and a display controller 140 to drive the display panel 110.

[0038] The display panel 110 may include a substrate 111 and a plurality of sub-pixels SP disposed on the substrate 111.

[0039] The substrate 111 of the display panel 110 may include a display area DA that can display images and a non-display area NDA located outside the display area DA.

[0040] Multiple subpixels SP used for image display can be arranged in the display area DA, while the non-display area NDA can include a pad area located from the display area DA along a first direction.

[0041] In the display panel 110 according to an embodiment of the present disclosure, the non-display area NDA can be very small. In this disclosure, the non-display area NDA is also referred to as the "border".

[0042] Various types of signal lines used to drive multiple sub-pixels SP can be arranged on the substrate 111 of the display panel 110.

[0043] The display device 100 according to embodiments of this disclosure may be a liquid crystal display (LCD) device or a self-emissive display device in which the display panel 110 emits its own light. When the display device 100 is a self-emissive display device, each of the plurality of sub-pixels SP may include a light-emitting device.

[0044] For example, the display device 100 according to an embodiment of this disclosure may be an organic light-emitting display device in which the light-emitting device is implemented as an organic light-emitting diode (OLED). In another example, the display device 100 may be an inorganic light-emitting display device in which the light-emitting device is implemented as an inorganic light-emitting diode. In yet another example, the display device 100 may be a quantum dot display device in which the light-emitting device is implemented as a quantum dot, a light-emitting semiconductor crystal.

[0045] The structure of each subpixel SP can vary depending on the type of display device 100. For example, when the display device 100 is a self-emissive display device in which each subpixel SP emits light, each subpixel SP may include a self-emissive light-emitting device, one or more transistors, and one or more capacitors.

[0046] Various types of signal lines can include multiple data lines DL for transmitting data signals (also known as data voltages or image signals) and multiple gate lines GL for transmitting gate signals (also known as scan signals).

[0047] The data driver circuit 120 can drive multiple data lines DL and output data signals to multiple data lines DL.

[0048] The data driver circuit 120 can receive digital image data DATA from the display controller 140, convert the received image data DATA into an analog data signal, and output the analog data signal to multiple data lines DL.

[0049] The data driver circuit 120 can be connected to one side of the display panel 110 (e.g., the top or bottom side). Alternatively, depending on the driving method or panel design, the data driver circuit 120 can be connected to both sides of the display panel 110 (e.g., the top and bottom sides), or to two or more of the four sides of the display panel 110.

[0050] The data driver circuit 120 can be connected to the periphery of the display area DA of the display panel 110. Alternatively, the data driver circuit 120 can be disposed within the display area DA of the display panel 110.

[0051] The gate driver circuit 130 can drive multiple gate lines GL and output gate signals to multiple gate lines GL.

[0052] The gate driver circuit 130 can receive a first gate voltage corresponding to the on-level voltage and a second gate voltage corresponding to the off-level voltage, as well as various gate driver control signals GCS, to generate a gate signal and provide the generated gate signal to multiple gate lines GL.

[0053] The display controller 140 can control the data driver circuit 120 and the gate driver circuit 130, and can control the driving timing of multiple data lines DL and multiple gate lines GL.

[0054] The display controller 140 can provide a data driver control signal DCS to the data driver circuit 120 to control the data driver circuit 120, and can provide a gate driver control signal GCS to the gate driver circuit 130 to control the gate driver circuit 130.

[0055] The display controller 140 can receive input image data from the host system 150 and provide image data DATA to the data driver circuit 120 based on the input image data.

[0056] The display controller 140 can be implemented as a component separate from the data driver circuit 120, or it can be integrated with the data driver circuit 120 as an integrated circuit.

[0057] The display controller 140 may be a timing controller used in related display technologies. Alternatively, the display controller 140 may be a control device that includes a timing controller and performs additional control functions, or it may be a control device separate from the timing controller. In some cases, the display controller 140 may be circuitry within a control device.

[0058] The display controller 140 can be mounted on a printed circuit board (PCB) or a flexible printed circuit (FPC) and can be electrically connected to the data driver circuit 120 and the gate driver circuit 130 via the PCB or FPC.

[0059] The display device 100 according to embodiments of this disclosure can provide not only image display functionality but also touch sensing functionality. To this end, the display device 100 may include a touch sensor and a touch sensing circuit, the touch sensing circuit detecting whether a touch object such as a finger or pen is being touched and determining the touch location.

[0060] The touch sensing circuit may include a touch driver circuit that drives a touch sensor to sense touch input, generate touch sensing data, and output the data. The touch sensing circuit may also include a touch controller that detects a touch or determines the touch location based on the touch sensing data.

[0061] A touch sensor may include multiple touch electrodes. Additionally, a touch sensor may include multiple touch lines for electrically connecting the multiple touch electrodes to touch driver circuitry.

[0062] The touch driver circuit can provide a touch drive signal to at least one of a plurality of touch electrodes and can sense at least one of the plurality of touch electrodes to generate touch sensing data.

[0063] The touch driver circuit and touch controller included in the touch sensing circuit can be implemented as separate devices or as a single device. Additionally, the touch driver circuit and data driver circuit can be implemented as separate devices or as a single device.

[0064] The display device 100 may also include a power supply circuit that supplies various power sources to the display driving circuit and / or touch sensing circuit.

[0065] The display device 100 according to embodiments of this disclosure may also include electronic devices such as a camera (image sensor) and a sensing sensor. For example, the sensing sensor may be a sensor that detects objects or the human body by receiving light such as infrared light, ultrasonic light, or ultraviolet light.

[0066] Figure 2 This is a view showing a sub-pixel SP according to an embodiment of the present disclosure.

[0067] Reference Figure 2 Each of the plurality of sub-pixels SP of the display device (e.g., device 100) may include a light-emitting device ED and a sub-pixel circuit SPC for driving the light-emitting device ED.

[0068] The subpixel circuit (SPC) may include a plurality of pixel driving transistors for driving the light-emitting device (ED) and at least one capacitor. In this disclosure, the SPC may provide a driving current to the ED in a predetermined timing sequence to drive the ED. The ED emits light under the drive current.

[0069] Multiple pixel driving transistors may include a driving transistor DT for driving the light-emitting device ED and a scanning transistor ST that is turned on or off in response to a scanning signal SC.

[0070] The driving transistor DT can provide driving current to the light-emitting device ED.

[0071] The scanning transistor ST can be configured to control the electrical state of a corresponding node within the sub-pixel circuit SPC or to control the state or operation of the drive transistor DT.

[0072] At least one capacitor may include a storage capacitor Cst for maintaining a constant voltage during a frame.

[0073] To drive the sub-pixel SP, a data signal VDATA, serving as an image signal, and a scan signal SC, serving as a gate signal, can be applied to the sub-pixel SP. Additionally, to drive the sub-pixel SP, a common pixel driving voltage, including a driving voltage VDD and a reference voltage VSS, can be applied to the sub-pixel SP.

[0074] The light-emitting device (ED) can be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), or a quantum dot light-emitting device. For example, when the ED is an organic light-emitting diode (OLED), it may include a light-emitting layer containing organic materials.

[0075] The driving transistor DT can be a transistor used to supply drive current to the light-emitting device ED. The driving transistor DT can be connected between the drive voltage line VDDL and the light-emitting device ED.

[0076] The driving transistor DT may include: a first node N1 electrically connected to the light-emitting device ED; a second node N2 to which a data signal VDATA can be applied; and a third node N3 to which a driving voltage VDD is applied from the driving voltage line VDDL.

[0077] In the driving transistor DT, the second node N2 can be the gate node. The first node N1 can be either the source node or the drain node. The third node N3 can be either the drain node or the source node. In the following text, for ease of explanation, we will use the example where the second node N2 is the gate node, the first node N1 is the source node, and the third node N3 is the drain node.

[0078] Figure 2The scanning transistor ST included in the sub-pixel circuit SPC shown can be a switching transistor used to transmit the data signal VDATA, which is an image signal, to the second node N2 of the driving transistor DT.

[0079] The scan transistor ST can be turned on and off by the scan signal SC, which is a gate signal applied through the scan line SCL. The scan line SCL is a type of gate line GL. The scan transistor ST controls the electrical connection between the second node N2 of the drive transistor DT and the data line DL. The drain or source electrode of the scan transistor ST can be electrically connected to the data line DL. The source or drain electrode of the scan transistor ST can be electrically connected to the second node N2 of the drive transistor DT. The gate electrode of the scan transistor ST can be electrically connected to the scan line SCL.

[0080] The storage capacitor Cst can be electrically connected between the first node N1 and the second node N2 of the driving transistor DT. The storage capacitor Cst may include a first capacitor electrode electrically connected to or corresponding to the first node N1 of the driving transistor DT, and a second capacitor electrode electrically connected to or corresponding to the second node N2 of the driving transistor DT.

[0081] The storage capacitor Cst is not a parasitic capacitor (e.g., Cgs, Cgd) such as an internal capacitor that may exist between the first node N1 and the second node N2 of the driving transistor DT. Instead, the storage capacitor Cst can be an external capacitor that is intentionally designed to be outside the driving transistor DT.

[0082] Each of the driving transistor DT and the scanning transistor ST can be an n-type transistor or a p-type transistor.

[0083] The display panel 110 may have a top-emitting structure or a bottom-emitting structure.

[0084] When the display panel 110 has a top-emitting structure, at least a portion of the sub-pixel circuit SPC can overlap with at least a portion of the light-emitting device ED in the vertical direction. Conversely, when the display panel 110 has a bottom-emitting structure, the sub-pixel circuit SPC may not overlap with the light-emitting device ED in the vertical direction.

[0085] The subpixel circuit SPC can have a 2T1C structure, comprising two transistors DT and ST and a capacitor Cst. In some cases, the subpixel circuit SPC may further include one or more additional transistors or one or more additional capacitors.

[0086] For example, a subpixel circuit SPC can have an 8T1C structure comprising eight transistors and one capacitor. In another example, a subpixel circuit SPC can have a 6T2C structure comprising six transistors and two capacitors. In yet another example, a subpixel circuit SPC can have a 7T1C structure comprising seven transistors and one capacitor.

[0087] Depending on the structure of the sub-pixel circuit SPC, the type and number of gate lines supplying gate signals to the sub-pixel SP can vary.

[0088] Furthermore, depending on the structure of the sub-pixel circuit SPC, the type and number of common pixel driving voltages provided to the sub-pixel SP can vary.

[0089] Figure 3 This is a view showing a plurality of light-emitting device packages (ED_PKGs) arranged on a display panel 110 according to an embodiment of the present disclosure.

[0090] Reference Figure 3 You can see the display panel 110. Figure 3 The display panel 110 shown is Figure 1 The display panel 110 shown is the same.

[0091] You can see the magnified area 300 of the display panel 110. Multiple light-emitting device packages (ED_PKG) can be arranged in the magnified area 300.

[0092] Each light-emitting device package ED_PKG may include multiple light-emitting devices EDa, EDb (see...). Figure 4 ).

[0093] For example, an ED_PKG package may include one or more light-emitting devices EDa and EDb. An ED_PKG package may include red light-emitting devices EDa and EDb; blue light-emitting devices EDa and EDb; and green light-emitting devices EDa and EDb.

[0094] For example, the light-emitting device package ED_PKG may include ordinary light-emitting devices EDa and EDb that emit light during the operation of the display device; and redundant light-emitting devices EDa and EDb used to repair the display device. If the ordinary light-emitting devices EDa and EDb fail, a repair process can be performed to make the redundant light-emitting devices EDa and EDb emit light.

[0095] The light-emitting device package ED_PKG can include multiple light-emitting devices EDa and EDb, and the multiple light-emitting devices EDa and EDb can be arranged in a row, in a circular pattern, or in two columns.

[0096] Reference Figure 3 You can see regions AB. This will be described in detail below. Figure 3 The diagram shows a cross-sectional view of region AB of the ED_PKG package for the light-emitting device.

[0097] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of region AB of the ED_PKG package for the light-emitting device.

[0098] Reference Figure 4 The lower substrate 410 can be disposed at the bottom of the display panel 110. The lower substrate 410 may include... Figure 1 The substrate 111 shown. The lower substrate 410 may also include Figure 2 The transistors DT and ST, and the storage capacitor Cst are shown.

[0099] The first connecting electrode 421 and the second connecting electrode 422 may be disposed on the lower substrate 410. The first connecting electrode 421 and the second connecting electrode 422 may include a metallic material. The first connecting electrode 421 and the second connecting electrode 422 may provide voltage or current to the light-emitting device EDa.

[0100] The first connecting electrode 421 and the second connecting electrode 422 may be positioned adjacent to each other but spaced apart. When a first voltage is supplied to the first connecting electrode 421, a second voltage may be supplied to the second connecting electrode 422. The first voltage may have a different voltage level than the second voltage. The first voltage may be greater than or less than the second voltage.

[0101] A first bonding material 431 may be disposed on the first connecting electrode 421. The first bonding material 431 may include a conductive material. Since the first bonding material 431 is configured to contact the first connecting electrode 421, the first bonding material 431 can be electrically connected to the first connecting electrode 421. (Refer to...) Figure 4 The width of the first bonding material 431 can be smaller than the width of the first connecting electrode 421. The first bonding material 431 can be located between the first connecting electrode 421 and the light-emitting device package ED_PKG. The first bonding material 431 can fix the light-emitting device package ED_PKG to the first connecting electrode 421.

[0102] A second bonding material 432 may be disposed on the second connecting electrode 422. The second bonding material 432 may include a conductive material. Since the second bonding material 432 is configured to contact the second connecting electrode 422, the second bonding material 432 can be electrically connected to the second connecting electrode 422. (Refer to...) Figure 4The width of the second bonding material 432 can be smaller than the width of the second connecting electrode 422. The second bonding material 432 can be located between the second connecting electrode 422 and the light-emitting device package ED_PKG. The second bonding material 432 can fix the light-emitting device package ED_PKG to the second connecting electrode 422.

[0103] The third connecting electrode 423 can be positioned spaced apart from the first connecting electrode 421 and the second connecting electrode 422. The features of the third connecting electrode 423 can be the same as those of the first connecting electrode 421. The fourth connecting electrode 424 can be disposed adjacent to the third connecting electrode 423, but positioned spaced apart from it. The features of the fourth connecting electrode 424 can be the same as those of the second connecting electrode 422. The third connecting electrode 423 and the fourth connecting electrode 424 can provide voltage or current to the light-emitting device EDb. A third bonding material 433 can be disposed on the third connecting electrode 423, and the features of the third bonding material 433 can be the same as those of the first bonding material 431. A fourth bonding material 434 can be disposed on the fourth connecting electrode 424, and the features of the fourth bonding material 434 can be the same as those of the second bonding material 432.

[0104] The light-emitting device package ED_PKG can be disposed on the lower substrate 410.

[0105] The light-emitting device package ED_PKG may include a package substrate 441; multiple anchors 451, 452, 453, 454; and multiple light-emitting devices EDa and EDb.

[0106] The packaging substrate 441 may be disposed at the bottom of the light-emitting device package ED_PKG. Etching, deposition, and patterning processes can be performed on the packaging substrate 441. The packaging substrate 441 may include materials capable of being etched, deposited, and patterned. The packaging substrate 441 may be a glass substrate. The packaging substrate 441 may include polymer-based materials or silicon-based materials.

[0107] Multiple anchors 451, 452, 453, and 454 may penetrate the packaging substrate 441. The packaging substrate 441 may include multiple anchor holes AH, and the multiple anchors 451, 452, 453, and 454 may be respectively disposed in the multiple anchor holes AH of the packaging substrate 441. The multiple anchors 451, 452, 453, and 454 may have a cylindrical shape. The multiple anchors 451, 452, 453, and 454 may have a cylindrical shape, but the top surface of the anchor may have a larger diameter than the bottom surface. However, the entire portion of the multiple anchors 451, 452, 453, and 454 may also have a cylindrical shape.

[0108] Multiple anchors 451, 452, 453, and 454 may include nano-conductive spheres 455. Multiple anchors 451, 452, 453, and 454 may be made of conductive paste 530 containing nano-conductive spheres 455 (see...). Figure 5 Material formation. When subjected to hot pressing, the conductive paste 530 can solidify, and the nano-conductive spheres 455 can rupture. Therefore, the multiple anchors 451, 452, 453, and 454 can become rigid and conductive. When hot pressing is applied to the multiple anchors 451, 452, 453, and 454, all the nano-conductive spheres 455 can rupture. However, some nano-conductive spheres 455 can remain intact within the multiple anchors 451, 452, 453, and 454.

[0109] Reference Figure 4 The first anchor 451 can be positioned adjacent to but spaced apart from the second anchor 452. The third anchor 453 can be positioned adjacent to but spaced apart from the fourth anchor 454.

[0110] The first anchor 451 may overlap with the first bonding material 431. In this case, the first anchor 451 may be positioned in contact with the first bonding material 431. The diameter of the first anchor 451 may be the same as, but is not limited to, the diameter of the first bonding material 431. The second anchor 452 may overlap with the second bonding material 432. In this case, the second anchor 452 may be positioned in contact with the second bonding material 432. The diameter of the second anchor 452 may be the same as, but is not limited to, the diameter of the second bonding material 432. The third anchor 453 may overlap with the third bonding material 433. In this case, the third anchor 453 may be positioned in contact with the third bonding material 433. The diameter of the third anchor 453 may be the same as, but is not limited to, the diameter of the third bonding material 432. The fourth anchor 454 may overlap with the fourth bonding material 434. In this case, the fourth anchor 454 may be positioned in contact with the fourth bonding material 434. The diameter of the fourth anchor 454 may be the same as the diameter of the fourth bonding material 434, but is not limited thereto.

[0111] A light-emitting device package (ED_PKG) may include a first light-emitting device (EDa) and a second light-emitting device (EDb). A light-emitting device package (ED_PKG) may also include two or more light-emitting devices (EDa, EDb). However, in... Figure 4 The cross-sectional view of region AB shows two light-emitting devices, EDa and EDb.

[0112] The first light-emitting device EDa may include: a first light-emitting layer ELa, a first positive electrode E1a located below the first light-emitting layer ELa, and a first negative electrode E2a located below the first light-emitting layer ELa.

[0113] The first light-emitting device EDa can be disposed on the first anchor 451 and the second anchor 452.

[0114] The first positive electrode E1a of the first light-emitting device EDa can be configured to contact the first anchor 451. The first positive electrode E1a can overlap with the first anchor 451. Since the first anchor 451 may include a conductive material, the first positive electrode E1a can be electrically connected to the first anchor 451.

[0115] The first negative electrode E2a of the first light-emitting device EDa can be configured to contact the second anchor 452. The first negative electrode E2a can overlap with the second anchor 452. Since the second anchor 452 may include a conductive material, the first negative electrode E2a can be electrically connected to the second anchor 452.

[0116] Since the first positive electrode E1a is electrically connected to the first anchor 451 and the first negative electrode E2a is electrically connected to the second anchor 452, the first light-emitting device EDa can be driven to emit light.

[0117] The second light-emitting device EDb may include: a second light-emitting layer ELb, a second positive electrode E1b located below the second light-emitting layer ELb, and a second negative electrode E2b located below the second emission layer ELb.

[0118] The second light-emitting device EDb can be disposed on the third anchor 453 and the fourth anchor 454.

[0119] The second positive electrode E1b of the second light-emitting device EDb can be configured to contact the third anchor 453. The second positive electrode E1b can overlap with the third anchor 453. Since the third anchor 453 may include a conductive material, the second positive electrode E1b can be electrically connected to the third anchor 453.

[0120] The second negative electrode E2b of the second light-emitting device EDb can be configured to contact the fourth anchor 454. The second negative electrode E2b can overlap with the fourth anchor 454. Since the fourth anchor 454 may include a conductive material, the second negative electrode E2b can be electrically connected to the fourth anchor 454.

[0121] Since the second positive electrode E1b is electrically connected to the third anchor 453 and the second negative electrode E2b is electrically connected to the fourth anchor 454, the second light-emitting device EDb can be driven to emit light.

[0122] An insulating layer 420 may be disposed on the lower substrate 410. The insulating layer 420 may be configured to cover the light-emitting device package ED_PKG. The insulating layer 420 may include an organic material. The insulating layer 420 may fix the position of the light-emitting device package ED_PKG.

[0123] A protective layer 460 can be disposed on the insulating layer 420. The protective layer 460 can protect the light-emitting device package (ED_PKG) from external factors. The protective layer 460 can be a glass substrate, or it can include organic or inorganic materials.

[0124] Although the light-emitting devices EDa and EDb are described as flip-chip LEDs for illustrative purposes, this disclosure can also be applied to vertical LEDs. In this case, the first electrode of the vertical LED can overlap with a single anchor. The second electrode, different from the first electrode, can receive power through the anchor, but it can also receive power from components outside the light-emitting device package. For ease of explanation, this disclosure will be described assuming that the light-emitting device is a flip-chip LED.

[0125] The cross-sectional view of region AB has already been described. The ED_PKG light-emitting device package will be described in more detail below.

[0126] Figures 5 to 8 This is a view illustrating the process of transferring a light-emitting device package (ED_PKG) onto a lower substrate 410 according to an embodiment of the present disclosure.

[0127] Reference Figure 5 We can see the first process (process 1) and the second process (process 2). Since the second process (process 2) is performed after the first process (process 1), the first process (process 1) will be described first.

[0128] The inspection wafer 500 may include an inspection substrate 510, an inspection electrode, a probe electrode, a packaging substrate 441, and a conductive paste 530.

[0129] The inspection substrate 510 can be disposed at the bottom of the light-emitting device package ED_PKG. Etching, deposition, and patterning processes can be performed on the inspection substrate 510. The inspection substrate 510 can include materials capable of being etched, deposited, and patterned. The inspection substrate 510 can be a glass substrate. The inspection substrate 510 can include polymer-based materials or silicon-based materials.

[0130] The first inspection electrode 521 and the second inspection electrode 522 may be disposed on the inspection substrate 510. The first inspection electrode 521 and the second inspection electrode 522 may overlap with a light-emitting device EDa or EDb. When the first inspection electrode 521 and the second inspection electrode 522 supply power to the light-emitting device EDa or EDb, the light-emitting device EDa or EDb may emit light. The first inspection electrode 521 and the second inspection electrode 522 may include a metallic material.

[0131] The first probe electrode 523 and the second probe electrode 524 may be disposed on the inspection substrate 510. The first probe electrode 523 and the second probe electrode 524 may be electrodes connected to an inspection device. The first probe electrode 523 may be electrically connected to the first inspection electrode 521. The second probe electrode 524 may be electrically connected to the second inspection electrode 522. Wiring connecting the first probe electrode 523 to the first inspection electrode 521 may be disposed on the upper surface of the inspection substrate 510 or within the inspection substrate 510. Wiring connecting the second probe electrode 524 to the second inspection electrode 522 may be disposed on the upper surface of the inspection substrate 510 or within the inspection substrate 510.

[0132] A first conductive paste 531 may be disposed on an inspection substrate 510. The first conductive paste 531 may be configured to cover the inspection electrode and the probe electrode. The first conductive paste 531 may include nanoconductive spheres 455. The first conductive paste 531 may be cured when subjected to hot pressing.

[0133] The encapsulation substrate 441 can be disposed on the first conductive paste 531. The encapsulation substrate 441 may include multiple anchoring holes AH. (See reference...) Figure 5 As can be seen, the packaging substrate 441 includes four anchoring holes.

[0134] A second conductive paste 532 may be disposed on the packaging substrate 441. The features of the second conductive paste 532 may be the same as those of the first conductive paste 531. The second conductive paste 532 may fill the plurality of anchor holes AH included in the packaging substrate 441. Since the first conductive paste 531 and the second conductive paste 532 are made of the same material, the second conductive paste 532 may be integrally fused with the first conductive paste 531. The conductive paste 530 may include both the first conductive paste 531 and the second conductive paste 532.

[0135] After the second conductive paste 532 is applied, an exposure process can be performed. During the exposure process, a portion of the second conductive paste 532 can be removed. (See reference...) Figure 5 The steps preceding the exposure process correspond to the first process (process 1). After performing the first process (process 1), the second process (process 2) can be performed.

[0136] The second process (process 2) can be seen. (Refer to...) Figure 5 After multiple light-emitting devices EDa and EDb are placed on the conductive paste 530, a hot-pressing process can be performed. The hot-pressing process can be a process of applying force to the light-emitting devices EDa and EDb from the upper surface to the lower surface. When the hot-pressing process is performed, heat can be transferred to the light-emitting devices EDa and EDb and the inspection wafer 500. Therefore, a portion of the conductive paste 530 can be cured, thereby forming multiple anchor posts 540 and 550.

[0137] Multiple anchor posts 540 and 550 can be located within multiple anchor holes AH. The multiple anchor posts 540 and 550 may include... Figure 4 The nano-conductive spheres 455 are shown. Multiple anchor posts 540, 550 can overlap with the electrodes of the light-emitting devices EDa, EDb. Multiple anchor posts 540, 550 can overlap with the inspection electrodes. After forming the multiple anchor posts 540, 550 by a hot-pressing process, the conductive paste 530, excluding the multiple anchor posts 540, 550, can be removed.

[0138] Multiple light-emitting devices EDa and EDb can be mounted on multiple anchor posts 540 and 550. In this case, a light-emitting inspection process can be performed on multiple light-emitting devices EDa and EDb.

[0139] The light emission inspection process can be used to determine whether multiple light-emitting devices EDa and EDb are emitting light normally. During the light emission inspection process, the first inspection probe 581 can be in contact with the first probe electrode 523, and the second inspection probe 582 can be in contact with the second probe electrode 524. The first inspection probe 581 and the second inspection probe 582 can supply power to the inspection wafer 500 to drive the light-emitting devices EDa and EDb.

[0140] If the light-emitting devices EDa and EDb are determined to be normal during the light-emitting inspection process, the packaging substrate 441 can be removed from the inspection substrate 510. (Refer to...) Figure 6 The stamp 600 can be attached to the upper surface of the light-emitting devices EDa and EDb, and the stamp 600 can lift the light-emitting devices EDa and EDb upwards.

[0141] Reference Figure 6 As the packaging substrate 441 is removed from the inspection substrate 510, the plurality of anchor posts 540, 550 can be separated into a plurality of anchor elements 541, 551 and a plurality of wafer anchor elements 542, 552. For example, a portion of the plurality of anchor posts 540, 550 can remain within the light-emitting device package ED_PKG as a plurality of anchor elements 541, 551, while the remaining portions of the plurality of anchor posts 540, 550 can remain within the inspection wafer 500 as a plurality of wafer anchor elements 542, 552.

[0142] When the multiple anchor posts 540, 550 are separated from the multiple anchor members 541, 551 and the multiple wafer anchor members 542, 552, the cross-sections of the multiple anchor members 541, 551 and the multiple wafer anchor members 542, 552 can be separated in a flat manner. In this case, the bottom surface of the multiple anchor members 541, 551 can be positioned parallel to the bottom surface of the packaging substrate 441. For example, the distance from the light-emitting devices EDa, EDb to the bottom surface of the multiple anchor members 541, 551 can be the same as the distance from the light-emitting devices EDa, EDb to the bottom surface of the packaging substrate 441.

[0143] Reference Figure 7 When the multiple anchor posts 540, 550 are separated into multiple anchor elements 541, 551 and multiple wafer anchor elements 542, 552, the cross-sections of the multiple anchor elements 541, 551 and the multiple wafer anchor elements 542, 552 may be separated in an uneven manner. The bottom surface of anchor element 541 may have a different shape than the bottom surface of anchor element 551. The distance from the light-emitting devices EDa, EDb to the bottom surfaces of the multiple anchor elements 541, 551 may be greater than the distance from the light-emitting devices EDa, EDb to the bottom surface of the packaging substrate 441.

[0144] Reference Figure 8 The light-emitting device package ED_PKG can be positioned on the lower substrate 410. Then, as the mold 600 moves in the direction close to the lower substrate 410, the light-emitting device package ED_PKG can come into contact with the bonding materials 431, 432.

[0145] Figure 9 and Figure 10 This is a view illustrating the process of transferring a light-emitting device package (ED_PKG) onto a lower substrate 410 according to an embodiment of the present disclosure.

[0146] Reference Figure 9 You can see the inspection chip 500 and the light-emitting device package ED_PKG. Figure 9 and Figure 10 The features of the inspection chip 500 and the light-emitting device package ED_PKG shown can be compared with... Figures 5 to 8 The inspection wafer 500 and the light-emitting device package ED_PKG shown have the same characteristics, so redundant descriptions can be omitted or provided briefly.

[0147] Reference Figure 9Multiple conductive film prototypes 960 and 970 may be located between multiple anchors 941 and 951 and multiple wafer anchors 942 and 952. A first conductive film prototype 960 may be located between a first anchor 941 and a first wafer anchor 942. A second conductive film prototype 970 may be located between a second anchor 951 and a second wafer anchor 952. The multiple conductive film prototypes 960 and 970 may be in thin film form and may include conductive materials.

[0148] Multiple conductive film prototypes 960 and 970 may include conductive nanomaterials, such as carbon black, graphene, or silver nanowires.

[0149] The multiple conductive film prototypes 960, 970 may include materials with weak adhesion. Therefore, the multiple films can be easily separated from the multiple anchors 941, 951 and the multiple wafer anchors 942, 952.

[0150] Reference Figure 10 The light-emitting device package (ED_PKG) can be separated from the inspection wafer 500. In this case, the conductive film prototypes 960 and 970 can be separated into multiple conductive films 961 and 971 and multiple wafer conductive films 962 and 972. The light-emitting device package (ED_PKG) may include multiple conductive films 961 and 971. The multiple conductive films 961 and 971 can be located below multiple anchors 941 and 951.

[0151] However, the multiple conductive film prototypes 960 and 970 can be included entirely within the light-emitting device package (ED_PKG) instead of being separated into two parts. In this case, the multiple conductive film prototypes 960 and 970 can be located below the multiple anchors 941 and 951. Since the multiple conductive film prototypes 960 and 970 comprise a material with weak adhesion, they can be easily separated from the multiple anchors 941 and 951 and the multiple wafer anchors 942 and 952.

[0152] Figure 11 and Figure 12 This is a view illustrating the process of transferring a light-emitting device package (ED_PKG) onto a lower substrate 410 according to an embodiment of the present disclosure.

[0153] Reference Figure 11 and Figure 12 You can see the inspection chip 500 and the light-emitting device package ED_PKG. Figure 11 and Figure 12 The features of the inspection chip 500 and the light-emitting device package ED_PKG shown can be compared with... Figure 9 and Figure 10The inspection wafer 500 and the light-emitting device package ED_PKG shown have the same characteristics. Therefore, redundant descriptions can be omitted.

[0154] As the ED_PKG light-emitting device package is moved by the mold 600, multiple conductive film prototypes 960 and 970 can be separated into two parts.

[0155] Reference Figure 12 The light-emitting device package ED_PKG may include a package substrate 441; multiple anchors 1141 and 1151; and multiple light-emitting devices EDa and EDb.

[0156] Multiple anchors 1141, 1151 may be located in multiple anchor holes AH formed in the packaging substrate 441 (see...) Figure 4 and Figure 5 )middle.

[0157] The multiple anchors 1141, 1151 may include anchor electrode posts 1141a, 1151a; and anchor electrodes 1141b, 1151b.

[0158] Anchor electrode posts 1141a and 1151a can be located in multiple anchor holes AH. The multiple anchor electrode posts 1141a and 1151a can be made of metallic material.

[0159] Anchor electrodes 1141b and 1151b can be disposed on multiple anchor electrode posts 1141a and 1151a. Anchor electrodes 1141b and 1151b can comprise a metallic material. Anchor electrodes 1141b and 1151b can comprise a metal different from the metal of the multiple anchor electrode posts 1141a and 1151a, or they can comprise the same metal. Anchor electrodes 1141b and 1151b can be electrically connected to the multiple anchor electrode posts 1141a and 1151a via a eutectic bonding process.

[0160] Reference Figure 12 Multiple conductive films 961 and 971 can be located below multiple anchoring electrode posts 1141a and 1151a, respectively. Since the anchoring electrodes 1141b and 1151b, the multiple anchoring electrode posts 1141a and 1151a, and the multiple conductive films 961 and 971 are conductive, they can be electrically connected to each other.

[0161] Figures 13 to 16 This is a view illustrating the process of transferring a light-emitting device package (ED_PKG) onto a lower substrate 410 according to an embodiment of the present disclosure.

[0162] Reference Figure 13 and Figure 14 You can see the inspection chip 500 and the light-emitting device package ED_PKG. Figure 13 and Figure 14 Some characteristics and Figure 11 and Figure 12 Since they share the same characteristics, redundant descriptions can be omitted or provided briefly.

[0163] The mold 600 can be attached to the upper surface of the light-emitting devices EDa and EDb. The packaging substrate 441 can be removed from the inspection substrate 510 via the mold 600. Therefore, the light-emitting device package ED_PKG can be separated from the inspection wafer 500 while remaining attached to the mold 600.

[0164] The multiple wafer anchors 1342, 1352 may have an uneven structure. The bottom surface of the multiple wafer anchors 1342, 1352 may be wider than their top surface. The multiple wafer anchors 1342, 1352 may have a bottom surface wider than their top surface. The multiple wafer anchors 1342, 1352 may have a structure in which a larger diameter cylinder is located at the bottom and a smaller diameter cylinder is located at the top.

[0165] Reference Figure 15 and Figure 16 Multiple conductive film prototypes 960 and 970 can be respectively disposed on multiple wafer anchors 1342 and 1352. When the light-emitting device package ED_PKG is separated from the inspection wafer 500, the conductive film prototypes 960 and 970 can be separated into two parts.

[0166] Reference Figure 16 Multiple conductive films 961 and 971 can be located below multiple anchor electrode posts 1141a and 1151a. Multiple wafer conductive films 962 and 972 can be located on multiple wafer anchors 1342 and 1352. However, the multiple conductive film prototypes 960 and 970 can not be separated into two parts, but can be included entirely in the light-emitting device package (ED_PKG). In this case, the multiple conductive film prototypes 960 and 970 can be located below the multiple anchors 1141 and 1151. Since the multiple conductive film prototypes 960 and 970 include a material with weak adhesion, they can be easily separated from the multiple anchors 1141 and 1151 and the multiple wafer anchors 1342 and 1352. The diameter or width of the multiple conductive films 961 and 971 can be smaller than the diameter or width of the multiple anchor electrode posts 1141a and 1151a, respectively.

[0167] The method for manufacturing a light-emitting device package according to embodiments of the present disclosure will be described in detail below. Figure 17 This is a flowchart of a method for manufacturing a light-emitting device package according to an embodiment of the present disclosure.

[0168] Reference Figure 17According to one embodiment, a filling step (S1710) may be performed, in which conductive paste is filled into a plurality of anchor holes in the packaging substrate. The conductive paste may be a material that can be transformed into a fixed structure by applying heat and pressure in subsequent processes.

[0169] Next, the light-emitting device placement step (1720) can be performed, in which multiple light-emitting devices are placed on the conductive paste. The multiple light-emitting devices can be arranged on corresponding portions of the conductive paste, thereby laying the foundation for electrical connection and mechanical fixation in subsequent processes.

[0170] Subsequently, a hot-pressing step (S1730) can be performed, in which heat and external force are applied to multiple light-emitting devices. In this step, the conductive paste can be cured or deformed to form multiple anchor posts, which can firmly fix the position of each light-emitting device.

[0171] After this, a lighting inspection step (S1740) can be performed. In this step, power can be supplied to multiple anchor posts via probe electrodes on the wafer substrate, and the presence or absence of light from multiple light-emitting devices can be checked. This step allows for the differentiation between acceptable and defective products.

[0172] According to the embodiment, in addition to the steps described above, a package pick-up step (S1750) may also be included. In the package pick-up step, the mold can remove multiple light-emitting devices from the wafer substrate, so that multiple anchor posts can be separated into multiple anchor members and multiple wafer anchor members.

[0173] In addition, a packaging placement step (S1760) may be included. In the packaging placement step, a light-emitting device package, including a packaging substrate, a plurality of light-emitting devices disposed on the packaging substrate, and a plurality of anchors overlapping with the light-emitting devices, may be placed in contact with bonding material on a lower substrate.

[0174] Therefore, this configuration allows for the manufacture of light-emitting device packages that ensure high stability and reliability while also enabling process optimization and mass production suitability.

[0175] The display device according to embodiments of this disclosure can be described as follows.

[0176] According to embodiments of this disclosure, a display device can be provided, comprising: a lower substrate; a plurality of connecting electrodes disposed on the lower substrate; an encapsulation substrate disposed on the plurality of connecting electrodes; a first light-emitting device, the first light-emitting device including a first light-emitting layer and a first electrode and a second electrode located below the first light-emitting layer, the first light-emitting device being disposed on the encapsulation substrate; a second light-emitting device, the second light-emitting device including a second light-emitting layer and a third electrode and a fourth electrode located below the second light-emitting layer, the second light-emitting device being disposed on the encapsulation substrate; and a first anchoring member electrically connected to the first electrode and the first connecting electrode among the plurality of connecting electrodes, the first anchoring member penetrating... A second anchoring member is electrically connected to the second electrode and the second connecting electrode among the plurality of connecting electrodes, the second anchoring member passing through the packaging substrate and overlapping the second electrode and the second connecting electrode; a third anchoring member is electrically connected to the third electrode and the third connecting electrode among the plurality of connecting electrodes, the third anchoring member passing through the packaging substrate and overlapping the third electrode and the third connecting electrode; and a fourth anchoring member is electrically connected to the fourth electrode and the fourth connecting electrode among the plurality of connecting electrodes, the fourth anchoring member passing through the packaging substrate and overlapping the fourth electrode and the fourth connecting electrode.

[0177] The first bottom surface of the first anchor can be positioned further away from the first light-emitting device than the bottom surface of the encapsulation substrate.

[0178] The first bottom surface of the first anchor may have a shape different from the shape of the second bottom surface of the second anchor.

[0179] The first to fourth anchors may include materials that solidify and become conductive when subjected to heat and external force.

[0180] The display device may further include: a first bonding material disposed between the first connecting electrode and the first anchor, the first bonding material being conductive and fixing the first anchor to the first connecting electrode; a second bonding material disposed between the second connecting electrode and the second anchor, the second bonding material being conductive and fixing the second anchor to the second connecting electrode; a third bonding material disposed between the third connecting electrode and the third anchor, the third bonding material being conductive and fixing the third anchor to the third connecting electrode; and a fourth bonding material disposed between the fourth connecting electrode and the fourth anchor, the fourth bonding material being conductive and fixing the fourth anchor to the fourth connecting electrode.

[0181] The display device may further include: a first conductive film disposed below the first anchor and having conductivity; a second conductive film disposed below the second anchor and having conductivity; a third conductive film disposed below the third anchor and having conductivity; and a fourth conductive film disposed below the fourth anchor and having conductivity.

[0182] The first to fourth conductive films may include at least one material selected from carbon black, graphene and silver nanowires.

[0183] At least one of the first to fourth anchoring elements may include a conductive nanosphere that is conductive and breaks when subjected to an external force.

[0184] The first anchoring element may include: a first anchoring electrode post comprising a first metal material, and a first anchoring electrode disposed on the first anchoring electrode post and comprising a second metal material. The second anchoring element may include: a second anchoring electrode post comprising the first metal material, and a second anchoring electrode disposed on the second anchoring electrode post and comprising the second metal material. The third anchoring element may include: a third anchoring electrode post comprising the first metal material, and a third anchoring electrode disposed on the third anchoring electrode post and comprising the second metal material. The fourth anchoring element may include: a fourth anchoring electrode post comprising the first metal material, and a fourth anchoring electrode disposed on the fourth anchoring electrode post and comprising the second metal material.

[0185] The first metallic material may be different from the second metallic material.

[0186] The display device may further include: a first conductive film disposed below the first anchoring electrode post and having conductivity; a second conductive film disposed below the second anchoring electrode post and having conductivity; a third conductive film disposed below the third anchoring electrode post and having conductivity; and a fourth conductive film disposed below the fourth anchoring electrode post and having conductivity.

[0187] The diameter or width of the first to fourth conductive films can be smaller than the diameter or width of the first to fourth anchoring electrode posts, respectively.

[0188] The packaging substrate may include at least one material selected from glass, polymer-based materials, and silicon-based materials.

[0189] The first to fourth anchors may include a conductive material, wherein the conductive material may include at least one material selected from metals, polymer-based materials and ceramic materials.

[0190] Embodiments of this disclosure may provide a light-emitting device package, comprising: a package substrate; a first light-emitting device disposed on the package substrate, the first light-emitting device including a first light-emitting layer, a first electrode electrically connected to the first light-emitting layer, and a second electrode electrically connected to the first light-emitting layer; a second light-emitting device disposed on the package substrate, the second light-emitting device including a second light-emitting layer, a third electrode electrically connected to the second light-emitting layer, and a fourth electrode electrically connected to the second light-emitting layer; a first anchoring member electrically connected to the first electrode, the first anchoring member overlapping with the first electrode and penetrating the package substrate; and a second anchoring member electrically connected to the third electrode, the second anchoring member overlapping with the third electrode and penetrating the package substrate.

[0191] The first bottom surface of the first anchor can be positioned further away from the first light-emitting device than the bottom surface of the encapsulation substrate.

[0192] The first bottom surface of the first anchor may have a shape different from the shape of the second bottom surface of the second anchor.

[0193] The light-emitting device package may further include: a third anchor electrically connected to the second electrode, the third anchor overlapping with the second electrode and penetrating the package substrate; and a fourth anchor electrically connected to the fourth electrode, the fourth anchor overlapping with the fourth electrode and penetrating the package substrate.

[0194] Embodiments of this disclosure may provide a method for manufacturing a light-emitting device package, the method comprising: a filling step of filling conductive paste into a plurality of anchor holes on a package substrate; a light-emitting device placement step of placing a plurality of light-emitting devices on the conductive paste; a thermo-pressing step of applying heat and external force to the plurality of light-emitting devices to transform the conductive paste into a plurality of anchor posts; and a lighting inspection step of supplying power to the plurality of anchor posts through probe electrodes on a wafer substrate and inspecting whether the plurality of light-emitting devices emit light.

[0195] The method may further include a packaging pick-up step, wherein the die removes the plurality of light-emitting devices from the wafer substrate, and the plurality of anchor posts are separated into a plurality of anchors and a plurality of wafer anchors.

[0196] The method may further include a packaging placement step, wherein the light-emitting device package, comprising the packaging substrate, the plurality of light-emitting devices disposed on the packaging substrate, and the plurality of anchors overlapping the plurality of light-emitting devices, is brought into contact with bonding material on the lower substrate.

[0197] The above description is provided to enable those skilled in the art to grasp and use the technical concept of the invention, and is offered within the context of specific applications and their requirements. Various modifications, additions, and substitutions to the described embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this disclosure. The above description and accompanying drawings are merely illustrative examples of the technical concept of the invention. That is, the disclosed embodiments are intended to illustrate the scope of the technical concept of the invention.

Claims

1. A display device, comprising: lower base plate; Multiple connection electrodes are disposed on the lower substrate; An encapsulation substrate disposed on the plurality of connecting electrodes; The first light-emitting device disposed on the packaging substrate includes a first light-emitting layer, and a first electrode and a second electrode located below the first light-emitting layer. The second light-emitting device disposed on the packaging substrate includes a second light-emitting layer, and a third electrode and a fourth electrode located below the second light-emitting layer; A first anchoring member electrically connected to the first electrode and the first connecting electrode among the plurality of connecting electrodes, the first anchoring member penetrating the packaging substrate and overlapping the first electrode and the first connecting electrode; A second anchoring member electrically connected to the second electrode and the second connecting electrode among the plurality of connecting electrodes, the second anchoring member penetrating the packaging substrate and overlapping the second electrode and the second connecting electrode; A third anchoring member electrically connected to the third electrode and the third connecting electrode among the plurality of connecting electrodes, the third anchoring member penetrating the packaging substrate and overlapping the third electrode and the third connecting electrode; as well as A fourth anchor is electrically connected to the fourth electrode and the fourth connecting electrode among the plurality of connecting electrodes, the fourth anchor penetrating the package substrate and overlapping the fourth electrode and the fourth connecting electrode.

2. The display device according to claim 1, wherein the first bottom surface of the first anchor is positioned further away from the first light-emitting device than the bottom surface of the encapsulation substrate.

3. The display device according to claim 1, wherein the first bottom surface of the first anchor has a shape different from the shape of the second bottom surface of the second anchor.

4. The display device according to claim 1, wherein the first to fourth anchoring elements comprise a material that solidifies and becomes conductive when subjected to heat and external force.

5. The display device according to claim 1, further comprising: A first bonding material is disposed between the first connecting electrode and the first anchor, the first bonding material being conductive and fixing the first anchor to the first connecting electrode; A second bonding material is disposed between the second connecting electrode and the second anchor, the second bonding material being conductive and fixing the second anchor to the second connecting electrode; A third bonding material is disposed between the third connecting electrode and the third anchor, the third bonding material being conductive and fixing the third anchor to the third connecting electrode; as well as A fourth bonding material is disposed between the fourth connecting electrode and the fourth anchor, the fourth bonding material being conductive and securing the fourth anchor to the fourth connecting electrode.

6. The display device according to claim 1, further comprising: A first conductive film that is disposed below the first anchor and is conductive; A second conductive film, which is conductive, is disposed below the second anchoring member; A third conductive film, which is conductive, is disposed below the third anchoring element; as well as A fourth conductive film, which is conductive, is disposed below the fourth anchor.

7. The display device according to claim 6, wherein the first to fourth conductive films comprise at least one material selected from carbon black, graphene, and silver nanowires.

8. The display device according to claim 1, wherein at least one of the first anchor, the second anchor, the third anchor, and the fourth anchor comprises a nanoconductive ball, and The aforementioned conductive nanospheres are conductive and break when subjected to external force.

9. The display device according to claim 1, The first anchoring element includes: It includes a first anchoring electrode post made of a first metallic material, and a first anchoring electrode disposed on the first anchoring electrode post and comprising a second metallic material. The second anchoring element includes: a second anchoring electrode post comprising the first metal material, and a second anchoring electrode disposed on the second anchoring electrode post and comprising the second metal material. The third anchoring element includes: a third anchoring electrode post comprising the first metal material, and a third anchoring electrode disposed on the third anchoring electrode post and comprising the second metal material. The fourth anchoring element includes: a fourth anchoring electrode post comprising the first metal material, and a fourth anchoring electrode disposed on the fourth anchoring electrode post and comprising the second metal material.

10. The display device according to claim 9, wherein the first metal material is different from the second metal material.

11. The display device according to claim 9, further comprising: A first conductive film, which is conductive, is disposed below the first anchoring electrode post; A second conductive film, which is conductive, is disposed below the second anchoring electrode post; A third conductive film is disposed below the third anchoring electrode post and has conductivity. as well as A fourth conductive film, which is conductive, is disposed below the fourth anchoring electrode post.

12. The display device according to claim 11, wherein the diameter or width of the first to fourth conductive films is smaller than the diameter or width of the first to fourth anchoring electrode posts.

13. The display device of claim 1, wherein the encapsulation substrate comprises at least one material selected from glass, polymer-based materials, and silicon-based materials.

14. The display device of claim 1, wherein the first to fourth anchoring members comprise a conductive material, the conductive material comprising at least one material selected from metals, polymer-based materials, and ceramic materials.

15. A light-emitting device package, comprising: Packaging substrate; The first light-emitting device disposed on the packaging substrate includes a first light-emitting layer, a first electrode electrically connected to the first light-emitting layer, and a second electrode electrically connected to the first light-emitting layer. The second light-emitting device disposed on the packaging substrate includes a second light-emitting layer, a third electrode electrically connected to the second light-emitting layer, and a fourth electrode electrically connected to the second light-emitting layer. A first anchor is electrically connected to the first electrode, the first anchor overlapping the first electrode and penetrating the packaging substrate; as well as A second anchor is electrically connected to the third electrode, the second anchor overlapping the third electrode and penetrating the packaging substrate.

16. The light-emitting device package of claim 15, wherein the first bottom surface of the first anchor is positioned further away from the first light-emitting device than the bottom surface of the package substrate.

17. The light-emitting device package of claim 15, wherein the first bottom surface of the first anchor has a shape different from the shape of the second bottom surface of the second anchor.

18. The light-emitting device package according to claim 15, further comprising: A third anchor is electrically connected to the second electrode, the third anchor overlapping the second electrode and penetrating the packaging substrate; as well as A fourth anchor is electrically connected to the fourth electrode, the fourth anchor overlapping the fourth electrode and penetrating the packaging substrate.

19. A method for manufacturing a light-emitting device package, the method comprising: The conductive paste is filled into multiple anchor holes of the packaging substrate; Multiple light-emitting devices are placed on the conductive paste; Heat and external force are applied to the plurality of light-emitting devices, thereby transforming the conductive paste into a plurality of anchoring posts; as well as Power is supplied to the plurality of anchor posts through probe electrodes on the wafer substrate, and the emission of light from the plurality of light-emitting devices is checked.

20. The method for manufacturing a light-emitting device package according to claim 19, further comprising: In the packaging pick-up step, the mold removes the plurality of light-emitting devices from the wafer substrate, and the plurality of anchor posts are separated into a plurality of anchor members and a plurality of wafer anchor members.

21. The method for manufacturing a light-emitting device package according to claim 20, further comprising: In the packaging and placement step, the light-emitting device package, which includes the packaging substrate, the plurality of light-emitting devices disposed on the packaging substrate, and the plurality of anchors overlapping the plurality of light-emitting devices, is brought into contact with the bonding material on the lower substrate.

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